JP2003132311A - Production method for ic card and ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve planarity, a surface strength, the strength of an IC chip peripheral part, and a printing performance. SOLUTION: In this production method for an IC card sealing an IC module in a hot melt adhesive layer, which is interposed between a first sheet material and a second sheet material, the first sheet material and the second sheet material are stuck with the hot melt adhesive, and then the surface temperature of the first sheet material and the second sheet material are rapidly cooled down not less than 10 deg.C and not more than 100 deg.C per second.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a license such as a driver's license, an identification card, a passport, an alien registration card, a library card, a cash card, which incorporates an IC module having an IC chip and an antenna body. , An IC card such as a credit card, an employee ID, an employee ID, a membership ID, a medical card and a student ID, and an IC card.

[0002]

2. Description of the Related Art Conventionally, ID cards such as ID cards, cash cards, and credit cards are
A magnetic card that records data by a magnetic recording method is often widely used. Since data can be rewritten relatively easily with a magnetic card, it is not possible to prevent tampering with the data, the medium is magnetic and is easily affected by external influences, and the data is not sufficiently protected. There are problems such as few.

Therefore, in recent years, ICs with built-in IC chips
Cards are becoming popular. The IC card is configured to read / write data from / to an external device via an electric contact provided on the surface or a loop antenna inside the card. The IC card has a larger storage capacity than the magnetic card, and the security is greatly improved.

Particularly, in a non-contact type IC card in which an antenna body for exchanging information between the IC chip and the outside is built in the card, and no electric contact is provided outside the card, the electric contact is provided on the card surface. Since it is superior in security to the contact type IC card that it has, it is being used for applications that require high confidentiality of data and prevention of forgery / alteration.

[0005]

As such an IC card, for example, an IC module in which a top sheet material and a back sheet material are bonded together with an adhesive and an IC chip and an antenna body are provided in the adhesive layer There is something to enclose. A reactive hot melt adhesive is used as this adhesive. The reactive hot melt adhesive is solid at room temperature. This adhesive has a property of being melted by heating and then being subjected to an adhesion process, and thereafter absorbing moisture to cure the adhesive itself. Its characteristics are that it has a longer bondable time than a normal hot melt adhesive and has a high softening temperature after the bonding process, so that it has excellent durability and is suitable for bonding at low temperatures.

That is, in a normal hot melt adhesive, the heat resistance does not exceed the adhesive processing temperature because the adhesive processing temperature is the same as the softening temperature of the adhesive. Therefore, when high heat resistance is required, a high bonding processing temperature is required. For example, when the bonding process is performed at a temperature of 100 ° C. or higher, there are problems that the card substrate is easily warped, and irregularities are easily generated on the surface of the card when being conveyed by a laminating roll.

Further, since the IC chip is laminated into a card to form a card, the periphery of the IC chip is liable to form a void, the strength in the vicinity thereof is remarkably lowered, and the printability on the card surface is remarkably lowered. There was a serious problem such as a problem, and there was a strong demand for a solution.

The present invention has been made in view of the above circumstances, and provides an IC card manufacturing method and an IC card capable of improving flatness, surface strength, strength around an IC chip, and printability. It is an object.

[0009]

In order to solve the above-mentioned problems and to achieve the object, the present invention has the following constitution.

According to a first aspect of the present invention, there is provided a method of manufacturing an IC card in which an IC module is enclosed in a hot melt adhesive layer interposed between a first sheet material and a second sheet material, After bonding the first sheet material and the second sheet material with a hot melt adhesive, the surface temperature of the first sheet material and the second sheet material is 10 ° C. per second.
A method of making an IC card, which comprises rapidly cooling at 100 ° C. or lower. ].

According to the first aspect of the invention, the surface strength is improved and the flatness is improved by cooling in the state of the best flatness.

The invention according to claim 2 is characterized in that "the hot melt adhesive having the elongation of 2% and the elastic modulus after the card is rapidly cooled to prepare a card is 20 kg / mm ² or more and 80 kg / mm ² or less. The method for producing an IC card according to claim 1. ].

According to the second aspect of the present invention, the surface strength is improved and the flatness is improved by the regulation of the elongation 2% elastic modulus of the hot melt adhesive after the card is made by quenching.

The invention according to claim 3 is that "the viscosity of the hot melt adhesive layer at 130 ° C. is 2000 mPs.
The method for producing an IC card according to claim 1 or 2, characterized in that it is not less than 40,000 mPs. ]
Is.

According to the third aspect of the present invention, the viscosity of the hot melt adhesive layer at 130 ° C. is defined, whereby the surface strength and the flatness are improved.

According to a fourth aspect of the invention, there is provided a method for producing an IC card according to any one of the first to third aspects, wherein the hot melt adhesive is a reactive type. ].

According to the fourth aspect of the invention, the hot melt adhesive is a reactive type, the surface strength is improved, and the flatness is improved.

According to a fifth aspect of the present invention, there is provided a method for producing an IC card in which a plurality of IC cards are produced from one or a long roll-shaped first sheet material and a second sheet material. A heating step of coating or pasting at a temperature of 150 ° C. or lower and a surface temperature of the first sheet material and the second sheet material after coating or pasting are 1 per second.
A method for producing an IC card, comprising: a cooling step of quenching at 0 ° C. or more and 100 ° C. or less; and a laminating step of laminating at a temperature of 0 ° C. or more and 30 ° C. or less after coating or laminating. ].

According to the invention described in claim 5, since it has a heating step, a cooling step, and a bonding step, the surface strength is improved by cooling in the state of the best flatness, And the flatness is improved.

The invention according to claim 6 provides the "claim 1
The IC card produced according to any one of claims 5 to 6, which has a scratch strength of 15 with a 0.8 mmφ sapphire needle.
An IC card having an image receiving layer of 0 g or more. ].

According to the invention of claim 6, the IC
The card has an image receiving layer having a scratch strength of not less than 150 g with a 0.8 mmφ sapphire needle, whereby the surface strength is improved.

According to a seventh aspect of the invention, "an IC in which an electronic component including an IC module having an IC chip and an antenna body is placed at a predetermined position between two opposing substrates and is filled with an adhesive agent An IC card, characterized in that a silane coupling agent is provided on the upper portion or the peripheral portion of the IC chip. ].

According to the invention of claim 7, the IC
The IC chip can be reinforced by providing a silane coupling agent on the upper part or the peripheral part of the chip.

The invention according to claim 8 is the IC card according to claim 7, wherein the silane coupling agent is a partially hydrolyzed polymer. ].

According to the eighth aspect of the invention, the IC chip can be reinforced by using the partially hydrolyzed polymer as the silane coupling agent.

According to a ninth aspect of the invention, the IC card according to the seventh aspect is characterized in that "a metal reinforcing plate is provided adjacent to the IC chip. ].

According to the invention of claim 9, the IC
The IC chip can be reinforced by having the metal reinforcing plate adjacent to the chip.

According to a tenth aspect of the present invention, the IC card according to the ninth aspect is characterized in that the metal reinforcing plate contains a material having a Young's modulus of 100 GPa or more. ].

According to the tenth aspect of the present invention, the IC chip can be reinforced by the metal reinforcing plate containing a material having a Young's modulus of 100 GPa or more.

An eleventh aspect of the present invention is that "the planar irregularity of the peripheral portion of the chip of the IC card is within ± 10 μm. IC card. ].

According to the invention of claim 11, I
The planar irregularity of the chip peripheral portion of the C card is within ± 10 μm, and the smoothness of the chip peripheral portion is improved.

The invention according to claim 12 is characterized in that "personal information such as face image, address, name, date of birth, etc. is described as personal information. The IC card according to item 1. ].

According to the invention of claim 12, personal information is described, and licenses such as automobile license, identification card, passport, alien registration card, library card,
Used for cash cards, credit cards, employee ID, employee ID, membership ID, medical card, student ID, etc.

According to a thirteenth aspect of the present invention, the IC card according to the twelfth aspect is characterized in that "the IC chip is not present at a position overlapping the face image portion. ].

According to the invention of claim 13, I
Since the C chip does not exist at the position overlapping the face image portion, the face image can be prevented from being damaged.

According to a fourteenth aspect of the present invention, "the IC card is of a non-contact type having no electrical contact outside the card, and any one of the sixth to thirteenth aspects is provided.
The IC card described in the item. ].

According to the invention of claim 14, I
The C card is a non-contact type that does not have an electrical contact outside the card, is excellent in security, and can be used in applications requiring high data confidentiality and anti-counterfeiting property.

[0038]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of an IC card producing method and an IC card of the present invention will be described with reference to the drawings, but the present invention is not limited to this embodiment.

FIG. 1 is a diagram showing an IC card producing apparatus, FIG.
Is a diagram showing a configuration of an IC card, and FIG. 3 is a plan view of the IC card.

The IC card creating apparatus of this embodiment is
First sheet material supply section A, second sheet material supply section B, adhesive application section C1, adhesive application section C2, inlet supply section D, heating section E, cooling section F, bonding section G and punching section A plurality of IC cards having H are prepared from the first sheet material 1 and the second sheet material 2.

A long roll-shaped first sheet material 1 is supplied from the first sheet material supply section A, and a long roll-shaped second sheet material 2 is supplied from the second sheet material supply section B. Although supplied, the first sheet material 1 and the second sheet material 2 are not limited to a long roll shape, and may be a single sheet. In the adhesive application section C1, an adhesive is applied to the first sheet material 1, and the hot melt adhesive 4 is used as this adhesive. In the adhesive application section C2, the second sheet material 2
An adhesive is applied to the hot melt adhesive 4, and the hot melt adhesive 4 is used as the adhesive.

In the inlet supply section D, the IC chip 3
a, the inlet of the electronic component 3 including the IC module having the antenna body 3b is placed on the second sheet material 2.

In the heating step E, the laminating roll 200,
The heater 201 is provided, and the first sheet material 1 and the second sheet material 2 are coated or bonded together at a temperature of 95 ° C. or higher and 150 ° C. or lower with the electronic component 3 interposed.

After the coating or bonding, the cooling unit F quenches the surface temperature of the first sheet material 1 and the second sheet material 2 at 10 ° C. or more and 100 ° C. or less per second.

In the bonding section G, after coating or bonding, bonding is performed at a temperature of 0 ° C. or higher and 30 ° C. or lower.

At the punching portion H, an IC card having a predetermined shape is punched with a cutter to produce an IC card having the structure shown in FIG.

