JP2003188419A - Light emitting diode lamp - Google Patents
Light emitting diode lampInfo
- Publication number
- JP2003188419A JP2003188419A JP2001385110A JP2001385110A JP2003188419A JP 2003188419 A JP2003188419 A JP 2003188419A JP 2001385110 A JP2001385110 A JP 2001385110A JP 2001385110 A JP2001385110 A JP 2001385110A JP 2003188419 A JP2003188419 A JP 2003188419A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting diode
- reflecting member
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 claims description 18
- 239000011248 coating agent Substances 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 8
- 229920000647 polyepoxide Polymers 0.000 abstract description 8
- 238000000605 extraction Methods 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 11
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、発光ダイオードラ
ンプに関し、詳しくは光の取り出し効率が良好である発
光ダイオードランプに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting diode lamp, and more particularly to a light emitting diode lamp having good light extraction efficiency.
【０００２】[0002]
【従来の技術】図４は、従来の発光ダイオードランプを
示す断面図であり、図中１１は発光ダイオードチップで
ある。発光ダイオードチップ１１は、銀ペーストを接着
剤として用いてリードフレーム１２上に接着固定されて
おり、発光ダイオードチップ１１に設けられた電極は、
金線１４によりリードフレーム１３とワイヤボンディン
グされている。そして、発光ダイオードチップ１１が搭
載されたリードフレーム１２はエポキシ樹脂等の透光性
樹脂からなる被覆部１５により覆われている。被覆部１
５は所望の光の指向性が得られるように砲弾型の形状を
有している。2. Description of the Related Art FIG. 4 is a cross-sectional view showing a conventional light emitting diode lamp, in which 11 is a light emitting diode chip. The light emitting diode chip 11 is adhesively fixed onto the lead frame 12 using silver paste as an adhesive, and the electrodes provided on the light emitting diode chip 11 are
The lead frame 13 is wire-bonded with the gold wire 14. Then, the lead frame 12 on which the light emitting diode chip 11 is mounted is covered with a covering portion 15 made of a translucent resin such as an epoxy resin. Cover 1
Reference numeral 5 has a shell-like shape so that a desired light directivity can be obtained.
【０００３】[0003]
【発明が解決しようとする課題】図４に示した従来の発
光ダイオードランプは、上述したように被覆部１５が砲
弾型の形状を有しており、被覆部１５の先端側の曲面部
に到達した光は所望の向きに出射するが、被覆部１５の
円筒部に到達した光は、制御できない迷光となっている
という問題があった。発光ダイオードチップ１１による
発光は円状発光であるので、被覆部１５が砲弾型形状を
有する場合、被覆部１５の円筒部に到達した光について
指向性を付与し、光の取り出し効率を向上させるには限
界があった。In the conventional light emitting diode lamp shown in FIG. 4, the covering portion 15 has a shell shape as described above, and reaches the curved surface portion on the tip side of the covering portion 15. Although the emitted light is emitted in a desired direction, there is a problem that the light that reaches the cylindrical portion of the covering portion 15 becomes stray light that cannot be controlled. Since the light emitted from the light emitting diode chip 11 is circular light emission, when the covering portion 15 has a shell-like shape, directivity is given to the light reaching the cylindrical portion of the covering portion 15 to improve the light extraction efficiency. There was a limit.
【０００４】本発明は斯かる事情に鑑みてなされたもの
であり、被覆部の出光面が平面状をなし、発光ダイオー
ドチップから出射した光を反射させるための第１反射部
材と、第１反射部材により反射された光、及び発光ダイ
オードチップから出射して出光面により反射された光を
再度反射させて、出光面から該出光面に交叉する方向に
出射させるための第２反射部材とを備えることにより、
発光ダイオードチップから出射する光のうち出射角が臨
界角より大きい光は出光面にて全反射し、第２反射部材
にて再度反射して出光面から出射し、発光ダイオードチ
ップから出射する光のうち出射角が小さい光は第１反射
部材にて反射し、第２反射部材にて再度反射して出光面
から出射し、光の指向性が良好であり、光の取り出し効
率が良好であるとともに、大型化も容易である発光ダイ
オードランプを提供することを目的とする。The present invention has been made in view of such circumstances, and the first reflecting member for reflecting the light emitted from the light emitting diode chip and the first reflecting member have a light emitting surface having a flat surface. A second reflecting member for reflecting again the light reflected by the member and the light emitted from the light emitting diode chip and reflected by the light emitting surface, and emitting the light from the light emitting surface in a direction intersecting with the light emitting surface. By
Of the light emitted from the light emitting diode chip, the light having an emission angle larger than the critical angle is totally reflected by the light emitting surface, is reflected again by the second reflecting member, is emitted from the light emitting surface, and is emitted from the light emitting diode chip. Light having a small emission angle is reflected by the first reflecting member, is reflected again by the second reflecting member, and is emitted from the light emitting surface. The directivity of the light is good, and the light extraction efficiency is good. An object of the present invention is to provide a light emitting diode lamp that can be easily upsized.
