JP2003197092A - Method for manufacturing plasma display panel - Google Patents

Abstract

[PROBLEMS] To provide a method of manufacturing a plasma display panel provided with a dielectric film having excellent withstand voltage characteristics. SOLUTION: A dielectric paste containing a plasticizer is applied on a glass substrate 3 on which a display electrode 6 is formed, and a remaining plasticizer amount ratio in the applied film is 8% to 29% of a plasticizer amount ratio in the dielectric paste. %, And then fired to form the dielectric film 9. Thereby, the coating film after drying has flexibility and internal stress is reduced, and cracks generated in the drying step can be suppressed. A dielectric film having withstand voltage characteristics can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel used for a display device or the like,
In particular, the present invention relates to a manufacturing method capable of suppressing the generation of film defects in the dielectric film forming process and improving the manufacturing yield of panels.

[0002]

2. Description of the Related Art As a display device for displaying a high-definition television image on a large screen, a device using a plasma display panel (hereinafter referred to as PDP) is expected to be used.

The PDP is basically composed of a front plate and a back plate.

The front plate is composed of a glass substrate, a display electrode composed of a stripe-shaped transparent electrode and a bus electrode formed on one main surface of the glass substrate, and a dielectric film covering the display electrode and acting as a capacitor. And a MgO protective layer formed on this dielectric film.

The dielectric film is usually formed by printing a paste having a predetermined viscosity by kneading powder such as lead borosilicate low melting point glass which is an inorganic component, ethyl cellulose resin as a binder component and a solvent. By a coating method, a batch coating method, a transfer method, or the like, is formed by coating a predetermined thickness on one main surface of the glass substrate including the display electrodes, drying, and baking.

On the other hand, the back plate has a glass substrate and stripe-shaped address electrodes formed on one main surface thereof.
It is composed of a dielectric film that covers the address electrodes, partition walls formed on the dielectric film, and phosphor layers that are formed between the partition walls and emit red, green, and blue light, respectively.

The front plate and the rear plate are hermetically sealed so that their electrode forming surfaces face each other, and a discharge gas such as Ne-Xe contains 400 Torr to 60 Torr in the discharge space formed by the partition wall.
It is sealed at a pressure of 0 Torr. A discharge gas is discharged by selectively applying a video signal voltage to the display electrodes, and the ultraviolet rays generated thereby excite the phosphor layers of each color to emit red, green, and blue light, thereby realizing a color image display. is doing.

[0008]

By the way, in the PDP for high-definition television, as the pixel density becomes high, the density of the partition walls must be made high, and the aperture ratio of the pixel is lowered accordingly. There is a risk that the brightness will be reduced. In order to obtain the same brightness and efficiency as the PDP used in the conventional method such as the NTSC method, the partition wall width is narrowed to suppress the decrease in the aperture ratio as much as possible, and the partial pressure of the discharge gas is adjusted. It has been studied to reduce the discharge voltage by decreasing the thickness and increase the transmittance.

As the dielectric film thickness is reduced, the withstand voltage characteristic is deteriorated accordingly, and not only the reliability of the PDP itself is deteriorated, but also the production yield of the PDP may be decreased. . This is because as the dielectric film becomes thinner, cracks and bubbles in the film are more likely to adversely affect the withstand voltage characteristics.

It is considered that the main factor that causes defects such as cracks and bubbles in the dielectric film is its forming method.

As described above, the dielectric film is formed by applying a paste containing an inorganic powder, a binder component, and a solvent to a predetermined thickness, holding it at a predetermined temperature in a drying oven, and drying it. Formed by firing.

In the process of applying the paste and then drying it,
The solvent component in the paste evaporates. Along with that, the coating film shrinks in the film thickness direction and the film in-plane direction, and this shrinkage phenomenon causes the occurrence of defects. In addition, after the coating film is dried, the difference in shrinkage between the coating film and the glass substrate supporting it due to the temperature change when the substrate is taken out of the drying oven, and the solvent and resin material being removed during the baking process It is speculated that the medium may also cause defects.

How stress is generated in the coating film in the drying step will be described with reference to FIGS. 8 (a) and 8 (b).

