JP2003049233A - Aluminum foil for an electrode for an electrolytic capacitor - Google Patents
Aluminum foil for an electrode for an electrolytic capacitorInfo
- Publication number
- JP2003049233A JP2003049233A JP2001238585A JP2001238585A JP2003049233A JP 2003049233 A JP2003049233 A JP 2003049233A JP 2001238585 A JP2001238585 A JP 2001238585A JP 2001238585 A JP2001238585 A JP 2001238585A JP 2003049233 A JP2003049233 A JP 2003049233A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum foil
- electrolytic capacitor
- electrode
- density
- pits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title claims abstract description 40
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 24
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 24
- 239000003990 capacitor Substances 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000002344 surface layer Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 9
- 238000007788 roughening Methods 0.000 abstract description 18
- 238000000137 annealing Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 238000000866 electrolytic etching Methods 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005211 surface analysis Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- QZPSXPBJTPJTSZ-UHFFFAOYSA-N aqua regia Chemical compound Cl.O[N+]([O-])=O QZPSXPBJTPJTSZ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004581 coalescence Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Metal Rolling (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、粗面化処理に供す
る電解コンデンサ電極用アルミニウム箔中高圧用陽極箔
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aluminum foil for electrolytic capacitor electrodes, which is subjected to surface roughening treatment, and an anode foil for medium and high voltage.
【０００２】[0002]
【従来の技術】一般に、電解コンデンサ用中高圧用箔の
製造工程は、Ａｌ純度９９．９９２％前後の純度のスラ
ブを鋳造後、面削し、熱間圧延、冷間圧延を引き続き行
い、最終圧延の前パスで中間焼鈍を行って最終冷間圧延
を行い（高い立方体方位率を得るため）、その後最終的
には５００℃以上の温度で、且つ不活性ガス雰囲気で数
時間処理され製品として提供されているのが通常であ
る。電解コンデンサ電極として用られるためには、この
箔素材に粗面化処理を行い、有効表面積を拡大してか
ら、誘電体としての陽極酸化膜を表面に形成して陽極と
して用いられているのが通常である。この粗面化処理の
効果はコンデンサの品質である静電容量に直接効果があ
り、コンデンサの特性には非常に重要な役割を果たす
が、粗面化は電気化学的なエッチング処理を行うことで
代表され、箔素材の特性により大きく左右されている。
このためＡｌ箔のメーカーは種々の材料的改良を重ねて
きた。2. Description of the Related Art Generally, in the manufacturing process of medium- and high-voltage foils for electrolytic capacitors, after casting a slab having a purity of Al of about 99.992%, the slab is chamfered, followed by hot rolling and cold rolling, and finally Final annealing is performed by intermediate annealing in the pass before rolling (to obtain a high cubic orientation ratio), and then finally processed at a temperature of 500 ° C or higher and in an inert gas atmosphere for several hours to obtain a product. It is usually provided. In order to be used as an electrolytic capacitor electrode, this foil material is roughened to increase the effective surface area and then used as an anode by forming an anodized film as a dielectric on the surface. It is normal. The effect of this roughening treatment has a direct effect on the capacitance, which is the quality of the capacitor, and plays a very important role in the characteristics of the capacitor.However, roughening is achieved by performing an electrochemical etching process. Being represented, it is greatly influenced by the characteristics of the foil material.
For this reason, Al foil manufacturers have made various improvements in materials.
【０００３】その一つが、最終焼鈍雰囲気を真空、ある
いはＡｒガスなどの非酸化性雰囲気で最終焼鈍を行い、
出来るだけ薄い酸化膜を形成させてエッチング処理をや
りやすくしたり、また例えば特開昭６０−１１０８５３
号公報にあるように中間焼鈍を行って最終焼鈍後の箔の
立方体方位率を向上させることを行ってきた。更には特
開昭５７−１９４５１６号公報に見るようにＰｂなどの
不純物元素を表面に濃縮させることによって、化学溶解
性を促進させ粗面化率の向上を行っている。また表面酸
化被膜では特開平１−２４８６０９号公報などのように
γ−アルミナ粒子の大きさ個数の規定を行い粗面化率の
向上を行っている。One of them is to perform final annealing in vacuum or in a non-oxidizing atmosphere such as Ar gas.
It is possible to form an oxide film as thin as possible to facilitate the etching process, and see, for example, JP-A-60-110853.
