JP2003209034A - Cleaning method of semiconductor substrate treatment device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive double coated tape suitable for use in a cleaning method of the wafer treatment device for improving the removing effect of foreign matters without degrading the operating efficiency of a device by transferring a wafer, to which an adhesive substance is fixed to an area wider than an area to which the wafer contacts during a process of transferring. <P>SOLUTION: The adhesive double coated tape is employed in the cleaning method for adsorbing the foreign matters in a transfer system and a treatment unit by a cleaning transfer of the substrate, to which an adhesive substance is fixed, in the semiconductor manufacturing device. The separating strength of one side of an adhesive layer of the adhesive double coated tape, in which the adhesive layers are formed on both surfaces of a substrate composed of a synthetic resin thin film, is higher than that of the other adhesive layer. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cleaning a semiconductor processing apparatus.

[0002]

2. Description of the Related Art In a substrate processing apparatus, each processing unit is connected by a transfer system such as (A) belt type, (B) roller type, (C) mechanical type, etc., as shown in FIG. The system is a substrate,
It is conveyed by making physical contact. At this time, if foreign matter adheres to the substrate, the foreign matter adheres to the belt 801 or the transport arm 806 that constitutes the transport system, and the foreign matter accumulates and causes dust generation. Then, there is a case where the subsequent substrate is reversely contaminated, that is, redeposition occurs, and when it is a substrate that requires high cleanliness, it may cause a fatal defect in yield. In order to avoid this adverse effect, the transport system and each processing unit are regularly subjected to maintenance, that is, cleaning processing, but during that time, the apparatus is stopped, which has been a cause of lowering the operating rate. In particular, in an apparatus that has such a transfer system in a vacuum chamber, it is necessary to disassemble and clean the vacuum system after it has been shut down, so maintenance is very complicated, and the cleaning process has a high operating rate. It was a factor that drastically lowered it.

Further, in order to reduce the frequency and labor of this maintenance, there is a method in which a dummy substrate is idly transported between processing substrates to remove foreign substances adhering to the transport system and each processing section. It cannot be said that the foreign matter removing effect is sufficient.

[0004]

As described above, in the conventional method for cleaning a substrate processing apparatus, the transportation system and each processing unit are regularly subjected to maintenance, that is, cleaning processing, which causes a decrease in the operating rate of the apparatus. It was. Further, in the method of carrying the dummy substrate in an idle state, the effect of removing foreign matter was not sufficient. It is an object of the present invention to provide a double-sided pressure-sensitive adhesive tape suitable for use in cleaning a substrate processing apparatus that improves the removal effect of foreign substances without reducing the operating rate of the apparatus.

[0005]

