JP2003054834A - Displacement detector for bonding wire - Google Patents
Displacement detector for bonding wireInfo
- Publication number
- JP2003054834A JP2003054834A JP2001249328A JP2001249328A JP2003054834A JP 2003054834 A JP2003054834 A JP 2003054834A JP 2001249328 A JP2001249328 A JP 2001249328A JP 2001249328 A JP2001249328 A JP 2001249328A JP 2003054834 A JP2003054834 A JP 2003054834A
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- spool
- strain gauge
- output voltage
- pay
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006073 displacement reaction Methods 0.000 title abstract 4
- 238000004804 winding Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Unwinding Of Filamentary Materials (AREA)
- Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、金、銀、アルミニ
ウム等のボンディングワイヤの巻取り装置に取り付けら
れるボンディングワイヤの振れ検出器に関し、特に、繰
出しスプール上のボンディングワイヤにくぐり、あるい
はそれに伴うボンディングワイヤの振れが発生したこと
を検知することが可能なボンディングワイヤの振れ検出
器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding wire runout detector attached to a winding device for a bonding wire of gold, silver, aluminum or the like, and more particularly, to a bonding wire on a pay-out spool, or a bonding accompanying it. The present invention relates to a bonding wire shake detector capable of detecting occurrence of wire shake.
【０００２】[0002]
【従来の技術】ＩＣやトランジスタのボンディングに使
用されるボンディングワイヤの製造工程中の巻取り工程
では、前工程でボンディングワイヤを巻き取った繰出し
スプールから、ボンディングワイヤを繰り出し、巻取り
スプールに巻き取って、半導体製造ラインで使用する。2. Description of the Related Art In a winding process during a manufacturing process of a bonding wire used for bonding an IC or a transistor, the bonding wire is unwound from the unwinding spool wound with the bonding wire in the previous process and wound up on the winding spool. Used in the semiconductor manufacturing line.
【０００３】該巻取り工程で使用するボンディングワイ
ヤの巻取り装置では、水平の固定軸に、前記繰出しスプ
ールを回転可能に取り付ける。空の巻取りスプールは、
前記固定軸の下方に位置し、回転速度が制御可能な水平
の回転軸に取り付ける。そして、繰出しスプールからボ
ンディングワイヤの先端を、回転自在な複数のプーリー
の溝を経由させて、前記巻取りスプールに止める。In a winding device for a bonding wire used in the winding step, the pay-out spool is rotatably attached to a horizontal fixed shaft. The empty take-up spool is
It is attached to a horizontal rotary shaft located below the fixed shaft and having a controllable rotation speed. Then, the tip of the bonding wire from the pay-out spool is stopped on the take-up spool through the grooves of a plurality of rotatable pulleys.
【０００４】さらに、ボンディングワイヤがプーリーか
ら脱線しないように、繰出しスプールの回転軸に対し、
プーリーおよび巻取りスプールの回転軸は、平面視で直
交の関係にある。Further, in order to prevent the bonding wire from derailing from the pulley,
The rotation axes of the pulley and the take-up spool are orthogonal to each other in plan view.
【０００５】回転軸により回転する巻取りスプールが、
ボンディングワイヤを引っ張ることにより、ボンディン
グワイヤが繰出しスプールから繰り出される。The take-up spool, which is rotated by the rotary shaft,
By pulling the bonding wire, the bonding wire is paid out from the paying spool.
【０００６】しかし、繰出しスプール上で、一巻き後の
ボンディングワイヤ（本ワイヤー）が、繰り出されてい
るボンディングワイヤ（末端ワイヤー）を跳び越えるこ
と、すなわちくぐりがあった場合には、繰出しスプール
と、最初に経由するプーリーとの間のボンディングワイ
ヤが激しく振れる現象を起こす。However, on the pay-out spool, the bonding wire (main wire) after one winding jumps over the bonding wire (terminal wire) being paid out, that is, when there is a dip, the pay-out spool, The bonding wire between the first passing pulley vibrates violently.
【０００７】ボンディングワイヤの振れとは、特に、繰
出しスプールから最初に経由するプーリーまでのボンデ
ィングワイヤが、弾かれた弦のように振動する様子であ
る。ボンディングワイヤの振れは、くぐりの状態や、プ
ーリーでの接触角などにより程度が異なる。高速で繰り
出されるボンディングワイヤが振れを起こすと、容易に
識別可能である。The wobbling of the bonding wire is a state in which the bonding wire from the payout spool to the pulley passing first is vibrated like a plucked string. The degree of deflection of the bonding wire varies depending on the passing condition and the contact angle at the pulley. When the bonding wire fed at high speed sways, it can be easily identified.