As described above, the first sheet material 1 and the second sheet material 2 have the heating step and the cooling step, and after coating or bonding the first sheet material 1 and the second sheet material 2 at a temperature of 95 ° C. or higher and 150 ° C. or lower,
By rapidly cooling the surface temperature of the first sheet material 1 and the second sheet material 2 at 10 ° C. or more and 100 ° C. or less per second, and cooling in the state of the best flatness, the surface strength is improved and a flat surface is obtained. The property is improved. Further, by providing a silane coupling agent on the upper portion or the peripheral portion of the IC chip 3a, the IC
The tip 3a can be reinforced. Since the silane coupling agent is a partially hydrolyzed polymer, I
The C chip 3a can be reinforced.

Further, a metal reinforcing plate 5 is provided adjacent to the IC chip 3a, and the metal reinforcing plate 5 can reinforce the IC chip 3a. The metal reinforcing plate 5 has a Young's modulus of 100
The IC chip 3a can be reinforced by including a material of GPa or higher.

As shown in FIG. 2, the surface of the IC card is
The planar irregularity of the peripheral portion of the chip is within ± 10 μm, and the smoothness of the peripheral portion of the chip is improved.

As shown in FIG. 3, this IC card has personal information such as face image 7, address, name, date of birth 11, etc. as personal information, and licenses such as automobile licenses,
It is used for identification, passport, alien registration card, library card, cash card, credit card, employee card, employee card, membership card, medical card and student card. Since the IC chip 3a does not exist at the position overlapping the portion of the face image 8, the face image can be prevented from being damaged.

This IC card is a non-contact type that has no electrical contact outside the card, has excellent security, and can be used in applications requiring high data confidentiality and forgery / alteration protection.

[Adhesive] The adhesive of the present invention is based on "JIS
It is preferable that the tensile elastic modulus at an elongation of 2% after curing, measured according to the regulations of “K 7127” or “ASTM D638”, is 20 kg / mm ² or more and 80 kg / mm ² . Tensile modulus after curing is 80kg / mm
If ² smaller than large or when 20 kg / mm ² than the printing properties since the adhesion to the card elasticity of or to the print head too large or too small card is lowered to deteriorate. Preferably 20 kg / mm ² or more and 50 kg / mm ²
It is the following.

The viscosity at 130 ° C. is 2000 m
If it is smaller than Ps, many bubbles will be generated when the cards are stuck together, and the flatness of the flat surface will be deteriorated.
If it is larger than this, the coating property of the adhesive will deteriorate,
Planar unevenness deteriorates. Since problems such as deterioration of the card surface strength after curing and problems such as burrs and beards occur, it is preferably 5000 mPs or more and 30,000 mPs.
s or less, more preferably 10,000 mPs or more and 2
It is 2000 mPs or less.

[Quenching Press] After the sheet materials are pasted with a hot melt adhesive, it is preferable to rapidly cool the surface temperature of the sheet materials at 10 ° C. or more and 100 ° C. or less per second. After laminating with a hot-melt adhesive, the sheet will not be cured by residual heat unless it is rapidly cooled at 10 ° C or more per second, so it is smooth immediately after laminating, but it is smooth in the pressing section and conveying section after that. It is conveyed while being distorted, and the unevenness is significantly deteriorated. Also, 1
If the material is rapidly cooled at a rate higher than 100 ° C. per second, temperature unevenness occurs, internal strain occurs, and bendability deteriorates.

[Silane Coupling Agent] The metal alkoxide having no active energy ray-reactive group used in the high refractive index layer of the present invention has preferably 1 to 10 carbon atoms, but preferably carbon atoms. The numbers are 1 to 4. The hydrolyzate of the metal alkoxide undergoes hydrolysis of the alkoxide group and reacts like -metal atom-oxygen atom-metal atom- to form a crosslinked structure and form a cured layer.

Examples of the metal alkoxide used in the present invention include Si (OCH3) 4 and Si (OC2H5).
4, Si (Oi-C3H7) 4, Si (Ot-C4)
H9).

These may be used alone or in combination of two or more. Among them, Si (OCH3) 4,
It is particularly preferable to use those obtained by synthesizing Si (OC2H5) 4 and Si (O-i-C3H7) 4 as a polymer in advance, since the degree of shrinkage becomes small when dried after hydrolysis and the occurrence of cracks is prevented.

In the high refractive index layer of the present invention,
A hydrolyzed (partially or completely hydrolyzed) form of the above metal alkoxide may be used, and is obtained, for example, by hydrolyzing the above metal alkoxide in an organic solvent in the presence of an acidic catalyst or a basic catalyst. . As the acidic catalyst, for example, mineral acids such as nitric acid and hydrochloric acid, and organic acids such as oxalic acid and acetic acid are preferable, and as the basic catalyst,
For example, ammonia and the like can be mentioned.

The layer containing the metal alkoxide compound used in the present invention is a layer in which the metal alkoxide itself self-condenses and crosslinks to form a network bond. A catalyst or a curing agent can be used to accelerate the reaction, and these include a metal chelate compound, an organometallic compound such as an organic carboxylate, an organosilicon compound having an amino group, a photoacid generator, and the like. There is.

[Metal Reinforcement Plate] The metal reinforcement plate used in the present invention is not particularly limited as long as it has strength, but it is preferable to use a metal reinforcement plate such as stainless steel which has strength and is relatively weighed. This metal reinforcing plate has a Young's modulus of 100 GP
From the viewpoint of durability, it is preferable to include at least one or more materials a or more. The thickness of the metal reinforcing plate may be sufficient to protect the IC chip, but it is preferably thin in order to improve the printability by eliminating the planar unevenness of the card when it is installed on the upper part of the chip.

The position of the metal reinforcing plate is not limited to the position above the IC chip, and may be a shape covering the IC chip or a structure in which the periphery is swirled.

[Type of Adhesive] The type of these adhesives is not particularly limited, but it is preferable to use a hot melt adhesive, a thermoplastic resin or the like. For example, as the hot melt adhesive, a commonly used adhesive can be used. Examples of the main component of the hot melt adhesive include ethylene / vinyl acetate copolymer (EVA) type, polyester type, polyamide type, thermoplastic elastomer type, polyolefin type and the like. A moisture curable material as a reactive hot melt adhesive is disclosed in JP-A-2000-036.
026, JP 2000-219855, JP 2000
-212118, and Japanese Patent Laid-Open No. 2000-219855. JP-A-10-316 as a photocurable adhesive
No. 959 and JP-A No. 11-5964 are disclosed.

Any of these adhesives may be used as long as they have the characteristics of the present invention, and it is preferable to use a material for which the present invention is not limited.

Further, an adhesive having the characteristics of the present invention may be prepared by mixing an additive with these adhesives. The additive is not particularly limited, and examples thereof include organic and inorganic pigments and resin materials. As phenol resin, xylene resin,
Examples thereof include epoxy resin, melamine resin, urea resin, polycarbonate and the like.

After the adhesive member of the present invention is cured,
There is no particular limitation as long as it is left for 7 days or more under conditions of temperature of 25 ° C. and humidity of 50% RH, or if it is cured under the conditions required for curing these adhesives.

[Sheet Material for IC Card Base Material] The sheet material for the first sheet material and the second sheet material is, for example,
Polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene terephthalate / isophthalate copolymers, polyolefin resins such as polyethylene, polypropylene and polymethylpentene,
Polyethylene fluoride such as polyvinyl fluoride, polyvinylidene fluoride, polytetrafluoroethylene, ethylene-4 fluoroethylene copolymer, polyamide such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride /
Vinyl acetate copolymer, ethylene / vinyl acetate copolymer,
Ethylene / vinyl alcohol copolymer, polyvinyl alcohol, vinylon and other vinyl polymers, cellulose triacetate, cellophane and other cellulosic resins, methyl polymethacrylate, ethyl polymethacrylate, ethyl polyacrylate, butyl polyacrylate. , Etc., acrylic resin, polystyrene, polycarbonate, polyarylate, polyimide, etc., synthetic resin sheet, high-quality paper, thin paper, glassine paper, sulfuric acid paper, etc., single layer of metal foil, etc. The body. The thickness of the support of the present invention is 30 to 300 μm, preferably 50 to 200.
μm. If the thickness is 30 μm or less, heat shrinkage or the like occurs when the first sheet material and the second sheet material are attached, which is a problem.

In the present invention, when the moisture-curable hot melt adhesive is used, the moisture permeability of the sheet material is 10%.
(G · 25 μ / m ² , 24 hr) or more is preferable. First
Water is efficiently supplied to the adhesive layer from both surface sides of the sheet material and the second sheet material, the curing of the adhesive can be accelerated, and the productivity is improved. Further, the curing rate of the entire surface of the card becomes the same, and a card having a uniform hardness can be manufactured. In the present invention, for example, polyethylene terephthalate (PET) or polypropylene (P
P) and the like are preferable, for example, PET-G manufactured by Eastman Chemical Co. whose crystallization is controlled for injection molding.
(R) is also preferable because the image receiving sheet is easily fused. Moisture permeability is 10 (g ・ 25μ / m ² , 24h
r) or more. Moisture permeability here is JIS K
7128-Z0208 It is measured by the moisture permeability test method of the moisture-proof packaging material, and the conditions are 40 ° C. and 90% RH.

In some cases, the second sheet material may be provided with an image receiving layer and a cushion layer for forming a face image of the card user. An image element may be provided on the surface of the personal identification card substrate, and at least one selected from an authentication identification image such as a face image, an attribute information image, and format printing may be provided. It may be a card.

Known resins can be used for the image-receiving layer. Examples thereof include polyvinyl chloride resin, copolymer resins of vinyl chloride and other monomers (eg, isobutyl ether, vinyl propionate, etc.), polyester resins, poly (Meth) acrylic acid ester, polyvinylpyrrolidone,
Polyvinyl acetal resin, polyvinyl butyral resin, polyvinyl alcohol, polycarbonate, cellulose triacetate, polystyrene, copolymers of styrene and other monomers (eg acrylic ester, acrylonitrile, ethylene chloride, etc.), vinyltoluene acrylate resin, polyurethane Examples thereof include resins, polyamide resins, urea resins, epoxy resins, phenoxy resins, polycaprolactone resins, polyacrylonitrile resins, and modified products thereof. Among them, polyvinyl chloride resins, vinyl chloride and other monomers are preferable. Copolymer with, polyester resin, polyvinyl acetal resin,
Polyvinyl butyral resins, copolymers of styrene and other monomers, and epoxy resins.

Polyolefin is preferable as a material for forming the cushion layer of the present invention. For example, polyethylene, polypropylene, ethylene-vinyl acetate copolymer,
Ethylene-ethyl acrylate copolymer, styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butadiene-styrene block copolymer, styrene-
Those having flexibility and low thermal conductivity such as hydrogenated isoprene-styrene block copolymer and polybutadiene are suitable.

The cushion layer as referred to in the present invention means a soft resin layer which is located between the IC and the image receiving layer for receiving an image and plays a role of alleviating the effect of unevenness due to electronic parts such as an IC module.

