JP2003053899A - Laminated body for flat cable - Google Patents
Laminated body for flat cableInfo
- Publication number
- JP2003053899A JP2003053899A JP2001242422A JP2001242422A JP2003053899A JP 2003053899 A JP2003053899 A JP 2003053899A JP 2001242422 A JP2001242422 A JP 2001242422A JP 2001242422 A JP2001242422 A JP 2001242422A JP 2003053899 A JP2003053899 A JP 2003053899A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- adhesive resin
- resin layer
- flat cable
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004840 adhesive resin Substances 0.000 claims abstract description 130
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 130
- 239000003063 flame retardant Substances 0.000 claims abstract description 49
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000000576 coating method Methods 0.000 claims abstract description 44
- 239000004020 conductor Substances 0.000 claims abstract description 44
- 239000011248 coating agent Substances 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000001035 drying Methods 0.000 abstract description 13
- 239000002904 solvent Substances 0.000 abstract description 8
- 229920002799 BoPET Polymers 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 153
- 229920005989 resin Polymers 0.000 description 25
- 239000011347 resin Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 24
- 239000002184 metal Substances 0.000 description 24
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 23
- -1 polyethylene terephthalate Polymers 0.000 description 23
- 239000007788 liquid Substances 0.000 description 13
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 7
- 239000012948 isocyanate Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920005862 polyol Polymers 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 229920001169 thermoplastic Polymers 0.000 description 7
- 239000004416 thermosoftening plastic Substances 0.000 description 7
- 229910019142 PO4 Inorganic materials 0.000 description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 6
- 150000002513 isocyanates Chemical class 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 235000021317 phosphate Nutrition 0.000 description 6
- 229920001225 polyester resin Polymers 0.000 description 6
- 239000004645 polyester resin Substances 0.000 description 6
- 239000013557 residual solvent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 150000003077 polyols Chemical class 0.000 description 5
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 5
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 4
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 4
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical class CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 3
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 3
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 3
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 3
- 239000001095 magnesium carbonate Substances 0.000 description 3
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 229920000388 Polyphosphate Polymers 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 2
- 229910052794 bromium Inorganic materials 0.000 description 2
- GQVCNZBQZKXBMX-UHFFFAOYSA-N butan-2-one;toluene Chemical compound CCC(C)=O.CC1=CC=CC=C1 GQVCNZBQZKXBMX-UHFFFAOYSA-N 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007756 gravure coating Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- YQFILLONAQHQKO-UHFFFAOYSA-N phosphinine-2-carboxylic acid Chemical class OC(=O)C1=CC=CC=P1 YQFILLONAQHQKO-UHFFFAOYSA-N 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 239000001205 polyphosphate Substances 0.000 description 2
- 235000011176 polyphosphates Nutrition 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- RVHSTXJKKZWWDQ-UHFFFAOYSA-N 1,1,1,2-tetrabromoethane Chemical compound BrCC(Br)(Br)Br RVHSTXJKKZWWDQ-UHFFFAOYSA-N 0.000 description 1
- GRPTWLLWXYXFLX-UHFFFAOYSA-N 1,1,2,2,3,3-hexabromocyclodecane Chemical compound BrC1(Br)CCCCCCCC(Br)(Br)C1(Br)Br GRPTWLLWXYXFLX-UHFFFAOYSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HANGEEGHMFWXAA-UHFFFAOYSA-N 2,4,5-trioxa-1-stiba-3-borabicyclo[1.1.1]pentane Chemical compound [Sb+3].[O-]B([O-])[O-] HANGEEGHMFWXAA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QJGNSTCICFBACB-UHFFFAOYSA-N 2-octylpropanedioic acid Chemical compound CCCCCCCCC(C(O)=O)C(O)=O QJGNSTCICFBACB-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- SYEOWUNSTUDKGM-YFKPBYRVSA-N 3-methyladipic acid Chemical compound OC(=O)C[C@@H](C)CCC(O)=O SYEOWUNSTUDKGM-YFKPBYRVSA-N 0.000 description 1
- WPSWDCBWMRJJED-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;oxirane Chemical compound C1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WPSWDCBWMRJJED-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- HZCDANOFLILNSA-UHFFFAOYSA-N Dimethyl hydrogen phosphite Chemical class COP(=O)OC HZCDANOFLILNSA-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920002302 Nylon 6,6 Polymers 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Chemical class 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- QHWKHLYUUZGSCW-UHFFFAOYSA-N Tetrabromophthalic anhydride Chemical compound BrC1=C(Br)C(Br)=C2C(=O)OC(=O)C2=C1Br QHWKHLYUUZGSCW-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- PQYJRMFWJJONBO-UHFFFAOYSA-N Tris(2,3-dibromopropyl) phosphate Chemical compound BrCC(Br)COP(=O)(OCC(Br)CBr)OCC(Br)CBr PQYJRMFWJJONBO-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- VCNTUJWBXWAWEJ-UHFFFAOYSA-J aluminum;sodium;dicarbonate Chemical compound [Na+].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O VCNTUJWBXWAWEJ-UHFFFAOYSA-J 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- ZRALSGWEFCBTJO-UHFFFAOYSA-N anhydrous guanidine Natural products NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DAMJCWMGELCIMI-UHFFFAOYSA-N benzyl n-(2-oxopyrrolidin-3-yl)carbamate Chemical compound C=1C=CC=CC=1COC(=O)NC1CCNC1=O DAMJCWMGELCIMI-UHFFFAOYSA-N 0.000 description 1
- SYEOWUNSTUDKGM-UHFFFAOYSA-N beta-methyladipic acid Natural products OC(=O)CC(C)CCC(O)=O SYEOWUNSTUDKGM-UHFFFAOYSA-N 0.000 description 1
- RAYIMXZLSRHMTK-UHFFFAOYSA-N bis(2,3-dibromopropyl) 2,3-dichloropropyl phosphate Chemical compound ClCC(Cl)COP(=O)(OCC(Br)CBr)OCC(Br)CBr RAYIMXZLSRHMTK-UHFFFAOYSA-N 0.000 description 1
- GPZPNAVMOODHSK-UHFFFAOYSA-N bis(3-chloropropyl) octyl phosphate Chemical compound CCCCCCCCOP(=O)(OCCCCl)OCCCCl GPZPNAVMOODHSK-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910001647 dawsonite Inorganic materials 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical group 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 229920006225 ethylene-methyl acrylate Polymers 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- 239000012757 flame retardant agent Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001112 grafted polyolefin Polymers 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- AVIYEYCFMVPYST-UHFFFAOYSA-N hexane-1,3-diol Chemical compound CCCC(O)CCO AVIYEYCFMVPYST-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 229920001912 maleic anhydride grafted polyethylene Polymers 0.000 description 1
- 229920001911 maleic anhydride grafted polypropylene Polymers 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 229910000476 molybdenum oxide Inorganic materials 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 1
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 1
- PQQKPALAQIIWST-UHFFFAOYSA-N oxomolybdenum Chemical compound [Mo]=O PQQKPALAQIIWST-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Chemical class 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920005678 polyethylene based resin Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 229920000874 polytetramethylene terephthalate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 229920006344 thermoplastic copolyester Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- JZZBTMVTLBHJHL-UHFFFAOYSA-N tris(2,3-dichloropropyl) phosphate Chemical compound ClCC(Cl)COP(=O)(OCC(Cl)CCl)OCC(Cl)CCl JZZBTMVTLBHJHL-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- GTRSAMFYSUBAGN-UHFFFAOYSA-N tris(2-chloropropyl) phosphate Chemical compound CC(Cl)COP(=O)(OCC(C)Cl)OCC(C)Cl GTRSAMFYSUBAGN-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 150000003755 zirconium compounds Chemical class 0.000 description 1
Landscapes
- Insulated Conductors (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】
【課題】 フラットケーブルの被覆材に用いる積層体で
あって、難燃性、導体接着性、自己融着性、導体埋め込
み性、摺動特性などの性能に優れると共に、残留溶剤も
殆どなく、生産性にも優れたフラットケーブル用積層体
を提供する。
【解決手段】 フラットケーブル用積層体10を、少なく
ともＰＥＴフィルムなどの可撓性を有する耐熱性基材１
と、その一方の面に設けられた２層以上の多層（図１で
は３層）に分割して積層されたの熱接着性樹脂層との積
層体で形成すると共に、それぞれの熱接着性樹脂層を、
別の離型性基材に塗布、乾燥して形成した塗膜の転写層
で形成し、また、それぞれの熱接着性樹脂層は、その積
層位置（耐熱性基材１に接する層、中間層、導体に接す
る層）に応じて、重視される機能に対応できるよう熱接
着性樹脂の選択や難燃剤の含有量の調節などを行って構
成する。
PROBLEM TO BE SOLVED: To provide a laminate used as a covering material for a flat cable, which has excellent properties such as flame retardancy, conductor adhesion, self-fusing properties, conductor embedding properties, sliding properties, and remains. Provided is a flat cable laminate having little solvent and excellent productivity. SOLUTION: A laminate 10 for a flat cable is made of a heat-resistant base material 1 having at least flexibility such as a PET film.
And a heat-adhesive resin layer formed by dividing into two or more multi-layers (three layers in FIG. 1) provided on one surface of the heat-adhesive resin layer. Layers
It is formed by a transfer layer of a coating film formed by coating and drying on another release substrate, and each of the heat-adhesive resin layers is placed at the lamination position (a layer in contact with the heat-resistant substrate 1, an intermediate layer, , The layer in contact with the conductor), by selecting a heat-adhesive resin, adjusting the content of a flame retardant, and the like so as to be able to cope with a function to be emphasized.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フラットケーブル
の被覆材に用いられるフラットケーブル用積層体に関
し、更に詳しくは、パソコン、液晶表示装置、ゲーム
機、携帯電話、プリンター、複写機等の電子・電気機
器、自動車等の内部配線に使用されるフラットケーブル
の被覆材に用いられ、難燃性、耐熱性、熱接着性、絶縁
性、屈曲性等に優れると共に、生産性にも優れたフラッ
トケーブル用積層体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flat cable laminate used as a covering material for a flat cable, and more specifically, it is used for electronic devices such as personal computers, liquid crystal display devices, game machines, mobile phones, printers, copiers and the like. A flat cable that is used as a covering material for flat cables used for internal wiring of electrical equipment, automobiles, etc., and has excellent flame retardancy, heat resistance, thermal adhesion, insulation, flexibility, etc., and also excellent productivity. For a laminated body.
