JP2002357743A - Optical module package and method of manufacturing the same - Google Patents

Abstract

(57) [Problem] To provide a surface mount type optical module package which can reduce the cost by reducing the number of components of the optical module package and can easily secure airtightness. An optical module package according to the present invention includes an optical bench 1, an LD (Laser Diode) 3 mounted on the optical bench 1, and a monitor PD (Photodiod).
e) Optical components such as 4, a substrate 8 on which the optical bench 1 is mounted, an optical fiber 2 b extending on the optical bench 1, and a side wall of a package installed on the substrate 8 so as to surround the optical bench 1. A ring-shaped resin molded product 2 having an optical connector portion 2a is formed, and a lid 9 for closing an opening of the ring-shaped resin molded product 2 is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LD (La
The present invention relates to an optical module package in which optically active components such as serdiodes (PDs) and PDs (photodiodes) and optically passive components such as optical fibers are hybrid-mounted, hollow-sealed by attaching a lid, and packaged, and a method of manufacturing the same.

[0002]

2. Description of the Related Art An optical module generally transmits and receives optical signals by hybridly mounting various optical components in a package made of ceramic. Optical components include PD (Photod
There are optically active components including semiconductor elements such as iode) and LD (Laser Diode), and optical passive components such as optical fibers and filters which do not themselves perform photoelectric conversion.

[0003] In recent years, optical modules do not directly incorporate optical components into a package, but rather employ a method of assembling them in advance on a silicon substrate called an optical bench and incorporating the assembly into a package. This enables higher density integration than before.

[0004] In recent years, an optical module package structure in which an optical connector is integrated with a package so that an optical module package can be mounted on a motherboard in a batch reflow method, that is, a so-called surface mount optical module, has attracted attention. .

FIG. 20 shows a schematic configuration diagram of a conventional optical module package. Here, an LD module is shown as an example.

As shown in FIG. 20, a metal pattern is formed on an optical bench 1 for soldering or wire bonding optical components such as a V-groove for mounting an optical fiber 2b and an LD3 and a monitor PD4. ing. The optical component is connected to a predetermined electrode unit via a gold wire 6.

[0007] Solder bonding of the optical component is performed by forming a solder film in advance on one of the optical bench 1 and the optical component, forming a metal pattern on the other to spread the solder, and melting the solder when mounting the optical component. And join. In general, a gold-tin eutectic alloy is used as a solder material. Generally, a gold layer is formed on the outermost surface of the metal pattern. Bonding is possible even if a solder is formed on both the optical bench 1 and the optical component in advance.

An optical component such as the optical fiber 2b may be mounted using an adhesive. In the case of bonding with a resin adhesive, a resin adhesive is applied on the optical bench 1, and
An optical component is mounted thereon, and the resin is cured by heat, light irradiation, or the like, and bonded.

An assembly method using the optical bench 1 includes a method called a passive alignment mounting technique. This method is excellent in mass productivity because the optical component is mounted by position recognition instead of adjusting the optical axis while emitting or receiving light.

[0010] Specifically, alignment marks are formed on both the optical bench 1 and the optical component, and the alignment marks are recognized by an infrared camera, adjusted in position, and adjusted.
Implement. According to the mounting using the passive alignment mounting technology, high-precision mounting of about 1 μm can be realized.

The optical module thus assembled is packaged and protected from the external environment. When packaging the optical module, the optical connector component 14 is finally bonded to the package side with an adhesive 15. The external electrodes 12 are formed on the surface of the package 13.

The material of the package 13 in the conventional optical module is generally ceramic, and hermetically sealed with a lid 9 of metal, glass, ceramic, or the like. In this case, only the inert gas such as helium is in contact with the surface of the optical module mounted inside the package 13, and the optical components have no stress and no chemical corrosion,
It is characterized by high long-term reliability such as heat cycle.

[0013]

On the other hand, in the conventional optical module package, the package 13 itself is expensive, and as shown in FIG.
In order to form an optical connector on the package 3, processing of a complicated shape is required for the package 13, and there has been a problem that the package 13 becomes more expensive.

Further, the optical connector component 14, which is a component separate from the package 13, needs to be formed in a complicated shape and mounted with high accuracy, and the increase in the number of components increases the cost. By the way, the connector part is ferrule 2
The optical signal terminal is made of zirconia, glass, or the like, and includes an optical signal terminal called "c" and a mounting fixing portion for fitting and mounting an external plug.

In fact, although a ceramic package is supposed to be highly reliable, it is difficult to hermetically seal it with the lid 9 including the optical connector portion in which different parts are spliced in a complicated manner. ) Decreased.

The present invention has been made to solve the above problems. An object of the present invention is to provide a surface mount type optical module package which can reduce costs by improving the components of the optical module package and reduce the number of components, and can easily secure airtightness.

[0017]

An optical module package according to the present invention comprises an optical bench, an optical component mounted on the optical bench, a substrate mounted with the optical bench, and an optical module extending on the optical bench. The optical system includes a fiber, a ring-shaped resin molded product which is provided on the substrate so as to surround the optical bench, forms a side wall of the package and has an optical connector portion, and a lid for closing an opening of the ring-shaped resin molded product. In the specification of the present application, the “optical bench” refers to an optical gantry or an optical pedestal serving as a base for mounting optical components.

By employing the ring-shaped resin molded product as described above, the package and the optical connector can be integrated, and the number of components of the optical module package can be reduced. In addition, by employing a resin molded product, the molding itself is also facilitated. Further, it is not necessary to splicate different parts as in the conventional example, and the airtightness of the package can be easily secured.

The ring-shaped resin molded product preferably has a ring portion surrounding the optical bench, and both the ring portion and the optical connector portion are formed of resin, and the ring portion and the optical connector portion are preferably integrated. Thereby, the number of components of the optical module package can be reduced, and the above-described effects can be obtained.

The optical module package according to the present invention comprises:
A ferrule (optical signal terminal) is provided to protrude from the ring-shaped resin molded product and through which an optical fiber is inserted. It is preferable that the ferrule portion is made of the same material as the ring-shaped resin molded product, and is integrally formed with the ring-shaped resin molded product. By thus integrating the ferrule with the ring-shaped resin molded product, the number of components of the optical module package can be further reduced.

The ferrule portion may be formed as a separate part from the ring-shaped resin molded product, and the ferrule portion may be integrated with the ring-shaped resin molded product by insert molding. In this case, the configuration of the molding die for the ring-shaped resin molded product can be simplified.