FIG. 8A shows the distribution of stress generated in the coating film when the dry peak temperature is maintained. The film thickness decreases as the solvent or the like evaporates from the coating film.
The amount of shrinkage at that time differs between the region on the film surface side and the region on the glass substrate side. As a result, stress is generated in the coating film, and cracks are easily generated, and further, cracks are generated.

On the other hand, FIG. 8B shows how stress is generated when cooling from the dry peak temperature to room temperature.
Since the coefficient of thermal expansion of the dried coating film is different from that of the glass substrate, tensile stress is generated in the film. This stress also easily causes cracks in the coating film, and further causes cracks. If firing is performed in this state, cracks may be generated inside the film in the process to generate bubbles, or cracks in the film may be expanded.

The generation of defects in these dielectric films is influenced by the shape of the bus electrodes arranged on the substrate side. That is, in the thin film bus electrode as shown in FIG. 9A, the electrode thickness d1
Is about 3 μm. On the other hand, in the thick film bus electrode shown in FIG. 9B, the electrode thickness d2 is about 7 μm. The thin film bus electrode was formed by vapor deposition, and the thick film bus electrode was prepared by applying a conductive paste to a predetermined thickness and firing.

When a thin film bus electrode is used, even if a dielectric film is formed by coating and baking, the bus electrode is thin, so there is little risk of cracks and bubbles in the film, and good characteristics are obtained. A dielectric film of is obtained.

On the other hand, when the dielectric paste material is applied onto the glass substrate including the thick film bus electrode to form the applied film, the bus electrode itself is thick, so that a cavity is likely to occur in the step portion. When the void is generated, the dielectric strength characteristics of the dielectric film are significantly deteriorated.

If the dielectric film contains defects such as cracks and bubbles, dielectric breakdown occurs when a discharge voltage is applied to the display electrodes, which causes quality defects such as screen failure.
Dielectric breakdown of the dielectric film may occur in a dielectric breakdown inspection of the front plate alone or in a panel aging process after assembling the front plate and the back plate. If it occurs after panel aging, the panel becomes defective. Therefore, it is extremely important to form a defect-free dielectric film and prevent insulation failure due to the dielectric film in order to increase the manufacturing yield of PDPs.

It is an object of the present invention to provide a method of manufacturing a PDP capable of suppressing defects such as cracks and bubbles in a dielectric film on a front plate and displaying a high quality image.

[0021]

In order to solve the above problems, a method of manufacturing a plasma display panel according to the present invention comprises a step of forming a display electrode on one surface of a glass substrate, and a glass covering the display electrode. The step of applying a dielectric paste consisting of at least glass powder, a resin material, a plasticizer and a solvent on one surface of the substrate, and the residual plasticizer amount ratio in the coating film of the dielectric paste is the plasticizer amount in the dielectric paste. Until the ratio is within the range of 8% -29%,
The method is characterized by including a step of drying the coating film and a step of baking the coating film after drying.

In this way, the coating film of the dielectric paste has a residual plasticizer content ratio of 8% to 8% of the dielectric paste plasticizer content ratio.
By drying up to 29%, the coating film after drying has flexibility and internal stress is reduced, and cracks generated in the drying step can be suppressed, so that crack expansion and bubble generation in the baking step are suppressed. . By suppressing the generation of these defects, it is possible to obtain a dielectric film having good withstand voltage characteristics, so that the manufacturing yield of PDPs can be improved.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a cross section of a main part showing a main structure of a PDP according to an embodiment. In the figure, the z direction corresponds to the thickness direction of the PDP and the xy plane corresponds to a plane parallel to the PDP surface. 2 is a sectional view taken along the line AA of FIG.

As shown in FIG. 1, the PDP is composed of a front plate 1 and a rear plate 2 arranged to face each other.

