JP2003127052A - Grinding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To execute grinding of a machining face of an object to be machined simply with excellent accuracy. SOLUTION: A grinding tool 3 is moved on the locus of a tool which is simultaneously directed in the two directions of the first direction or the reverse direction and the second direction in an area where the relative movement direction of the grinding tool 3 is turned from the first direction (the Y direction) or the reverse direction (the Y direction) to the second direction (the X direction) that is roughly perpendicular to the first direction and in the area where the relative movement direction of the grinding tool is turned from the second direction to the first direction or the reverse direction. By that, reduction in the movement speed of the grinding tool 3 is suppressed in the area where the movement direction of the grinding tool 3 is turned from the first direction or the reverse direction to the second direction and from the second direction to the first direction or the reverse direction, and furthermore, density of the locus of the tool can be set to be low, excessive grinding in the area where the movement direction of the grinding tool 3 is turned can be prevented, and the grinding with excellent accuracy can be executed.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a polishing method.

[0002]

2. Description of the Related Art Conventionally, as a method of polishing a work piece such as a die for molding an optical element, a small-diameter polishing tool is pressed against the work surface of the work piece with a constant force to reciprocate the polishing tool. The method of making is used. According to such a polishing method, it is possible to adjust the polishing depth by changing the moving speed of the polishing tool, improve the processing accuracy of the processed surface, and remove the undulations on the processed surface. it can.

FIG. 12 shows a polishing tool 1 having a small diameter on a processing surface 102 of a mold 101 for molding a lens which is an optical element.
No. 03 shows a general work mode when polishing is performed, and FIG. 13 is a plan view showing a tool locus of the polishing tool 103 on the processing surface 102 at that time. This FIG.
The rectangular broken line in the inside indicates that the inner part is the optically effective region and the outer part is the optically unnecessary region.

The polishing tool 103 is driven to rotate about its axis and moves on a predetermined tool locus while being pressed against the processing surface 102 with a predetermined polishing load F. This tool locus is Y which is the lateral direction (sub scanning direction) of the die 101.
Tool path extending in the Y direction or the opposite direction, and the mold 10 orthogonal to the Y direction at the end portion in the Y direction or the opposite direction.
1 along a longitudinal direction (main scanning direction), that is, a tool trace of a small amount.

Here, when a general-purpose NC machine tool is driven to perform polishing, when the polishing tool 103 moves in the Y direction, the moving speed gradually decreases at the end portion thereof, and the polishing tool 1
At the point where the moving direction of 03 is turned back by approximately 90 ° from the Y direction to the X direction, it becomes “0” momentarily.

FIG. 14 shows a working surface 102 of the die 101 in the sub-scanning direction (Y direction) and a moving range of the polishing tool 103 moving on the working surface 102. The width dimension of the die 101 in the sub-scanning direction (Y direction) is 2.4 mm,
The contact width dimension of the polishing tool 103 formed of an elastic member with the processing surface 102 is about 0.8 mm, and NC
Polishing tool 103 controlled by NC data of machine tool
The moving width dimension of is 1.6 mm.

FIG. 15 shows a polishing depth in the sub-scanning direction when the polishing tool 103 is moved in the sub-scanning direction (Y direction) of the mold 101 to polish the processed surface 102 of the mold 101 as shown in FIG. The amount of polishing (polishing amount) is shown. At both ends in the sub-scanning direction, the polishing depth significantly increases due to a decrease in the moving speed of the polishing tool 103.
Occurs. The stable processing area where proper polishing is performed is about 0.6 mm. That is, the processing surface 1 of the die 101
The width of 2.4 is 2.4 mm, and the stable machining area is about 1/4.
And less.

[0008]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
Various polishing methods for increasing the ratio of the stable processing area have been proposed, and one example thereof is Japanese Patent Laid-Open No. 62-
As described in Japanese Laid-Open Patent Application No. 246467 and Japanese Patent Laid-Open No. 2001-79742, a pseudo shape (yatoy) having a guide surface continuous with the machined surface of a workpiece (for example, a die) is provided on the outer periphery of the machined surface. A method is known in which the direction of movement of the polishing tool is turned back on this pseudo-shaped guide surface.