It is preferable that the ferrule has positioning means for positioning the ferrule in a mold for molding a ring-shaped resin molded product. Thus, the ferrule portion can be easily and accurately positioned in the molding die, and the positional accuracy in the optical axis direction with respect to the molding die can be increased.

The ring-shaped resin molded product may include a lead frame portion. By fixing the ferrule to the lead frame in advance, it is possible to easily position the molding die and the ferrule, instead of directly positioning the molding die and the ferrule. This eliminates the need to perform complicated ferrule alignment work in the molding die.

It is preferable that the ring-shaped resin molded article and at least one of the lid and the substrate are bonded using a semi-curable adhesive sheet.

By employing a semi-curable adhesive sheet as described above, it is possible to suppress the generation of air bubbles in the bonded portion during curing, and to suppress the occurrence of poor airtightness. Further, since liquid dripping hardly occurs as in the case of bonding using a liquid resin, it is not necessary to design the liquid dripping into a large size, and the package can be downsized.

The bonding part by the semi-curable bonding sheet is
It is preferable to coat with a thermosetting resin. Thereby, the bonding portion can be reinforced, and it is possible to prevent the bonding portion from being peeled off at the time of reflow in the package mounting process. As a result, the moisture resistance of the package can be improved, and the reliability of the package can be improved.

It is preferable that the ring-shaped resin molded product has a step portion for receiving at least one of the substrate and the lid. In this case, at least one of the substrate and the lid is placed on the step.

Thus, the positioning of the substrate and the lid is facilitated, and the workability is improved. Further, the bonding area between the substrate or the lid and the ring-shaped resin molded product can be increased, and peeling of the bonded portion can be suppressed.

It is preferable that the thickness of the optical connector portion of the ring-shaped resin molded product is larger than the thickness of the ring portion of the ring-shaped resin molded product. Further, it is preferable that the optical connector is disposed outside the substrate.

In any case, the thickness of the ring portion in the ring-shaped resin molded product can be reduced, so that the optical fiber can be brought closer to the substrate. That is, the height of the optical fiber from the substrate can be reduced. This makes it possible to adjust the height of the optical bench surface on which the optical fiber is installed from the substrate and the height of the optical fiber from the substrate while ensuring the necessary thickness for the optical connector section, and the difference between these heights can be adjusted. There is no need to install a member (for example, the submount 7 in FIG. 1) for adjusting.

It is preferable that the optical connector portion is provided with a convex portion for preventing the optical module package from tilting after mounting. Thus, it is possible to prevent the optical module package from being tilted when mounted on the motherboard, thereby preventing the occurrence of soldering failure.

It is preferable that the protrusion extends to the vicinity of the lowermost surface on the mounting side of the optical module package (for example, the surface of an external terminal). Thereby, it is possible to effectively suppress the optical module package from being tilted at the time of mounting on the mother board, and it is possible to suppress occurrence of soldering failure. Further, when the protrusion is extended below the lowermost surface on the mounting side of the optical module package, and when the tip of the protrusion is inserted into the mother board, the detachment force of the fiber plug is absorbed by the insertion fixing portion. be able to.

The optical bench has a groove for positioning an optical fiber, and the height of the groove from the substrate is
It is preferable that the optical fiber is positioned in the groove by lowering the height of the optical fiber from the substrate and pressing the optical fiber against the groove.

Thus, the optical fiber can be securely fixed to the groove while preventing the optical fiber from being damaged.

In the above-mentioned ring-shaped resin molded product, the thickness of the ring portion remote from the optical connector portion is reduced from the mounting surface side on the substrate to be smaller than the thickness of the ring portion located on the optical connector portion side. Is preferred. Specifically, for example, as shown in FIG. 19, an inclined surface is provided on the bottom surface (the surface to be mounted on the substrate) of the ring portion in the ring-shaped resin molded product, the ring portion is tapered, and the side away from the optical connector portion is provided. The thickness of the ring portion is made smaller than the thickness of the ring portion located on the optical connector side.

Thus, when the ring-shaped resin molded product is placed on the substrate, the tip of the optical fiber can be inclined downward (substrate side) with respect to the optical bench surface as shown in FIG. 18, for example. The tip of the fiber can be easily housed in a V groove or the like on the surface of the optical bench.

The method for manufacturing an optical module package according to the present invention includes the following steps. Mount the optical components on the optical bench. The optical bench is mounted on a substrate. A ring-shaped resin molded product having an optical connector is formed. A side wall of the package is formed by installing a ring-shaped resin molded product on the substrate so as to surround the optical bench. Attach the lid to the ring-shaped resin molded product so as to cover the optical bench.

Since it is only necessary to mount the ring-shaped resin molded product having the optical connector portion on the substrate as described above, the optical module package can be easily and efficiently manufactured. Further, by adopting the ring-shaped resin molded product of the present invention, the number of components of the optical module package can be reduced as described above, which can also contribute to facilitating the manufacture of the optical module package. In addition, since it is not necessary to splicate different parts as in the conventional example, the airtightness of the package can be ensured.

The above-mentioned ring-shaped resin molded article has a ferrule. The step of forming the ring-shaped resin molded article includes molding the ring-shaped resin molded article by insert molding and fixing the ferrule to the ring-shaped resin molded article. Including. Thereby, the work of fixing the ferrule to the ring-shaped resin molded product can be performed simultaneously with the molding of the ring-shaped resin molded product, and the process can be simplified.

The insert molding described above may be performed with the optical fiber attached to the ferrule. Thus, the work of inserting the optical fiber into the ferrule can be separately performed, and the optical module package can be manufactured efficiently.

The insert molding may be performed with the ferrule mounted on the lead frame. Thereby,
The ferrule can be installed in the molding die with the ferrule fixed to the lead frame, and there is no need to align the ferrule, which is a micro component, on the molding die. as a result,
The operating rate of the molding machine can be improved.

[0042]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to FIGS.

(Embodiment 1) FIG. 1 is a sectional view of an optical module package according to Embodiment 1, FIG. 2 is a side view of the optical module package, and FIG. 3 is a ring-shaped resin molded product according to Embodiment 1. 2 is a plan view, and FIG. 4 is a perspective view of the ring-shaped resin molded product 2. Here, an LD module is shown as an example.

As shown in FIG. 1, an optical module package integrated with an optical connector according to the present invention comprises an optical bench (base for mounting optical components) 1 and an optical bench 1.
The optical component mounted on the optical bench 1, the substrate 8 on which the optical bench 1 is mounted, the optical fiber 2b, the ring-shaped resin molded product 2 having the optical connector formed thereon, and the opening of the ring-shaped resin molded product 2 are closed. And a lid 9.

