JP2003082380A - Nonflammable aqueous cutting fluid composition and nonflammable aqueous cutting fluid - Google Patents
Nonflammable aqueous cutting fluid composition and nonflammable aqueous cutting fluidInfo
- Publication number
- JP2003082380A JP2003082380A JP2001271539A JP2001271539A JP2003082380A JP 2003082380 A JP2003082380 A JP 2003082380A JP 2001271539 A JP2001271539 A JP 2001271539A JP 2001271539 A JP2001271539 A JP 2001271539A JP 2003082380 A JP2003082380 A JP 2003082380A
- Authority
- JP
- Japan
- Prior art keywords
- cutting fluid
- salt
- acid
- water
- based cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002173 cutting fluid Substances 0.000 title claims abstract description 84
- 239000000203 mixture Substances 0.000 title claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 67
- 150000003839 salts Chemical class 0.000 claims abstract description 51
- 239000006061 abrasive grain Substances 0.000 claims abstract description 47
- 229920000642 polymer Polymers 0.000 claims abstract description 33
- 238000005520 cutting process Methods 0.000 claims abstract description 31
- 239000002253 acid Substances 0.000 claims abstract description 26
- -1 ferrous metals Chemical class 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000003021 water soluble solvent Substances 0.000 claims abstract description 11
- 239000002518 antifoaming agent Substances 0.000 claims abstract description 5
- 239000000314 lubricant Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000004034 viscosity adjusting agent Substances 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 24
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 19
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- 229910052783 alkali metal Inorganic materials 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000010453 quartz Substances 0.000 claims description 12
- 125000001931 aliphatic group Chemical group 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 10
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 7
- 239000011976 maleic acid Substances 0.000 claims description 7
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 7
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 4
- 229920001577 copolymer Polymers 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 229920001519 homopolymer Polymers 0.000 claims description 3
- 150000001340 alkali metals Chemical group 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000000178 monomer Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 4
- 230000007797 corrosion Effects 0.000 claims 1
- 239000003112 inhibitor Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 14
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract description 11
- 230000003449 preventive effect Effects 0.000 abstract description 6
- 239000003921 oil Substances 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 235000012239 silicon dioxide Nutrition 0.000 description 11
- 239000002480 mineral oil Substances 0.000 description 10
- 235000010446 mineral oil Nutrition 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000002002 slurry Substances 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 6
- 229910010271 silicon carbide Inorganic materials 0.000 description 6
- 238000013329 compounding Methods 0.000 description 5
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 5
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- 239000002736 nonionic surfactant Substances 0.000 description 4
- 229910052700 potassium Inorganic materials 0.000 description 4
- 239000011591 potassium Substances 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 4
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 4
- WWZKQHOCKIZLMA-UHFFFAOYSA-N Caprylic acid Natural products CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- BFSVOASYOCHEOV-UHFFFAOYSA-N 2-diethylaminoethanol Chemical compound CCN(CC)CCO BFSVOASYOCHEOV-UHFFFAOYSA-N 0.000 description 2
- GADSJKKDLMALGL-UHFFFAOYSA-N 2-propylbenzoic acid Chemical compound CCCC1=CC=CC=C1C(O)=O GADSJKKDLMALGL-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- AKNUHUCEWALCOI-UHFFFAOYSA-N N-ethyldiethanolamine Chemical compound OCCN(CC)CCO AKNUHUCEWALCOI-UHFFFAOYSA-N 0.000 description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 2
- BTZVDPWKGXMQFW-UHFFFAOYSA-N Pentadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCC(O)=O BTZVDPWKGXMQFW-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000004931 aggregating effect Effects 0.000 description 2
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- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000012459 cleaning agent Substances 0.000 description 2
- GJBRTCPWCKRSTQ-UHFFFAOYSA-N decanedioic acid Chemical compound OC(=O)CCCCCCCCC(O)=O.OC(=O)CCCCCCCCC(O)=O GJBRTCPWCKRSTQ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- QQHJDPROMQRDLA-UHFFFAOYSA-N hexadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)=O QQHJDPROMQRDLA-UHFFFAOYSA-N 0.000 description 2
- 229940051250 hexylene glycol Drugs 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
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- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
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- 239000007864 aqueous solution Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 description 1
- GONOPSZTUGRENK-UHFFFAOYSA-N benzyl(trichloro)silane Chemical compound Cl[Si](Cl)(Cl)CC1=CC=CC=C1 GONOPSZTUGRENK-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 230000005802 health problem Effects 0.000 description 1
- XEUHNWODXVYLFD-UHFFFAOYSA-N heptanedioic acid Chemical compound OC(=O)CCCCCC(O)=O.OC(=O)CCCCCC(O)=O XEUHNWODXVYLFD-UHFFFAOYSA-N 0.000 description 1
- YSFZWUJOBANROZ-UHFFFAOYSA-N heptylmalonic acid Chemical compound CCCCCCCC(C(O)=O)C(O)=O YSFZWUJOBANROZ-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- GPSDUZXPYCFOSQ-UHFFFAOYSA-N m-toluic acid Chemical compound CC1=CC=CC(C(O)=O)=C1 GPSDUZXPYCFOSQ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- DUWWHGPELOTTOE-UHFFFAOYSA-N n-(5-chloro-2,4-dimethoxyphenyl)-3-oxobutanamide Chemical compound COC1=CC(OC)=C(NC(=O)CC(C)=O)C=C1Cl DUWWHGPELOTTOE-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N n-hexanoic acid Natural products CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- TWHMVKPVFOOAMY-UHFFFAOYSA-N octanedioic acid Chemical compound OC(=O)CCCCCCC(O)=O.OC(=O)CCCCCCC(O)=O TWHMVKPVFOOAMY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000151 polyglycol Chemical class 0.000 description 1
- 239000010695 polyglycol Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 159000000000 sodium salts Chemical class 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C11/00—Selection of abrasive materials or additives for abrasive blasts
- B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lubricants (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】この発明は、油系設備に使用
可能な非引火性水系切削液組成物及び非引火性水系切削
液に関し、更に詳しくは、半導体結晶材料の単結晶シリ
コンや多結晶シリコン、石英、水晶、セラミック等のイ
ンゴットの切断加工に好適な水系切削液及びこれに砥粒
を配合したスラリー状の非引火性水系切削液に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-flammable water-based cutting fluid composition and a non-flammable water-based cutting fluid that can be used in oil-based equipment, and more specifically, single crystal silicon or polycrystalline silicon as a semiconductor crystal material. The present invention relates to a water-based cutting fluid suitable for cutting ingots such as quartz, quartz, and ceramics, and a non-flammable water-based cutting fluid in the form of slurry in which abrasive particles are mixed.
【0002】[0002]
【従来の技術】従来より、シリコンインゴット等の硬脆
材料の切断用の切削液に於いては、砥粒分散媒として、
主に鉱物油を主成分とする非水系の切削液が用いられて
いる。この非水系切削液は、切削油に炭化ケイ素等の砥
粒を1:1(重量比)の割合で分散させたスラリー状で
あり、このスラリーが切断加工面に連続供給される。切
り出されたウエハーの洗浄には、トリクロロエタンや塩
化メチレン等の塩素系有機溶剤や、高濃度の非イオン系
界面活性剤が洗浄液として用いられている。2. Description of the Related Art Conventionally, in cutting fluids for cutting hard and brittle materials such as silicon ingots, as an abrasive dispersion medium,
A non-aqueous cutting fluid mainly composed of mineral oil is used. This non-aqueous cutting fluid is a slurry in which abrasive grains such as silicon carbide are dispersed in cutting oil at a ratio of 1: 1 (weight ratio), and this slurry is continuously supplied to the cutting surface. A chlorine-based organic solvent such as trichloroethane or methylene chloride or a high-concentration nonionic surfactant is used as a cleaning liquid for cleaning the cut wafer.