As described in the publication, the intermediate annealing has been performed to improve the cubic orientation ratio of the foil after the final annealing. Furthermore, as disclosed in JP-A-57-194516, by concentrating an impurity element such as Pb on the surface, chemical solubility is promoted to improve the roughening rate. Further, in the surface oxide film, the size and number of γ-alumina particles are regulated to improve the roughening rate, as in JP-A-1-248609.
【０００４】上記のようにアルミニウム箔は、電解コン
デンサの電極として用いられるためには粗面化処理が施
されるのが通常であり、この粗面化率が高いとそれだけ
単位面積あたりの静電容量が高くなり、コンデンサの小
型化に寄与することが出来ると共に省資源、コスト減に
つながり好ましい。上記粗面化率を構成するピットはキ
ャピラリー状、あるいはトンネルピットと呼ばれてお
り、このピットの個数、密度が表面積に直接的に寄与す
る。したがって前述した従来法は殆どがこのピット形成
に関するものであり、出来るだけピット密度を高めるこ
とを目的にしている。As described above, the aluminum foil is usually subjected to a surface roughening treatment in order to be used as an electrode of an electrolytic capacitor. The higher the surface roughening rate, the more electrostatic per unit area. This is preferable because the capacity is increased and it is possible to contribute to the miniaturization of the capacitor, as well as saving resources and reducing costs. The pits forming the above-mentioned roughening rate are called capillary pits or tunnel pits, and the number and density of these pits directly contribute to the surface area. Therefore, most of the above-mentioned conventional methods are related to the formation of the pits, and the purpose is to increase the pit density as much as possible.
【０００５】[0005]
【発明が解決しようとする課題】しかし、上記従来例を
はじめとして今までの方法ではピット発生が均一になら
ないため、ある部分はピットの合体が生じ有効表面積を
著しく下げてしまう。またある部分は逆に、広範囲にピ
ットが生じない部分が存在するのが実態であった。However, since the pits are not evenly formed by the conventional methods including the above-mentioned conventional example, the pits are merged at a certain portion to significantly reduce the effective surface area. On the contrary, it was the actual situation that there was a part where pits did not occur in a wide area.
【０００６】本発明は、上記事情を背景としてなされた
ものであり、ピットの分散性を良くし、ピットの合体を
なくすこと及びエッチングピットの生じない領域をなく
す事により、有効表面積を高くし、ひいては高い静電容
量が得られる箔を提供することを目的とする。The present invention has been made in view of the above circumstances, and improves the dispersibility of pits, eliminates the coalescence of pits, and eliminates the area where etching pits do not occur, thereby increasing the effective surface area, Furthermore, it aims at providing the foil which can obtain high electrostatic capacitance.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
請求項１記載の電解コンデンサ電極用アルミニウム箔材
は、純度が９９．９６質量％以上で、立方体方位率が６
０体積％以上からなり、かつ表面内層部の転位密度が１
０８／ｃｍ２以上であることを特徴とする。In order to solve the above problems, the aluminum foil material for an electrolytic capacitor electrode according to claim 1 has a purity of 99.96% by mass or more and a cubic orientation ratio of 6 or less.
0% by volume or more and the dislocation density in the surface inner layer is 1
It is characterized in that it is at least 0 8 / cm 2 .
【０００８】請求項２記載の電解コンデンサ電極用アル
ミニウム箔材は、請求項１記載の発明において、前記表
面内層部は、表面からの深さ１μｍから、少なくとも表
面から３μｍ以上の深さに至るものであることを特徴と
する。According to a second aspect of the present invention, there is provided an aluminum foil material for an electrolytic capacitor electrode according to the first aspect, wherein the surface inner layer portion has a depth of 1 μm from the surface to at least 3 μm or more from the surface. Is characterized in that.
【０００９】本発明に至った理由は以下の通りである。
まず本発明者等は、ピット発生点について鋭意研究した
結果、ピットの発生点は箔内部（最表面より１μｍから
内部）に形成されている亜粒界上、あるいはそれらのト
リプルポイント、更には加工によって形成される転位の
セル境界に優先的に形成されることを明らかにしたこと
による。そして、本発明は、表面層組織（表面より１μ
ｍから、少なくとも３μｍの深さ）に加工により形成さ
れる転位を均一に導入することにより、ピット発生点の
均一、分散化が得られ静電容量の画期的な向上が得られ
る技術を提案するものである。そのためには、最終焼鈍
後に、アルミニウム箔材の表面層にのみ適切な低歪み加
えを与えてやればよい。その加工方法は、低圧下圧延
（スキンパス）による加工歪みでもよいし、更にブラス
ト処理などのように表面層のみに転位を導入する方法を
行ってもよい。表面層のみに歪みを与えると、転位が表
面層にのみ導入されることにより、均一な歪分布組織が
得られる。The reason for reaching the present invention is as follows.