The optical bench 1 is made of, for example, silicon, and has a surface for receiving the optical fiber 2b.
A groove such as a groove is formed. Optical components are LD3 and monitor PD hybrid mounted on optical bench 1.
4 and optical passive components such as an optical fiber 2b and a filter. The LD 3 and the monitor PD 4 are connected to predetermined electrodes via the gold wire 6. Optical fiber 2b
Extends on the V groove on the surface of the optical bench 1 and is fixed to the optical bench 1 with an adhesive or the like.

The substrate 8 is made of, for example, an insulating material, and has a simple flat plate shape in the embodiment shown in FIG. The substrate 8
The optical bench 1 is mounted on the surface of the optical bench 1 via a submount 7. The submount 7 functions as a height adjusting member for adjusting the height of the V groove on the surface of the optical bench 1 and the height of the optical fiber 2b. An external electrode 12 made of a solder ball or the like is formed on the back surface of the substrate 8.

The ring-shaped resin molded product 2 is adhered to the substrate 8 and the lid 9 with a semi-curable adhesive sheet 10 to form a side wall of the package.

As shown in FIGS. 1 to 4, the ring-shaped resin molded product 2 has an optical connector portion 2a and a ring portion, and the optical connector portion 2a and the ring portion are integrally formed and have the same material. (Resin).

The optical connector 2a has a ferrule (optical signal terminal) 2a1 and surrounds the ferrule 2a1. The optical connector portion 2a is shaped so that the plug can be attached and fixed, but this is because the engraving is formed in the molding die itself so as to have the shape.
It does not mean that it is machined after molding. An optical fiber 2b is inserted into the center of the ferrule portion 2a1.

The ring-shaped resin molded product 2 shown in FIGS. 1 to 4 is injection-molded using a vertically separate molding die.
The broken line shown in FIG. 4 indicates a mating surface of the upper and lower molds (a linear uneven portion formed along the mating surface of the upper and lower molds) 2j. The material of the ring-shaped resin molded product 2 is PPS
(Polyphenylene sulfide), PBT (polybutylene terephthalate), and epoxy resin are conceivable. In practice, a compound containing a filler or the like can be used.

The ring portion forms a side wall of the package,
It has a space on the inner circumference side. An optical bench 1 and the like are installed in the space as shown in FIG. Therefore, when the package is assembled, the optical bench 1 and the like are surrounded by the ring portion.

The assembly including the optical bench 1 and the like is assembled in the above-mentioned ring portion, and the lid 9 is attached so as to close the opening of the ring portion. Thereby, the package is hermetically sealed.

Next, an assembly method (manufacturing method) of the optical module package according to the present embodiment will be described with reference to FIG.

The LD 3 is die-bonded to the optical bench 1 by a passive alignment mounting method. Next, the monitor PD carrier 5 is mounted. The monitor PD 4 is die-bonded to the monitor PD carrier 5 in advance.
The carrier 5 and the monitor PD 4 are wire-bonded with a gold wire 6.

The above assembly is die-bonded to a substrate 8 made of ceramic or the like. The substrate 8 is flat without a cavity and has metal wiring formed thereon.
Next, the substrate wiring and the optical bench 1 are wire-bonded with gold wires 6.

Next, the ring-shaped resin molded product 2 having the above structure
Is molded by injection molding or the like, and the ring-shaped resin molded product 2 is bonded to the substrate 8. At that time, the position is adjusted so that the optical fiber 2b of the ring-shaped resin molded product 2 fits into the V groove of the optical bench 1.

The side wall of the package and the optical connector are simultaneously formed by bonding the ring-shaped resin molded product 2. In FIG.
In order to adjust the position of the optical fiber 2b and the height of the surface of the optical bench 1 almost equally, the optical bench 1
A submount 7 is formed between the substrate and the substrate 8. The submount 7 is made of a metal such as Kovar.

Accurate fine adjustment of the optical fiber 2b into the V groove on the surface of the optical bench 1 is achieved by subsequently hardening the optical fiber 2b with a resin while pressing the optical fiber 2b into the V groove. Next, the sealing is completed by bonding the lid 9 to the upper surface of the ring-shaped resin molded product 2.

Finally, by forming the external electrodes 12, the optical module package is completed. In FIG. 1 and FIG. 2, the external electrode 12 is a BGA (Ball Grid
Array) is shown, but instead of ball electrodes, leads and pins may be used as external electrodes.

In the present embodiment, the ring-shaped resin molded product 2
, The airtight sealing is easy even if an optical terminal is present. Even if the substrate 8 is made of ceramic, the substrate 8 does not need to have a complicated shape, and may be, for example, a flat substrate on which only metal wiring is formed. Therefore, the cost of the conventionally expensive package can be reduced. In addition, since the optical connector is formed by the ring-shaped resin molded product 2 at a time, the number of parts does not increase, and the optical connector itself is inexpensive.

(Embodiment 2) Next, Embodiment 2 of the present invention will be described. The package of the second embodiment is an optical connector integrated type module package as in the case of the first embodiment, and the ring-shaped resin molded product 2 is an integrated resin molded product including the optical connector. Similarly, a resin-molded cylindrical convex portion is formed in a shape extending into and out of the ring portion.

The above-mentioned convex portion functions as the ferrule portion 2a1. A through-hole is formed at the center of the projection, and the optical fiber 2b is inserted into and adhered to the through-hole. The optical fiber 2b protruding from the end surface of the convex portion inside the ring portion of the ring-shaped resin molded product 2 is cleaved by a predetermined length, and the outer end surface of the ring portion of the convex portion to which the optical fiber 2b is bonded is polished. Then, the cleaved optical fiber 2b is optically coupled to an optical component mounted on the optical bench 1.

Focusing on the optical connector portion 2a of the optical module package shown in FIG. 1, there is no boundary between the convex portion functioning as the ferrule portion 2a1 and the main body of the ring-shaped component. That is, the convex portion is made of the same material as the ring-shaped resin molded product 2,
At the same time, they are collectively formed by injection molding.

In this configuration, the optical fiber 2b
Since a through-hole for passing through is required, molding cannot be performed using a vertically separate mold as in the first embodiment. Therefore, injection molding is performed using a mold having three or more surfaces. The resin material used and others are the same as in the first embodiment.

In the second embodiment, the ferrule portion 2a1
The ring-shaped resin molded product 2 is more inexpensive than that of the first embodiment because it is collectively formed by using the resin including the convex portion functioning as the resin.