【0003】しかし、鉱物油は引火性のある危険物であ
るため、防爆対策を施した設備が必要であり、貯蔵数量
等の制限もあり、環境保全や製造管理に問題が生じるお
それがある。また、鉱物油を用いて切断されたウエハー
の洗浄に用いられる上述のような塩素系有機溶剤の洗浄
剤は発ガン性を有しているため、安全衛生上問題があ
る。更に、大気汚染やオゾン層の破壊の主原因であると
して、近年使用が禁止されるに至っている。その代替洗
浄として、非イオン系界面活性剤が用いられているが、
この非イオン系界面活性剤の洗浄では、その洗浄力の低
さから大型の洗浄設備が必要となり、更には高濃度で使
用することが必要であるため、廃水処理や廃棄処理に問
題が生じている。However, since mineral oil is a flammable dangerous substance, explosion proof equipment is required and the storage quantity is limited, which may cause problems in environmental protection and manufacturing control. Further, the above-mentioned chlorine-based organic solvent cleaning agent used for cleaning a wafer cut with a mineral oil has a carcinogenic property, which is a safety and health problem. In addition, its use has been banned in recent years because it is the main cause of air pollution and destruction of the ozone layer. A nonionic surfactant is used as an alternative cleaning agent.
Cleaning of this nonionic surfactant requires a large cleaning facility due to its low cleaning power, and since it needs to be used at a high concentration, it causes problems in wastewater treatment and disposal. There is.
【0004】一方、鉱物油を主成分とせず、かつ切断工
程後に水での洗浄が可能なものとして、ポリオキシアル
キレングリコール及びその誘導体等の水溶性エーテル類
を主成分とするグリコールタイプの水可溶系の水溶性切
削液(特開平3−181598公報及び特開平11−1
98016公報参照)が提案されている。On the other hand, a glycol-type water containing water-soluble ethers such as polyoxyalkylene glycol and its derivatives as a main component, which does not contain mineral oil as a main component and can be washed with water after the cutting step, is used. Melting water-soluble cutting fluid (JP-A-3-181598 and JP-A-11-1)
98016) is proposed.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、グリコ
ールタイプの水溶性切削液は、引火点消失のために水を
配合する必要があるが、水分量が低くなると引火性を生
ずるという問題や、水分量を多く配合すると砥粒の分散
性が悪くなる等、製造管理に問題が生じている。また、
グリコールタイプの水溶性切削液は、水での洗浄が容易
であっても、洗浄水の廃水負荷が高く、廃液処理にも問
題を残している。また、鉱物油系切削液を使用していた
従来の設備に水溶性切削液を導入した場合、錆が発生し
てしまうため、設備の改良や専用設備の導入等の投資が
必要となっている。However, the glycol type water-soluble cutting fluid needs to be mixed with water in order to eliminate the flash point. However, when the water content is low, it causes flammability and the water content. When a large amount is mixed, the dispersibility of the abrasive grains deteriorates, which causes problems in manufacturing control. Also,
Even if the glycol type water-soluble cutting fluid is easy to wash with water, the waste water load of the washing water is high and there is a problem in waste fluid treatment. Also, if water-soluble cutting fluid is introduced into conventional equipment that used mineral oil-based cutting fluid, rust will occur, so investment is required to improve equipment and introduce specialized equipment. .
【0006】[0006]
【課題を解決するための手段】本発明はこのような従来
の問題点に着目してなされたものであって、特定のポリ
カルボン酸系高分子化合物及び/又はその塩と、カルボ
ン酸及び/又はその塩とを用いることにより、水を多く
配合した組成物でも砥粒の分散性が良好となり、硬脆材
料の切断加工への使用に際しても引火性の問題がなく、
油系設備に使用しても防錆性を発揮し、且つ、水での洗
浄が容易な非引火性水系切削液組成物を提供することが
可能となる。The present invention has been made by paying attention to such conventional problems, and a specific polycarboxylic acid type polymer compound and / or a salt thereof, a carboxylic acid and / or Or by using the salt thereof, the dispersibility of the abrasive grains becomes good even in a composition containing a large amount of water, and there is no problem of flammability when used for cutting hard and brittle materials,
It is possible to provide a non-flammable water-based cutting fluid composition that exhibits rust resistance even when used in oil-based equipment and is easy to wash with water.
【0007】即ち、本発明の非引火性水系切削液組成物
は、重量平均分子量が1,000〜200,000のポ
リカルボン酸系高分子化合物及び/又はその塩を5〜4
5重量%、並びにカルボン酸及び/又はその塩を0.0
5〜5重量%で含有していることを特徴とする。That is, the non-flammable water-based cutting fluid composition of the present invention comprises a polycarboxylic acid polymer compound having a weight average molecular weight of 1,000 to 200,000 and / or a salt thereof in an amount of 5 to 4
5% by weight and 0.0% of carboxylic acid and / or its salt
It is characterized by containing 5 to 5% by weight.
【0008】ポリカルボン酸系高分子化合物は砥粒粒子
に吸着し、保護コロイド効果により安定な分散効果を発
揮するものと考えられる。また、ポリカルボン酸系高分
子化合物の塩はイオン性が付与されているため、静電気
的な反発力を生じて更に優れた分散性が得られるものと
考えられる。このポリカルボン酸系高分子化合物の分子
量や配合量が1,000より低い場合には、粒子表面に
均一な保護コロイド層が形成されず、粒子間の反発力が
弱くなり、分散性や再分散性が悪くなるものと考えられ
る。また、分子量が200,000を超える場合には凝
集作用が現れ、再分散性が低下するものと考えられる。It is considered that the polycarboxylic acid type polymer compound is adsorbed on the abrasive grains and exhibits a stable dispersion effect due to the protective colloid effect. Further, since the salt of the polycarboxylic acid-based polymer compound is provided with ionicity, it is considered that an electrostatic repulsion force is generated and further excellent dispersibility is obtained. When the molecular weight or blending amount of this polycarboxylic acid type polymer compound is lower than 1,000, a uniform protective colloid layer is not formed on the particle surface, the repulsive force between particles becomes weak, and the dispersibility and redispersion are reduced. It is thought that the sex will deteriorate. Further, when the molecular weight exceeds 200,000, it is considered that the aggregating action appears and the redispersibility decreases.
【0009】加えて、本発明の非引火性水系切削液組成
物は、前記カルボン酸及び/又はその塩を0.05〜5
重量%で含有している。カルボン酸及びその塩は、防錆
性の機能を高めるために加えられる。In addition, the non-flammable water-based cutting fluid composition of the present invention contains the carboxylic acid and / or its salt in an amount of 0.05-5.
It is contained by weight%. Carboxylic acid and its salts are added to enhance the anticorrosive function.
【0010】本発明の非引火性水系切削液組成物は、水
溶性溶剤、潤滑剤、粘性調整剤、非鉄金属用防食剤及び
消泡剤からなる群から選択される少なくとも1種の添加
補助剤を更に含有していてもよい。中でも、前記添加補
助剤として、ポリオキシアルキレングリコール及びその
誘導体から選択される水溶性溶剤の1種又は2種以上を
含有しているものが好ましい。The non-flammable water-based cutting fluid composition of the present invention comprises at least one additive aid selected from the group consisting of water-soluble solvents, lubricants, viscosity modifiers, anti-corrosion agents for non-ferrous metals and defoamers. May be further contained. Among them, those containing one or more water-soluble solvents selected from polyoxyalkylene glycols and their derivatives as the above-mentioned addition aid are preferable.
【0011】前記ポリカルボン酸系高分子化合物及び/
又はその塩は、アクリル酸、マレイン酸及びメタクリル
酸からなる群から選択されるモノマーの1種又は2種以
上から調製されるポリマー、該ポリマーのアルカリ金属
塩、該ポリマーのオニウム塩及びこれらの1種又は2種
以上の混合物からなる群から選択されるものであること
が好ましい。The polycarboxylic acid type polymer compound and /
Alternatively, the salt thereof is a polymer prepared from one or more monomers selected from the group consisting of acrylic acid, maleic acid and methacrylic acid, an alkali metal salt of the polymer, an onium salt of the polymer and one of these. It is preferably selected from the group consisting of one kind or a mixture of two or more kinds.