First, as a result of diligent research on the pit generation point, the present inventors found that the pit generation point was on a sub-grain boundary formed inside the foil (1 μm from the outermost surface), or triple points thereof, and further processing. This is due to the fact that the dislocations formed by are preferentially formed at the cell boundaries. And, the present invention is a surface layer structure (1μ from the surface
By introducing dislocations formed by processing from m to a depth of at least 3 μm), we propose a technology that can even and disperse pit generation points and achieve an epoch-making improvement in capacitance. To do. For that purpose, after the final annealing, an appropriate low strain may be applied only to the surface layer of the aluminum foil material. The processing method may be processing strain by low pressure rolling (skin pass), or may be a method of introducing dislocations only in the surface layer such as blasting. When strain is applied only to the surface layer, dislocations are introduced only into the surface layer, so that a uniform strain distribution structure is obtained.
【００１０】以下に本発明で規定した条件について説明
する。
純度：９９．９６質量以上
純度を９９．９６質量％以上とした理由は、それ未満の
純度では中高圧コンデンサに用いた場合リーク電流が増
加し、コンデンサとしての基本性能が悪くなり適応でき
ない。また、転位を高密度で発生させるという観点から
純度は９９．９９５質量％以下とするのが望ましい。The conditions specified in the present invention will be described below. Purity: 99.96% by mass or more The reason why the purity is 99.96% by mass or more is that if the purity is lower than that, the leakage current increases when used in a medium-high voltage capacitor, and the basic performance as a capacitor deteriorates, so that it cannot be applied. Further, the purity is preferably 99.995 mass% or less from the viewpoint of generating dislocations at a high density.
【００１１】立方体方位率：６０体積％以上
また、本発明のアルミニウム箔は、立方体方位率が体積
比で、６０％以上であることが必要とされる。これは立
方体方位の組織においてピットが効果的に形成されるこ
とから、充分な数のピットを形成するために立方体方位
率の下限を定めるものである。なお、同様の理由で立方
体方位率が８０体積％以上であるのが望ましく、さらに
９０体積％以上であるのが一層望ましい。Cube orientation ratio: 60% by volume or more Further, the aluminum foil of the present invention is required to have a cubic orientation ratio of 60% or more in volume ratio. Since pits are effectively formed in a cubic oriented structure, this defines the lower limit of the cubic orientation ratio in order to form a sufficient number of pits. For the same reason, the cubic orientation ratio is preferably 80% by volume or more, and more preferably 90% by volume or more.
【００１２】転位密度：１０８／ｃｍ２以上
表面内層部に形成される転位密度が１０８／ｃｍ２以上
にした理由は、１０８／ｃｍ２未満ではピット均一分散
が得られず、従来行程材と大差なく静電容量にあまり効
果が見られないためである。好ましくは５×１０８／ｃ
ｍ２以上と考えられる。ちなみに従来材の表面層の転位
密度はおおむね１０７／ｃｍ２以下である。なお、上記
転位密度に着目する領域として最表層部を重視しないの
は、エッチングに際し、微細亜粒界サイズの最表層部は
早期に溶解し、それよりも内層部でピットの発生の起点
が得られるためである。この表層部は、通常、表面から
１μｍ以下の深さで存在している。したがって、本発明
では表面から１μｍの深さを表面内層部の開始深さとし
て見ることにより、最表層部を確実に除外することがで
きる。また、この表面内層部は、通常、少なくとも表面
から３μｍ以上の深さで存在する。ただし、この高密度
転位領域は芯部まで達すると、粗面化処理の際生成する
キャピラリー状のピットの成長が阻害されるため、表面
より１０μｍ迄の深さが好ましい。Dislocation density: 10 8 / cm 2 or more The reason why the dislocation density formed in the surface inner layer portion is 10 8 / cm 2 or more is that a uniform dispersion of pits cannot be obtained when the density is less than 10 8 / cm 2 , and the conventional process This is because there is not much difference with the material and the effect on the capacitance is not so great. Preferably 5 × 10 8 / c
It is considered to be m 2 or more. By the way, the dislocation density of the surface layer of the conventional material is about 10 7 / cm 2 or less. Note that the outermost layer portion is not important as the region focusing on the dislocation density, that during etching, the outermost surface portion of the fine grain boundary size is dissolved early, and the starting point of pit generation in the inner layer portion is obtained. This is because This surface layer portion usually exists at a depth of 1 μm or less from the surface. Therefore, in the present invention, the outermost surface layer portion can be reliably excluded by viewing the depth of 1 μm from the surface as the starting depth of the surface inner layer portion. The inner surface layer portion is usually present at least at a depth of 3 μm or more from the surface. However, when this high-density dislocation region reaches the core, growth of capillary pits generated during the roughening treatment is hindered, so a depth of up to 10 μm from the surface is preferable.