The present invention has been made to solve the above problems, and is suitable for use in cleaning the inside of a substrate processing apparatus by transporting a substrate to which an adhesive substance is fixed. It is a double-sided adhesive tape. That is, the present invention is a double-sided adhesive tape having a pressure-sensitive adhesive layer formed on both surfaces of a support made of a synthetic resin thin film,
A double-sided adhesive tape for cleaning a semiconductor substrate processing apparatus, wherein one adhesive layer has a peel strength greater than that of the other adhesive layer.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of a cleaning method for a semiconductor substrate processing apparatus according to the present invention will be described in detail with reference to FIGS.
1 and 2 show an example of a wafer structure to which an adhesive substance is fixed. The adherence of foreign matter on the wafer is biased to the contact portion between the wafer and the transfer path in the apparatus, but the distribution thereof is somewhat wide. Therefore, the main surface, back surface,
Adhesive substances (double-sided adhesive tape in this case) are attached to a wide area that covers the parts that come into contact with each other during the transportation process on the side surface. The parts that come into contact with each other in the carrying process here are shown in FIG.
Such as a belt type, roller type, mechanical type, etc. contacting portion with a wafer, a claw or clamp for holding a wafer, a stopper for a wafer, a wafer chuck and the like. FIG. 1 shows an example of a wafer structure to which an adhesive tape used for cleaning a semiconductor substrate processing apparatus according to the present invention is fixed. FIG. 1A is a perspective view showing a state in which each element is separated, (B) is a sectional view. Adhesive substances (here, double-sided adhesive tapes) 101, 104, 105 are spread over a wide range so as to cover the main surface, the back surface, and the side surface of the semiconductor wafer 103 that come into contact with each other during the transportation process.
Is pasted. The foreign matter removing ability of the dummy wafer to which the adhesive tape is fixed deteriorates as the foreign matter is attached to the contact portion of the transfer system or the processing unit, so it is necessary to recover the foreign matter removing ability by some method. is there. Here, replacing the tape is used as a means for recovering the foreign matter capability. Therefore, the non-adhesive portion 102 for peeling the double-sided adhesive tape, which is a non-adhesive protruding thin film, is fixed to the adhesive tape 101. The replacement of the tape can be reused by pulling the non-adhesive thin film 102 to remove the adhesive tape 101 from the wafer 103 and attaching a new adhesive tape 101. The attachment / detachment of the sticky substance may be performed by hand, or by a jig or a device. 2A and 2B show a second embodiment of a wafer to which an adhesive tape used for cleaning a semiconductor substrate processing apparatus according to the present invention is fixed, and FIG. 2A is a perspective view showing a state where each element is separated, (B) is a sectional view. Adhesive substances (here, double-sided adhesive tapes) 201, 204, and 205 are attached to a wide range covering the main surface, the back surface, and the side surface of the semiconductor wafer 203 that come into contact with each other during the transportation process. In the case of FIG. 1, a case where a tape coating on the back surface of the wafer is required in a donut shape such as contact with a claw in the carrying process is shown, while in the case of FIG. It shows the case where the entire back surface requires a tape coating, such as contact with a chuck or the like. At this time, as described above,
In order to surely adsorb and remove the foreign matter in the portion that comes into contact with the wafer in the transfer system and each processing section of the apparatus, the range in which the wafer is covered with the tape is set to a wide range so as to cover this contact section. This range varies depending on the device, and an example of the range of the double-sided adhesive tape to be attached to the main surface of the wafer is shown in FIG. FIG. 3 is a third view of a wafer to which an adhesive tape used for cleaning a semiconductor substrate processing apparatus according to the present invention is fixed.
FIG. 4A is a top view of the embodiment of FIG. 4A, where FIG. 7A is a case where an adhesive tape is required for a donut-shaped portion around the wafer such as a peripheral perimeter clamp, and FIG. The case where an adhesive tape is required is shown. FIG. 4 is a sectional view of a fourth embodiment of a wafer to which an adhesive tape used for cleaning the semiconductor substrate processing apparatus according to the present invention is fixed. (A) is a sectional view of the entire wafer. , (B) are enlarged sectional views of (A) part. FIG. 4B shows a double-sided adhesive tape having a three-layer structure of an adhesive 402, a support 405, and an adhesive 404, which is a wafer 403.
It is pasted on both sides of. Materials for the support include acetate film (matte finish; Sumitomo 3M), polyethylene terephthalate (PET; Fujicolor), fluororesin, Teflon (registered trademark) resin (Teflon skived tape), etc. In the case where inertness is required, a silicone-based pressure-sensitive adhesive is suitable, but an acrylic-based pressure-sensitive adhesive can be used when gas generation is allowed to some extent in a normal temperature / normal pressure process. When the double-sided body shown in FIG. 4 is attached to a wafer, the peeling strength (f
It is necessary that 1) is equal to or greater than the peel strength (f2) on the outermost surface side, that is, f1 ≧ f2. The reason is f
When 2 is larger than f1, there is a high risk that the double-sided tape itself will peel off and adhere to the contact portion during the transportation process.
This is because it not only defeats the purpose of removing foreign matter but also contaminates the transportation process. In the above example, the double-sided adhesive tape was used, but any other adhesive thin film may be used. Next, as another example, FIG. 5 shows an example in which an adhesive is formed on a wafer by coating. FIG. 5 is a cross-sectional view of an example of a wafer to which an adhesive substance used for cleaning the semiconductor substrate processing apparatus according to the present invention is fixed by coating. FIG. 5A is a cross-sectional view of the entire wafer,
(B) and (C) are enlarged cross-sectional views of part (a), (B) is a case where there is one coating layer, and (C) is a case where there are two coating layers. It forms a silicon-based adhesive. As shown in FIG. 5C, the reason why the adhesive layer is formed of two or more layers of adhesives is that the peel strength is f1 in the same manner as above in order to avoid the risk of contamination of the conveying process by the adhesive substance. This is because it is necessary to select the material of each layer so as to satisfy the relationship of ≧ f2 (f1: peel strength of the adhesive on the substrate side, f2: peel strength of the adhesive on the outermost surface side).
As a means for recovering the foreign matter removing ability, for example, O ₂
Remove the adhesive with asher or sulfuric acid / hydrogen peroxide treatment and reapply.

