JP2003151763A - Method of manufacturing organic LED element and organic LED element - Google Patents
Method of manufacturing organic LED element and organic LED elementInfo
- Publication number
- JP2003151763A JP2003151763A JP2001351063A JP2001351063A JP2003151763A JP 2003151763 A JP2003151763 A JP 2003151763A JP 2001351063 A JP2001351063 A JP 2001351063A JP 2001351063 A JP2001351063 A JP 2001351063A JP 2003151763 A JP2003151763 A JP 2003151763A
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- lid
- desiccant
- led element
- organic led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
(57)【要約】
【課題】有機LED素子内部に乾燥剤を配置する技術に
関する。
【解決手段】本発明によれば、凹部が設けられた蓋体の
内部底面に、乾燥剤成分を含んだ硬化樹脂成分を含む第
1の吐出物を吐出し、その後第2の吐出物を第1の吐出
物上に落下させて、粘度の低い乾燥剤原料8を形成し、
その後乾燥剤原料8を硬化させることで、蓋体の内部底
面に、硬化した樹脂と、その樹脂内部に分散された乾燥
剤成分からなる乾燥剤を配置している。このため、従来
必要であったシート状又は粉体状の乾燥剤を、粘着テー
プで蓋体の内部底面に貼り付けて固定する作業が不要に
なる。この作業は手作業に頼らざるを得ないため、自動
化の大きな妨げになっていたが、本発明によればこの作
業が不要なので、全ての工程を自動化することができ
る。
The present invention relates to a technique for disposing a desiccant inside an organic LED element. According to the present invention, a first discharged material containing a cured resin component containing a desiccant component is discharged to an inner bottom surface of a lid provided with a concave portion, and then a second discharged material is discharged to the second discharged material. 1 to form a desiccant raw material 8 having a low viscosity,
After that, the desiccant raw material 8 is cured, so that a desiccant composed of a cured resin and a desiccant component dispersed inside the resin is disposed on the inner bottom surface of the lid. For this reason, the work of pasting and fixing the sheet-like or powder-like desiccant, which has been conventionally required, to the inner bottom surface of the lid with an adhesive tape becomes unnecessary. This work has had to rely on manual work, which greatly hindered automation. However, according to the present invention, since this work is unnecessary, all steps can be automated.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、有機LED素子の
製造方法及び有機LED素子に関し、特に、有機LED
素子内部に乾燥剤を配置する技術の改善に関するもので
ある。TECHNICAL FIELD The present invention relates to a method for manufacturing an organic LED element and an organic LED element, and more particularly to an organic LED.
The present invention relates to improvement of a technique for disposing a desiccant inside an element.
【0002】[0002]
【従来の技術】近年、フラットパネルディスプレイ用の
素子として、有機LED素子が注目されている。図16
の符号101に、従来の有機LED素子を示す。この有
機LED素子101は、有機LED素子の本体160を
有している。2. Description of the Related Art In recent years, organic LED elements have been attracting attention as elements for flat panel displays. FIG.
Reference numeral 101 indicates a conventional organic LED element. The organic LED element 101 has a main body 160 of the organic LED element.
【0003】本体160は、基板102と、第1、第2
の電極127、128と有機薄膜103とを有してい
る。有機薄膜103は基板102の一表面上に配置さ
れ、第1、第2の電極127、128は、ともにストラ
イプ状に配置され、互いに直交した状態で有機薄膜10
3を上下から挟むように配置されており、第1、第2の
電極127、128間に電圧を印加すると、第1、第2
の電極127、128間に挟まれた有機薄膜103に電
流が流れ、有機薄膜103が発光するように構成されて
いる。基板102と、第1、第2の電極127、128
はともに光を透過できるように構成され、有機薄膜10
3が発光すると、その光は基板102を透過して外部に
放出される。The main body 160 includes a substrate 102 and first and second substrates.
Electrodes 127 and 128 and an organic thin film 103. The organic thin film 103 is disposed on one surface of the substrate 102, the first and second electrodes 127 and 128 are both arranged in a stripe shape, and the organic thin film 10 is orthogonal to each other.
3 are arranged so as to sandwich them from above and below, and when a voltage is applied between the first and second electrodes 127 and 128, the first and second electrodes are formed.
A current flows through the organic thin film 103 sandwiched between the electrodes 127 and 128 of the above, and the organic thin film 103 emits light. The substrate 102 and the first and second electrodes 127 and 128
Both are configured to transmit light, and the organic thin film 10
When 3 emits light, the light passes through the substrate 102 and is emitted to the outside.
【0004】この有機薄膜103は、水分と接触すると
反応して劣化してしまうので、基板102上には、容器
状の蓋体104が、有機薄膜103を上から覆うように
配置されている。蓋体104と基板102との間には封
止剤105が配置されており、封止剤105で蓋体10
4と基板102とが気密に封止されるので、蓋体104
と基板102とで囲まれた空間170が外部雰囲気と遮
断され、その空間170内に配置された有機薄膜103
が外部雰囲気中の水分に曝されないようになっている。Since the organic thin film 103 reacts and deteriorates when it comes into contact with moisture, a container-shaped lid 104 is arranged on the substrate 102 so as to cover the organic thin film 103 from above. A sealant 105 is arranged between the lid 104 and the substrate 102, and the lid 10 is covered by the sealant 105.
4 and the substrate 102 are hermetically sealed, the lid 104
The space 170 surrounded by the substrate 102 and the substrate 102 is shielded from the external atmosphere, and the organic thin film 103 disposed in the space 170 is closed.
Are not exposed to moisture in the external atmosphere.
【0005】蓋体104の内部底面には、乾燥剤108
が粘着テープ109で貼り付けられて固定されており、
蓋体104と基板102とで囲まれる空間170に微量
な水分が混入した場合でも、その水分は乾燥剤108で
吸収され、有機薄膜103が水分と接しないようになっ
ている。A desiccant 108 is formed on the inner bottom surface of the lid 104.
Is attached and fixed with adhesive tape 109,
Even if a small amount of water is mixed in the space 170 surrounded by the lid 104 and the substrate 102, the water is absorbed by the desiccant 108 so that the organic thin film 103 does not come into contact with the water.
【0006】かかる乾燥剤108を蓋体104の内部底
面に固定するには、蓋体104の内部底面に置かれた乾
燥剤108を、粘着テープ109で蓋体104の内部底
面に貼り付ける工程が必要になる。この工程は機械によ
る自動化が極めて困難であって手作業に頼らざるを得な
かったため、製造工程の自動化を進める上で大きな障害
となっていた。In order to fix the desiccant 108 to the inner bottom surface of the lid 104, a step of attaching the desiccant 108 placed on the inner bottom surface of the lid 104 to the inner bottom surface of the lid 104 with an adhesive tape 109 is performed. You will need it. This process was extremely difficult to automate with a machine and had to rely on manual work, which was a major obstacle in promoting automation of the manufacturing process.
【0007】[0007]
【発明が解決しようとする課題】本発明は上記従来技術
の不都合を解決するために創作されたものであり、有機
LED素子内部に乾燥剤を配置する際に、手作業に頼る
ことなく簡単に配置する技術を提供することを目的とす
る。The present invention was created in order to solve the above-mentioned disadvantages of the prior art. When disposing a desiccant inside an organic LED element, the present invention can be easily performed without resorting to manual work. The purpose is to provide placement technology.