In the front plate 1, a plurality of stripe-shaped transparent electrodes 4 are formed in parallel on the surface of the front glass substrate 3 on the rear plate 2 side with the x direction as the longitudinal direction. Further, as shown in FIG. 2, the bus electrode 5 having a sufficiently narrow width and excellent conductivity is provided along the one end of the transparent electrode 4 in the longitudinal direction and in the even number, as shown in FIG. The second transparent electrode 4 is laminated along the other edge in the longitudinal direction to form the display electrode 6. A light-shielding layer 7 is provided between each of the adjacent display electrodes 6 on the edge side covered with the bus electrode 5. The light shielding layer 7 is for shielding the phosphor layer 8 when no light is emitted.

Then, the display electrodes 6 on the front glass substrate 3 are formed.
A dielectric film 9 including the display electrode 6 and the light-shielding layer 7 is formed on the surface on which the light-shielding layer 7 and the light-shielding layer 7 are provided, and a protective film 10 is laminated on the entire area of the dielectric film 9. .

The display electrode 6 constitutes a pair of display electrodes by the display electrodes 6A and 6B formed between the light shielding layers 7 adjacent to each other, and corresponds to one display pixel.

In the rear plate 2, the rear glass substrate 11
Of the plurality of address electrodes 12 on the surface of the front plate 1 side.
A back plate dielectric film 13 is formed so as to be arranged side by side in a stripe pattern with the direction being the longitudinal direction and to cover the address electrodes 12. Then, the stripe-shaped partition walls 14 are arranged so as to be located directly above the regions between the address electrodes 12 on the surface of the back plate dielectric film 13. Phosphor layers 8 that emit red, green, and blue light are regularly arranged and formed in the stripe-shaped concave portions formed by the partition walls 14 and the back plate dielectric film 13.

As shown in FIG. 1, the front plate 1 and the rear plate 2 having such a structure are arranged so that the address electrodes 12 and the display electrodes 6 face each other at right angles, and the rear plate 2
The space surrounded by the stripe-shaped concave portions formed by the partition walls 14 and the back plate dielectric film 13 and the protective film 10 of the front plate 1 is filled with a discharge gas as described later, The outer peripheral edge of back plate 2 is sealed with sealing glass.

As a result, a discharge space 15 is formed between the adjacent barrier ribs 14 and, as shown in FIG. 2, a discharge space is formed in a region where a pair of adjacent display electrodes 6A and 6B and one address electrode 12 intersect. The cell becomes 15, which is a cell related to image display. He, Xe, or Ne is contained in the discharge space 15.
Discharge gas (filled gas) consisting of rare gas components such as
It is sealed at a pressure of about 600 Torr.

At the time of driving the PDP, in each cell, the address electrode 12 and the display electrode 6, and the pair of display electrodes 6A, 6 are provided.
Short-wave ultraviolet light (wavelength of about 147
nm) is generated, and the phosphor layer 8 emits light to display an image.

Next, an example of a specific method for manufacturing the front plate 1 will be described.

(Example 1) A front glass substrate 3 made of soda glass having a thickness of about 2.8 mm was coated with a thickness of about 3000.
An ITO (Indium Tin Oxide) film or SnO ₂ film of Å is formed by a sputtering method, a vacuum evaporation method or the like, and then patterned in a stripe shape to form the transparent electrode 4. Further, a bus electrode 5 is formed by applying a photosensitive silver paste on a predetermined portion of the transparent electrode 4 and then patterning it by a photolithography technique or by printing it in a stripe shape by a thick film forming technique such as a screen printing method. . The transparent electrode 4 and the bus electrode 5 form a display electrode 6.

The bus electrode 5 may be formed by laminating three layers of Cr-Cu-Cr using a thin film forming technique.

A photosensitive light-shielding black paste is applied between adjacent display electrodes 6 and then patterned by a photolithography technique, or printed in stripes by a thick film forming technique such as a screen printing method to form a light-shielding layer 7. To form.

A method of forming the dielectric film 9 on the surface of the front glass substrate 3 on which the display electrodes 6 and the light shielding layer 7 are formed will be described.

As described above, the transparent electrode 4, the bus electrode 5 and the light shielding layer 7 are formed on the front glass substrate 3. The bus electrode 5 may be manufactured using a thin film forming technique.

