JP2003133819A - Dielectric resonator and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem of a conventional dielectric resonator such that the quantity of an adhesive adhering to a stage becomes little by the cavitation due to air bank, which incurs the drop of adhesive strength, though there is necessity to apply an adhesive thinly because of the dispersion of the resonance frequency if the quantity of the adhesive is increased. SOLUTION: In a dielectric resonator where a dielectric resonator element is bonded to a stage, the periphery of the bonding face of the above stage is chamfered, and also the thickness of the adhesive existing between the above stage and the dielectric resonator element is made 0.01-0.02 mm.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shape of a support base in a dielectric resonator and a method for adhering the dielectric resonator and the support base.

[0002]

2. Description of the Related Art In a dielectric resonator f, a support 1 and a dielectric resonator 2 are bonded with an adhesive 3 as shown in FIGS. When the support base 1 and the dielectric resonator 2 are bonded to each other, there is also a method of directly applying the adhesive 3 discharged from the nozzle to the support base 1 or the dielectric resonator 2 using a dispenser or the like. Therefore, there is a problem in that the application method is complicated because it is necessary to apply the adhesive 3 in accordance with this, and the amount of the adhesive 3 applied to the support base 1 is large and non-uniform.

When the support base 1 is placed on the dielectric resonator 2 because the amount of the adhesive 3 attached to the support base 1 is increased, the hardness of the adhesive 3 due to the heating state and the like. The degree to which the support base 1 sinks into the adhesive 3 varies depending on the pressing method of the. Since the support base 1 tilts with respect to the dielectric resonator 2, or the support base 1, the adhesive 3 and the dielectric resonator 2 are integrated into a dielectric. Since the overall height of the body resonator f fluctuates, the variation of the resonance frequency becomes large. Therefore, the adhesive 3 on the support base 1 needs to be thinly and uniformly attached.

Therefore, as a conventional method shown in FIGS. 9 (a) and 9 (b), as a method of thinly and uniformly adhering the adhesive 3, the adhesive 3 softened by heating from the tip of the dispenser nozzle 7 on the surface of the flat plate 14 is used. After applying with a dropper or the like, the support base 1 is grasped with tweezers or the like, pressed against the adhesive 3 applied on the surface of the flat plate 14 to adhere the adhesive 3 to the support base 1, and then the support base 1 is attached to the dielectric resonator. Place on top of 2. afterwards,
The dielectric resonator f was heated by the plate heater 10 to be thermoset and adhered.

[0005]

In order to suppress the decrease in adhesive strength, it is sufficient to increase the amount of the adhesive 3 attached to the support 1, but as described above, the overall height of the dielectric resonator f is increased. The variation in the resonance frequency increases because of the fluctuation. Therefore, as a method for applying the adhesive 3 thinly and uniformly, as shown in FIG.
The method of applying a thin coating on the flat plate 14 of FIG.
As shown in (a), (b), and (c), the adhesive 3 adheres to the support 1 by the cavity 3b or the like due to air pockets generated when the support 1 and the adhesive 3 come into contact with each other due to the unevenness of the surface of the adhesive 3.
Is small and non-uniform, and when the support base 1 is placed on the dielectric resonator 2, a gap 3c is generated, resulting in a decrease in adhesive strength.

[0006]

In view of the above, the present invention provides a dielectric resonator having a dielectric resonator adhered to a support, and a chamfered portion is provided around the bonding surface of the support and the support is provided. It is characterized in that the thickness of the adhesive existing between the base and the dielectric resonator is 0.01 to 0.02 mm.