【０００５】また、本発明は、凹面鏡状の第２反射部材
を有する支持部と、第２反射部材の略中央部に設けられ
た発光ダイオードチップと、発光ダイオードチップに対
向させて設けられた円板状の第１反射部材と、第２反射
部材の内側に設けられた被覆部とを備えることにより、
構造が簡単であり、発光ダイオードチップの円状発光に
対応して、さらに指向性が良好である発光ダイオードラ
ンプを提供することを目的とする。Further, according to the present invention, a support portion having a concave mirror-shaped second reflecting member, a light emitting diode chip provided substantially in the center of the second reflecting member, and a circle provided so as to face the light emitting diode chip. By providing the plate-shaped first reflecting member and the covering portion provided inside the second reflecting member,
It is an object of the present invention to provide a light emitting diode lamp having a simple structure and having a better directivity corresponding to circular light emission of a light emitting diode chip.
【０００６】そして、本発明は、第１反射部材が、発光
ダイオードチップから出射する光のうち出射角が臨界角
より小さい光を反射させる大きさを有することにより、
発光ダイオードチップから出射する光のうち出射角が臨
界角より小さい光は全て第１反射部材にて反射し、第２
反射部材にて再度反射して出光面から出光面に交叉する
方向に出射するので、指向性がさらに良好になり、光の
取り出し効率がさらに良好になる発光ダイオードランプ
を提供することを目的とする。According to the present invention, the first reflecting member has a size that reflects the light emitted from the light emitting diode chip and having an emission angle smaller than the critical angle.
Of the light emitted from the light emitting diode chip, all light having an emission angle smaller than the critical angle is reflected by the first reflecting member,
An object of the present invention is to provide a light emitting diode lamp in which directivity is further improved and light extraction efficiency is further improved because the light is reflected again by the reflecting member and emitted in a direction intersecting the light emitting surface. .
【０００７】また、本発明は、第１反射部材及び／又は
第２反射部材に、銀又はアルミニウムの被膜を形成する
ことにより、第１反射部材及び第２反射部材における反
射率が良好である発光ダイオードランプを提供すること
を目的とする。Further, according to the present invention, by forming a coating of silver or aluminum on the first reflecting member and / or the second reflecting member, light emission with good reflectance in the first reflecting member and the second reflecting member. It is intended to provide a diode lamp.
【０００８】そして、本発明は、第１反射部材及び／又
は第２反射部材を金属製にすることにより、第１反射部
材及び第２反射部材における反射率が良好である発光ダ
イオードランプを提供することを目的とする。The present invention provides a light emitting diode lamp in which the first reflecting member and / or the second reflecting member are made of metal, and the reflectances of the first reflecting member and the second reflecting member are good. The purpose is to
【０００９】[0009]
【課題を解決するための手段】第１発明の発光ダイオー
ドランプは、発光ダイオードチップと、該発光ダイオー
ドチップを覆う透光性樹脂製の被覆部とを備える発光ダ
イオードランプにおいて、前記被覆部は、前記発光ダイ
オードチップから出射した光が出光する出光面が平面状
をなし、前記発光ダイオードチップと前記出光面との間
に設けられており、前記発光ダイオードチップから出射
した光を反射させるための第１反射部材と、該第１反射
部材により反射された光、及び前記発光ダイオードチッ
プから出射して前記出光面により反射された光を再度反
射させて、前記出光面から該出光面に交叉する方向に出
射させるための第２反射部材とを備えることを特徴とす
る。A light emitting diode lamp according to a first aspect of the present invention is a light emitting diode lamp comprising a light emitting diode chip and a cover made of translucent resin for covering the light emitting diode chip. The light emitting surface from which the light emitted from the light emitting diode chip emits is formed into a flat shape, is provided between the light emitting diode chip and the light emitting surface, and is for reflecting the light emitted from the light emitting diode chip. (1) a reflecting member, a direction reflected by the first reflecting member, and a light emitted from the light emitting diode chip and reflected by the light emitting surface again to cross the light emitting surface to the light emitting surface And a second reflecting member for causing the light to be emitted.