(Embodiment 3) Next, Embodiment 3 of the present invention will be described. In the third embodiment, in the optical connector integrated module package, the ring-shaped resin molded product 2 is an insert molded product of the ferrule 2c, and the optical fiber 2b is inserted into and adhered to the center through hole of the ferrule 2c.

The optical fiber 2b protruding from the inner end surface of the ring portion of the ferrule 2c is cleaved to a predetermined length, and the outer end surface of the ring of the ferrule portion 2a1 to which the optical fiber 2b is bonded is polished. Then, the cleaved optical fiber 2b is optically coupled to an optical component mounted on the optical bench 1.

FIG. 5 is a cross-sectional view of the ring-shaped resin molded product 2 according to the third embodiment. As shown in FIG. 5, the material of the ferrule 2c and the body of the ring-shaped resin molded product 2 are different. Generally, zirconia or the like is used as a material of the ferrule 2c.

Next, a method for manufacturing the ring-shaped resin molded product 2 of the third embodiment will be described. The ferrule 2c is set in the cavity of the molding die of the ring-shaped resin molded product 2, the mold is closed, and the resin is filled into the mold cavity by injection molding. Thereby, the work of fixing the ferrule 2c to the ring-shaped resin molded product 2 can be performed simultaneously with the molding of the ring-shaped resin molded product 2, and the process can be simplified. In addition, the mold used can be a two-sided mold of a vertical separate type.
The resin material used is the same as in the first embodiment.

At the center of the insert-molded ferrule 2c, a hole for passing the optical fiber 2b is formed in advance. After molding, the optical fiber 2b is inserted into the hole of the ferrule portion 2c.
, Resin such as epoxy is injected into the gap between the hole and the optical fiber 2b, and the optical fiber 2b and the ferrule 2c are bonded.

Next, the optical fiber 2b protruding from the inner end face of the ring-shaped resin molded product 2 in the ferrule 2c is cleaved to a predetermined length. Further, the outer end surface of the ring portion of the ferrule 2c to which the optical fiber 2b is bonded is polished. Other assembly methods and effects are described in Embodiment 1.
Is the same as

(Fourth Embodiment) Next, a fourth embodiment of the present invention will be described. The fourth embodiment is characterized in that in the optical connector integrated module package, the ring-shaped resin molded product 2 is an insert molded product of the ferrule 2c with the optical fiber 2b. A diagram showing the present embodiment is the same as FIG. 5 showing the third embodiment.

A method for assembling the ring-shaped resin molded product 2 of the fourth embodiment will be described. The optical fiber 2b is passed through the through hole at the center of the ferrule 2c made of zirconia or the like, and a resin such as epoxy is injected into a gap between the hole and the optical fiber 2b to bond the optical fiber 2b and the ferrule 2c.

Next, the optical fiber 2b protruding from one end face of the ferrule 2c is cleaved by a predetermined length, and the other end face of the ferrule 2c is polished. The ferrule with optical fiber 2c assembled as described above is placed on the molding die of the ring-shaped resin molded product 2, the mold is closed, and the resin is filled into the mold cavity by injection molding.

As described above, the optical fiber 2b and the ferrule 2c are bonded in advance, and the ferrule 2c with the optical fiber 2b is insert-molded to separately insert the optical fiber 2b into the ferrule 2c. The optical module package can be manufactured efficiently.

The mold to be used is an upper and lower separate mold.
This is possible with a surface mold. The resin material used is the same as in the first embodiment. Other assembling methods and effects are the same as those of the first embodiment.

(Fifth Embodiment) Next, a fifth embodiment of the present invention will be described. The fifth embodiment is characterized in that a means for positioning on a molding die is formed in the ferrule 2c used for the ring-shaped resin molded product 2.

FIG. 6 is a sectional view showing an example of the ring-shaped resin molded product 2 of the present embodiment. As shown in FIG. 6, a narrowed portion 2c1 that is slightly smaller than the outer diameter of the ferrule 2c is formed in a part of the ferrule 2c. That is, the outer diameter of the ferrule 2c located on the inner peripheral side of the ring portion of the ring-shaped resin molded product 2 is partially reduced, and a groove or a concave portion is provided on the outer periphery of the ferrule 2c.

On the other hand, a convex portion for positioning the ferrule is formed in the molding die of the ring-shaped resin molded product 2, and the ferrule narrowing portion 2c1 is matched with the convex portion of the molding die to thereby provide the ferrule 2c or the optical fiber. The positioning of the ferrule on the mold can be facilitated.

The outer diameter of the ferrule 2c is generally 1.2
5 mm or 2.5 mm is often used. In the embodiment shown in FIG. 6, the narrowed portion 2
The diameter of c1 is about 0.4 mm smaller, and the width of the drawn portion is about 0.4 mm.
5 mm.

The ferrule 2c or the ferrule with an optical fiber is positioned on the molding die by the above-described method, the die is closed, and the resin is filled in the die cavity to injection-mold the ring-shaped resin molded product 2. . The mold to be used may be a two-sided mold of a vertical separate type. The resin material used is the same as in the first embodiment.

According to the fifth embodiment, ferrule 2c
By forming the positioning means such as the squeezed portion 2c1 at the bottom, an effect is obtained that the positional accuracy in the optical axis direction with respect to the molding die can be improved. Other assembling methods and effects are the same as in the first embodiment.

(Embodiment 6) Next, Embodiment 6 of the present invention will be described. The optical connector integrated module package according to the sixth embodiment includes the ring-shaped resin molded product 2 including the lead frame 2d.

The ring-shaped resin molded product 2 of the present embodiment is
The ferrule 2c or the ferrule with an optical fiber is mounted on the lead frame 2d in advance, and a part of the lead frame 2d on which the ferrule 2c is mounted and the ferrule 2c are inserted and molded in a molding die. It can be manufactured by separating the unnecessary portion and the ring-shaped resin molded product 2 main body.

FIG. 7 shows a sectional view of the ring-shaped resin molded product 2 of the present embodiment. As shown in FIG. 7, a ferrule 2c made of zirconia or the like is fixed to a lead frame 2d in advance with an adhesive.
Of insert molding. By doing so, it is not necessary to align the ferrule 2c, which is a minute component, on the molding die, and the operating rate of the molding machine can be further improved.

For example, a lead frame 2d capable of mounting ten ferrules 2c is manufactured. The lead frame 2 is formed with ten identical patterns continuously, and each pattern has a ferrule mounting portion.

The mounting and bonding of the ferrule 2c to each of the ferrule mounting portions is performed by a different aligning machine from the molding machine. The lead frame 2d on which the ferrule 2c is mounted is formed with a positioning hole for aligning with a molding die, and the positioning pin on the molding die is aligned with the positioning hole, so that the lead frame 2d is placed on the die. It can be positioned and at the same time determines the ferrule position on the mold.