【０００８】程度の大きい振れを起こして巻取りスプー
ルに巻き取られたボンディングワイヤは、蛇行した形状
となる。該蛇行部分は、ボンディング装置の送り出し経
路に引っかかって、ボンディング装置を停止させたり、
隣接するボンディングワイヤと接触してショートさせる
原因となる。The bonding wire wound on the take-up spool with a large degree of deflection has a meandering shape. The meandering portion is caught in the feeding path of the bonding apparatus to stop the bonding apparatus,
This may cause contact with adjacent bonding wires and cause a short circuit.
【０００９】巻取り工程中は、ボンディングワイヤの振
れが起きていないことを、オペレータが目で確認し、振
れが確認されれば、繰り出されたボンディングワイヤの
状態、および巻き取られたボンディングワイヤの状態を
確認し、巻取り工程の合否判定を行っていた。During the winding process, the operator visually confirms that the bonding wire does not shake, and if the shaking is confirmed, the state of the unwound bonding wire and the wound bonding wire The state was checked and the pass / fail judgment of the winding process was performed.
【００１０】[0010]
【発明が解決しようとする課題】近年、１ＩＣ当たりの
ボンディングワイヤの使用量が増大して、巻取り装置の
需要が高まり、一方、稼働中の巻取り装置の稼働率は高
める必要がある。従って、複数の巻取り装置の前に１人
のオペレータが常駐し、多くのボンディングワイヤを同
時に目で確認し、振れがある場合の合否判定を行うこと
は困難になり、充分に稼働率を高めることはできなかっ
た。In recent years, the amount of bonding wires used per IC has increased, and the demand for the winding device has increased. On the other hand, it is necessary to increase the operating rate of the winding device in operation. Therefore, one operator is resident in front of a plurality of winding devices, it is difficult to visually confirm many bonding wires at the same time, and it is difficult to make a pass / fail judgment when there is a runout, and the operating rate is sufficiently increased. I couldn't do that.
【００１１】本発明は、このような問題点に鑑み、ボン
ディングワイヤの振れを容易かつ自動的に検知すること
のできるボンディングワイヤの振れ検出器を提供するこ
とを目的とする。In view of the above problems, it is an object of the present invention to provide a bonding wire deflection detector capable of easily and automatically detecting the deflection of the bonding wire.
【００１２】[0012]
【課題を解決するための手段】本発明者らは、ボンディ
ングワイヤの巻取り工程中の振れを定量的に検出するこ
とを鋭意研究した結果、本発明をするに至った。The inventors of the present invention have earnestly studied to quantitatively detect the shake during the winding process of the bonding wire, and as a result, have accomplished the present invention.
【００１３】本発明のボンディングワイヤの振れ検出器
は、ボンディングワイヤの巻取り装置の繰出しスプール
から最初に経由するプーリーの取付けステーに取り付け
られた歪みゲージと、該歪みゲージの出力電圧が過大に
なったこと、および歪みゲージの出力電圧に検出された
パルス状波形のパルス幅が過大であったことにより、前
記繰出しスプール上のボンディングワイヤにくぐりが発
生したことを検知する手段とを備える。In the bonding wire deflection detector of the present invention, the strain gauge attached to the pulley mounting stay that first passes from the feeding spool of the bonding wire winding device and the output voltage of the strain gauge become excessive. And that the pulse width of the pulse-shaped waveform detected in the output voltage of the strain gauge is excessively large, and means for detecting that the bonding wire on the payout spool has passed through.
【００１４】本発明のボンディングワイヤの巻取り装置
は、繰出しスプールと、該繰出しスプールから繰り出さ
れるボンディングワイヤが経由する複数のプーリーと、
回転する巻取りスプールと、繰出しスプールから最初に
経由するプーリーの取付けステーに取り付けられた歪み
ゲージとを備える。前記歪みゲージの出力電圧が過大に
なったこと、および歪みゲージの出力電圧に検出された
パルス状波形のパルス幅が過大であったことにより、前
記繰出しスプール上のボンディングワイヤにくぐりが発
生したことを検知する手段を設ける。The bonding wire take-up device of the present invention comprises a pay-out spool, and a plurality of pulleys through which the bonding wire paid out from the pay-out spool passes.
