JP2003168920A - Millimeter-wave wireless communication system package with aligned lens - Google Patents

Abstract

An object of the present invention is to provide a millimeter wave wireless communication system package that has high energy transfer efficiency between an antenna and an external environment, is small, and is suitable for mass production. A millimeter-wave wireless communication system having one planar integrated antenna is mounted on a package core constituted by a substrate, a package bottom plate, and a package side wall, and a package lid is mounted on the package side wall. Is fixed with cement 6, the lens holder 3 is fixed to the package lid 5 with cement 4, the dielectric lens 1 is aligned with the lens holder 3 so as to face the planar integrated antenna, and the And a millimeter wave wireless communication system package characterized by being attached to the package.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to package construction, and more particularly to millimeter wave wireless communication system packages having aligned lenses.

[0002]

BACKGROUND OF THE INVENTION Millimeter wave wireless communication systems are rapidly growing and require highly integrated and cost effective packaging technology. One of the major problems with packaging technology for integrated systems with single or multiple monolithic millimeter-wave integrated circuits and single or multiple planar integrated antennas is between the single or multiple antennas and the external environment. Optimization of energy transfer in.

Therefore, much effort has conventionally been directed to improving the gain of the planar integrated antenna and its directivity. F. F. Filipovic
In addition, S. S. Raman and G. M. Lapates (GM Rebeiz), or F.L. One original method, developed by several proponents such as F. Colomb et al., Comprises a dielectric lens placed over a radiating antenna, which is the same as a planar antenna wafer. It has a dielectric constant.

[0004]

The above method has the advantage of eliminating the substrate mode which is the main cause of the high losses of planar integrated antennas. However, A. As revealed by A. Neto,
Thereby the antenna's feeding source
This method is limited because it has a significant effect on Moreover, it requires advanced and specific simulation tools. After all, this kind of method requires the use of large dielectric lenses, which is inconvenient for packaging,
It hampers the achievement of high integration levels of planar integrated antennas integrated with monolithic millimeter-wave integrated circuits.

The present invention overcomes the above problems in the prior art, and provides a millimeter wave wireless communication system package which has high energy transfer efficiency between an antenna and an external environment, is small in size, and is suitable for mass production. With the goal.

[0006]

In order to solve the above-mentioned problems, the present invention provides a package, as described in claim 1.
A millimeter wave wireless communication system package including a core and a package lid, wherein the package core has a millimeter wave wireless communication system having one planar integrated antenna mounted thereon, and the package lid includes a millimeter wave wireless communication system. A lens holder is fixed, a dielectric lens is attached to the lens holder, and the dielectric lens is aligned so as to face the planar integrated antenna. And a millimeter wave wireless communication system package having the same.

Further, the present invention is a millimeter wave wireless communication system package including a package core and a package lid as set forth in claim 2, wherein the package core has a plurality of flat surfaces. A millimeter-wave wireless communication system having an integrated antenna is mounted, and the package lid is fixed with the same number of lens holders as the number of the planar integrated antennas, and each lens holder has one lens holder. The dielectric lens of is attached, each said dielectric lens,
A millimeter wave wireless communication system package having aligned lenses, each of which is aligned to face a separate planar integrated antenna.

[0008]

It is an object of the present invention to provide a millimeter wave wireless communication system package that has high energy transfer efficiency between an antenna and an external environment, is small in size, and is suitable for mass production.

To achieve the above object, the dielectric lens or lenses are physically separated from the antenna or antennas and integrated into the package lid or package lid. That is, by increasing the energy transfer efficiency between the antenna and the external environment by constructing a package having a precisely aligned lens or lenses for a planar integrated antenna-based system, It is possible to achieve downsizing and to provide a packaging structure suitable for mass production.