【００１３】[0013]
【発明の実施の形態】以下に、本発明の一実施形態を説
明する。本発明で用いられるアルミニウム箔には純度９
９．９６質量％以上の高純度アルミニウムが用いられ
る。その製造においては、通常のアルミニウム箔と同様
の工程で鋳造、圧延することができ、最終厚みの箔素材
とするまでの製造方法は特に限定されるものではない。
なお、本発明としては最終厚みについて特に限定される
ものでないことは勿論であるが、通常は０．１ｍｍ程度
の厚さを最終厚みとしている。BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below. The aluminum foil used in the present invention has a purity of 9
High-purity aluminum of 9.96 mass% or more is used. In its production, it can be cast and rolled in the same process as that for a normal aluminum foil, and the production method for obtaining a foil material having a final thickness is not particularly limited.
It should be noted that the final thickness is not particularly limited in the present invention, but normally the final thickness is about 0.1 mm.
【００１４】上記箔には、通常、軟質化等の目的で最終
焼鈍を行う。最終焼鈍における温度は４５０℃以上６０
０℃までが好ましい範囲として推奨される。４５０℃未
満では立方体方位の結晶が充分に成長せず、所望の立方
体方位率を得ることが難しくなる。一方、６００℃を越
えると箔の一部焼き付きが生じるたので、最終焼鈍の温
度は、上記４５０℃〜６００℃の範囲が望ましい。The foil is usually subjected to final annealing for the purpose of softening or the like. The temperature in the final annealing is 450 ° C or higher 60
Up to 0 ° C is recommended as a preferable range. If the temperature is lower than 450 ° C., crystals having a cubic orientation do not grow sufficiently, and it becomes difficult to obtain a desired cubic orientation ratio. On the other hand, if the temperature exceeds 600 ° C., some seizure of the foil occurs, so the temperature of the final annealing is preferably in the range of 450 ° C. to 600 ° C.
【００１５】上記アルミニウム箔材の、表面内層部に高
密度転位を形成するために、低歪み加工を行う。低歪み
加工としては、微粒子によるブラスト処理が挙げられ
る。この微粒子の種類は特に限定されないが、硬質で箔
への汚染が少ない材料としてアルミナ粒子が好適であ
る。微粒子の大きさは特に限定されないが、歪みを均等
かつ効果的に箔表面に与えるために適度な大きさが望ま
しく、例えば５〜２５μｍ径の大きさのものが挙げられ
る。さらに、他の方法として、ヘアライン処理が挙げら
れる。この方法は、硬質の線材等を束ねたブラシで箔表
面を擦り、その擦り傷（ヘアライン）によって箔表面層
に均一歪みと凹凸を与えるものである。In order to form high-density dislocations in the surface inner layer portion of the aluminum foil material, low strain processing is performed. Examples of the low distortion processing include blast processing with fine particles. The type of the fine particles is not particularly limited, but alumina particles are preferable as a material that is hard and has little contamination of the foil. The size of the fine particles is not particularly limited, but an appropriate size is desirable in order to evenly and effectively impart strain to the foil surface, and examples include those having a diameter of 5 to 25 μm. Furthermore, as another method, a hairline treatment can be mentioned. In this method, the foil surface is rubbed with a brush formed by bundling hard wires and the like, and the foil surface layer is uniformly distorted and uneven due to scratches (hairlines).
【００１６】低歪み処理を行った後、このアルミニウム
箔材には粗面化処理を施す。該処理は常法により行うこ
とができる。粗面化処理に際して微細な転位セルによっ
て高密度で均一なキャピラリー状ピットが形成され高い
粗面化率が得られる。高密度で均一なピットが形成され
ることにより、このアルミニウム箔を用いた電解コンデ
ンサは大きな静電容量を得ることができ、小型化も可能
になる。After the low distortion treatment, the aluminum foil material is roughened. The treatment can be performed by a conventional method. During the roughening treatment, fine dislocation cells form high-density and uniform capillary pits, and a high roughening rate is obtained. By forming high density and uniform pits, the electrolytic capacitor using the aluminum foil can obtain a large capacitance and can be downsized.