【０００２】[0002]
【従来の技術】従来、フラットケーブルの被覆材に用い
る積層体としては、例えば、可撓性、耐熱性を有する基
材の一方の面に、プライマー層（接着性向上層）を設
け、その上に難燃性を付与した熱接着性樹脂層を形成し
た構成の積層体が用いられていた。この難燃性を付与し
た熱接着性樹脂層は、難燃性と共に、自己融着性、導体
（金属）接着性、導体埋め込み性、耐熱性などの特性を
併せ持つ必要があり、例えば、適する熱接着性樹脂を選
定し、その溶液に難燃剤を溶解もしくは分散させて、難
燃性熱接着性樹脂の塗布液を作製し、これを前記可撓
性、耐熱性基材の一方の面に形成されたプライマー層の
上に塗布、乾燥して難燃性熱接着性樹脂層を形成する方
法が採られていた。2. Description of the Related Art Conventionally, as a laminate used for a covering material for a flat cable, for example, a primer layer (adhesion improving layer) is provided on one surface of a base material having flexibility and heat resistance A laminated body having a structure in which a heat-adhesive resin layer having flame retardancy is formed is used. This flame-retardant heat-adhesive resin layer must have flame-retardant properties as well as self-fusing properties, conductor (metal) adhesive properties, conductor embedding properties, heat resistance, and the like. Select an adhesive resin, dissolve or disperse the flame retardant in the solution to prepare a coating solution of the flame-retardant heat-adhesive resin, and form this on one side of the flexible, heat-resistant substrate. A method of forming a flame-retardant heat-adhesive resin layer by coating and drying the applied primer layer has been adopted.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述の
ような難燃性熱接着性樹脂層は、例えば、良好な導体埋
め込み性を有するためには、その厚さを少なくとも２５
〜４０μｍ程度に形成する必要があり、このような厚さ
の難燃性熱接着性樹脂層を塗布液のコーティング方式で
形成するためには、塗布液を１００〜１５０ｇ／ｍ2 の
ように大量に塗布することになり、距離の長い乾燥装置
の設置、或いは、コーティング速度を著しく低下させて
乾燥時間を長くするなどの対策を採る必要があり、その
結果、生産コストを押し上げ、製品価格の上昇を招くと
いう問題があった。However, the flame-retardant heat-adhesive resin layer as described above has a thickness of at least 25 in order to have a good conductor embedding property.
It is necessary to form the coating liquid to about 40 μm, and in order to form the flame-retardant heat-adhesive resin layer having such a thickness by the coating method of the coating liquid, a large amount of the coating liquid such as 100 to 150 g / m 2 is used. Therefore, it is necessary to take measures such as installing a drying device with a long distance, or significantly reducing the coating speed and lengthening the drying time, resulting in an increase in production cost and an increase in product price. There was a problem of inviting.
【０００４】上記の対策を採った場合でも、難燃性熱接
着性樹脂層中の溶剤等を完全に除去することは困難であ
り、溶剤等の残留が多くなると熱接着性樹脂に対して可
塑剤的に作用し、耐熱性や接着性を低下させ、また、そ
の積層体で金属ケーブルを両側から包み込んで熱接着し
てフラットケーブルに適用した後も、高温の環境下では
難燃性熱接着性樹脂層の内部で気化し、気泡を発生する
結果、金属ケーブルや耐熱性基材との剥離や、層内強度
を低下させるなどの問題があった。Even when the above measures are taken, it is difficult to completely remove the solvent and the like in the flame-retardant heat-adhesive resin layer, and when the amount of the solvent and the like remains, the heat-adhesive resin is plasticized. Acts as a chemical agent to reduce heat resistance and adhesiveness, and even after the metal cable is wrapped from both sides with its laminate and heat-bonded to apply to a flat cable, it is flame-retardant heat-bonded in a high temperature environment. As a result of vaporization inside the functional resin layer and generation of air bubbles, there are problems such as separation from the metal cable or the heat-resistant base material, and reduction in strength within the layer.
【０００５】また、高度な難燃性を付与するためには、
熱接着性樹脂中に一定の割合以上の難燃剤を添加する必
要があり、そのようにすると熱接着性樹脂の熱接着性が
損なわれ優れた熱接着性が得られなくなるため、難燃剤
の添加量が制約されるという問題があった。このように
難燃性熱接着性樹脂層で、高度な難燃性と優れた自己融
着性、導体（金属）接着性、導体埋め込み性を同時に持
たせることは困難であった。Further, in order to impart high flame retardancy,
It is necessary to add a certain proportion or more of the flame retardant to the heat-adhesive resin, and if this is done, the heat-adhesiveness of the heat-adhesive resin will be impaired and excellent heat-adhesiveness will not be obtained. There was a problem that the quantity was limited. Thus, it was difficult for the flame-retardant heat-adhesive resin layer to have high flame retardancy and excellent self-fusion property, conductor (metal) adhesive property, and conductor embedding property at the same time.
【０００６】また、前記残留溶剤の問題を解決するため
に、難燃性熱接着性樹脂層を溶融押し出しコーティング
法で形成する方法も研究されているが、難燃剤の添加量
が多くなると押し出し適性が損なわれ、また、溶融時の
高温加熱で難燃剤が劣化する問題があり、未だ解決に至
っていない。Further, in order to solve the problem of the residual solvent, a method of forming the flame-retardant heat-adhesive resin layer by a melt extrusion coating method has been researched. However, when the amount of the flame retardant added is large, it is suitable for extrusion. However, there is a problem that the flame retardant is deteriorated by heating at a high temperature during melting, and the problem has not been solved yet.
【０００７】本発明は、このような問題点を解決するた
めになされたものであり、その目的とするところは、高
度な難燃性と優れた自己融着性、導体（金属）接着性、
導体埋め込み性を備えると共に、残留溶剤も殆どなく、
生産性、経済性に優れ、また、耐熱性、電気絶縁性、屈
曲性などの諸性能にも優れたフラットケーブル用積層体
を提供することにある。The present invention has been made to solve the above problems, and its purpose is to achieve high flame retardancy, excellent self-fusion property, conductor (metal) adhesive property,
In addition to having conductor embedding properties, there is almost no residual solvent,
It is an object of the present invention to provide a laminate for a flat cable, which has excellent productivity and economical efficiency, and also has various properties such as heat resistance, electric insulation, and flexibility.
【０００８】[0008]
【課題を解決するための手段】上記の課題は、以下の本
発明により解決することができる。即ち、請求項１に記
載した発明は、フラットケーブルの導体を両側から挟み
込み、熱接着により被覆して用いられる積層体であっ
て、該積層体が、少なくとも可撓性を有する耐熱性基材
と、その一方の面に積層された２層以上の熱接着性樹脂
層とで形成され、それぞれの熱接着性樹脂層が、予め他
の離型性基材上に形成された熱接着性樹脂塗膜の転写層
で形成されると共に、少なくとも導体に接する熱接着性
樹脂層以外の熱接着性樹脂層には難燃剤が含有されてい
ることを特徴とするフラットケーブル用積層体からな
る。The above-mentioned problems can be solved by the present invention described below. That is, the invention described in claim 1 is a laminated body which is used by sandwiching the conductor of a flat cable from both sides and covering it by thermal adhesion, wherein the laminated body is a heat-resistant base material having at least flexibility. , A heat-adhesive resin layer formed on at least one surface of the releasable base material, each heat-adhesive resin layer being formed of two or more heat-adhesive resin layers laminated on one surface thereof. The flat cable laminate is characterized in that a flame retardant is contained in at least a thermoadhesive resin layer other than the thermoadhesive resin layer that is formed of a film transfer layer and is in contact with the conductor.
【０００９】このような構成を採ることにより、以下に
列挙するような作用効果を得ることができる。
（１）熱接着性樹脂層の厚さが、２５〜４０μｍ、或い
はそれ以上、例えば５０μｍのような厚さで必要とされ
る場合でも、適宜に難燃剤を含有させた熱接着性樹脂の
塗布液を、予め、離型性を付与した紙またはフィルムな
どの他の離型性基材上に、複数に分割して塗布、乾燥し
て塗膜層を形成しておいて、それを熱転写などで可撓性
を有する耐熱性基材に逐次転写して所望の厚さに形成す
ることができるので、個々の塗膜は薄くすることがで
き、残留溶剤の問題もなく高速で塗膜層を形成すること
ができる。
（２）熱接着性樹脂層を、分割した単位厚さで形成でき
るので、可撓性を有する耐熱性基材に積層する位置（下
層、中間層、上層など）により、耐熱性基材に対する接
着性、難燃性、導体（金属）に対する接着性など、重点
機能を変えて形成することができるので、一層性能に優
れたフラットケーブル用積層体を製造することができ
る。
（３）また、熱接着性樹脂層を、単位厚さに分割し、且
つ、上記のように耐熱性基材に積層する位置により、重
点機能を変えて離型性を付与した紙またはフィルム上に
形成し、巻き上げた状態で保存することができるので、
需要に合わせて、可撓性を有する耐熱性基材に、所望の
厚さにそれぞれの熱接着性樹脂層を転写して積層するこ
とができ、小ロットの場合でもロス率を少なく、且つ、
迅速に対応することができる。By adopting such a configuration, the following operational effects can be obtained. (1) Even if the thickness of the heat-adhesive resin layer is required to be 25 to 40 μm or more, for example, 50 μm, the application of the heat-adhesive resin containing a flame retardant is appropriately applied. The liquid is applied in advance on other releasable base material such as paper or film to which releasability is applied, divided into a plurality of parts, and dried to form a coating layer, which is then thermally transferred, etc. Since it can be sequentially transferred to a heat-resistant substrate having flexibility to form a desired thickness, individual coatings can be thinned, and the coating layer can be formed at high speed without the problem of residual solvent. Can be formed. (2) Since the thermo-adhesive resin layer can be formed in divided unit thickness, it is adhered to the heat-resistant substrate depending on the position (lower layer, intermediate layer, upper layer, etc.) to be laminated on the flexible heat-resistant substrate. Since it can be formed by changing important functions such as heat resistance, flame retardancy, and adhesion to a conductor (metal), it is possible to manufacture a flat cable laminate having further excellent performance. (3) Further, on a paper or film on which the heat-adhesive resin layer is divided into unit thicknesses, and the releasability is imparted by changing the important function depending on the position to be laminated on the heat resistant substrate as described above. Since it can be formed into a roll and stored in the rolled state,
According to demand, it is possible to transfer and laminate each heat-adhesive resin layer to a desired thickness on a heat-resistant base material having flexibility, and reduce the loss rate even in the case of a small lot, and
You can respond quickly.