【0008】[0008]
【課題を解決するための手段】上記課題を解決するため
に、請求項1記載の発明は、容器状に形成された蓋体の
内部底面に乾燥剤を配置する乾燥剤配置工程と、電圧印
加によって発光する有機薄膜が一表面に配置された本体
と、前記蓋体とを有し、前記蓋体の容器開口の縁部分を
前記本体の一表面に貼付し、前記有機薄膜を外気と遮断
して有機LED素子を形成する貼り合わせ工程とを有す
る有機LED素子の製造方法であって、前記乾燥剤配置
工程は、第1、第2の貯留容器を有し、前記第1、第2
の貯留容器内の第1、第2の貯留室をそれぞれ外部に接
続する第1、第2の吐出管が前記第1、第2の貯留容器
にそれぞれ設けられた第1、第2の吐出装置を用い、前
記第1の貯留室に、乾燥剤成分と硬化樹脂成分とを有す
る第1の吐出物を入れ、前記第2の貯留室に、前記硬化
樹脂成分の溶剤となる溶剤成分を有する第2の吐出物を
入れ、前記第1の吐出装置が、前記第1の貯留室内の第
1の吐出物を、前記第1の吐出管から前記蓋体の内部底
面に向けて吐出し、前記第2の吐出装置が、前記第2の
貯留室内の第2の吐出物を前記第2の吐出管から吐出し
て、前記第1の吐出物上に落下させている。請求項2記
載の発明は、請求項1記載の有機LED素子の製造方法
であって、前記第2の吐出装置が吐出した前記第2の吐
出物は、前記第1の吐出管を伝って前記第1の吐出物上
に落下する。請求項3記載の発明は、請求項1又は請求
項2のいずれか1項記載の有機LED素子の製造方法で
あって、前記硬化樹脂成分は、紫外線硬化性樹脂又は熱
硬化性樹脂のいずれか一方で構成されている。請求項4
記載の発明は、請求項1乃至請求項3のいずれか1項記
載の有機LED素子の製造方法であって、前記第1、第
2の吐出装置は、前記第1、第2の貯留室に第1、第2
の吐出物がそれぞれ入れられた状態で、前記第1、第2
の貯留室にそれぞれ所定量のガスを導入すると、前記ガ
スにより前記第1、第2の吐出物が圧力を受け、前記所
定量に対応した量の第1、第2の吐出物が、前記第1、
第2の吐出管から吐出されるように構成されている。請
求項5記載の発明は、電圧印加によって発光する有機薄
膜が一表面に配置された本体と、容器状の蓋体とを有
し、前記蓋体の容器開口の縁部分が前記本体の前記一表
面に貼付され、前記有機薄膜が外気と遮断されることで
構成された有機LED素子であって、前記蓋体は、該蓋
体の内部底面に配置された容器部分を有し、前記容器部
分内に、乾燥剤成分を含有する樹脂が配置されている。
請求項6記載の発明は、請求項5記載の有機LED素子
であって、前記容器部分は、前記蓋体の内部底面に形成
された凹部で構成されている。請求項7記載の発明は、
請求項5記載の有機LED素子であって、前記容器部分
は、前記蓋体の内部底面に配置されたリング状の突条で
形成されている。In order to solve the above-mentioned problems, the invention according to claim 1 comprises a desiccant arranging step of arranging a desiccant on the inner bottom surface of a container-shaped lid, and a voltage application. Has a main body on which an organic thin film that emits light is arranged on one surface, and the lid body, and the edge portion of the container opening of the lid body is attached to the one surface of the main body to block the organic thin film from the outside air. A method of manufacturing an organic LED element, comprising: a bonding step of forming an organic LED element by means of the above; wherein the desiccant arranging step includes first and second storage containers, and the first and second
First and second discharge devices in which first and second discharge pipes respectively connecting the first and second storage chambers inside the storage container to the outside are provided in the first and second storage containers, respectively. A first discharge containing a desiccant component and a curable resin component is placed in the first storage chamber, and a solvent component serving as a solvent for the curable resin component is placed in the second storage chamber. The second discharge device is put in, and the first discharge device discharges the first discharge substance in the first storage chamber from the first discharge pipe toward the inner bottom surface of the lid, The second discharge device discharges the second discharge substance in the second storage chamber from the second discharge pipe and drops it onto the first discharge substance. A second aspect of the present invention is the method for manufacturing an organic LED element according to the first aspect, wherein the second ejected substance ejected by the second ejecting device passes through the first ejecting pipe and is It falls on the first discharge. The invention according to claim 3 is the method for producing an organic LED element according to claim 1 or 2, wherein the curable resin component is either an ultraviolet curable resin or a thermosetting resin. On the other hand, it is composed. Claim 4
The described invention is the method of manufacturing an organic LED element according to any one of claims 1 to 3, wherein the first and second ejection devices are provided in the first and second storage chambers. First, second
In the state that the discharged substances of
When a predetermined amount of gas is introduced into each of the storage chambers, the gas exerts a pressure on the first and second ejected substances, and the first and second ejected substances in amounts corresponding to the prescribed amount become the first and second ejected substances. 1,
It is configured to be discharged from the second discharge pipe. According to a fifth aspect of the present invention, there is provided a main body in which an organic thin film that emits light upon application of a voltage is disposed on one surface, and a container-shaped lid, and an edge portion of a container opening of the lid is the one of the main body An organic LED element that is attached to a surface and is configured by blocking the organic thin film from the outside air, wherein the lid has a container portion disposed on an inner bottom surface of the lid, and the container portion Inside, a resin containing a desiccant component is arranged.
According to a sixth aspect of the invention, there is provided the organic LED element according to the fifth aspect, wherein the container portion is composed of a recess formed on the inner bottom surface of the lid body. The invention according to claim 7 is
It is an organic LED element of Claim 5, Comprising: The said container part is formed by the ring-shaped protrusion strip arrange | positioned at the inner bottom face of the said lid.
【0009】本発明の有機LED素子の製造方法では、
蓋体の内部底面に、乾燥剤成分と、硬化樹脂成分とを有
する第1の吐出物を第1の吐出管から吐出し、その後第
2の吐出管から第2の吐出物を吐出し、第1の吐出物上
に落下させている。In the method of manufacturing an organic LED element of the present invention,
On the inner bottom surface of the lid body, a first discharge product having a desiccant component and a cured resin component is discharged from a first discharge pipe, and then a second discharge product is discharged from a second discharge pipe. 1 is dropped on the discharged material.
【0010】第1の吐出物は、硬化樹脂成分の溶剤とな
る成分がほとんど含まれておらず、粘度が高くなってい
るが、第2の吐出物中には、第1の吐出物の硬化樹脂成
分の溶剤である溶剤成分が含まれており、第2の吐出物
が第1の吐出物上に落下すると、第1の吐出物の硬化樹
脂成分の粘度が低くなり、その結果粘度が低い硬化樹脂
成分と乾燥剤成分とで構成される液状の乾燥剤原料が得
られ、その乾燥剤原料が蓋体の内部底面に配置される。The first discharged product contains almost no component serving as a solvent for the cured resin component and has a high viscosity. However, the second discharged product is cured in the first discharged product. When the second discharged substance falls on the first discharged substance because the solvent component which is the solvent of the resin component is contained, the viscosity of the cured resin component of the first discharged substance becomes low, and as a result, the viscosity is low. A liquid desiccant raw material composed of a cured resin component and a desiccant component is obtained, and the desiccant raw material is placed on the inner bottom surface of the lid.
【0011】その後乾燥剤原料の硬化樹脂成分を硬化さ
せると、硬化した硬化樹脂成分に乾燥剤成分が分散され
た乾燥剤が形成され、蓋体の内部底面に固定される。こ
のように、第1、第2の吐出物を蓋体の内部底面に吐出
して配置することで、乾燥剤を蓋体の内部底面に配置す
ることができるので、従来必要であった、乾燥剤を粘着
テープで蓋体の内部底面に貼り付けて固定する工程が不
要になる。この工程は手作業に頼らざるを得なかったた
め、自動化の大きな妨げになっていたが、本発明によれ
ば貼り付けて固定する手作業が不要なので、全ての工程
を自動化することができる。After that, when the cured resin component of the desiccant raw material is cured, a desiccant in which the desiccant component is dispersed in the cured cured resin component is formed and fixed to the inner bottom surface of the lid. In this way, the desiccant can be disposed on the inner bottom surface of the lid body by ejecting and arranging the first and second ejected substances on the inner bottom surface of the lid body. The step of attaching the agent to the inner bottom surface of the lid with an adhesive tape and fixing the agent is unnecessary. Since this process had to rely on manual work, it was a great obstacle to automation. However, according to the present invention, all the processes can be automated because the manual work of attaching and fixing is unnecessary.