【００１０】第１発明においては、発光ダイオードチッ
プから出射する光のうち出射角が臨界角より大きい光は
被覆部の出光面にて全反射し、第２反射部材にて再度反
射して出光面から出光面に交叉する方向に出射する。そ
して、発光ダイオードチップから出射する光のうち出射
角が小さい光は第１反射部材にて反射し、第２反射部材
にて再度反射して出光面から出光面に交叉する方向に出
射する。従って、第１発明の発光ダイオードランプは、
光の指向性が良好であり、光の取り出し効率が良好であ
る。そして、この第１発明の発光ダイオードランプの構
造によれば、大型化も容易である。In the first aspect of the invention, of the light emitted from the light emitting diode chip, the light having an emission angle larger than the critical angle is totally reflected by the light emitting surface of the covering portion, and is again reflected by the second reflecting member to be reflected by the light emitting surface. The light is emitted in a direction intersecting with the light exit surface. Then, of the light emitted from the light emitting diode chip, the light having a small emission angle is reflected by the first reflecting member, is reflected again by the second reflecting member, and is emitted in the direction intersecting the light emitting surface with the light emitting surface. Therefore, the light emitting diode lamp of the first invention is
The light directivity is good, and the light extraction efficiency is good. Further, according to the structure of the light emitting diode lamp of the first invention, it is easy to increase the size.
【００１１】第２発明の発光ダイオードランプは、第１
発明において、凹面鏡状の前記第２反射部材を有する支
持部と、前記第２反射部材の略中央部に設けられた前記
発光ダイオードチップと、該発光ダイオードチップに対
向させて設けられた円板状の前記第１反射部材と、前記
第２反射部材の内側に設けられた前記被覆部とを備える
ことを特徴とする。第２発明においては、第２反射部
材、被覆部及び第１反射部材の平面視の形状が、発光ダ
イオードチップによる発光の形状に対応して円状である
ので、さらに指向性が良好になり、光の取り出し効率が
向上する。この発光ダイオードランプは、構造も簡単で
ある。The light emitting diode lamp of the second invention is the first invention.
In the invention, a support portion having the concave reflecting mirror-shaped second reflecting member, the light-emitting diode chip provided in a substantially central portion of the second reflecting member, and a disc-like shape provided so as to face the light-emitting diode chip. Of the first reflection member and the covering portion provided inside the second reflection member. In the second invention, since the shapes of the second reflecting member, the covering portion and the first reflecting member in plan view are circular shapes corresponding to the shapes of light emitted by the light emitting diode chips, the directivity is further improved. The light extraction efficiency is improved. This light emitting diode lamp has a simple structure.
【００１２】第３発明の発光ダイオードランプは、第２
発明において、前記第１反射部材は、前記発光ダイオー
ドチップから出射する光のうち出射角が臨界角より小さ
い光を反射させる大きさを有することを特徴とする。第
３発明においては、発光ダイオードチップから出射する
光のうち出射角が臨界角より小さい光は全て第１反射部
材にて反射し、第２反射部材にて再度反射して出光面か
ら出光面に交叉する方向に出射する。従って、指向性が
さらに良好になり、光の取り出し効率が良好になる。The light emitting diode lamp of the third invention is the second invention.
In the invention, the first reflecting member is sized to reflect light having an emission angle smaller than a critical angle among the light emitted from the light emitting diode chip. In the third invention, of the light emitted from the light emitting diode chip, all the light having an emission angle smaller than the critical angle is reflected by the first reflecting member and is reflected again by the second reflecting member to change from the light emitting surface to the light emitting surface. Emit in the crossing direction. Therefore, the directivity is further improved, and the light extraction efficiency is improved.
【００１３】第４発明の発光ダイオードランプは、第１
乃至第３発明のいずれかにおいて、前記第１反射部材及
び／又は第２反射部材には、銀又はアルミニウムの被膜
が形成してあることを特徴とする。第４発明において
は、第１反射部材及び第２反射部材における反射率が良
好である。A light emitting diode lamp according to a fourth invention is the first invention.
In any one of the third to third inventions, the first reflecting member and / or the second reflecting member is characterized in that a coating of silver or aluminum is formed. In the fourth invention, the reflectances of the first reflecting member and the second reflecting member are good.
【００１４】第５発明の発光ダイオードランプは、第１
乃至第３発明のいずれかにおいて、前記第１反射部材及
び／又は第２反射部材は、金属からなることを特徴とす
る。第５発明においては、第１反射部材及び第２反射部
材における反射率が良好である。The light emitting diode lamp of the fifth invention is the first
According to any one of the third to third inventions, the first reflecting member and / or the second reflecting member is made of metal. In the fifth invention, the reflectances of the first reflecting member and the second reflecting member are good.