【００１０】請求項２に記載した発明は、前記熱接着性
樹脂層が、少なくとも３層で形成され、前記耐熱性基材
に接する熱接着性樹脂層は、耐熱性基材との接着性に重
点を置き、少量の難燃剤を含むかまたは難燃剤を含まな
い熱接着性樹脂層で形成され、中間の熱接着性樹脂層
は、難燃性に重点を置き、大量の難燃剤を含む熱接着性
樹脂層で形成され、導体に接する熱接着性樹脂層は、導
体との接着性と自己融着性に重点を置き、難燃剤を含ま
ないかまたは少量の難燃剤を含む熱接着性樹脂層で形成
されていることを特徴とする請求項１記載のフラットケ
ーブル用積層体からなる。According to a second aspect of the present invention, the heat-adhesive resin layer is formed of at least three layers, and the heat-adhesive resin layer in contact with the heat-resistant base material has excellent adhesiveness to the heat-resistant base material. Formed with a heat-adhesive resin layer with a small amount of flame retardant or without a flame retardant, the middle heat-adhesive resin layer focuses on flame retardancy and heat with a large amount of flame retardant. The heat-adhesive resin layer formed of an adhesive resin layer, which is in contact with the conductor, focuses on the adhesiveness with the conductor and the self-fusing property, and does not contain the flame retardant or contains a small amount of the flame retardant. The flat cable laminate according to claim 1, wherein the laminate is formed of layers.
【００１１】このような構成は、一種の傾斜的機能を付
与した構成であり、上記のように耐熱性基材に積層する
位置に応じて、熱接着性樹脂の選定と共に、その熱接着
性樹脂に含有させる難燃剤の含有量を調節することがで
きる。即ち、中間の熱接着性樹脂層には、その塗膜形成
に支障がなく、その積層強度を損なわない範囲で、でき
るだけ難燃剤の含有量を多くして難燃性を高め、耐熱性
基材側と導体側の熱接着性樹脂層では、耐熱性基材との
接着性、または導体との接着性と自己融着性をよくする
ため、難燃剤を含まないかまたは少量の難燃剤を含む熱
接着性樹脂層で形成することができる。Such a structure is a structure to which a kind of inclined function is added, and the heat-adhesive resin is selected according to the position to be laminated on the heat-resistant substrate as described above. The content of the flame retardant to be contained in can be adjusted. That is, in the intermediate heat-adhesive resin layer, the content of the flame retardant is increased as much as possible to enhance the flame retardancy within a range that does not hinder the coating film formation and does not impair the lamination strength thereof. The heat-adhesive resin layers on the side and the conductor side do not contain a flame retardant or contain a small amount of a flame retardant in order to improve the adhesiveness with the heat-resistant base material or the adhesiveness with the conductor and the self-fusing property. It can be formed of a heat adhesive resin layer.
【００１２】このような構成を採ることにより、前記請
求項１に記載した発明の作用効果に加えて、例えば、３
層に分割されたそれぞれの熱接着性樹脂層に、その積層
位置に応じて必要な重要機能を重点的に持たせることが
できるので、熱接着性樹脂層全体として、可撓性を有す
る耐熱性基材との接着性、難燃性、導体との接着性と自
己融着性など総合的な性能に一層優れたものにすること
ができ、フラットケーブル用積層体の性能を一層向上さ
せることができる。By adopting such a configuration, in addition to the function and effect of the invention described in claim 1, for example, 3
Each heat-adhesive resin layer divided into layers can be given important functions required depending on the stacking position, so that the heat-adhesive resin layer as a whole has flexibility and heat resistance. It is possible to further improve the overall performance such as adhesiveness with the base material, flame retardancy, adhesiveness with the conductor and self-bonding property, and further improve the performance of the flat cable laminate. it can.
【００１３】請求項３に記載した発明は、前記フラット
ケーブル用積層体の熱接着性樹脂層のうち、導体に接す
る熱接着性樹脂層の表面に微細な凹凸が設けられている
ことを特徴とする請求項１または２に記載のフラットケ
ーブル用積層体である。上記微細な凹凸は、フラットケ
ーブル用積層体の作製後、その熱接着性樹脂層面にエン
ボス加工を行って設けることもできるが、導体側の熱接
着性樹脂層を形成する離型性基材の離型面に予め微細な
凹凸を設けておくことにより、容易に熱接着性樹脂層の
表面に微細な凹凸を賦型することができる。The invention according to claim 3 is characterized in that, of the heat-adhesive resin layers of the flat cable laminate, fine irregularities are provided on the surface of the heat-adhesive resin layer in contact with the conductor. The laminated body for a flat cable according to claim 1 or 2. The fine irregularities may be provided by embossing the heat-adhesive resin layer surface after the flat cable laminate is produced. By providing the release surface with fine irregularities in advance, it is possible to easily apply fine irregularities to the surface of the heat-adhesive resin layer.
【００１４】このような構成を採ることにより、前記請
求項１または２に記載した発明の作用効果に加えて、フ
ラットケーブル用積層体を巻き上げた際の耐ブロッキン
グ性を向上できるので、導体に接する熱接着性樹脂層に
使用する熱接着性樹脂の選択範囲を広げることが可能と
なり、一層低温熱接着性および導体（金属）接着性に優
れた熱接着性樹脂を使用できるようになる。By adopting such a constitution, in addition to the function and effect of the invention described in claim 1 or 2, blocking resistance at the time of winding up the flat cable laminate can be improved, so that it is in contact with the conductor. It becomes possible to expand the selection range of the heat-adhesive resin used for the heat-adhesive resin layer, and it becomes possible to use the heat-adhesive resin having excellent low-temperature heat adhesive property and conductor (metal) adhesive property.
【００１５】[0015]
【発明の実施の形態】以下に、図面を用いて本発明のフ
ラットケーブル用積層体の実施の形態について説明す
る。図１、図２は、それぞれ本発明のフラットケーブル
用積層体の一実施例の構成を示す模式断面図である。但
し、本発明は、その要旨を超えない限り図面に限定され
るものではない。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a flat cable laminate of the present invention will be described below with reference to the drawings. 1 and 2 are schematic cross-sectional views showing the configuration of an embodiment of the flat cable laminate of the present invention. However, the present invention is not limited to the drawings unless the gist thereof is exceeded.
【００１６】図１に示したフラットケーブル用積層体１
０は、可撓性を有する耐熱性基材１の一方の面に、熱接
着性樹脂層を、第１の熱接着性樹脂層２、第２の熱接着
性樹脂層３、第３の熱接着性樹脂層４の順に３層に分割
し、それぞれを別の離型性基材上に形成した熱接着性樹
脂の塗膜を順次熱転写し、積層して構成したものであ
る。The flat cable laminate 1 shown in FIG.
0 is a heat-adhesive resin layer on one surface of the flexible heat-resistant substrate 1, the first heat-adhesive resin layer 2, the second heat-adhesive resin layer 3, and the third heat-adhesive resin layer 3. The adhesive resin layer 4 is divided into three layers in this order, and a coating film of a thermoadhesive resin formed on another releasable substrate is thermally transferred in sequence and laminated.
【００１７】また、図２に示したフラットケーブル用積
層体２０は、前記図１に示したフラットケーブル用積層
体１０の構成において、可撓性を有する耐熱性基材１と
第１の熱接着性樹脂層２との間に接着性向上層５を追加
して設けて構成したものである。上記接着性向上層５
は、可撓性を有する耐熱性基材１面に第１の熱接着性樹
脂層２を熱転写して積層した際、その接着性が不足する
ような場合、必要に応じて設けられるものであり、可撓
性を有する耐熱性基材１の上に、後述するような接着性
向上層５の塗布液を塗布、乾燥することにより設けるこ
とができる。Further, the flat cable laminate 20 shown in FIG. 2 has the same structure as the flat cable laminate 10 shown in FIG. The adhesiveness improving layer 5 is additionally provided between the resin and the resin layer 2. The adhesion improving layer 5
Is provided if necessary when the first thermo-adhesive resin layer 2 is thermally transferred and laminated on the surface of the heat-resistant substrate 1 having flexibility and the adhesiveness is insufficient. It can be provided by applying a coating solution for the adhesion improving layer 5 as described below on the flexible heat-resistant substrate 1 and drying it.
【００１８】本発明において、可撓性を有する耐熱性基
材１は、耐熱性、屈曲性に優れると共に、機械的強度、
寸法安定性、耐薬品性、耐溶剤性、電気絶縁性などに優
れることが好ましく、例えば、ポリエチレンテレフタレ
ート、ポリブチレンテレフタレート、ポリエチレンナフ
タレート、ポリテトラメチレンテレフタレートなどのポ
リエステル、ポリプロピレン、エチレン−プロピレン共
重合体などのポリオレフィン、ナイロン１２、ナイロン
６、ナイロン６６、全芳香族ポリアミドなどのポリアミ
ド、ポリアミドイミド、ポリエーテルイミドなどのポリ
イミド、ポリテトラフルオロエチレン、ポリトリフルオ
ロエチレン、ポリフッ化ビニリデン、ポリフッ化ビニル
などのフッ素含有樹脂、ポリ塩化ビニル、ポリエーテル
スルフォン、ポリエーテルケトン、ポリフェニレンサル
ファイド、ポリアリレート、ポリエステルエーテル、ポ
リカーボネートなどの無延伸または延伸フィルムを使用
することができる。なかでも２軸延伸ポリエチレンテレ
フタレートフィルムは、前記性能と共に、製膜の容易
さ、経済性にも優れており特に好ましく使用することが
できる。In the present invention, the heat-resistant base material 1 having flexibility is excellent in heat resistance and flexibility, and has a mechanical strength,
It is preferable that it is excellent in dimensional stability, chemical resistance, solvent resistance, electrical insulation, and the like. For example, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, and polytetramethylene terephthalate, polypropylene, ethylene-propylene copolymer Polyolefins such as coalesced materials, nylon 12, nylon 6, nylon 66, polyamides such as wholly aromatic polyamides, polyimides such as polyamideimides and polyetherimides, polytetrafluoroethylene, polytrifluoroethylene, polyvinylidene fluoride, polyvinyl fluoride, etc. Fluorine-containing resin, polyvinyl chloride, polyether sulfone, polyether ketone, polyphenylene sulfide, polyarylate, polyester ether, polycarbonate Unstretched or stretched film may be used. Among them, the biaxially stretched polyethylene terephthalate film is excellent in easiness of film formation and economical efficiency, in addition to the above-mentioned properties, and can be particularly preferably used.
【００１９】上記耐熱性基材１の厚さは、通常、６〜１
００μｍのものを使用できる。また、耐熱性基材１の熱
接着性樹脂層を積層する側の面には、コロナ放電処理、
プラズマ処理、オゾン処理などの接着強化処理を施すこ
とが好ましく、更に必要な場合には、図２に示すよう
に、接着性向上層５を設けることができる。The heat-resistant substrate 1 usually has a thickness of 6 to 1
Those having a diameter of 00 μm can be used. Further, on the surface of the heat resistant substrate 1 on which the heat adhesive resin layer is laminated, corona discharge treatment,
It is preferable to perform an adhesion strengthening treatment such as plasma treatment or ozone treatment, and if necessary, an adhesion improving layer 5 can be provided as shown in FIG.