It comprises a rotating take-up spool and a strain gauge mounted on the pulley mounting stay which is routed first from the pay-out spool. Since the output voltage of the strain gauge becomes excessively large and the pulse width of the pulse-shaped waveform detected in the output voltage of the strain gauge is excessively large, the bonding wire on the feeding spool has passed through. A means for detecting is provided.
【００１５】くぐりが発生したことを検知した場合に
は、警報ランプを点灯させて、オペレータに報せる。警
報ランプが点いた後は、ボンディングワイヤの状態、お
よび巻き取られたボンディングワイヤの状態を、オペレ
ータが確認し、巻取り工程の合否判定を行う。When it is detected that the underpass has occurred, the alarm lamp is turned on to notify the operator. After the alarm lamp is turned on, the operator confirms the state of the bonding wire and the state of the wound bonding wire, and the pass / fail judgment of the winding process is performed.
【００１６】[0016]
【発明の実施の形態】以下に、一実施例を示した図面に
基づいて、本発明を説明する。図１は、本発明のボンデ
ィングワイヤの巻取り装置の一実施例を示す側面図であ
る。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to the drawings showing an embodiment. FIG. 1 is a side view showing an embodiment of a bonding wire winding device of the present invention.
【００１７】ボンディングワイヤ２が、繰出しスプール
１から繰り出され、プーリー４、５、６、７を経由し
て、巻取りスプール８に巻き取られるように構成され
る。繰出しスプール１、プーリー４、５、６、７は、回
転自在に取り付けられ、巻取りスプール８は、回転速度
が制御可能に回転する。さらに、ボンディングワイヤ２
がプーリー４から脱線しないように、繰出しスプール１
の回転軸に対し、プーリー４の回転軸は、平面視で直交
の関係にある。プーリー５、６、７、巻取りスプール８
の回転軸は、プーリー４の回転軸と平行である。The bonding wire 2 is unwound from the unwinding spool 1 and is wound around the winding spool 8 via the pulleys 4, 5, 6, and 7. The pay-out spool 1 and the pulleys 4, 5, 6, 7 are rotatably attached, and the take-up spool 8 rotates in a controllable rotational speed. Furthermore, the bonding wire 2
The spool 1 so that it does not derail from the pulley 4.
The rotation axis of the pulley 4 is orthogonal to the rotation axis of 1 in plan view. Pulleys 5, 6, 7 and take-up spool 8
The rotation axis of is parallel to the rotation axis of the pulley 4.
【００１８】繰出しスプール１から最初に経由するプー
リー４は、図示したように斜め方向に伸び、板厚０．１
〜３．０ｍｍの金属板からなる取付けステーの先端に取
り付けられる。歪みゲージ３は、該取付けステーに取り
付けた。The pulley 4 passing first from the pay-out spool 1 extends obliquely as shown in the drawing and has a plate thickness of 0.1.
It is attached to the tip of a mounting stay made of a metal plate of ~ 3.0 mm. The strain gauge 3 was attached to the attachment stay.
【００１９】ボンディングワイヤ２によりプーリー４が
受ける力は、図５に示すように、繰出しスプール１から
繰り出されたボンディングワイヤ２の方向と、該方向に
直交する平面上の２方向との計３方向に分解可能で、歪
みゲージ３の検出方向を、３方向のいずれかに一致させ
る。歪みゲージ３の検出方向を変えて得られた出力電圧
波形から、ボンディングワイヤ２の振れがそれぞれ検出
できたが、繰出しスプール１から繰り出されたボンディ
ングワイヤ２の方向に検出方向を一致させた歪みゲージ
３の出力電圧波形では、ボンディングワイヤ２の張力の
方が大きいため、ボンディングワイヤ２の振れの検出に
は適さなかった。As shown in FIG. 5, the force applied to the pulley 4 by the bonding wire 2 is a total of three directions, that is, the direction of the bonding wire 2 unwound from the unwinding spool 1 and two directions on a plane orthogonal to the direction. The strain gauge 3 can be detected in any of the three directions. Although the deflection of the bonding wire 2 could be detected from the output voltage waveform obtained by changing the detection direction of the strain gauge 3, the strain gauge in which the detection direction coincides with the direction of the bonding wire 2 delivered from the delivery spool 1 is detected. In the output voltage waveform of No. 3, since the tension of the bonding wire 2 was larger, it was not suitable for detecting the deflection of the bonding wire 2.