The distance from the lens or lenses to the antenna surface, the size of the lens or lenses, and the focal length do not significantly affect the feed source, and the gain or orientation of the antenna or antennas. Selected to further improve sex. That is,
Given that the position of the planar integrated antenna (s) is fixed within the system, the proposed package configuration can be applied to any planar integrated antenna based millimeter wave wireless integrated communication system. Furthermore, the configuration of the precision alignment system proposed here and its implementation are simple. For these two reasons, the package provided by the present invention is considered suitable for high volume manufacturing.

The miniaturization of the package in the present invention is achieved by arranging one or a plurality of small dielectric lenses, which are aligned so as to face the planar integrated antenna, in other words, the diameter thereof is the same as the operating frequency of the antenna or several times thereof. , By using precisely aligned dielectric lens or lenses. The dielectric lens or lenses of this type effectively improve the gain and directivity of the antenna, even though they do not satisfy the conditions of geometrical optics. Therefore, the dielectric lens or lenses considered here are effective in improving the energy transfer between the antenna or antennas and the surrounding environment, and are compatible with the integration of the package.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention proposes the following three new package configuration examples specialized for millimeter wave wireless communication systems and having precisely aligned lenses. [Example 1] As an example of a package having a dielectric lens for a single antenna-based millimeter-wave wireless communication system, a package for a millimeter-wave wireless system having one integrated planar antenna is shown in FIG. Shown in (a) and (b). 1A is a top view, and FIG. 1B is a cross-sectional view taken along the vertical plane AA ′ shown in FIG.

In this package, a millimeter wave wireless communication system 8 having one planar integrated antenna is placed on a package core composed of a substrate 11, a package bottom plate 9 and a package side wall 7, and the package side wall 7 is provided with The package lid 5 corresponding to the lid portion of the package is fixed with cement 6, the lens holder 3 is fixed to the package lid 5 with cement 4, and the dielectric lens 1 is physically attached to the lens holder 3. ing. Further, the dielectric lens 1 is a convex lens and is positioned so as to face the planar integrated antenna.

The millimeter wave wireless communication system 8 having one planar integrated antenna described above is formed of one or more monolithic millimeter wave (and / or microwave) integrated circuits in the present invention.

The millimeter wave planar integrated antenna contemplated for the millimeter wave wireless communication system 8 described above may be a separate integrated circuit or may be part of a multifunction integrated circuit.

To assist in fine alignment of the dielectric lens 1, the marks 3-1 and 3- associated with the planar integrated antenna of the millimeter wave wireless communication system 8 are provided.
2, 3-3, and 3-4 are provided.

In the embodiment shown in FIGS. 1A and 1B, the package core is the package sidewall 7,
It is composed of a substrate 11 and a package bottom plate 9. The substrate 11 includes a conductor wire 11-1 to provide a sufficient connection to the millimeter wave wireless communication system 8. The materials and techniques used to manufacture the substrate 11 and its conductor wires 11-1 can provide the required operating performance. The conductor wire 11-1 is the bottom plate 9 of the package.
Since it is connected via the via hole formed on the bottom surface of the package, this enables surface mounting of the package.

Millimeter wave wireless communication system 8
In the construction of the package core in which wire bonding technology is used for mounting the
A hole 10 filled with 1 is formed in the package bottom plate 9. This hole 10 is smaller than the area of the planar integrated antenna chip, that is, the chip having the aforementioned planar integrated antenna, so that it can be fixed while keeping the planar integrated antenna horizontal. This feature helps in fine alignment of the dielectric lens 1 above the planar integrated antenna.

According to the present invention, the materials used for manufacturing the package side wall 7, the package bottom plate 9 and the substrate 11 can be selected according to the cost and the operating performance.

In the embodiment shown in FIGS. 1 (a) and 1 (b), as an example of a configuration in which the package core enables mounting of the millimeter wave wireless communication system 8 using the wire bonding technique. It is shown. However, it will be apparent that other techniques, such as flip chip bonding, may be used without departing from the spirit of the invention. Therefore, changes in the specifications for the package bottom plate 9 and the substrate 11 are included within the scope of the present invention.