【0012】また、前記ポリカルボン酸系高分子化合物
及び/又はその塩は、化3の一般式(1)で示すポリマ
ーであることが好ましい。Further, the polycarboxylic acid type polymer compound and / or its salt is preferably a polymer represented by the general formula (1).
【0013】[0013]
【化3】 [Chemical 3]
【0014】ここで、一般式(1)に於いて、Rは水素
原子又はメチル基であり、M1、M2、及びM3は、水素
原子、アルカリ金属原子又はオニウムの何れかであって
同じか又は互いに異なってもよい。nは1以上の整数、
mは0以上の整数である。In the general formula (1), R is a hydrogen atom or a methyl group, and M 1 , M 2 and M 3 are any of a hydrogen atom, an alkali metal atom or onium. It may be the same or different from each other. n is an integer of 1 or more,
m is an integer of 0 or more.
【0015】前記カルボン酸及び/又はその塩は、化4
の一般式(2)で示す脂肪族ジカルボン酸、該脂肪族ジ
カルボン酸のアルカリ金属塩及び該脂肪族ジカルボン酸
のオニウム塩からなる群から選択されるものであること
が好ましい。The carboxylic acid and / or its salt is
Is preferably selected from the group consisting of the aliphatic dicarboxylic acid represented by the general formula (2), the alkali metal salt of the aliphatic dicarboxylic acid, and the onium salt of the aliphatic dicarboxylic acid.
【0016】[0016]
【化4】 [Chemical 4]
【0017】ここで、一般式(2)に於いて、kは6〜
12の整数である。Here, in the general formula (2), k is 6 to
It is an integer of 12.
【0018】本発明の非引火性水系切削液は、上記非引
火性水系切削液組成物と、砥粒とを含有することを特徴
とする。The non-flammable water-based cutting fluid of the present invention is characterized by containing the above non-flammable water-based cutting fluid composition and abrasive grains.
【0019】ここで、前記砥粒の粒径は、0.5〜50
μmであることが好ましい。また、非引火性水系切削液
組成物と砥粒とを、重量比1:0.5〜1:1.5の割
合で分散させた切削液が好ましい。Here, the grain size of the abrasive grains is 0.5 to 50.
It is preferably μm. Further, a cutting fluid in which a non-flammable water-based cutting fluid composition and abrasive grains are dispersed in a weight ratio of 1: 0.5 to 1: 1.5 is preferable.
【0020】このような本発明の非引火性水系切削液
は、ワイヤーソー又はバンドソーに好適に使用され、特
に、硬脆材料からなるインゴットの切断に好適に使用さ
れる。前記硬脆材料としては、シリコン、石英及び水晶
から選択されるものを挙げることができる。The non-flammable water-based cutting fluid of the present invention is preferably used for a wire saw or a band saw, and particularly preferably for cutting an ingot made of a hard and brittle material. Examples of the hard and brittle material include materials selected from silicon, quartz and quartz.
【0021】[0021]
【発明の実施の形態】以下、本発明の実施の形態につい
て説明する。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
【0022】本発明に用いられるポリカルボン酸系高分
子化合物として、アクリル酸、マレイン酸若しくはメタ
クリル酸のホモポリマー若しくはコポリマー、又はこれ
らとエチレン、プロピレン、スチレン、メタクリル酸エ
ステル、マレイン酸モノエステル、マレイン酸ジエステ
ル、酢酸ビニル等とのコポリマーを使用することができ
る。また、上記ポリカルボン酸系高分子化合物のアルカ
リ金属塩及び/又はオニウム塩も使用することができ
る。ここで、塩の種類としては、ナトリウム、カリウ
ム、リチウム等の金属イオンの塩、アンモニア、モノエ
タノールアミン、ジエタノールアミン、トリエタノール
アミン、メチルアミン、ジメチルアミン、トリメチルア
ミン、エチルアミン、ジエチルアミン、トリエチルアミ
ン、メチルエタノールアミン、ジメチルエタノールアミ
ン、メチルジエタノールアミン、エチルエタノールアミ
ン、ジエチルエタノールアミン、エチルジエタノールア
ミン等のオニウムイオンの塩が挙げられる。これらの塩
のうち、好ましいものは、ナトリウム、カリウム、アン
モニア、モノエタノールアミン及びジエタノールアミン
の塩である。As the polycarboxylic acid type polymer compound used in the present invention, homopolymers or copolymers of acrylic acid, maleic acid or methacrylic acid, or ethylene, propylene, styrene, methacrylic acid ester, maleic acid monoester, maleic acid with these. Copolymers with acid diesters, vinyl acetate and the like can be used. Further, an alkali metal salt and / or onium salt of the above polycarboxylic acid type polymer compound can also be used. Here, as the type of salt, salts of metal ions such as sodium, potassium and lithium, ammonia, monoethanolamine, diethanolamine, triethanolamine, methylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, methylethanolamine , Salts of onium ions such as dimethylethanolamine, methyldiethanolamine, ethylethanolamine, diethylethanolamine and ethyldiethanolamine. Of these salts, the preferred ones are sodium, potassium, ammonia, monoethanolamine and diethanolamine salts.
【0023】上記のポリカルボン酸系高分子化合物のう
ち、特に好適に使用されるのは、前述の化3の一般式
(1)で示されるアクリル酸のホモポリマー及び/又は
アクリル酸とマレイン酸のコポリマーのアルカリ金属塩
及び/又はオニウム塩である。Among the above-mentioned polycarboxylic acid type polymer compounds, particularly preferably used are homopolymers of acrylic acid represented by the general formula (1) of Chemical Formula 3 and / or acrylic acid and maleic acid. Alkali metal salt and / or onium salt of the copolymer of
【0024】ポリカルボン酸系高分子化合物及び/又は
その塩の重量平均分子量は、1,000〜200,00
0であることが好ましいが、5,000〜20,000
のものが取り扱い易く、水溶液にしたときに適正な粘度
が得られる。分子量が1,000未満の場合は、砥粒の
分散能力が低く、50重量%を超える配合量が必要とな
り、廃水負荷が増大する。分子量が200,000を超
える場合は、適正な粘度を得るために配合量を低くする
必要が生じ、加えて砥粒の分散性が低下する。The weight average molecular weight of the polycarboxylic acid type polymer compound and / or its salt is 1,000 to 200,000.
0 is preferable, but 5,000 to 20,000
The product is easy to handle, and an appropriate viscosity can be obtained when it is made into an aqueous solution. If the molecular weight is less than 1,000, the dispersibility of the abrasive grains is low, and a compounding amount of more than 50% by weight is required, and the waste water load increases. When the molecular weight is more than 200,000, it is necessary to reduce the compounding amount in order to obtain an appropriate viscosity, and in addition, the dispersibility of abrasive grains is lowered.
【0025】ポリカルボン酸系高分子化合物及び/又は
その塩の配合量の下限は、5重量%以上、好ましくは2
0重量%以上であり、上限は45重量%以下、好ましく
は40重量%以下である。配合量が5重量%未満の場
合、十分な砥粒分散性が得られず、45重量%を超える
と、切削液の粘度が上昇して砥粒の混合が困難となり、
切削装置への連続供給も不可能となる。The lower limit of the compounding amount of the polycarboxylic acid type polymer compound and / or its salt is 5% by weight or more, preferably 2%.
It is 0% by weight or more, and the upper limit is 45% by weight or less, preferably 40% by weight or less. If the content is less than 5% by weight, sufficient dispersibility of abrasive grains cannot be obtained, and if it exceeds 45% by weight, the viscosity of the cutting fluid increases and it becomes difficult to mix the abrasive grains.
Continuous supply to the cutting equipment is also impossible.
