JP2003084265A - Method for polishing liquid crystal panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for polishing a liquid crystal panel. SOLUTION: The liquid crystal panel is subjected to polishing after a protective element 33 is stuck to pad regions 311, 312 arranged on a thin film transistor substrate 31. The protective element is removed from the thin film transistor substrate after polishing the liquid crystal panel.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal panel polishing method.

[0002]

2. Description of the Related Art Conventional methods for reducing the weight of a liquid crystal panel include a chemical mechanical polishing method (CMP), a chemical etching method, and a method using a low density glass substrate. The present invention is an improvement over the chemical mechanical polishing method.

There are two types of known chemical mechanical polishing methods. The first method is to combine a thin film transistor (TFT) substrate and a color filter (CF) substrate and then perform polishing. After that, cutting, liquid crystal injection / sealing, and polarizing plate bonding are performed.

However, as shown in FIG. 1, since the conventional polishing process is performed before the liquid crystal is injected, the sealing agent 12 must be provided to prevent the polishing liquid from seeping out to the panel 13. In addition, since the substrate is thinned by polishing, the difficulty of the subsequent steps increases. Further, a space for arranging the sealant 12 is also required, which reduces the usable area on the substrate.

The second method is to combine a thin film transistor substrate and a color filter substrate, then perform a cutting process, a liquid crystal injection / sealing process, a polishing process, and finally a polarizing plate. is there.

However, the following problem may occur in the second method. 1. As shown in FIG. 2, during polishing, the liquid crystal panel 2
The one pad area 22 is exposed, damaging the circuit and causing corrosion. 2. Antistatic (ESD) before the LCD panel is polished
Since the ring is removed by polishing, the liquid crystal panel is damaged by static electricity. If the antistatic ring is not removed before polishing, a step of removing the ESD ring must be performed after polishing the liquid crystal panel, which may result in thinning of the glass substrate.

[0007]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for polishing a liquid crystal panel, which can improve the yield of the liquid crystal panel without changing the conventional method as much as possible.

[0008]

According to one aspect of the present invention, there is provided a method of polishing a liquid crystal panel including a thin film transistor substrate having a pad area. The method comprises the steps of providing a protective element and protecting the protective element. The device comprises the steps of covering the pad area of the thin film transistor substrate, polishing the liquid crystal panel, and removing the protective element from the thin film transistor substrate.

In another aspect of the present invention, there is provided a method of polishing a liquid crystal panel having a thin film transistor substrate having a pad area and a color filter substrate. The liquid crystal panel is cut into a predetermined size in advance, and after injecting liquid crystal, it is sealed. The method provides a protection element and covers the pad area of the thin film transistor substrate with the protection element.
The liquid crystal panel is polished to remove the protective element from the thin film transistor substrate.

The protective element comprises a plurality of layers, the layer in contact with the pad area preferably being electrically conductive. The pad area of the thin film transistor substrate comprises a gate pad area and a data pad area, and the protective element covering the gate pad area and the protective element covering the data pad area may or may not be continuous.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the present invention will be described in detail below with reference to the drawings.

3a to 3c show a liquid crystal panel polishing method according to a first embodiment of the present invention. As shown in Figure 3a,
The liquid crystal panel 30 includes a thin film transistor substrate 31 and a color filter substrate 32. After the liquid crystal panel 30 is formed into a predetermined size, the liquid crystal is injected and the liquid crystal is sealed.
Then, the liquid crystal panel 30 is polished. A pad area including a gate pad area 312 and a data pad area 311 is provided on the thin film transistor substrate 31.

The liquid crystal panel polishing method of the present invention comprises the steps of preparing a protective element 33, as shown in FIG.
b, attaching the protective element 33 to cover the pad areas 311, 312 of the thin film transistor substrate 31, and the liquid crystal panel 3 as shown in FIG. 3c.
As described above, the protective element 33 is removed from the thin film transistor substrate 31 by polishing the protective element 33 from the thin film transistor substrate 31, and in the present invention, the protective element 33 is attached before the polishing step. The circuit (not shown) on the panel can be protected during the polishing step only by removing the protective element 33 after the above step, and no other sealant is required.
That is, the present invention does not change known steps as much as possible,
The liquid crystal panel can be reduced in weight, and the yield of finished liquid crystal panels can be improved.