【0012】また、本発明では、第2の吐出物を第1の
吐出物上に落下させて、粘度の低い乾燥剤原料を得てい
る。粘度が低いので乾燥剤原料は高く盛り上がることが
できず、周囲に流れ出して高さが低くなる。Further, in the present invention, the second ejected substance is dropped onto the first ejected substance to obtain a desiccant raw material having a low viscosity. Since the viscosity is low, the desiccant raw material cannot rise to a high level, and flows out to the surroundings, resulting in a low height.
【0013】蓋体と本体とを封止剤で気密に封止すると
きに、乾燥剤原料の高さが高いと、第1の吐出物の上端
部が本体側の有機薄膜等と接触して不具合が生じること
があるが、本発明では、乾燥剤原料の高さが低くなるの
で、かかる不具合が生じることはない。When the lid and the main body are hermetically sealed with the sealant, if the height of the desiccant raw material is high, the upper end of the first discharge material comes into contact with the organic thin film or the like on the main body side. Although a problem may occur, in the present invention, since the height of the desiccant raw material becomes low, such a problem does not occur.
【0014】なお、本発明において、第2の吐出管か
ら、第1の吐出管に向けて第2の吐出物を吐出し、第2
の吐出物が第1の吐出管を伝って第1の吐出物上に滴下
するように構成してもよい。In the present invention, the second discharge product is discharged from the second discharge pipe toward the first discharge pipe, and the second discharge product is discharged.
The discharge product may be configured to drop along the first discharge pipe onto the first discharge product.
【0015】第1の吐出管の吐出口等に粘度の高い第1
の吐出物が付着すると、第1の吐出管の吐出口が詰まる
ことがありうるが、仮に第1の吐出管に第1の吐出物が
付着しても、第2の吐出物がかけられると付着した第1
の吐出物は粘度が低下して第1の吐出管から落ちるの
で、第1の吐出管の吐出口が詰まることはなくなる。The discharge port of the first discharge pipe has a high viscosity
Of the first discharge pipe may be clogged with the second discharge product, the second discharge product may be applied even if the first discharge product is attached to the first discharge pipe. First attached
Since the viscosity of the discharged product drops and drops from the first discharge pipe, the discharge port of the first discharge pipe is not clogged.
【0016】また、本発明において、硬化樹脂成分を、
紫外線硬化性樹脂又は熱硬化性樹脂のいずれか一方で構
成してもよい。この場合、封止剤と同じ硬化性樹脂にし
ておくと、封止剤を硬化させるとともに硬化樹脂成分を
硬化させることができる。一例として封止剤と硬化樹脂
成分をともに紫外線硬化樹脂で構成した場合には、封止
剤と硬化樹脂成分の両方に紫外線を照射すると、その両
方を硬化させることができる。In the present invention, the cured resin component is
It may be composed of either an ultraviolet curable resin or a thermosetting resin. In this case, if the same curable resin as the encapsulant is used, the encapsulant can be cured and the cured resin component can be cured. As an example, when both the encapsulant and the curable resin component are composed of an ultraviolet curable resin, both the encapsulant and the curable resin component can be cured by irradiating them with ultraviolet light.
【0017】また、本発明において、第1、第2の吐出
装置は、第1、第2の貯留室内部の中空部分に、所定量
のガスを導入できるように構成され、第1、第2の貯留
室内部の中空部分に第1、第2の吐出物が入れられた状
態で、第1、第2の貯留室内部の中空部分にそれぞれ所
定量のガスを導入すると、導入されたガスの量に比例し
た量の第1、第2の吐出物が、第1、第2の吐出管から
吐出されるように構成してもよい。In the present invention, the first and second discharge devices are constructed so that a predetermined amount of gas can be introduced into the hollow portions of the first and second storage chambers. When a predetermined amount of gas is introduced into each of the hollow portions of the first and second storage chambers while the first and second discharged substances are contained in the hollow portion of the storage chamber of The first and second ejected substances in an amount proportional to the amount may be ejected from the first and second ejection pipes.
【0018】かかる構成の第1、第2の吐出装置を用い
る場合には、粘度が低い液体を貯留室内に入れた場合に
は、所定量のガスを導入しても導入されたガスの量に比
例した量の液体が吐出されず、吐出量の制御が困難にな
る。特に、粘度の低い液体を硬化樹脂成分としてその内
部に乾燥剤成分を含有させると、乾燥剤成分の量を精度
良く制御できなくなってしまうため、有機LED素子ご
とに、配置された乾燥剤成分の量がばらついてしまうこ
とがある。In the case of using the first and second discharge devices having such a structure, when a liquid having a low viscosity is put in the storage chamber, even if a predetermined amount of gas is introduced, the amount of the introduced gas is reduced. Since a proportional amount of liquid is not ejected, it becomes difficult to control the ejection amount. In particular, when a liquid having a low viscosity is used as a cured resin component and a desiccant component is contained therein, the amount of the desiccant component cannot be accurately controlled. The amount may vary.
【0019】本発明では、粘度が高い第1の吐出物中に
乾燥剤成分を含有させ、その第1の吐出物を第1の吐出
管から吐出しているので、第1の吐出管から吐出される
第1の吐出物の吐出量はほぼ一定になり、各有機LED
素子において乾燥剤の量が一定になる。In the present invention, since the desiccant component is contained in the first discharge product having a high viscosity and the first discharge product is discharged from the first discharge pipe, the discharge product is discharged from the first discharge pipe. The discharge amount of the discharged first discharge becomes substantially constant, and each organic LED
The amount of desiccant becomes constant in the device.
【0020】なお、本発明の有機LED素子によれば、
蓋体が容器部分を有している。この容器部分は、蓋体の
内部底面に配置されており、その内部に乾燥剤成分を含
む樹脂が配置されている。According to the organic LED element of the present invention,
The lid has a container portion. This container portion is arranged on the inner bottom surface of the lid body, and the resin containing the desiccant component is arranged therein.
【0021】このように構成することにより、樹脂を配
置する工程において、容器部分の内部に樹脂を入れれ
ば、容器部分の内部壁面で樹脂の流出が止められ、容器
部分の外側まで樹脂が流出することはない。このため、
樹脂が蓋体の内部底面に広く流れ出してしまうことを防
止できる。According to this structure, when the resin is put inside the container portion in the step of arranging the resin, the resin is prevented from flowing out at the inner wall surface of the container portion, and the resin flows out to the outside of the container portion. There is no such thing. For this reason,
It is possible to prevent the resin from widely flowing to the inner bottom surface of the lid body.
【0022】また、本発明の有機LED素子において、
容器部分を、蓋体の内部底面に形成された凹部や、又は
蓋体の内部底面に配置されたリング状の突条で構成して
もよい。In the organic LED element of the present invention,
The container portion may be formed by a recess formed on the inner bottom surface of the lid body or a ring-shaped ridge arranged on the inner bottom surface of the lid body.
【0023】凹部で容器部分を構成する場合には、凹部
内部に樹脂を滴下すれば、凹部の内部側面で樹脂の流出
が止められ、凹部の外側まで樹脂が流出することはな
い。When the container portion is formed by the concave portion, if the resin is dropped inside the concave portion, the resin is prevented from flowing out on the inner side surface of the concave portion, and the resin does not flow to the outside of the concave portion.
【0024】また、突条で容器部分を構成する場合に
は、リング状の突条の内側の部分に樹脂を滴下すれば、
突条の内部側面で樹脂の流出が止められるので、突条の
外側まで樹脂が流出することはない。Further, in the case of forming the container portion by the protrusion, if the resin is dropped on the inner portion of the ring-shaped protrusion,
Since the outflow of the resin is stopped at the inner side surface of the ridge, the resin does not flow out to the outside of the ridge.