Lead boric acid type glass powder as an inorganic component,
Ethyl cellulose as a resin component, a solvent, and a plasticizer are mixed at a weight ratio of 70: 4.8: 24: 1.2 to form a paste. α-Terpineol and EP acetic acid diethylene glycol mono-n-butyl ether (hereinafter BCA
(Referred to as ") are mixed at a weight ratio of 20:80 to prepare a solvent. This solvent, polymer resin ethyl cellulose, and plasticizer dibutyl phthalate (hereinafter DB
Vehicle). This vehicle and lead borate glass (PbO ・ B ₂ O ₃・ SiO ₂・ CaO)
The powder is mixed in a weight ratio of 30:70 to prepare a dielectric film forming paste. An acrylic resin may be used instead of the ethyl cellulose resin.

This paste is used for the transparent electrode 4 and the bus electrode 5.
On the surface of the front glass substrate 3 on which are formed, including the surfaces of the electrodes 4 and 5, coating printing is performed by a die coating method. Since the thickness of the dielectric film 9 is about 30 μm, the thickness of the coating film of the dielectric forming paste is about 100 μm.
Of course, instead of the die coating method, screen printing may be repeated many times to form a coating film having a predetermined film thickness. In this example, since the mass productivity is excellent, the coating film was formed by the die coating method.

FIG. 3 shows a method of forming a dielectric film by a die coating method.

As shown in FIG. 3, the front glass substrate 3 is placed on the table 16 with the display electrode and the light-shielding film (neither shown) on the upper side. A paste 17 having a viscosity of 3 × 10 ⁵ centipoise or less is placed in a tank 18, guided to a die coater head 20 by a pump 19, and the paste 17 is discharged from a head nozzle 21 onto the front glass substrate 3. At this time, the coating film 22 of the dielectric film 9 is formed on the entire surface of the front glass substrate 3 by moving either the head nozzle 21 or the table 16.

Next, the coating film 22 is dried to remove the solvent component contained in the coating film 22. This can reduce the firing load in the next firing step.

FIG. 4 shows the temperature profile of the drying process. The front glass substrate 3 on which the coating film 22 is formed is placed in an infrared (IR) drying furnace in which the maximum temperature is set to a temperature of 130 ° C. lower than the boiling point of the solvent, and the coating film is dried by holding it for a predetermined time. Then, it is gradually cooled to room temperature and then fired. As a method for heating the coating film, a method of using a hot plate instead of the infrared drying oven or a method of using a hot air oven or the like may be used.

Next, the front glass substrate having the dried coating film is fired using a firing furnace set to the temperature profile shown in FIG.

As shown in FIG. 5, first, the front glass substrate with a coating film is gradually heated to a temperature of 350 ° C. and kept at this temperature for a predetermined time to desolvate the coating film. Then, the temperature is further raised and baking is performed at 580 ° C. for 10 minutes. After firing, it is gradually cooled to room temperature. In this way, the front glass substrate provided with the dielectric film is completed.

As described above, when a plasticizer is added to the paste which is the raw material of the coating film, the coating film is prevented from being excessively dried, and flexibility is imparted to the coating film after drying. Thereby, the stress generated in the dielectric film obtained by firing the coating film can be reduced as compared with the case where the plasticizer is not contained.

As a result of examining the relationship between the magnitude of the stress remaining in the dielectric film when kept at room temperature and the withstand voltage characteristic against the dielectric breakdown of the dielectric film, the residual plasticizer amount ratio in the coated film after drying was determined. It has been clarified that the withstand voltage characteristic of the dielectric film can be improved by the regulation.

With respect to the coating film formed by using the paste having the above composition ratio, samples having different residual plasticizer amount ratios in the coating film were prepared by selecting the holding time Th of the peak temperature in the temperature profile shown in FIG. Then, the temperature was maintained at 580 ° C. for 10 minutes, and firing was performed.

The residual plasticizer content ratio means the ratio of the plasticizer content ratio in the coating film before firing to the plasticizer content ratio in the paste state.

Each of the obtained dielectric-forming coating films was measured for residual stress contained therein, and the results shown in FIG. 6 were obtained. The horizontal axis represents the residual plasticizer amount ratio in the coating film before firing.