Next, an embodiment of a cleaning method for a semiconductor wafer processing apparatus according to the present invention will be described in detail with reference to FIG. In the semiconductor substrate processing apparatus, dust is accumulated on a portion that comes into contact with the wafer 603 during the transfer process by repeating the transfer of the processed wafer 603, that is, a transfer path, a claw for holding a wafer, a claw of a blade, or a wafer chuck (electrostatic chuck). Since it causes dust generation, the wafer 603 to which the above-mentioned adhesive substance is fixed is idly transferred to the transfer system of the wafer processing apparatus between processing wafers. With the wafer 603 to be processed placed on the wafer cassette 601, the cassette chamber 6
It is set in the cassette holder 607 in 02. When the cassette chamber 602 is evacuated and the pressure difference between the wafer loading chamber 605 and the wafer loading chamber 605 becomes a certain value or less, the gate valve 606 separating the cassette chamber 602 and the wafer loading chamber 605 is opened, and the wafer cassette 601 is mounted on the wafer holder 607 together with the wafer. Transferred to the loading chamber 605. After the transfer is completed, the gate valve 606 is closed. Next, the etching chamber 608 and the wafer loading chamber 60
Open the gate valve that separates 5 to open the wafer cassette 6
The wafers 603 set to 01 are transferred one by one into the etching chamber 608. The process of transferring and transferring the wafer 603 from the wafer loading chamber 605 to the etching chamber 608 will be described below with reference to FIG. The wafer 703 lifted from the wafer cassette 701 by the blade 706 shown in FIG. 7A is held by the wafer holding tabs 702 of the transfer arm 705 as shown in FIG. 7B, and then the blade 706. Moves back to its original position. Next, as shown in FIG. 7C, after the gate valve 708 is opened, the wafer 703 is
The transfer arm 705 conveys the wafer to a position just above the wafer chuck (electrostatic chuck) 704, and the wafer chuck 704 moves to this position, whereby the wafer is chucked by the wafer chuck 704 and the wafer chuck 704 retracts. Thereafter, as shown in FIG. 7D, the transfer arm 705 moves to the wafer loading chamber 605 to avoid contact with the wafer 703. After that, the gate valve 708 is closed and the wafer etching is started. The transfer and delivery after the processing is the reverse of the above operation, and the wafer 703 is transported from the wafer chuck 704 to the wafer cassette 701. Regarding the frequency of the dummy wafer transfer process to which the adhesive substance is fixed, the process interval may be controlled by time or the number of process lots. Further, it may be conveyed only for cleaning processing. The number of wafers is determined by the degree of contamination received from other processes and the level of cleanliness required for the wafers to be processed before the next empty transfer. Therefore, weaving every few wafers can be considered. As described above, the number of wafers to which the adhesive substance is fixed can be transferred at any time and at any number.