【0025】[0025]
【発明の実施の形態】以下で図面を参照し、本発明の実
施形態について説明する。図1の符号10に、本発明の
有機LED素子の製造方法に用いられる滴下装置を示
す。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. Reference numeral 10 in FIG. 1 shows a dropping device used in the method for producing an organic LED element of the present invention.
【0026】この滴下装置10は、基板ステージ32を
有している。この基板ステージ32はその表面が平坦に
されており、後に詳述する蓋体板を水平に支持できるよ
うになっている。この基板ステージ32は図示しない移
動機構に取り付けられ、移動機構を動作させると、蓋体
板20を支持した状態で基板ステージ32自体が移動で
きるように構成されている。The dropping device 10 has a substrate stage 32. The surface of the substrate stage 32 is flat so that a lid plate, which will be described in detail later, can be supported horizontally. The substrate stage 32 is attached to a moving mechanism (not shown), and when the moving mechanism is operated, the substrate stage 32 itself can be moved while supporting the lid plate 20.
【0027】基板ステージ32の上方には、第1、第2
の吐出装置211、212が配置されている。第1、第2
の吐出装置211、212は、第1、第2の貯留容器24
1、242と、第1、第2の吐出管251、252とをそれ
ぞれ有している。Above the substrate stage 32, the first and second
Discharge devices 21 1 and 21 2 are arranged. First, second
The discharge devices 21 1 and 21 2 of the first and second storage containers 24 are
1 , 24 2 and first and second discharge pipes 25 1 , 25 2 , respectively.
【0028】第1、第2の貯留容器241、242は内部
にそれぞれ図示しない第1、第2の貯留室を有し、第
1、第2の吐出管251、252は、第1、第2の貯留室
にそれぞれ接続されており、第1、第2の貯留室は、第
1、第2の吐出管251、252を介して外部に通じるよ
うに構成されている。The first and second storage containers 24 1 and 24 2 respectively have first and second storage chambers (not shown) therein, and the first and second discharge pipes 25 1 and 25 2 are The first and second storage chambers are respectively connected to the first and second storage chambers, and are configured to communicate with the outside via the first and second discharge pipes 25 1 and 25 2 .
【0029】第1、第2の貯留室には第1、第2のガス
導入管231、232の一端が接続され、第1、第2のガ
ス導入管231、232の他端には、所定圧力のガスが入
れられたガスボンベ55が接続されている。第1、第2
のガス導入管231、232の途中には、それぞれ第1、
第2の制御バルブ221、222が設けられており、第
1、第2の制御バルブ221、222をそれぞれ開くと、
各制御バルブ221、222にそれぞれ接続された第1、
第2の貯留室にガスを導入することができるように構成
されている。The first, the second storage chamber first, second gas introduction pipe 23 1, 23 2 of the one end is connected, first, second gas introduction pipe 23 1, 23 2 at the other end A gas cylinder 55 containing a gas of a predetermined pressure is connected to the. First, second
In the middle of the gas introduction pipes 23 1 and 23 2 of the
Second control valves 22 1 and 22 2 are provided, and when the first and second control valves 22 1 and 22 2 are opened,
The first and second control valves 22 1 and 22 2 respectively connected to
It is configured so that gas can be introduced into the second storage chamber.
【0030】そして、液体が入れられた第1、第2の貯
留室にガスが導入されると、導入されたガスにより液体
の液面が圧迫され、導入されたガスの量に比例した量の
液体が第1、第2の吐出管251、252の各吐出口から
吐出されるようになっている。When the gas is introduced into the first and second storage chambers containing the liquid, the liquid level of the liquid is compressed by the introduced gas, and the amount of the gas proportional to the amount of the introduced gas is increased. The liquid is discharged from the discharge ports of the first and second discharge pipes 25 1 and 25 2 .
【0031】図2、図3の符号20に、本発明の有機L
ED装置の製造に用いられる蓋体板を示す。図2は蓋体
板20の平面図であり、図3は図2のA−A線断面図で
ある。Reference numeral 20 in FIGS. 2 and 3 indicates the organic L of the present invention.
2 shows a lid plate used for manufacturing an ED device. 2 is a plan view of the lid plate 20, and FIG. 3 is a sectional view taken along the line AA of FIG.
【0032】蓋体板20は平板なガラス板からなる。蓋
体板20は、その平坦な表面が複数箇所矩形に掘削され
ており、その結果、掘削された部分である内部空間14
1〜1416と、各内部空間141〜1416の表面から突出
した開口縁部分55とが設けられており、各内部空間1
41〜1416は開口縁部分55で互いに分離されてい
る。開口縁部分55の平面形状は格子状であり、各内部
空間は141〜1416は行列状に配置されている。各内
部空間111〜1116の底面中央部には凹部121〜12
16が設けられており、後述する乾燥剤がその内部に配置
されるようになっている。The lid plate 20 is made of a flat glass plate. The lid plate 20 has a flat surface excavated in a rectangular shape at a plurality of locations, and as a result, the internal space 14 that is the excavated portion.
1 to 14 16 and an opening edge portion 55 projecting from the surface of each of the internal spaces 14 1 to 14 16 are provided.
4 1 to 14 16 are separated from each other at the opening edge portion 55. The planar shape of the opening edge portion 55 is a lattice, and the inner spaces 14 1 to 14 16 are arranged in a matrix. Recesses 12 1 to 12 are formed in the central portions of the bottom surfaces of the internal spaces 11 1 to 11 16.
16 is provided, and a desiccant described later is arranged inside thereof.
【0033】かかる蓋体板20は、開口縁部分の中心線
である切り出し線50で区切られた複数の蓋体部を有し
ている。ここでは図2、図3に示すように一枚の蓋体板
20が16枚の蓋体部141〜1416を有している。こ
れらの蓋体部141〜1416は、開口縁部分55の中心
線である切り出し線50に沿って蓋体板20を切断する
と、それぞれが後に詳述する容器状の蓋体となるもので
ある。The lid plate 20 has a plurality of lid portions separated by a cutting line 50 which is the center line of the opening edge portion. Here, as shown in FIGS. 2 and 3, one lid plate 20 has 16 lid portions 14 1 to 14 16 . Each of these lid portions 14 1 to 14 16 becomes a container-shaped lid body which will be described later in detail when the lid body plate 20 is cut along the cutout line 50 which is the center line of the opening edge portion 55. is there.
【0034】以下で、上述した構成の滴下装置10を用
いて、本発明の有機LED装置の製造方法の一部であ
り、蓋体板20に乾燥剤を配置する乾燥剤配置工程につ
いて説明する。The desiccant arranging step of disposing the desiccant on the cover plate 20 which is a part of the method for manufacturing an organic LED device of the present invention using the dropping device 10 having the above-described structure will be described below.
【0035】予め、第1、第2の貯留容器241、242
中に、第1、第2の吐出物をそれぞれ入れておく。ここ
で第1の吐出物は、粉体状の乾燥剤粉末が、紫外線硬化
性の液状の樹脂中に分散されることで構成されている。
なお、乾燥剤粉末と樹脂とは、それぞれが本発明の乾燥
剤成分と硬化樹脂成分の一例である。他方、第2の吐出
物は、第1の吐出物の樹脂の溶剤となる有機溶剤を有し
ている。次いで、各凹部121〜1216を鉛直上方に向
けた状態で蓋体板20を基板ステージ32上に支持させ
る。In advance, the first and second storage containers 24 1 and 24 2
The first and second discharged substances are respectively put therein. Here, the first discharge product is formed by dispersing a powdery desiccant powder in an ultraviolet curable liquid resin.
The desiccant powder and the resin are examples of the desiccant component and the cured resin component of the present invention, respectively. On the other hand, the second ejected substance has an organic solvent that serves as a solvent for the resin of the first ejected substance. Next, the lid plate 20 is supported on the substrate stage 32 with the recesses 12 1 to 12 16 facing vertically upward.
