JP2003077613A - Method for surface mounting chip component and socket for it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a socket for surface mounting a chip component, cable of mounting the chip component to a conventional board without modifying the board even when the tip component is miniaturized. SOLUTION: Paste soldering is applied onto a pair of lands formed at an interval on the board, then a socket is placed on paste solder, and one end and the other end of the tip component are held by the pair of sockets, respectively. The soldering paste is melted and solidified to join the pair of sockets to the pair of lands. Each socket has a body part formed by erecting one end and the other end of the bottom surface part and pressing parts that are disposed at respective opening ends of the body part and energize the chip component placed on the upper surface of the bottom surface part to the bottom surface part side.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting method for mounting a chip component on a printed circuit board and a surface mounting socket for the chip component.

[0002]

2. Description of the Related Art Conventionally, a capacitor having no lead wire,
When mounting a chip type electronic component such as a resistor or a coil (hereinafter referred to as a chip component) on a printed circuit board, the chip component may be mounted on a socket and the socket may be soldered to a land on the printed circuit board (special feature). Kaihei 05-258
816).

[0003]

However, in recent years,
Smaller chip parts are being manufactured, and sockets for smaller chip parts have been manufactured accordingly. Therefore, when the sockets are mounted on the pair of chip lands adjacently arranged on the printed circuit board to connect the chip lands, the width between the chip lands is too wide and it is difficult to mount the chip component. In some cases, it was necessary to revise to a substrate with a narrower width between chip lands.

The present invention has been made in order to solve such a conventional problem. Even if the chip component is downsized, the surface mounting method of the chip component and the chip component can be mounted on the conventional substrate without modifying the substrate. An object of the present invention is to provide a surface mounting socket.

[0005]

According to a first aspect of the present invention, there is provided a chip component surface mounting method, wherein a solder paste is applied on a pair of lands formed on a substrate with a space therebetween, and a socket is provided on each solder paste. And a step of holding one end side and the other end side of the chip component by the pair of sockets, respectively, and a step of melting and solidifying the solder paste and joining the pair of sockets to the pair of lands. And having.

According to a second aspect of the present invention, there is provided a surface mounting socket for a chip component, which is provided at each of a main body portion having side surface portions erected on one end side and the other end side of a bottom surface portion and an open end of the main body portion.
And a pressing portion for urging the chip component placed on the top surface of the bottom surface portion toward the bottom surface portion. A surface mounting socket for a chip component according to a third aspect is the surface mounting socket for a chip component according to the second aspect, wherein the pressing portion is bent in a dogleg shape.

A surface mounting socket for a chip component according to a fourth aspect is the socket for surface mounting a chip component according to the second or third aspect, wherein the pressing portion extends along the cross-sectional direction of the main body portion. At least one slit is provided. A surface mount socket for a chip part according to claim 5 is the surface mount socket for a chip part according to any one of claims 2 to 4, wherein the bottom surface portion is provided in a longitudinal sectional direction of the main body part. It is characterized in that at least one slit is provided along the slit.

A surface mount socket for a chip part according to claim 6 is the surface mount socket for a chip part according to any one of claims 2 to 5, wherein the main body portion has a thickness of 0.1 mm. It is characterized by the following. A surface mounting socket for a chip component according to claim 7 is the surface mounting socket for a chip component according to any one of claims 2 to 6, wherein the surface mounting socket extends from the bottom surface portion to the side surface portion. At least 1 along the transverse direction of the body
It is characterized in that one slit is provided.

(Operation) In the surface mounting method for a chip component according to claim 1, the socket is joined to each of a pair of lands formed at intervals on the substrate, and one end side and the other end side of the chip component are connected. Are held by a pair of sockets, respectively. According to another aspect of the surface mount socket of the chip component of the present invention, each of the open ends of the main body is provided with a pressing portion having a predetermined gap, and the chip component is inserted from above the surface mount socket. Further, the pressing portion biases the chip component placed on the upper surface of the bottom surface portion toward the bottom surface side, and the position of the chip component is restricted.

According to a third aspect of the surface mount socket for a chip component of the present invention, in the surface mount socket for a chip component according to the fourth aspect, the pressing portion is bent into a dogleg shape and has an upper end of the dogleg. A spring is formed with the bent portion of the letter as a fulcrum. In the surface mounting socket for a chip component according to claim 4,
In the surface mounting socket for a chip component according to claim 4 or 5, the pressing portion is provided with at least one slit along the cross-sectional direction of the main body portion, and the chip component is constrained by the plurality of pressing portions. The pressing portion is easily deformed.

A surface mount socket for a chip part according to claim 5 is the surface mount socket for a chip part according to any one of claims 4 to 6, wherein the bottom surface portion has a longitudinal sectional direction of the main body part. There is provided at least one slit along the upper surface and the lower surface of the bottom surface portion. For example, if the solder paste is spread under the surface mounting socket and melted, it is sucked into the socket by a capillary phenomenon.