However, this method increases the number of new work steps for forming a pseudo shape (a toy) having a guide surface having no step with respect to the processed surface of the workpiece. Furthermore, when finishing the workpiece and the pseudo-form by ultra-precision cutting, the processing area of ultra-precision cutting increases by that much, and the time required for ultra-precision cutting and the wear amount of the cutting tool for performing ultra-precision cutting increase. A problem such as a decrease in the precision of ultra-precision cutting due to the above occurs in the pre-process of polishing.

Further, as a polishing method not using a pseudo pattern (yaito), as described in Japanese Patent Laid-Open No. 2001-138196, a defect area due to turning back in the moving direction of the polishing tool is used as an optical method in a workpiece. It is known how to put it in the unnecessary area.

However, according to this polishing method, the workpiece has to be formed in an unnecessarily large size, which has the same problem as in the case of using the pseudo pattern.

Further, as described in Japanese Patent Laid-Open No. 2001-170852, by synchronously controlling the turning back in the moving direction of the polishing tool and the peripheral speed of the polishing tool, the polishing amount in the turning back region in the moving direction of the polishing tool is controlled. Polishing processing methods for reducing the number are also known.

However, in this polishing method, the rotation speed of the polishing tool must be controlled within an extremely short time of 1 second or less, which is difficult to control.

An object of the present invention is to provide a polishing method capable of simply and accurately polishing a work surface of a workpiece.

An object of the present invention is to increase the percentage of stable working area in polishing.

[0016]

The invention according to claim 1 is
A rotating small-diameter polishing tool is pressed against the work surface of the work piece with a predetermined load to move it relatively in the first direction or the opposite direction, and after moving to a predetermined position in the first direction or the opposite direction, the movement In a polishing method for polishing the machined surface by repeating a turning operation in which a relatively small amount is moved in a second direction substantially orthogonal to the direction, the relative movement direction of the polishing tool is the first direction or the opposite direction. From the second direction to the second direction and from the second direction to the first direction or the opposite direction thereof, the polishing tool is simultaneously directed to the first direction or two directions of the opposite direction and the second direction. The feature is that the tool is moved on the tool path.

Therefore, in a region where the movement direction of the polishing tool is turned back from the first direction or the opposite direction to the second direction, or from the second direction to the first direction or the opposite direction, the polishing tool is moved in the first direction or the opposite direction. By moving on the tool locus that simultaneously moves in two directions, the opposite direction and the second direction, it is possible to suppress a decrease in the moving speed of the polishing tool, and further to reduce the density of the tool locus. It is possible to prevent excessive polishing in a region where the moving direction of the polishing tool is switched back.

According to a second aspect of the present invention, in the polishing method according to the first aspect, the tool locus is N of an NC machine tool.
The tool locus of the section formed by the coordinate command point of the C data and moving simultaneously in the first direction or the opposite direction and the second direction is formed by a straight line or an arc.

Therefore, such a tool locus can be easily set by the normal G code command of the NC machine tool.

According to a third aspect of the present invention, in the polishing method according to the first aspect, the tool locus is formed by adjusting the response speed of the NC machine tool, and the first direction or the opposite direction and the second direction. It is characterized in that the tool locus in a section that moves in the two directions simultaneously and is formed so as to make a short circuit within the first direction or the opposite direction and the second direction.

Therefore, such a tool locus can be easily set without tuning NC data only by tuning the positioning servo of the NC machine tool or setting parameters.

According to a fourth aspect of the present invention, the rotating small-diameter polishing tool is pressed against the work surface of the work piece with a predetermined load to relatively move in the first direction or the opposite direction, and the first direction or the opposite direction. A polishing tool for polishing the machined surface by repeating a turning operation in which a relatively small amount is moved in a second direction that is substantially orthogonal to the moving direction after moving to a predetermined position in the direction. The maximum movement position in the direction or the opposite direction is a position where a part of the polishing tool is separated from the processing surface of the workpiece and another part is in contact with the processing surface. .