【００１７】[0017]
【実施例】以下に本発明の実施例を比較例と対比しつつ
説明する。従来法で溶製した純度９９．９９２質量％Ａ
ｌを、熱間圧延、冷間圧延を経て０．１１ｍｍ厚みの高
圧用アルミニウム箔とし、これに５４０℃×５時間の最
終焼鈍を行ってアルミニウム原箔とした。該原箔に対
し、表１に示す条件で湿式のブラスト処理を行い、表層
部に低歪み加工を施して供試材となるアルミニウム箔材
を用意した。EXAMPLES Examples of the present invention will be described below in comparison with comparative examples. Purity 99.992% by mass A melted by the conventional method
1 was subjected to hot rolling and cold rolling to obtain a 0.11 mm-thick aluminum foil for high pressure, which was subjected to final annealing at 540 ° C. for 5 hours to obtain an aluminum original foil. The raw foil was wet-blasted under the conditions shown in Table 1, and the surface layer portion was subjected to low strain processing to prepare an aluminum foil material as a test material.
【００１８】得られた供試材について、立方体方位率を
測定した。立方体方位率は、硝酸−塩酸の混酸を用いた
エッチングにより立方体方位を現出させ面分析を行い体
積率を算出した（これらの箔では立方体方位が厚さ方向
に沿って表裏に貫通しており、面分析により体積率を算
出することができる）。さらに供試材について透過型電
子顕微鏡を用いて転位密度を測定した。該転位密度の測
定では、表面の深さ１μｍから３μｍの深さに至る表面
内層部で転位密度を測定するとともに、転位密度が１０
８／ｃｍ２以上である限界深さ（表面からの深さ）を測
定した。The cubic orientation ratio of the obtained test material was measured. For the cubic orientation ratio, the cubic orientation was revealed by etching with a mixed acid of nitric acid-hydrochloric acid and surface analysis was performed to calculate the volume ratio (in these foils, the cubic orientation penetrates the front and back along the thickness direction. , Volume ratio can be calculated by surface analysis). Further, the dislocation density of the test material was measured using a transmission electron microscope. In the measurement of the dislocation density, the dislocation density is measured at the inner surface layer portion from the surface depth of 1 μm to the depth of 3 μm, and
The critical depth (depth from the surface) of 8 / cm 2 or more was measured.
【００１９】さらに各供試材について、以下の条件で電
解エッチングを行い、その後、３８０Ｖで化成を行って
静電容量を調べた。静電容量については、比較例の静電
容量を１００として相対評価をした。各試験結果は表１
に示した。
（電解エッチング条件）
ＨＣｌ １モル／ｌ
Ｈ２ＳＯ４ ３モル／ｌ
初期電流密度 ０．２Ａ／ｃｍ２
温 度 ７５℃
時 間 ６分Further, each test material was subjected to electrolytic etching under the following conditions, and then subjected to chemical conversion at 380 V to examine the capacitance. Regarding the electrostatic capacity, relative evaluation was performed with the electrostatic capacity of the comparative example being 100. Table 1 shows the test results.
It was shown to. (Electrolytic etching conditions) HCl 1 mol / l H 2 SO 4 3 mol / l Initial current density 0.2 A / cm 2 Temperature 75 ° C. Time 6 minutes
【００２０】[0020]
【表１】 [Table 1]
【００２１】表１から明らかなように、本発明のアルミ
ニウム箔材を用いた場合の静電容量は、比較例に比べて
充分に高い数値が得られており、粗面化処理により高い
粗面化率が達成されたことが分かる。As is clear from Table 1, the capacitance when the aluminum foil material of the present invention is used is sufficiently higher than that of the comparative example, and a high surface roughness is obtained by the roughening treatment. It can be seen that the conversion rate has been achieved.
【００２２】[0022]
【発明の効果】以上説明したように、本発明の本発明の
電解コンデンサ電極用アルミニウム箔材によれば、純度
が９９．９６質量％以上で、立方体方位率が６０体積％
以上からなり、かつ表面内層部の転位密度が１０８／ｃ
ｍ２以上であるので、粗面化処理に際し、ピットが均一
かつ高い密度で形成され、高い粗面化率が得られ、結果
的に単位面積当たりの静電容量が高い電解コンデンサ電
極が得られる。As described above, according to the aluminum foil material for electrolytic capacitor electrodes of the present invention of the present invention, the purity is 99.96% by mass or more and the cubic orientation ratio is 60% by volume.
The dislocation density of the inner layer portion of the surface is 10 8 / c
Since it is m 2 or more, pits are formed uniformly and with high density during the surface roughening treatment, a high surface roughening rate is obtained, and as a result, an electrolytic capacitor electrode having a high capacitance per unit area is obtained. .
Claims (2)
方位率が６０体積％以上からなり、かつ表面内層部の転
位密度が１０８／ｃｍ２以上であることを特徴とする電
解コンデンサ電極用アルミニウム箔材。1. An electrolytic capacitor electrode having a purity of 99.96% by mass or more, a cubic orientation ratio of 60% by volume or more, and a dislocation density of 10 8 / cm 2 or more in a surface inner layer portion. Aluminum foil material for use.
ｍから、少なくとも表面から３μｍ以上の深さに至るも
のであることを特徴とする請求項１記載の電解コンデン
サ電極用アルミニウム箔材。2. The inner surface layer portion has a depth of 1 μm from the surface.
The aluminum foil material for an electrolytic capacitor electrode according to claim 1, wherein the aluminum foil material has a depth from m to at least 3 μm or more from the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001238585A JP4530244B2 (en) | 2001-08-07 | 2001-08-07 | Aluminum foil for electrolytic capacitor electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001238585A JP4530244B2 (en) | 2001-08-07 | 2001-08-07 | Aluminum foil for electrolytic capacitor electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003049233A true JP2003049233A (en) | 2003-02-21 |
| JP4530244B2 JP4530244B2 (en) | 2010-08-25 |
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ID=19069469
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001238585A Expired - Fee Related JP4530244B2 (en) | 2001-08-07 | 2001-08-07 | Aluminum foil for electrolytic capacitor electrode |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009062595A (en) * | 2007-09-07 | 2009-03-26 | Sumitomo Light Metal Ind Ltd | Aluminum foil material |
| JP2009062594A (en) * | 2007-09-07 | 2009-03-26 | Sumitomo Light Metal Ind Ltd | Aluminum foil material |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0192347A (en) * | 1987-10-01 | 1989-04-11 | Kobe Steel Ltd | Manufacture of aluminum foil for electrolytic capacitor anode |
| JPH1154382A (en) * | 1997-08-07 | 1999-02-26 | Kobe Steel Ltd | Aluminum foil for electrolytic capacitor having high electrostatic capacity and manufacture of aluminum foil for the electrolytic capacitor |
| JPH11290906A (en) * | 1998-04-09 | 1999-10-26 | Nippon Foil Mfg Co Ltd | Manufacture of aluminum foil for electrode of electrolytic capacitor |
| JP2001143971A (en) * | 1999-11-15 | 2001-05-25 | Kobe Steel Ltd | Low pressure hard electrolytic al foil with etching stability and manufacturing method thereof |
| JP2002327227A (en) * | 2001-04-27 | 2002-11-15 | Mitsubishi Alum Co Ltd | Aluminum foil for electrode of electrolytic capacitor |
-
2001
- 2001-08-07 JP JP2001238585A patent/JP4530244B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0192347A (en) * | 1987-10-01 | 1989-04-11 | Kobe Steel Ltd | Manufacture of aluminum foil for electrolytic capacitor anode |
| JPH1154382A (en) * | 1997-08-07 | 1999-02-26 | Kobe Steel Ltd | Aluminum foil for electrolytic capacitor having high electrostatic capacity and manufacture of aluminum foil for the electrolytic capacitor |
| JPH11290906A (en) * | 1998-04-09 | 1999-10-26 | Nippon Foil Mfg Co Ltd | Manufacture of aluminum foil for electrode of electrolytic capacitor |
| JP2001143971A (en) * | 1999-11-15 | 2001-05-25 | Kobe Steel Ltd | Low pressure hard electrolytic al foil with etching stability and manufacturing method thereof |
| JP2002327227A (en) * | 2001-04-27 | 2002-11-15 | Mitsubishi Alum Co Ltd | Aluminum foil for electrode of electrolytic capacitor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009062595A (en) * | 2007-09-07 | 2009-03-26 | Sumitomo Light Metal Ind Ltd | Aluminum foil material |
| JP2009062594A (en) * | 2007-09-07 | 2009-03-26 | Sumitomo Light Metal Ind Ltd | Aluminum foil material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4530244B2 (en) | 2010-08-25 |
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