【００１５】[0015]
【発明の実施の形態】以下、本発明をその実施の形態を
示す図面に基づいて具体的に説明する。図１は、本発明
の実施の形態に係る発光ダイオードランプを示す断面図
であり、図中１は発光ダイオードチップである。発光ダ
イオードチップ１は、銀ペーストを接着剤として用いて
リードフレーム２上に接着固定されており、発光ダイオ
ードチップ１に設けられた電極とリードフレーム３と
が、金線４によりワイヤボンディングされている。白色
の液晶ポリマー等の樹脂からなる支持部５は、上部に凹
面鏡状の反射面（第２反射部材）５ａを有しており、発
光ダイオードチップ１を搭載したリードフレーム２及び
リードフレーム３は、反射面５ａの中央部を通って支持
部５の縦方向に貫通するリードフレーム挿入孔５ｂに挿
入されて、反射面５ａの中央部に配されている。反射面
５ａには、アルミニウム又は銀からなる被膜５ｃが形成
されている。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below with reference to the drawings showing the embodiments thereof. FIG. 1 is a sectional view showing a light emitting diode lamp according to an embodiment of the present invention, in which 1 is a light emitting diode chip. The light emitting diode chip 1 is adhesively fixed on the lead frame 2 using silver paste as an adhesive agent, and the electrode provided on the light emitting diode chip 1 and the lead frame 3 are wire-bonded by a gold wire 4. . The supporting portion 5 made of a resin such as white liquid crystal polymer has a concave mirror-shaped reflecting surface (second reflecting member) 5a on the upper portion, and the lead frame 2 and the lead frame 3 on which the light emitting diode chip 1 is mounted are It is inserted in a lead frame insertion hole 5b penetrating in the longitudinal direction of the support portion 5 through the central portion of the reflecting surface 5a, and is arranged in the central portion of the reflecting surface 5a. A coating 5c made of aluminum or silver is formed on the reflecting surface 5a.
【００１６】発光ダイオードチップ１を埋めるようにし
て、反射面５ａ及びリードフレーム挿入孔５ｂにはエポ
キシ樹脂等からなる透光性樹脂が充填されており、被覆
部６が形成されている。被覆部６の光が出光する出光面
６ａには、発光ダイオードチップ１に対向させて、反射
板嵌合孔６ｂが設けられており、反射板嵌合孔６ｂには
円板状の反射板（第１反射部材）７が嵌合されている。
反射板７の一面には、アルミニウム又は銀からなる被膜
７ａが形成されている。反射板７は、発光ダイオードチ
ップ１から出射する光のうち出射角が臨界角より小さい
光を反射させる大きさを有する。被覆部６を構成するエ
ポキシ樹脂の屈折率をｎ1 、空気の屈折率をｎ2 とする
と、臨界角θは、次の式（１）により求められる。
ｓｉｎθ＝ｎ2 ／ｎ1 …（１）
例えば、ｎ1 ＝１．５、ｎ2 ＝１であるとき、臨界角θ
は式（１）より、θ＝４１．８（度）となる。反射板７
の半径は、式（１）により求められた臨界角θ、及び反
射板７と発光ダイオードチップ１との間の距離から求め
られる。The reflective surface 5a and the lead frame insertion hole 5b are filled with a translucent resin such as an epoxy resin so as to fill the light emitting diode chip 1, and a covering portion 6 is formed. The light emitting surface 6a from which the light of the covering portion 6 emits light is provided with a reflection plate fitting hole 6b facing the light emitting diode chip 1, and the reflection plate fitting hole 6b has a disc-shaped reflection plate ( The first reflecting member) 7 is fitted.
A coating 7a made of aluminum or silver is formed on one surface of the reflection plate 7. The reflection plate 7 has a size that reflects the light emitted from the light emitting diode chip 1 and having an emission angle smaller than the critical angle. Assuming that the refractive index of the epoxy resin forming the coating portion 6 is n 1 and the refractive index of air is n 2 , the critical angle θ can be calculated by the following equation (1). sin θ = n 2 / n 1 (1) For example, when n 1 = 1.5 and n 2 = 1 then the critical angle θ
From the equation (1), θ = 41.8 (degrees). Reflector 7
The radius of is calculated from the critical angle θ obtained by the equation (1) and the distance between the reflector 7 and the light emitting diode chip 1.