Further, the coating films were baked according to the baking profile shown in FIG. 5 to form dielectric films, and the insulation failure occurrence rate was also measured when a predetermined voltage was applied to each of the obtained dielectric films. did. The result is shown in FIG.

As is clear from FIG. 6, the residual stress in the coating film decreases as the residual plasticizer content ratio increases,
When the residual plasticizer amount ratio is 8% or more, it becomes a substantially constant value. Further, it was confirmed that the residual plasticizer amount ratio increased, and when it exceeded 29%, the residual stress increased a little.

The occurrence of insulation failure of the dielectric film was not observed when the residual plasticizer content ratio was within the range of 8% to 29%, and it was revealed that the dielectric film exhibited extremely good withstand voltage characteristics. That is, when the residual plasticizer amount ratio is lower than 8%, the insulation failure occurrence rate remarkably increases. on the other hand,
If the value exceeds 29%, the insulation failure occurrence rate also increases.

From the relationship between the residual plasticizer amount ratio in the coating film and the residual stress in the dielectric film, if the residual plasticizer amount ratio in the coating film is too low, that is, in the overdried state, It can be seen that the residual stress becomes almost constant when the residual stress increases and the residual plasticizer amount ratio increases. On the other hand, from the relationship between the residual plasticizer amount ratio in the coating film and the insulation failure occurrence rate of the dielectric film, defects such as cracks increase due to an increase in residual stress in the overdried state,
If the amount of plasticizer remains excessively large, air bubbles will be generated in the film due to the plasticizer during the desolvation process during firing, and the air bubbles will remain without being removed from the film, resulting in withstand voltage characteristics. It is presumed that the insulation failure rate increased and the insulation failure rate increased as a result.

As is apparent from the above, in order to reduce the occurrence of insulation failure of the dielectric film and enhance the withstand voltage characteristics, the residual plasticizer amount ratio in the coating film before firing is set within the range of 8% to 29%. It is desirable to do.

FIG. 7 shows the relationship between the residual plasticizer amount ratio in the coating film and the insulation failure occurrence rate in the dielectric film produced from the coating film when the applied voltage to the dielectric film is varied.

In FIG. 7, A is the result of applying a voltage which is 1.5 times the voltage used in the normal panel characteristic test, B is the same voltage twice, and C is the voltage tripled. It is the result obtained by applying.

As is apparent from FIG. 7, the desirable range of the residual plasticizer amount ratio becomes narrower as the applied voltage is increased. When the residual plasticizer amount ratio is within the range of 11% to 29%, good withstand voltage characteristics are guaranteed even at 1.5 times the normal test voltage. When higher safety needs to be ensured, the range is preferably 12% to 29%, more preferably 15% to 25%.

As described above, when the bus electrode is formed by the thick film process, it is important to suppress the generation of voids in the electrode step portion due to its large thickness. In the present invention, by adding a plasticizer to the paste to impart flexibility to the paste, and controlling the amount of residual plasticizer so that the state of being adhered to the side surface of the bus electrode is maintained even in the step of drying the coating film, When the coating film is hardened in the drying step, peeling from the side surface of the electrode prevents generation of a cavity.

Needless to say, the coating film may be dried and baked continuously.

Example 2 An example in which the present invention is applied to a process of simultaneously firing a bus electrode and a dielectric film will be described. The co-firing is a process in which a plurality of thick films stacked up to drying are fired at once in order to reduce energy consumption in the firing process.

In the case of the front plate, the printed film for forming the bus electrodes is dried, and then the coating film for forming the dielectric film is formed by coating, and after drying, the baked film is fired to form the bus electrode and the layer above it. A dielectric film is formed at the same time.

In the case of simultaneous firing, since the coating film for forming the bus electrodes has not yet been fired, the film thickness d2 shown in FIG. 9B becomes about 15 μm, which is about twice the film thickness after firing. Therefore, in the step of drying the dielectric film-forming coating film, cavities are likely to occur at the bus electrode forming coating film step portion. Further, in the degassing process of the firing process, the amount of shrinkage of the coating film in the bus electrode formation region is larger than that of the fired bus electrode, and the stress generated in the film is large.