A large number of lead frames 2d in one molding
If injection molding is used, mass production becomes possible. In particular, in order to achieve the shape of the ring-shaped resin molded product 2 of the present embodiment, the molding die is effective because it can be realized by a vertical separate die. The resin material used is the same as in the first embodiment. Other assembling methods and effects are the same as in the first embodiment.

Embodiment 7 Next, Embodiment 7 of the present invention will be described. The seventh embodiment is characterized in that in the optical connector-integrated module package, the ring-shaped resin molded product 2 and the substrate 8 or the lid 9 are bonded using the semi-curable adhesive sheet 10.

As shown in FIG. 1, the ring-shaped resin molded product 2
The semi-curable adhesive sheet 10 is used for bonding the substrate 9, the ring-shaped resin molded product 2 and the lid 9 to each other. The semi-curable adhesive sheet 10 is obtained by impregnating a glass fiber woven fabric with an epoxy-based resin or the like, and curing the composition halfway (B-staged).

The semi-curable resin sheet 10 can be easily punched out with a mold, and can be formed into a shape corresponding to the shape of the bonding surface. In the seventh embodiment, the semi-curable resin sheet 10 may be punched in a ring shape. The punched semi-curable adhesive sheet 10 is used as an adherend (in this case, a ring-shaped resin molded product 2).
And substrate 8 and / or ring-shaped resin molded product 2 and lid 9)
By sandwiching between them, and curing while being clamped, the adhesion of the adherend is completed.

Conventionally, there is a method of simply sealing with a liquid resin, but in this case, airtightness cannot be ensured, for example, air inside the package expands during curing for curing the adhesive and air bubbles accumulate in the bonding portion. was there.

However, in this embodiment, since the semi-curable adhesive sheet 10 is used, there is an advantage that air bubbles do not accumulate in the adhesive portion and the problem of poor airtightness does not occur. In addition, although dripping of about 0.3 mm occurs in the liquid resin, the semi-curable adhesive sheet 10 does not generate dripping as compared with the liquid resin, so there is no need to design a package area in consideration of the dripping portion. Thus, the size of the package can be further reduced. Other assembling methods and effects are the same as in the first embodiment.

Embodiment 8 Next, Embodiment 8 of the present invention will be described. In the eighth embodiment, in the optical connector integrated optical module package of the seventh embodiment, the semi-curable adhesive sheet 10 is preliminarily bonded to at least one of the substrate 8, the ring-shaped component 2, and the lid 9. Features.

FIG. 8 is a cross-sectional view of the ring-shaped resin molded product 2 to which the semi-curable adhesive sheet 10 has been pre-adhered. FIG.
This is an example of preliminary bonding, and the semi-curable adhesive sheet 10 may be pre-bonded to the substrate 8 or the lid 9.

In this embodiment, since the semi-curable adhesive sheet 10 is preliminarily bonded to one of the adherends, it is necessary to directly handle the thin flexible semi-curable adhesive sheet 10 in the assembly process. Therefore, there is an advantage that workability is improved. In the case where the semi-curable adhesive sheet 10 is preliminarily bonded as in the present embodiment, the same effect as in the seventh embodiment can be obtained.

(Ninth Embodiment) Next, a ninth embodiment of the present invention will be described. In the ninth embodiment, in the optical module package with an integrated optical connector, the ring-shaped resin molded product 2 and the substrate 8 and / or the lid 9 are bonded with the semi-curable adhesive sheet 10, and furthermore, with the liquid resin. Potting (sealing) the adhesive part of the curable adhesive sheet 10
It is characterized by doing.

FIG. 9 is a sectional view of an optical module package according to the present embodiment. As shown in FIG. 9, the adhesive portion of the semi-curable adhesive sheet 10 is liquid resin potted. That is, the adhesive portion of the semi-curable adhesive sheet 10 is replaced with the potting resin 1 formed by potting.
Coated with 1.

The steps up to liquid resin potting are the same as in the seventh and eighth embodiments. The liquid resin to be potted is generally an epoxy-based thermosetting resin, in which a solvent, a curing agent, a catalyst, a base resin, a filler, and the like are blended.

The mounting of the optical connector integrated type optical module package is generally performed by reflow. However, the package is exposed to a high temperature at the time of reflow, and the adhesive portion of the semi-curable adhesive sheet 10 is peeled off due to air expansion inside the package. It is possible. When such a problem occurs, moisture enters from the peeling portion and affects the long-term reliability of the optical module. When the package absorbs moisture, the above-mentioned problem is likely to occur because the moisture and moisture are vaporized and expanded.

In the present embodiment, since the adhesive portion of the semi-curable adhesive sheet 10 is potted with the liquid resin, the adhesive portion is reinforced, and even if a large stress is generated in the adhesive portion by reflow or the like, the adhesive portion is not damaged. Does not occur. By doing so, a more reliable optical module package sealing structure can be realized. Other assembling methods and effects are the same as in the first embodiment.

(Embodiment 10) Next, Embodiment 10 of the present invention will be described. In the tenth embodiment, in the optical connector-integrated module package, a uniform step is formed on at least one surface of the ring-shaped resin molded product 2, and the lid 9 is positioned one step inside the outermost surface of the ring-shaped resin molded product 2. And the substrate 8 is bonded.

FIG. 10 is a cross-sectional view of the optical module package according to the present embodiment, and FIG. 11 is a perspective view of the ring-shaped resin molded product 2 according to the present embodiment.

In the ring-shaped resin molded product 2 of the present embodiment, as shown in FIG.
Is formed. By forming a step in the injection mold, a step is formed in the resin molded product.
It is not necessary to add a step in order to form. Although the present embodiment is illustrated as a modification of the second and ninth embodiments, the idea of the present embodiment can be applied to all the modifications of the third to eighth embodiments.
It is desirable that the depth of the step portion 2e is 0.5 mm or more.

As described above, the formation of the step 2e makes it possible to
0, the semi-curable adhesive sheet 1 is placed on the step 2e.
The cover 9 and the substrate 8 can be attached to the ring-shaped resin molded product 2 in this state by placing the cover 9 and the substrate 8 with the cover 9 interposed therebetween.
Therefore, the semi-curable adhesive sheet 10 and the lid 9 can be easily positioned, and workability is improved.