【００２０】歪みゲージ３の出力電圧波形が過大とな
り、パルス状の波形が見られた時に、ボンディングワイ
ヤの巻取り装置を停止し、繰出しスプール上のボンディ
ングワイヤを観察したところ、くぐりが見られた。When the output voltage waveform of the strain gauge 3 became excessive and a pulse-like waveform was observed, the winding device of the bonding wire was stopped and the bonding wire on the pay-out spool was observed. .
【００２１】図２に示した歪み変換器は、歪みゲージ３
の出力電圧が、電圧設定ボリュームにて設定した電圧設
定値を超えた場合、警報ランプを点灯させる電気回路を
内蔵する。また、歪みゲージ３の出力電圧が、パルス幅
設定ボリュームにて設定したパルス幅設定値を超えた場
合でも、警報ランプを点灯させる電気回路を備える。警
報ランプは、歪みゲージ３の出力電圧が消失した後も点
灯し続け、リセットスイッチにより消灯する。歪み変換
器の電気回路は、周知の技術に基づいて容易に構成可能
である。これらの電気回路の例を図６に示す。The strain transducer shown in FIG. 2 has a strain gauge 3
If the output voltage of exceeds the voltage setting value set by the voltage setting potentiometer, the built-in electric circuit that lights the alarm lamp. Further, an electric circuit is provided which lights up the alarm lamp even when the output voltage of the strain gauge 3 exceeds the pulse width setting value set by the pulse width setting volume. The alarm lamp continues to light even after the output voltage of the strain gauge 3 disappears, and is turned off by the reset switch. The electric circuit of the distortion converter can be easily constructed based on well-known techniques. An example of these electric circuits is shown in FIG.
【００２２】前述のような歪みゲージと歪み変換器とか
らなる振れ検出器により、遠隔位置でくぐりの検知が可
能となる。また、警報ランプの点灯と同時に、ボンディ
ングワイヤの巻取り装置を停止させて、オペレータに巻
取り工程の合否判定を促す警報を発するようにしてもよ
い。該歪み変換器により、巻取り工程の作業効率が格段
に向上した。The shake detector composed of the strain gauge and the strain converter as described above makes it possible to detect the diversion at a remote position. Further, the winding device for the bonding wire may be stopped at the same time when the alarm lamp is turned on, and an alarm for prompting the operator to determine whether the winding process is acceptable or not may be issued. With the strain converter, the work efficiency of the winding process is significantly improved.
【００２３】（実施例）以下に、図面に基づいて実施例
を説明する。図１は、本発明のボンディングワイヤの巻
取り装置の一実施例を示す側面図である。(Embodiment) An embodiment will be described below with reference to the drawings. FIG. 1 is a side view showing an embodiment of a bonding wire winding device of the present invention.
【００２４】繰出しスプール１に巻かれた直径３０μｍ
のボンディングワイヤ２を、張力２９．４ｍＮ（３．０
ｇｆ）で、直径５０ｍｍの巻取りスプール８を、回転速
度５１０ｒｐｍで回転させて巻き取った。歪みゲージ３
は、厚さ０．５ｍｍの銅板に取り付けた。歪み変換器の
電圧設定値を０．４Ｖとし、パルス幅設定値を３ｍｓと
して、それぞれ設定値以上に歪みゲージ３の出力電圧が
達した時に、警報ランプが点くようにした。Diameter of 30 μm wound around pay-out spool 1
Bonding wire 2 of which tension is 29.4 mN (3.0
In gf), the winding spool 8 having a diameter of 50 mm was wound at a rotation speed of 510 rpm. Strain gauge 3
Was attached to a copper plate having a thickness of 0.5 mm. The voltage setting value of the strain converter is set to 0.4 V, the pulse width setting value is set to 3 ms, and the alarm lamp is turned on when the output voltage of the strain gauge 3 reaches the set value or more.
【００２５】図３は、通常の場合の歪みゲージ３の出力
電圧波形を、オシロスコープでモニターした結果であ
る。歪みゲージ３の出力電圧の最大値は０．３Ｖで、電
圧設定値以下であり、パルス状の波形は見られなかっ
た。FIG. 3 shows the result of monitoring the output voltage waveform of the strain gauge 3 in a normal case with an oscilloscope. The maximum value of the output voltage of the strain gauge 3 was 0.3 V, which was less than or equal to the voltage setting value, and no pulse-like waveform was seen.