【００１７】本実施の形態に係る発光ダイオードチップ
においては、反射面５ａは、反射面５ａにおいて反射し
た光が、出光面６ａからこの出光面６ａに略直交する方
向に出射するような曲率を有しているので、発光ダイオ
ードチップ１から出射する光のうち出射角が臨界角より
小さい光は反射板７にて反射され、反射板７にて反射さ
れた光は反射面５ａの被膜５ｃにて再度反射され、被膜
５ｃにて反射された光は、出光面６ａから出光面６ａに
略直交する方向に出射する。そして、発光ダイオードチ
ップ１から出射する光のうち出射角が臨界角より大きい
光は出光面６ａにて反射され、出光面６ａにて反射され
た光は反射面５ａの被膜５ｃにて再度反射され、被膜５
ｃにて反射された光は、出光面６ａから出光面６ａに略
直交する方向に出射する。In the light emitting diode chip according to this embodiment, the reflecting surface 5a has a curvature such that the light reflected by the reflecting surface 5a is emitted from the light emitting surface 6a in a direction substantially orthogonal to the light emitting surface 6a. Therefore, of the light emitted from the light emitting diode chip 1, the light having an emission angle smaller than the critical angle is reflected by the reflection plate 7, and the light reflected by the reflection plate 7 is reflected by the coating 5c of the reflection surface 5a. The light reflected again and reflected by the coating 5c is emitted from the light emitting surface 6a in a direction substantially orthogonal to the light emitting surface 6a. Then, of the light emitted from the light emitting diode chip 1, light having an emission angle larger than the critical angle is reflected by the light emitting surface 6a, and light reflected by the light emitting surface 6a is reflected again by the coating film 5c of the reflecting surface 5a. , Coating 5
The light reflected by c is emitted from the light emitting surface 6a in a direction substantially orthogonal to the light emitting surface 6a.
【００１８】以下に、本発明の発光ダイオードランプの
製造方法について説明する。図２及び図３は、発光ダイ
オードランプの製造工程を示す断面図である。まず、リ
ードフレーム２に発光ダイオードチップ１を搭載し、発
光ダイオードチップ１の電極とリードフレーム３とを金
線４によりワイヤボンディングする。そして、反射面５
ａに被膜５ｃが形成された支持部５を逆にして、リード
フレーム挿入孔５ｂに、発光ダイオードチップ１が搭載
されたリードフレーム２及びリードフレーム３を逆向き
に挿入する（図２（ａ））。The method of manufacturing the light emitting diode lamp of the present invention will be described below. 2 and 3 are cross-sectional views showing a manufacturing process of the light emitting diode lamp. First, the light emitting diode chip 1 is mounted on the lead frame 2, and the electrodes of the light emitting diode chip 1 and the lead frame 3 are wire-bonded with the gold wire 4. And the reflective surface 5
The support portion 5 having the coating 5c formed on a is reversed, and the lead frame 2 and the lead frame 3 on which the light emitting diode chip 1 is mounted are inserted in the lead frame insertion holes 5b in the opposite directions (FIG. 2 (a)). ).
【００１９】次に、発光ダイオードチップ１を搭載した
リードフレーム２及びリードフレーム３が挿入された支
持部５を、支持部５の上部と同一形状を有する凹部８ａ
と、反射板７と同一形状を有し、凹部８ａの中央部に設
けられた突出部８ｂとを備える被覆部形成型８に嵌め込
む。リードフレーム挿入孔５ｂからエポキシ樹脂を未硬
化の状態で流し込み、硬化炉にて１２０℃で略３時間加
温し、エポキシ樹脂を硬化させて、被覆部６を形成す
る。被覆部６の平面の中央部には、反射板嵌合孔６ｂが
形成されている（図２（ｂ））。Next, the lead frame 2 on which the light emitting diode chip 1 is mounted, and the supporting portion 5 into which the lead frame 3 is inserted, have a recess 8a having the same shape as the upper portion of the supporting portion 5.
And a covering portion forming die 8 having the same shape as the reflection plate 7 and having a protruding portion 8b provided in the central portion of the concave portion 8a. The epoxy resin is poured into the lead frame insertion hole 5b in an uncured state, and heated in a curing oven at 120 ° C. for about 3 hours to cure the epoxy resin to form the coating portion 6. A reflection plate fitting hole 6b is formed in the center of the plane of the covering portion 6 (FIG. 2 (b)).
【００２０】そして、被覆部形成型８から支持部５を抜
いて、被膜７ａが形成された反射板７をエポキシ樹脂を
介在させた状態で反射板嵌合孔６ｂに嵌め込み、エポキ
シ樹脂を硬化させる（図３（ｃ））。Then, the support portion 5 is removed from the coating portion forming die 8, the reflection plate 7 having the coating 7a is inserted into the reflection plate fitting hole 6b with the epoxy resin interposed, and the epoxy resin is cured. (FIG.3 (c)).