【００２０】接着性向上層５は、可撓性を有する耐熱性
基材１に、前記第１の熱接着性樹脂層２を転写して積層
する際、その接着性を向上させるために必要に応じて予
め耐熱性基材１の積層面に設けるものであり、以下のよ
うな接着性向上剤の塗布液を耐熱性基材１の上に塗布、
乾燥して形成することができる。接着性向上剤として
は、例えば、ポリエチレンイミン、有機チタン化合物、
ポリオレフィン系化合物、ポリブタジエン系化合物、イ
ソシアネート系化合物、ポリエステルウレタン化合物、
ポリエーテルウレタン化合物などのなかから、耐熱性基
材１と第１の熱接着性樹脂層との接着適合性や作業性を
勘案して選定することができる。また、接着部の耐熱性
がよく、塗布、溶剤乾燥後、低温での硬化も可能なポリ
オールを主剤とし、イソシアネートを硬化剤とする２液
硬化型の接着性向上剤を用いることが、フラットケーブ
ルの耐熱性、積層強度を向上できる点で更に好ましい。The adhesiveness improving layer 5 is necessary for improving the adhesiveness when the first heat-adhesive resin layer 2 is transferred and laminated on the flexible heat resistant substrate 1. Correspondingly, it is provided in advance on the laminated surface of the heat resistant substrate 1, and the following coating solution of the adhesion improver is applied on the heat resistant substrate 1,
It can be formed by drying. Examples of the adhesion improver include polyethyleneimine, organic titanium compounds,
Polyolefin compounds, polybutadiene compounds, isocyanate compounds, polyester urethane compounds,
It can be selected from polyether urethane compounds and the like in consideration of the adhesion compatibility and workability between the heat resistant substrate 1 and the first heat adhesive resin layer. In addition, it is possible to use a two-component curing type adhesiveness improver having a polyol as a main component and a isocyanate as a curing agent, which has good heat resistance of an adhesive portion and can be cured at a low temperature after coating and solvent drying. Is more preferable in that the heat resistance and the lamination strength can be improved.
【００２１】上記接着性向上剤の主剤には、エチレング
リコール、ジエチレングリコール、ジプロピレングリコ
ール、１，４−ブタンジオール、１，６−ヘキサンジオ
ール、ネオペンチルグリコールなどのジオール成分と、
アジピン酸、アゼライン酸、セバシン酸、イソフタル
酸、テレフタル酸などの二塩基酸成分とから合成される
ポリエステルポリオールおよびそれらの変性物や、ポリ
エチレングリコール、ポリオキシプロピレングリコー
ル、ポリテトラメチレンエーテルグリコールなどのポリ
エーテルポリオールおよびそれらの変性物や、エチレン
グリコール、ジエチレングリコール、ジプロピレングリ
コール、１，４−ブタンジオール、１，６−ヘキサンジ
オール、ネオペンチルグリコール、トリメチロールプロ
パンなどの低分子ポリオールなどを使用することができ
る。The main component of the adhesion improver is a diol component such as ethylene glycol, diethylene glycol, dipropylene glycol, 1,4-butanediol, 1,6-hexanediol or neopentyl glycol.
Polyester polyols synthesized with dibasic acid components such as adipic acid, azelaic acid, sebacic acid, isophthalic acid, and terephthalic acid, and their modified products, and polyphenols such as polyethylene glycol, polyoxypropylene glycol, and polytetramethylene ether glycol. It is possible to use ether polyols and modified products thereof, and low molecular weight polyols such as ethylene glycol, diethylene glycol, dipropylene glycol, 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, and trimethylolpropane. it can.
【００２２】また、接着性向上剤の硬化剤には、トリレ
ンジイソシアネート、ジフェニルメタンジイソシアネー
ト、ヘキサメチレンジイソシアネート、イソホロンジイ
ソシアネート、トリス（イソシアネートフェニル）、メ
タン−トリス（イソシアネートフェニル）チオホスフェ
ートなどのイソシアネートモノマーや、トリレンジイソ
シアネート、ヘキサメチレンジイソシアネートなどイソ
シアネートモノマーをトリメチロールプロパンに付加し
たウレタンプレポリマー、ヘキサメチレンジイソシアネ
ートビューレット、ヘキサメチレンジイソシアネート及
びイソホロンジイソシアネートトリマーなどのイソシア
ネート変性体などを使用することができる。Further, as a curing agent for the adhesion improver, an isocyanate monomer such as tolylene diisocyanate, diphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, tris (isocyanatophenyl), methane-tris (isocyanatophenyl) thiophosphate, or the like, A urethane prepolymer obtained by adding an isocyanate monomer to trimethylolpropane such as tolylene diisocyanate or hexamethylene diisocyanate, an isocyanate modified product such as hexamethylene diisocyanate burette, hexamethylene diisocyanate and isophorone diisocyanate trimer can be used.
【００２３】上記接着性向上剤の接着強度、耐熱接着
性、反応速度を一層向上させるための助剤として、チタ
ンカップリング剤、シランカップリング剤、或いは無機
フィラーなどを添加することもできる。このような接着
性向上剤は、トルエン、酢酸エチル、メチルエチルケト
ン、イソプロピルアルコールなどの溶剤を適宜加えて塗
布液を作製し、ロールコート法、リバースロールコート
法、グラビアコート法、グラビアリバースコート法など
の塗布手段で耐熱性基材１に塗布、乾燥して接着性向上
層５を形成することができる。接着性向上層５の厚さ
は、薄くてよく、０．０５〜３μｍ程度が適当である。A titanium coupling agent, a silane coupling agent, an inorganic filler or the like can be added as an auxiliary agent for further improving the adhesive strength, heat resistant adhesiveness and reaction rate of the above-mentioned adhesiveness improver. Such an adhesion improver is prepared by appropriately adding a solvent such as toluene, ethyl acetate, methyl ethyl ketone, or isopropyl alcohol to prepare a coating solution, and roll coating method, reverse roll coating method, gravure coating method, gravure reverse coating method, etc. The adhesion-improving layer 5 can be formed by applying the composition to the heat-resistant base material 1 with a coating means and drying it. The thickness of the adhesion improving layer 5 may be thin, and is preferably about 0.05 to 3 μm.
【００２４】次に、熱接着性樹脂層は、図１、図２で
は、３層に分割して積層された構成を例示したが、２層
〜７層程度の範囲であれば、熱接着性樹脂層の必要とさ
れる総厚に応じて、適宜の層数で設けることができる。
図示したように、熱接着性樹脂層を、３層に分割して積
層する場合、第１の熱接着性樹脂層２は、可撓性を有す
る耐熱性基材１との接着性に重点を置き、難燃剤は少量
含有するかまたは含有しない熱接着性樹脂で形成し、第
２の熱接着性樹脂層３は、難燃性に重点を置き、難燃剤
を大量に含有させた熱接着性樹脂で形成し、第３の熱接
着性樹脂層４は、導体（金属）接着性および自己融着性
に重点を置き、難燃剤は少量含有するかまたは含有しな
い熱接着性樹脂で形成することができる。そして、この
ような構成を採ることにより、熱接着性樹脂層全体とし
ての上記性能を一層向上させることができる。Next, in FIG. 1 and FIG. 2, the heat-adhesive resin layer has a structure in which the heat-adhesive resin layer is divided into three layers and laminated. An appropriate number of layers can be provided according to the required total thickness of the resin layer.
As shown in the figure, when the thermoadhesive resin layer is divided into three layers and laminated, the first thermoadhesive resin layer 2 focuses on the adhesiveness with the heat-resistant base material 1 having flexibility. The second heat-adhesive resin layer 3 is made of a heat-adhesive resin containing a small amount or no flame-retardant, and the second heat-adhesive resin layer 3 focuses on the flame-retardant property. The third thermoadhesive resin layer 4 is made of a resin, and the third thermoadhesive resin layer 4 is made of a thermoadhesive resin containing a small amount of flame retardant or no flame retardant, with emphasis on conductor (metal) adhesiveness and self-fusing property. You can Further, by adopting such a configuration, the above-mentioned performance as the entire heat-adhesive resin layer can be further improved.
【００２５】尚、上記のように分割された熱接着性樹脂
層は、それぞれ別の離型性基材に、その塗布液を塗布、
乾燥して形成するため、１層当たりの乾燥時の厚さを５
〜１２μｍ程度の範囲とすることにより、極端に塗工速
度を低下させることなく、良好な乾燥塗膜を形成するこ
とができる。また、熱接着性樹脂層の総厚が厚く、３層
の積層で不足する場合は、中間の難燃剤を大量に含有さ
せた熱接着性樹脂層の層数を増やすことにより、優れた
難燃性と自己融着性、導体接着性、導体埋め込み性など
の性能を維持して対応することができる。The heat-adhesive resin layers divided as described above are coated with the coating liquid on different releasable substrates,
Since it is formed by drying, the dry thickness per layer is 5
By setting the thickness in the range of about 12 μm, a good dry coating film can be formed without extremely reducing the coating speed. In addition, when the total thickness of the heat-adhesive resin layer is large and the stacking of three layers is insufficient, it is possible to obtain excellent flame retardancy by increasing the number of heat-adhesive resin layers containing a large amount of the intermediate flame retardant. And self-fusing property, conductor adhesive property, conductor embedding property, etc. can be maintained and dealt with.
【００２６】前記第１、第２、第３の熱接着性樹脂層
は、それぞれ熱接着性樹脂の溶液、またはエマルジョ
ン、ディスパージョンに、適宜難燃剤を溶解または分散
させて塗布液を作製し、これをナイフコート、ロールコ
ート、バーコート、マイクロバーコート、グラビアコー
トなどのコーティング手段で離型性基材に塗布、乾燥し
て所定の厚さの塗膜を形成した後、可撓性を有する耐熱
性基材１、または可撓性を有する耐熱性基材１に設けら
れた接着性向上層５の上に順次熱転写して積層すること
ができる。上記第１、第２、第３の熱接着性樹脂層に用
いる熱接着性樹脂は、それぞれに必要な性能を満たすこ
とができれば、共通の熱接着性樹脂を用いてもよく、ま
た、積層強度が損なわれない限り、それぞれの特性に対
応した異なる熱接着性樹脂を用いることもできる。The first, second, and third thermoadhesive resin layers are each prepared by preparing a coating solution by appropriately dissolving or dispersing a flame retardant in a solution, emulsion, or dispersion of the thermoadhesive resin. This is applied to a releasable substrate by a coating means such as knife coating, roll coating, bar coating, micro bar coating, gravure coating, and dried to form a coating film having a predetermined thickness, and then it has flexibility. The heat-resistant substrate 1 or the adhesive property improving layer 5 provided on the flexible heat-resistant substrate 1 can be sequentially heat-transferred and laminated. As the heat-adhesive resin used for the first, second, and third heat-adhesive resin layers, a common heat-adhesive resin may be used as long as the required performance can be satisfied for each, and the laminating strength is high. It is also possible to use different thermo-adhesive resins corresponding to the respective characteristics, as long as the above is not impaired.