Therefore, it is possible to increase the movement width of the polishing tool when the polishing tool is moved in the first direction or in the opposite direction, whereby polishing on both sides of the work surface of the workpiece in the first direction is performed. The remaining area is reduced,
The ratio of stable processing area is high.

According to a fifth aspect of the present invention, in the polishing method according to the fourth aspect, a chamfering treatment is applied to an edge portion of the workpiece in the moving direction of the polishing tool in the first direction or the opposite direction. It is characterized by

Therefore, when polishing is performed using a polishing tool formed of an elastic member, the edge of the workpiece is chamfered, so that part of the polishing tool is processed. Even if the polishing tool separates from the machining surface and the other part comes into contact with the machining surface, the deformation state of the polishing tool at the contact part between the polishing tool and the edge of the workpiece becomes gentle, resulting in a sharp deformation. The polishing tool is prevented from being damaged by. Also, since the chamfering process eliminates burrs on the edges of the workpiece, the burrs remaining on the edges of the workpiece are caught in the polishing tool and come into contact with the machining surface of the workpiece. The occurrence of scratches is prevented.

According to a sixth aspect of the present invention, a rotating small-diameter polishing tool is pressed against the processing surface of the workpiece with a predetermined load, and the polishing tool is moved so that the tool path is cut back in a zigzag shape in a plane projection. In the polishing method for polishing the machined surface, the tip portion of the tool locus that is cut back in a zigzag shape is rounded into an arc shape or a trapezoid shape.

Therefore, in a region where the tool locus of the polishing tool is cut back in a zigzag manner, it is possible to suppress a decrease in the moving speed of the polishing tool and further reduce the density of the tool locus, whereby the movement of the polishing tool is moved. It is possible to prevent excessive polishing in the region where the direction is turned back.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a first embodiment of the present invention.
Or, it demonstrates based on FIG. FIG. 1 shows a working mode in which a processing surface 2 of a mold 1 which is a workpiece for molding a lens which is an optical element is polished by a polishing tool 3 having a small diameter. It is a top view which shows the tool locus | trajectory of the polishing tool 3 on the process surface 2 at that time. This Figure 2
The rectangular broken line in the inside indicates that the inner part is the optically effective region and the outer part is the optically unnecessary region.

The polishing tool 3 is formed by shaping a compression member obtained by kneading urethane resin and wood, and diamond paste having a particle size of ¼ μm is used as abrasive grains on the outer peripheral portion.

The polishing tool 3 is connected to an NC machine tool (not shown) so as to be driven to rotate about its axis, and is pressed against the machined surface 2 with a predetermined polishing load F. ing. Further, the polishing tool 3 is connected to the NC machine tool so that the inclination adjustment in which the normal direction of the processing surface 2 and the direction of the polishing load always match each other is performed.

The tool locus of the polishing tool 3 when the polishing surface 3 is polished by the polishing tool 3 is shown in FIGS.
As shown in (a), the tool path toward the first direction (Y direction), which is the lateral direction (sub-scanning direction) of the mold 1, or the opposite direction (Y direction), and the first direction or the opposite direction. At the end of the direction, a small amount of tool locus toward the second direction (X direction), which is the longitudinal direction (main scanning direction) of the mold 1 orthogonal to the Y direction, and the movement direction of the polishing tool 3 are the first direction. Or, the Y direction and the X direction in the region switched back from the opposite direction to the second direction and the region switched back from the second direction (X direction) to the first direction (Y direction) or the opposite direction (Y direction). It is formed by a tool locus that simultaneously moves in two directions.

FIG. 3A is an enlarged view of a part of the tool locus of the present embodiment, and FIG. 3B is an enlarged view of a part of the tool locus of the conventional example shown in FIG. Is shown. The tool locus of the present embodiment shown in FIG.
Further, both the tool trajectories of the conventional example shown in FIG. 3B are formed by the coordinate command points (white circle points) of the NC data, and in this embodiment, “P” in FIG.
By moving "0" and "P1" to "P0S" and "P1S" in FIG. 3 (a), a linear tool locus heading in the X direction and the Y direction at the same time is formed. , (A), (b), "W1" is 0.1m
m, "C1" is 0.2 mm, and "C1S" is 0.1 mm.