【００２１】以上のようにして製造された本実施の形態
に係る発光ダイオードランプにおいては、発光ダイオー
ドチップ１から出射する光のうち出射角が臨界角より大
きい光は出光面６ａにて全反射し、被膜５ｃにて再度反
射して出光面６ａから出光面６ａに略直交する方向に出
射し、発光ダイオードチップ１から出射する光のうち出
射角が臨界角より小さい光は反射板７にて反射し、被膜
５ｃにて再度反射して出光面６ａから出光面６ａに略直
交する方向に出射するので、反射面５ａ、被覆部６及び
反射板７の形状が発光ダイオードチップ１の発光の形状
に対応して円状であることと相まって、指向性が良好で
あり、光の取り出し効率が良好である。そして、この発
光ダイオードランプの構造は簡単であり、大型化も容易
である。In the light emitting diode lamp according to the present embodiment manufactured as described above, of the light emitted from the light emitting diode chip 1, the light having the emission angle larger than the critical angle is totally reflected by the light emitting surface 6a. Of the light emitted from the light emitting surface 6a in a direction substantially perpendicular to the light emitting surface 6a and emitted from the light emitting diode chip 1 and having an emission angle smaller than the critical angle is reflected by the reflection plate 7. Then, the light is reflected again by the coating film 5c and emitted from the light emitting surface 6a in a direction substantially orthogonal to the light emitting surface 6a. Along with the corresponding circular shape, the directivity is good and the light extraction efficiency is good. Further, the structure of this light emitting diode lamp is simple and it is easy to increase the size.
【００２２】なお、本実施の形態においては、反射面５
ａ、被覆部６及び反射板７の平面視の形状が円状である
場合につき説明しているが、これに限定されるものでは
ない。但し、反射面５ａ、被覆部６及び反射板７の形状
が円状である方が、発光ダイオードチップ１の発光の形
状に対応しており、指向性が良好であり、光の取り出し
効率が良好である。In this embodiment, the reflecting surface 5
Although the case where the shapes of a, the covering portion 6 and the reflecting plate 7 in plan view are circular has been described, the present invention is not limited to this. However, the circular shapes of the reflecting surface 5a, the covering portion 6, and the reflecting plate 7 correspond to the shape of the light emission of the light emitting diode chip 1, the directivity is good, and the light extraction efficiency is good. Is.
【００２３】また、本実施の形態においては、出光面６
ａが平面である場合につき説明しているがこれに限定さ
れず、出光面６ａ全体にわたって良好な指向性を確保す
ることができる形状であれば、上に凸であってもよい。Further, in this embodiment, the light emitting surface 6
Although the case where a is a plane has been described, the shape is not limited to this, and may be convex upward as long as it has a shape capable of ensuring good directivity over the entire light exit surface 6a.
【００２４】そして、本実施の形態においては、反射板
７が、発光ダイオードチップ１から出射する光のうち出
射角が臨界角より小さい光を反射させる大きさを有する
場合につき説明しているが、これに限定されるものでは
ない。但し、反射板７が、発光ダイオードチップ１から
出射する光のうち出射角が臨界角より小さい光を反射さ
せる大きさを有する方が、出射角が臨界角より小さい光
が全て反射板７にて反射し、再度反射面５ａにて反射さ
れて出向面６ａから出光面６ａに略直交する方向に出射
して、指向性がさらに良好になるので好ましい。In the present embodiment, the case where the reflection plate 7 has a size that reflects the light emitted from the light emitting diode chip 1 and having an emission angle smaller than the critical angle has been described. It is not limited to this. However, when the reflection plate 7 has a size that reflects light having an emission angle smaller than the critical angle among the light emitted from the light emitting diode chip 1, all the light having the emission angle smaller than the critical angle is reflected by the reflection plate 7. It is preferable because the light is reflected, is reflected again by the reflecting surface 5a, and is emitted from the outgoing surface 6a in a direction substantially orthogonal to the light outgoing surface 6a to further improve the directivity.
【００２５】さらに、本実施の形態においては、反射面
５ａ及び反射板７にアルミニウム又は銀からなる被膜５
ｃ及び７ａが形成されている場合につき説明しているが
これに限定されるものではなく、反射面５ａ及び反射板
７をアルミニウム及び銀等の金属から構成することにし
てもよい。反射面５ａ及び反射板７にアルミニウム又は
銀からなる被膜５ｃ及び７ａを形成し、又は反射面５ａ
及び反射板７をアルミニウム及び銀等の金属から構成す
ることにより、反射面５ａ及び反射板７における反射率
が向上する。Further, in this embodiment, the coating 5 made of aluminum or silver is formed on the reflecting surface 5a and the reflecting plate 7.
Although the case where c and 7a are formed has been described, the present invention is not limited to this, and the reflecting surface 5a and the reflecting plate 7 may be made of a metal such as aluminum and silver. Coatings 5c and 7a made of aluminum or silver are formed on the reflection surface 5a and the reflection plate 7, or the reflection surface 5a
By configuring the reflecting plate 7 and the reflecting plate 7 from a metal such as aluminum and silver, the reflectance of the reflecting surface 5a and the reflecting plate 7 is improved.