【００２６】図４は、繰出しワイヤー１上でワイヤーく
ぐりが有り、ボンディングワイヤ２の振れが発生した場
合の歪みゲージ３の出力電圧波形を、オシロスコープで
モニターした結果である。歪みゲージ３の出力電圧の最
大値は０．７Ｖで、設定値以上であり、波形写真から読
み取ったパルス状の波形のパルス幅は７ｍｓであった。FIG. 4 shows the result of monitoring the output voltage waveform of the strain gauge 3 with an oscilloscope when there is a wire passage on the pay-out wire 1 and the deflection of the bonding wire 2 occurs. The maximum value of the output voltage of the strain gauge 3 was 0.7 V, which was above the set value, and the pulse width of the pulse-like waveform read from the waveform photograph was 7 ms.
【００２７】本実施例により、繰出しスプール１上でボ
ンディングワイヤ２にくぐりが有った場合に発生するボ
ンディングワイヤ２の振れは、歪みゲージ３の出力電圧
波形を監視することにより、検出可能であることが確認
できた。According to the present embodiment, the deflection of the bonding wire 2 which occurs when the bonding wire 2 passes through on the feeding spool 1 can be detected by monitoring the output voltage waveform of the strain gauge 3. I was able to confirm that.
【００２８】また、詳細な実施例は示さないが、電圧設
定値およびパルス幅設定値の組み合わせを適当に選定す
ることにより、繰出しスプール上のボンディングワイヤ
の食い込みによる不良や、機械的要因でのボンディング
ワイヤの振れが、それぞれ検出できることも確認した。Although a detailed embodiment is not shown, by properly selecting the combination of the voltage setting value and the pulse width setting value, a defect due to the biting of the bonding wire on the feeding spool and a bonding due to a mechanical factor are performed. It was also confirmed that the runout of the wire could be detected.
【００２９】さらに、前記歪み変換器のような検出回路
を２以上備えて、２以上の異常のそれぞれの特徴に合わ
せた設定値を設定することにより、同時に検出すること
も可能である。Further, it is possible to detect at the same time by providing two or more detection circuits such as the distortion converter and setting a set value according to each characteristic of two or more abnormalities.
【００３０】あるいは、歪みゲージを巻取りスプールの
取り付け部に設けてもよい。この場合には、歪みゲージ
の出力電圧により、巻き取られたボンディングワイヤの
質量を同時に測定可能になる。Alternatively, a strain gauge may be provided at the mounting portion of the take-up spool. In this case, the output voltage of the strain gauge can simultaneously measure the mass of the wound bonding wire.
【００３１】[0031]
【発明の効果】本発明により、ボンディングワイヤの繰
出しスプール上のボンディングワイヤのくぐりを、容易
に検出可能であり、蛇行不良の流出を防止できる。As described above, according to the present invention, it is possible to easily detect the passing of the bonding wire on the payout spool of the bonding wire and prevent the outflow of the meandering defect.
【図１】 本発明の巻取り装置の一実施例を示す側面図
である。FIG. 1 is a side view showing an embodiment of a winding device of the present invention.
【図２】 本発明の歪み変換器の一実施例を示す正面図
である。FIG. 2 is a front view showing an embodiment of the distortion converter of the present invention.
【図３】 通常の歪みゲージの出力電圧波形を示すチャ
ートグラフである。FIG. 3 is a chart graph showing an output voltage waveform of a normal strain gauge.
【図４】 くぐりの有る場合の歪みゲージの出力電圧波
形を示すチャートグラフである。FIG. 4 is a chart graph showing an output voltage waveform of a strain gauge in the case where there is a hollow.
【図５】 ボンディングワイヤの振れの説明図である。FIG. 5 is an explanatory diagram of a deflection of a bonding wire.
【図６】 歪み変換器の一実施例を示す回路構成図であ
る。FIG. 6 is a circuit configuration diagram showing an embodiment of a distortion converter.