The resin layer is coated or laminated on one surface or both surfaces of another support having substantially the same quality as the above-mentioned substrate,
It is particularly preferable that it is formed.

The first sheet material, which is the back sheet of the IC card, may be provided with a writing layer, a cushion layer, etc., which can be written with a pen, and there is no particular limitation.

For the writable layer, a fine inorganic powder such as calcium carbonate, talc, diatomaceous earth, titanium oxide, barium sulfate is contained in a film of thermoplastic resin (polyolefin such as polyethylene, various copolymers, etc.). To form.

[Electronic Component] The electronic component means an information recording member, and specifically, an IC chip for electrically storing the information of the user of the electronic card, and a coil shape connected to the IC chip. It is an antenna body. The IC chip is a memory only or a microcomputer in addition to the memory. In some cases, the electronic component may include a capacitor. The present invention is not limited to this and is not particularly limited as long as it is an electronic component necessary for the information recording member.

Although the IC module has an antenna coil, when it has an antenna pattern, any method such as a conductive paste printing process, a copper foil etching process, or a winding welding process may be used. As the printed circuit board, a thermoplastic film such as polyester is used, and when heat resistance is required, polyimide is advantageous. The IC chip and the antenna pattern are joined by a conductive adhesive such as silver paste, copper paste, carbon paste (EN-4000 series of Hitachi Chemical Co., Ltd., XAP series of Toshiba Chemical Co., Ltd.) or anisotropic conductive film (Hitachi Chemical Co., Ltd.). A method of using an industrial anisorum) or a method of performing solder bonding is known, but any method may be used.

Since the component including the IC chip is placed at a predetermined position in advance and then the resin is filled, the joint portion is detached by the shearing force due to the flow of the resin, or the surface of the surface is broken due to the flow or cooling of the resin. In order to prevent loss of smoothness and lack of stability, a resin layer is formed on the substrate sheet in advance and the electronic component is sealed with a porous resin film or a porous resin film in order to encapsulate the component in the resin layer. It is preferable to use in the form of a high quality foamable resin film, a flexible resin sheet, a porous resin sheet or a non-woven fabric sheet. For example, Japanese Patent Application No. 11-1
The methods described in No. 05476 and the like can be used.

Since the IC chip has a weak point pressure strength, it is also preferable to have a reinforcing plate in the vicinity of the IC chip.

The total thickness of the electronic component is preferably 10 to 300 μm, more preferably 30 to 300 μm, further preferably 30 to 250 μm.

[Method of Providing Electronic Component Between First Sheet Material and Second Sheet Material] A predetermined electronic component is provided between the first sheet material and the second sheet material of the present invention. In order to provide the above, as a manufacturing method, a heat bonding method, an adhesive bonding method and an injection molding method are known, but they may be bonded by any method. In addition, the first sheet material and the second sheet material are printed by format either before or after the bonding, or
Information may be recorded, and may be formed by any method such as offset printing, gravure printing, silk printing, screen printing, intaglio printing, letterpress printing, ink jet method, sublimation transfer method, electrophotographic method, heat melting method and the like. it can.

A method of manufacturing an IC mounted card base material according to the present invention is described in JP-A 2000-036026 and 2000-21.
9855, JP 2000-212178 A, JP 20
No. 00-219855, JP-A-10-316959, JP-A-11-5964, and the like, there are disclosed methods of laminating and coating. Any laminating method, coating method or the like can be used, and the present invention is not particularly limited.

Further, as described in claims 3 to 5 of the present invention, as a method of disposing the adhesive at a specific position, a screen printing method, a gravure printing method, or the like is used.
It can be manufactured by applying an adhesive at a predetermined position. When a hot-melt adhesive is used, it is also possible to apply the adhesive in a bead shape from a nozzle with a hand gun type hot-melt applicator to apply the adhesive to each arrangement.

Alternatively, the adhesive processed into a film shape may be cut so as to be placed in a predetermined arrangement, and after being placed in each arrangement, heat and pressure treatment may be applied to bond them.

At the time of bonding, it is preferable to perform heating and pressurization in order to improve the surface smoothness of the base material and the adhesiveness of a predetermined electronic component between the first sheet material and the second sheet material, It is preferable to manufacture by a vertical pressing method, a laminating method, etc. Further, in consideration of cracking of IC parts, a flat pressing type is used to avoid a roller which is close to line contact and to which an excessive bending force is applied even with a slight deviation. Is preferred. Heating 1
0-180 degreeC is preferable, More preferably, it is 30-150.
℃. The applied pressure is preferably 1.0 to 300 kgf / cm ² , and more preferably 1.0 to 200 kgf / cm ^2.
Is. If the pressure is higher than this, the IC chip will be damaged. Heating and pressurizing time is preferably 0.001 to 90 sec
More preferably, it is 0.001 to 60 sec. If the time is longer than this, the manufacturing efficiency is reduced.

For a moisture-curing adhesive whose reaction rate is lowered due to the influence of moisture or the like, that is, the adhesive strength and the durability of the card are deteriorated. Therefore, the adhesive should be attached under vacuum or under nitrogen. Is more effective.
In the bonding or coating process, the substrate member, the electronic component holder and the surface member are bonded together under a predetermined pressure and heating condition, so that the electronic component holder itself is used as an adhesive. A member for a substrate, and an electronic component holder for the same,
The substrate for the surface can be attached with good reproducibility.

A sheet for an IC card having an IC module having an IC chip and an antenna in the adhesive layer, in which the first sheet material and the second sheet material are bonded together with an adhesive agent, has a predetermined condition. After being stored under
An IC card is manufactured by supplying a C card sheet to a punching die and punching the IC card from the IC card sheet with the punching die.

In this case, the authentication identification image and the bibliographic items may be recorded before the punching process.

[Photocurable Resin Layer] The photocurable resin layer is made of a material having an addition-polymerizable or ring-opening-polymerizable property, and the addition-polymerization compound is a radical-polymerizable compound, for example, Japanese Patent Laid-Open No. H7-18753. -159983, Japanese Patent Publication No. 7-31399
A photo-curable material using a photo-polymerization (including heat-polymerizable) composition described in Japanese Patent Application No. 7-231444, etc. and Japanese Patent Application No. 7-231444. May be. As the addition polysynthetic compound, a cationic polymerization type photocurable material is known, and recently, a cationic photopolymerization type photocurable material sensitized to a long wavelength region longer than visible light is also disclosed in, for example, JP-A-6- It is disclosed in Japanese Patent Publication No. 43633.
As a hybrid polymerization type photocurable material, there is disclosed in Japanese Patent Application Laid-Open No.
No. 181944 discloses the composition. Specifically, it is a photo-curable layer containing any of the above-mentioned cationic initiator, cationically polymerizable compound, radical-based initiator and radical-polymerizable compound, and any photo-curable layer is used for the purpose of the present invention. I don't mind.

[Thermosetting Resin Layer] In the present invention, the thermosetting resin composition is, for example, an epoxy-based, polyester-based, acrylic-based resin, a curing agent, a curing catalyst, a leveling agent, or other additives. You may mix | blend.

As the composition of the polyester resin, a composition mainly containing an aromatic dicarboxylic acid such as terephthalic acid or isophthalic acid as a dicarboxylic acid component and an aliphatic diol such as ethylene glycol or neopentyl glycol as a diol component is preferable. , Aliphatic dicarboxylic acids such as adipic acid and azelaic acid, trivalent or higher carboxylic acids such as trimellitic acid and pyromellitic acid, and trivalent or higher valency such as trimethylolethane, trimethylolpropane and pentaerythritol. Those containing a small amount of alcohol and the like are more preferable because the melt fluidity and the crosslinking reactivity are improved.

The average degree of polymerization of the polyester resin is 5
Those in the range of -50 are preferred. If it is lower than this, sufficient strength cannot be obtained when it is made into a film, and if it is higher than this, crushing becomes difficult. Next, as the curing agent, when the terminal group of polyester is -OH type, there are an isocyanate compound and a melamine resin, for example, ε-caprolactam block isocyanate and methylated melamine. Examples of the -COOH type terminal group include epoxy resin and triglycidyl isocyanurate. [Method for Producing Heat or Photocurable Resin Layer] When the heat or photocurable resin layer is produced on the image recording body, it is preferable to produce it by a coating method or transfer foil.

When coating is selected as a method of protecting the image recording material, conventionally known methods such as spin coating, wire bar coating, dip coating, felt coating, air knife coating, spray coating, air spray coating, electrostatic coating are used. Methods such as air spray coating, roll coating blade coating and curtain coating are used. At this time, the coating amount varies depending on the application, but is, for example, 0.05 to 50.0 g as solid content.
A coating amount of / m ² is preferred. As the coating amount decreases, the apparent sensitivity increases, but the film characteristics and chemical resistance of the image forming layer decrease.

As a method for curing after coating, any method for generating active electromagnetic waves can be used. For example,
Examples thereof include lasers, light emitting diodes, xenon flash lamps, halogen lamps, carbon arc lamps, metal halide lamps, tungsten lamps, mercury lamps and electrodeless light sources. Preferably a xenon lamp,
Examples of the light source include a halogen lamp, a carbon arc lamp, a metal halide lamp, a tungsten lamp, and a mercury lamp.Energy to be added at this time is appropriately selected by adjusting the exposure distance, time, and intensity depending on the type of the polymerization initiator. Can be used. When using an "active curing line" laser as the light source,
It is easy to reduce the exposure area to a very small size, and high-resolution image formation is possible. As a laser light source, any of an argon laser, a He-Ne gas laser, a YAG laser, a semiconductor laser and the like can be preferably used.

When photocuring is performed using actinic rays,
A means for stabilizing photocuring in a nitrogen stream under reduced pressure may be used. "Heat treatment" Heat energy can also be applied, and as a means, an oven, a heater, a hot stamp, a thermal head, a laser beam, an infrared flash, a hot pen, etc. can be selected and used at appropriate times.

For protection of the heat- or photo-curable resin layer of the present invention, a transparent protective layer ribbon or transparent protective foil formed by coating on a heat-resistant support such as a polyethylene terephthalate resin film is prepared in advance. Alternatively, it can be formed by thermal transfer using, for example, a thermal head or a thermal transfer roll. [Method of Making IC Card Using Transfer Foil] Hereinafter, an embodiment of the transfer foil and the method of making an IC card according to the present invention will be described with reference to the drawings. It is not limited. First, a first embodiment is shown in FIGS. 4 and 5, FIG. 4 is a schematic configuration diagram of an IC card producing apparatus, and FIG. 5 is a diagram showing a layer configuration of an IC card.

In the IC card producing apparatus of this embodiment, the card base material supplying section 10 and the information recording section 2 are provided at the upper position.
0 is disposed, and the protection imparting portion and / or the optical change element imparting portion 40, the actinic ray curing layer imparting portion and / or the actinic ray irradiating portion 90 are disposed in the lower position to prepare a card as an IC card, but a sheet is also It can also be created.