According to a sixth aspect of the present invention, there is provided a surface mount socket for a chip component according to any one of the fourth to seventh aspects, wherein the body portion has a thickness of 0.1 mm or less. When the upper surface and the lower surface of the bottom surface portion are brought close to each other and, for example, the solder paste is spread under the surface mounting socket and melted, it is easily sucked into the socket due to the capillary phenomenon.

A surface mount socket for a chip component according to claim 7 is the surface mount socket for a chip component according to any one of claims 4 to 8, wherein the surface mount socket extends from a bottom surface portion to a side surface portion. At least one slit is provided along the cross-sectional direction of the main body, and the upper surface and the lower surface of the bottom surface are penetrated. For example, if the solder paste is spread under the surface mounting socket and melted, the capillary phenomenon may occur. Sucked inside the socket.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of a surface mount socket for a chip component according to the present invention (claims 2 to 7).
(Corresponding to). In FIG. 1, a surface mounting socket 1A for a chip component is made of a single conductive plate material having a thickness of 0.1 mm.
a and 3b. The main body portion 13 has a bottom surface portion 12 and side surface portions 2 a and 2 b provided upright on one end side and the other end side of the bottom surface portion 12. In addition, the pressing portions 3a and 3b
Are provided at the open ends of the main body portion 13, that is, at the end portions of the side surface portions 2a and 2b, respectively, and are formed by connecting portions 15a and 15b, bent portions 16a and 16b, and contact portions 17a and 17b. It is bent into a shape.

Further, along the cross-sectional direction of the main body 13,
Two slits 4a and 4b, which extend from the ends of the doglegs of the pressing portions 3a and 3b to the bottom surface portion 12 through the side surface portion 2b, are provided on each of the one end side and the other end side. Further, the bottom surface portion 12 is provided with three slits 5 along the longitudinal section direction of the main body portion 13.

FIG. 2 shows an embodiment (corresponding to claim 1) of a surface mounting method for a chip component of the present invention. In this embodiment, first, as shown in FIG. 2A, the solder paste 11 is applied onto the pair of chip lands 9A and 9B formed on the substrate 10 at intervals.

Next, as shown in FIG. 2B, the sockets 1A and 1B are placed on the respective solder pastes 11.
Next, as shown in FIG. 2C, the chip component 8 is mounted on the sockets 1A, 1B from above the sockets 1A, 1B, with the wide surfaces thereof serving as the upper and lower surfaces. FIG. 3 shows FIG.
The detail of (c) is shown. The chip component 8 is composed of a rectangular parallelepiped chip body 6 and terminal portions 7a and 7b provided on one end side and the other end side of the chip body 6. This figure shows the socket 1 on the pair of chip lands 9A and 9B.
A and 1B are respectively placed, and the chip component 8 is biased by the pressing portions 3a and 3b and is restrained on the bottom surface portion 12. Here, the chip component 8 is attached such that the wide surface of the chip body 6 is the upper and lower surfaces. At this time, the pressing portions 3a, 3b formed in a dogleg shape expand the distance between the bent portions 16a, 16b while deforming in association with the movement of the chip component 8, and the chip component 8 is bent by the bent portions 16a, 16b. At 16b, the width of the chip component 8 is reduced while pressing the chip component 8 toward the bottom surface portion 12 side. In this way, the terminal portions 7a and 7b are held by the pair of sockets 1A and 1B, respectively.

Next, as shown in FIG. 2D, the solder paste 11 is melted and solidified by, for example, a reflow furnace,
The pair of sockets 1A and 1B are connected to the pair of chip lands 9A,
Join on 9B. 4 and 5 show details of FIG. 2 (d). FIG. 4 is a vertical sectional view showing a pair of chip lands 9A and 9B formed on the substrate 10 at intervals.
Sockets 1A and 1B are provided on the top. Further, the terminal portions 7a and 7b on one end side and the other end side of the chip component 8 are held by the pair of sockets 1A and 1B, respectively. Further, the solder paste 11 is melted and solidified, so that the pair of sockets 1A, 1B and the pair of chip lands 9A, 9
B is joined with solder 14.

Further, FIG. 5 is a cross-sectional view, in which the solder paste 11 is melted and sucked into the inside of the socket 1A through the slit 5 and the slits 4a and 4b (not shown) by a capillary phenomenon. At this time, the chip component 8 is
Although it is in contact with the pressing portions 3a and 3b, when the solder 14 is covered to the upper side of the chip component 8 as shown in the drawing, the biasing force of the pressing portions 3a and 3b to the chip component 8 is deenergized. The chip component 8 is fixed by the solder 14.