Although the above description has been given to the case of a processing apparatus having a vacuum chamber, it is needless to say that it can be applied to a processing apparatus under the atmosphere. Further, it can be applied to either a single-wafer type or a batch type, and can also be applied to an apparatus for transporting a substrate other than a wafer such as a photomask or a reticle. In addition, the adhesive substance that is attached to the substrate is
In the above, the above selection was made in consideration of adhesiveness and generation of gas, but various conditions such as heat resistance, water resistance, chemical resistance, oil repellency, etc. may be considered depending on the needs of the equipment and the processing substrate. Therefore, it goes without saying that a material suitable for the purpose of use, including the support, should be selected.

[0009]

As described above, by using the double-sided pressure-sensitive adhesive tape for cleaning according to the present invention, it is possible to surely adsorb and remove the foreign matter in the portion which comes into contact with the wafer in the transfer system and each processing section of the wafer processing apparatus. As a result, as compared with the conventional method of performing maintenance by a person, semi-automatic cleaning and in-situ cleaning of the wafer transfer path can be achieved at a high cleanliness level, which imposes an operator's burden, that is, frequency and labor. It is possible to save a lot and improve the operating rate. This is particularly effective for equipment that uses a vacuum system because of differences in workability, such as the need to disassemble and clean the vacuum system after it has been shut down. In the future, local cleaning of the equipment or unit will be required. When performing, the high degree of effectiveness can be obtained for the same reason. In addition, this method allows loading at an arbitrary number of wafers, and by increasing the frequency of loading dummy wafers, real-time control of contamination control of the transfer path becomes possible. Further, as compared with the conventional method of carrying dummy wafers in an empty manner, the number of dummy wafers to be used can be significantly reduced, so that the operation rate of the wafer processing apparatus can be improved. Further, according to the present invention, the reliability of the in-apparatus cleanliness is improved, so that a stable product yield can be obtained.

Further, in the present invention, since the non-adhesive protruding thin film is adhered to the adhesive substance adhered to the dummy wafer, the adhesive substance can be easily peeled off, so that re-adhesion can be performed. This makes it possible to recycle the dummy wafer to which the sticky substance is fixed.

[Brief description of drawings]

FIG. 1 is a view showing an example of a wafer structure to which an adhesive tape used for cleaning a semiconductor substrate processing apparatus according to the present invention is fixed, and FIG. 1A is a perspective view showing a state where each element is separated, (B) is a sectional view.

FIG. 2 shows a second embodiment of a wafer to which an adhesive tape is used for cleaning a semiconductor substrate processing apparatus according to the present invention, and FIG. 2A is a perspective view showing a state where each element is separated. , (B) are sectional views.

FIG. 3 is a top view of a third embodiment of a wafer to which an adhesive tape used for cleaning a semiconductor substrate processing apparatus according to the present invention is fixed, where (A) is a donut-shaped portion around the wafer (B). Shows the case where adhesive tapes are required for scattered areas around the wafer.

FIG. 4 is a cross-sectional view of a fourth embodiment of a wafer to which an adhesive tape used for cleaning a semiconductor substrate processing apparatus according to the present invention is fixed, (A) is a cross-sectional view of the entire wafer, (B) is an enlarged cross-sectional view of (A) part.

FIG. 5 is a cross-sectional view of an example of a wafer to which an adhesive substance used for cleaning the semiconductor substrate processing apparatus according to the present invention is fixed by coating, (A) is a cross-sectional view of the entire wafer, and (B) is a cross-sectional view. ) (C) is a sectional view of (A) a part,
(B) is the case where the coating layer is one layer, and (C) is the case where the coating layer is two layers.

FIG. 6 is a cross-sectional view of a schematic configuration of an apparatus for cleaning a semiconductor substrate processing apparatus according to an embodiment of the present invention.