Further, according to the present invention, the adhesive surface of the support is pressed against an adhesive thinly applied on a flat plate to move it in a circular shape or back and forth and left and right, and then the dielectric resonator is adhered to this adhesive surface. Characterize. That is, when the support base is pressed against the adhesive thinly applied to the flat plate, it can be moved circularly or forward / backward and left / right to eliminate air pockets on the adhesive surface and enable thin and uniform attachment to the support base. By providing an R shape or a C surface shape such as chamfering around the bonding surface of the base, the adhesive can be adhered to the support base without significantly increasing the amount of the adhesive adhered to the support base. By this,
It is not necessary to use a complicated device, and the adhesive can be uniformly attached, and the decrease in the adhesive strength can be suppressed without increasing the thickness of the adhesive.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

Dielectric resonator 2 shown in FIGS. 1 (a) and 1 (b).
The dielectric resonator g including the support 9 and the support 9 is made of a ceramic material, and the dielectric resonator 2 is made of Ba-Nd-Ti.
Based materials, Nd-Al-Ca-Ti based materials, La-Al-
Sr-Ti based materials, Ba-Ti based materials, Ba-Mg-W
A system material, a Mg-Ca-Ti system material, sapphire, or the like is used, and a material for the support base 9 is alumina ceramics, cordierite ceramics, forsterite ceramics, or the like. The adhesive 3 is made of epoxy resin or the like.

When the support base 9 is pressed against the adhesive 3 thinly applied to the flat plate 14 as shown in FIGS. 2 (a) and 2 (b), it is circular or as shown in FIGS. 3 (a), 3 (b) and 3 (c). In this way, by moving it forward, backward, leftward and rightward, the air pockets that are generated when they are in close contact move and are expelled, so that cavitation does not occur.

Further, as shown in FIGS. 4 (a) and 4 (b), the chamfered portion 9b on the outer periphery of the adhesive surface 9a is provided with an R shape or a C surface shape so that the support base 9 can be moved in a circular shape or in the left / right direction. At this time, since the liquid pool 3a is formed in the gap between the chamfered portion 9b and the flat plate 14, the liquid can be effectively attached to the entire adhesive surface 9a without increasing the amount. The liquid pool 3a that has entered the chamfered portion 9b of the support base 9 by this method is shown in FIGS.
When placed on the dielectric resonator 2 as shown in (c), a liquid pool 3
Therefore, the dielectric resonator 2 and the adhesive surface 9a of the support base 9 and the chamfered portion 9b can be brought into close contact with each other without a gap. This makes it possible to suppress a decrease in adhesive strength.

When the thickness 3d of the adhesive between the support 9 and the dielectric resonator 2 shown in FIG. 1 (b) varies by 0.01 mm, the entire height of the dielectric resonator g changes, so that the resonance frequency is about the same. It varies by 4 MHz. When the amount of the adhesive 3 attached to the support base 9 is large, when the support base 9 is placed on and adhered to the dielectric resonator 2, there is a large variation in the amount of the support base 9 sinking into the adhesive 3 and the dielectric resonator. Since the variation of the total thickness of g is large, the variation amount of the resonance frequency is large. As a result, the thickness 3d of the adhesive of the dielectric resonator g is preferably 0.01 mm or more and 0.02 mm or less so that the decrease in adhesive strength can be suppressed and the variation in resonance frequency can be minimized. it can.

When the chamfered portion 9b of the support base 9 is formed into an R shape, the chamfered portion 9b is formed by using a barrel machine by vibration or rotation in which water and an abrasive are added, and the size of the R shape is the strength of vibration or rotation and water, The control can be performed by changing the amounts of the polishing agent and the support 9 charged. When the chamfered portion 9b of the support base 9 has a C-plane shape, the mold has the same C-plane shape at the time of molding.
It may be formed integrally with the support base 9.

A chamfered portion 9b capable of suppressing a decrease in adhesive strength.
The size of R shape or C surface shape is 0.05 mm or more,
The thickness is preferably 0.10 mm or more, and this effect can be obtained with the dielectric resonator g in which the bonding area between the support 9 and the dielectric resonator 2 is 1.5 square centimeters or less. This is
This is because the amount of the adhesive 3 that accumulates in the liquid reservoir 3a increases as the size of the R shape or C surface shape of the chamfered portion 9b of the support base 9 increases as shown in FIG. If the area of the adhesive surface 9a with the resonator 2 is originally large, the ratio of the amount of the adhesive 3 in the liquid pool 3a is small, and a sufficient effect can be obtained without using the method of the present invention.