In the card base material supply unit 10, a plurality of card base materials 50 preliminarily cut into a sheet shape for writing the personal information of the card user are stocked with the face for recording a face up. Has been done. In this example, the card substrate 5
0 is composed of a support 51 and an image receiving layer 52, and the card bases 50 are automatically supplied one by one from the card base supply unit 10 at a predetermined timing.

In the information recording section 20, a yellow ribbon cassette 21, a magenta ribbon cassette 22, a cyan ribbon cassette 23, and a black ribbon cassette 24 are arranged, and recording heads 25 to 28 are arranged corresponding to them. The card substrate 50 is formed by thermal transfer using a thermal transfer sheet such as a yellow ribbon, a magenta ribbon, and a cyan ribbon.
While the image is being moved, an image area 53 having a gradation such as a facial photograph of the card user is recorded in a predetermined area of the image receiving layer 52. Further, the character ribbon cassette 31 and the recording head 32 are arranged, and the thermal identification by the thermal transfer sheet such as the character ribbon, the authentication identification information 5 such as the name and the card issuing date.
4 is recorded and an image recording layer is formed.

A transfer foil cassette 41 is disposed in the protection imparting section and / or the optical change element imparting section 40, and a thermal transfer head 42 is disposed corresponding to the transfer foil cassette 41. The transparent protective transfer foil 64 and / or the optically variable element transfer foil 43 is thermally transferred to provide the transparent protective transfer layer 640 and / or the optically variable element transfer layer 430.

After that, the actinic ray curable liquid is applied by the actinic ray curable layer applying section and / or the actinic ray irradiating section 90 and exposed by the actinic ray to obtain the layer constitution of the IC card having the constitution shown in FIG. An actinic ray curing layer 650 is provided on the protective transfer layer 640 and / or the optical change element transfer layer 430.

Next, a second embodiment is shown in FIGS. 6 and 7, FIG. 6 is a schematic configuration diagram of an IC card producing apparatus, and FIG. 7 is a diagram showing a layer configuration of an IC card.

In the IC card producing apparatus 1 of this embodiment, the card base material supplying section 10 and the information recording section 20 are similarly configured, but the resin applying section 60 is arranged next to the information recording section 20. .

The resin applying section 60 includes a transfer foil cassette 61.
Is arranged, and the thermal transfer head 62 is arranged corresponding to the transfer foil cassette 61. Transfer foil cassette 61
The curable transfer foil 66 is set in the
6 is transferred to provide a curable protective layer-containing transfer layer 660.

Next, a third embodiment is shown in FIGS. 8 and 9, FIG. 8 is a schematic configuration diagram of an IC card producing apparatus, and FIG. 9 is a diagram showing a layer configuration of an IC card.

In the IC card producing apparatus 1 of this embodiment, the card base material supplying section 10 and the information recording section 20 are configured in the same manner, but next to the information recording section 20, a protection imparting section and / or an optical change element imparting section The part 40 and the resin applying part 60 are arranged.

Protection imparting portion and / or optical change element imparting portion 4
At 0, the transparent protective transfer layer 640 and / or the optically variable element transfer layer 430 are provided. In the resin applying section 60, the curable transfer foil 66 is thermally transferred onto the IC card formed of the transparent protective transfer layer 640 and / or the optically variable element transfer layer 430 on the image receiving layer 52 to form the curable protective layer-containing transfer layer 660. It is provided.

Next, a fourth embodiment will be described with reference to FIGS.
1 and FIG. 10 is a schematic configuration diagram of the IC card creation device,
FIG. 11 is a diagram showing the layer structure of the IC card.

IC card making apparatus 1 of this embodiment
The card base material supply unit 10 and the information recording unit 20 have the same structure, but a transparent protective layer and / or an optical change element transfer layer applying unit / or a resin layer applying unit 70 are arranged, and then a transparent protective layer is added. The layer and / or the optical change element transfer layer applying portion / or the resin layer applying portion 70 is arranged.

In the transparent protective layer and / or the optical change element transfer layer applying section / or the resin layer applying section 70, the transfer foil cassette 7 is used.
1 is arranged, and a thermal transfer head 72 is arranged corresponding to the transfer foil cassette 71. Optical change element transfer foil 4
3 and / or the transparent protective transfer foil 64 and the curable transfer foil 66 are transferred, and the optically variable element transfer layer 430 and / or the transparent protective transfer layer 640 and the curable protective layer-containing transfer layer 660 are provided.

Next, a fifth embodiment is shown in FIGS. 12 and 13, FIG. 12 is a schematic view of an IC card producing apparatus, and FIG. 13 is a view showing a layer structure of the IC card.

In the IC card producing apparatus 1 of this embodiment, the card base material supply section 10 and the information recording section 20 are configured in the same manner, but the transparent protective layer and / or the optical change element transfer applying section / or the resin layer applying section 70 is arranged.

A transfer cassette 71 is disposed in the transparent protective layer and / or the optical change element transfer imparting portion / or resin layer imparting portion 70, and a thermal transfer head 72 is disposed corresponding to the transfer foil cassette 71. The curable resin layer-containing optical change element transfer foil 44 is transferred to provide the curable resin layer-containing optical change element transfer layer 440.

In the present invention, the transparent protective transfer foil is a transparent protective foil that protects an image, and the transparent protective layer is a transparent protective layer that protects an image. Further, the resin layer is a layer having a resin which defines the elongation at break and the coefficient of friction according to the present invention. The active cured resin layer is a part of the type of the resin layer, which is a preferred embodiment in the present invention, but may be limited to the resin layer in manufacturing. The curable protective layer-containing optical change element layer refers to a layer in which the cured layer and the optical change element layer are integrated. The protective property imparting transfer foil means a transfer foil including at least one resin layer (preferably actinic ray curable resin).

Next, an embodiment of the transparent protective transfer foil 64 is shown in FIG. The transparent protective transfer foil 64 of FIG. 14A is composed of a transparent protective transfer layer 640 and a support 64b, and the transparent protective transfer layer 640 includes a release layer 64a1 and a transparent protective layer 64a.
2. Adhesive layer 64a3, transparent protective layer 64a2
Release layers 64a1 and adhesive layers 64a3 are provided on both sides of
The release layer 64a1 is adhered to the support 64b. Figure 1
The transparent protective transfer foil 64 of 4 (b) has the same structure as the transfer foil of FIG. 14 (a), except that the transparent protective layer 64a2 and the adhesive layer 6 are
The intermediate layer 64a4 is provided between the intermediate layer 64a4 and 4a3. Figure 1
The transparent protective transfer foil 64 of 4 (c) has the same structure as the transfer foil of FIG. 14 (b), but two transparent protective layers 64a2 are provided. The transparent protective transfer foil 64 of FIG.
Same structure as the transfer foil of (b), but with transparent protective layer 64
A barrier layer 64a5 is provided between a2 and the intermediate layer 64a4.

The transparent protective transfer foil 64 is transferred by peeling the transparent protective transfer layer 640 from the support 43b.

An embodiment of the optical variable element transfer foil 43 is shown in FIG. The optical change element transfer foil 43 of FIG. 15A is composed of an optical change element transfer layer 430 and a support 43b, and the optical change element transfer layer 430 is composed of a release layer 43a1, an optical change element layer 43a2, and an adhesive layer 43a3. The release layer 43a1 and the adhesive layer 43a3 are provided on both sides of the optical change element layer 43a2, and the release layer 43a1 is adhered to the support 43b. Optically variable element transfer foil 4 of FIG.
3 has the same structure as that of the transfer foil of FIG. 15A, except that the intermediate layer 4 is provided between the adhesive layer 43a3 and the optical change element layer 43a2.
3a4 is provided. The optical variable element transfer foil 43 of FIG. 15C is configured similarly to the transfer foil of FIG. 15B, but a barrier layer 43a5 is provided between the optical variable element layer 43a2 and the intermediate layer 43a4. . The transfer foil of FIG. 15 (d) has the same structure as the transfer foil of FIG. 15 (c),
A transparent protective layer 43a6 is provided between the release layer 43a1 and the optical change element layer 43a2.

The optical change element transfer foil 43 is transferred by separating the optical change element transfer layer 430 from the support 43b.

Next, an embodiment of the curable transfer foil 66 is shown in FIG. The curable transfer foil 66 of FIG. 16A is composed of a curable protective layer-containing transfer layer 660 and a support 66b,
The curable protective layer-containing transfer layer 660 includes a release layer 66a1, a cured layer 66a2, an intermediate layer 66a4, and an adhesive layer 66a3. The release layer 66a1 and the intermediate layer 66a4 are provided on both sides of the cured layer 66a2. 66a1 is adhered to the support 66b. The curable transfer foil 66 of FIG. 16B has the same configuration as the transfer foil of FIG.
Two layers of a2 are provided. The curable transfer foil 6 of FIG. 16 (c)
6 has the same structure as the transfer foil of FIG. 16 (a), but has a barrier layer 66a between the adhesive layer 66a3 and the intermediate layer 63a4.
5 are provided.

The curable transfer foil 66 is transferred by separating the curable protective layer-containing transfer layer 660 from the support 43b.

Next, an embodiment of the curable resin layer-containing optical change element transfer foil 44 is shown in FIG. The curable resin layer-containing optical change element transfer foil 44 of FIG. 17A is composed of a curable resin layer-containing optical change element transfer layer 440 and a support 44b, and the curable resin layer-containing optical change element transfer layer 440 is separated. Mold layer 44a1, cured layer 44a9, optical change element layer 44a
2, intermediate layer 44a4, barrier layer 44a5, adhesive layer 44
The release layer 44a1 is made of a3 and is adhered to the support 44b. The curable resin layer-containing optically variable element transfer foil 44 of FIG. 17 (b) has the same structure as the transfer foil of FIG. 17 (a), but does not have the intermediate layer 44a4.
The curable resin layer-containing optically variable element transfer foil 44 of 7 (c) has the same structure as the transfer foil of FIG. 17 (a), but does not have the barrier layer 44a5.

The curable resin layer-containing optical change element transfer foil 44 is used as the curable resin layer-containing optical change element transfer layer 44.
0 is separated from the support 44b and transferred.

In the curable resin layer-containing optical change element transfer foil 44 of this embodiment, the curable resin layer-containing optical change element transfer layer 440 is peeled from the support 44b and transferred, and the curable resin layer-containing optical change film is transferred. The element transfer layer 440 has at least a release layer, a cured layer, an optical change element layer, an intermediate layer, and an adhesive layer, and is excellent in surface protection and surface abrasion resistance.