FIG. 7 is an internal structure diagram relating to wafer transfer of an apparatus for cleaning a semiconductor substrate processing apparatus according to an embodiment of the present invention, in which (A), (B), (C), and (D) are loaded with wafers. 2 shows the state of each sequence in the process.

FIG. 8 is a perspective view of a conventional general wafer transfer system.

[Explanation of symbols]

101 201 301 401 501: Double-sided adhesive tape 102 attached to the main surface of wafer 102 202: Non-adhesive part for peeling double-sided adhesive tape 103 203 403 503 603 703: Semiconductor wafer 104 204: Double-sided adhesive tape 105 205: Wafer attached to back surface of wafer Double-sided adhesive tape 301 to be attached to the side surface: Tape attachment range 302 on wafer surface: Wafer edge 401: Double-sided tape 402 502: Adhesive 1 404 504: Adhesive 2 405 505: Support 601 701: Wafer cassette 602: Cassette Chamber 604 704: Wafer chuck 605: Wafer loading chamber 606 708: Gate valve 607: Cassette holder 608: Etching chamber 702: Wafer holding tab 705: Wafer transfer arm 706: W Ha transfer blade 707: wafer transfer blade claw 709: chamber wall 801: Belt 802: Pulley 804: drive motor 805: Roller 806: transfer arm 807: wafer contact surface 808: Vacuum holes 809: slide box 810: slide stage

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Claims (19)