Further, reinforcement of the bonding portion of the semi-curable bonding sheet 10 by liquid resin potting is improved by increasing the bonding area. Therefore, even if a large amount of stress is generated in the bonded portion due to reflow or the like, the peeling of the bonded portion can be more effectively prevented. By doing so, a more reliable optical module package sealing structure can be realized. Other assembling methods and effects are the same as in the first embodiment.

(Eleventh Embodiment) Next, an eleventh embodiment of the present invention will be described. The eleventh embodiment is characterized in that in the ring-shaped resin molded product 2 of the optical connector integrated type module package, the thickness of the optical connector portion 2a is larger than that of the ring portion, and the optical connector portion 2a is located outside the substrate 8. And

FIG. 12 is a sectional view of the optical module package according to the present embodiment, FIG. 13 is a side view of the optical module package according to the present embodiment, and FIG. 14 is a perspective view of the ring-shaped resin molded product 2 according to the present embodiment. Is shown.

As shown in these figures, Embodiment 1
In the ring-shaped resin molded product 2, the thickness of the optical connector 2 a is larger than that of the ring. Therefore, a step 2 is formed between the surface of the optical connector portion 2a (the surface on the mounting surface side on the mother board) and the surface of the ring portion (the surface on the substrate 8 side).
h will be present.

By changing the shape of the injection mold,
Since the shape of the resin molded product can be changed, it is not necessary to add a particular step. Here, the modification of the second embodiment is shown, but the idea of the eleventh embodiment can be applied to all the other embodiments.

Generally, the thickness of the optical connector is as large as 2.5 mm or more, and the thickness of the optical bench 1 is about 0.5 m.
m, the optical bench 1 is mounted on a flat substrate 8 as in the first embodiment, and when the ring-shaped resin molded product 2 having a uniform thickness is used, the V groove and the ring of the optical bench 1 are formed. The submount 7 is required to adjust the vertical position of the optical fiber 2b of the resin molded product 2 (the position in the substrate 8 in the direction perpendicular to the mounting surface of the optical bench 1).

However, in the present embodiment, the thickness of the ring portion is made smaller than the thickness of the optical connector portion 2a, the optical connector portion 2a is arranged outside the substrate 8, and the substrate 8 and the cover are attached to the thin ring portion. Since the adhesive 9 is adhered, the V-groove of the optical bench 1 can be vertically aligned with the optical fiber 2b of the ring-shaped resin molded product 2 without the submount 7.

Therefore, it is possible to omit the submount 7 while securing the necessary thickness of the optical connector 2a. As a result, a small optical module package that is thinner than the second embodiment by about 0.7 mm or more can be realized. Other assembling methods and effects are the same as in the first embodiment.

(Twelfth Embodiment) Next, a twelfth embodiment of the present invention will be described. In the present embodiment, in the optical connector integrated optical module package, the optical connector portion 2a of the ring-shaped resin molded product 2 is arranged outside the substrate 8, and at least one convex portion is formed on the lower surface of the optical connector portion 2a. It is characterized by doing. The vertical position of the tip of the protrusion is substantially the same as the lowermost surface of the terminal of the module package.

FIG. 15 is a side view of the optical module package according to the present embodiment. In the ring-shaped resin molded product 2 of the present embodiment, a boss (convex portion or columnar portion) 2f is formed on the lower surface of the optical connector portion 2a. And
As shown in FIG. 15, the boss 2f is moved downward (external electrode 12
Side) and the vertical position of the tip of the boss 2f is substantially the same as the lowermost surface of the external electrode (terminal) 12 of the optical module package.

By changing the shape of the injection mold,
Since the boss 2f can be formed, it is not necessary to add a step. That is, the boss 2f is also formed simultaneously with the injection molding of the ring-shaped resin molded product 2. Although shown here as a modification of the second embodiment, the idea of the present embodiment can be applied to all the other embodiments.

In the optical connector-integrated optical module package as shown in FIG. 1, when the size of the module body is small, the weight of the optical connector 2a is large, so that the weight when the optical module package is mounted on a flat surface. The balance becomes poor, and the optical module package tilts.
If such an optical module package is mounted on a mother board, defective soldering of the external electrodes 12 may occur.

However, in the ring-shaped resin molded product 2 of the present embodiment, the boss 2f is formed on the lower surface of the optical connector portion 2a, and the vertical position of the tip of the boss 2f is substantially the same as the lowermost surface of the external electrode 12 of the module package. Since the position is set, the boss 2f functions as a support for preventing the optical module package from tilting. Therefore, there is no possibility that the soldering failure occurs due to the inclination of the optical module package at the time of mounting on the motherboard. Other assembling methods and effects are the same as in the first embodiment.

(Thirteenth Embodiment) Next, a thirteenth embodiment of the present invention will be described. In the present embodiment, in the optical connector integrated module package, the optical connector portion 2a of the ring-shaped resin molded product 2 is disposed outside the substrate 8, and at least one convex portion is formed on the lower surface of the optical connector portion 2a. The vertical position of the tip of the projection is lower than the lowermost terminal of the terminal of the module package.

FIG. 16 is a side view of the optical module package according to the present embodiment. As shown in FIG.
The ring-shaped resin molded product 2 of the present embodiment has a stepped boss 2g on the lower surface of the optical connector 2a. Then, the tip vertical position of the boss 2g is disposed below the lowermost surface of the external electrode 12 of the module package.

By changing the shape of the injection mold,
Since the boss 2g can be formed, it is not necessary to add a step. That is, the boss 2g is also formed simultaneously with the injection molding of the ring-shaped resin molded product 2. Although illustrated here as modified examples of the second and twelfth embodiments, the idea of the present embodiment can be applied to all the other embodiments.

In the optical connector integrated type module package, after mounting on the mother board, the attachment and detachment of the fiber plug to and from the optical connector portion 2a are repeated. At this time, the detaching force of the optical module is about 15 N (about 1.5 kgf).

In the optical connector-integrated optical module package as shown in FIG. 1 or FIG. 15, all the detaching force of the fiber plug is received at the connection portion (solder connection portion) of the external electrode 12 to the motherboard. In that case, a large stress is applied to the soldered portion, and a fatal problem such as cracking or peeling at the soldered portion may occur.

However, in this embodiment, the boss 2g is formed on the lower surface of the optical connector portion, and the vertical end of the boss 2g is lower than the lowermost surface of the external electrode 12 of the module package. Boss 2g
If a through-hole is formed at the corresponding position, the boss 2g is inserted and fixed in the through-hole, so that the fiber plug attaching / detaching force can be absorbed by the insertion fixing portion of the boss 2g.