In the surface mounting method of the chip component as described above, the conductive sockets 1A and 1B are joined to the pair of chip lands 9A and 9B formed on the substrate 10 at intervals, and the terminals are connected. When the portions 7a and 7b are respectively held by the pair of sockets 1A and 1B, even if the width between the pair of chip lands 9A and 9B is too wide or too narrow,
By adjusting the width between the chip lands 9A and 9B with the sockets 1A and 1B, the terminal portions 7a and 7b can be connected to the chip lands 9A and 9B, respectively. As a result, even if the chip component 8 is downsized, the substrate 10 can be attached to the conventional substrate without revising.

Further, in the surface mounting socket for chip components as described above, pressing portions 3a and 3b having a predetermined interval are provided at each of the open ends of the body portion 13, and the chip component 8 is placed from above the socket 1a. It can be easily inserted even when it is inserted and an automatic inserter or the like is used. Also, the pressing portion 3
The a and 3b can urge the chip component 8 placed on the upper surface of the bottom surface portion 12 toward the bottom surface portion 12 side to restrain the position of the chip component 8.

Further, the pressing portions 3a and 3b are bent in a dogleg shape, and a spring is formed with the upper end of the dogleg and the bent portion of the dogleg as a fulcrum. Even when the chip component 8 is inserted from the upper side of the sockets 1A and 1B by using it, the gap between the pressing portion 3a and the pressing portion 3b can be easily widened and can be easily inserted. Further, the pressing portions 3a, 3
Two slits 4a and 4b are provided in b respectively along the cross-sectional direction of the main body portion 13, and since the chip component 8 has three pressing portions 3a and 3b, the pressing portions 3a and 3b are provided.
b is easily deformed. That is, when the chip component 8 is not along the longitudinal cross-sectional direction of the main body 13, the slits 4a,
Since the pressing portions 3a and 3b are deformed with a smaller force than when the 4b is not provided, the chip component is returned to a predetermined position with a smaller force after contacting the bottom surface portion 12 of the chip component 8. , And can be placed on the bottom portion 12 in a more balanced manner.

Further, the bottom surface portion 12 is provided with three slits 5 along the longitudinal sectional direction of the main body portion 13, and the solder paste 11 laid under the sockets 1A, 1B is melted by a capillary phenomenon when melted. In addition to being able to be sucked in to the inside of 1A and 1B, the rising of the solder 14 can be improved,
Since the bottom surface portion 12 between the slits 5 is included in the solder 14, the sockets 1A and 1B can be bonded onto the chip lands 9A and 9B with sufficient strength.

Further, the thickness of the main body 13 is 0.1 mm.
Below, the solder paste 11 laid under the sockets 1A, 1B is melted by a capillary phenomenon when the sockets 1A, 1B
It is easily sucked into the inside of 1B, and soldering can be performed in a short time. In addition, from the bottom surface portion 12 to the side surface portions 2a and 2b
Two slits 4a and 4b are provided along the cross-sectional direction of the main body 13 up to the pressing portions 3a and 3b through the slits 4 extending from the bottom surface portion 12 to the side surface portions 2a and 2b.
When the solder paste 11 laid under the sockets 1A and 1B by a and 4b is melted, the socket 1 is caused by a capillary phenomenon.
Since it is sucked into the inside of A and 1B, the rising of the solder 14 can be improved.

In the above-described embodiment, an example in which the sockets 1A and 1B made of a conductive plate material are used has been described. However, the present invention is not limited to this embodiment and the terminal portions 7a and 7b are used. If the chip lands 9A, 9B are connected via the solder 14, the sockets 1A,
1B may be a non-conductive material. Further, in the above-described embodiment, the pressing portions 3a and 3b have a V shape, but may have, for example, an arc shape. In short, it suffices that the chip component 8 can be mounted from the upper side of the sockets 1A and 1B and the chip component can be urged toward the bottom surface portion 12 side.

Further, in the above-described embodiment, the bottom surface portion 1
Although the slit 5 of No. 2 is provided along the longitudinal cross-sectional direction of the main body portion 13, it is possible to improve the rising of the solder 14 and to bond the sockets 1A and 1B to the chip lands 9A and 9B with sufficient strength. If it is possible, the direction does not matter. Further, in the above-described embodiment, the slits 4a and 4b are provided along the cross-sectional direction of the main body portion 13. However, these slits 4a and 4b balance the chip component 8 with the pressing portions 3a and 3b in a well-balanced manner. The solder 1 can be placed on the upper surface of the bottom surface 12 and the side surfaces 2a and 2b.
The direction does not matter as long as the rising of 4 can be improved.