By changing the tool path as described above, FIG.
In the conventional example shown in (b), the time from the point "A" to the point "B" of the polishing tool 103 was 1.0 second. In the form, the polishing tool 3
It was possible to shorten the time from "A" point to "B" point to 0.4 seconds. This means that a decrease in the moving speed of the polishing tool 3 at both ends in the Y direction can be suppressed, and excessive polishing due to the decrease in the moving speed can be prevented.

Further, the length of the tool locus included in the rectangular area "S" having the same area shown in FIGS. 3A and 3B corresponds to that of FIG. Figure 3 is better
It is shorter than the conventional example shown in (b). this is,
This means that the density of tool trajectories in the same area at both ends in the Y direction is lower than that in the conventional example in the present embodiment. This also contributes to preventing excessive polishing at both ends in the Y direction. Become.

FIG. 4 shows the working surface 2 of the die 1 in the sub-scanning direction (Y direction) and the moving range of the polishing tool 3 moving on the working surface 2. Sub-scanning direction of mold 1 (Y
Direction) width dimension is 2.4 mm, and the polishing tool 3 has elasticity
Has a contact width with the machined surface 2 of about 0.8 mm,
The moving width dimension of the polishing tool 3 controlled by the NC data of the machine tool is 1.6 mm.

Looking only at FIG. 4, which is the same as FIG. 14 described as a conventional example, the polishing depth in the sub-scanning direction (Y direction) when the processed surface 2 of the mold 1 is polished according to the present embodiment. The size is as shown in FIG. That is, the mold
Although incomplete machining areas of 0.6 mm are generated at both ends in the sub-scanning direction (Y direction) of 1, the occurrence of excessive polishing portions at both ends in the Y direction is prevented, so that proper polishing is performed. The stable processing area is about 1.2 mm, which is wide, and the ratio of the stable processing area is large.

In this embodiment, the sub-scanning direction (Y
The description has been given by taking as an example the case where the tool trajectories of the polishing tool 3 on both ends of the (direction) are formed linearly in the Y direction and the X direction at the same time, but the number of coordinate command points is increased and arranged in an arc shape. You may form in an arc shape by doing.

In this embodiment, the case where the mold 1 is fixed and the polishing tool 3 is moved has been described as an example. However, the mold 1 is moved while the position of the polishing tool 3 is fixed. Good.

Next, a second embodiment of the present invention will be described with reference to FIG.
It will be described based on. The same parts as those described in the first embodiment (FIGS. 1 to 5) are designated by the same reference numerals, and the description thereof will be omitted (the same applies to the following embodiments).

In the present embodiment, as in the first embodiment, the decrease in the moving speed of the polishing tool (not shown) is suppressed at both ends in the sub-scanning direction (Y direction), and the sub-scanning is performed. By lowering the density of the tool path of the polishing tool at both ends in the direction (Y direction), excessive polishing is prevented at both ends in the sub-scanning direction (the region where the movement direction of the polishing tool is switched back). Is.

Therefore, in this embodiment, the coordinate command point of the NC data is the same as that of the conventional example shown in FIG. 3B, and the response speed of the NC machine tool is adjusted by tuning the positioning servo or changing the parameters. The tool path is adjusted so that the inside of the Y-direction and the X-direction is moved closer to the inside.

Next, a third embodiment of the present invention will be described with reference to FIG.
Or, it demonstrates based on FIG. In the present embodiment, the maximum movement position of the polishing tool 3 in the sub-scanning direction (Y direction) is
As shown in FIG. 7, a part of the polishing tool 3 is separated from the processing surface 2 of the mold 1 and the other part comes into contact with the processing surface 2, and the moving width dimension of the polishing tool 3 in the sub-scanning direction is reached. Is 2.4 mm
Has become.

Further, a chamfered portion 4 is formed on the edge of the die 1 in the sub-scanning direction. The chamfered portion 4 has a radius of curvature of 0.1 mm or more.