【0026】本発明に用いられるカルボン酸として、プ
ロパン酸、ブタン酸、ペンタン酸、ヘキサン酸、ヘプタ
ン酸、オクタン酸、ノナン酸、デカン酸、ウンデカン
酸、ドデカン酸、テトラデカン酸、ヘプタデカン酸、オ
クタデカン酸、オレイン酸等の脂肪族モノカルボン酸、
安息香酸、o−メチル安息香酸(トルイル酸)、m−メ
チル安息香酸、p−メチル安息香酸、o−エチル安息香
酸、m−エチル安息香酸、p−エチル安息香酸、o−プ
ロピル安息香酸、m−プロピル安息香酸、p−プロピル
安息香酸、p−t−ブチル安息香酸、ナフタレンカルボ
ン酸等の芳香族モノカルボン酸、シュウ酸、マロン酸、
コハク酸、グルタル酸、アジピン酸、ヘプタン二酸(ピ
メリン酸)、オクタン二酸(スべリン酸)、ノナン二酸
(アゼライン酸)、デカン二酸(セバシン酸)、ウンデ
カン二酸、ドデカン二酸、トリデカン二酸、テトラデカ
ン二酸、ペンタデカン二酸、ヘキサデカン二酸等の脂肪
族ジカルボン酸、フタル酸、イソフタル酸、テレフタル
酸等の芳香族ジカルボン酸を挙げることができる。ま
た、これらのアルカリ金属塩及びオニウム塩も使用する
ことができる。この塩の種類としては、ナトリウム、カ
リウム、リチウム等の金属イオンの塩、アンモニア、モ
ノエタノールアミン、ジエタノールアミン、トリエタノ
ールアミン、メチルアミン、ジメチルアミン、トリメチ
ルアミン、エチルアミン、ジエチルアミン、トリエチル
アミン、メチルエタノールアミン、ジメチルエタノール
アミン、メチルジエタノールアミン、エチルエタノール
アミン、ジエチルエタノールアミン、エチルジエタノー
ルアミン等のオニウムイオンの塩が挙げられる。これら
の塩うち、好ましいのは、ナトリウム、カリウム、アン
モニア、モノエタノールアミン及びジエタノールアミン
の塩である。Examples of the carboxylic acid used in the present invention include propanoic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, undecanoic acid, dodecanoic acid, tetradecanoic acid, heptadecanoic acid, octadecanoic acid. , Aliphatic monocarboxylic acids such as oleic acid,
Benzoic acid, o-methylbenzoic acid (toluic acid), m-methylbenzoic acid, p-methylbenzoic acid, o-ethylbenzoic acid, m-ethylbenzoic acid, p-ethylbenzoic acid, o-propylbenzoic acid, m -Aromatic monocarboxylic acids such as propylbenzoic acid, p-propylbenzoic acid, pt-butylbenzoic acid and naphthalenecarboxylic acid, oxalic acid, malonic acid,
Succinic acid, glutaric acid, adipic acid, heptanedioic acid (pimelic acid), octanedioic acid (suberic acid), nonanedioic acid (azelaic acid), decanedioic acid (sebacic acid), undecanedioic acid, dodecanedioic acid And aliphatic dicarboxylic acids such as tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, and hexadecanedioic acid, and aromatic dicarboxylic acids such as phthalic acid, isophthalic acid, and terephthalic acid. Further, these alkali metal salts and onium salts can also be used. The types of salts include salts of metal ions such as sodium, potassium and lithium, ammonia, monoethanolamine, diethanolamine, triethanolamine, methylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, methylethanolamine, dimethyl. Salts of onium ions such as ethanolamine, methyldiethanolamine, ethylethanolamine, diethylethanolamine, ethyldiethanolamine and the like can be mentioned. Of these salts, the salts of sodium, potassium, ammonia, monoethanolamine and diethanolamine are preferable.
【0027】特に好適なカルボン酸は、化4の一般式
(2)で示される脂肪族ジカルボン酸のアルカリ金属塩
及びアンモニウム塩、並びにアルカノールアミン塩の中
和物であり、具体的にはオクタン二酸(スベリン酸)、
ノナン二酸(アゼライン酸)、デカン二酸(セバシン
酸)、ウンデカン二酸、ドデカン二酸、トリデカン二
酸、テトラデカン二酸等のナトリウム塩、ジエタノール
アミン塩等である。これらは、発泡性が低く、消泡剤の
添加補助剤を必要としない。Particularly preferred carboxylic acid is a neutralized product of an alkali metal salt and an ammonium salt of an aliphatic dicarboxylic acid represented by the general formula (2) of Chemical formula 4, and an alkanolamine salt, and specifically, octane dicarboxylic acid. Acid (suberic acid),
Examples thereof include sodium salts of nonanedioic acid (azelaic acid), decanedioic acid (sebacic acid), undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, and diethanolamine salts. These have a low foaming property and do not require an auxiliary agent for adding an antifoaming agent.
【0028】カルボン酸及び/又はその塩の配合量の下
限は、0.05重量%以上、好ましくは0.2重量%以
上であり、上限は5重量%以下、好ましくは2重量%以
下である。配合量が0.05重量%未満の場合、十分な
防錆性が得られず、5重量%を超えると、分散性が低下
し、砥粒の混合が困難となるとともに、切削装置への連
続供給も不可能となる。The lower limit of the blending amount of the carboxylic acid and / or its salt is 0.05% by weight or more, preferably 0.2% by weight or more, and the upper limit is 5% by weight or less, preferably 2% by weight or less. . If the blending amount is less than 0.05% by weight, sufficient rust preventive properties cannot be obtained, and if it exceeds 5% by weight, dispersibility decreases, and it becomes difficult to mix the abrasive grains, and continuous to the cutting device. Supply will also be impossible.
【0029】非引火性水系切削液に配合する水分量は5
0重量%以上であり、50重量%未満の場合、ポリカル
ボン酸塩型高分子化合物を均一に溶解することができな
くなるので好ましくない。また、水分量を50重量%以
上配合することにより、切断後の被切断物(ウエハー
等)の洗浄に於いても、水のみでスラリー状の本発明の
非引火性水系切削液の除去が可能となり、洗浄が容易と
なる。また、本発明の切削液は、中和塩にすることによ
りpH7〜9に調整することが好ましく、pH4以下の
酸性領域では、鉄系素材に発錆が認められ、pH10以
上のアルカリ領域では手に付着した場合、手荒れ等を生
じる懸念がある。The water content of the non-flammable water-based cutting fluid is 5
If it is 0% by weight or more and less than 50% by weight, the polycarboxylic acid salt type polymer compound cannot be uniformly dissolved, which is not preferable. Further, by blending the water content of 50% by weight or more, it is possible to remove the slurry of the non-flammable water-based cutting fluid of the present invention only with water even when washing the cut object (wafer, etc.) after cutting. Therefore, cleaning becomes easy. In addition, the cutting fluid of the present invention is preferably adjusted to pH 7 to 9 by using a neutralizing salt. Rust is recognized in the iron-based material in the acidic region of pH 4 or less, and the rust is detected in the alkaline region of pH 10 or more. If it adheres to the skin, there is a risk of rough hands.