Further, at least from the optical change element layer, I
It is preferable that the transparent protective layer located on the surface side of the C card is an ultraviolet curable layer or an electron beam curable layer because of excellent surface protection and surface abrasion resistance.

Further, it is preferable that the optical change element layer is a hard coat layer or a vapor deposition layer having an uneven image because curing for preventing forgery / alteration is more facilitated.

Further, it is preferable that at least one transparent protective layer is thermally transferred onto the entire surface of the card because of excellent surface protection and surface abrasion resistance.

Furthermore, it is preferable that an antistatic agent is contained in either layer of the transparent protective transfer foil or the optically variable element transfer foil, so that a card or sheet on which dust does not adhere can be prepared.

Further, it is preferable that the transfer surface which has been transferred first is subjected to the easy adhesion processing of the transfer foil which is transferred later, because the adhesion is good.

In the transfer foil of the present invention, an antistatic layer, a release layer, a transparent protective layer, an optical change element layer, a barrier layer,
At least one layer is preferably provided in the intermediate layer and the adhesive layer. The antistatic layer of the transfer foil contains an anionic polymer substance having excellent antistatic properties and / or conductive particles.

[Detailed Description of Transfer Foil Material] The transfer foil of the present invention preferably comprises a support having a release layer and a transparent resin layer, more preferably a release layer, a transparent resin layer, an intermediate layer and a barrier. At least one of a layer, a primer layer, and an adhesive layer
It is preferably composed of two layers. In the case of the present invention, the IC chip can prevent forgery and the like,
It is also possible to provide an optical change element layer for the purpose of visual discrimination. <Transfer foil support> Examples of the support include polyester resins such as polyethylene terephthalate, polybutylene terephthalate and polyethylene terephthalate / isophthalate copolymers, polyolefin resins such as polyethylene, polypropylene and polymethylpentene, polyvinyl fluoride and polyvinyl fluoride. Poly (vinyl fluoride), poly (tetrafluoroethylene), ethylene / tetrafluoroethylene copolymer, etc., polyfluorinated ethylene resin, polyamide such as nylon 6, nylon 6.6, polyvinyl chloride, vinyl chloride / vinyl acetate copolymer , Ethylene / vinyl acetate copolymer, ethylene /
Vinyl alcohol copolymer, polyvinyl alcohol, vinyl polymer such as vinylon, cellulose triacetate, cellulosic resin such as cellophane, methyl polymethacrylate,
Acrylic resins such as ethyl polymethacrylate, ethyl polyacrylate, butyl polyacrylate, etc., polystyrene, polycarbonate, polyarylate, synthetic resin sheets such as polyimide, or fine paper, thin paper, glassine paper,
Examples include paper such as sulfuric acid paper and the like, single-layered bodies such as metal foils, and laminated bodies of two or more layers thereof. The thickness of the support of the present invention is 10 to 10.
200 μm It is preferably 15 to 80 μm. 10 μm
If it is below, the support will be broken at the time of transfer, which is a problem. In the specific release layer of the present invention, polyethylene terephthalate is preferred.

The support of the present invention may have irregularities if necessary. Examples of means for forming irregularities include kneading with a matting agent, sandblasting, hairline processing, matte coating, or chemical etching. In the case of matte coating, either an organic substance or an inorganic substance may be used.

For example, as the inorganic substance, Swiss Patent No. 3 can be used.
Silica described in 30,158, etc., French Patent No. 1,29
Glass powder described in US Pat. No. 6,995, British Patent No. 1,17
Alkaline earth metals described in No. 3,181 or carbonates such as cadmium and zinc can be used as a matting agent. Organic substances include US Pat. No. 2,322,03
No. 7, etc., starch derivatives, such as Belgian Patent No. 625,451 and British Patent No. 981,198, polyvinyl alcohols described in Japanese Patent Publication No. 44-3643, Swiss Patent No. 330,158. Or polymethacrylate described in U.S. Pat.
Organic matting agents such as polyacrylonitrile described in US Pat. No. 079,257 and polycarbonate described in US Pat. No. 3,022,169 can be used. The method for applying the matting agent may be a method in which the matting agent is dispersed in the coating solution in advance and then applied, or a method in which the matting agent is sprayed after the application of the coating solution and before the completion of drying. When a plurality of types of matting agents are added, both methods may be used together. In the case of the uneven processing according to the present invention, it is possible to apply it to one or more of the transfer surface and the back surface. <Transfer foil release layer> As the release layer, a resin such as an acrylic resin having a high glass transition temperature, a polyvinyl acetal resin, a poly (vinyl butyral) resin, waxes, silicone oils, a fluorine compound, a polyvinylpyrrolidone resin having water solubility , Polyvinyl alcohol resin, Si modified polyvinyl alcohol, methyl cellulose resin, hydroxy cellulose resin, silicone resin, paraffin wax, acrylic modified silicone, polyethylene wax,
Resins such as ethylene vinyl acetate can be mentioned. In addition, polydimethylsiloxane and its modified products such as polyester modified silicone, acrylic modified silicone, urethane modified silicone, alkyd modified silicone, amino modified silicone, epoxy modified silicone, polyether modified silicone, etc. Oils and resins, or cured products thereof. Examples of other fluorine-based compounds include fluorinated olefins and perfluorophosphate ester-based compounds. Preferred olefin compounds include dispersions of polyethylene, polypropylene, etc., long-chain alkyl compounds such as polyethyleneimine octadecyl, etc. Of these release agents, those having poor solubility can be used by dispersing them.

When two transfer foils are transferred, a thermoplastic elastomer may be added. Specific examples of thermoplastic elastomers include styrene type (styrene block copolymer (SBC)), olefin type (TP), urethane type (T
PU), polyester type (TPEE), polyamide type (TPAE), 1,2-polybutadiene type, vinyl chloride type (T
PVC), fluorine-based, ionomer resin, chlorinated polyethylene, silicone-based, and the like. Specifically, 1996
It is described in "12996 Chemical Products" (Chemical Industry Daily), etc., for the fiscal year.

The thermoplastic elastomer having a tensile elongation of 100% or more, which is preferably used in the present invention and is composed of a block polymer of polystyrene and a polyolefin, is a thermoplastic elastomer composed of a block of styrene and a linear or branched saturated alkyl group having 10 or less carbon atoms. It refers to a plastic resin (hereinafter also referred to as a thermoplastic resin S1). In particular, styrene-butadiene-styrene (SBS), styrene-isoprene-styrene (SIS), styrene-ethylene / butylene-styrene (SEBS), styrene- which are block polymers having a polystyrene phase and a hydrogenated phase of polyolefin.
Examples thereof include ethylene / propylene-styrene (SEPS) and styrene-ethylene / propylene (SEP) block polymers.

If desired, a thermosetting resin layer may be used between the release layer of the present invention and the resin layer or the actinic ray curable layer. Specifically, polyester resin, acrylic resin, epoxy resin, xylene resin, guanamine resin,
Examples thereof include diallyl phthalate resin, phenol resin, polyimide resin, maleic acid resin, melamine resin, urea resin, polyamide resin and urethane resin.

The transparent resin layer of the transfer foil is made of polyvinyl butyral resin, polyurethane resin, polyamide resin, polyester resin, epoxy resin, novolac resin, styrene, paramethylstyrene, vinyl monomer such as methacrylic acid ester, acrylic acid ester and the like. Any other high-molecular polymer such as cellulose-based, thermoplastic polyester, and natural resin may be used in combination. Also, in addition, Kiyoshi Akamatsu supervised, "Practical technology of new photosensitive resin", (CMC, 1987)
Year) or “10188 chemical products” pp. 657-767 (Kagaku Kogyo Nippo Co., Ltd., 1988).

In the present invention, it is preferable to provide a photo or thermosetting layer with a transfer foil for the purpose of protecting the IC card. The light or / thermosetting layer is not particularly limited as long as it is a material composed of the composition described above. The thickness of the transparent resin layer is preferably 0.3 to 50 μm, more preferably 0.
It is 3 to 30 μm, particularly preferably 0.3 to 20 μm.

The intermediate layer of the transfer foil is preferably composed of one or more intermediate layers. In some cases, a primer layer or a barrier layer may be interposed to further improve the adhesion between the layers.

For example, vinyl chloride resin, polyester resin, acrylic resin, polyvinyl acetal resin,
Polyvinyl butyral resin, polyvinyl alcohol,
Polycarbonate, cellulose resin, styrene resin, urethane resin, amide resin, urea resin, epoxy resin, phenoxy resin, polycaprolactone resin,
Polyacrylonitrile resin, SEBS resin, SEPS resin, and modified products thereof can be used.

Among the above-mentioned resins, vinyl chloride resin, polyester resin, acrylic resin, polyvinyl butyral resin, styrene resin, epoxy resin, urethane resin, urethane acrylate resin are preferable for the purpose of the present invention. , SEBS resin, and SEPS resin. These resins may be used alone or in combination of two or more.

As a concrete compound, a thermoplastic resin composed of a block polymer of polystyrene and polyolefin, polyvinyl butyral and the like are preferable. In the intermediate layer of the present invention, as a polyvinyl butyral resin having a degree of polymerization of 1000 or more, SLECH BH-3, BX-1, BX-2, BX-5, BX-5 manufactured by Sekisui Chemical Co., Ltd.
5, BH-S, Denka Butyral # 4000-2, # 5000-A, # 6000-EP manufactured by Denki Kagaku Kogyo Co., Ltd.
Etc. are commercially available. The thermosetting resin of polybutyral of the intermediate layer is not limited to the degree of polymerization before thermosetting and may be a resin having a low degree of polymerization, and an isocyanate curing agent or an epoxy curing agent can be used for thermosetting, and the thermosetting conditions Is 50 ~
90 ° C. for 1 to 24 hours is preferable. The thickness of the intermediate layer is 0.
1 to 1.0 μm is preferable.

As the adhesive layer of the transfer foil, ethylene vinyl acetate resin, ethyne ethyl acrylate resin, ethylene acrylic acid resin, ionomer resin as a heat-adhesive resin,
Polybutadiene resin, acrylic resin, polystyrene resin, polyester resin, olefin resin, urethane resin, tackifier (eg phenol resin, rosin resin,
Terpene resin, petroleum resin, etc., and copolymers or mixtures thereof may be used.

Specifically, as the urethane-modified ethylene ethyl acrylate copolymer, Hitech S-6254, S-6254B, S-312 manufactured by Toho Chemical Industry Co., Ltd.
9 and the like are commercially available, and as the polyacrylic acid ester copolymer, Jurimer AT-210 and AT manufactured by Nippon Pure Chemical Industries, Ltd.
-510, AT-613, plus size L-201, SR-102, SR-103, J manufactured by Mutsoh Chemical Co., Ltd.
-4 and the like are commercially available. The weight ratio of the urethane-modified ethylene ethyl acrylate copolymer and the polyacrylic acid ester copolymer is preferably 9: 1 to 2: 8, and the thickness of the adhesive layer is preferably 0.1 to 1.0 μm.