【００２７】特にフラットケーブルの導体（金属）に接
する側に用いる熱接着性樹脂層、図１、図２では第３の
熱接着性樹脂層４に用いる熱接着性樹脂は、自己融着性
と共に金属に対する熱接着性に優れることが好ましく、
そのためには、カルボン酸、カルボン酸無水物、カルボ
ン酸塩、カルボン酸エステルなどに基づくカルボニル基
「−（Ｃ＝Ｏ）−」を主鎖または側鎖に１〜７００ｍｅ
ｑ／１００ｇを含む熱可塑性樹脂を用いることが好まし
い。カルボニル基が１ｍｅｑ／１００ｇ未満では、金属
との接着が弱く、高温下で屈曲した時、剥がれを発生す
ることがあり、また、７００ｍｅｑ／１００ｇを超える
場合は、吸湿しやすくなり、水分による接着に対する悪
影響がでるため好ましくない。In particular, the heat-adhesive resin layer used on the side of the flat cable that contacts the conductor (metal), the heat-adhesive resin used for the third heat-adhesive resin layer 4 in FIGS. 1 and 2, is self-fusing. It is preferable that it has excellent heat adhesion to metal,
For that purpose, a carbonyl group "-(C = O)-" based on a carboxylic acid, a carboxylic acid anhydride, a carboxylic acid salt, a carboxylic acid ester or the like is added to the main chain or the side chain in an amount of 1 to 700 me.
It is preferable to use a thermoplastic resin containing q / 100 g. If the carbonyl group is less than 1 meq / 100 g, the adhesion to the metal is weak and peeling may occur when bent at high temperature, and if it exceeds 700 meq / 100 g, it tends to absorb moisture to prevent adhesion due to moisture. It is not preferable because it causes adverse effects.
【００２８】このような熱接着性樹脂としては、例え
ば、エチレン−アクリル酸メチル共重合体、エチレン−
アクリル酸エチル共重合体、エチレン−アクリル酸共重
合体、エチレン−メタクリル酸メチル共重合体、エチレ
ン−メタクリル酸エチル共重合体、無水マレイン酸グラ
フトポリエチレン、無水マレイン酸グラフトポリプロピ
レン、アクリル酸グラフトポリオレフィン、エチレン−
酢酸ビニル共重合体、エチレン−酢酸ビニル共重合体の
部分ケン化物とアセトキシ基、水酸基或いはカルボニル
基を持つ化合物とを共重合した共重合樹脂、イオン架橋
オレフィン共重合体（アイオノマー）、熱可塑性共重合
ポリエステル系樹脂、共重合ポリアミドなどが挙げられ
る。これらの樹脂は、いずれか一種類を選択して用いて
もよいが、二種以上を組み合わせて使用することもでき
る。Examples of such a heat-adhesive resin include ethylene-methyl acrylate copolymer and ethylene-
Ethyl acrylate copolymer, ethylene-acrylic acid copolymer, ethylene-methyl methacrylate copolymer, ethylene-ethyl methacrylate copolymer, maleic anhydride grafted polyethylene, maleic anhydride grafted polypropylene, acrylic acid grafted polyolefin, Ethylene
Vinyl acetate copolymer, copolymer resin of partially saponified ethylene-vinyl acetate copolymer with a compound having acetoxy group, hydroxyl group or carbonyl group, ion-crosslinked olefin copolymer (ionomer), thermoplastic copolymer Examples include polymerized polyester resins and copolyamides. One of these resins may be selected and used, or two or more of them may be used in combination.
【００２９】尚、上記熱可塑性共重合ポリエステル系樹
脂の製造に用いるジカルボン酸成分としては、例えば、
テレフタル酸、イソフタル酸、オルトフタル酸、パラフ
ェニレンジカルボン酸等の芳香族二塩基酸、コハク酸、
グルタル酸、スベリン酸、β−メチルアジピン酸、ピメ
リン酸、１，６−ヘキサンジカルボン酸、アゼライン
酸、セバシン酸、ノナンジカルボン酸、デカンジカルボ
ン酸、ヘキサデカンジカルボン酸、１，４−シクロヘキ
サンジカルボン酸等の脂肪族二塩基酸等を使用すること
ができる。また、上記に用いるグリコール成分として
は、例えば、エチレングリコール、１，２−プロパンジ
オール、１，３−ブタンジオール、１，４−ブタンジオ
ール、１，５−ペンタンジオール、ネオペンチルグリコ
ール、３−メチルペンタンジオール、ビスフェノールＡ
−エチレンオキサイド付加物、１，３−ヘキサンジオー
ル、１，６−ヘキサンジオール、水添ビスフェノール
Ａ、１，４−シクロヘキサンジメタノール等のほか、ジ
エチレングリコール、トリチレングリコール、ポリエチ
レングリコール、ポリプロピレングリコール、ポリテト
ラエチレングリコール等のポリアルキレングリコール等
を使用することができる。The dicarboxylic acid component used in the production of the thermoplastic copolyester resin is, for example,
Aromatic dibasic acids such as terephthalic acid, isophthalic acid, orthophthalic acid, paraphenylenedicarboxylic acid, succinic acid,
Glutaric acid, suberic acid, β-methyladipic acid, pimelic acid, 1,6-hexanedicarboxylic acid, azelaic acid, sebacic acid, nonanedicarboxylic acid, decanedicarboxylic acid, hexadecanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, etc. Aliphatic dibasic acids and the like can be used. Examples of the glycol component used above include ethylene glycol, 1,2-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, neopentyl glycol, 3-methyl. Pentanediol, Bisphenol A
-Ethylene oxide adduct, 1,3-hexanediol, 1,6-hexanediol, hydrogenated bisphenol A, 1,4-cyclohexanedimethanol, etc., as well as diethylene glycol, triethylene glycol, polyethylene glycol, polypropylene glycol, polytetra Polyalkylene glycols such as ethylene glycol can be used.
【００３０】上記のような酸成分の一種乃至それ以上
と、上記グリコール成分の一種乃至それ以上とを適宜に
選択して常法により共重合して、飽和共重合ポリエステ
ル系樹脂を製造することができる。尚、本発明において
は、特に上記のような単量体成分を限定するものではな
いが、その接着性、経済性（コスト）等から、酸成分と
しては、テレフタル酸、イソフタル酸を主成分とし、こ
れらに、ガラス転移点の調整等を目的として、脂肪族二
塩基酸を必要量使用することが好ましく、また、グリコ
ール成分としては、エチレングリコール、１，４−テト
ラメチレングリコールを主成分とし、これらに、主に、
結晶性の調整を目的として、ジエチレングリコール、ト
リエチレングリコール、ネオペンチルグリコール等を必
要量使用することが好ましい。また、本発明において
は、結晶性の調整等の物性改良を目的として、トリメリ
ット酸、ピロメリット酸等の三官能以上の酸成分を微量
使用することもできる。更に、上記のように製造した熱
可塑性の飽和共重合ポリエステル系樹脂の二種以上を混
合して使用することもでき、また、同一組成で重合度の
異なる樹脂を混合して使用することもできる。One or more of the above acid components and one or more of the above glycol components may be appropriately selected and copolymerized by a conventional method to produce a saturated copolyester resin. it can. In addition, in the present invention, the monomer component as described above is not particularly limited, but the acid component mainly contains terephthalic acid and isophthalic acid because of its adhesiveness, economical efficiency (cost) and the like. In these, it is preferable to use a necessary amount of an aliphatic dibasic acid for the purpose of adjusting the glass transition point, and as the glycol component, ethylene glycol, 1,4-tetramethylene glycol as a main component, Mainly to these
For the purpose of adjusting the crystallinity, diethylene glycol, triethylene glycol, neopentyl glycol or the like is preferably used in a necessary amount. In the present invention, trifunctional or higher functional acid components such as trimellitic acid and pyromellitic acid may be used in small amounts for the purpose of improving physical properties such as adjusting crystallinity. Further, two or more kinds of the thermoplastic saturated copolyester resins produced as described above can be mixed and used, or resins having the same composition but different polymerization degrees can be mixed and used. .
【００３１】また、可撓性を有する耐熱性基材１側およ
び中間層に積層する熱接着性樹脂層、図１、図２では第
１および第２の熱接着性樹脂層２、３に用いる熱接着性
樹脂には、上記の熱接着性樹脂を共通して使用すること
もできるが、更に選択範囲を広げて例えば、ポリエチレ
ン系樹脂、ポリプロピレン系樹脂、ポリスチレン系樹
脂、アクリロニトリル−スチレン共重合樹脂、ポリ酢酸
ビニル系樹脂、熱可塑性線状飽和ポリエステル系樹脂、
ポリアクリルもしくはメタクリル系樹脂、熱可塑性ポリ
ウレタン系樹脂なども使用することができる。The heat-adhesive resin layers laminated on the flexible heat-resistant base material 1 side and the intermediate layer are used for the first and second heat-adhesive resin layers 2 and 3 in FIGS. 1 and 2. The above heat-adhesive resin can be used in common as the heat-adhesive resin, but the selection range can be further expanded to, for example, polyethylene-based resin, polypropylene-based resin, polystyrene-based resin, acrylonitrile-styrene copolymer resin. , Polyvinyl acetate resin, thermoplastic linear saturated polyester resin,
Polyacrylic or methacrylic resin, thermoplastic polyurethane resin, etc. can also be used.