In the present invention, a plasticizer is added to the dielectric paste, and a predetermined amount of the plasticizer is left in the drying step, so that the side surface of the coating film for forming the bus electrode and the coating film for forming the dielectric film adhere to each other. Can be maintained. Therefore, voids are not generated in the drying process, and the stress generated due to shrinkage can be reduced.

In this embodiment, the plasticizer has a boiling point of 3
Using 40 ° C. DBP, the temperature in the desolvation process was set to 350 ° C. in the firing profile of FIG. As a result, by allowing the plasticizer to exist in the coating film until the desolvation process, the stress in the coating film for forming the dielectric film can be reduced even if the coating film has a large shrinkage amount, and the baking can be performed.

As described above, according to the present invention, the effect is particularly exhibited in the simultaneous firing process for rationalizing the firing process.

The control of the amount of the plasticizer remaining in the dried film may be carried out by a method of controlling the holding time of a predetermined peak temperature or the peak temperature, or a combination of the two.

As described above, the present invention is an effective manufacturing method when a thick film of several tens of μm or more is formed on a large area substrate such as a glass substrate of a PDP without defects.

(Third Embodiment) Although the first and second embodiments describe the formation of the front plate dielectric, the present invention is also applicable to the formation of the rear plate dielectric or the partition wall.

That is, it can be realized by using a paste containing a plasticizer as the back plate dielectric film and the partition walls, and controlling the content of the plasticizer after drying within the optimum range.

The back plate is manufactured by the following method. Figure 1
As shown in, a conductor paste containing silver as a main component is applied in a stripe pattern at regular intervals on the surface of the rear glass substrate 11 made of soda glass having a thickness of about 2.6 mm by a screen printing method to form a thick film. The address electrode 12 having a thickness of about 5 to 10 μm is formed. By applying a lead-based glass paste on it by a die coating method or the like, the thickness after firing is about 2
A back plate dielectric film 13 having a thickness of 0 to 30 μm is formed.

Similarly, a paste of a partition wall material containing lead glass as a main component and alumina powder as an aggregate is applied to the back plate dielectric film 13 by a die coating method or the like, and the sandblast method or the like is used to obtain a predetermined thickness. And a height after firing of about 100 to 150 μm for forming partition walls. Then, it is fired to form the partition wall 14. After that, phosphor inks of a red phosphor, a green phosphor, and a blue phosphor are applied in a predetermined arrangement relationship on the wall surface of the partition wall 14 and the surface of the back plate dielectric film 13 exposed between them. After that, the phosphor ink is dried and fired to form the phosphor layers 8 of the respective colors, and the back plate 2 is completed.

At this time, the back plate dielectric film 13 and the partition wall 14
The formation method of was the same as the formation conditions of the dielectric film 9 and the like described in the first embodiment. That is, in the case of the back plate dielectric film 13, a paste having an appropriate viscosity is prepared by using lead borate glass powder as an inorganic component, ethyl cellulose as a resin component, and a solvent, and applied on the entire surface of the glass substrate. Further, it is dried and fired. Further, in the case of the partition wall 14, alumina powder or the like is further added as an aggregate to the component of the back plate dielectric film 13. The partition 14 is characterized in that the coating thickness is thicker than that of the back plate dielectric film 13. Similarly to the dielectric film 9 on the front plate, the back plate dielectric film 13 is required to have a predetermined withstand voltage characteristic. Further, since the partition wall 14 is a structure, it is required that the partition wall 14 is not missing due to a defect in the coating film.

Therefore, it is obvious that a high-quality thick film can be formed by introducing the plasticizer amount control of the present invention into the drying process of the coating formation process of the back plate dielectric film and the partition wall. In particular, since the coating film thickness is large in the partition wall forming process, the amount of shrinkage is large and the residual stress in the film is large. Therefore, it is needless to say that the effect can be obtained even if the present technical idea is applied to partition wall formation and the like. However, it goes without saying that the component ratio in the paste, the resin component, the solvent component and the like may be appropriately selected.