In the embodiment shown in FIGS. 1A and 1B, the package core is shown by way of example in a configuration that allows surface mounting of the package. However, it will be apparent that other configurations, such as those using leads, are possible without departing from the spirit of the invention. Therefore, changes in the specifications of the package side wall 7, the package bottom plate 9, and the substrate 11 are included in the scope of the present invention.

The dielectric lens 1 is arranged above the above planar integrated antenna so that its focal plane corresponds to the plane of the planar integrated antenna. This improves the gain of the antenna and increases the efficiency of energy transfer between the antenna and the external environment.

Such a configuration is possible because accurate knowledge of the thickness of each component constituting the package and the thickness of the planar integrated antenna chip is obtained.

The focal length of the dielectric lens 1 which is a convex lens is selected to be sufficiently large so as not to have a great influence on the feed source of the above-mentioned planar integrated antenna. Figure 3
Shows the results of a simulation of the effect of a 1400 μm thick fused silica layer placed above the ring slot antenna on the feed source. This simulation is based on the antenna model shown in FIG.
It was performed using the Lett Packard Momentum) electromagnetic simulation software. The data shown in FIG. 2 are relevant when using state-of-the-art millimeter wave integrated circuit materials. The fused silica chosen here as an example corresponds to one of the possible materials for the production of dielectric lenses. The thickness of the fused silica layer shown in this example corresponds to one of the fused silica lens thicknesses applicable to the present invention.

The results shown in FIG. 3 demonstrate that there is a distance between the dielectric material and the feed line, which distance has little effect from the dielectric layer to the feed line. That is, the dielectric lens 1 whose distance from the plane of the planar integrated antenna is selected to be sufficiently large does not significantly affect the antenna feed source. Therefore, if the position of the planar integrated antenna is fixed in the package, the present invention can be applied to any millimeter wave wireless communication system having one planar integrated antenna. This result shows that the present invention is suitable for mass production.

It is included as part of this embodiment of the present invention that the diameter of the dielectric lens 1 can be chosen to be of the same order as the operating wavelength of the planar integrated antenna, or several times that wavelength. This result is D. Kasi1ingam et al. Have theoretically studied dielectric ball lenses, and
A. It has been experimentally demonstrated by A. Yamada et al. Using plano-convex quartz lenses.

FIG. 6 shows a surface radius of 1500 μm and a thickness of 26.
5 shows a field emission pattern of the ring slot antenna of FIG. 4 in which a fused silica convex lens having a diameter of 00 μm and a focal length of 1367 μm is combined. The distance from the dielectric lens to the plane of the planar integrated antenna is 213 μm. As compared with the radiation pattern obtained by only the planar integrated antenna shown in FIG. 5, the gain is improved by about 8 dB and the half-value angle is improved by about 42 °. In this example,
We considered a dielectric lens with a diameter on the order of the wavelength of the planar integrated antenna under consideration. According to the invention, this proves to be compatible with the integration in a package in which the dielectric lens 1 is miniaturized in size, while at the same time improving the energy transfer of the planar integrated antenna and the surrounding environment. It was

As shown in FIGS. 1A and 1B, the dielectric lens 1 is physically mounted on the lens holder 3 by cement 2. Figure 1 (a)
In the examples of (b) and (b), the thickness of the lens holder 3 is thin in the vicinity of the dielectric lens 1, and its influence on the lens performance is suppressed. However, the shape and size of the lens holder 3 are different from those of FIG.
It is not limited by the examples of (a) and (b). Obviously, other shapes or sizes may be considered without departing from the spirit of the invention. Therefore, changes in specifications that can be made to the lens holder 3 are included in the scope of the present invention.

Marks 3-1, 3-2, 3-3, and 3 are provided on the lens holder 3 as shown in FIG.
-4, which is used for fine alignment with the marks associated with the planar integrated antenna. This fine alignment is performed after the package lid 5 is fixed to the package side wall 7 by the cement 6. However, these marks 3-1, 3-2, 3-3, and 3
The shape, size, and position of -4 are not limited to the example of FIG. Obviously, other shapes, sizes or positions are conceivable without departing from the spirit of the invention. Therefore, changes in specifications that can be made to the marks 3-1, 3-2, 3-3, and 3-4 are included within the scope of the present invention. Marks 3-1, 3-2, 3-
After precise alignment of 3 and 3-4 with the marks associated with the planar integrated antenna, cement 4 is used to secure the lens holder 3 to the package lid 5.