【００３２】以上のような熱接着性樹脂に含有させる難
燃剤としては、例えば、塩素化パラフィン、塩素化ポリ
エチレン、塩素化ポリフェニル、パークロルペンタシク
ロデカン、無水ヘット酸、クロルエンド酸などの塩素系
化合物、およびテトラブロモエタンなどの臭素化エタ
ン、テトラブロモビスフェノールＡ、ヘキサブロモベン
ゼン、デカブロモビフェニルエーテル、テトラブロモ無
水フタール酸、ポリジブロモフェニレンオキサイド、ヘ
キサブロモシクロデカン、臭化アンモニウムなどの臭素
系化合物などのハロゲン元素を含む有機または無機化合
物、そして、トリアリルホスフェート、アルキルアリル
ホスフェート、アルキルホスフェート、ジメチルホスフ
ォネート、ホスフォリネート、ハロゲン化ホスフォリネ
ートエステル、トリメチルホスフェート、トリブチルホ
スフェート、トリオクチルホスフェート、トリブトキシ
エチルホスフェート、オクチルジフェニルホスフェー
ト、トリクレジルホスフェート、クレジルフェニルホス
フェート、トリフェニルホスフェート、トリス（クロロ
エチル）ホスフェート、トリス（２−クロロプロピル）
ホスフェート、トリス（２，３−ジクロロプロピル）ホ
スフェート、トリス（２，３−ジブロモプロピル）ホス
フェート、ビス（２，３−ジブロモプロピル）２，３−
ジクロロプロピルホスフェート、ビス（クロロプロピ
ル）モノオクチルホスフェート、ポリフォスホネート、
ポリフォスフェート、芳香族ポリホスフェート、ジブロ
モネオベンチルグリコールなどのリン酸エステルまたは
リン化合物、ホスフォネート型ポリオール、ホスフェー
ト型ポリオール、含ハロゲンポリオールなどのポリオー
ル化合物、水酸化アルミニウム、水酸化マグネシウム、
三酸化アンチモン、三塩化アンチモン、五酸化アンチモ
ン、ホウ酸亜鉛、ホウ酸アンチモン、ホウ酸、モリブデ
ン酸アンチモン、酸化モリブデン、リン・窒素化合物、
カルシウム・アルミニウムシリケート、ジルコニウム化
合物、錫化合物、ドーソナイト、アルミン酸カルシウム
水和物、酸化銅、金属銅粉、炭酸カルシウム、炭酸マグ
ネシウム、メタホウ酸バリウムなどの金属粉や無機化合
物、その他、シリコーン系ポリマー、フェロセン、フマ
ール酸、マレイン酸、トリアジン、イソシアヌレート、
尿素、グアニジン化合物などを使用することができる。
このような難燃剤は、一種類を選択して使用することも
できるが、二種以上を組み合わせて使用することが更に
好ましい。Examples of the flame retardant to be contained in the above heat-adhesive resin include, for example, chlorine such as chlorinated paraffin, chlorinated polyethylene, chlorinated polyphenyl, perchlorpentacyclodecane, hettic anhydride, and chlorendic acid. Compounds and brominated ethane such as tetrabromoethane, tetrabromobisphenol A, hexabromobenzene, decabromobiphenyl ether, tetrabromophthalic anhydride, polydibromophenylene oxide, hexabromocyclodecane, ammonium bromide Organic or inorganic compounds containing halogen elements such as, and triallyl phosphates, alkylallyl phosphates, alkyl phosphates, dimethylphosphonates, phosphorinates, halogenated phosphorinate esters, triaryl phosphates Chiruhosufeto, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, octyl diphenyl phosphate, tricresyl phosphate, cresyl phenyl phosphate, triphenyl phosphate, tris (chloroethyl) phosphate, tris (2-chloropropyl)
Phosphate, tris (2,3-dichloropropyl) phosphate, tris (2,3-dibromopropyl) phosphate, bis (2,3-dibromopropyl) 2,3-
Dichloropropyl phosphate, bis (chloropropyl) monooctyl phosphate, polyphosphonate,
Polyphosphate, aromatic polyphosphate, phosphoric acid ester or phosphorus compound such as dibromoneobenchyl glycol, phosphate type polyol, phosphate type polyol, polyol compound such as halogen-containing polyol, aluminum hydroxide, magnesium hydroxide,
Antimony trioxide, antimony trichloride, antimony pentoxide, zinc borate, antimony borate, boric acid, antimony molybdate, molybdenum oxide, phosphorus / nitrogen compounds,
Calcium / aluminum silicate, zirconium compounds, tin compounds, dawsonite, calcium aluminate hydrate, copper oxide, metal powders such as metal copper powder, calcium carbonate, magnesium carbonate, barium metaborate and inorganic compounds, and other silicone polymers, Ferrocene, fumaric acid, maleic acid, triazine, isocyanurate,
Urea, a guanidine compound, etc. can be used.
These flame retardants may be used alone, but it is more preferable to use two or more kinds in combination.
【００３３】以上のような熱接着性樹脂に適宜難燃剤を
含有させて形成される熱接着性樹脂層は、本発明におい
ては、２層以上の多層で形成する。熱接着性樹脂層を２
層で形成する場合は、耐熱性基材１側に積層する熱接着
性樹脂層には難燃剤を５０〜９０重量％の範囲で多く含
有させ、導体に接する側の熱接着性樹脂層では難燃剤の
含有量を０〜６０重量％の範囲として少なめにすること
が好ましい。また、両者の熱接着性樹脂には特徴をもた
せることもできる。そして、コーティング時の塗布量
は、２層に分割しているので、例えば、１／２のように
減らすことができ、乾燥が容易になり、コーティング速
度をそれほど落とすことなく残留溶剤を少なくすること
ができる。In the present invention, the heat-adhesive resin layer formed by containing a flame-retardant in the above-mentioned heat-adhesive resin is formed in a multilayer structure of two or more layers. Thermal adhesive resin layer 2
When it is formed by a layer, the heat-adhesive resin layer laminated on the heat-resistant substrate 1 side contains a large amount of a flame retardant in the range of 50 to 90% by weight, and the heat-adhesive resin layer on the side in contact with the conductor is difficult. It is preferable to make the content of the combustor small in the range of 0 to 60% by weight. Further, both the heat-adhesive resins can have characteristics. Since the coating amount at the time of coating is divided into two layers, it can be reduced to, for example, 1/2, drying is facilitated, and the residual solvent is reduced without slowing the coating speed so much. You can
【００３４】また、熱接着性樹脂層を３層以上の多層で
形成する場合は、先にも説明したように、その積層位置
により難燃剤の含有量を調節することが好ましく、例え
ば、中間層に用いる熱接着性樹脂層（図１、２では第２
の熱接着性樹脂層３）では、その固形分中の難燃剤の含
有量を７５〜９０重量％のように高くして難燃性を高
め、両側、即ち、可撓性を有する耐熱性基材１側と導体
に接する側に用いる熱接着性樹脂層（図１、２では、第
１および第３の熱接着性樹脂層２、４）では、その固形
分中の難燃剤の含有量を０〜７０重量％のように低くし
て、それぞれの熱接着性の低下を防止することができ
る。熱接着性樹脂層をこのように構成することにより、
難燃性、可撓性を有する耐熱性基材に対する接着性、導
体接着性、自己融着性などの性能を一層向上させること
ができる。このような熱接着性樹脂層の総厚は、通常、
２０〜６０μｍの範囲で形成される。In addition, when the heat-adhesive resin layer is formed in a multilayer structure of three or more layers, it is preferable to adjust the content of the flame retardant depending on the stacking position, as described above, for example, the intermediate layer. The heat-adhesive resin layer used for
In the heat-adhesive resin layer 3), the flame-retardant property is increased by increasing the content of the flame-retardant agent in the solid content to 75 to 90% by weight, and both sides, that is, a flexible heat-resistant group. In the heat-adhesive resin layers (first and third heat-adhesive resin layers 2 and 4 in FIGS. 1 and 2) used on the material 1 side and the side in contact with the conductor, the content of the flame retardant in the solid content is By lowering it as 0 to 70% by weight, it is possible to prevent deterioration of the thermal adhesiveness of each. By configuring the heat-adhesive resin layer in this way,
It is possible to further improve performance such as adhesiveness to a heat-resistant base material having flame retardancy and flexibility, adhesiveness to conductors, and self-bonding property. The total thickness of such a heat-adhesive resin layer is usually
It is formed in the range of 20 to 60 μm.
【００３５】[0035]
【実施例】以下に、実施例を挙げて本発明を更に具体的
に説明する。
〔実施例１〕図２に示した構成のフラットケーブル用積
層体を作製することとし、可撓性を有する耐熱性基材１
には、厚さ２５μｍの２軸延伸ポリエチレンテレフタレ
ートフィルム（以下、ＰＥＴフィルムと略記する）〔引
張り強さ：（ＭＤ）６．５ｋｇ／１０ｍｍ幅、（ＴＤ）
７．０ｋｇ／１０ｍｍ幅、伸び率：（ＭＤ）１４０％、
（ＴＤ）１３０％、融点２６５℃〕を用い、その一方の
面に、ポリエステルポリオールにジフェニルメタンジイ
ソシアネートを重量比４：１で混合してなる２液硬化型
の接着性向上剤の塗布液を乾燥時の塗布量が０．５ｇ／
ｍ2 となるように塗布、乾燥して接着性向上層５を形成
した。上記接着性向上層５の上に、熱転写方式で第１、
第２、第３の熱接着性樹脂層２、３、４を積層するた
め、紙に離型層としてポリプロピレンを厚さ１５μｍに
押し出しコートした離型性基材を別に用意し、そのポリ
プロピレンコート面に、下記の組成の第１、第２、第３
の熱接着性樹脂層用塗布液を、それぞれ乾燥時の厚さが
９μｍとなるように塗布、乾燥して、第１、第２、第３
の熱接着性樹脂層用の熱転写シートを作製した。EXAMPLES The present invention will be described more specifically below with reference to examples. [Example 1] A laminate for a flat cable having the configuration shown in FIG.
Is a biaxially stretched polyethylene terephthalate film having a thickness of 25 μm (hereinafter abbreviated as PET film) [tensile strength: (MD) 6.5 kg / 10 mm width, (TD)
7.0 kg / 10 mm width, elongation: (MD) 140%,
(TD) 130%, melting point 265 ° C.], and dried on one surface thereof a coating liquid of a two-component curing type adhesiveness improver made by mixing polyester polyol with diphenylmethane diisocyanate at a weight ratio of 4: 1. Coating amount of 0.5g /
The adhesiveness improving layer 5 was formed by coating and drying so that the thickness was m 2 . On the adhesion improving layer 5, the first by thermal transfer method,
In order to laminate the second and third heat-adhesive resin layers 2, 3 and 4, a release base material prepared by extruding and coating polypropylene with a thickness of 15 μm as a release layer on paper is prepared separately, and the polypropylene coated surface thereof is prepared. In addition, the first, second and third of the following composition
The coating liquid for heat-adhesive resin layer is applied to a thickness of 9 μm when dried, and dried to form first, second, and third layers.
A thermal transfer sheet for the heat-adhesive resin layer was prepared.