In some cases, an optical change element layer transfer layer may be provided for the purpose of preventing forgery / alteration. Optical change element (O
optical Variable Device: OV
D) is 1) a two-dimensional CG image of a diffraction grating such as a kinegram, which is characterized in that the image of a line image structure freely moves and changes such as movement, rotation, expansion, and reduction.
2) Something like Pixelgram, which has the feature that the image changes to positive and negative, 3) OSD (Optic)
A color that changes from gold to green, such as al Security Device, 4) LEAD (Long)
Lasting Economical Antico
py Device), in which the image image appears to change, 5) a stripe type OVD, 6) a metal foil, etc., Journal of the Printing Society of Japan (1998), Vol. 35, No. 6, P482-
The security may be maintained by using a paper material, a special printing technique, a special ink, etc. as described in P496. Holograms are particularly preferred in this invention.

The hologram used in the present invention is a relief hologram, Fresnel hologram, Fraunhofer hologram, lensless Fourier transform hologram, laser reproduction hologram such as image hologram, white reproduction hologram such as Lippmann hologram, rainbow hologram, color hologram, computer hologram. ,
A hologram display, a multi-flex hologram, a hologram flex stereogram, a holographic diffraction grating, etc. can be arbitrarily adopted.

The optically variable element layer can be formed, for example, by adhering a hologram sheet on the image receiving layer. A relief type hologram sheet can be used as the hologram sheet. The relief type hologram sheet is formed by laminating a hologram forming layer and a hologram effect layer in this order on a support film. Specifically, a hologram sheet is a resin layer that is solid at room temperature and has thermoformability on the surface of a support film such as a polyethylene terephthalate film, for example, a thermoplastic electron that is solid at room temperature. A line-curable resin layer (hologram forming layer) is formed, and a hologram master plate on which a hologram interference pattern is formed in a concavo-convex shape is pressed and compressed, and the concavo-convex shape is transferred to a resin surface and cured, Furthermore, a thin film hologram effect layer made of a material (for example, a vapor-deposited film of TiO2, SiO2, ZnS) that has sufficient transparency and a large reflectivity at a certain angle on the uneven surface and has a refractive index different from that of the hologram forming layer is formed. It can be obtained by forming. A hologram whose image is reproduced by white light such as daylight or illumination light is also excellent in decorativeness because the hologram image can be observed even in a normal state. On the other hand, the type in which an image is reproduced by laser light is excellent in tampering detectability.

Further, according to the present invention, a bead-holding layer can be provided, and the bead-holding layer having the beads according to the present invention is given a phase difference to a part of human incident light and re-synthesized.
It has a reflective substrate and transparent beads arranged on the substrate to enhance light components in a specific wavelength region by interference and to return colored light having a color tone different from that of the incident light in the incident light entering direction. The bead-holding layer having beads is formed by disposing a resin layer on a reflective substrate, and further arranging a large number of beads having a bead diameter of 10 to 60 μm, preferably 15 to 40 μm, which are made of glass or the like, on the surface side thereof. The optical refractive index of is 1.
6-2.1 are preferable and 1.7-2.0 are more preferable. The incident light entering from the outside travels into the beads, at least a part of which is reflected from the transparent beads through the resin layer to the reflective substrate, returns to the beads again, and travels to the outside. Since the surface of the beads protruding outward is a spherical surface,
Even if there is a slight change in the angle of incidence of the person, the same effect is produced, and the reflected light can be returned in the incident direction.

Next, in the present invention, a reflective layer can be provided, and the reflective layer of the present invention can be used as the reflective layer.
It is selected from at least a metal thin film, a metal oxide thin film, a light interference material and a light diffraction layer. The reflective layer is preferably provided by printing a paint containing a powder capable of expressing an interference color such as an interfering substance, a metal oxide, or mica in an arbitrary pattern.

Examples of metal oxides include titanium dioxide, iron oxide, low-order titanium oxide, zirconium oxide, silicon oxide, aluminum oxide, cobalt oxide, nickel oxide, cobalt titanate, and Li2CoTi3O8 or K.
Examples thereof include composite oxides such as NiTiOx, and mixtures of these metal oxides, but the metal oxides are not particularly limited as long as they are metal oxides capable of exhibiting an interference color. As the interference material layer, a metal film having an interference color obtained by oxidizing the surface of the metal film can be used. These metal films include a method of anodizing metal aluminum, metal titanium, a stainless steel film, etc., or a method of preparing a metal oxide capable of expressing an interference color by a sol-gel method and coating it or a metal capable of expressing an interference color. A method of applying an alkoxide to a metal film and thermally decomposing it, a vapor deposition operation method such as CVD or PVD, and the like can be used. [Method of applying transfer foil on IC card] Transfer of the transfer foil to the material to be transferred is usually performed by using a hand means such as a thermal head, a heat roller, or a hot stamping machine that can apply pressure while heating.

EXAMPLES The present invention will be described in detail below with reference to examples, but the embodiments of the present invention are not limited thereto. In the following, "part" means "part by weight". (Preparation of Adhesive) Adhesive 1-Henkel's Macroplast QR3460 (moisture-curing adhesive) 80 parts-Porous high silica aluminosilicate (AMT-SILICA # 200B; manufactured by Mizusawa Chemical Co., Ltd.) Was stirred at a temperature of 150 ° C. for 60 minutes with a homogenizer to prepare an adhesive 1.

Adhesive 2 • Sekisui Chemical Co., Ltd. Esdyne 9631W 95 parts • Porous high silica aluminosilicate (AMT-SILICA # 200B; Mizusawa Chemical Co., Ltd.) The amounts shown in the table The above components at a temperature of 150 ° C. for 60 minutes, a homogenizer And stirred to prepare adhesive 2.

Adhesive 3 • Hitachi Chemical Polymer Hibon 4810 95 parts • Porous high silica aluminosilicate (AMT-SILICA # 200B; manufactured by Mizusawa Chemical Co., Ltd.) The amounts shown in the table The above components at a temperature of 150 ° C. for 60 minutes, a homogenizer Then, the adhesive 3 was prepared by stirring. (Measurement of Physical Properties of Adhesive) [Measurement of Tensile Elastic Modulus and Elongation at Tensile Break Point] Adhesives 1-2
Using a hot press machine, the adhesive and thickness 300
A spacer with a thickness of 50 μm is sandwiched between release PET films with a thickness of 50 μm and pressed under conditions of 100 ° C. and 5 kg / cm ² for 3 minutes, and then the temperature is 25 ° C. and the humidity is 50% RH.
The mold release PET film was removed by leaving it for 7 days under the conditions described above to obtain a cured adhesive having a thickness of 300 μm.

The adhesive sheet thus obtained was used as an oriental tensilon universal testing machine RTA-
Tensile elastic modulus was measured using 100 according to ASTM D638. The measured results are shown in Table 1. (Creation of IC Card) FIG. 18 is a diagram showing an example of a laminated structure of an IC card and an individual authentication card.

IC card and personal authentication card 10 of the embodiment
0 indicates that the adhesive sheet 10 is provided between the back sheet (first sheet material) 101 and the top sheet (second sheet material) 102.
3, 104, IC chip 105a and antenna body 105b
The electronic component 105 made of is interposed and bonded. On the topsheet (second sheet material) 102, personal information such as a face image 106, an address, a name, a date of birth 107, etc. is described.

Support 1 As a top sheet and a back sheet, JIS K7128-
Moisture permeability by Z0208 is 22 (g ・ 25μ /
A white polyester sheet having a thickness of 100 μm and a thickness of 75 μm, which is m ² , 24 hr) was used.

Support 2 As a top sheet and a back sheet, JIS K7128-
Moisture permeability by Z0208 is 5 (g ・ 25μ / m ² ,
A white PVC sheet having a thickness of 100 μm and a thickness of 75 μm, which is 24 hr), was used. (Preparation of surface sheet) On the surface of the support surface sheet having a thickness of 100 μm, a surface having been subjected to corona discharge treatment, a coating solution for forming a first image receiving layer, a coating solution for forming a second image receiving layer and a coating for forming a third image receiving layer having the following composition The liquids are applied and dried in this order so that each thickness is 0.2.
An image receiving layer was formed by laminating the layers so as to have a thickness of 2.5 μm, 2.5 μm, and 0.5 μm. <Coating liquid for forming first image-receiving layer> Polyvinyl butyral resin 9 parts [Sekisui Chemical Co., Ltd .: Eslec BL-1] Isocyanate 1 part [Nippon Polyurethane Industry Co., Ltd .: Coronate HX] Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second image-receiving layer> Polyvinyl butyral resin 6 parts [Sekisui Chemical Co., Ltd .: S-REC BX-1] Metal ion-containing compound (compound MS) 4 parts Methyl ethyl ketone 80 parts Butyl acetate 10 parts < Third image-receiving layer forming coating liquid> Polyethylene wax 2 parts [Toho Chemical Industry Co., Ltd .: Hitec E1000] Urethane-modified ethylene acrylic acid copolymer 8 parts [Toho Chemical Industry Co., Ltd .: Hitech S6254] Methylcellulose [ Shin-Etsu Chemical Co., Ltd .: SM15] 0.1 part water 90 parts (format printing) By fat-relief printing method, logo and O
P varnish was printed sequentially. (Preparation of Back Sheet) (Preparation of Writing Layer) 75 μm of the back sheet of the support was corona-discharge-treated on the surface thereof and manufactured by Oji Yuka Co., Ltd .: YUPO DFG-65
The sheets are stuck together, and a first writing layer forming coating liquid, a second writing layer forming coating liquid and a third writing layer forming coating liquid having the following compositions are applied and dried in this order to have a thickness of 5 μm. , 15μ
A writing layer was formed by laminating so as to have a thickness of 0.2 μm. <Coating liquid for forming the first writing layer> Polyester resin [Toyobo Co., Ltd .: Byron 200] 8 parts Isocyanate 1 part [Japan Polyurethane Industry Co., Ltd .: Coronate HX] Carbon black Trace amount of titanium dioxide particles [Ishihara Sangyo] Co., Ltd .: CR80] 1 part Methyl ethyl ketone 80 parts Butyl acetate 10 parts <Coating liquid for forming second writing layer> Polyester resin 4 parts [Toyobo Co., Ltd .: Vylonal MD1200] Silica 5 parts Titanium dioxide particles [Ishihara] Sangyo Co., Ltd .: CR80] 1 part Water 90 parts <Third writing layer forming coating liquid> Polyamide resin [Sanwa Chemical Industry Co., Ltd .: Sunmide 55] 5 parts Methanol 95 parts Obtained writing layer The center line average roughness was 1.34 μm. (Creation of IC Card Sheet) FIG. 19 is a diagram showing an example of implementation of an IC card creation apparatus.