【0030】本発明の非引火性水系切削液には、所望に
より各種の添加補助剤を配合してもよい。このような添
加補助剤として、水溶性溶剤、潤滑剤、粘性調整剤、非
鉄金属用防食剤、消泡剤等を挙げることができる。水溶
性溶剤の例としては、エチレングリコール、ジエチレン
グリコール、トリエチレングリコール、プロピレングリ
コール、ジプロピレングリコール、トリプロピレングリ
コール、ヘキシレングリコール、グリセリン、ポリエチ
レングリコール、ポリプロピレングリコール、ポリエチ
レングリコール−ポリブロピレングリコール共重合体、
ヘキシレングリコール、1,3−プロパンジオール、
1,4−ブタンジオール、1,6−ヘキサンジオール、
ペンタエリストール、ソルビトール、エチレングリコー
ルモノメチルエーテル、エチレングリコールモノエチル
エーテル、エチレングリコールモノブチルエーテル、ジ
エチレングリコールモノメチルエーテル、ジエチレング
リコールモノエチルエーテル、ジエチレングリコールモ
ノブチルエーテル、トリエチレングリコールモノメチル
エーテル、トリエチレングリコールモノエチルエーテ
ル、トリエチレングリコールモノブチルエーテル、プロ
ピレングリコールモノメチルエーテル、ジプロピレング
リコールモノメチルエーテル、トリプロピレングリコー
ルモノメチルエーテル及びこれらの混合物を挙げること
ができる。また、潤滑剤として、例えば非イオン界面活
性剤、アニオン界面活性剤、脂肪酸、脂肪酸重縮合物等
を挙げることができる。粘性調整剤としては、例えばベ
ントナイト、水性シリカゾル、ポリビニルピロリドン、
カルボキシメチルセルロース等を挙げることができる。
非鉄金属用防食剤として、例えばベンゾトリアゾール系
化合物等を挙げることができ、消泡剤としては、例えば
シリコーン系、アセチレンジオール系、ポリグリコール
系のものや、アルコール類等を挙げることができる。特
に好適な添加補助剤は、水溶性溶剤であるエチレングリ
コール、ジエチレングリコール、プロピレングリコール
等のポリオキシアルキレングリコール系溶剤であり、こ
れらは砥粒の沈降防止に効果的である。If desired, various additives may be added to the non-flammable water-based cutting fluid of the present invention. Examples of such addition aids include water-soluble solvents, lubricants, viscosity modifiers, anti-corrosion agents for non-ferrous metals, defoaming agents and the like. Examples of the water-soluble solvent include ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, dipropylene glycol, tripropylene glycol, hexylene glycol, glycerin, polyethylene glycol, polypropylene glycol, polyethylene glycol-polypropylene glycol copolymer. ,
Hexylene glycol, 1,3-propanediol,
1,4-butanediol, 1,6-hexanediol,
Pentaerythritol, sorbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene Mention may be made of glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether and mixtures thereof. Further, examples of the lubricant include nonionic surfactants, anionic surfactants, fatty acids, and fatty acid polycondensates. Examples of the viscosity modifier include bentonite, aqueous silica sol, polyvinylpyrrolidone,
Carboxymethyl cellulose etc. can be mentioned.
Examples of the anticorrosive agent for non-ferrous metals include benzotriazole compounds, and examples of the defoaming agent include silicone compounds, acetylene diol compounds, polyglycol compounds, and alcohols. A particularly suitable addition aid is a polyoxyalkylene glycol-based solvent such as ethylene glycol, diethylene glycol, or propylene glycol, which is a water-soluble solvent, and these are effective for preventing sedimentation of abrasive grains.
【0031】本発明の非引火性水系切削液に分散させる
砥粒は特に制限されるものではなく、炭化ケイ素、酸化
アルミニウム、酸化ジルコニウム、二酸化ケイ素、二酸
化セシウム、ダイヤモンド等が挙げられる。砥粒の平均
粒径は0.5〜50μmが好ましく、より好ましくは5
〜30μmである。砥粒の平均粒径が50μmを超える
と、砥粒の沈降速度が速くなり、分散しにくくなる。ま
た、砥粒の平均粒径が0.5μmより小さいと、切削液
の切削能力が低下するので好ましくない。非引火性水系
切削液1に対して、砥粒の配合割合の下限は0.5(重
量比)以上であり、好ましくは0.8以上である。ま
た、砥粒の配合割合の上限は、1.5(重量比)以下で
あり、好ましくは1.2以下である。砥粒の配合割合が
0.5未満の場合は、スラリー中の砥粒量が少な過ぎ、
切断加工に長時間を有する。また、砥粒の配合割合が
1.5を超えると、砥粒の分散性が悪く、本発明のスラ
リー状の切削液の切削装置への連続供給も困難となるの
で好ましくない。The abrasive grains to be dispersed in the non-flammable water-based cutting fluid of the present invention are not particularly limited, and examples thereof include silicon carbide, aluminum oxide, zirconium oxide, silicon dioxide, cesium dioxide and diamond. The average grain size of the abrasive grains is preferably 0.5 to 50 μm, more preferably 5
˜30 μm. When the average particle size of the abrasive grains exceeds 50 μm, the sedimentation speed of the abrasive grains is increased and it becomes difficult to disperse the abrasive grains. If the average grain size of the abrasive grains is smaller than 0.5 μm, the cutting ability of the cutting fluid is reduced, which is not preferable. The lower limit of the compounding ratio of the abrasive grains to the non-flammable water-based cutting fluid 1 is 0.5 (weight ratio) or more, preferably 0.8 or more. Further, the upper limit of the mixing ratio of the abrasive grains is 1.5 (weight ratio) or less, and preferably 1.2 or less. If the mixing ratio of the abrasive grains is less than 0.5, the amount of abrasive grains in the slurry is too small,
It takes a long time for cutting. Further, if the mixing ratio of the abrasive grains exceeds 1.5, the dispersibility of the abrasive grains is poor and it becomes difficult to continuously supply the cutting fluid in the form of slurry of the present invention to the cutting device, which is not preferable.
【0032】本発明の非引火性水系切削液は硬脆材料の
切断に使用され、この硬脆材料には特に制限ないが、単
結晶シリコン、多結晶シリコン、石英、水晶、ガラス、
ガリウム−ヒ素、セラッミク等の硬脆材料に好適に使用
することができ、より好ましくは、単結晶シリコンイン
ゴット又は石英(水晶)インゴットに適用される。ま
た、本発明の非引火性水系切削液は、遊離砥粒を用い、
硬脆材料の切断を行う切削装置であれば何れのタイプで
も使用可能であるが、好ましい切削装置としては、例え
ばワイヤーソー、バンドソー等が挙げられる。The non-flammable water-based cutting fluid of the present invention is used for cutting hard and brittle materials, and the hard and brittle materials are not particularly limited, but single crystal silicon, polycrystalline silicon, quartz, quartz, glass,
It can be preferably used for hard and brittle materials such as gallium-arsenic and ceramics, and more preferably applied to a single crystal silicon ingot or a quartz (quartz) ingot. Further, the non-flammable water-based cutting fluid of the present invention uses free abrasive grains,
Any type of cutting device can be used as long as it is a cutting device for cutting hard and brittle materials, but preferable cutting devices include, for example, a wire saw and a band saw.
【0033】[0033]
【実施例】次に、本発明を実施例及び比較例に基づいて
説明するが、本発明はこれら実施例に限定されるもので
はない。EXAMPLES Next, the present invention will be explained based on Examples and Comparative Examples, but the present invention is not limited to these Examples.
【0034】(実施例1〜18及び比較例1〜10)表
1及び表2に記載した各成分を、記載した割合にて配合
し、切削液組成物を得た。得られた切削液組成物に砥粒
を加えて切削液を調製し、各切削液の分散性、再分散
性、粘度変化、切断加工精度、洗浄性及び防錆性を、次
のようにして調べ、その結果を表3及び表4に示した。(Examples 1 to 18 and Comparative Examples 1 to 10) The components shown in Tables 1 and 2 were blended in the proportions shown to obtain cutting fluid compositions. A cutting fluid was prepared by adding abrasive grains to the obtained cutting fluid composition, and the dispersibility of each cutting fluid, redispersibility, viscosity change, cutting accuracy, cleaning property and rust preventive property were measured as follows. The results are shown in Tables 3 and 4.
【0035】[0035]
【表1】 [Table 1]
【0036】[0036]
【表2】 [Table 2]
【0037】(砥粒の分散性と再分散性)表1及び表2
に挙げる切削剤組成物500gと炭化ケイ素砥粒(GP
#800、(株)フジミインコーポレーテッド製)500
gとを1,000mlのポリ容器に採取し、室温(25
℃)にてホモディスパー(特殊機化工業(株)製)を用
い、回転速度3,000rpmで3分間撹拌し、均一な
スラリー状の非引火性水系切削液を得た。(Dispersibility and Redispersibility of Abrasive Grains) Tables 1 and 2
500 g of the cutting agent composition and silicon carbide abrasive grains (GP
# 800, made by Fujimi Incorporated) 500
g and 1,000 ml in a plastic container and store at room temperature (25
(C) using a homodisper (manufactured by Tokushu Kika Kogyo Co., Ltd.) at a rotation speed of 3,000 rpm for 3 minutes to obtain a uniform slurry-like non-flammable water-based cutting fluid.