[0027]

As described above, in the surface mounting method of the chip component according to the first aspect, the socket is joined to each of the pair of lands, and one end side and the other end side of the chip component are formed by the pair of sockets. Since each is held, even if the width between the pair of chip lands is too wide or too narrow, the chip component and the chip land can be connected by adjusting the width between the chip lands with the socket. As a result, even if the chip component is downsized, it can be attached to the conventional substrate without modifying the substrate.

According to another aspect of the present invention, there is provided a surface mount socket for a chip component, wherein each of the open ends of the main body is provided with a pressing portion having a predetermined gap, and the chip component is inserted from the upper side of the surface mount socket to automatically It can be easily inserted even when using an inserter. Further, the pressing portion can urge the chip component placed on the upper surface of the bottom surface portion toward the bottom surface portion to restrain the position of the chip component.

In the surface mount socket for a chip component according to a third aspect of the present invention, the pressing portion is bent into a dogleg shape, and a spring is formed with the upper end of the dogleg and the dogleg bent portion as fulcrums. Therefore, even when the chip component is inserted from the upper side of the surface mounting socket using an automatic machine or the like, it is possible to easily widen the interval between the two pressing portions and easily insert the chip component. In the surface mount socket for a chip component according to claim 4, at least one slit is provided in the pressing portion along the cross-sectional direction of the main body, and the chip component is constrained by the plurality of pressing portions. Is easily deformed. That is, when the chip component is not along the longitudinal cross-sectional direction of the main body portion, the pressing portion is deformed with a smaller force than when the slit is not provided, and therefore, after contacting the bottom surface portion of the chip component, Since the chip component is returned to the predetermined position with a small force, it can be placed on the bottom surface in a more balanced manner.

In the surface mounting socket for a chip component according to claim 5, since at least one slit is provided in the bottom surface portion along the longitudinal sectional direction of the main body portion, the solder laid under the surface mounting socket. When the paste is melted, it is sucked into the inside of the socket due to a capillary phenomenon, so that the rising of the solder can be improved. Further, since the bottom surface portion between the slits is included in the solder, the surface mounting socket can be bonded onto the chip land with sufficient strength.

In the surface mounting socket for a chip component according to claim 6, since the thickness of the main body is 0.1 mm or less,
When the solder paste laid under the surface mounting socket is melted, it is easily sucked into the inside of the surface mounting socket due to a capillary phenomenon, so that soldering can be performed in a short time. In the surface mounting socket for a chip component according to claim 7, since at least one slit is provided extending from the bottom surface portion to the side surface portion along the cross-sectional direction of the main body portion, the surface mounting socket is laid under the surface mounting socket. The melted solder paste is sucked into the inside of the surface mounting socket due to a capillary phenomenon when melted, and the rising of the solder can be improved.

[Brief description of drawings]

FIG. 1 is an external perspective view of a socket according to an embodiment of the present invention.

FIG. 2 is a process chart showing a surface mounting method of a chip part according to an embodiment of the present invention.

FIG. 3 is an external perspective view showing a surface mounting method of a chip component according to the embodiment of the present invention.

FIG. 4 is a vertical cross-sectional view when mounting a chip component according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view of the chip component according to the embodiment of the present invention when mounted.

[Explanation of symbols]

1A, 1B socket 2a, 2b side part 3a, 3b pressing part 4a, 4b slit 5 slits 8 chip parts 9A, 9B Chip land 10 substrates 11 Solder paste 12 Bottom part 13 Body

Claims (7)

[Claims] 1. A step of applying a solder paste on a pair of lands formed at intervals on a substrate and placing a socket on each of the solder pastes; one end side and the other end side of a chip component. And a step of holding the solder paste by the pair of sockets, respectively, and a step of melting and solidifying the solder paste and joining the pair of sockets to the pair of lands. 2. A body portion having side surface portions provided upright on one end side and the other end side of the bottom surface portion, and provided on each of the open ends of the body portion and mounted on the upper surface of the bottom surface portion. A surface mount socket for a chip part, comprising: a pressing part for urging the chip part toward the bottom surface side. 3. The surface mounting socket for a chip component according to claim 2, wherein the pressing portion is bent in a dogleg shape. 4. The surface mounting socket for a chip component according to claim 2, wherein the pressing portion is provided with at least one slit along a cross-sectional direction of the body portion. Surface mounting socket for the characteristic chip parts. 5. The surface mounting socket for a chip component according to claim 2, wherein the bottom surface portion is provided with at least one slit along a longitudinal sectional direction of the main body portion. A surface mount socket for chip parts. 6. The surface mounting socket for a chip part according to claim 2, wherein the thickness of the main body is 0.1 mm or less. Surface mount socket. 7. The surface mounting socket for a chip part according to claim 2, wherein the socket part extends from the bottom surface portion to the side surface portion, and extends along a cross-sectional direction of the main body portion. A surface mount socket for chip parts, wherein at least one slit is provided.