【００２６】[0026]
【発明の効果】以上、詳述したように、第１発明による
場合は、発光ダイオードチップから出射する光のうち出
射角が臨界角より大きい光は被覆部の出光面にて全反射
し、第２反射部材にて再度反射して出光面から出光面に
交叉する方向に出射し、発光ダイオードチップから出射
する光のうち出射角が小さい光は第１反射部材にて反射
し、第２反射部材にて再度反射して出光面から出光面に
交叉する方向に出射する。従って、光の指向性が良好で
あり、光の取り出し効率が良好である。そして、この第
１発明の発光ダイオードランプの構造によれば、大型化
も容易である。As described above in detail, according to the first aspect of the invention, of the light emitted from the light emitting diode chip, the light having an emission angle larger than the critical angle is totally reflected by the light emitting surface of the covering portion, 2 The light is reflected again by the reflecting member and is emitted from the light emitting surface in a direction intersecting the light emitting surface. Of the light emitted from the light emitting diode chip, the light having a small emission angle is reflected by the first reflecting member and the second reflecting member. The light is reflected again at and is emitted in a direction intersecting the light emitting surface from the light emitting surface. Therefore, the directivity of light is good and the light extraction efficiency is good. Further, according to the structure of the light emitting diode lamp of the first invention, it is easy to increase the size.
【００２７】第２発明による場合は、第２反射部材、被
覆部及び第１反射部材の平面視の形状が発光ダイオード
チップの発光の形状に対応して円状であるので、さらに
指向性が良好になり、光の取り出し効率が向上する。こ
の発光ダイオードランプは、構造も簡単である。In the case of the second invention, since the shapes of the second reflecting member, the covering portion and the first reflecting member in plan view are circular shapes corresponding to the light emitting shapes of the light emitting diode chips, the directivity is further improved. Therefore, the light extraction efficiency is improved. This light emitting diode lamp has a simple structure.
【００２８】第３発明による場合は、第１反射部材が発
光ダイオードチップから出射する光のうち出射角が臨界
角より小さい光を反射させる大きさを有するので、発光
ダイオードチップから出射する光のうち出射角が臨界角
より小さい光は全て第１反射部材にて反射し、第２反射
部材にて再度反射して出光面から出光面に交叉する方向
に出射するので、指向性がさらに良好になり、光の取り
出し効率が良好になる。According to the third aspect of the present invention, the first reflecting member has a size that reflects light having an emission angle smaller than the critical angle among the light emitted from the light emitting diode chip. All the light having an emission angle smaller than the critical angle is reflected by the first reflecting member, is reflected again by the second reflecting member, and is emitted in the direction intersecting the light emitting surface from the light emitting surface, so that the directivity is further improved. , The light extraction efficiency is improved.
【００２９】第４発明による場合は、第１反射部材及び
／又は第２反射部材には、銀又はアルミニウムの被膜が
形成されているので、第１反射部材及び第２反射部材に
おける反射率が良好である。In the case of the fourth invention, since the silver or aluminum coating is formed on the first reflecting member and / or the second reflecting member, the reflectance of the first reflecting member and the second reflecting member is good. Is.
【００３０】第５発明の発光ダイオードランプは、前記
第１反射部材及び／又は第２反射部材は、金属からなる
ので、第１反射部材及び第２反射部材における反射率が
良好である。In the light emitting diode lamp of the fifth invention, since the first reflecting member and / or the second reflecting member is made of metal, the reflectance of the first reflecting member and the second reflecting member is good.
【図１】本発明の実施の形態に係る発光ダイオードラン
プを示す断面図である。FIG. 1 is a cross-sectional view showing a light emitting diode lamp according to an embodiment of the present invention.
【図２】本発明の実施の形態に係る発光ダイオードラン
プの製造工程を示す断面図である。FIG. 2 is a sectional view showing a manufacturing process of the light emitting diode lamp according to the embodiment of the present invention.
【図３】本発明の実施の形態に係る発光ダイオードラン
プの製造工程を示す断面図である。FIG. 3 is a cross-sectional view showing a manufacturing process of the light-emitting diode lamp according to the embodiment of the present invention.
【図４】従来の発光ダイオードランプを示す断面図であ
る。FIG. 4 is a sectional view showing a conventional light emitting diode lamp.