【0038】この水系切削液100mlを100mlの
ネスラー管(直径24mm、高さ200mm)に入れ、
静置後1時間、6時間、24時間及び48時間のそれぞ
れの時点で、下層の砥粒の容量の測定と沈降状態の観察
を行った。下層の容量の大きいものは上部分離水量が少
なく、砥粒の分散性に優れていると判断することができ
る。100 ml of this water-based cutting fluid was put into a 100 ml Nessler tube (diameter 24 mm, height 200 mm),
At 1 hour, 6 hours, 24 hours and 48 hours after standing, the volume of the lower layer abrasive grains was measured and the sedimentation state was observed. It can be judged that the lower layer having a large capacity has a small amount of upper separated water and is excellent in the dispersibility of the abrasive grains.
【0039】砥粒の再分散性については、静置48時間
後に、スラリーの入ったネスラー管を水平に傾け、砥粒
層の流動性から、以下のような基準で判断した。The redispersibility of the abrasive grains was judged by the following criteria from the fluidity of the abrasive grain layer after tilting the Nessler tube containing the slurry horizontally after 48 hours of standing.
【0040】 ◎…砥粒層の全体がスムーズに流動する ○…砥粒層の全体がゆっくり流動する △…砥粒層上部のみが流動する ×…砥粒層が殆ど流動しない。[0040] ◎… The entire abrasive grain layer flows smoothly ○: The entire abrasive grain layer slowly flows △: Only the upper part of the abrasive layer flows X: The abrasive grain layer hardly flows.
【0041】表3及び表4から明らかなように、各実施
例の非引火性水系切削液は、鉱物油系の切削液(比較例
10)に匹敵する安定な分散効果を発揮している。これ
は、各実施例の非引火性水系切削液に配合されているポ
リカルボン酸系高分子化合物が、砥粒粒子に吸着して保
護コロイドを形成していることを示している。また、ポ
リカルボン酸系高分子化合物のアルカリ金属塩及びオニ
ウム塩はイオン性を有しているため、静電気的な反発力
が発揮されるものと考えられ、更に優れた分散性が得ら
れている。ポリカルボン酸系高分子化合物が一定の分子
量以下である場合や配合量が低い場合には、粒子表面に
均一な保護コロイド層が形成されず、粒子間の反発力が
弱くなるものと考えられ、分散性や再分散性が低下して
いる。また、分子量が20万を超える場合は、凝集作用
が発現し、再分散性が低下している。As is clear from Tables 3 and 4, the non-flammable water-based cutting fluid of each Example exhibits a stable dispersion effect comparable to the mineral oil-based cutting fluid (Comparative Example 10). This indicates that the polycarboxylic acid type polymer compound blended in the non-flammable water-based cutting fluid of each example is adsorbed on the abrasive grain to form a protective colloid. Further, since the alkali metal salt and onium salt of the polycarboxylic acid type polymer compound have ionicity, it is considered that electrostatic repulsion force is exerted, and further excellent dispersibility is obtained. . When the polycarboxylic acid polymer compound has a certain molecular weight or less or when the compounding amount is low, it is considered that a uniform protective colloid layer is not formed on the particle surface and the repulsive force between particles becomes weak, Dispersibility and redispersibility are reduced. Further, when the molecular weight exceeds 200,000, the aggregating action is exhibited and the redispersibility is deteriorated.
【0042】(粘度変化)表1及び表2に挙げる切削液
組成物500gと炭化ケイ素砥粒(GP#800、(株)
フジミインコーポレーテッド製)500gとを1,00
0mlのポリ容器に採取し、室温(25℃)にてホモデ
ィスパー(特殊機化工業(株)製)回転速度3,000r
pmで3分間撹拌し、均一なスラリー状の非引火性水系
切削液を得た。この水系切削液について25℃での粘度
をBM型粘度計で測定した。次に、ホモミキサー(ディ
スパー羽根)を用いて回転速度10,000rpmにて
1時間撹拌し、25℃に調温した後、粘度を測定した。
撹拌前後の粘度変化率=(10,000rpmで1時間
撹拌後の粘度)/(撹拌前の粘度)を求め、剪断力によ
る影響を調べた。粘度変化率が1に近いほど、インゴッ
ト等の切断時に於ける粘度変化が少なく、安定した加工
性が得られることを示している。(Viscosity Change) 500 g of the cutting fluid composition listed in Tables 1 and 2 and silicon carbide abrasive grains (GP # 800, manufactured by Co., Ltd.)
Made by Fujimi Incorporated) 500g and 1,00
Collect in a 0 ml poly container and rotate at room temperature (25 ° C) with a homodisper (manufactured by Tokushu Kika Kogyo Co., Ltd.) rotation speed of 3,000r.
The mixture was stirred at pm for 3 minutes to obtain a uniform slurry-like non-flammable water-based cutting fluid. The viscosity of this water-based cutting fluid at 25 ° C. was measured with a BM type viscometer. Next, using a homomixer (disper blade), the mixture was stirred at a rotation speed of 10,000 rpm for 1 hour, adjusted to 25 ° C., and then the viscosity was measured.
The rate of change in viscosity before and after stirring = (viscosity after stirring for 1 hour at 10,000 rpm) / (viscosity before stirring) was determined, and the effect of shearing force was investigated. It is shown that the closer the viscosity change rate is to 1, the smaller the viscosity change at the time of cutting an ingot or the like and the more stable workability can be obtained.
【0043】表3及び表4から明らかなように、各実施
例の非引火性水系切削液を用いた場合、比較例の切削液
に比較して粘度変化が小さく、鉱物油系の切削液(比較
例10)と同等以上の粘度安定性を有していることが分
かる。As is clear from Tables 3 and 4, when the non-flammable water-based cutting fluid of each Example is used, the viscosity change is smaller than that of the cutting fluid of Comparative Example, and the mineral oil-based cutting fluid ( It can be seen that it has a viscosity stability equal to or higher than that of Comparative Example 10).
【0044】(切断加工精度)表1及び表2に挙げる切
削液組成物と炭化ケイ素砥粒(GP#800、(株)フジ
ミインコーポレーテッド製)とを1:1(重量比)で撹
拌混合し、均一なスラリー状の非引火性水系切削液を得
た。この切削液を用い、ワイヤー線径が180μmのワ
イヤーソー切削装置にて、8インチ径の単結晶シリコン
インゴットの切断加工を行ない、切断されたウエハーの
加工精度を評価した。(Cutting processing accuracy) The cutting fluid compositions listed in Tables 1 and 2 and silicon carbide abrasive grains (GP # 800, manufactured by Fujimi Incorporated) were stirred and mixed at a ratio of 1: 1 (weight ratio). A non-flammable water-based cutting fluid in the form of a uniform slurry was obtained. Using this cutting fluid, an 8-inch diameter single crystal silicon ingot was cut with a wire saw cutting device having a wire wire diameter of 180 μm, and the processing accuracy of the cut wafer was evaluated.
【0045】加工精度はウエハーのソリ(WARP、中
央部と外周部を合わせ計5点の高さの差の最大値)を測
定し、10枚の平均値を求め、以下の基準で切断加工精
度を判定した。The processing accuracy is measured by measuring the warp of the wafer (WARP, the maximum value of the height difference between the central part and the outer peripheral part at a total of 5 points), obtaining the average value of 10 wafers, and the cutting processing accuracy according to the following criteria. Was judged.
【0046】 ◎…0μm以上〜10μm未満 ○…10μm以上〜20μm未満 △…20μm以上〜30μm未満 ×…30μm以上のもの。[0046] ◎ ... 0 μm or more and less than 10 μm ○: 10 μm or more and less than 20 μm Δ: 20 μm or more and less than 30 μm X: 30 μm or more.
【0047】表3及び表4から明らかなように、各実施
例の非引火性水系切削液を用いた場合、比較例の切削液
に比較して切断加工精度が高く、鉱物油系の切削液(比
較例10)と同等以上の切断加工精度を発揮し得ること
が分かる。As is clear from Tables 3 and 4, when the non-flammable water-based cutting fluid of each example is used, the cutting accuracy is higher than that of the comparative example, and the mineral oil-based cutting fluid is used. It can be seen that cutting processing accuracy equal to or higher than that of (Comparative Example 10) can be exhibited.