【００３６】 （第１の熱接着性樹脂層用塗布液の組成） 熱可塑性共重合ポリエステル系樹脂 （ガラス転移点６℃、軟化温度１２３℃） ２０重量部 熱可塑性共重合ポリエステル系樹脂 （ガラス転移点６７℃、軟化温度１６３℃） １０重量部 溶剤 トルエン １００重量部 メチルエチルケトン ８０重量部 難燃剤 臭素化エタン（比重3.25、臭素含有率82％、平均粒径 3μｍ） ３０重量部 三酸化アンチモン（平均粒子径 0.5μｍ） ６重量部 水酸化アルミニウム（平均粒子径 1μｍ） ３重量部 炭酸マグネシウム（平均粒子径 3μｍ） ３重量部 イソシアネート系硬化剤 ５．２重量部[0036] (Composition of coating liquid for first heat-adhesive resin layer) Thermoplastic Copolymerized Polyester Resin (Glass transition point 6 ° C, softening temperature 123 ° C) 20 parts by weight Thermoplastic Copolymerized Polyester Resin (Glass transition point 67 ° C, softening temperature 163 ° C) 10 parts by weight solvent 100 parts by weight of toluene Methyl ethyl ketone 80 parts by weight Flame retardants Brominated ethane (specific gravity 3.25, bromine content 82%, average particle size 3 μm) 30 parts by weight Antimony trioxide (average particle size 0.5 μm) 6 parts by weight Aluminum hydroxide (average particle size 1 μm) 3 parts by weight Magnesium carbonate (average particle size 3 μm) 3 parts by weight Isocyanate curing agent 5.2 parts by weight
【００３７】 （第２の熱接着性樹脂層用塗布液の組成） 熱可塑性共重合ポリエステル系樹脂 （ガラス転移点６℃、軟化温度１２３℃） ２０重量部 熱可塑性共重合ポリエステル系樹脂 （ガラス転移点６７℃、軟化温度１６３℃） １０重量部 溶剤 トルエン １５２重量部 メチルエチルケトン １２２重量部 難燃剤 臭素化エタン（比重3.25、臭素含有率82％、平均粒径 3μｍ）１０５重量部 三酸化アンチモン（平均粒径 0.5μｍ） ２０重量部 水酸化アルミニウム（平均粒径 1μｍ） １１重量部 炭酸マグネシウム（平均粒径 3μｍ） １１重量部 イソシアネート系硬化剤 ５．２重量部[0037] (Composition of coating liquid for second heat-adhesive resin layer) Thermoplastic Copolymerized Polyester Resin (Glass transition point 6 ° C, softening temperature 123 ° C) 20 parts by weight Thermoplastic Copolymerized Polyester Resin (Glass transition point 67 ° C, softening temperature 163 ° C) 10 parts by weight solvent 152 parts by weight of toluene Methyl ethyl ketone 122 parts by weight Flame retardants 105 parts by weight of brominated ethane (specific gravity 3.25, bromine content 82%, average particle size 3 μm) Antimony trioxide (average particle size 0.5 μm) 20 parts by weight Aluminum hydroxide (average particle size 1 μm) 11 parts by weight Magnesium carbonate (average particle size 3 μm) 11 parts by weight Isocyanate curing agent 5.2 parts by weight
【００３８】（第３の熱接着性樹脂層用塗布液の組成）
第３の熱接着性樹脂層用の塗布液には、前記第１の熱接
着性樹脂層用に用いた塗布液と同じ組成の塗布液を用い
た。(Composition of coating liquid for third thermo-adhesive resin layer)
As the coating liquid for the third thermoadhesive resin layer, the coating liquid having the same composition as the coating liquid used for the first thermoadhesive resin layer was used.
【００３９】以上のように作製した第１、第２、第３の
熱接着性樹脂層用の熱転写シートを用いて、前記接着性
向上層を設けた可撓性を有する耐熱性基材の接着性向上
層の上に、第１の熱接着性樹脂層（厚さ９μｍ）を１
層、第２の熱接着性樹脂層（厚さ９μｍ）を２層、第３
の熱接着性樹脂層（厚さ９μｍ）を１層の順に合計４回
熱転写して、熱接着性樹脂層の総厚が３６μｍの実施例
１のフラットケーブル用積層体を作製した。
（フラットケーブル用積層体の構成）ＰＥＴフィルム
（厚さ２５μｍ）／接着性向上層（塗布量０．５ｇ／ｍ
2 ）／第１の熱接着性樹脂層（厚さ９μｍ）／第２の熱
接着性樹脂層（厚さ１８μｍ）／第３の熱接着性樹脂層
（厚さ９μｍ）Adhesion of a flexible heat-resistant base material provided with the adhesiveness improving layer using the thermal transfer sheets for the first, second and third thermal adhesive resin layers produced as described above. 1st heat-adhesive resin layer (thickness 9 μm) on the property improving layer
Layer, the second thermo-adhesive resin layer (thickness 9 μm), the second layer, the third layer
The heat-adhesive resin layer (thickness: 9 μm) was heat-transferred four times in total in the order of one layer to produce a flat cable laminate of Example 1 in which the total thickness of the heat-adhesive resin layer was 36 μm. (Structure of laminated body for flat cable) PET film (thickness 25 μm) / adhesion improving layer (application amount 0.5 g / m)
2 ) / first thermal adhesive resin layer (thickness 9 μm) / second thermal adhesive resin layer (thickness 18 μm) / third thermal adhesive resin layer (thickness 9 μm)
【００４０】以上のように作製した実施例１のフラット
ケーブル用積層体を用いて、以下のようにフラットケー
ブルを作製し、得られたフラットケーブルを試料とし
て、下記の項目について、試験、評価を行った。
（フラットケーブルの作製）実施例１のフラットケーブ
ル用積層体を、その熱接着性樹脂層同士が対向するよう
に両側に配置し、その間に金属ケーブルとして、表面に
錫メッキが施された幅１．０ｍｍ、厚さ０．０５ｍｍの
銅ケーブルを、1 ｍｍの間隔を開けて１５本挿入し、３
ｍ／ｍｉｎの表面速度で回転する２本の加熱ゴムロール
の間で加熱圧着して金属ケーブル（導体）の埋め込みを
行うと共に、それぞれを熱接着させた後、チルロールと
ゴムロールの間で圧着、冷却して実施例１のフラットケ
ーブルを作製した。尚、上記加熱ロールのロール温度は
１８０℃とした。Using the flat cable laminate of Example 1 produced as described above, a flat cable was produced in the following manner, and the obtained flat cable was used as a sample to test and evaluate the following items. went. (Production of Flat Cable) The flat cable laminate of Example 1 is arranged on both sides so that the heat-adhesive resin layers face each other, and a metal cable between the width 1 having a tin-plated surface 1 Insert 15 copper cables with a thickness of 0.0 mm and a thickness of 0.05 mm at intervals of 1 mm, and insert 3
A metal cable (conductor) is embedded by thermocompression bonding between two heating rubber rolls that rotate at a surface speed of m / min, and each is heat-bonded, and then pressure-bonded and cooled between the chill roll and rubber roll. As a result, the flat cable of Example 1 was manufactured. The roll temperature of the heating roll was 180 ° C.
【００４１】（１）導体埋め込み性のチェック
試料のフラットケーブルを、ケーブルの流れ方向に対し
て垂直方向に切断し、その断面を拡大鏡で拡大して金属
ケーブルの埋め込み状態を目視により観察した結果、金
属ケーブルの周囲に空隙はなく、導体埋め込み性は良好
であった。(1) Conductor embeddability check result: The sample flat cable was cut in the direction perpendicular to the flow direction of the cable, its cross section was magnified with a magnifying glass, and the embedded state of the metal cable was visually observed. There was no void around the metal cable, and the conductor embedding property was good.
【００４２】（２）導体（金属）接着性試験
実施例１のフラットケーブル用積層体の熱接着性樹脂層
面に金属ケーブルを重ねて、前記フラットケーブルの作
製と同じ加熱ロール（ロール温度は１８０℃）を用い
て、加熱圧着して熱接着させた後、金属ケーブルを１８
０度の角度で剥離した時の剥離強度を測定した。上記剥
離強度は、１００〜１１０ｇｆ／ｍｍ幅であり、導体
（金属）接着性は良好であった。(2) Conductor (Metal) Adhesion Test A metal cable is laminated on the heat-adhesive resin layer surface of the flat cable laminate of Example 1, and the same heating roll (roll temperature is 180 ° C.) as in the production of the flat cable. ) Is used for heat-pressing and heat-bonding, and then the metal cable is
The peel strength when peeled at an angle of 0 degree was measured. The peel strength was 100 to 110 gf / mm width, and the conductor (metal) adhesion was good.
【００４３】（３）フラットケーブルの耐摺動性試験
実施例１のフラットケーブルを試料として、通電状態で
摺動試験を行い、断線するまでの摺動回数を測定した。
尚、摺動試験条件は、屈曲半径５ｍｍ、摺動距離３０ｍ
ｍ、摺動速度５００回／分、温度６０℃である。上記耐
摺動性試験の結果は、断線するまでの摺動回数が３，５
８６，３５１回で１００万回を余裕をもって超えてお
り、フラットケーブルとしての耐摺動性は優れていた。(3) Sliding resistance test of flat cable Using the flat cable of Example 1 as a sample, a sliding test was conducted in an energized state, and the number of times of sliding until disconnection was measured.
The sliding test conditions are a bending radius of 5 mm and a sliding distance of 30 m.
m, sliding speed 500 times / min, temperature 60 ° C. The result of the above sliding resistance test shows that the number of sliding times before breaking is 3, 5
With 86,351 times, it exceeded 1 million times with a margin, and the sliding resistance as a flat cable was excellent.
【００４４】また、前記第１、第２、第３の熱接着性樹
脂層用の転写シートは、いずれも３か月保存後も良好に
熱転写することができ、その保存性も良好であった。The transfer sheets for the first, second and third heat-adhesive resin layers were all capable of good thermal transfer even after storage for 3 months and had good storage stability. .
【００４５】以上のように、実施例１のフラットケーブ
ル用積層体では、その熱接着性樹脂層（総厚３６μｍ）
を、別の離型性基材にそれぞれ厚さが９μｍとなるよう
に塗布、乾燥して形成した第１の熱接着性樹脂層を１
層、第２の熱接着性樹脂層を２層、第３の熱接着性樹脂
層を１層の順に、４層に分割して可撓性を有する耐熱性
基材に設けた接着性向上層の上に熱転写して形成してい
る。そして、中間層の第２の熱接着性樹脂層では、難燃
剤の含有量をできるだけ多くして難燃性を高め、両側、
即ち、耐熱性基材側と導体側の第１および第３の熱接着
性樹脂層では、難燃剤の含有量を減らして耐熱性基材に
対する接着性、または導体（金属）に対する接着性、自
己融着性を高めた構成としている。As described above, in the flat cable laminate of Example 1, its heat-adhesive resin layer (total thickness 36 μm)
Is applied to another releasable base material so that the thickness thereof is 9 μm, and the first heat-adhesive resin layer is formed by drying.