In such a structure, when the polishing tool 3 is moved in the sub-scanning direction (Y direction), the moving width of the polishing tool 3 can be made substantially the same as the width of the mold 1 in the sub-scanning direction. . As a result, the unpolished regions on both ends of the processed surface 2 of the die 1 in the sub-scanning direction are reduced, and FIG.
As shown in, the stable machining area is widened to about 2.0 mm,
The ratio of stable processing area increases.

Further, in this embodiment, since the chamfered portions 4 are formed at the edges of the mold 1 at both ends in the sub-scanning direction, as shown in FIG. Even if the tool is separated from the processing surface 2 of the mold 1 and a part of the tool 1 contacts the processing surface 2, the polishing tool 3 is deformed at the contact portion between the polishing tool 3 and the edge of the mold 1. Becomes gentle and damage to the polishing tool 3 is prevented. In addition, since the burr is reliably removed from the edge of the mold 1 by forming the chamfered portion 4, the burr remaining on the edge of the mold 1 is polished by the polishing tool 3 along with the polishing process. It is possible to prevent the burrs that are caught in the work surface 2 from contacting the work surface 2 of the mold 1 and causing scratches on the work surface 2.

On the other hand, FIG. 8B shows a case where the edge of the mold 1 is not chamfered. When chamfering is not performed on the edge of the mold 1, when a part of the polishing tool 3 is separated from the working surface 2 of the mold 1 and another part is in contact with the working surface 2. A sharp deformation occurs in the contact portion of the polishing tool 3 with the edge of the die 1, and the deformation easily damages the polishing tool 3. Furthermore, a situation in which burrs remain on the edge of the mold 1 is likely to occur, and the burrs may come into contact with the machining surface 2 after being caught by the polishing tool 3 to cause scratches on the machining surface 2. .

In the present embodiment, the case where the chamfered portion 4 is formed in an arc shape has been described as an example, but the chamfered portion may be chamfered in the shape of an isosceles right triangle. In that case, 1 of the chamfer
By setting the side to 0.1 mm or more, it is possible to prevent the occurrence of sharp deformation when the polishing tool 3 comes into contact with the chamfered portion, and it is possible to prevent damage to the polishing tool 3 due to such deformation.

Further, in the present embodiment, the chamfered portion 4 is formed at the edge of the die 1, and a part of the polishing tool 3 having elasticity is separated from the working surface 2 of the die 1 and the other surface is removed. Described below is a case in which the sharp deformation of the polishing tool 3 at the contact portion between the polishing tool 3 and the edge of the mold 1 is prevented when the portion comes into contact with the processing surface 2. . However, even when the hardness of the polishing tool is increased and a part of the polishing tool is separated from the processing surface 2 of the die 1 and another part is in contact with the processing surface 2, the amount of deformation of the polishing tool The chamfering at the edge of the mold 1 is not always necessary by making the number of the two small.

Next, a fourth embodiment of the present invention will be described with reference to FIG.
A description will be given based on 0. This embodiment is shown in FIG.
As shown in Fig. 10, when the tool locus is cut back so as to have a zigzag shape (N-shaped) in a plane projection and polishing is performed, the tip end portion of the tool locus is trapezoidal as shown in Fig. 10A. It is a rounded one.

As a method of rounding the tip of the tool path into a trapezoidal shape, as described in the first embodiment (FIG. 5),
A method of changing the coordinate command point of NC data is adopted.

By thus rounding the tip of the zigzag tool locus into a trapezoidal shape, it is possible to suppress a decrease in the moving speed of the polishing tool in the region where the tool locus is cut back, and to further reduce the density of the tool loci. It can be made low, whereby excessive polishing in the region where the moving direction of the polishing tool is turned back can be prevented, and the ratio of the stable processing area on the processing surface of the die can be increased.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
It will be described based on 1. This embodiment is shown in FIG.
As shown in Fig. 11, when the tool locus is cut back so as to have a zigzag shape (triangular wave shape) in plane projection and polishing is performed, the tip end portion of the tool locus is rounded into an arc shape as shown in Fig. 11 (a). It is a thing.

As a method of rounding the tip of the tool path in an arc shape, as described in the second embodiment (FIG. 6), N is used.
A method is adopted in which the response speed of the NC machine tool is adjusted by tuning the positioning servo or changing the parameters without changing the coordinate command point of the C data, and the inner side of the tool path is moved closer to the tip side.