【0048】(洗浄性)表1及び表2に挙げる切削液組
成物500gと炭化ケイ素砥粒(GP#800、(株)フ
ジミインコーポレーテッド製)500gとを1,000
mlのポリ容器に採取し、室温(25℃)にてホモミキ
サー(ディスパー羽根)回転速度3,000rpmで3
分間撹拌し、均一なスラリー状の非引火性水系切削液を
得た。(Washability) 1,000 g of the cutting fluid composition shown in Tables 1 and 2 and 500 g of silicon carbide abrasive grains (GP # 800, manufactured by Fujimi Incorporated) are used.
Collect in a ml plastic container and homogenize at room temperature (25 ° C) (disper blade) at a rotation speed of 3,000 rpm for 3 times.
After stirring for a minute, a uniform slurry-like non-flammable water-based cutting fluid was obtained.
【0049】シリコンウエハー及び石英ウエハーに上記
切削液を塗布し、80℃にて1時間乾燥後、切断加工後
の模擬検体とした。この模擬検体のウエハーを流水(室
温25℃)で3分間洗浄し、以下の基準で洗浄性を判断
した。The above cutting fluid was applied to a silicon wafer and a quartz wafer, dried at 80 ° C. for 1 hour, and used as a simulated sample after cutting. The wafer of this simulated sample was washed with running water (room temperature 25 ° C.) for 3 minutes, and the washability was judged according to the following criteria.
【0050】 ○…砥粒残渣がなく洗い落とせたもの ×…砥粒が残り洗い落とせないもの。[0050] ○: Those that can be washed off without any abrasive residue ×: Abrasive particles remain and cannot be washed off.
【0051】表3及び表4から明らかなように、各実施
例の非引火性水系切削液を用いた場合、シリコンウエハ
ー及び石英ウエハーの何れの場合にも、比較例の切削液
を用いた場合と同等以上の洗浄性が得られている。な
お、鉱物油系の切削液(比較例10)は水による洗浄が
不可能であり、洗浄性の評価は×となっているが、この
場合は砥粒の除去は全くできておらず、各実施例に比較
して明らかに洗浄性が劣っている。As is clear from Tables 3 and 4, when the non-flammable water-based cutting fluid of each example was used, and when the cutting fluid of the comparative example was used for both silicon wafers and quartz wafers Detergency equal to or higher than that of is obtained. Incidentally, the mineral oil-based cutting fluid (Comparative Example 10) could not be washed with water, and the cleaning performance was evaluated as x. However, in this case, the removal of the abrasive grains could not be performed at all. The detergency is obviously inferior to that of the example.
【0052】(防錆性)表1及び表2に挙げる切削液を
鋳鉄粉(FC20)に2ml滴下し、室温条件下に於け
る3時間、1日、3日での発錆状況を確認し、以下の基
準にて比較した。(Rustproofness) 2 ml of the cutting fluid listed in Tables 1 and 2 was dropped on cast iron powder (FC20), and the rusting condition was confirmed at room temperature for 3 hours, 1 day and 3 days. The following criteria were compared.
【0053】 ◎…発錆なし ○…発錆面積5%未満、 △…発錆面積5%〜25%未満 ×…発錆面積25%以上。[0053] ◎ ... No rusting ○: Rust area less than 5%, △: Rust area 5% to less than 25% ×: Rust area is 25% or more.
【0054】表3及び表4から明らかなように、各実施
例の非引火性水系切削液を用いた場合、比較例の切削液
と同等以上の防錆性を示し、鉱物油系の切削液(比較例
10)と同等又はこれに近い防錆性を示すことが分か
る。As is clear from Tables 3 and 4, when the non-flammable water-based cutting fluid of each example is used, it exhibits a rust-preventing property equal to or higher than that of the cutting fluid of the comparative example, and a mineral oil-based cutting fluid. It can be seen that the rust preventive property is equal to or close to that of (Comparative Example 10).
【0055】[0055]
【表3】 [Table 3]
【0056】[0056]
【表4】 [Table 4]
【0057】[0057]
【発明の効果】本発明の非引火性水系切削液組成物は、
ポリカルボン酸系高分子化合物及び/又はその塩と、カ
ルボン酸及び/又はその塩とを含有しているので、水を
多く配合した組成物であっても砥粒の分散性が良好とな
り、硬脆材料の切断加工への使用に際しても引火性の問
題が生じない。また、本発明の非引火性水系切削液組成
物は高い防錆性を有しているので、油系設備に使用して
も錆は発生しない。加えて、水での洗浄により容易に洗
い流すことが可能となる。The non-flammable water-based cutting fluid composition of the present invention comprises:
Since it contains a polycarboxylic acid-based polymer compound and / or a salt thereof and a carboxylic acid and / or a salt thereof, the dispersibility of the abrasive grains becomes good even if the composition contains a large amount of water, and the hard particles are hard. There is no problem of flammability when used for cutting brittle materials. Further, since the non-flammable water-based cutting fluid composition of the present invention has a high rust preventive property, rust does not occur even when used in oil-based equipment. In addition, it becomes possible to easily wash away by washing with water.
【0058】また、本発明の油系設備用の非引火性水系
切削液は上記組成物に砥粒を配合したので、ワイヤーソ
ー、バンドソー等の切削装置に連続して供給することが
でき、加工精度の高いウエハーの切断を行うことができ
る。Further, since the non-flammable water-based cutting fluid for oil-based equipment of the present invention contains abrasive grains in the above composition, it can be continuously supplied to a cutting device such as a wire saw or band saw. Highly accurate wafer cutting can be performed.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) C10M 125/28 C10M 125/28 129/26 129/26 129/34 129/34 129/42 129/42 145/14 145/14 145/16 145/16 145/26 145/26 // C10N 10:02 C10N 10:02 10:06 10:06 10:08 10:08 20:04 20:04 20:06 20:06 Z 30:00 30:00 Z 30:04 30:04 30:12 30:12 30:18 30:18 40:22 40:22 Fターム(参考) 4H104 AA01Z AA04C AA13C AA22C BB14C BB18C CB08A CB08C CB09A CB09C CB14C EA03A EA03C EA08C FA01 FA03 FA04 LA02 LA06 LA20 PA22 QA01 RA01 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 7 Identification code FI theme code (reference) C10M 125/28 C10M 125/28 129/26 129/26 129/34 129/34 129/42 129/42 145 / 14 145/14 145/16 145/16 145/26 145/26 // C10N 10:02 C10N 10:02 10:06 10:06 10:08 10:08 20:04 20:04 20:06 20: 06 Z 30:00 30:00 Z 30:04 30:04 30:12 30:12 30:18 30:18 40:22 40:22 F term (reference) 4H104 AA01Z AA04C AA13C AA22C BB14C BB18C CB08A CB08C CB09A CB09C CB14C EA03A EA03C EA08C FA01 FA03 FA04 LA02 LA06 LA20 PA22 QA01 RA01
Claims (13)
000のポリカルボン酸系高分子化合物及び/又はその
塩を5〜45重量%、並びにカルボン酸及び/又はその
塩を0.05〜5重量%で含有している非引火性水系切
削液組成物。1. A weight average molecular weight of 1,000 to 200,
Non-flammable water-based cutting fluid composition containing 5 to 45% by weight of polycarboxylic acid type polymer compound and / or salt thereof and 0.05 to 5% by weight of carboxylic acid and / or salt thereof .
金属用防食剤及び消泡剤からなる群から選択される少な
くとも1種の添加補助剤を更に含有している請求項1記
載の非引火性水系切削液組成物。2. The method according to claim 1, further comprising at least one additive aid selected from the group consisting of a water-soluble solvent, a lubricant, a viscosity modifier, a corrosion inhibitor for non-ferrous metals and an antifoaming agent. Non-flammable water-based cutting fluid composition.
