JP2002327126A - Composition for optical material, optical material, method for producing the same and liquid crystal display device and light-emitting diode using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composition for optical materials, having high optical transparency, scarcely causing light deterioration and having toughness, an optical material, a method for producing the optical material and a light- emitting diode. SOLUTION: This composition for optical materials consists essentially of (A) an organic compound containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule, (B) a silicon compound containing at least two SiH groups in one molecule, (C) a hydrosilylating catalyst and (D) a thermoplastic resin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical material, and more particularly to a composition for an optical material having high optical transparency and toughness, an optical material, a method for producing the same, and a liquid crystal using the same. The present invention relates to a display device and a light emitting diode.

[0002]

2. Description of the Related Art Materials having a low birefringence, a small photoelastic coefficient and a high optical transparency are used as optical materials for liquid crystal display devices. In the case of a material for a liquid crystal display device or the like, a material used in a manufacturing process needs to have high heat resistance. Conventionally, glass or the like has been used as a material satisfying such requirements.

[0003] Optical materials for liquid crystal display devices and the like are often used in the form of thin films or thin tubes or rods. In accordance with recent market demands, optical materials in the form of thinner films or thinner tubes or rods are used. Use is becoming necessary. However, conventionally used glass has a brittle property in terms of strength, so that the range of use has been limited.

As a tough material, there is a polymer material. For example, in the case of a thermoplastic resin, generally, when an aromatic skeleton is introduced in order to exhibit high heat resistance, the birefringence increases and the photoelastic coefficient increases. Therefore, it is difficult to achieve both high heat resistance and optical performance.

[0005] In the case of thermosetting resins, conventionally known thermosetting resins are generally colored and are not suitable for use in optical materials. Further, they generally have polarity, which is disadvantageous for optical performance. Therefore, for example, in a sealing material application of a light emitting diode, a transparent epoxy resin using an acid anhydride-based curing agent has been widely used as a special thermosetting resin. However, even in such a transparent epoxy resin, the moisture resistance is low due to the high water absorption of the resin, or the light resistance is low due to low light transmittance particularly to low wavelength light, or the resin is colored by light deterioration. Had the disadvantage that

Further, thermosetting resins are generally brittle, and there has been a problem that when a thermal shock is applied to a cured product or a product made using the cured product, cracking or peeling occurs.
On the other hand, as a coating material with high light resistance and flexibility,
Silicone resin is used, but it is generally soft and has surface tackiness, so there is a problem that foreign matter may adhere to the light emitting surface during mounting and the light emitting surface may be damaged by mounting equipment. .

[0007]

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a device having high optical transparency, low light degradation, toughness, adhesion of foreign matter to a light emitting surface during mounting, and a mounting device. An object of the present invention is to provide a composition for an optical material, an optical material, a method for producing the same, and a liquid crystal display device and a light emitting diode using the same, which do not cause a problem that the light emitting surface is damaged by the light emitting device.

[0008]

Means for Solving the Problems In order to solve the above problems, the present inventors have made intensive studies and found that an organic compound containing at least two carbon-carbon double bonds having a reactivity with a SiH group in one molecule. A compound and at least two S
The inventors have found that the above problem can be solved by using a silicon compound containing an iH group, a hydrosilylation catalyst, and a thermoplastic resin as an essential component in a composition for an optical material,
The present invention has been reached.