Further, as shown in FIG. 16, the thickness of the boss 2g is narrowed down near the lowermost surface of the external electrode 12 of the optical module to form a stepped shape, and the diameter of the boss 2g insertion hole of the mother board is set to the thickness of the boss 2g thick portion. The value is in the middle of the thin part. Accordingly, there is no possibility that the weight balance is bad and tilted when the optical module package is mounted.

In this embodiment, the boss 2g is formed on the lower surface of the optical connector 2a, and the vertical end of the boss 2g is lower than the lowermost surface of the external electrode 12 of the optical module.
If a through-hole is formed at a position corresponding to the boss 2g of the mother board, stress will be applied to the soldered portion by the detachment force of the fiber plug, and problems such as cracking and peeling at the soldered portion will not occur. Absent. Other assembling methods and effects are the same as in the first embodiment.

(Embodiment 14) Next, Embodiment 14 of the present invention will be described. In the present embodiment, in the optical connector integrated module package, the fiber positioning V of the optical bench 1 mounted on the substrate 8 is set.
The height of the groove (the height from the mounting surface of the ring-shaped resin molded product 2 on the substrate 8) is determined by the vertical position of the optical fiber of the ring-shaped resin molded product 2 (with respect to the mounting surface of the ring-shaped resin molded product 2 on the substrate 8). (The position in the vertical direction), and pressing the optical fiber 2b from above, the optical bench 1
Is positioned in the V-groove.

FIG. 17 is a sectional view of a semi-finished product module package on which the ring-shaped resin molded product 2 is mounted.
As shown in FIG. 17, the vertical position of the optical fiber 2b from the substrate 8 is higher than the vertical position of the V groove of the optical bench 1 from the substrate 8. The height gap is desirably about 0.1 to 0.3 mm.

In the optical module according to the first to thirteenth embodiments, the alignment between the optical fiber 2b of the ring-shaped resin molded product 2 and the V-groove of the optical bench 1 is determined by the adhesion accuracy of the ring-shaped resin molded product 2. Is done. In a state where the optical fiber 2b is in contact with the optical bench 1, the optical fiber 2b cannot be pressed to fit into the V-groove, and if pressed forcibly, the optical fiber 2b may be damaged.

In this embodiment, however, the tip of the optical fiber 2b, which is slightly higher than the optical bench 1, can be pressed and fixed to the V-groove.
At least the tip of the optical fiber 2b can be accommodated in the V-groove, and even if the distance in the optical axis direction is slightly increased, deterioration of the optical characteristics can be suppressed to a small value.

Although the present embodiment is shown as a modification of the second embodiment, the concept of the present embodiment can be applied to all the other embodiments. Other assembling methods and effects are the same as in the first embodiment.

(Embodiment 15) Next, Embodiment 15 of the present invention will be described. In the present embodiment, in the optical connector integrated optical module package, the optical fiber 2b provided on the ring-shaped resin molded product 2 is extended in parallel with the mating surface 2j of the upper and lower molds, and the link-shaped resin molded product 2 is formed.
The thickness between the bonding surface on the substrate 8 side and the mating surface 2j of the upper and lower molds in the ring portion is set to be closer to the non-optical connector side than the optical connector side (the side opposite to the optical connector side and away from the optical connector section 2a) It is characterized by having been thinned.

FIG. 18 is a sectional view of the optical module package according to the present embodiment, and FIG. 19 is a perspective view of the ring-shaped resin molded product 2 according to the present embodiment.

As shown in FIG. 19, an inclined surface is provided on the bottom surface (the surface located on the side of the substrate 8 after assembling) of the link-shaped resin molded product 2 so that the ring portion has a tapered shape and an inclined surface 2i is provided. The inclined surface is inclined in a direction approaching the mating surface 2j of the upper and lower molds as the distance from the optical connector portion 2a increases,
As a result, the thickness of the ring portion remote from the optical connector portion 2a is smaller than the thickness of the ring portion close to the optical connector portion 2a.

When the link-shaped resin molded product 2 having the above structure is adhered on the substrate 8, as shown in FIG.
b extends obliquely downward from the optical connector portion 2a toward the V groove of the optical bench 1 according to the degree of inclination of the inclined surface, and is connected to the optical bench 1.

By changing the shape of the injection mold, it is possible to obtain the shape of the ring-shaped resin molded product 2 as in the present embodiment, so that it is not necessary to add a special step. In addition, although shown here as a modification of the second embodiment, the idea of the present embodiment can be applied to all other embodiments.

In the optical module according to the first to thirteenth embodiments, the alignment between the optical fiber 2b of the ring-shaped resin molded product 2 and the V-groove of the optical bench 1 is determined by the adhesion accuracy of the ring-shaped resin molded product 2. Is done. In a state where the optical fiber 2b located on the optical bench 1 contacts the optical bench 1, the optical fiber 2b is
If the optical fiber 2b is forcibly pressed into the groove, the optical fiber 2b may be damaged.

However, in the present embodiment, the optical fiber 2b provided on the ring-shaped resin molded product 2 is extended in parallel with the mating surface 2j of the upper and lower molds, and the bonding of the link-shaped resin molded product 2 on the substrate 8 side is performed. Since the thickness of the ring portion in the direction from the surface to the mating surface 2j of the upper and lower molds is made thinner on the side of the optical connector than on the side of the optical connector, the tip of the optical fiber 2b is directed downward with respect to the lower surface of the ring-shaped resin molded product 2. Can be tilted.
Therefore, the tip of the optical fiber 2b is connected to the optical bench 1
It is easy to adjust the position so as to fit in the V groove.

In this state, the ring-shaped resin molded product 2 and the substrate 8 are bonded. At this time, the tip of the optical fiber 2b is pressed against the V-groove of the optical bench 1 by the elastic force of the fiber itself.
b is in a bent state. In this state, the tip of the optical fiber 2b may be bonded with a translucent resin.

With the above configuration, the tip of the optical fiber 2b can be easily accommodated in the V-groove of the optical bench 1, and even if the distance in the optical axis direction is slightly increased, deterioration of the optical characteristics is small. Can be suppressed. Other assembling methods and effects are the same as in the first embodiment.

Although the embodiments of the present invention have been described above, the features of each embodiment can be combined as appropriate. In addition, the embodiments disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the appended claims, and includes all modifications within the scope and meaning equivalent to the claims.

[0142]

According to the present invention, since a ring-shaped resin molded product is employed, not only the number of components of the optical module package can be reduced, but also the hermeticity of the package can be ensured. . Thus, the reliability of the optical module package can be improved while reducing the cost.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an optical module package according to Embodiment 1 of the present invention.