It is part of this embodiment of the invention that the lens holder 3 is made of a non-metal transparent material. The non-metallic material was chosen to minimize the effect of the lens holder 3 on the planar integrated antenna as well as its peripheral circuits. The transparent material includes the marks 3-1, 3-2, 3-3, and 3-4 of the lens holder 3,
It was chosen to allow fine alignment with the marks associated with the planar integrated antenna. Example 2 An example of a package having a dielectric lens and a precision alignment system for a single antenna based millimeter wave wireless communication system, FIG.
It shows in (a), (b), and (c) of FIG. this is,
4 illustrates an extension of the first embodiment. FIG. 7 is a top view of the system, and FIGS. 8 (a), (b), and (c) are vertical planes AA ′, B- in FIG. 7 of the system, respectively.
The sectional view in B'and CC 'is shown.

In this package, a millimeter wave wireless communication system 8 having one planar integrated antenna is placed on a package core composed of a substrate 11, a package bottom plate 9 and a package side wall 16,
The package lid 12 is provided on the package side wall 16 with four precision screws 13-1, 13-2, 13-3, and 13.
-4, the lens holder 3 is fixed to the package lid 12 with cement 4, and the dielectric lens 1 is physically attached to the lens holder 3. Further, the dielectric lens 1 is a convex lens and is positioned so as to face the planar integrated antenna.

The millimeter-wave wireless communication system 8 having one planar integrated antenna described above is formed of a single or a plurality of monolithic millimeter-wave (and / or microwave) integrated circuits in the present invention.

The package also includes a precision alignment system distributed between the package core and the package lid 12 described above.

The millimeter wave wireless communication system 8 having one planar integrated antenna described above is formed from one or more monolithic millimeter wave (and / or microwave) integrated circuits in accordance with the present invention. The millimeter wave planar integrated antenna contemplated for the millimeter wave wireless communication system 8 described above can be a separate integrated circuit or can be part of a multifunction integrated circuit. Marks associated with the planar integrated antenna of the millimeter wave wireless communication system 8 are provided to assist in fine alignment of the dielectric lens 1.

As in the case of the first embodiment, this package core also includes the package side wall 16, the substrate 11, and the package bottom plate 9. The configurations of the package bottom plate 9 and the substrate 11 are the same as those described in the first embodiment. Also in this case, the conductor wire 11-1 is
Since they are connected through the via holes formed on the bottom surface of the package bottom plate 9, the surface mounting of the package can be performed by this.

Millimeter wave wireless communication system 8
In the construction of the package core in which wire bonding technology is used for mounting the
A hole 10 filled with 1 is formed in the package bottom plate 9. This hole 10 is smaller than the area of the planar integrated antenna chip, that is, the chip having the aforementioned planar integrated antenna, so that it can be fixed while keeping the planar integrated antenna horizontal. This feature helps in fine alignment of the dielectric lens 1 above the planar integrated antenna.

According to the present invention, the materials used for manufacturing the package bottom plate 9, the substrate 11 and the package side wall 16 can be selected according to the cost and the operating performance.

In the embodiment shown in FIGS. 7 (a), (b), and (c), the package core mounts a millimeter wave wireless communication system using wire bonding technology. It is shown as an example in a enabling arrangement. However, it will be apparent that other techniques, such as flip chip bonding, may be used without departing from the spirit of the invention. Therefore, changes in specifications made to the package bottom plate 9 and the substrate 11 are included within the scope of the present invention.