【0036】次に、蓋体板20を移動させ、図4に示す
ように複数の蓋体部141〜1416のうち最初に乾燥剤
を配置する蓋体部141の凹部121が、第1の吐出管2
51の鉛直下方に位置するように位置合わせする。Next, the lid plate 20 is moved, and as shown in FIG. 4, the concave portion 12 1 of the lid portion 14 1 in which the desiccant is placed first among the plurality of lid portions 14 1 to 14 16 is First discharge pipe 2
Align so that it is located vertically below 5 1 .
【0037】図5に示すように第1の吐出管251は鉛
直に配置され、第1の吐出管251の吐出口291は鉛直
下方に向けられており、第1の吐出管251から第1の
吐出物を吐出すると、吐出された第1の吐出物は、第1
の吐出管251の鉛直下方に位置する凹部121の底部に
滴下される。滴下された第1の吐出物を符号6に示す。
この第1の吐出物6は粘度が高く、滴下された位置から
その周囲へと流れ出さず、第2の凹部121の底部に高
く盛り上がって配置される。[0037] Figure 5 to the first discharge pipe 25 1 as shown is positioned vertically, the first discharge pipe 25 1 of the discharge port 29 1 is directed vertically downward, the first discharge pipe 25 1 When the first ejected substance is ejected from the first ejected substance, the ejected first ejected substance is
Is dripped on the bottom of the recess 12 1 positioned vertically below the discharge pipe 25 1 . Reference numeral 6 indicates the dropped first discharge product.
The first discharge product 6 has a high viscosity, does not flow out from the dropped position to the periphery thereof, and is arranged in a highly raised state at the bottom of the second recess 12 1 .
【0038】図6に示すように、第2の吐出管25
2は、第1の吐出管251の斜め上方に斜めに配置され、
第2の吐出管252の吐出口292は第1の吐出管251
に向けられている。第2の吐出管252の吐出口292か
ら、第2の吐出物7を吐出すると、吐出された第2の吐
出物は、第1の吐出管251にかけられた後、鉛直に配
置された第1の吐出管251を伝って鉛直下方の第1の
吐出物6上に滴下される。吐出された第2の吐出物を符
号7に示す。As shown in FIG. 6, the second discharge pipe 25
2 is disposed obliquely above the first discharge pipe 25 1 ,
Discharge port 29 2 of the second discharge pipe 25 2 first discharge pipe 25 1
Is directed to. When the second discharge product 7 is discharged from the discharge port 29 2 of the second discharge pipe 25 2, the discharged second discharge product is hung on the first discharge pipe 25 1 and then arranged vertically. Further, it is dropped on the first discharge product 6 vertically downward through the first discharge pipe 25 1 . Reference numeral 7 indicates the second discharged product.
【0039】第2の吐出物7が第1の吐出物6に滴下さ
れると、第1の吐出物6は粘度が低くなり、図7の符号
8に示すように、乾燥剤原料8が得られる。この乾燥剤
原料8は粘度が低く、周辺へと流出しようとするが、凹
部121の内部側面によって流出が止められており、凹
部121の外側には流れ出さずに凹部121の内部に配置
されている。この状態で乾燥剤原料8の表面は平坦にな
り、高さが低くなっている。When the second discharge product 7 is dropped on the first discharge product 6, the viscosity of the first discharge product 6 becomes low, and the desiccant raw material 8 is obtained as indicated by reference numeral 8 in FIG. To be The desiccant raw material 8 has a low viscosity and tries to flow out to the surroundings, but the outflow is stopped by the inner side surface of the concave portion 12 1 , and the desiccant raw material 8 does not flow outside the concave portion 12 1 and enters the concave portion 12 1 . It is arranged. In this state, the surface of the desiccant raw material 8 is flat and the height is low.
【0040】こうして、一個の蓋体部141の凹部121
の底部に、乾燥剤原料8が配置されたら、図8に示すよ
うに蓋体板20を移動させ、図9に示すように、次に第
1の吐出物6を配置する蓋体部142の凹部122が、第
1の吐出管251の鉛直上方に位置するように位置合わ
せする。In this way, the recess 12 1 of one lid 14 1
The bottom, when the desiccant material 8 is arranged to move the lid plate 20 as shown in FIG. 8, the lid portion 14 2 which arranged as shown in FIG. 9, then the first discharge product 6 The concave portion 12 2 is aligned so as to be positioned vertically above the first discharge pipe 25 1 .
【0041】次いで、最初の蓋体部141と同様に、次
の蓋体部142の凹部122内に、乾燥剤原料8を配置す
る。その後も同様にして各凹部121〜1216に順次乾
燥剤原料8を配置して、全部の蓋体部141〜1416の
凹部121〜1216に、乾燥剤原料8を配置する。以上
の工程を経て、乾燥剤配置工程は終了する。Then, the desiccant raw material 8 is placed in the recess 12 2 of the next lid portion 14 2 as in the case of the first lid portion 14 1 . After that, similarly, the desiccant raw material 8 is sequentially arranged in each of the concave portions 12 1 to 12 16, and the desiccant raw material 8 is arranged in the concave portions 12 1 to 12 16 of all the lid portions 14 1 to 14 16 . The desiccant arranging step is completed through the above steps.
【0042】その後、蓋体板20を基板ステージ32か
ら取り外し、図示しない封止装置に搬入し、蓋体板20
を移動させながら、全部の蓋体部141〜1416の開口
縁部分55にリング状の封止剤を配置し、その封止剤の
内側に、各内部空間111〜1116の開口を位置させる
ようにする。全ての蓋体部141〜1416に乾燥剤原料
8と封止剤が配置されたら、蓋体板20を切り出し線5
0から切断して蓋体を切り出す。切り出された一個の蓋
体を図10の符号4に示し、封止剤を符号5に示す。こ
の状態で、蓋体4は、内部空間11が開口縁部分55よ
り凹んで容器状に形成され、内部空間11の底部が容器
の内部底面となっている。After that, the lid plate 20 is removed from the substrate stage 32 and carried into a sealing device (not shown) to remove the lid plate 20.
While moving, the ring-shaped sealant is arranged on the opening edge portions 55 of all the lid portions 14 1 to 14 16 , and the openings of the internal spaces 11 1 to 11 16 are formed inside the sealant. Try to position it. When the desiccant raw material 8 and the sealant are placed on all the lid portions 14 1 to 14 16 , the lid plate 20 is cut out to form the line 5.
Cut from 0 and cut the lid. One cut-out lid body is shown by reference numeral 4 in FIG. 10, and the sealant is shown by reference numeral 5. In this state, the lid body 4 is formed in a container shape in which the internal space 11 is recessed from the opening edge portion 55, and the bottom of the internal space 11 is the internal bottom surface of the container.
【0043】次いで、図11に示すように、かかる蓋体
4と、有機LED素子の本体60とを対向させて位置合
わせする。有機LED素子の本体60は、基板2と、有
機薄膜3及び第1、第2の電極27、28を有してい
る。このうち有機薄膜3及び第1、第2の電極27、2
8は、基板2の一表面側に配置されている。Then, as shown in FIG. 11, the lid 4 and the body 60 of the organic LED element are opposed to each other and aligned with each other. The main body 60 of the organic LED element has the substrate 2, the organic thin film 3, and the first and second electrodes 27 and 28. Of these, the organic thin film 3 and the first and second electrodes 27, 2
8 is arranged on one surface side of the substrate 2.
【0044】かかる本体60と蓋体4とを窒素雰囲気中
に入れ、基板2の、有機薄膜3等が配置された側の一表
面を下方に向け、蓋体4の内部空間11を対向させた
後、有機薄膜3の全部が、内部空間11の上方に位置す
るように本体60と蓋体4とを位置合わせする。次に、
図12に示すように、蓋体4上の封止剤5を本体60の
基板2の表面に圧着させる。The main body 60 and the lid 4 were placed in a nitrogen atmosphere, and one surface of the substrate 2 on the side where the organic thin film 3 and the like were arranged faced downward so that the internal space 11 of the lid 4 was opposed. Then, the main body 60 and the lid 4 are aligned so that the entire organic thin film 3 is located above the internal space 11. next,
As shown in FIG. 12, the sealant 5 on the lid 4 is pressure-bonded to the surface of the substrate 2 of the main body 60.