The IC card producing apparatus is provided with a delivery shaft 310 for delivering the first sheet material 301, and the first sheet material 301 delivered from the delivery shaft 310 is stretched over the guide roller 311 and the drive roller 312. Supplied. An applicator coater 313 is arranged between the delivery shaft 310 and the guide roller 311. The applicator coater 313 coats the adhesive layer 302a on the sheet with a predetermined thickness.

Further, the IC card manufacturing apparatus is provided with a delivery shaft 314 for delivering the second sheet material 304, and the second sheet material 304 delivered from the delivery shaft 314.
Is supplied by being stretched over the guide roller 315 and the drive roller 316. An applicator coater 317 is arranged between the delivery shaft 314 and the guide roller 315.
The applicator coater 317 applies the adhesive layer 302b to the sheet with a predetermined thickness.

Adhesive-coated first sheet material 301
Then, the second sheet material 304 is conveyed along the conveyance path 318 while being in contact with the second sheet material 304 in a state of being separated from and facing the second sheet material 304. An IC module 303 is inserted at a position where the first sheet material 301 and the second sheet material 304 are opposed to each other with a space therebetween.

The IC modules 303 are supplied as a single unit or as a plurality of sheets or rolls. A quenching laminating section 319 and a cutting section 320 are arranged in the conveyance path 318 of the IC card manufacturing apparatus along the conveyance direction of the first sheet material 301 and the second sheet material 304. In addition, a protective film supply unit may be provided in front of the quenching laminating unit 319, and it is preferable that the protective film supply unit is disposed so as to face the conveyance path 318 so as to face each other. The quenching laminating section 319 is a flat type cooling laminating upper die 3 which is arranged above and below the conveyance path 318 so as to face each other.
21 and a cooling laminate lower mold 322. The cooling laminate upper die 321 and the lower die 322 are provided so as to be movable in directions in which they come in contact with and separate from each other. After passing through the cooling laminating section 319, the sheet material is cut into a predetermined size at the cutting section.

A reinforcing plate can be provided on or around the IC chip of the IC module, and a silane coupling agent can be added from above the chip to increase the strength. As the addition method, a method of dropping a liquid droplet with an apparatus such as a dropper, or a general coating method such as dip coating or spin coating can be used. (Production of IC Card Sheet 1) The IC card production apparatus of FIG. 19 was used, and the back sheet and the front sheet were used as the first sheet material and the second sheet material.

Adhesive 1 was applied to each sheet using a T-die to a thickness of 280 μm, an IC module was placed between the upper and lower adhesive-attached sheets, and rapidly laminated under the conditions shown in the table. It was made.

A reinforcing plate was attached to a part of the IC chip of the IC module used here in a portion adjacent to the chip.
The types of reinforcing plate are shown in FIGS. 20 shows a rectangular reinforcing plate provided on the upper side of the IC chip, FIG. 21 shows that the IC chip is fitted into the opening of the rectangular reinforcing plate, FIG. 22 shows that the IC chip is fitted into the recess of the rectangular reinforcing plate, and FIG. An elliptical reinforcing plate is provided above the IC chip, a cross-shaped reinforcing plate is provided above the IC chip in FIG. 24, and a corrugated reinforcing plate is provided above the IC chip in FIG.

The reinforcing plate was made of stainless steel and had a Young's modulus of 120 GPa.

Further, 3 ml of the silane coupling agent was dropped on some of the IC modules by using a commercially available dropper. When the reinforcing plate and the silane coupling agent were used together, the solution was dropped from the side opposite to the reinforcing plate.

The thickness of the IC card sheet thus prepared was 760 μm. 25 ° C, 50% after fabrication
It was stored for 7 days under the environment of RH. (Method of Writing Personal Information on Personal Authentication Card and Surface Protecting Method) A personal authentication card having a face image, attribute information, and format printing was prepared on the punched IC card as follows. (Preparation of sublimation-type thermal transfer recording ink sheet) A 6 μm-thick polyethylene terephthalate sheet having a back surface processed to prevent fusion is coated with a yellow ink layer-forming coating solution, a magenta ink layer-forming coating solution, and cyan. The ink layer forming coating liquid was provided so that each thickness was 1 μm, and three color ink sheets of yellow, magenta and cyan were obtained. <Coating liquid for forming yellow ink layer> Yellow dye (Compound Y-1) 3 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] manufactured by Denki Kagaku Kogyo Co., Ltd. Polymethyl methacrylate modified polystyrene 1 part [ Toagosei Chemical Industry Co., Ltd .: Rededa GP-200] 0.5 parts urethane modified silicone oil [Dainichi Seika Kogyo Co., Ltd .: Dialomer SP-2105] methyl ethyl ketone 70 parts Toluene 20 parts <Coating for forming magenta ink layer Working solution> Magenta dye (Compound M-1) 2 parts Polyvinyl acetal 5.5 parts [Denka Butyral KY-24] manufactured by Denki Butyral Co., Ltd. Polymethylmethacrylate modified polystyrene 2 parts [Toagosei Chemical Industry Co., Ltd.] Made by: Rededa GP-200] 0.5 parts of urethane modified silicone oil [Dainichi Seika Kogyo Co., Ltd. Made: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts <Cyan ink layer forming coating liquid> Cyan dye (compound C-1) 1.5 parts Cyan dye (compound C-2) 1.5 parts Polyvinyl acetal 5 6 parts [Denka Butyral KY-24 manufactured by Denki Kagaku Kogyo Co., Ltd.] Polymethylmethacrylate modified polystyrene 1 part [Reeda GP-200 manufactured by Toagosei Chemical Industry Co., Ltd.] 0.5 parts urethane modified silicone oil [ Dainichi Seika Kogyo Co., Ltd .: Dialomer SP-2105] Methyl ethyl ketone 70 parts Toluene 20 parts (preparation of ink sheet for melt-type thermal transfer recording) A polyethylene terephthalate sheet having a thickness of 6 μm and processed to prevent fusion on the back surface has the following composition. The ink layer-forming coating solution is applied to a thickness of 2 μm and dried to dry the ink. It was obtained. <Ink layer forming coating liquid> Carnauba wax 1 part Ethylene vinyl acetate copolymer 1 part [Mitsui DuPont Chemical Co., Ltd .: EV40Y] Carbon black 3 parts Phenolic resin [Arakawa Chemical Industries Co., Ltd .: Tamanor 521] 5 parts 90 parts of methyl ethyl ketone (formation of face image) The image receiving layer and the ink side of a sublimation type thermal transfer recording ink sheet are superposed on each other and output from the ink sheet side using a thermal head 0.23 W / dot, pulse width 0.3 to 4 By heating under a condition of a dot density of 16 dots / mm for 0.5 msec, a human image having gradation is formed on the image receiving layer. In this image, the dye and nickel in the image receiving layer form a complex. (Formation of character information) The OP varnish portion and the ink side of the ink sheet for melt-type thermal transfer recording are superposed and output from the ink sheet side using a thermal head 0.5 W / dot, pulse width 1.0 msec, dot density Character information was formed on the OP varnish by heating under the condition of 16 dots / mm. (Surface protection method) [Synthesis example 1 of resin for addition of surface protection agent for personal authentication card] Resin 1 using actinic ray curable layer 73 parts of methyl methacrylate, 15 parts of styrene, 12 parts of methacrylic acid were placed in a three-necked flask under a nitrogen stream. Then, 500 parts of ethanol and 3 parts of α, α′-azobisisobutyronitrile were added, and the mixture was reacted in a nitrogen stream at 80 ° C. in an oil bath for 6 hours. Then, add 3 parts of triethylammonium chloride and 1.0 part of glycidyl methacrylate and add 3 parts.
The reaction was allowed to proceed for a time to obtain a synthetic binder 1 of the intended acrylic copolymer. [Method 1 for forming surface protective layer] (Preparation of transparent resin transfer foil 1) The following formulation was applied by wire bar coating to one side of polyethylene terephthalate (S-25) manufactured by DIAFOIL Hoechst Co., Ltd. and dried to obtain a transparent resin. Transfer foil 1 was created. (Peeling layer) Film thickness 0.5 μm Acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., DIANAR BR-87) 5 parts (resin layer) Film thickness 0.5 μm Acrylic resin (manufactured by Mitsubishi Rayon Co., Ltd., DIANAR BR- 87) 5 parts Polyvinyl acetoacetal (SP value: 9.4) (Sekisui Chemical Co., Ltd., KS-1) 5 parts Methyl ethyl ketone 40 parts Toluene 50 parts (intermediate layer) Film thickness 2 μm Styrenic resin (Kuraray Co., Ltd.) Septon 2006) 5 parts Polyvinyl butyral resin (Sekisui Chemical Co., Ltd., BL-S) 5 parts Toluene 90 parts (adhesive layer) Film thickness 2 μm Styrene resin (Asahi Kasei Corp., Tuftec M-1953) 6 parts Alicyclic Saturated hydrocarbon resin (Arakawa Chemical Co., Ltd., Alcon P100) 3.5 parts Calcium carbonate (Okutama Industry Co., Ltd., Tamapearl TP-123) 0.5 part Toluene 90 parts A transparent resin transfer foil 1 composed of a release layer, an intermediate layer and an adhesive layer having the above composition was prepared.

Then, using the IC card making apparatus,
A card provided with a face image, attribute information and format printing was heated to a surface temperature of 200 ° C. using the transparent resin transfer foil 1, and a heat roller having a diameter of 5 cm and a rubber hardness of 85 was used and pressure was 150 kg / cm ² to 1.2. Transfer was performed by applying heat for 2 seconds. The card on which the transfer foil 1 was transferred was coated with the coating liquid containing the ultraviolet curable resin by a gravure roll coater having a specific background pattern so that the coating amount was 20 g / m ² , and the ultraviolet curable was performed under the following curing conditions. The resin-containing coating liquid 1 was cured to form an ultraviolet curing protective layer, and a personal identification card having the protective layer was prepared.