[0076]

As described above, according to the present invention, in the drying step after applying the paste in the manufacturing method for forming the dielectric film of the plasma display panel, the plasticizer content ratio in the coating film after drying is initially set. 9% or more and 29% or less of the plasticizer amount ratio in the paste.

As a result, it is possible to suppress the generation of defects in the film during the drying process and also suppress the generation of bubbles during the baking process. As a result, a dielectric film having excellent withstand voltage characteristics can be formed, and the manufacturing yield can be improved.

Further, according to the present invention, the effect is particularly large in the process in which the bus electrode is formed by the thick film process and the electrode step is likely to occur. This is a suitable method for simultaneously baking after forming laminated coating films for forming electrodes and dielectrics.

Furthermore, the method of the present invention can be applied not only to the formation of the dielectric film of the PDP front plate, but also to the process which requires a large film thickness and low defects.

[Brief description of drawings]

FIG. 1 is a cross-sectional perspective view of a main part showing the main configuration of a PDP.

FIG. 2 is a sectional view taken along the line AA in FIG.

FIG. 3 is a diagram for explaining a method for forming a coating film for a dielectric film by a die coating method.

FIG. 4 is a diagram showing an example of a temperature profile in a step of drying a dielectric film-forming coating film in the method of the present invention.

FIG. 5 is a view showing an example of a temperature profile in a firing process of a coating film for forming a dielectric film in the method of the present invention.

FIG. 6 is a diagram showing a relationship between a residual plasticizer amount ratio after drying of a dielectric film forming coating film, a residual stress in a dielectric film, and an insulation failure occurrence rate.

FIG. 7 is a diagram showing a relationship between an applied voltage and a residual plasticizer amount ratio after drying of a dielectric film forming coating film, and an insulation failure occurrence rate in the dielectric film.

FIG. 8 (a) is a conceptual diagram showing stress generation during the drying peak temperature holding process of the dielectric film, and FIG. 8 (b) is a conceptual diagram showing stress generation during the cooling process after drying of the dielectric film.

9A is a sectional view showing details of a thin film bus electrode and a dielectric film coating portion. FIG. 9B is a sectional view showing details of a thick film bus electrode and a dielectric film coating portion.

[Explanation of symbols]

1 Front plate 2 Back plate 3 Front glass substrate 4 transparent electrodes 5 bus electrodes 6 display electrodes 7 Light-shielding layer 8 Phosphor layer 9 Dielectric film 10 Protective film 11 Rear glass substrate 12 address electrodes 13 Back plate dielectric film 14 partitions 15 discharge space 16 tables 17 paste 18 tanks 19 pumps 20 Die coater head 21 head nozzle 22 Coating film

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masaki Aoki             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Nobuyuki Tai             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Morio Fujitani             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Akihiro Horikawa             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. (72) Inventor Atsushi Morita             1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric             Sangyo Co., Ltd. F-term (reference) 5C027 AA01 AA05                 5C040 FA01 GB03 GB14 GC19 GD07                       GD09 JA21 MA02 MA23

Claims (5)

[Claims] 1. A step of forming a display electrode on one surface of a glass substrate, and at least a glass powder, a resin material, a plasticizer and a solvent on the one surface of the glass substrate covering the display electrode. A step of applying the dielectric paste, and the residual plasticizer amount ratio in the coating film of the dielectric paste is 8% to 2 of the plasticizer amount ratio in the dielectric paste.
A method of manufacturing a plasma display panel, comprising: a step of drying the coating film until it is within a range of 9%; and a step of baking the coating film after drying. 2. The method of manufacturing a plasma display panel according to claim 1, further comprising a step of cooling the coating film to room temperature after the drying step. 3. The method of manufacturing a plasma display panel according to claim 1, wherein the display electrode has a bus electrode made of a thick film conductive film formed on a thin film transparent electrode. 4. The method for manufacturing a plasma display panel according to claim 3, wherein the bus electrode and the coating film of the dielectric paste are formed by simultaneous firing. 5. The method of manufacturing a plasma display panel according to claim 1, wherein the coating step obtains a predetermined film thickness by coating once.