FIG. 2 is a side view of the optical module package shown in FIG.

FIG. 3 is a plan view of a ring-shaped resin molded product used for the optical module package shown in FIG.

FIG. 4 is a perspective view of a ring-shaped resin molded product used for the optical module package shown in FIG.

FIG. 5 is a sectional view of a ring-shaped resin molded product used for an optical module package according to Embodiment 3 of the present invention.

FIG. 6 is a sectional view of a ring-shaped resin molded product used for an optical module package according to a fifth embodiment of the present invention.

FIG. 7 is a sectional view of a ring-shaped resin molded product used for an optical module package according to a sixth embodiment of the present invention.

FIG. 8 is a sectional view of a ring-shaped resin molded product used for an optical module package according to an eighth embodiment of the present invention.

FIG. 9 is a sectional view of an optical module package according to Embodiment 9 of the present invention.

FIG. 10 is a sectional view of an optical module package according to Embodiment 10 of the present invention.

FIG. 11 is a perspective view of a ring-shaped resin molded product used for an optical module package according to Embodiment 10 of the present invention.

FIG. 12 is a sectional view of an optical module package according to Embodiment 11 of the present invention.

FIG. 13 is a side view of an optical module package according to Embodiment 11 of the present invention.

FIG. 14 is a perspective view of a ring-shaped resin molded product used for an optical module package according to Embodiment 11 of the present invention.

FIG. 15 is a side view of an optical module package according to Embodiment 12 of the present invention.

FIG. 16 is a side view of an optical module package according to Embodiment 13 of the present invention.

FIG. 17 is a cross-sectional view of the optical module package according to Embodiment 14 of the present invention in the middle of assembling.

FIG. 18 is a sectional view of an optical module package according to Embodiment 15 of the present invention.

FIG. 19 is a perspective view of a ring-shaped resin molded product used for an optical module package according to Embodiment 15 of the present invention.

FIG. 20 is a cross-sectional view of a conventional optical module package.

[Explanation of symbols]

1 optical bench, 2 ring-shaped resin molded product, 2
a Optical connector section, 2a1 ferrule section, 2b optical fiber, 2c ferrule, 2c1 aperture section, 2d lead frame, 2e step section, 2f, 2g boss, 2h
Step, 2i slope, 2j Mold mating surface, 3 LD, 4
Monitor PD, 5 Monitor PD carrier, 6 Gold wire, 7
Submount, 8 substrates, 9 lid, 10 semi-curable adhesive sheet, 11 potting resin, 12 external electrode,
13 package, 14 optical connector parts, 15 adhesive.

Claims (19)

[Claims] 1. An optical bench, an optical component mounted on the optical bench, a substrate on which the optical bench is mounted, an optical fiber extending on the optical bench, and the optical bench on the substrate An optical module, comprising: a ring-shaped resin molded product having an optical connector portion, the ring-shaped resin molded product being provided so as to surround the package, forming a side wall of the package, and a lid for closing an opening of the ring-shaped resin molded product. package. 2. The ring-shaped resin molded product has a ring portion surrounding the optical bench, wherein both the ring portion and the optical connector portion are formed of resin,
The optical module package according to claim 1, wherein the ring unit and the optical connector unit are integrated. 3. A ferrule portion protruding from the ring-shaped resin molded product and through which the optical fiber is inserted, wherein the ferrule portion is made of the same material as the ring-shaped resin molded product, The optical module package according to claim 1, wherein the optical module package is formed integrally with a molded product. 4. A ferrule portion protruding from the ring-shaped resin molded product and through which the optical fiber is inserted, wherein the ferrule portion is made of a separate component from the ring-shaped resin molded product, and the ferrule is formed by insert molding. The optical module package according to claim 1, wherein a portion is integrated with the ring-shaped resin molded product. 5. The optical module package according to claim 3, wherein said ferrule part has a positioning means for positioning said ferrule part in a molding die of said ring-shaped resin molded product. 6. The optical module package according to claim 4, wherein the ring-shaped resin molded product has a lead frame portion. 7. The optical module according to claim 1, wherein the ring-shaped resin molded product is bonded to at least one of the lid and the substrate using a semi-curable adhesive sheet. package. 8. The optical module package according to claim 7, wherein an adhesive portion of the semi-curable adhesive sheet is coated with a thermosetting resin. 9. The ring-shaped resin molded product has a step portion for receiving at least one of the substrate and the lid, and at least one of the substrate and the lid is placed on the step portion. An optical module package according to any one of claims 1 to 8. 10. The optical connector according to claim 2, wherein the thickness of the optical connector portion of the ring-shaped resin molded product is larger than the thickness of the ring portion of the ring-shaped resin molded product. Optical module package. 11. The optical module package according to claim 1, wherein the optical connector is disposed outside the substrate. 12. The optical module package according to claim 11, wherein the optical connector portion is provided with a convex portion for preventing the optical module package from tilting after mounting. 13. The optical module package according to claim 1, wherein the projecting portion extends to a vicinity of a lowermost surface on a mounting side of the optical module package.
3. The optical module package according to 2. 14. The optical bench has a groove for positioning the optical fiber, the height of the groove from the substrate is lower than the height of the optical fiber from the substrate, and the optical fiber The optical module package according to any one of claims 1 to 13, wherein the optical fiber is positioned in the groove by pressing the optical fiber against the groove. 15. In the ring-shaped resin molded product, the thickness of the ring portion on the side away from the optical connector portion is
The optical module package according to any one of claims 2 to 14, wherein the thickness of the ring portion on the side of the optical connector portion is smaller than the thickness of the ring portion on the side of the mounting surface on the substrate. 16. A step of mounting an optical component on an optical bench, a step of mounting the optical bench on a board, a step of forming a ring-shaped resin molded product having an optical connector section, and A step of forming a side wall of a package by installing the ring-shaped resin molded product so as to surround the optical bench; and a step of attaching a lid to the ring-shaped resin molded product so as to cover the optical bench. A method for manufacturing an optical module package, comprising: 17. The ring-shaped resin molded product has a ferrule, and the step of forming the ring-shaped resin molded product includes forming the ring-shaped resin molded product by insert molding and forming the ferrule into the ring-shaped resin molded product. 17. The method for manufacturing an optical module package according to claim 16, comprising a step of fixing the optical module package to a product. 18. The method for manufacturing an optical module package according to claim 17, wherein said insert molding is performed with an optical fiber attached to said ferrule. 19. The method for manufacturing an optical module package according to claim 17, wherein the insert molding is performed in a state where the ferrule is mounted on a lead frame.