In the embodiments shown in FIGS. 7, 8A, 8B, and 8C, the package core is shown by way of example in a configuration that allows surface mounting of the package. ing. However, it will be apparent that other configurations, such as those using leads, are possible without departing from the spirit of the invention. Therefore, changes in specifications made to the package bottom plate 9, the substrate 11, and the package side wall 16 are within the scope of the present invention.

As in the case of the package shown in the first embodiment, the dielectric lens 1 is arranged above the planar integrated antenna so that its focal plane corresponds to the plane of the planar integrated antenna. This improves the gain of the antenna and increases the efficiency of energy transfer between the antenna and the external environment. Also in this case, the focal length of the focusing dielectric lens 1 is selected to be sufficiently large so as not to have a great influence on the feed source of the above-mentioned planar integrated antenna. Therefore, if the position of the planar integrated antenna is fixed in the package, the proposed invention is
It can be applied to any millimeter wave wireless communication system having two planar integrated antennas. This result shows that the present invention is suitable for mass production.

As in the case of the package shown in the first embodiment, the fact that the diameter of the dielectric lens can be selected to be on the order of the operating wavelength of the planar integrated antenna or several times thereof is the present embodiment. Included as part of the example.

The results shown in FIG. 6 can also be applied to this embodiment. In this case, we considered a dielectric lens having a diameter equal to the wavelength of the planar integrated antenna under consideration. According to the invention, this results in a dielectric lens 1
Has been demonstrated to be compatible with integration in miniaturized packages in size, while improving the energy transfer of planar integrated antennas and the surrounding environment.

The dielectric lens 1 was made by cementing the lens holder 3 with cement 2 according to exactly the same method as in Example 1.
Physically mounted on top. 7 and 8 (a)
In the examples of (b) and (b), the thickness of the lens holder 3 is thin in the vicinity of the dielectric lens 1, and its influence on the lens performance is suppressed. However, the shape and size of the lens holder 3 are not limited by the examples of FIGS. 7 and 8A and 8B. Obviously, other shapes or sizes may be considered without departing from the spirit of the invention. Therefore, changes in specifications that can be made to the lens holder 3 are included in the scope of the present invention.

Marks 3-1 and 3 are provided on the lens holder 3.
-2, 3-3, and 3-4, which are used for fine alignment with the marks associated with the planar integrated antenna. However, these marks 3-1, 3-2,
The shapes, sizes and positions of 3-3 and 3-4 are
It is not limited to the example of FIG. Obviously, other shapes, sizes or positions are conceivable without departing from the spirit of the invention. Therefore, the marks 3-1 and 3
Modifications of specifications that can be made to -2, 3-3, and 3-4 are within the scope of the present invention. Mark 3-
After precise alignment of 1, 3-2, 3-3, and 3-4 with the marks associated with the planar integrated antenna, cement 4 is used to secure lens holder 3 to package lid 12.

As in the case of the package shown in the first embodiment, it is part of this embodiment that this lens holder 3 is made of a non-metallic transparent material.

The vertical precision alignment system includes four precision screws 13-1, 13-2, 13-3, which pass through the package lid 12 and are screwed into the package side wall 16.
And 13-4. These four screws 13-
1, 13-2, 13-3, and 13-4 are four spiral springs 15-1 and 1 embedded in the package side wall 16.
5-2, 15-3, and 15-4, respectively, and the dielectric lens 1 from the relationship with the planar integrated antenna.
Allows you to set the vertical position of the. Vertical fine alignment is achieved when maximum peak power is radiated from the antenna lens assembly. This precise alignment is performed after fixing the lens holder 3 to the package lid 12. The package lid 12
It must be adjusted on the package side wall 16 so that the horizontal displacement of the dielectric lens 1 does not occur. The package lid 12 is fixed to the package core by four small precision screws 14-1, 14-2, 14-.
3 and 14-4. [Embodiment 3] An example of a package having a plurality of dielectric lenses and a precision alignment system for a multi-antenna-based millimeter-wave wireless communication system is shown in FIGS. 9, 10A and 10B. . This includes a package with multiple precision aligned lenses,
9 is an extension of the millimeter-wave wireless communication system according to the second embodiment having a plurality of planar integrated antennas.