１ 発光ダイオードチップ ２ リードフレーム ５ 支持部 ５ａ 反射面 ５ｃ 被膜 ６ 被覆部 ７ 反射板 ７ａ 被膜 1 Light emitting diode chip 2 lead frame 5 Support 5a reflective surface 5c film 6 Cover 7 Reflector 7a film
Claims (5)
ードチップを覆う透光性樹脂製の被覆部とを備える発光
ダイオードランプにおいて、 前記被覆部は、前記発光ダイオードチップから出射した
光が出光する出光面が平面状をなし、 前記発光ダイオードチップと前記出光面との間に設けら
れており、前記発光ダイオードチップから出射した光を
反射させるための第１反射部材と、 該第１反射部材により反射された光、及び前記発光ダイ
オードチップから出射して前記出光面により反射された
光を再度反射させて、前記出光面から該出光面に交叉す
る方向に出射させるための第２反射部材とを備えること
を特徴とする発光ダイオードランプ。1. A light-emitting diode lamp comprising a light-emitting diode chip and a translucent resin covering portion for covering the light-emitting diode chip, wherein the covering portion has a light-emitting surface on which light emitted from the light-emitting diode chip is emitted. Has a planar shape, is provided between the light emitting diode chip and the light emitting surface, and has a first reflecting member for reflecting light emitted from the light emitting diode chip; and a first reflecting member that reflects the light. And a second reflecting member for reflecting again the light emitted from the light emitting diode chip and reflected by the light emitting surface, and emitting the light in a direction intersecting with the light emitting surface from the light emitting surface. A light emitting diode lamp.
持部と、 前記第２反射部材の略中央部に設けられた前記発光ダイ
オードチップと、 該発光ダイオードチップに対向させて設けられた円板状
の前記第１反射部材と、 前記第２反射部材の内側に設けられた前記被覆部とを備
える請求項１記載の発光ダイオードランプ。2. A support portion having the second reflecting member in the shape of a concave mirror, the light emitting diode chip provided at a substantially central portion of the second reflecting member, and a circle provided so as to face the light emitting diode chip. The light-emitting diode lamp according to claim 1, comprising the plate-shaped first reflecting member and the covering portion provided inside the second reflecting member.
ドチップから出射する光のうち出射角が臨界角より小さ
い光を反射させる大きさを有する請求項２記載の発光ダ
イオードランプ。3. The light emitting diode lamp according to claim 2, wherein the first reflecting member has a size that reflects light having an emission angle smaller than a critical angle among lights emitted from the light emitting diode chip.
材には、銀又はアルミニウムの被膜が形成してある請求
項１乃至３のいずれかに記載の発光ダイオードランプ。4. The light emitting diode lamp according to claim 1, wherein a coating of silver or aluminum is formed on the first reflecting member and / or the second reflecting member.
材は、金属からなる請求項１乃至３のいずれかに記載の
発光ダイオードランプ。5. The light emitting diode lamp according to claim 1, wherein the first reflecting member and / or the second reflecting member is made of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001385110A JP3970017B2 (en) | 2001-12-18 | 2001-12-18 | Light emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001385110A JP3970017B2 (en) | 2001-12-18 | 2001-12-18 | Light emitting diode lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003188419A true JP2003188419A (en) | 2003-07-04 |
| JP3970017B2 JP3970017B2 (en) | 2007-09-05 |
Family
ID=27594655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001385110A Expired - Fee Related JP3970017B2 (en) | 2001-12-18 | 2001-12-18 | Light emitting diode lamp |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3970017B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347467A (en) * | 2004-06-02 | 2005-12-15 | Fujikura Ltd | Light emitting device and lighting system |
| JP2006190813A (en) * | 2005-01-06 | 2006-07-20 | Fujikura Ltd | Light emitting device, method for adjusting chromaticity of light emitting device, and lighting apparatus |
| CN100359708C (en) * | 2004-02-26 | 2008-01-02 | 京瓷株式会社 | Lighting devices and lighting devices |
| TWI565096B (en) * | 2012-12-24 | 2017-01-01 | 鴻海精密工業股份有限公司 | Light-emitting diode crystal grain and manufacturing method thereof, light-emitting diode lamp |
-
2001
- 2001-12-18 JP JP2001385110A patent/JP3970017B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100359708C (en) * | 2004-02-26 | 2008-01-02 | 京瓷株式会社 | Lighting devices and lighting devices |
| JP2005347467A (en) * | 2004-06-02 | 2005-12-15 | Fujikura Ltd | Light emitting device and lighting system |
| JP2006190813A (en) * | 2005-01-06 | 2006-07-20 | Fujikura Ltd | Light emitting device, method for adjusting chromaticity of light emitting device, and lighting apparatus |
| TWI565096B (en) * | 2012-12-24 | 2017-01-01 | 鴻海精密工業股份有限公司 | Light-emitting diode crystal grain and manufacturing method thereof, light-emitting diode lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3970017B2 (en) | 2007-09-05 |
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