That is, the present invention relates to (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group per molecule, and (B) at least two SiH groups per molecule. A composition for an optical material (claim 1), comprising a silicon compound having a group, (C) a hydrosilylation catalyst, and (D) a thermoplastic resin as essential components; Is an organic compound containing at least one vinyl group reactive with a SiH group in one molecule, the composition for an optical material according to claim 1 (claim 2), wherein (A) 2. The composition for an optical material according to claim 1, wherein the component is an organic compound containing at least one allyl group reactive with a SiH group in one molecule. (A) Component is 1,2-poly Tajien, vinylcyclohexene,
The composition for an optical material according to claim 1, which is cyclopentadiene, dicyclopentadiene, divinyl biphenyl, or bisphenol A diallyl ether (claim 4), wherein the component (A) is triallyl isocyanurate. Or the composition for an optical material according to claim 1, wherein the thermoplastic resin is an acrylic resin, a polycarbonate resin, a cycloolefin resin, or an olefin. The composition for an optical material according to any one of claims 1 to 5, wherein the composition is one or more resins selected from the group consisting of a maleimide-based resin and a polyester-based resin (Claim 6). The glass transition temperature of the thermoplastic resin is 50 ° C. or less. The composition for an optical material according to any one of claims 1 to 7, wherein the composition is a film for a liquid crystal. The optical material is the composition for an optical material according to any one of claims 1 to 7, wherein the optical material is a plastic cell for a liquid crystal (claim 9), and the optical material is a sealing of a light emitting diode. The composition for an optical material according to any one of claims 1 to 7, which is a material (claim 10).
Wherein the composition for an optical material according to any one of claims 1 to 10 is mixed in advance, and a carbon-carbon double bond and a part of the SiH group reactive with the SiH group in the composition or An optical material (Claim 11) hardened by reacting all of them, wherein the composition for an optical material according to any one of Claims 1 to 10 is preliminarily mixed to form an SiH group in the composition. The method for producing the optical material according to claim 11, wherein a part or all of a reactive carbon-carbon double bond and a SiH group are reacted (claim 12). A liquid crystal display device using a material (claim 13), and a light emitting diode using the optical material according to claim 11 (claim 14).

(A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in one molecule; and (B) a silicon compound containing at least two SiH groups in one molecule. , (C) a hydrosilylation catalyst, and (D) a thermoplastic resin, a light-emitting element coated with a curable composition containing the essential components (claim 15). The light emitting diode according to claim 15, wherein the organic compound contains at least one vinyl group reactive with a SiH group in one molecule (claim 16).
16. The light emitting diode according to claim 15, wherein the light emitting diode is an organic compound containing at least one allyl group reactive with a SiH group in one molecule.
The light-emitting diode according to claim 15, wherein the component (A) is 1,2-polybutadiene, vinylcyclohexene, cyclopentadiene, dicyclopentadiene, divinylbiphenyl, or bisphenol A diallyl ether. Yes, the component (A)
The light-emitting diode according to claim 15, which is triallyl isocyanurate or trivinylcyclohexane, wherein the thermoplastic resin is an acrylic resin, a polycarbonate resin, a cycloolefin resin, 20. The light-emitting diode according to claim 15, wherein the light-emitting diode is one or more resins selected from the group consisting of an olefin-maleimide resin and a polyester resin.
0), and the glass transition temperature of the thermoplastic resin is 5
The light-emitting diode according to any one of claims 15 to 20, wherein the temperature is 0 ° C or less, wherein the curable composition is mixed in advance before coating the light-emitting element. The carbon-carbon double bond having a reactivity with a SiH group in the composition and a part or all of the SiH group has been reacted with the SiH group in the composition, according to any one of claims 15 to 21, This is a light emitting diode (claim 22).

Further, in the light-emitting diode according to the present invention, the curable composition can emit a part of the light emitted from the light-emitting element to emit another fluorescent light. It is characterized by containing a phosphor. Thereby, a color conversion type light emitting diode that can emit light uniformly with good controllability is obtained.

Further, the light emitting element is a nitride semiconductor in which at least a light emitting layer emits visible light, and the phosphor is at least one selected from the group consisting of Y, Lu, Sc, La, Gd and Sm. A garnet-based phosphor activated with cerium having two elements and at least one element selected from the group consisting of Al, Ga and In provides a white light emitting diode capable of emitting light uniformly. Can be

[0013] The method for producing a light-emitting diode according to claim 25 of the present invention is characterized in that: (A) an organic compound containing at least two carbon-carbon double bonds having reactivity with a SiH group in one molecule; (B) At least two S in one molecule
A method for producing a light-emitting diode in which a light-emitting element is coated using a curable composition containing a silicon compound containing an iH group, (C) a hydrosilylation catalyst, and (D) a thermoplastic resin as essential components, The curable composition is mixed before coating the light emitting device with a carbon-carbon double bond reactive with SiH groups in the composition and S.
It is characterized in that part or all of the iH group has reacted. Thereby, the viscosity of the curable composition can be easily adjusted to a viscosity excellent in workability, and the composition can be manufactured with good mass productivity.

The stencil plate is obtained by adding a phosphor capable of absorbing a part of the light emitted from the light emitting element and emitting another fluorescence to the curable composition and mixing and dispersing the phosphor. When the light emitting element is sealed by printing, it is possible to obtain a light emitting diode having stable light characteristics without dispersing light emitting diodes by arranging phosphors very uniformly in a sealing material of the formed light emitting diode. it can.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.