【0045】次いで、図13に示すように、蓋体4の外
部から紫外線80を照射する。蓋体4はガラスからな
り、紫外線を透過するので、紫外線は封止剤5と、乾燥
剤原料8との両方に照射される。紫外線が照射される
と、封止剤5と、乾燥剤原料8内の樹脂とはともに硬化
する。Next, as shown in FIG. 13, ultraviolet rays 80 are irradiated from the outside of the lid body 4. Since the lid 4 is made of glass and transmits ultraviolet rays, the ultraviolet rays irradiate both the sealant 5 and the desiccant raw material 8. When irradiated with ultraviolet rays, the sealant 5 and the resin in the desiccant raw material 8 are both cured.
【0046】封止剤5が硬化すると基板2と蓋体4とは
封止剤5により気密に封止され、基板2と蓋体4とで囲
まれた空間70は、外部雰囲気とは遮断される。他方、
乾燥剤原料8の樹脂は硬化すると、蓋体4の凹部12内
に固定される。硬化した樹脂内には乾燥剤粉末が分散さ
れており、この乾燥剤粉末と硬化した樹脂とで構成され
る乾燥剤が得られ、蓋体4の凹部12内に配置される。
その乾燥剤を図14の符号88に示す。When the sealant 5 hardens, the substrate 2 and the lid 4 are hermetically sealed by the sealant 5, and the space 70 surrounded by the substrate 2 and the lid 4 is shielded from the external atmosphere. It On the other hand,
When the resin of the desiccant raw material 8 is cured, it is fixed in the recess 12 of the lid 4. A desiccant powder is dispersed in the hardened resin, and a desiccant composed of the desiccant powder and the hardened resin is obtained and placed in the recess 12 of the lid 4.
The desiccant is indicated by reference numeral 88 in FIG.
【0047】以上の工程を経て、図14に示すような有
機LED素子1が完成する。この有機LED素子1で
は、有機薄膜3は第1、第2の電極27、28により上
下から挟まれており、第1、第2の電極27、28間に
電圧を印加すると、その間に挟まれた有機薄膜3に電流
が流れ、有機薄膜3が発光する。本体60の基板2はガ
ラスで構成されており光を透過するので、発光した光は
基板2を透過して照射される。Through the above steps, the organic LED element 1 as shown in FIG. 14 is completed. In this organic LED element 1, the organic thin film 3 is sandwiched between the first and second electrodes 27 and 28 from above and below, and when a voltage is applied between the first and second electrodes 27 and 28, it is sandwiched between them. A current flows through the organic thin film 3 and the organic thin film 3 emits light. Since the substrate 2 of the main body 60 is made of glass and transmits light, the emitted light passes through the substrate 2 and is irradiated.
【0048】以上説明したように、本発明の有機LED
素子の製造方法によれば、乾燥剤粉末を含んだ第1の吐
出物6を蓋体4に滴下した後、第2の吐出物7を滴下し
て粘度が低い乾燥剤原料8を形成し、その後紫外線照射
で乾燥剤原料8を硬化させて乾燥剤88を形成し、蓋体
4の凹部12内部に固着している。As described above, the organic LED of the present invention
According to the manufacturing method of the element, after the first discharge 6 containing the desiccant powder is dropped on the lid 4, the second discharge 7 is dropped to form the desiccant raw material 8 having low viscosity, After that, the desiccant raw material 8 is cured by ultraviolet irradiation to form a desiccant 88, which is fixed inside the recess 12 of the lid 4.
【0049】このため、従来必要であったシート状又は
粉体状の乾燥剤を、粘着テープで蓋体の内部底面に貼り
付けて固定する作業が不要になる。この作業は手作業に
頼らざるを得ないため、自動化の大きな妨げになってい
たが、本発明によればこの作業が不要なので、全ての工
程を自動化することができる。For this reason, it becomes unnecessary to attach a sheet-like or powder-like desiccant to the inner bottom surface of the lid with an adhesive tape to fix the desiccant, which is conventionally required. Since this work has to rely on manual work, it has been a great hindrance to automation. However, according to the present invention, this work is unnecessary, so that all steps can be automated.
【0050】また、乾燥剤原料8の高さが高いと、蓋体
4と基板2とを封止剤5で気密に封止したときに、乾燥
剤88の上端部が本体60側の有機薄膜3等と接触して
不具合が生じることがあるが、本発明では、第1の吐出
物6を吐出した後に第2の吐出物7を第1の吐出物6上
に吐出し、乾燥剤原料8の粘度を低くして高さを低くし
ているので、かかる不具合が生じることはない。Further, when the height of the desiccant raw material 8 is high, when the lid 4 and the substrate 2 are hermetically sealed with the sealant 5, the upper end of the desiccant 88 is an organic thin film on the main body 60 side. However, in the present invention, the second discharge product 7 is discharged onto the first discharge product 6 and the desiccant raw material 8 is discharged after the first discharge product 6 is discharged. Since the viscosity is low and the height is low, such a problem does not occur.
【0051】ところで、本実施形態では、上述したよう
に粘度の高い樹脂中に乾燥剤粉末を分散させた第1の吐
出物を蓋体4に滴下し、その後第2の吐出物7で第1の
吐出物の粘度を低くして乾燥剤原料8を得ているが、予
め、粘度の低い液状の樹脂中に乾燥剤粉末を分散させて
おき、その樹脂を蓋体4に滴下すれば、滴下が一回で済
むため、上述した実施形態より好都合のようにも思われ
る。By the way, in the present embodiment, as described above, the first discharge product in which the desiccant powder is dispersed in the high-viscosity resin is dropped on the lid body 4, and then the second discharge product 7 is used as the first discharge product. Although the desiccant raw material 8 is obtained by lowering the viscosity of the discharged product, the desiccant powder is dispersed in a liquid resin having a low viscosity in advance, and the resin is dripped onto the lid body 4. Since it only has to be done once, it seems to be more convenient than the above-described embodiment.
【0052】しかしながら、上述したように第1、第2
の吐出装置211、212を用いた場合には、粘度が低い
液体が第1、第2の貯留容器241、242内に入れられ
ると、その吐出量の制御が困難になる。However, as described above, the first and second
When the discharge devices 21 1 and 21 2 are used, if the liquid having a low viscosity is put into the first and second storage containers 24 1 and 24 2 , it becomes difficult to control the discharge amount thereof.
【0053】このため、吐出量の制御が困難な粘度の低
い樹脂中に乾燥剤粉末を分散させ、その樹脂を吐出させ
ると吐出量がばらつき、各有機LED素子ごとに、乾燥
剤の量が異なってしまうという不都合が生じてしまう。Therefore, when the desiccant powder is dispersed in a resin having a low viscosity where it is difficult to control the discharge amount, and the resin is discharged, the discharge amount varies, and the amount of the desiccant is different for each organic LED element. There is an inconvenience of being lost.
【0054】そこで本発明では、粘度が高い第1の吐出
物6中に乾燥剤粉末を含有させ、その第1の吐出物6を
第1の吐出管251から吐出している。第1の吐出物6
は粘度が高いため、第1の吐出装置211から吐出され
る量は一定であり、複数の有機LED素子1内部に配置
される乾燥剤粉末の量を一定にすることができる。な
お、本発明では第1の吐出物6の粘度を、2Ns/m2以上
6Ns/m2以下の範囲とし、第2の吐出物7の粘度を、
0.001Ns/m2以上0.05Ns/m2以下の範囲としてい
る。Therefore, in the present invention, the desiccant powder is contained in the first discharge product 6 having a high viscosity, and the first discharge product 6 is discharged from the first discharge pipe 25 1 . First discharge 6
Has a high viscosity, the amount discharged from the first discharge device 21 1 is constant, and the amount of desiccant powder disposed inside the plurality of organic LED elements 1 can be constant. In the present invention the viscosity of the first discharge was 6, and 2Ns / m 2 or more 6 ns / m 2 or less of the range, the viscosity of the second discharged product 7,
The range is 0.001 Ns / m 2 or more and 0.05 Ns / m 2 or less.