The dielectric resonator of the present invention is an antenna component for receiving satellite broadcasting (LNB: low noise block), an oscillating element such as a measuring instrument (VOC: voltage control oscillator), a sensor for collision prevention and radar detection of an automobile or the like. Used for etc.

[0016]

EXAMPLE As an example of the present invention, the support base 9 is attached to the adhesive 3
As for the method of pressing against, it was incorporated into the dielectric bonding apparatus shown in FIG.

The support base 9 and the dielectric resonator 2 are formed by spray-drying a raw material granulated by a powder press machine using a metal mold, and then in the atmosphere at about 1300 ° C. and 1600 ° C.
It was obtained by firing at ℃.

The support 9 has a thickness of 1.5 mm and an outer diameter of 4.3 m.
m, forsterite material, the dielectric resonator 2 has a thickness of 2.0 mm, an outer diameter of 5.6 mm, and a material of Nd-Al-Ca-.
A Ti-based material (relative dielectric constant of about 43) was used. As the adhesive 3, an epoxy resin adhesive was used.

The R shape of the chamfered portion 9b of the support base 9 was given by a centrifugal barrel polishing machine. To the barrel polishing machine, the support 9 and the polishing agent and water were put into the barrel container 10L, and the chamfered portion 9b was R = 0.1 by performing the treatment for 10 hours.
A size of 0 mm was obtained.

In the dielectric bonding apparatus, the adhesive 3 is dropped on the coating tape 5 (width 40 mm) moving in the direction h at a rate of 40 mm per minute from the dispenser nozzle 7 at a rate of about 1 drop every 3 minutes. The coating thickness 3e of the adhesive 3 is set in the gap between the squeegee 6 and the coating tape 5, and the coating thickness 3e is set to 0.13.
mm. The support base 9 is grasped by the robot hand 8 using a SCARA robot and pressed against the adhesive 3 on the adhesion table 4, and the support base 9 is rotated once so that the center of the support base 9 draws a circle having a diameter of 3 mm. Then, the support base 9 to which the adhesive 3 was attached was placed on the plate heater 10 on the center of the dielectric resonator 2 which was supplied by a biaxial robot and positioned, and was adhered by heat curing.

The adhesive strength is determined by placing the dielectric resonator g adhered as shown in FIG.
It is pinched with a strength measuring instrument tip 11 (made by Imada DPX-
50T) was slowly applied to the side surface of the support 9 to measure the strength when the adhesive portion was peeled off.

The adhesive strength according to the conventional method and the adhesive strength according to the present invention were changed by changing the R dimension of the chamfered portion 9b, and
Results of individual measurement are shown in FIGS. 11 (a), (b), (c), and (d). The R dimension of the chamfered portion 9b was created by changing the processing time using a barrel grinder. Further, the coating thickness 3e attached to the support base 9 was set to 0.13 mm. If the R dimension is 0.01 mm or less, which is the conventional method, the minimum adhesive strength is 8.5 k.
What was g was 1 when the R dimension of the present invention was 0.05 mm.
0.5 kg, 11.5 kg for R size 0.10 mm or more
Further, the variation was as small as 4.5 kg in the method according to the present invention as compared with 6 kg in the conventional method. Therefore, according to the present invention, it is understood that the decrease of the adhesive strength is suppressed and the stable strength is obtained.

Table 1 shows the variation of the resonance frequency and the adhesive thickness 3d of the dielectric resonator g in the coating thickness 3e of the adhesive 3.

Twenty samples were prepared by changing the coating thickness 3e of the adhesive 3 to be coated on the coating tape 5 and changing the thickness of the adhesive 3 on the support base 9. The thickness 3d and thickness variation of the adhesive of the dielectric resonator g are measured in advance by measuring the thickness of the dielectric resonator 2 and the thickness of the support base 9 with a micrometer before the bonding, and the dielectric resonator g after the bonding is measured. Was calculated by subtracting from the total thickness of. In addition, the chamfered portion 9 of the support base 9
The R dimension of b was 0.10 mm.