As described above, by rounding the tip end portion of the zigzag tool locus in an arc shape, it is possible to suppress the decrease in the moving speed of the polishing tool in the region where the tool locus is cut back, and further to reduce the density of the tool locus. You can
As a result, it is possible to prevent excessive polishing in the region where the movement direction of the polishing tool is switched back, and it is possible to increase the ratio of the stable processing region on the processing surface of the die.

[0055]

According to the polishing method of the present invention, the relative movement direction of the polishing tool is changed from the first direction or the opposite direction to the second direction, and from the second direction. In the area that is cut back in the first direction or the opposite direction,
Since the polishing tool is moved on the tool locus that simultaneously moves in the first direction or the opposite direction and the second direction, the movement direction of the polishing tool changes from the first direction or the opposite direction to the second direction. And, in the region where the second direction is switched back to the first direction or the opposite direction, it is possible to suppress a decrease in the moving speed of the polishing tool, and further it is possible to reduce the density of the tool locus, whereby the polishing tool It is possible to prevent excessive polishing in a region where the movement direction of the is cut back, and it is possible to perform accurate polishing processing.

According to the second aspect of the present invention, in the polishing method according to the first aspect, the tool locus is formed by the coordinate command points of the NC data of the NC machine tool, and the first direction or the reverse direction thereof is used. Since the tool locus in the section that moves in two directions simultaneously with two directions is formed by a straight line or an arc,
This kind of tool locus setting is used for normal NC machine tool G
It can be easily done by a code command.

According to the third aspect of the present invention, in the polishing method according to the first aspect, the tool locus is formed by adjusting the response speed of the NC machine tool. Since the tool locus in the section that moves in two directions at the same time as the two directions is formed so as to make a short cut inside the first direction or the opposite direction and the second direction, setting of such a tool locus is performed. , NC data can be easily adjusted only by tuning the positioning servo of the NC machine tool or setting parameters without modifying the NC data.

According to the polishing method of the invention described in claim 4, a part of the polishing tool is separated from the processing surface of the workpiece at the maximum movement position of the polishing tool in the first direction or the opposite direction. Since the other part is in a position where it contacts the processed surface,
It is possible to increase the movement width of the polishing tool when the polishing tool is moved in the first direction or the opposite direction, and this reduces the remaining polishing area on both sides of the processed surface of the workpiece in the first direction. The ratio of the stable processing area can be increased.

According to the invention of claim 5, in the polishing method of claim 4, chamfering treatment is applied to the edge of the workpiece in the moving direction of the polishing tool in the first direction or the opposite direction. Therefore, when polishing is performed using a polishing tool formed of an elastic material, the edge of the workpiece is chamfered, so that part of the polishing tool is processed. Even if the polishing tool is detached from the machined surface and some other part is in contact with the machined surface, the deformed state of the polishing tool at the contact portion between the polishing tool and the edge of the workpiece becomes gentle and sharp. It is possible to prevent damage to the polishing tool due to deformation, and since chamfering eliminates burrs on the edge of the workpiece, the burrs remaining on the edge of the workpiece may be caught in the polishing tool. Machining surface of the work piece causing the problem A scratch occurrence can be prevented.

According to the polishing method of the invention described in claim 6, when the polishing tool is moved so that the tool path is cut back in a zigzag shape by plane projection, the surface to be processed of the workpiece is polished. By rounding the tip part of the tool path cut back in a zigzag shape into an arc shape or a trapezoidal shape, it is possible to suppress a decrease in the moving speed of the polishing tool at the tip part and further reduce the density of the tool path. This makes it possible to prevent excessive polishing in a region where the moving direction of the polishing tool is switched back, and it is possible to perform accurate polishing processing.

[Brief description of drawings]

FIG. 1 is a perspective view showing a work mode of polishing processing according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a tool locus of a polishing tool on a processing surface.

FIG. 3A is an enlarged plan view showing a part of a tool locus of a polishing tool, and FIG. 3B is an enlarged plan view showing a part of a tool locus of a polishing tool in a conventional example. .