First, the component (A) in the present invention will be described. The component (A) is not particularly limited as long as it is an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in one molecule. The organic compound does not include a siloxane unit (Si-O-Si) such as a polysiloxane-organic block copolymer or a polysiloxane-organic graft copolymer, and contains only C, H, N, O, S, and halogen as constituent elements. It is preferable that it contains. In the case of those containing a siloxane unit, there are problems of gas permeability and repellency.

The bonding position of the carbon-carbon double bond reactive with the SiH group is not particularly limited, and may be anywhere in the molecule.

The organic compound (A) can be classified into an organic polymer compound and an organic monomer compound.

Examples of the organic polymer type compound include polyether type, polyester type, polyarylate type, polycarbonate type, saturated hydrocarbon type, unsaturated hydrocarbon type, and the like.
Polyacrylate, polyamide, phenol-formaldehyde (phenol resin), and polyimide compounds can be used.

Examples of the organic monomer compound include, for example,
Examples include aromatic hydrocarbons such as phenols, bisphenols, benzene, and naphthalene; aliphatic hydrocarbons such as linear and alicyclic; heterocyclic compounds and mixtures thereof.

The carbon-carbon double bond reactive with the SiH group of the component (A) is not particularly limited, but may be represented by the following general formula (I):

[0022]

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A group represented by the formula (wherein R ¹ represents a hydrogen atom or a methyl group) is preferred from the viewpoint of reactivity. Also, from the availability of raw materials,

[0024]

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The group represented by is particularly preferred.

The carbon-carbon double bond reactive with the SiH group of the component (A) is represented by the following general formula (II):

[0027]

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An alicyclic group represented by the formula (wherein R ¹ represents a hydrogen atom or a methyl group) is preferred from the viewpoint that the cured product has high heat resistance. Also, from the availability of raw materials,

[0029]

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The alicyclic group represented by the formula is particularly preferred.

The carbon-carbon double bond reactive with the SiH group may be directly bonded to the skeleton portion of the component (A), or may be covalently bonded via a divalent or higher valent substituent. The divalent or higher substituent is not particularly limited as long as it is a substituent having 0 to 10 carbon atoms.
Those containing only N, O, S, and halogen are preferable. Examples of these substituents include

[0032]

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[0033]

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And the like. Two or more of these divalent or more substituents are connected by a covalent bond to form one
It may constitute a substituent having a valence of at least.

Examples of the group covalently bonded to the above skeleton include vinyl, allyl, methallyl, acryl, methacryl, 2-hydroxy-3- (allyloxy) propyl, and 2-allylphenyl Group, 3-allylphenyl group, 4-allylphenyl group, 2- (allyloxy) phenyl group, 3- (allyloxy) phenyl group,
-(Allyloxy) phenyl group, 2- (allyloxy)
Ethyl group, 2,2-bis (allyloxymethyl) butyl group, 3-allyloxy-2,2-bis (allyloxymethyl) propyl group,

[0036]

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And the like.

Specific examples of the component (A) include diallyl phthalate, triallyl trimellitate, diethylene glycol bisallyl carbonate, trimethylolpropane diallyl ether, pentaerythritol triallyl ether, 1,1,2,2-tetrayl Allyloxyethane, dialylidenepentaerythrit, triallyl cyanurate, triallyl isocyanurate, 1,2,4-
Trivinylcyclohexane, divinylbenzenes (purity 50 to 100%, preferably 80 to 100%
), Divinylbiphenyl, 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and oligomers thereof, 1,2-polybutadiene (1,2-polybutadiene having a 1,2 ratio of 10 to 100%, preferably , 2
Ratio of 50 to 100%), allyl ether of novolak phenol, allylated polyphenylene oxide,

[0039]

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[0040]

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In addition, there may be mentioned a conventionally known epoxy resin in which a glycidyl group is replaced with an allyl group.

As the component (A), a low-molecular-weight compound, which is difficult to be expressed as a skeleton portion and a carbon-carbon double bond as described above, can also be used. Specific examples of these low molecular weight compounds include aliphatic chain polyene compound systems such as butadiene, isoprene, octadiene, and decadiene; and cyclopentadiene, cyclohexadiene, cyclooctadiene, dicyclopentadiene, tricyclopentadiene, and norbornadiene. Aliphatic cycloolefin compounds, substituted aliphatic cyclic olefin compounds such as vinylcyclopentene, vinylcyclohexene and the like.