The protective element 33 is composed of a plurality of layers, and the layer contacting the pad areas 311 and 312 is electrically conductive. Accordingly, when the protection element 33 is installed on the pad areas 311, 312 as shown in FIG. 3b, the protection element 332 contacting the gate pad area 312 and the protection element 331 contacting the data pad area 311 are continuous. Therefore, the protection element 33 has not only the function of the circuit protection film but also the effect of preventing static electricity.

FIG. 4 shows a liquid crystal panel polishing method according to the second embodiment of the present invention. In the second embodiment, the protection element 332 provided on the gate pad area 312 and the protection element 331 provided on the data pad area 311 are used. In this case, the data pad area 311 and the gate pad area 312 are not connected by the protection elements 331 and 332.

FIG. 5 shows a liquid crystal panel polishing method according to a third embodiment of the present invention. The third embodiment provides a polishing method of the liquid crystal panel 40 different from the first embodiment. The liquid crystal panel 40 shown in FIG. 5 is composed of a thin film transistor substrate 41 and a color filter 42, and a pad area including a gate pad area 412 and two data pad areas 411 is provided on the thin film transistor substrate 41.

The thin film transistor substrate 41 of FIG. 5 is shown in FIG.
Although it has one more data pad area as compared with the thin film transistor substrate 31, the protection element covering the other data pad area may be attached. in this way,
Even for different types of panels, the polishing method of the present invention can improve the product yield.

In FIG. 5, the protection element attached to the gate pad area 412 and the protection element attached to the data pad area 411 can be either continuous or non-continuous. In other words, the protective element may be integrated as in the first embodiment or may be divided as in the second embodiment.

[0019]

According to the panel polishing method of the present invention, the yield of products can be improved.

[Brief description of drawings]

FIG. 1 is a schematic plan view of a conventional liquid crystal panel.

FIG. 2 is a side view of another conventional liquid crystal panel.

FIG. 3 is a diagram showing a method of polishing a liquid crystal panel according to the first embodiment of the present invention.

FIG. 4 is a diagram showing a method of polishing a liquid crystal panel according to a second embodiment of the present invention.

FIG. 5 is a diagram showing a polishing method for a liquid crystal panel according to a third embodiment of the present invention.

[Explanation of symbols]

30, 40 ... Liquid crystal panel, 31, 41 ... TFT substrate, 3
2, 42 ... Color filter substrate, 33, 331, 332
... Protection element 311, 411 ... Data pad area, 31
2, 412 ... Gate pad area.

Claims (8)

[Claims] 1. A method of polishing a liquid crystal panel including a thin film transistor substrate having a pad area, the method comprising: providing a protective element; and covering the pad area of the thin film transistor substrate with the protective element. A polishing method comprising: (b); a step (c) of polishing the liquid crystal panel; and a step (d) of removing the protective element from the thin film transistor substrate. 2. The polishing method according to claim 1, wherein the protective element is composed of a plurality of layers, and the layer contacting the pad area is conductive. 3. In the step (c), the pad area comprises a gate pad area and a data pad area, and a protection element covering the gate pad area and a protection element covering the data pad area are continuously formed. The polishing method according to claim 2, wherein 4. In the step (c), the pad area comprises a gate pad area and a data pad area, and a protective element covering the gate pad area and a protective element covering the data pad area are continuous. The polishing method according to claim 2, wherein the polishing method is absent. 5. A method for polishing a liquid crystal panel, comprising a thin film transistor substrate having a pad area and a color filter substrate, cut into a predetermined size, filled with a liquid crystal, and sealed. (A), a step (b) of covering a pad area of the thin film transistor substrate with the protective element, a step (c) of polishing the liquid crystal panel, and a step of providing the protective element with the thin film transistor substrate. And a step (d) of removing from the polishing method. 6. The polishing method according to claim 5, wherein the protective element is composed of a plurality of layers, and the layer contacting the pad area is conductive. 7. In the step (c), the pad area comprises a gate pad area and a data pad area, and a protection element covering the gate pad area and a protection element covering the data pad area are continuously formed. The polishing method according to claim 6, wherein: 8. In the step (c), the pad area comprises a gate pad area and a data pad area, and a protection element covering the gate pad area and a protection element covering the data pad area are continuous. The polishing method according to claim 6, wherein the polishing method is absent.