キレングリコール及びその誘導体から選択される水溶性
溶剤の1種又は2種以上を含有している請求項2記載の
非引火性水系切削液組成物。3. The non-flammable water-based cutting fluid composition according to claim 2, wherein the additive aid contains one or more water-soluble solvents selected from polyoxyalkylene glycol and its derivatives. .
/又はその塩が、アクリル酸、マレイン酸及びメタクリ
ル酸からなる群から選択されるモノマーの1種又は2種
以上から調製されるポリマー、該ポリマーのアルカリ金
属塩、該ポリマーのオニウム塩及びこれらの1種又は2
種以上の混合物からなる群から選択されるものである請
求項1乃至3の何れかに記載の非引火性水系切削液組成
物。4. A polymer prepared from one or more monomers selected from the group consisting of acrylic acid, maleic acid and methacrylic acid, wherein the polycarboxylic acid-based polymer compound and / or its salt is a polymer. Alkali metal salts of polymers, onium salts of said polymers and one or two of these
The non-flammable water-based cutting fluid composition according to any one of claims 1 to 3, which is selected from the group consisting of a mixture of one or more kinds.
/又はその塩が、化1の一般式(1)で示すポリマーで
ある請求項1乃至4の何れかに記載の非引火性水系切削
液組成物。 【化1】 (式中Rは水素原子又はメチル基であり、M1、M2、及
びM3は、水素原子、アルカリ金属原子又はオニウムの
何れかであって同じか又は互いに異なってもよく、nは
1以上の整数、mは0以上の整数である。)5. The non-flammable water-based cutting fluid according to claim 1, wherein the polycarboxylic acid-based polymer compound and / or its salt is a polymer represented by the general formula (1) of Chemical formula 1. Composition. [Chemical 1] (In the formula, R is a hydrogen atom or a methyl group, M 1 , M 2 , and M 3 are either a hydrogen atom, an alkali metal atom or onium and may be the same or different, and n is 1 The above integers and m are integers of 0 or more.)
2の一般式(2)で示す脂肪族ジカルボン酸、該脂肪族
ジカルボン酸のアルカリ金属塩及び該脂肪族ジカルボン
酸のオニウム塩からなる群から選択されるものである請
求項1乃至5の何れかに記載の非引火性水系切削液組成
物。 【化2】 (式中kは、6〜12の整数である。)6. The carboxylic acid and / or salt thereof comprises an aliphatic dicarboxylic acid represented by the general formula (2) of Chemical formula 2, an alkali metal salt of the aliphatic dicarboxylic acid and an onium salt of the aliphatic dicarboxylic acid. The non-flammable water-based cutting fluid composition according to any one of claims 1 to 5, which is selected from the group. [Chemical 2] (In the formula, k is an integer of 6 to 12.)
/又はその塩が、5,000〜150,000の重量平
均分子量を有し、アクリル酸のホモポリマーのアルカリ
金属塩及び/若しくはオニウム塩、並びに/又はアクリ
ル酸とマレイン酸とのコポリマーのアルカリ金属塩及び
/若しくはオニウム塩であり、該ポリカルボン酸系高分
子化合物及び/又はその塩の含有量が20〜40重量%
であり、カルボン酸及び/又はその塩が化2の一般式
(2)で示す脂肪族ジカルボン酸、該脂肪族ジカルボン
酸のアルカリ金属塩及び該脂肪族ジカルボン酸のオニウ
ム塩からなる群から選択されるものであり、該カルボン
酸及び/又はその塩の含有量が0.5〜2重量%であ
り、前記添加補助剤が水溶性溶剤であるポリオキシアル
キレングリコール及びその誘導体から選択される水溶性
溶剤であり、該水溶性溶剤の含有量が5〜20重量%で
ある請求項2記載の非引火性水系切削液組成物。7. The alkali metal salt and / or onium salt of a homopolymer of acrylic acid, wherein the polycarboxylic acid-based polymer compound and / or its salt has a weight average molecular weight of 5,000 to 150,000. And / or an alkali metal salt and / or onium salt of a copolymer of acrylic acid and maleic acid, and the content of the polycarboxylic acid-based polymer compound and / or salt thereof is 20 to 40% by weight.
And the carboxylic acid and / or salt thereof is selected from the group consisting of an aliphatic dicarboxylic acid represented by the general formula (2) of Chemical formula 2, an alkali metal salt of the aliphatic dicarboxylic acid and an onium salt of the aliphatic dicarboxylic acid. The content of the carboxylic acid and / or salt thereof is 0.5 to 2% by weight, and the addition aid is a water-soluble solvent selected from polyoxyalkylene glycol and its derivatives which are water-soluble solvents. The non-flammable water-based cutting fluid composition according to claim 2, which is a solvent, and the content of the water-soluble solvent is 5 to 20% by weight.
性水系切削液組成物と、砥粒とを含有する非引火性水系
切削液。8. A non-flammable water-based cutting fluid containing the non-flammable water-based cutting fluid composition according to claim 1 and abrasive grains.
る請求項8記載の非引火性水系切削液。9. The non-flammable water-based cutting fluid according to claim 8, wherein the grain size of the abrasive grains is 0.5 to 50 μm.
引火性水系切削液組成物と、砥粒とを、重量比1:0.
5〜1:1.5の割合で分散させた請求項8又は9記載
の非引火性水系切削液。10. The non-flammable water-based cutting fluid composition according to claim 1 and abrasive grains in a weight ratio of 1: 0.
The non-flammable water-based cutting fluid according to claim 8 or 9, which is dispersed at a ratio of 5 to 1: 1.5.
れる請求項8乃至10の何れかに記載の非引火性水系切
削液。11. The non-flammable water-based cutting fluid according to claim 8, which is used for a wire saw or a band saw.
使用される請求項8乃至11の何れかに記載の非引火性
水系切削液。12. The non-flammable water-based cutting fluid according to claim 8, which is used for cutting an ingot made of a hard and brittle material.
水晶から選択されるものである請求項12記載の非引火
性水系切削液。13. The non-flammable water-based cutting fluid according to claim 12, wherein the hard and brittle material is selected from silicon, quartz and quartz.
Priority Applications (6)
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JP2001271539A JP2003082380A (en) | 2001-09-07 | 2001-09-07 | Nonflammable aqueous cutting fluid composition and nonflammable aqueous cutting fluid |
TW91119355A TW575660B (en) | 2001-09-07 | 2002-08-27 | Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid |
EP02256127A EP1291408A1 (en) | 2001-09-07 | 2002-09-04 | Nonflammable water-based cutting fluid composition |
CNB021318522A CN1234827C (en) | 2001-09-07 | 2002-09-06 | Non-combustible water-series cutting fluid composition and non-combustible water-series cutting fluid |
KR10-2002-0053770A KR100494296B1 (en) | 2001-09-07 | 2002-09-06 | nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid |
US10/236,899 US6673754B1 (en) | 2001-09-07 | 2002-09-06 | Nonflammable water-based cutting fluid composition and nonflammable water-based cutting fluid |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006249320A (en) * | 2005-03-11 | 2006-09-21 | Toshiba Mach Co Ltd | Aqueous lubricant for machining and method for machining |
JP2007031502A (en) * | 2005-07-25 | 2007-02-08 | Yushiro Chem Ind Co Ltd | Water-based abrasive dispersion medium composition |
US7271088B2 (en) | 2004-01-05 | 2007-09-18 | Hynix Semiconductor Inc. | Slurry composition with high planarity and CMP process of dielectric film using the same |
WO2010071875A3 (en) * | 2008-12-20 | 2010-09-16 | Cabot Microelectronics Corporation | Cutting fluid composition for wiresawing |
WO2010113678A1 (en) * | 2009-03-31 | 2010-10-07 | 出光興産株式会社 | Working fluid for brittle material and working fluid for hard material |
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JP2013507490A (en) * | 2009-10-16 | 2013-03-04 | ダウ グローバル テクノロジーズ エルエルシー | Aqueous cutting fluid for use with diamond wire saws |
WO2012035951A1 (en) * | 2010-09-14 | 2012-03-22 | 出光興産株式会社 | Aqueous cleaning agent |
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