【0055】また、第1の吐出管251の吐出口291等
に粘度の高い第1の吐出物6が付着すると、第1の吐出
管の吐出口291が詰まることがあるが、本発明では、
第1の吐出物6の粘度を低下させる第2の吐出物7が第
1の吐出管251にかけられているので、第1の吐出管
251に第1の吐出物6が付着しても、第2の吐出物7
がかけられると、付着した第1の吐出物6は粘度が低下
して第1の吐出管25 1から落ちるので、第1の吐出管
251の吐出口291が詰まることはなくなる。Also, the first discharge pipe 251Discharge port 291etc
If the first ejected substance 6 having a high viscosity adheres to the
Pipe outlet 291May clog, but in the present invention,
The second discharge product 7 that reduces the viscosity of the first discharge product 6 is
1 discharge pipe 251The first discharge pipe
251Even if the first ejected substance 6 adheres to the second ejected substance 7,
When applied, the viscosity of the adhered first discharge product 6 decreases.
Then the first discharge pipe 25 1Falls from the first discharge pipe
251Discharge port 291No longer gets clogged.
【0056】また、上述した実施形態では、第1の吐出
管251が鉛直に配置され、第2の吐出管252が斜めに
配置されているが、本発明の第1、第2の吐出管2
51、252の配置はこれに限られるものではなく、第2
の吐出管252の吐出口292から第2の吐出物7を吐出
すると、吐出された第2の吐出物7が第1の吐出管25
1にかけられた後に第1の吐出物6上に滴下されるよう
に構成されていればよい。例えば第1の吐出管251を
斜めに配置し、第2の吐出管252を鉛直に配置し、第
1の吐出管251の先端の鉛直上方に第2の吐出管252
の吐出口292が位置するように配置してもよい。Further, in the above-described embodiment, the first discharge
Tube 251Is arranged vertically, and the second discharge pipe 252Diagonally
Although arranged, the first and second discharge pipes 2 of the present invention
51, 252The arrangement of is not limited to this, but the second
Discharge pipe 252Discharge port 292From the second ejected substance 7
Then, the discharged second discharged material 7 is discharged to the first discharge pipe 25.
1So that it is dripped onto the first discharge product 6
It should be configured in. For example, the first discharge pipe 251To
The second discharge pipe 25 is arranged diagonally.2Vertically, and
1 discharge pipe 251The second discharge pipe 25 vertically above the tip of the2
Discharge port 292You may arrange so that may be located.
【0057】また、第1の吐出物6を構成する溶剤成分
として、紫外線硬化性の樹脂を用いたが、本発明の溶剤
成分はこれに限られるものではなく、例えば熱硬化性の
樹脂を用いてもよい。Although an ultraviolet curable resin was used as the solvent component constituting the first discharge 6, the solvent component of the present invention is not limited to this, and for example, a thermosetting resin is used. May be.
【0058】また、上述した実施形態では、本発明の容
器部分として蓋体4の内部底面に凹部12を設け、その
内部に乾燥剤を配置したが、本発明の容器部分はこれに
限られるものではなく、例えば図15の符号31に示す
有機LED素子のように、蓋体4の内部底面上に、リン
グ状の突条38を配置し、その突条38を容器部分とし
てもよい。図15には、乾燥剤88がリング状部材38
内部に配置された状態を示している。Further, in the above-mentioned embodiment, the concave portion 12 is provided on the inner bottom surface of the lid 4 as the container portion of the present invention, and the desiccant is placed inside the concave portion 12, but the container portion of the present invention is not limited to this. Instead, for example, like an organic LED element indicated by reference numeral 31 in FIG. 15, a ring-shaped protrusion 38 may be arranged on the inner bottom surface of the lid body 4 and the protrusion 38 may be used as a container portion. In FIG. 15, the desiccant 88 has a ring-shaped member 38.
It shows the state of being placed inside.
【0059】かかる構成の有機LED素子31におい
て、突条38の内部に乾燥剤88を配置するには、蓋体
4の内部底面に突条38を配置し、その突条38の内側
に上述した第1、第2の吐出物6、7を順次滴下して乾
燥剤原料8を得て、その乾燥剤原料8を硬化させてい
る。In the organic LED element 31 having such a structure, in order to arrange the desiccant 88 inside the ridge 38, the ridge 38 is arranged on the inner bottom surface of the lid 4, and the above-mentioned inside of the ridge 38 is described. The first and second discharge products 6 and 7 are sequentially dropped to obtain a desiccant raw material 8, and the desiccant raw material 8 is cured.
【0060】乾燥剤原料8は粘度が低く、周囲へと流れ
出そうとするが、突条38の内部側面により乾燥剤原料
8の流出が止められ、蓋体4の内部底面に凹部12を設
けた場合と同様に、突条38の外側に乾燥剤原料8が流
出しないようにすることができる。The desiccant raw material 8 has a low viscosity and tends to flow out to the surroundings, but the inner side surface of the protrusion 38 prevents the desiccant raw material 8 from flowing out, and the recess 12 is provided on the inner bottom surface of the lid 4. Similarly to the case, it is possible to prevent the desiccant raw material 8 from flowing out to the outside of the ridge 38.
【0061】この突条38の厚みは、内部空間11の深
さよりも浅いか又は等しい。このように構成すると突条
38の上端部は蓋体4の開口の縁部分より突出しないの
で、蓋体4と基板2とを封止したときに、突条38が有
機薄膜3と接触するという不具合が生じない。The thickness of the protrusion 38 is shallower than or equal to the depth of the internal space 11. With this structure, the upper end of the protrusion 38 does not protrude from the edge portion of the opening of the lid 4, so that the protrusion 38 contacts the organic thin film 3 when the lid 4 and the substrate 2 are sealed. No trouble occurs.
【0062】[0062]
【発明の効果】有機LED素子内に乾燥剤を配置する工
程を完全に自動化することができる。The process of disposing the desiccant in the organic LED element can be completely automated.
【図1】本発明の一実施形態に係る有機LED素子の製
造方法に用いられる滴下装置の構成を示す図FIG. 1 is a diagram showing a configuration of a dropping device used in a method for manufacturing an organic LED element according to an embodiment of the present invention.
【図2】本発明の一実施形態に係る有機LED素子の製
造方法に用いられる蓋体板を示す平面図FIG. 2 is a plan view showing a lid plate used in a method for manufacturing an organic LED element according to an embodiment of the present invention.
【図3】本発明の一実施形態に係る有機LED素子の製
造方法に用いられる蓋体板を示す断面図FIG. 3 is a cross-sectional view showing a lid plate used in a method for manufacturing an organic LED element according to an embodiment of the present invention.
【図4】本発明の一実施形態に係る乾燥剤配置工程を説
明する第1の図FIG. 4 is a first diagram illustrating a desiccant placement step according to an embodiment of the present invention.
【図5】本発明の一実施形態に係る乾燥剤配置工程を説
明する第2の図FIG. 5 is a second diagram illustrating a desiccant placement step according to an embodiment of the present invention.
【図6】本発明の一実施形態に係る乾燥剤配置工程を説
明する第3の図FIG. 6 is a third diagram illustrating a desiccant placement step according to an embodiment of the present invention.
【図7】本発明の一実施形態に係る乾燥剤配置工程を説
明する第4の図FIG. 7 is a fourth diagram illustrating a desiccant placement step according to an embodiment of the present invention.
【図8】本発明の一実施形態に係る乾燥剤配置工程を説
明する第5の図FIG. 8 is a fifth diagram illustrating a desiccant placement step according to an embodiment of the present invention.
【図9】本発明の一実施形態に係る乾燥剤配置工程を説
明する第6の図FIG. 9 is a sixth diagram illustrating a desiccant placement step according to an embodiment of the present invention.
【図10】本発明の一実施形態に係る蓋体の構造を説明
する断面図FIG. 10 is a sectional view illustrating a structure of a lid body according to an embodiment of the present invention.