In this package, a millimeter wave wireless communication system 22 having a plurality of planar integrated antennas is mounted on a package core composed of a substrate 11, a package bottom plate 23, and a package side wall 16, and the package side wall 16 is packaged.・ The lid 21
The lens holders 19-1 and 19-2 are fixed to the package lid 21 by the four precision screws 13-1, 13-2, 13-3, and 13-4, respectively.
Fixed with cement 21-1 and 21-2, lens
Dielectric lenses 17-1 and 17-2 are physically attached to the holders 19-1 and 19-2, respectively. Further, the dielectric lenses 17-1 and 17-2 are convex lenses, and are aligned so as to face the separate planar integrated antennas.

Further, this package is provided with a precision alignment system distributed to the above-mentioned package core and package lid 21.

The millimeter wave wireless communication system 22 having two planar integrated antennas described above is formed from one or more monolithic millimeter wave (and / or microwave) integrated circuits in accordance with the present invention. The millimeter wave planar integrated antenna contemplated for the millimeter wave wireless communication system 22 described above can be a separate integrated circuit or can be part of a multifunction integrated circuit. A millimeter wave wireless communication system 22 is provided to assist in precise alignment of the dielectric lenses 17-1 and 17-2.
And a mark associated with the planar integrated antenna.

In this embodiment, the number of planar integrated antennas and the corresponding numbers of dielectric lenses and lens holders are the same as those in FIGS. 9 and 10 (a) and (b).
Needless to say, the number is not limited to the two shown in FIG. Also, it goes without saying that the number of screws used in this embodiment may be arbitrary plural.

As in the case of the first and second embodiments, this package core also includes the package side wall 16, substrate 11, and
Also included is a package bottom plate 23. The configurations of the package side wall 16 and the substrate 11 are the same as those described in the second embodiment. Further, also in this case, since the conductor wire 11-1 is connected through the through hole formed in the bottom surface of the package bottom plate 23, the surface mounting of the package can be performed by this.

Millimeter wave wireless communication system 2
In the construction of the package core in which the wire bonding technique is used to mount the two, the cement 24 is partially
The package bottom plate 23 has a plurality of holes 24 filled with -1.
Is formed. These holes 24 are for the planar integrated antenna
Below the chip, i.e. the chip with the above-mentioned planar integrated antenna, is distributed so that it can be fixed while keeping the planar integrated antenna horizontal. This feature helps in fine alignment of the dielectric lenses 17-1 and 17-2 above the planar integrated antenna.

According to the present invention, the materials used for manufacturing the substrate 11, the package side wall 16, and the package bottom plate 23 can be selected according to the cost and the operating performance.

In the embodiment shown in FIGS. 9 and 10 (a) and (b), the package core is in a configuration that allows mounting of a millimeter wave wireless communication system using wire bonding technology. It is shown as an example. However, it will be apparent that other techniques, such as flip chip bonding, may be used without departing from the spirit of the invention.
Therefore, changes in the specifications made to the components 11 and 23 are within the scope of the invention.

In the embodiment shown in FIGS. 9 and 10A and 10B, the package core is shown by way of example in a configuration that allows surface mounting of the package. However, it will be apparent that other configurations, such as those using leads, are possible without departing from the spirit of the invention. Therefore, the substrate 11, the package side wall 16, and the package bottom plate 23.
Changes to the specifications made to the will fall within the scope of the present invention.

As in the case of the package shown in the first embodiment, the dielectric lenses 17-1 and 17-2 are located above the corresponding planar integrated antenna, and the focal planes correspond to the planes of the planar integrated antenna. Is arranged as. This improves the gain of the antenna and increases the efficiency of energy transfer between the antenna and the external environment. The focal lengths of the focusing dielectric lenses 17-1 and 17-2 are equal to each other, and again, they are selected to be sufficiently large so as not to have a great influence on the feed source of the above-mentioned planar integrated antenna. Provided that the position of the planar integrated antenna is fixed in the package, the proposed invention can be applied to any millimeter wave wireless communication system having a plurality of planar integrated antennas. This result shows that the proposed invention is suitable for mass production.