[Claims] 1. A semiconductor substrate provided with a mechanism for transporting a semiconductor substrate, comprising a cleaning substrate having a double-sided adhesive tape having an adhesive layer formed on both sides of a support on at least a part of a back surface of the semiconductor substrate. It is characterized in that the cleaning substrate is conveyed to a semiconductor substrate passing path of a processing apparatus, and the self-weight of the cleaning substrate is used to remove foreign substances that cause defects in semiconductor devices, thereby improving the manufacturing yield of semiconductor substrates. A method for cleaning a semiconductor substrate processing apparatus. 2. A semiconductor substrate of a semiconductor substrate processing apparatus is conveyed by using a cleaning substrate having a double-sided adhesive tape having an adhesive layer formed on both sides of a support on at least a part of the back surface of the semiconductor substrate. Mechanism, a mechanism for performing a required treatment on the semiconductor substrate, and a mechanism for transporting the semiconductor substrate, and then the cleaning substrate is conveyed to a series of semiconductor substrate passages, and a semiconductor device utilizing the dead weight of the cleaning substrate is used. A method for cleaning a semiconductor substrate processing apparatus, characterized in that the manufacturing yield of semiconductor substrates is improved by removing foreign matter that causes defects in the semiconductor substrate. 3. A cleaning substrate having a double-sided pressure-sensitive adhesive tape having a pressure-sensitive adhesive layer formed on both sides of a support on at least a part of the back surface of the semiconductor substrate, the semiconductor substrate in a semiconductor substrate processing apparatus being transferred from a semiconductor substrate loading section. A transport system for transporting to the semiconductor substrate processing section, the semiconductor substrate processing section, and the semiconductor substrate are transported to a series of semiconductor substrate passing paths of a transport system for transporting from the semiconductor substrate processing section to the unloading section, and the cleaning substrate A semiconductor-based leaning method, characterized in that the manufacturing yield of a semiconductor substrate is improved by removing foreign matter that causes defects in a semiconductor device by utilizing its own weight. 4. A process for applying a predetermined process using a semiconductor substrate processing apparatus to a cleaning substrate having a double-sided adhesive tape having a pressure-sensitive adhesive layer formed on both sides of a support on at least a part of the back surface of the semiconductor substrate. Improving the manufacturing yield of a semiconductor substrate by idly carrying it to a semiconductor substrate passing path of the semiconductor substrate processing apparatus between the substrates and removing foreign matters that cause defects in semiconductor devices by using the self-weight of the cleaning substrate. A method for cleaning a semiconductor substrate processing apparatus, comprising: 5. A pressure-sensitive adhesive layer is formed on both sides of a support on at least a part of the back surface of the semiconductor substrate, and the peel strength of the pressure-sensitive adhesive layer on the semiconductor substrate fixing side is adjusted to the semiconductor substrate processing device member contact side pressure-sensitive adhesive layer. Using a cleaning substrate with a double-sided adhesive tape adhered, which has a peel strength equal to or greater than the peel strength, the cleaning substrate is placed in a semiconductor substrate passage of a semiconductor substrate processing apparatus equipped with a mechanism for transporting the semiconductor substrate. A method for cleaning a semiconductor substrate processing apparatus, which comprises transporting and using a self-weight of the cleaning substrate to remove foreign matter that causes a defect in a semiconductor device, thereby improving a manufacturing yield of the semiconductor substrate. 6. The method for cleaning a semiconductor substrate processing apparatus, wherein a pressure sensitive adhesive layer is formed on both surfaces of a support as a double-sided pressure sensitive adhesive tape, and the peel strength of the substrate fixing side pressure sensitive adhesive layer is adjusted to the semiconductor substrate processing apparatus member contact. The method for cleaning a semiconductor substrate processing apparatus according to claim 5, wherein a double-sided adhesive tape having a peel strength greater than that of the side adhesive layer is used. 7. The method for cleaning a semiconductor substrate processing apparatus according to claim 5, wherein the semiconductor substrate processing apparatus is a semiconductor substrate processing apparatus maintained in a vacuum. 8. A mechanism for transporting a semiconductor substrate using a cleaning substrate having a double-sided pressure-sensitive adhesive tape having an acrylic pressure-sensitive adhesive layer formed on both sides of a support on at least a part of the back surface of the semiconductor substrate. The cleaning substrate is conveyed to the semiconductor substrate passage of the semiconductor substrate processing apparatus, and the self-weight of the cleaning substrate is used to remove foreign matters that cause defects in semiconductor devices, thereby improving the manufacturing yield of the semiconductor substrate. A method for cleaning a semiconductor substrate processing apparatus, comprising: 9. The support is composed mainly of polyethylene terephthalate.
A method for cleaning a semiconductor substrate processing apparatus as described above. 10. A semiconductor substrate on at least a part of a back surface thereof,
Acrylic pressure-sensitive adhesive layers are formed on both sides of a support mainly composed of polyethylene terephthalate, and the peel strength of the substrate fixing side pressure sensitive adhesive layer is equal to or higher than the peeling strength of the substrate processing apparatus member contact side pressure sensitive adhesive layer. Using a cleaning substrate with a double-sided adhesive tape fixed to be larger,