【図11】本発明の一実施形態に係る封止工程を説明す
る第1の図FIG. 11 is a first diagram illustrating a sealing step according to an embodiment of the present invention.
【図12】本発明の一実施形態に係る封止工程を説明す
る第2の図FIG. 12 is a second diagram illustrating a sealing step according to the embodiment of the present invention.
【図13】本発明の一実施形態に係る封止工程を説明す
る第3の図FIG. 13 is a third diagram illustrating a sealing step according to the embodiment of the present invention.
【図14】本発明の一実施形態に係る有機LED素子を
説明する断面図FIG. 14 is a sectional view illustrating an organic LED element according to an embodiment of the present invention.
【図15】本発明の他の実施形態に係る有機LED素子
を説明する断面図FIG. 15 is a sectional view illustrating an organic LED element according to another embodiment of the present invention.
【図16】従来の有機LED素子を説明する断面図FIG. 16 is a sectional view illustrating a conventional organic LED element.
1…有機LED素子 2…基板 3…有機薄膜
4…蓋体 5…封止剤6…第1の吐出物 7…第2の吐
出物 211…第1の吐出装置 212…第2の吐出装置
241…第1の貯留容器 242…第2の貯留容器 2
51…第1の吐出管 252…第2の吐出管1 ... Organic LED element 2 ... Substrate 3 ... Organic thin film
4 ... Lid 5 ... Sealant 6 ... 1st discharge thing 7 ... 2nd discharge thing 21 1 ... 1st discharge device 21 2 ... 2nd discharge device 24 1 ... 1st storage container 24 2 ... Second storage container 2
5 1 ... 1st discharge pipe 25 2 ... 2nd discharge pipe
Claims (7)
剤を配置する乾燥剤配置工程と、 電圧印加によって発光する有機薄膜が一表面に配置され
た本体と、前記蓋体とを有し、前記蓋体の容器開口の縁
部分を前記本体の一表面に貼付し、前記有機薄膜を外気
と遮断して有機LED素子を形成する貼り合わせ工程と
を有する有機LED素子の製造方法であって、 前記乾燥剤配置工程は、 第1、第2の貯留容器を有し、前記第1、第2の貯留容
器内の第1、第2の貯留室をそれぞれ外部に接続する第
1、第2の吐出管が前記第1、第2の貯留容器にそれぞ
れ設けられた第1、第2の吐出装置を用い、 前記第1の貯留室に、乾燥剤成分と硬化樹脂成分とを有
する第1の吐出物を入れ、前記第2の貯留室に、前記硬
化樹脂成分の溶剤となる溶剤成分を有する第2の吐出物
を入れ、 前記第1の吐出装置が、前記第1の貯留室内の第1の吐
出物を、前記第1の吐出管から吐出して前記蓋体の内部
底面に落下させ、 前記第2の吐出装置が、前記第2の貯留室内の第2の吐
出物を前記第2の吐出管から吐出して、前記第1の吐出
物上に落下させる有機LED素子の製造方法。1. A desiccant disposing step of disposing a desiccant on an inner bottom surface of a lid formed in a container shape, a main body having an organic thin film that emits light when a voltage is applied on one surface, and the lid. A method of manufacturing an organic LED element, which comprises a step of attaching an edge portion of the container opening of the lid to one surface of the main body, and attaching the organic thin film to the outside air to form an organic LED element. Then, the desiccant arranging step has first and second storage containers, and first and second connecting the first and second storage chambers in the first and second storage containers to the outside, respectively. A second discharge pipe is provided with the first and second discharge devices respectively provided in the first and second storage containers, and the first storage chamber has a desiccant component and a cured resin component. The discharge component 1 is put into the second storage chamber, and the solvent component serving as the solvent for the cured resin component is placed in the second storage chamber. A second discharge product having a discharge gas is introduced, and the first discharge device discharges the first discharge product in the first storage chamber from the first discharge pipe and drops it onto the inner bottom surface of the lid body. Then, the second discharge device discharges the second discharge product in the second storage chamber from the second discharge pipe and drops it onto the first discharge product. .
内の第2の吐出物を前記第2の吐出管から吐出し、前記
第2の吐出物は、前記第1の吐出管を伝って前記第1の
吐出物上に落下する請求項1記載の有機LED素子の製
造方法。2. The second discharge device discharges a second discharge product in the second storage chamber from the second discharge pipe, and the second discharge product is the first discharge pipe. The method of manufacturing an organic LED element according to claim 1, wherein the organic LED element falls on the first ejected material along the flow path.
は熱硬化性樹脂のいずれか一方で構成された請求項1又
は請求項2のいずれか1項記載の有機LED素子の製造
方法。3. The method of manufacturing an organic LED element according to claim 1, wherein the curable resin component is composed of either an ultraviolet curable resin or a thermosetting resin.
第2の貯留室に第1、第2の吐出物がそれぞれ入れられ
た状態で、前記第1、第2の貯留室にそれぞれ所定量の
ガスを導入すると、前記ガスにより前記第1、第2の吐
出物が圧力を受け、前記所定量に対応した量の第1、第
2の吐出物が、前記第1、第2の吐出管から吐出される
ように構成された請求項1乃至請求項3のいずれか1項
記載の有機LED素子の製造方法。4. The first and second discharge devices are the first and second discharge devices.
When a predetermined amount of gas is introduced into each of the first and second storage chambers in a state where the first and second discharged substances are placed in the second storage chamber, the first and second gases are introduced by the gas. 5. The discharge product according to claim 1 receives pressure, and the first and second discharge products in an amount corresponding to the predetermined amount are discharged from the first and second discharge pipes. 4. The method for manufacturing an organic LED element according to any one of 3 above.
面に配置された本体と、 容器状の蓋体とを有し、 前記蓋体の容器開口の縁部分が前記本体の前記一表面に
貼付され、前記有機薄膜が外気と遮断されることで構成
された有機LED素子であって、 前記蓋体は、該蓋体の内部底面に配置された容器部分を
有し、 前記容器部分内に、乾燥剤成分を含有する樹脂が配置さ
れた有機LED素子。5. A main body having an organic thin film, which emits light upon application of a voltage, disposed on one surface thereof, and a container-shaped lid, wherein an edge portion of a container opening of the lid is attached to the one surface of the main body. And the organic thin film is an organic LED element configured by being shielded from the outside air, wherein the lid has a container portion arranged on an inner bottom surface of the lid, and in the container portion, An organic LED element in which a resin containing a desiccant component is arranged.
成された凹部で構成された請求項5記載の有機LED素
子。6. The organic LED element according to claim 5, wherein the container portion is formed of a recess formed on the inner bottom surface of the lid body.
置されたリング状の突条で形成された請求項5記載の有
機LED素子。7. The organic LED element according to claim 5, wherein the container portion is formed of a ring-shaped protrusion provided on the inner bottom surface of the lid body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001351063A JP3949434B2 (en) | 2001-11-16 | 2001-11-16 | Manufacturing method of organic LED element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001351063A JP3949434B2 (en) | 2001-11-16 | 2001-11-16 | Manufacturing method of organic LED element |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003151763A true JP2003151763A (en) | 2003-05-23 |
JP3949434B2 JP3949434B2 (en) | 2007-07-25 |
Family
ID=19163441
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006190583A (en) * | 2005-01-07 | 2006-07-20 | Futaba Corp | Organic electronic device and manufacturing method of the same |
CN109923940A (en) * | 2016-11-07 | 2019-06-21 | 富士胶片株式会社 | Functional film and organic EL element |
-
2001
- 2001-11-16 JP JP2001351063A patent/JP3949434B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006190583A (en) * | 2005-01-07 | 2006-07-20 | Futaba Corp | Organic electronic device and manufacturing method of the same |
CN109923940A (en) * | 2016-11-07 | 2019-06-21 | 富士胶片株式会社 | Functional film and organic EL element |
CN109923940B (en) * | 2016-11-07 | 2021-08-24 | 富士胶片株式会社 | Functional thin films and organic EL devices |
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