As in the case of the package shown in the first embodiment, it is essential that the diameter of the dielectric lens can be selected to be the same order as the operating wavelength of the planar integrated antenna or several times thereof. Included as part of the example.

The results shown in FIG. 6 can also be applied to this embodiment. In this example, a dielectric lens having a wavelength and a diameter equal to that of the planar integrated antenna under consideration was considered. According to the proposed invention, this is compatible with the integration of the dielectric lenses 17-1 and 17-2 in a package which is downsized in size, while the planar integrated antenna and the energy transfer of the ambient environment. Has been proved to be improved.

As shown in FIGS. 9 and 10 (a) and (b), the dielectric lenses 17-1 and 17-2 are formed by cementing the lens holders 19-1 and 19-2 with cements 18-1 and 18-2. Physically mounted on 19-2. In this case, the dielectric lenses 17-1 and 17-2
Near the lens holders 19-1 and 19-2
Is thin, and its influence on the operating characteristics of the lens is suppressed. However, the shape and size of the lens holders 19-1 and 19-2 are not limited by the examples shown in FIGS. 9 and 10 (a) and (b). Obviously, other shapes or sizes may be considered without departing from the spirit of the invention. Therefore, the specification changes that can be made to the lens holders 19-1 and 19-2 are:
It is within the scope of the present invention.

Marks 19-1-1, 19-1-2, 19-1--are provided on the lens holders 19-1 and 19-2.
3, and 19-1-4, and 19-2-1, 19
-2-2, 19-2-3, and 19-2-4 are provided, which are used for fine alignment with the marks associated with the planar integrated antenna. However, these marks 19-1-1, 19-1-2, 19-1-3, and 19-1-4, and 19-2-1, 19-2-2,
The shapes, sizes, and positions of 19-2-3 and 19-2-4 are not limited to the example of FIG. 9. Obviously, other shapes, sizes or positions are conceivable without departing from the spirit of the invention. Therefore, marks 19-1-1, 19-1-2, 19-1-3, and 19-1-4, and 19-2-1, 19-2-
Modifications of specifications that can be made to 2, 19-2-3, and 19-2-4 are included within the scope of the present invention. Marks 19-1-1, 19-1-2, 19-1-
3, and 19-1-4, and 19-2-1, 19
-2-2, 19-2-3, and 19-2-4 and the fine alignment of the marks associated with the planar integrated antenna, followed by cementing the lens holder 19 with cement 20-1 and 20-2. -1 and 19-2 are fixed to the package lid 21.

As in the case of the packages shown in Examples 1 and 2, this lens holder 19-1 and 19-
It is included as part of this example that 2 is made from a non-metallic transparent material.

The vertical precision alignment system in this embodiment is exactly the same as the vertical precision alignment system in the second embodiment. This precise alignment is performed after fixing the lens holders 19-1 and 19-2 to the package lid 21. The fixation of the package lid 21 to the package core is provided by four small precision screws 14-1, 14-2, 14-3 and 14-4.

[0063]

As a result of implementing the present invention, the energy transfer efficiency between the antenna and the external environment is high, and the size is reduced,
A millimeter wave wireless communication system package suitable for mass production can be provided.

That is, by incorporating the dielectric lens into the package, the energy transfer efficiency between the antenna and the external environment is high, and a millimeter wave communication device suitable for mass production can be realized with a compact and simple structure. Becomes

[Brief description of drawings]

FIG. 1 is a diagram showing a package including a dielectric lens and specialized for a single antenna-based millimeter-wave wireless communication system according to the present invention;
Is a plan view and (b) is a cross-sectional view taken along a vertical plane AA ′ in (a).