FIG. 4 is a cross-sectional view showing a movement range of a polishing tool that moves on a processing surface of a die in a sub-scanning direction (Y direction).

FIG. 5 is a graph showing the polishing depth in the sub-scanning direction (Y direction) when the processed surface of the die is polished.

FIG. 6 is an enlarged plan view showing a part of a tool locus of a polishing tool according to a second embodiment of the present invention.

FIG. 7 is a cross-sectional view showing a movement range of a polishing tool that moves on a machining surface of a die in a sub-scanning direction (Y direction) according to a third embodiment of the present invention.

FIG. 8 is a cross-sectional view showing a deformed state of the polishing tool in a case where a chamfered portion is formed on an edge of the mold in the sub-scanning direction (a) and a case where the chamfered portion is not formed (b).

FIG. 9 is a graph showing the polishing depth in the sub-scanning direction (Y direction) when the processed surface of the die is polished.

FIG. 10 is a plan view showing a tool locus (a) of a polishing tool according to a fourth embodiment of the present invention in comparison with a tool locus (b) of a conventional example.

FIG. 11 is a plan view showing a tool locus (a) of a polishing tool according to a fifth embodiment of the present invention in comparison with a tool locus (b) of a conventional example.

FIG. 12 is a perspective view showing a working mode of polishing in a conventional example.

FIG. 13 is a plan view showing a tool locus of a polishing tool on a processing surface.

FIG. 14 is a cross-sectional view showing a movement range of a polishing tool that moves on a processing surface of a die in a sub-scanning direction (Y direction).

FIG. 15 is a graph showing the polishing depth in the sub-scanning direction (Y direction) when the processed surface of the die is polished.

[Explanation of symbols]

1 Workpiece 2 Processing surface 3 polishing tools

Claims (6)

[Claims] 1. A rotating small-diameter polishing tool is pressed against a work surface of a workpiece with a predetermined load to relatively move in a first direction or a reverse direction thereof, and moves to a predetermined position in the first direction or a reverse direction thereof. In the polishing processing method of polishing the processed surface by repeating the cutting back in which a relatively small amount is moved in a second direction substantially orthogonal to the moving direction, the relative movement direction of the polishing tool is the first. Of the polishing tool in the first direction or in the opposite direction and in the second direction, and in the area that is cut back in the second direction from the direction or the opposite direction, and in the area that is turned back in the first direction or the opposite direction from the second direction. Two
A polishing method characterized in that the polishing tool is moved on tool trajectories that simultaneously move in the same direction. 2. The tool locus is formed by coordinate command points of NC data of an NC machine tool, and the tool locus in a section that moves simultaneously in the first direction or in the opposite direction and in the second direction is a straight line or The polishing processing method according to claim 1, wherein the polishing processing is formed by an arc. 3. The tool locus is formed by adjusting a response speed of an NC machine tool, and the tool locus in a section that moves simultaneously in a first direction or two directions of an opposite direction and a second direction has a first direction. It is formed so as to go around the inner side of the second direction and the opposite direction or the opposite direction.
The polishing method described. 4. A rotating small-diameter polishing tool is pressed against a work surface of a workpiece with a predetermined load to relatively move in a first direction or a reverse direction thereof, and moves to a predetermined position in the first direction or a reverse direction thereof. In the polishing processing method of polishing the processed surface by repeating the turning back and forth, in which a relatively small amount is moved in a second direction substantially orthogonal to the moving direction, in the first direction of the polishing tool or in the opposite direction. The maximum movement position of the polishing tool is a position where a part of the polishing tool is separated from the processing surface of the workpiece and another part is in contact with the processing surface. 5. The polishing method according to claim 4, wherein a chamfering treatment is applied to an edge portion of the workpiece in the moving direction of the polishing tool in the first direction or the opposite direction. 6. A polishing tool is applied to a rotating small-diameter polishing tool against a work surface of a workpiece with a predetermined load, and the polishing tool is moved so that the tool path is cut back in a zigzag shape by plane projection. In the polishing method described above, the tip portion of the tool locus that is cut back in a zigzag shape is rounded into an arc shape or a trapezoid shape.