[0025]

[Table 1]

As shown in Table 1, when the coating thickness 3e of the adhesive 3 to be attached to the support base 9 is 0.13 mm, the support base 9 is placed on the dielectric resonator 2 and heat-cured to bond it. The thickness 3d of the agent was 0.010 mm or more and 0.017 mm or less, the thickness variation was 0.007 mm, and the resonance frequency variation was 3 MHz. Further, the coating thickness 3e is set to 0.
When the thickness is set to 21 mm, the thickness 3d of the adhesive after adhesion is 0.
027 mm or more and 0.098 mm or less, thickness variation is 0.071 mm, and resonance frequency variation is 28 M
Became Hz.

That is, when the thickness 3d of the adhesive in the dielectric resonator g is set to 0.010 mm or more and 0.020 mm or less, the variation of the support base 9 sinking into the adhesive 3 becomes small, and the variation of the adhesive thickness 3d. Can be suppressed.
As a result, it can be seen that the variation in resonance frequency can be reduced.

[0028]

As described above, according to the present invention, the adhesive is adhered to the thinned adhesive by moving the supporting base in contact with the adhesive to move it in a circular shape, front and rear, left and right to apply the adhesive. Insufficiency is eliminated, and further, by attaching an R shape or C surface shape to the outer periphery of the adhesive surface of the support base, the adhesiveness to the dielectric resonator is improved, so that a decrease in adhesive strength can be suppressed and stabilized. it can. Further, since the thickness of the adhesive can be reduced, it is possible to reduce variations in the resonance frequency of the dielectric resonator.

[Brief description of drawings]

1 shows a dielectric resonator shape of the present invention,
(A) is a perspective view and (b) is a side view.

2A and 2B show a bonding method in a method for manufacturing a dielectric resonator of the present invention, FIG. 2A is a top view and FIG. 2B is a perspective view.

3A to 3C are top views showing another example of the bonding method in the method for manufacturing a dielectric resonator of the present invention.

4A and 4B are side views showing a bonding method in the manufacturing method of the present invention.

5A to 5C are side views showing a bonding method in the manufacturing method of the present invention.

FIG. 6 is a perspective view showing an adhesive device used in the method for manufacturing a dielectric resonator of the present invention.

FIG. 7 is a perspective view showing an adhesive strength measuring device for a dielectric resonator.

FIG. 8 shows a conventional dielectric resonator shape, (a)
Is a perspective view and (b) is a side view.

9A and 9B are perspective views showing a conventional method of bonding a dielectric resonator.

10A to 10C are side views showing a conventional method of bonding a dielectric resonator.

FIG. 11 is a graph comparing the adhesive strengths of the example of the present invention and the conventional example.

[Explanation of symbols]

1: Support stand 2: Dielectric resonator 3: Adhesive 3a: Liquid pool 3b: Cavity due to air pool 3c: Gap 3d: Thickness of adhesive 3e: coating thickness 4: Adhesive table 5: Coating tape 6: Squeegee 7: Dispenser nozzle 8: Robot hand 9: Support stand 9a: Adhesive surface 9b: Chamfer 10: Plate heater 11: Tip of strength measuring instrument 12: Fixed jig 13: Measurement table 14: Flat plate 15: Tape f: Dielectric resonator g: Dielectric resonator h: direction

Claims (2)

[Claims] 1. A dielectric resonator in which a dielectric resonator is bonded to a support, a chamfer is provided around the bonding surface of the support, and the chamfer is present between the support and the dielectric resonator. A dielectric resonator, wherein the thickness of the adhesive used is 0.01 to 0.02 mm. 2. A dielectric resonator in which a dielectric resonator is adhered to a support base, a chamfered portion is formed around the bonding surface of the support base, and the support base is attached to an adhesive thinly applied on a flat plate. A method for manufacturing a dielectric resonator, which comprises the steps of pressing the adhesive surface of, moving it in a circular shape, and moving it back and forth, right and left, and then bonding a dielectric resonator to this adhesive surface.