FIG. 2 is a schematic diagram showing the model used to investigate the effect of a 1400 μm thick layer of fused silica placed above a ring slot antenna on the feed source. The ring slot antenna was pre-designed to have a minimum return loss at the center frequency Fc = 59.2 GHz in the absence of the fused silica layer.

FIG. 3 is a graph examining the effect of a 1400 μm thick fused silica layer placed above a ring slot antenna on the feed source according to the model shown in FIG. 2. This graph shows the variation of the center frequency Fc of the ring slot antenna with respect to the thickness t of the air layer separating the fused silica layer and the feed source.

FIG. 4 is a planar integrated ring designed to have a minimum return loss at a center frequency Fc = 59.2 GHz.
It is a schematic diagram showing a model of a slot antenna.

FIG. 5 is a chart showing a field emission pattern of the ring slot antenna whose model is shown in FIG.

6 is a chart showing a field emission pattern of the ring slot antenna of FIG. 5 in which a convex lens such as fused silica having a surface radius of 1500 μm, a thickness of 2600 μm and a focal length of 1367 μm is combined. The distance from the dielectric lens to the plane of the planar integrated antenna is 213 μm.

FIG. 7 is a top view of a package for a single antenna based millimeter wave wireless communication system having a dielectric lens and a precision alignment system according to the present invention.

8 is a diagram showing a cross section of a package for the millimeter wave wireless communication system shown in FIG.
(A), (b), and (c) are sectional views in vertical planes AA ', BB', and CC 'of FIG. 7, respectively.

FIG. 9 is a top view of a package specialized for a multi-antenna based millimeter wave wireless communication system with a precision alignment system according to the present invention. This package has as many precision aligned dielectric lenses as planar integrated antennas.

10 is a diagram showing a cross section of a package for the millimeter wave wireless communication system shown in FIG. 9,
9A and 9B are vertical planes D- of FIG.
It is sectional drawing in D'and EE '. This package has as many precision aligned dielectric lenses as planar integrated antennas.

[Explanation of symbols]

1 ... Dielectric lens, 2 ... Cement, 3 ... Lens holder, 3-1 to 3-4 ... Mark, 4 ... Cement, 5 ... Package lid, 6 ... Cement, 7 ... Package side wall,
8 ... Millimeter wave wireless communication system, 9 ... Package bottom plate, 10 ... Hole, 10-1 ... Cement, 11 ... Substrate, 11-1 ... Conductor wire, 12 ... Package lid, 13-1 to 13-4 ... Precision Screws, 14-1 to 14-
4 ... Precision screw, 15-1 to 15-4 ... Spiral spring, 16 ...
Package side walls, 17-1, 17-2 ... Dielectric lens,
18-1, 18-2 ... Cement, 19-1, 19-2 ...
Lens holder, 19-1-1 to 19-1-4, 19-
2-1 to 19-2-4 ... Mark, 20-1, 20-2 ...
Cement, 21 ... Package lid, 22 ... Millimeter wave wireless communication system, 23 ... Package bottom plate, 24 ... Hole, 24-1 ... Cement.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masao Nakagawa             2-3-1, Otemachi, Chiyoda-ku, Tokyo             Inside Telegraph and Telephone Corporation F-term (reference) 5J020 AA02 BB01 BC02 BC12                 5J070 AB24 BC00

Claims (2)

[Claims] 1. A millimeter wave wireless communication system package including a package core and a package lid, wherein the package core mounts a millimeter wave wireless communication system having one planar integrated antenna. A lens holder is fixed to the package lid, a dielectric lens is attached to the lens holder, and the dielectric lens is positioned so as to face the planar integrated antenna. Millimeter-wave wireless communication system package with aligned lenses. 2. A millimeter wave wireless communication system package comprising a package core and a package lid, wherein the package core mounts a millimeter wave wireless communication system having a plurality of planar integrated antennas. , A number of lens holders equal to the number of the planar integrated antennas are fixed to the package lid, and one dielectric lens is attached to each of the lens holders. A millimeter wave wireless communication system package with aligned lenses, each of which is aligned to face the separate planar integrated antenna.