By transporting the cleaning substrate to the semiconductor substrate passage of the semiconductor substrate processing apparatus having a mechanism for transporting the semiconductor substrate, and using the self-weight of the cleaning substrate to remove foreign matters that cause defects in the semiconductor device. A method of cleaning a semiconductor substrate processing apparatus, characterized by improving the manufacturing yield of a semiconductor substrate. 11. The double-sided pressure-sensitive adhesive tape has pressure-sensitive adhesive layers formed on both sides of a support, and the peel strength of the pressure-sensitive adhesive layer on the substrate-fixing side is higher than that of the pressure-sensitive adhesive layer on the substrate-processing device member contact side. 11. The method for cleaning a semiconductor substrate processing apparatus according to claim 10, wherein the double-sided adhesive tape is large. 12. A semiconductor substrate using a cleaning substrate having a double-sided adhesive tape having an acrylic adhesive layer formed on both sides of a support containing polyethylene terephthalate as a main material on at least a part of the back surface of the semiconductor substrate. The semiconductor substrate processing apparatus transfers the cleaning substrate to a series of semiconductor substrate passing paths of a mechanism for transferring a semiconductor substrate of a processing apparatus, a mechanism for performing a required processing on the semiconductor substrate, and a mechanism for transferring the semiconductor substrate thereafter. A cleaning method for a semiconductor substrate processing apparatus, comprising: cleaning a semiconductor substrate and removing foreign matter that causes a defect in a semiconductor device by utilizing the weight of the cleaning substrate. 13. A semiconductor substrate processing apparatus comprising a cleaning substrate having a double-sided adhesive tape having an acrylic adhesive layer formed on both sides of a support containing polyethylene terephthalate as a main material on at least a part of the back surface of the semiconductor substrate. In a series of semiconductor substrate passage paths of a transport system for transporting the semiconductor substrate from the semiconductor substrate loading unit to the semiconductor substrate processing unit, the semiconductor substrate processing unit, and a transport system for transporting the semiconductor substrate from the semiconductor substrate processing unit to the unloading unit. A semiconductor characterized by improving the manufacturing yield of a semiconductor substrate by transporting and cleaning the semiconductor substrate processing apparatus and removing foreign matter that causes a defect in a semiconductor device by utilizing the weight of the cleaning substrate. A method for cleaning a substrate processing apparatus. 14. At least a part of the back surface of the semiconductor substrate,
A cleaning substrate having a double-sided adhesive tape having an acrylic pressure-sensitive adhesive layer formed on both sides of a support containing polyethylene terephthalate as a main material is fixed between the substrates to be subjected to a predetermined process using a semiconductor substrate processing apparatus. The present invention is characterized in that the manufacturing yield of semiconductor substrates is improved by carrying out empty conveyance to a semiconductor substrate passage of a semiconductor substrate processing apparatus and removing foreign matters that cause defects in semiconductor devices by utilizing the weight of the cleaning substrate. Cleaning method for semiconductor substrate processing apparatus. 15. At least a part of the back surface of the semiconductor substrate,
A double-sided pressure-sensitive adhesive tape in which a pressure-sensitive adhesive layer is formed on both sides of a support, and the peeling strength of the substrate-fixing-side pressure-sensitive adhesive layer is equal to or larger than the peeling strength of the semiconductor-substrate processing apparatus member contact-side pressure-sensitive adhesive layer. By using the cleaning substrate having the fixed substrate, the cleaning substrate is transported to the substrate passage path of the semiconductor substrate processing apparatus having a mechanism for transporting the semiconductor substrate to clean the semiconductor substrate processing apparatus, and the cleaning substrate A method for cleaning a semiconductor substrate processing apparatus, characterized in that a manufacturing yield of a semiconductor substrate is improved by removing foreign matter which causes a defect in a semiconductor device by utilizing its own weight. 16. The double-sided pressure-sensitive adhesive tape is characterized in that a double-sided pressure-sensitive adhesive tape having a peeling strength of the substrate-fixing-side pressure-sensitive adhesive layer higher than a peeling strength of the semiconductor-substrate-processing-device-member-contact-side pressure-sensitive adhesive layer is used. Item 16. A method for cleaning a semiconductor substrate processing apparatus according to Item 15. 17. The method for cleaning a semiconductor substrate processing apparatus according to claim 15, wherein the semiconductor substrate processing apparatus is a semiconductor substrate processing apparatus maintained in a vacuum. 18. The semiconductor substrate in which the range of the back surface of the semiconductor substrate on which the double-sided adhesive tape is formed covers the contact portion between the cleaning system and the transport system or processing unit of the semiconductor processing apparatus to be cleaned. 18. The method for manufacturing a semiconductor processing apparatus according to claim 1, wherein the range is the back surface of the semiconductor processing apparatus. 19. At least a part of the back surface of the semiconductor substrate,
A cleaning substrate having a double-sided adhesive tape having an adhesive layer formed on both sides of a support is used, and the cleaning substrate is conveyed to a semiconductor substrate passage of a semiconductor substrate processing apparatus having a mechanism for conveying the semiconductor substrate. A method for cleaning a semiconductor processing apparatus, comprising: