JP2003037363A - Method of manufacturing board for multilayer board, method of manufacturing multilayer board by use of element board manufactured by the method, and element board used for multilayer board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simplified method of manufacturing an element board for a multilayer board, a multilayer board manufactured by the use of the element board, and an element board for a multilayer board. SOLUTION: This manufacturing method comprises a conductor pattern forming process S1 of enabling the conductor foil of a rolled single-sided conductor foil film 11 equipped with a thermoplastic resin film layer film to undergo pattern etching, a via hole forming process S2 of forming bottomed via holes, a filling process S3 of filling the bottomed via holes with conductive paste, and a hot press process S4 of sintering metal particles contained in the conductive paste so as to solidify the conductive paste. A single-sided conductor pattern film 21 composed of linked element boards for forming multilayer boards is taken up into a roll. When the multilayer board is manufactured, the single-sided conductor pattern film 21 is cut out into the element boards, and the element boards are laminated and pressed as heated.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for manufacturing a base plate for a multilayer substrate, a method for manufacturing a multilayer substrate using the base plate for a multilayer substrate manufactured by the manufacturing method, and a base plate for a multilayer substrate.

[0002]

2. Description of the Related Art Conventionally, as a method for manufacturing a multilayer substrate,
There is known a method of manufacturing a multi-layer substrate by using a so-called double-sided substrate or the like having conductor patterns with interlayer connection on both sides as a base plate.

For example, there is a method of manufacturing a multilayer substrate disclosed in Japanese Patent Laid-Open No. 2000-38464.

First, a via hole is provided in a film-like insulator which is an insulating base material, a conductive paste which is an interlayer connecting material is filled therein, and a conductor foil is heat-sealed on both surfaces of the via hole to form a pattern. By doing so, a double-sided substrate to be the first blank is manufactured. Next, a via hole is provided in the film-like insulator which is an insulating base material, and a conductive paste which is an interlayer-connecting material is filled in the via-hole to form a film-like insulator which is a second base plate and which has been subjected to interlayer connection. To manufacture. After that, a method of manufacturing a multilayer substrate by stacking a plurality of first blanks with a second blank is shown.

First, a double-sided substrate, which is a first blank, is manufactured in the same manner as described above. Next, a via hole is provided in a film-like insulator which is an insulating base material, a conductive paste which is an interlayer connecting material is filled therein, and a conductor foil is heat-fused on one surface of the via-hole to form a pattern. A single-sided conductor pattern film to be a base plate is manufactured. After that, the first
It shows a method of manufacturing a multilayer substrate by laminating a second blank that has been subjected to interlayer connection processing on both sides of the blank.

Further, in general, when manufacturing the above-mentioned base plate, according to the size of each base plate when manufacturing the multilayer substrate,
It is known that a long film-shaped insulator, which is a strip-shaped insulating base material, is cut into a predetermined size (for example, 500 mm square) to be used as a processing starting material.

[0007]

However, according to the above-mentioned prior art, a method of manufacturing a plurality of types of blanks from an insulating base material cut into a predetermined size, and combining them to manufacture a multilayer substrate is proposed. Therefore, there is a problem that the manufacturing process of the base plate and the multilayer substrate becomes complicated.

The present invention has been made in view of the above points,
A base plate for a multilayer substrate and a method for manufacturing a base plate for a multilayer substrate capable of simplifying the manufacturing process of a multilayer substrate manufactured from this base plate, and a base plate for a multilayer substrate manufactured by the manufacturing method. Another object of the present invention is to provide a method for manufacturing a multilayer substrate and a base plate for a multilayer substrate.

[0009]

In order to achieve the above object, in the method for producing a base plate for a multilayer substrate according to the present invention as set forth in claim 1, the strip-shaped insulating base material (23) is formed along the longitudinal direction thereof. The multilayer substrate (100) is provided only on one side of the insulating base material (23).
And a conductor pattern forming step (S1) of continuously forming the conductor pattern (22) of the base plates (L1, L2, L3, L4) constituting the base plate, and the conductor pattern of the base plates (L1, L2, L3, L4) ( 22) A via hole forming step (S2) of forming a via hole (24) on the insulating base material (23) from a surface opposite to the surface on which the conductor pattern (22) is formed, at a desired position. , A filling step (S3) of filling the via hole (24) with the interlayer connection material (50), and forming the base plates (L1, L2,
L3, L4) are connected and formed.

According to this, the conductor pattern (22) is formed only on one surface of the insulating base material (23), and the conductor pattern (22) filled with the interlayer connecting material (50) at a desired position is used as the bottom surface. The connected blanks (L1, L2, L3, L4) having the bottomed via holes (24) can be manufactured. The base plates (L1, L2, L3, L4) in which the band-shaped insulating base material (23) is connected without cutting can be continuously manufactured, and each base plate (L1,
It can be cut every L2, L3, L4). Therefore, it is possible to simplify the manufacturing process of the multi-layer substrate blank and the multi-layer substrate manufactured from this blank.

Further, in the method for manufacturing a base plate for a multilayer substrate of the present invention as defined in claim 2, the strip-shaped insulating base material (23) has a plurality of types of the conductor patterns constituting each layer of the multilayer substrate (100). A plurality of blanks (L1, L2, L having (22)
3, L4) as one unit, and is repeatedly formed.

According to this, the bare plates (L1, L2, L3, L4) forming each layer of the multilayer substrate (100) are formed with the conductor pattern (22) only on one surface of the insulating base material (23), and Raw plates (L1, L2, L of the same type) having bottomed via holes (24) whose bottom surface is a conductor pattern (22) filled with an interlayer connecting material (50) at a desired position.
3, L4). Therefore, it is not necessary to manufacture other types of blanks, such as double-sided boards, in the manufacturing process. In this way, it is possible to surely simplify the manufacturing process of the base plate for a multilayer substrate and the multilayer substrate manufactured from this base plate.

Further, since the base plates (L1, L2, L3, L4) constituting the multilayer substrate (100) can be continuously formed as one unit, it is easy to cope with the production of a small amount of the multilayer substrate.

In the method for manufacturing a base plate for a multilayer substrate according to the present invention, one unit of the base plates (L1, L2, L3, L4) forming the multilayer substrate (100) is a multilayer substrate ( 100), the blanks (L
1, L2, L3, L4) according to the stacking order of the base plates (L
1, L2, L3, L4) are continuously formed.

According to this, when the multilayer board is manufactured, the connected base plates (L1, L2, L3, L4) are connected to the base plates (L1, L).
It is easy to stack after cutting every 2, L3, L4).

Further, in the method for manufacturing a base plate for a multilayer substrate according to the present invention, the base plates (L1, L2, L3, L4)
1 unit includes a plurality of multi-layer boards (100) that are composed of the base plates (L1, L2, L3, L4).
It is characterized in that they are formed by collecting them in the same order of the stacking order in 0).

According to this, a plurality of multilayer substrates (100)
Even when they are manufactured at the same time, the connected blanks (L
1, L2, L3, L4) to each blank (L1, L2, L3,
It is easy to stack after cutting every L4).

Further, in the method for manufacturing a base plate for a multilayer substrate according to the present invention, the base plate (L1 constituting the multilayer substrate is formed.
1, L12, L13, L14) are strip-shaped insulating base materials (2
It is characterized in that a plurality of base plates (L11, L12) are formed side by side in the lateral direction of 3).

According to this, the base plates (L11, L12, L13, L14) constituting the multi-layer substrate can be disposed within the width of the strip-shaped insulating base material (23) without waste.

Further, in the method for manufacturing a base plate for a multilayer substrate according to the sixth aspect of the present invention, the strip-shaped insulating base material (23) is a resin film (23).

According to this, even if the strip-shaped insulating base material (23) is long, it is flexible and easy to handle.

Further, in the method for manufacturing a base plate for a multilayer substrate according to the seventh aspect of the present invention, the resin film (23) is made of a thermoplastic resin.

According to this, it is easy to bond the respective base plates (L1, L2, L3, L4) at the time of manufacturing the multilayer substrate.

Further, in the method for manufacturing a base plate for a multilayer substrate according to the present invention, the connected base plates (L1, L2, L3, L4) are formed into a strip shape after the filling step (S3). It is characterized in that the insulating base material (23) is wound in the longitudinal direction to form a roll.

According to this, even if the base plates (L1, L2, L3, L4) formed by connection are long, they are easy to handle.

Further, in the method for manufacturing a base plate for a multilayer substrate according to a ninth aspect of the invention, after the filling step (S3), the connected base plates (L1, L2, L3, L4) are wound. Before being processed, the blank plates (L1, L2, L3,
The protective sheet member (31) is formed on at least one surface of L4).

According to this, it is possible to prevent the surface of the connected raw plates (L1, L2, L3, L4) wound in a roll shape from being damaged or contaminated.

According to the tenth aspect of the present invention, the interlayer connecting material (50) is a conductive paste (50), which is formed by connecting after the filling step (S3). It is characterized in that the conductive paste (50) is heated and solidified before winding the base plates (L1, L2, L3, L4).

According to this, it is possible to prevent the conductive paste (50) filled in the via hole (24) from falling off and from adhering to other parts of the raw plate.

Further, as in the method for producing a multilayer substrate of the invention described in claim 11, a multilayer produced by the method for producing a base plate for a multilayer substrate according to any one of claims 1 to 10. The base plates for substrates (L1, L2, L3, L4)
Each of the base plates (L1, L2, L constituting the multilayer substrate (100)
3 and L4) cutting step, stacking step of stacking the blanks (L1, L2, L3, L4) cut in this cutting step, and blank board (L) stacked in this stacking step
1, L2, L3, L4) is heated while applying pressure from both sides to connect the layers of the conductor pattern (22) with the interlayer connecting material (51) and to form the base plate (L1,
L2, L3, L4) A multilayer substrate can be easily manufactured by including a bonding step of bonding each other.

The base plate for a multilayer substrate according to the twelfth aspect of the invention can be formed by the manufacturing method of the second aspect of the invention. Further, the base plate for a multilayer substrate of the invention described in claim 13 can be formed by the manufacturing method of the invention described in claim 3. Further, the base plate for a multilayer substrate of the invention described in claim 14 can be formed by the manufacturing method of the invention described in claim 4. Further, the base plate for a multilayer substrate of the invention described in claim 15 can be formed by the manufacturing method of the invention described in claim 5.

The base plate for a multilayer substrate according to the sixteenth aspect of the invention can be formed by the manufacturing method of the sixth aspect of the invention. Further, the base plate for a multilayer substrate of the invention described in claim 17 can be formed by the manufacturing method of the invention described in claim 7. The base plate for a multilayer substrate according to the eighteenth aspect of the invention can be formed by the manufacturing method of the eighth aspect. Further, the base plate for a multilayer substrate of the invention described in claim 19 can be formed by the manufacturing method of the invention described in claim 9.

The reference numerals in parentheses attached to the above-mentioned respective means show the corresponding relationship with the concrete means described in the embodiments to be described later.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic view schematically showing a manufacturing process of a base plate for a multilayer substrate in this embodiment.

In FIG. 1, reference numeral 1 denotes a resin tube, and the resin tube 1 is a one-sided conductor foil in which a conductor foil (copper foil having a thickness of 18 μm in this example) is attached to one side of a belt-shaped resin film 23 described later. The film 11 is wound, and the single-sided conductor foil film 11 is sent out in a processing step for processing into a single-sided conductor pattern film 21, which is a base plate for a multilayer substrate, which will be described later.

In this example, the resin film 23 is made of a polyether ether ketone resin 65 to 35% by weight and a polyetherimide resin 35 to 65% by weight and has a thickness of 25 to 50%.
A 75 μm thermoplastic resin film is used. Also,
In this example, the belt-shaped resin film 23 has a width of 500 m.
m, a resin film having a length of 100 to 200 m is used.

The single-sided conductor foil film 11 is processed by the conductor pattern forming step S1, the via hole forming step S2, the step S3 of filling the conductive paste as an interlayer connecting material, and the hot pressing step S4 for solidifying the conductive paste. Becomes the pattern film 21 and becomes the resin tube 2
It is wound into a roll. Each step will be described in detail later.

Here, when the one-sided conductor pattern film 21 is wound around the resin tube 2, a resin film which is a protective sheet member is provided in order to prevent the surface of the one-sided conductor pattern film 21 from being damaged or contaminated. 31
(In this example, a polyethylene terephthalate film having a thickness of 25 μm) is wound simultaneously so as to be sandwiched between the layers of the single-sided conductor pattern film 21.

FIG. 2 is a sectional view for each step showing the manufacturing process of the single-sided conductor pattern film 21 which is the base plate for a multilayer substrate in this embodiment.

The single-sided conductor foil film 11 sent out from the resin tube 1 is, as shown in FIG. 2 (a), first, the conductor foil adhered to one side of the resin film 23 is formed by etching resist layer formation or pattern exposure, for example. Then, the single-sided conductor pattern film 21 having the conductor pattern 22 is formed by patterning by a known etching method including the processes of developing, etching and resist removal.

The pattern formation described above is performed for each of the base plates constituting the multi-layer substrate 100 to be laminated at the time of manufacturing the multi-layer substrate described later. In the present embodiment, as shown in FIG. 2A, the base plates L1, L2,
The conductor pattern 22 is formed on the resin film 23 in the order of L3 and L4.
Was continuously formed in the longitudinal direction of.

The dashed-dotted line in FIG. 2 (a) indicates the boundaries of the regions of the individual base plates in the single-sided conductor pattern film 21, and the individual base plates L1 to L4 are formed in a linked manner. The same applies to FIGS. 2B to 2D described later.

Further, although not shown in FIG. 2, in the single-sided conductor pattern film 21, which is a base plate for a multi-layer substrate formed by connecting the base plates, it is shown in FIG. As shown, the base plates L1 to L4 formed according to the stacking order are set as one unit, and the base plates are connected so as to repeat this unit.

Note that FIG. 4 shows the connected state of the respective blanks, and the conductor pattern 22 and the like are omitted.
Further, the alternate long and short dash line in FIG. 4 indicates the boundaries of the regions of the respective blank plates in the single-sided conductor pattern film 21.

When the conductor pattern 22 is formed, a plurality of fiducial marks 25, which serve as a position reference for machining each blank, are simultaneously formed in a later step.

The above-described step shown in FIG. 2A is the conductor pattern forming step S1 in this embodiment.

As shown in FIG. 2A, the conductor pattern 2
When the formation of 2 is completed, next, as shown in FIG. 2B, a carbon dioxide gas laser is irradiated from the resin film 23 side to form a via hole 24 which is a bottomed via hole having the conductor pattern 22 as a bottom surface. The via holes are formed by adjusting the output of the carbon dioxide gas laser, the irradiation time, and the like so that holes are not formed in the conductor pattern 22.

In order to form the via hole 24, an excimer laser or the like can be used in addition to the carbon dioxide laser. A via hole forming method such as drilling other than laser is also possible, but drilling with a laser beam is preferable because the hole can be formed with a fine diameter and the conductor pattern 22 is less damaged.

Since the via hole 24 is formed by using the reference mark 25 for each blank formed at the same time as the formation of the conductor pattern 22 as a position reference, a bottomed via hole having the conductor pattern 22 as its bottom surface is surely formed. It can be easily formed.

The above-mentioned step shown in FIG. 2B is the via hole forming step S2 in this embodiment.

As shown in FIG. 2B, the via hole 24
When the formation of is completed, next, as shown in FIG.
Conductive paste 5 which is an interlayer connecting material in the via hole 24
Fill with 0. The conductive paste 50 has an average particle size of 5 μm,
To 300 g of tin particles having a specific surface area of 0.5 m ² / g and 300 g of silver particles having an average particle size of 1 μm and a specific surface area of 1.2 m ² / g, 60 g of terpineol, which is an organic solvent, was added and kneaded with a mixer to form a paste. It has been transformed.

The conductive paste 50 is printed and filled in the via holes 24 of the single-sided conductor pattern film 21 by a screen printing machine using a metal mask, and then 140 to
Dry the terpineol at 160 ° C. Beer hall 2
The conductive paste 50 was filled into the inside of the No. 4 using a screen printing machine in this example, but if the filling can be surely performed,
Other methods using a dispenser or the like are possible.

Here, it is possible to use other than terpineol as the organic solvent added for forming the paste, but it is preferable to use an organic solvent having a boiling point of 150 to 300 ° C. An organic solvent having a boiling point of lower than 150 ° C. is likely to cause a problem that the viscosity of the conductive paste 50 changes greatly with time. On the other hand, an organic solvent having a boiling point of higher than 300 ° C. is not preferable because it takes a long time to dry.

In this example, the metal particles forming the conductive paste 50 have an average particle size of 5 μm and a specific surface area of 0.5.
m ² / g tin particles, average particle size 1 μm, specific surface area 1.2
m ² / g of silver particles were used.
It is preferable that the average particle size is 0.1 to 20 μm and the specific surface area is 0.1 to 2.5 m ² / g.

When the average particle diameter of the metal particles is less than 0.1 μm or the specific surface area exceeds 2.5 m ² / g,
A large amount of organic solvent is required to form a paste having a viscosity suitable for filling via holes. A conductive paste containing a large amount of an organic solvent takes time to dry, and if the drying is insufficient, a large amount of gas is generated by heating, so that voids are likely to be generated in the via hole 24, and interlayer connection reliability is improved. It causes to decrease.

On the other hand, when the average particle size of the metal particles exceeds 20 μm or the specific surface area is less than 0.1 m ² / g, it becomes difficult to fill the via holes 24 and the metal particles are apt to be unevenly distributed. There is a problem that it is difficult to form a conductive composition 51, which will be described later, made of a uniform alloy even when heated, and it is difficult to secure interlayer connection reliability, which is not preferable.

Further, the conductive paste 5 is placed in the via hole 24.
Before filling 0 with the via hole 24 of the conductor pattern 22.
The part facing the surface may be thinly etched or reduced. According to this, the via connection described later is more favorably performed.

The above-mentioned step shown in FIG. 2C is the filling step S3 in this embodiment.

As shown in FIG. 2C, the via hole 24
When the filling of the conductive paste 50 into the inside is completed, next, the single-sided conductor pattern film 21 is pressed from both upper and lower sides while being heated by a vacuum heating press machine. In this example, 2
It was heated to a temperature of 50 to 350 ° C. and pressurized at a pressure of 1 to 10 MPa for 10 to 20 minutes. As a result, as shown in FIG. 2D, the conductive paste 50 in the via holes 24 is solidified to become the conductive composition 51 and the conductive composition 5
1 is electrically connected to the conductor pattern 22.

The step of pressurizing the single-sided conductor pattern film 21 while heating it with a vacuum heating press is the hot pressing step S4 in this embodiment.

Here, the mechanism of connection between the conductive composition 51 and the conductor pattern 22 will be briefly described while the conductive paste 50 is solidified to become the conductive composition 51. Conductive paste 50 filled and dried in the via hole 24
Is in a state where tin particles and silver particles are mixed. When this paste 50 is heated to 250 to 350 ° C., the melting point of tin particles is 232 ° C. and the melting point of silver particles is 9 ° C.
Since the temperature is 61 ° C., the tin particles melt and adhere to cover the outer circumference of the silver particles.

When heating is continued in this state, the molten tin begins to diffuse from the surface of the silver particles and forms an alloy of tin and silver (melting point 480 ° C.). At this time, the conductive paste 50
Since a pressure of 1 to 10 MPa is applied to, the conductive composition 51 made of an alloy integrated (that is, solidified) by sintering is formed in the via hole 24 with the formation of the alloy of tin and silver. It is formed.

When the conductive composition 51 is formed in the via hole 24, since the conductive composition 51 is pressurized, it is pressed against the surface of the conductor pattern 22 constituting the bottom portion of the via hole 24. It Thereby, the tin component in the conductive composition 51 and the copper component of the copper foil forming the conductor pattern 22 are solid-phase diffused with each other, and the conductive composition 51 is formed.
A solid phase diffusion layer is formed at the interface between the conductor pattern 22 and the conductor pattern 22 to electrically connect them.

As described above, the conductive paste 50 is solidified by the hot pressing process and becomes the conductive composition 51 connected to the conductor pattern 22, so that in the subsequent steps, the conductive composition 51 becomes the single-sided conductor pattern film 2.
It can be reliably prevented from falling off from 1.

As described above, the single-sided conductor foil film 11
Is a conductor pattern forming step S1 and a via hole forming step S
2. The blank plates L1 to L4, which are processed in the filling step S3 and the hot pressing step S4, are repeatedly formed along the longitudinal direction of the belt-shaped resin film 23, and each of the blank plates L1 to L4 is formed. To form a single-sided conductor pattern film 21, which is wound around the resin tube 2 in a roll shape as shown in FIG.

FIG. 3 is a cross-sectional view for each process showing the manufacturing process of the multilayer substrate in this embodiment.

As shown in FIG. 1, when the winding of the single-sided conductor pattern film 21 onto the resin tube 2 is completed, first,
While pulling out the wound single-sided conductor pattern film 21, the connected base plates are cut into individual base plates.

Then, as shown in FIG. 3 (e), four sheets of base plates L1, L2, L3, L4 (resin film 23a on which the conductor pattern 22 is formed) constituting the multilayer substrate are laminated. At this time, the reference mark 25 of each blank formed simultaneously with the conductor pattern 22 in the conductor pattern forming step.
By stacking, the relative positions between the respective base plates L1, L2, L3, L4 can be accurately stacked.

In addition, on the wound single-sided conductor pattern film 21, the respective raw plates are formed from the pull-out end side.
Since they are formed by connecting 4, L3, L2, and L1 in this order, that is, in the order of stacking, it is possible to easily stack the base plates while cutting each base plate.

When four blanks are stacked, the bottom two blanks L3 and L4 have the upper surface of the two blanks L1 and L2 with the surface on which the conductor pattern 22 is provided being the lower side. The surface on which the conductor pattern 22 is provided is stacked on the upper side.

That is, the two center plates L2 and L3
(Resin film 23a on which the conductor pattern 22 is formed)
Are laminated so that the surfaces on which the conductor pattern 22 is not formed face each other, and the remaining base plates L1 and L4 (resin film 23a on which the conductor pattern 22 is formed) are the surface on which the conductor pattern 22 is formed and the conductor pattern 22. It is laminated so that the surface on which is not formed faces each other.

As shown in FIG. 3E, the blank plates L1, L2,
After stacking L3 and L4, pressure is applied from both upper and lower surfaces thereof while heating with a vacuum heating press. In this example, 2
It was heated to a temperature of 50 to 350 ° C. and pressurized at a pressure of 1 to 10 MPa for 10 to 20 minutes.

As a result, as shown in FIG. 3 (f), the base plates L1, L2, L3 and L4 are bonded together. The resin film 23a is heat-fused and integrated, and the adjacent conductive patterns 22 are interlayer-connected by the conductive composition 51 which is the interlayer-connecting material in the via hole 24, whereby the multilayer substrate 100 is obtained.

At this time, by heating under pressure under the above conditions, the conductive compositions 51 in the via holes 24 of the base plates L2 and L3 facing each other are sintered and integrated.
Further, in the conductive composition 51 in the via holes 24 of the base plates L1 and L4, the tin component in the conductive composition 51 and the copper component of the copper foil forming the conductor pattern 22 of the adjacent base plates are used. Solid-phase diffusion is performed on each other, and a solid-phase diffusion layer is formed at the interface between the conductive composition 51 and the conductor pattern 22 to be electrically connected. In this way, the interlayer connection of the conductor pattern 22 is performed.

The resin films 23a are all made of the same thermoplastic resin material, and by being heated to 250 to 350 ° C., the elastic modulus is lowered to about 5 to 40 MPa. Therefore, it can be surely integrated by being pressurized. Moreover, the activity of the surfaces of the conductive composition 51 and the conductor pattern 22 is improved by being heated to 250 ° C. or higher. Therefore, the conductive composition 51 or the conductor pattern 22 and the resin film 23 can be reliably bonded.

The elastic modulus of the resin film 23 during hot pressing is preferably 1-1000 MPa. When the elastic modulus is larger than 1000 MPa, it is difficult for the resin films 23 to be heat-sealed to each other, and a large stress is applied to the conductor pattern 22 due to the pressurization, so that a defect such as a disconnection is likely to occur. Further, when the elastic modulus is less than 1 MPa, the resin film easily flows due to pressure, and the conductor pattern 22 moves, so that it is difficult to form the printed circuit board 100.

In the manufacturing process of the above-described multilayer substrate, after forming the multilayer substrate 100 as shown in FIG. 3F, if the end portion of the multilayer substrate 100 where the reference mark 25 is provided is unnecessary, Alternatively, this part may be removed.

In the manufacturing process of the above-mentioned multilayer substrate, the step of cutting the single-sided conductor pattern film 21 into each blank is the cutting step in this embodiment, and the step shown in FIG. 3 (e) is the lamination in this embodiment. It is a process. Also, FIG.
The step of forming the multilayer substrate 100 shown in FIG. 3 (f) by hot pressing the laminated body shown in (e) is the bonding step in this embodiment.

According to the above-described method for manufacturing a base plate for a multilayer substrate and the structure obtained by the manufacturing method, each element forming the multilayer substrate 100 can be formed without cutting the strip-shaped resin film 23 to which the conductor foil is attached. The single-sided conductor pattern film 21 in which the plates L1, L2, L3 and L4 are connected can be continuously manufactured. In addition, each base plate L1 that constitutes the multilayer substrate 100,
Since L2, L3, and L4 are the same type of base plates, it is not necessary to manufacture another type of base plate such as a double-sided board in the manufacturing process. Therefore, it is possible to simplify the manufacturing process of the base plate for a multilayer substrate.

Furthermore, the base plate L which constitutes the multilayer substrate 100
Since 1, L2, L3, and L4 can be continuously formed as one unit, it is easy to cope with the production of a small amount of multilayer substrates.

According to the method for manufacturing a multilayer board using the base plate obtained by the method for manufacturing a base plate for a multilayer board described above, the single-sided conductor pattern film 21 is cut and laminated for each base plate, Then, by heat pressing, the multilayer substrate 1
00 can be formed. Therefore, it is possible to simplify the manufacturing process of the multilayer substrate.

(Other Embodiments) In the above-described one embodiment, the single-sided conductor pattern film 21 has each of the base plates L1, L2, L3, and L4 constituting the multilayer substrate as one unit, as shown in FIG. In the unit, the base plates are formed by connecting the base plates in the order of stacking the base plates when the multilayer substrate 100 is manufactured, and this unit is repeatedly formed.
As shown in FIG. 5, the connection configuration of the raw plates in one unit may be a configuration other than the stacking order.

Further, in the above-described embodiment, each unit plate constituting one multi-layer substrate is set as one unit, and this unit is repeatedly formed. For example, as shown in FIG. 6, a plurality of (in the example of FIG. 6, (2 sheets) the base plates that make up the multilayer substrate,
The units may be repeatedly formed by collecting the units of the same order in the order of stacking the base plates at the time of manufacturing the multi-layer substrate and setting the base plates constituting the plurality of multi-layer substrates as one unit. In the example of FIG. 6, the connected eight base plates L1 to L4 are one unit.

Further, in the above-described embodiment, all the base plates constituting the multilayer substrate are formed adjacent to each other in the longitudinal direction of the belt-shaped resin film 23 (that is, the single-sided conductor pattern film 21), but the width of the base plate is one side. When the width is less than half the width of the conductor pattern film, for example, as shown in FIG. 7, a plurality of base plates (base plates L) are formed in the lateral direction of the resin film 23 (that is, the single-sided conductor pattern film 121).
11 and L12 and blank plates L13 and L14) may be formed side by side. This can reduce the loss of the single-sided conductor foil film.

In the example shown in FIG. 7, the four base plates L11 to L14 constituting one multi-layer substrate are one unit, but a plurality of base plates are formed side by side in the lateral direction of the single-sided conductor pattern film 121. Also in this case, the base plates forming the plurality of multilayer substrates may be one unit. For example,
As shown in FIG. 8, the base plates constituting the four multilayer substrates are
It may be configured as a unit.

Further, in the above-described embodiment, the conductive paste 50 in the via hole 24 is heated while being pressurized in the hot pressing step S4 to form the conductive composition 51. However, the conductive paste 50 may fall from the via hole 24. The heat-pressing step can be omitted as long as it does not adhere to other parts of the single-sided conductor pattern film 21.

In the above embodiment, when the cut blanks are stacked, the reference marks 25 are overlapped with each other to perform the alignment between the blanks. Positioning through holes are formed at the same position of each base plate with reference to 25, and when stacking the base plates, a pin member or the like is inserted into the through holes to perform the alignment between the base plates. Good.

Further, in the above embodiment, the polyether ether ketone resin 65 to 65 is used as the resin film 23.
35 wt% and polyetherimide resin 35-65 wt%
Although the resin film composed of and is used, the present invention is not limited to this, and may be a film in which a filler is filled in a polyetheretherketone resin and a polyetherimide resin, or a polyetheretherketone (PEEK) or a polyetherimide (PEEK). It is also possible to use PEI) alone.

Further, as the resin film, polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyether sulfone (PES), thermoplastic polyimide, or so-called liquid crystal polymer may be used. If the resin film that is the insulating base material is formed of a single thermoplastic resin, it is easy to bond the base plates to each other, and it is advantageous in terms of recycling the base material. A resin film made of a thermoplastic resin that can be adhered by a hot press and has heat resistance necessary for a soldering step or the like that is a subsequent step can be preferably used.

As a resin film, a polyimide film made of PEEK, PEI, PEN, PET, PES,
You may use the structure which laminated | stacked the layer which consists of a thermoplastic resin of at least any one of thermoplastic polyimide and liquid crystal polymer. Any resin film can be used as long as it can be adhered by hot pressing and has a heat resistance necessary for a soldering process which is a post process.

When a polyimide film laminated with a thermoplastic resin layer is used, the coefficient of thermal expansion of polyimide is about 15 to 20 ppm, and the coefficient of thermal expansion of copper (17 .About.20 ppm), it is possible to prevent the occurrence of peeling, warpage of the substrate, and the like.

Although the multilayer substrate 100 is a four-layer substrate in the above embodiment, it goes without saying that the number of layers is not limited as long as it has a plurality of conductor pattern layers.

[Brief description of drawings]

FIG. 1 is a schematic diagram schematically showing a manufacturing process of a base plate for a multilayer substrate according to an embodiment of the present invention.

FIG. 2 is a sectional view for each step showing a schematic manufacturing process of a base plate for a multilayer substrate according to an embodiment of the present invention.

FIG. 3 is a sectional view for each step showing a schematic manufacturing process of the multilayer substrate according to the embodiment of the present invention.

FIG. 4 is a plan view showing a connected state of the base plates according to the embodiment of the present invention.

FIG. 5 is a plan view showing a connected state of respective base plates according to another embodiment of the present invention.

FIG. 6 is a plan view showing a connected state of respective base plates according to another embodiment of the present invention.

FIG. 7 is a plan view showing a connected state of respective base plates according to another embodiment of the present invention.

FIG. 8 is a plan view showing a connected state of respective base plates according to another embodiment of the present invention.

[Explanation of symbols]

21, 121 Single-sided conductor pattern film (joined base plate) 22 Conductor patterns 23, 23a Resin film 24 Via hole (bottomed via hole) 25 Reference mark 31 Resin film (protective sheet member) 50 Conductive paste (interlayer connection material) 51 Conductivity Composition (interlayer connection material) 100 Multilayer substrate S1 Conductor pattern forming step S2 Via hole forming step S3 Filling step S4 Hot pressing step L1, L2, L3, L4, L11, L12, L13, L
14 bare plate

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yoshio Hattori             1-1, Showa-cho, Kariya city, Aichi stock market             Inside the company DENSO F-term (reference) 5E317 AA24 BB01 BB12 CC22 CC25                       CD21 CD25 CD32 GG17                 5E346 AA22 AA43 AA53 CC02 CC08                       CC32 CC55 DD02 DD12 DD32                       DD44 EE04 FF01 FF18 GG02                       GG14 GG15 GG18 GG22 GG23                       GG28 HH32

Claims (19)

[Claims] 1. A raw plate (L1, L2, L3, L4) which constitutes a multilayer substrate (100) only on one side of the insulating base material (23) along the longitudinal direction of the strip-shaped insulating base material (23). )
Conductor pattern forming step (S1) of continuously forming the conductor pattern (22) of the above, and at the desired position where the conductor pattern (22) of the raw plates (L1, L2, L3, L4) is formed, A via hole forming step (S2) of forming a via hole (24) on the insulating base material (23) from the surface opposite to the surface on which the conductor pattern (22) is formed; and interlayer connection in the via hole (24) A filling step (S3) for filling the material (50), and the base plates (L1, L2,
L3, L4) are connected and formed, The manufacturing method of the base plate for multilayer substrates characterized by the above-mentioned. 2. The plurality of base plates (L1, L) having a plurality of kinds of conductor patterns (22) constituting each layer of the multilayer substrate (100) on the strip-shaped insulating base material (23).
2. The method for producing a base plate for a multi-layer substrate according to claim 1, wherein the unit is made of 2, L3, L4) and is repeatedly formed. 3. The unit plate (L1, L2, L3, L4) constituting the multilayer substrate (100) is formed by stacking the unit plates (L1, L2, L3, L4) when the multilayer substrate (100) is formed. The base plate (L1, L2, L3, L4) is continuously formed in accordance with the stacking order of L1, L2, L3, L4). Production method. 4. The single unit of the base plates (L1, L2, L3, L4) includes the base plates (L1, L2, L3, L4) constituting a plurality of the multi-layer substrates (100). The method for manufacturing a base plate for a multilayer substrate according to claim 3, wherein the layers are formed by collecting the layers in the same stacking order in (100). 5. A base plate (L11, which constitutes the multilayer substrate,
L12, L13, L14) are the strip-shaped insulating base materials (2
3. A plurality of base plates (L11, L12) are formed side by side in the lateral direction of 3).
A method for manufacturing a base plate for a multilayer substrate according to any one of 1. 6. The method for producing a base plate for a multilayer substrate according to claim 1, wherein the strip-shaped insulating base material (23) is a resin film (23). Method. 7. The method for manufacturing a base plate for a multilayer substrate according to claim 6, wherein the resin film (23) is made of a thermoplastic resin. 8. After the filling step (S3), the base plates (L1, L2, L3, L4) formed by the connection are wound around the strip-shaped insulating base material (23) in the longitudinal direction and rolled. The method for manufacturing a base plate for a multilayer substrate according to claim 6 or 7, wherein 9. After the filling step (S3) and before winding the connected blanks (L1, L2, L3, L4), the linked blanks ( L1, L
The method for manufacturing a base plate for a multilayer substrate according to claim 8, wherein a protective sheet member (31) is formed on at least one surface of (2, L3, L4). 10. The interlayer connecting material (50) is a conductive paste (50), and after the filling step (S3), winding the connected blanks (L1, L2, L3, L4). 10. The method for manufacturing a base plate for a multilayer substrate according to claim 8, wherein the conductive paste (50) is heated and solidified before turning. 11. A multi-layer substrate blank (L1, L2, L3, L4) produced by the method for producing a multi-layer substrate blank according to any one of claims 1 to 10, wherein: Each of the base plates (L1, L2, L constituting the substrate (100)
3, L4) cutting step, and the blank plates (L1, L2,
L3, L4) laminating step, and the raw plates (L1, L2,
By heating the laminate of (L3, L4) from both sides while applying pressure, the layers of the conductor pattern (22) are connected by the interlayer connection material (51) and the base plate (L
1, L2, L3, L4) an adhering step for adhering each other. 12. A plurality of types of conductor patterns (2) constituting each layer of the multilayer substrate (100) only on one surface of the insulating base material (23) along the longitudinal direction of the strip-shaped insulating base material (23).
2) is continuously formed and is provided with a bottomed via hole (24) whose bottom surface is the conductor pattern (22) filled with an interlayer connecting material (51) at a desired position, and the plurality of types of conductor patterns ( 22), a plurality of blank plates (L1, L2, L3, L4) are set as one unit, and the blank plates (L1, L2, L) are repeated to repeat this unit.
3, L4) are connected to each other, a base plate for a multilayer substrate. 13. The plurality of blanks (L1, L2, L3,
The one unit consisting of L4) is the multilayer substrate (10
0) is laminated to form the base plates (L1, L)
The base plate for a multilayer substrate according to claim 12, wherein the base plate is connected in the order of stacking (2, L3, L4). 14. The blanks (L1, L2, L3, L4)
In the 1 unit, the raw plates (L1, L2, L3, L4) constituting the plurality of multilayer substrates (100) are collected and connected in the same order of the stacking order in each multilayer substrate (100). The base plate for a multilayer substrate according to claim 13, wherein 15. A base plate (L1) forming the multilayer substrate
1, L12, L13, L14) is characterized in that a plurality of base plates (L11, L12) are connected side by side in the lateral direction of the strip-shaped insulating base material (23). Item 15. The base plate for a multilayer substrate according to any one of items 14. 16. The base plate for a multilayer substrate according to claim 12, wherein the strip-shaped insulating base material (23) is a resin film (23). 17. The base plate for a multilayer substrate according to claim 16, wherein the resin film (23) is made of a thermoplastic resin. 18. The connecting plate (L1, L)
The base plate for a multilayer substrate according to claim 16 or 17, wherein (2, L3, L4) is wound in the longitudinal direction of the strip-shaped insulating base material (23) and has a roll shape. 19. A protective sheet member (31) is sandwiched between layers of the connected raw plates (L1, L2, L3, L4) wound in the roll shape. The base plate for a multilayer substrate according to claim 18.