１ 繰出しスプール ２ ボンディングワイヤ ３ 歪みゲージ ４、５、６、７ プーリー ８ 巻取りスプール ９ 歪み変換器 1 Delivery spool 2 Bonding wire 3 strain gauge 4, 5, 6, 7 pulley 8 take-up spool 9 distortion converter
───────────────────────────────────────────────────── フロントページの続き (72)発明者 阿久津 智 東京都青梅市末広町１−６−１ 住友金属 鉱山株式会社電子事業本部内 (72)発明者 佐藤 文男 東京都青梅市末広町１−６−１ 住友金属 鉱山株式会社電子事業本部内 Ｆターム(参考） 3F109 AA03 BA02 CA03 5F044 FF10 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Satoshi Akutsu Sumitomo Metals 1-6-1 Suehiro-cho, Ome-shi, Tokyo Mining Co., Ltd. Electronic Business Division (72) Inventor Fumio Sato Sumitomo Metals 1-6-1 Suehiro-cho, Ome-shi, Tokyo Mining Co., Ltd. Electronic Business Division F term (reference) 3F109 AA03 BA02 CA03 5F044 FF10
Claims (2)
しスプールから最初に経由するプーリーの取付けステー
に取り付けられた歪みゲージと、該歪みゲージの出力電
圧が過大になったこと、および歪みゲージの出力電圧に
検出されたパルス状波形のパルス幅が過大であったこと
により、前記繰出しスプール上のボンディングワイヤに
くぐりが発生したことを検知する歪み変換手段とを備え
たことを特徴とするボンディングワイヤの振れ検出器。1. A strain gauge attached to a mounting stay of a pulley which first passes from a payout spool of a winding device for a bonding wire, an output voltage of the strain gauge being excessive, and an output voltage of the strain gauge. The deflection of the bonding wire is characterized by further comprising a strain converting means for detecting that the bonding wire on the pay-out spool has passed due to an excessively large pulse width of the pulse-shaped waveform detected in Detector.
ら繰り出されるボンディングワイヤが経由する複数のプ
ーリーと、回転する巻取りスプールと、繰出しスプール
から最初に経由するプーリーの取付けステーに取り付け
られた歪みゲージとを備えた巻取り装置であって、前記
歪みゲージの出力電圧が過大になったこと、および歪み
ゲージの出力電圧に検出されたパルス状波形のパルス幅
が過大であったことにより、前記繰出しスプール上のボ
ンディングワイヤにくぐりが発生したことを検知する手
段を設けることを特徴とするボンディングワイヤの巻取
り装置。2. A pay-out spool, a plurality of pulleys through which a bonding wire paid out from the pay-out spool passes, a rotating take-up spool, and a strain gauge attached to a mounting stay of the pulley passing first from the pay-out spool. And a pulse width of the pulse-shaped waveform detected in the output voltage of the strain gauge is too large. A winding device for a bonding wire, characterized in that it is provided with means for detecting the occurrence of a dip in the upper bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001249328A JP4556361B2 (en) | 2001-08-20 | 2001-08-20 | Bond wire runout detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001249328A JP4556361B2 (en) | 2001-08-20 | 2001-08-20 | Bond wire runout detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003054834A true JP2003054834A (en) | 2003-02-26 |
| JP4556361B2 JP4556361B2 (en) | 2010-10-06 |
Family
ID=19078347
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001249328A Expired - Fee Related JP4556361B2 (en) | 2001-08-20 | 2001-08-20 | Bond wire runout detector |
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| Country | Link |
|---|---|
| JP (1) | JP4556361B2 (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892256U (en) * | 1981-12-18 | 1983-06-22 | 日鐵溶接工業株式会社 | Tangle detection device for coiled steel wire |
| JPH04100635A (en) * | 1990-08-20 | 1992-04-02 | Satsuki Seisakusho:Kk | Device for feeding wire material |
| JPH08206764A (en) * | 1995-02-06 | 1996-08-13 | Daido Steel Co Ltd | Wire rod supply method and device |
-
2001
- 2001-08-20 JP JP2001249328A patent/JP4556361B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5892256U (en) * | 1981-12-18 | 1983-06-22 | 日鐵溶接工業株式会社 | Tangle detection device for coiled steel wire |
| JPH04100635A (en) * | 1990-08-20 | 1992-04-02 | Satsuki Seisakusho:Kk | Device for feeding wire material |
| JPH08206764A (en) * | 1995-02-06 | 1996-08-13 | Daido Steel Co Ltd | Wire rod supply method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4556361B2 (en) | 2010-10-06 |
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