Curing conditions Light irradiation source 60 w / cm ² high-pressure mercury lamp irradiation distance 10 cm Irradiation mode 3 cm / sec Optical scanning evaluation method [UV-curable resin-containing coating liquid 1] Bis (3,4-epoxy-6-methylcyclohexylmethyl) ) Adipate 70 parts Bisphenol A glycidyl ether 10 parts 1,4-Butanediol glycidyl ether 13 parts Triarylsulfonium fluoroantimony 7 parts [Surface protection layer forming method 2] (Preparation of actinic radiation curable transfer foil 1) 0.1 μm An actinic ray curable transfer foil 1 was prepared by laminating the following composition on the release layer of a polyethylene terephthalate film 2 having a thickness of 25 μm provided with a release layer of a fluororesin layer. (Actinic ray curable compound) Shin Nakamura Chemical Co., Ltd. A-9300 / Shin Nakamura Chemical Co., Ltd. EA-1020 = 35 / 11.75 parts Reaction initiator Irgacure 184 Nippon Ciba Geigy Co., Ltd. 5 parts Additive unsaturated group-containing resin 48 Parts Other additives Dainippon Ink Surfactant F-179 0.25 parts <Intermediate layer forming coating liquid> Film thickness 1.0 μm Polyvinyl butyral resin [Sekisui Chemical Co., Ltd .: S-REC BX-1] 3.5 Part Tuftex M-1913 (Asahi Kasei) 5 parts Curing agent Polyisocyanate [Coronate HX Nippon Polyurethane] 1.5 parts Methyl ethyl ketone 90 parts Curing of the curing agent after coating was carried out at 50 ° C. for 24 hours. <Adhesive layer forming coating liquid> Film thickness 0.5 μm Urethane-modified ethylene ethyl acrylate copolymer [manufactured by Toho Chemical Industry Co., Ltd .: Hitec S6254B] 8 parts Polyacrylic ester copolymer [manufactured by Nippon Pure Chemical Co., Ltd.] : Julimer AT510] 2 parts Water 45 parts Ethanol Further, using the actinic radiation curable transfer foil 1 having the above-mentioned structure on the image receptor on which images and characters are recorded, a surface temperature of 20.
Transfer was performed by applying heat at a pressure of 150 kg / cm ² for 1.2 seconds using a heat roller heated to 0 ° C. and having a rubber hardness of 85 and a diameter of 5 cm. The transcription is shown in Table 1
This was done using a C card making device. ◎ Evaluation of card <Evaluation method of card scratch strength (wear resistance) for preventing forgery / alteration> Using a wear resistance tester (HEIDON-18), 200 g, 250 g with 0.1 mmφ sapphire needle
And the load was changed to slide the surface of the created card (text, before image formation). The scratched portion of the surface of the card at that time was measured, and the weight of the scratched portion was measured. The results are shown in Table 1. <Measurement of surface roughness> The surface roughness of the created card (text, before image formation) is measured by a surface roughness meter (RST / PLUS WY
(Manufactured by CO). A practical level is within ± 5 μm. <Evaluation of bending suitability> As shown in FIG. 26, the personal authentication card thus manufactured to the end has a long side direction of the card of 35 mm and a short side direction of the card of 35 mm.
In order to obtain m, the test was conducted 1000 times in total in the long-side direction and the short-side direction at a cycle of 30 / min every 125 times. After that, the IC function was confirmed with a commercially available reader / writer, and the evaluation was performed in three stages. The results obtained are shown in Table 1.

A: No deformation and no problem with IC function.

Δ: There is no deformation, but the IC function is lost.

X: The IC function is lost due to bending. <Image printability> The formability after forming the face image and the character information was evaluated on a five-point scale. The results obtained are shown in Table 1.

1 The peripheral portion of the chip is clean without any blurring of characters or images.

2 Although there is no blurring of characters or images in the peripheral portion of the chip, the characters or images are slightly difficult to see due to the unevenness.

[0173] A blur of characters and images can be seen around the chip.

[0174] 4 There is a portion of the peripheral portion of the chip where characters and images are not formed at all.

There are many portions where characters and images are not formed at all in addition to the peripheral portion of the five chips.

1 and 2 are practically acceptable levels.

[0177]

[Table 1]

[0178]

As described above, in the invention described in claim 1, the surface strength is improved and the flatness is improved by cooling in the state of the best flatness.

According to the second aspect of the invention, the surface strength is improved and the flatness is improved due to the regulation of the elongation 2% elastic modulus of the hot-melt adhesive after the card is made by rapid cooling.

According to the third aspect of the invention, the surface strength and the flatness are improved by defining the viscosity of the hot melt adhesive layer at 130 ° C.

In the invention described in claim 4, the hot melt adhesive is a reactive type, the surface strength is improved, and the flatness is improved.

In the invention described in claim 5, a heating step,
By having a cooling step and a bonding step, the surface strength is improved by cooling in the state of the best flatness,
And the flatness is improved.

According to the invention of claim 6, the IC card has a scratch strength of 150 g with a 0.8 mmφ sapphire needle.
The surface strength is improved by having the image receiving layer as described above.

According to the seventh aspect of the invention, the IC chip can be reinforced by providing the silane coupling agent on the upper portion or the peripheral portion of the IC chip.

In the invention described in claim 8, since the silane coupling agent is a partially hydrolyzed polymer, I
The C-tip can be reinforced.

According to the ninth aspect of the invention, the IC chip can be reinforced by having the metal reinforcing plate adjacent to the IC chip.

[0187] In the invention of claim 10, the metal reinforcing plate contains a material having a Young's modulus of 100 GPa or more,
The IC chip can be reinforced.

According to the eleventh aspect of the invention, the planar irregularity of the chip peripheral portion of the IC card is within ± 10 μm,
The smoothness around the chip is improved.

In the invention described in claim 12, personal information is described, licenses such as automobile license, identification card, passport, alien registration card, library card, cash card, credit card, employee It is used for ID cards, employee ID cards, membership cards, medical cards and student ID cards.

According to the thirteenth aspect of the present invention, the IC chip is not present at a position overlapping the face image portion, so that the face image recording property is improved.

According to the fourteenth aspect of the present invention, the IC card is a non-contact type that has no electrical contact outside the card, is excellent in security, and is used for applications requiring high data confidentiality and forgery / alteration protection. can do.

[Brief description of drawings]

FIG. 1 is a diagram showing an IC card creation device.

FIG. 2 is a diagram showing a configuration of an IC card.

FIG. 3 is a plan view of an IC card.

FIG. 4 is a schematic configuration diagram of an IC card creation device.

FIG. 5 is a diagram showing a layer structure of an IC card.

FIG. 6 is a schematic configuration diagram of an IC card creation device.

FIG. 7 is a diagram showing a layer structure of an IC card.

FIG. 8 is a schematic configuration diagram of an IC card creation device.

FIG. 9 is a diagram showing a layer structure of an IC card.

FIG. 10 is a schematic configuration diagram of an IC card creation device.

FIG. 11 is a diagram showing a layer structure of an IC card.

FIG. 12 is a schematic configuration diagram of an IC card creation device.

FIG. 13 is a diagram showing a layer structure of an IC card.

FIG. 14 is a diagram showing an embodiment of a transparent protective transfer foil.

FIG. 15 is a diagram showing an embodiment of an optical variable element transfer foil.

FIG. 16 is a diagram showing an embodiment of a curable transfer foil.

FIG. 17 is a diagram showing an embodiment of a curable resin layer-containing optical change element transfer foil.

FIG. 18 is a diagram showing an example of a laminated structure of an IC card and an individual authentication card.

FIG. 19 is a diagram showing an example of implementation of an IC card creation device.

FIG. 20 is a diagram showing a configuration of a reinforcing plate.

FIG. 21 is a diagram showing a configuration of a reinforcing plate.

FIG. 22 is a diagram showing a configuration of a reinforcing plate.

FIG. 23 is a diagram showing a configuration of a reinforcing plate.

FIG. 24 is a diagram showing a configuration of a reinforcing plate.

FIG. 25 is a diagram showing a configuration of a reinforcing plate.

FIG. 26 is a diagram illustrating evaluation of bending suitability of an IC card.

[Explanation of symbols]

A First sheet material supply unit B Second sheet material supply unit C adhesive coating section D inlet supply section E heating unit F cooling unit G pasting part H punched part 1st sheet material 2 Second sheet material 3 electronic components 4 Hot melt adhesive

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideki Takahashi             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company (72) Inventor Nobuyuki Ishii             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company (72) Inventor Ryoji Hattori             Konica Stock, 1 Sakura-cho, Hino City, Tokyo             In the company F-term (reference) 2C005 MA11 MA12 MA14 MB01 MB08                       MB10 NA08 NB01 PA03 PA04                       PA19 PA21 PA23 RA03 RA09                       RA10                 5B035 AA07 AA08 BA05 BB09 CA02                       CA03 CA23

Claims (14)

[Claims] 1. A method for producing an IC card in which an IC module is encapsulated in a hot melt adhesive layer interposed between a first sheet material and a second sheet material, wherein After the second sheet material is pasted with a hot melt adhesive, the surface temperature of the first sheet material and the second sheet material is rapidly cooled at 10 ° C. or more and 100 ° C. or less per second. How to make. 2. The hot melt adhesive after the card is rapidly cooled to prepare a card having an elongation of 2% and an elastic modulus of 20 kg / mm ² or more 80.
The method for producing an IC card according to claim 1, wherein the IC card has a weight of not more than kg / mm ² . 3. The method for producing an IC card according to claim 1, wherein the viscosity of the hot melt adhesive layer at 130 ° C. is 2000 mPs or more and 40000 mPs or less. 4. The method for producing an IC card according to claim 1, wherein the hot melt adhesive is a reactive type. 5. A plurality of IC cards are prepared from one or a long roll-shaped first sheet material and second sheet material.
In the method of making a C card, a heating step of coating or pasting at a temperature of 95 ° C. to 150 ° C. and a surface temperature of the first sheet material and the second sheet material for 1 second after coating or pasting A method for producing an IC card, comprising a cooling step of rapidly cooling at 10 ° C. or more and 100 ° C. or less, and a bonding step of bonding at a temperature of 0 ° C. or more and 30 ° C. or less after coating or bonding. 6. The IC card according to any one of claims 1 to 5, wherein the IC card has an image receiving layer having a scratch strength of 150 g or more with a 0.8 mmφ sapphire needle. 7. An IC is provided at a predetermined position between two opposing substrates.
An IC card in which an electronic component including an IC module having a chip and an antenna body is placed and filled with an adhesive, wherein a silane coupling agent is provided on an upper portion or a peripheral portion of the IC chip. card. 8. The IC card according to claim 7, wherein the silane coupling agent is a partially hydrolyzed polymer. 9. The IC card according to claim 7, further comprising a metal reinforcing plate adjacent to the IC chip. 10. The metal reinforcing plate has a Young's modulus of 100 GPa.
The IC card according to claim 9, comprising one of the above materials. 11. The planar irregularity of the peripheral portion of the chip of the IC card is within ± 10 μm.
The IC card according to claim 10. 12. The IC card according to claim 6, wherein personal information such as a face image, an address, a name, a date of birth is recorded as the personal information. 13. The IC card according to claim 12, wherein the IC chip is not present at a position overlapping with the face image portion. 14. The IC card according to claim 6, wherein the IC card is a non-contact type that has no electrical contact outside the card.