Layer, the second heat-adhesive resin layer is two layers, and the third heat-adhesive resin layer is one layer in this order and is divided into four layers, and the adhesion-improving layer is provided on the flexible heat-resistant base material. It is formed by thermal transfer on top. Then, in the second heat-adhesive resin layer of the intermediate layer, the content of the flame retardant is increased as much as possible to enhance the flame retardancy,
That is, in the first and third heat-adhesive resin layers on the heat-resistant base material side and the conductor side, the content of the flame retardant is reduced to adhere to the heat-resistant base material, or to the conductor (metal), It has a structure that enhances fusion.
【００４６】従って、離型性基材にそれぞれの熱接着性
樹脂層を塗布、乾燥して転写シートを作製する際、特別
な乾燥装置を必要とせず、通常のコーティング装置で特
にスピードを落とすこともなく、残留溶剤も少なく作製
することができる。また、機能に特徴を有し、単位厚さ
に形成された熱接着性樹脂層の転写シートを巻取り状態
でストックできるので、厚さの異なる製品に対しても迅
速に対応することができ、難燃性、耐熱性基材に対する
接着性、導体（金属）に対する接着性、導体埋め込み性
など、性能に優れたフラットケーブル用積層体を生産性
よく提供することができる。Therefore, when a thermal release adhesive resin layer is applied to a releasable substrate and dried to prepare a transfer sheet, a special drying device is not required, and the speed is particularly slowed by an ordinary coating device. In addition, the residual solvent can be produced in a small amount. In addition, since the transfer sheet of the thermo-adhesive resin layer formed to have a unit thickness can be stocked in a wound state, which has characteristics in function, it is possible to quickly respond to products with different thicknesses, It is possible to provide, with good productivity, a laminate for a flat cable, which has excellent properties such as flame retardancy, adhesion to a heat resistant substrate, adhesion to a conductor (metal), and conductor embedding property.
【００４７】[0047]
【発明の効果】以上、詳しく説明したように、本発明に
よれば、高度な難燃性と優れた自己融着性、導体（金
属）接着性、導体埋め込み性を備えると共に、残留溶剤
も殆どなく、生産性、経済性に優れ、また、フラットケ
ーブルとして要求される耐摺動性（屈曲性）、耐熱性、
電気絶縁性などの諸性能にも優れたフラットケーブル用
積層体を生産性よく提供できる効果を奏する。As described above in detail, according to the present invention, in addition to having high flame retardancy, excellent self-fusing property, conductor (metal) adhesive property and conductor embedding property, almost no residual solvent is left. It has excellent productivity and economical efficiency, and has the sliding resistance (flexibility) and heat resistance required for flat cables.
This has the effect of providing a flat cable laminate excellent in various properties such as electrical insulation with high productivity.
【図１】本発明のフラットケーブル用積層体の一実施例
の構成を示す模式断面図である。FIG. 1 is a schematic cross-sectional view showing the configuration of an example of a flat cable laminate of the present invention.
【図２】本発明のフラットケーブル用積層体の別の一実
施例の構成を示す模式断面図である。FIG. 2 is a schematic cross-sectional view showing the configuration of another embodiment of the flat cable laminate of the present invention.
１ 可撓性を有する耐熱性基材 ２ 第１の熱接着性樹脂層 ３ 第２の熱接着性樹脂層 ４ 第３の熱接着性樹脂層 ５ 接着性向上層 １０、２０ フラットケーブル用積層体 1 Flexible heat resistant substrate 2 First thermal adhesive resin layer 3 Second thermal adhesive resin layer 4 Third thermal adhesive resin layer 5 Adhesion improving layer 10, 20 Flat cable laminate
Claims (3)
み、熱接着により被覆して用いられる積層体であって、
該積層体が、少なくとも可撓性を有する耐熱性基材と、
その一方の面に積層された２層以上の熱接着性樹脂層と
で形成され、それぞれの熱接着性樹脂層が、予め他の離
型性基材上に形成された熱接着性樹脂塗膜の転写層で形
成されると共に、少なくとも導体に接する熱接着性樹脂
層以外の熱接着性樹脂層には難燃剤が含有されているこ
とを特徴とするフラットケーブル用積層体。1. A laminated body which is used by sandwiching a conductor of a flat cable from both sides and covering it by heat bonding,
The laminate is a heat resistant substrate having at least flexibility,
A heat-adhesive resin coating film formed by two or more heat-adhesive resin layers laminated on one surface thereof, each heat-adhesive resin layer being previously formed on another releasable substrate. And a thermal adhesive resin layer other than the thermal adhesive resin layer which is in contact with the conductor and which contains a flame retardant.
形成され、前記耐熱性基材に接する熱接着性樹脂層は、
耐熱性基材との接着性に重点を置き、少量の難燃剤を含
むかまたは難燃剤を含まない熱接着性樹脂層で形成さ
れ、中間の熱接着性樹脂層は、難燃性に重点を置き、大
量の難燃剤を含む熱接着性樹脂層で形成され、導体に接
する熱接着性樹脂層は、導体との接着性と自己融着性に
重点を置き、難燃剤を含まないかまたは少量の難燃剤を
含む熱接着性樹脂層で形成されていることを特徴とする
請求項１記載のフラットケーブル用積層体。2. The heat-adhesive resin layer is formed of at least three layers, and the heat-adhesive resin layer in contact with the heat-resistant substrate comprises:
Focusing on adhesiveness with heat resistant base material, it is formed by a heat-adhesive resin layer containing a small amount of flame retardant or no flame retardant, and the intermediate heat-adhesive resin layer focuses on flame retardancy. Placed in a heat-adhesive resin layer containing a large amount of flame retardant, the heat-adhesive resin layer in contact with the conductor places emphasis on the adhesiveness with the conductor and self-fusion property, and contains no flame retardant or a small amount. The laminated body for a flat cable according to claim 1, which is formed of a heat-adhesive resin layer containing the flame retardant.
樹脂層のうち、導体に接する熱接着性樹脂層の表面に微
細な凹凸が設けられていることを特徴とする請求項１ま
たは２に記載のフラットケーブル用積層体。3. The heat-adhesive resin layer of the laminate for a flat cable, wherein the surface of the heat-adhesive resin layer in contact with the conductor is provided with fine irregularities. The laminate for a flat cable described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001242422A JP4724981B2 (en) | 2001-08-09 | 2001-08-09 | Laminated body for flat cable and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001242422A JP4724981B2 (en) | 2001-08-09 | 2001-08-09 | Laminated body for flat cable and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003053899A true JP2003053899A (en) | 2003-02-26 |
| JP4724981B2 JP4724981B2 (en) | 2011-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2001242422A Expired - Fee Related JP4724981B2 (en) | 2001-08-09 | 2001-08-09 | Laminated body for flat cable and manufacturing method thereof |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006040817A (en) * | 2004-07-29 | 2006-02-09 | Dainippon Printing Co Ltd | Flat cable covering material and flat cable |
| JP2007051287A (en) * | 2005-08-12 | 2007-03-01 | Sika Technology Ag | Primer composition |
| KR100898604B1 (en) | 2008-06-20 | 2009-05-21 | 두성산업 주식회사 | Conductive flame retardant fabric coated with non-halogen flame retardant adhesive and its manufacturing method |
| JP2010061885A (en) * | 2008-09-02 | 2010-03-18 | Riken Technos Corp | Non-halogen system fire resistant laminated film and flat cable |
| KR20200066696A (en) * | 2017-11-01 | 2020-06-10 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Low-combustibility adhesive composition with layered structure |
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| JPH09201913A (en) * | 1996-01-29 | 1997-08-05 | Dainippon Printing Co Ltd | Laminated body for flat cable |
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| JPH1083721A (en) * | 1996-09-10 | 1998-03-31 | Dainippon Printing Co Ltd | Covering material for flat cable and flat cable using it |
| JPH10278206A (en) * | 1997-04-08 | 1998-10-20 | Polyplastics Co | Flame retardant laminated film and method for producing the same |
| JPH10323954A (en) * | 1997-05-23 | 1998-12-08 | Sekisui Chem Co Ltd | Film for flat cable |
| JPH117839A (en) * | 1997-06-13 | 1999-01-12 | Dainippon Printing Co Ltd | Covering material for flat cable and flat cable using it |
| JPH117840A (en) * | 1997-06-13 | 1999-01-12 | Dainippon Printing Co Ltd | Covering material for flat cable and flat cable using it |
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| JPH09201913A (en) * | 1996-01-29 | 1997-08-05 | Dainippon Printing Co Ltd | Laminated body for flat cable |
| JPH09201914A (en) * | 1996-01-29 | 1997-08-05 | Dainippon Printing Co Ltd | Laminated body for flat cable |
| JPH1083721A (en) * | 1996-09-10 | 1998-03-31 | Dainippon Printing Co Ltd | Covering material for flat cable and flat cable using it |
| JPH10278206A (en) * | 1997-04-08 | 1998-10-20 | Polyplastics Co | Flame retardant laminated film and method for producing the same |
| JPH10323954A (en) * | 1997-05-23 | 1998-12-08 | Sekisui Chem Co Ltd | Film for flat cable |
| JPH117839A (en) * | 1997-06-13 | 1999-01-12 | Dainippon Printing Co Ltd | Covering material for flat cable and flat cable using it |
| JPH117840A (en) * | 1997-06-13 | 1999-01-12 | Dainippon Printing Co Ltd | Covering material for flat cable and flat cable using it |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006040817A (en) * | 2004-07-29 | 2006-02-09 | Dainippon Printing Co Ltd | Flat cable covering material and flat cable |
| JP2007051287A (en) * | 2005-08-12 | 2007-03-01 | Sika Technology Ag | Primer composition |
| KR100898604B1 (en) | 2008-06-20 | 2009-05-21 | 두성산업 주식회사 | Conductive flame retardant fabric coated with non-halogen flame retardant adhesive and its manufacturing method |
| JP2010061885A (en) * | 2008-09-02 | 2010-03-18 | Riken Technos Corp | Non-halogen system fire resistant laminated film and flat cable |
| KR20200066696A (en) * | 2017-11-01 | 2020-06-10 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Low-combustibility adhesive composition with layered structure |
| JP2021501252A (en) * | 2017-11-01 | 2021-01-14 | スリーエム イノベイティブ プロパティズ カンパニー | Low flammability adhesive composition with layered structure |
| EP3704201A4 (en) * | 2017-11-01 | 2021-07-21 | 3M Innovative Properties Company | LIGHTLY FLAMMABLE ADHESIVE COMPOSITION WITH LAYER STRUCTURE |
| JP2024059751A (en) * | 2017-11-01 | 2024-05-01 | スリーエム イノベイティブ プロパティズ カンパニー | Low combustibility adhesive composition with layered construction |
| KR102673976B1 (en) * | 2017-11-01 | 2024-06-10 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | Low-flammability adhesive composition with layered structure |
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