From the viewpoint of further improving the heat resistance, the component (A) contains a carbon-carbon double bond reactive with a SiH group in an amount of 0.00 per gram of the component (A).
What is necessary is just to contain 1 mol or more.
Those containing 0.005 mol or more per g are preferable, and those containing 0.008 mol or more are particularly preferable.

The number of carbon-carbon double bonds reactive with the SiH group of the component (A) should be at least two per molecule on average, but if the mechanical strength is desired to be further improved, 2 is required. Preferably, the number is more than three, and more preferably three or more. When the number of carbon-carbon double bonds having reactivity with the SiH group of the component (A) is 1 or less per molecule, the reaction with the component (B) results in only a graft structure and not a crosslinked structure. .

As the component (A), those having fluidity at a temperature of 100 ° C. or less are preferable for obtaining uniform mixing with other components and good workability, and may be linear or branched. Although the molecular weight is not particularly limited, 50
Any of ~ 100,000 can be suitably used. When the molecular weight is 100,000 or more, the raw material generally has a high viscosity and is inferior in workability.
The effect of cross-linking due to reaction with the group is hardly exhibited.

The component (A) preferably has a low content of a compound having a phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group from the viewpoint of suppressing coloring, particularly yellowing. Those containing no compound having a derivative of a phenolic hydroxyl group are more preferred. The phenolic hydroxyl group in the present invention refers to a hydroxyl group directly bonded to an aromatic hydrocarbon nucleus exemplified by a benzene ring, a naphthalene ring, an anthracene ring, and the like, and a phenolic hydroxyl group derivative is a hydrogen atom of the phenolic hydroxyl group described above. A group substituted by an alkyl group such as a methyl group and an ethyl group, an alkenyl group such as a vinyl group and an allyl group, and an acyl group such as an acetoxy group.

From the viewpoint of good optical properties and good weather resistance such as low birefringence and low photoelastic coefficient, the weight ratio of the aromatic ring to the component (A) is preferably It is preferably 50% by weight or less, more preferably 40% by weight or less, even more preferably 30% by weight or less. Most preferred are those that do not contain an aromatic hydrocarbon ring.

From the coloring properties and optical properties of the obtained cured product, as the component (A), vinylcyclohexene, dicyclopentadiene, triallyl isocyanurate, 2,2
-Diallyl ether of -bis (4-hydroxycyclohexyl) propane, 1,2,4-trivinylcyclohexane is preferred, triallyl isocyanurate, 2,2-
The diallyl ether of bis (4-hydroxycyclohexyl) propane, 1,2,4-trivinylcyclohexane, is particularly preferred.

Next, the compound having a SiH group as the component (B) will be described.

The compound having a SiH group that can be used in the present invention is not particularly limited.
/ 15194, compounds having at least two SiH groups in one molecule can be used.

Of these, from the viewpoint of availability, a chain and / or cyclic polyorganosiloxane having at least two SiH groups in one molecule is preferable, and has good compatibility with the component (A). From the viewpoint of, the following general formula (III)

[0052]

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(Wherein R ² represents an organic group having 1 to 6 carbon atoms, and n represents a number of 3 to 10), and a cyclic group having at least two SiH groups in one molecule. Polyorganosiloxanes are preferred. Note that the substituent R ² in the compound represented by the general formula (III) is preferably composed of C, H, and O, and more preferably a hydrocarbon group.

Further, from the viewpoint of having good compatibility with the component (A), one selected from a chain and / or cyclic polyorganosiloxane and an organic compound having a carbon-carbon double bond. Reaction products with more than one compound (hereinafter referred to as component (E)) are also preferred. In this case, in order to further increase the compatibility of the reactant with the component (A), a product obtained by removing unreacted siloxanes and the like from the reactant by devolatilization or the like can be used.

The component (E) is an organic compound containing at least one carbon-carbon double bond reactive with a SiH group in one molecule, and the same compound as described in the component (A) can also be used. . The organic compound of the component (E) may be the same as or different from the organic compound of the component (A). It is also possible to use one or a mixture of two or more. When it is desired to increase the compatibility of the component (B) with the component (A), the component (E) is preferably the same as the component (A).

The chain and / or cyclic polyorganosiloxane to be reacted with the organic compound (E) is preferably 1,3 from the viewpoint of industrial availability and good reactivity when reacted. , 5,7-Tetramethylcyclotetrasiloxane is preferred.

As the component (B), similarly to the component (A),
From the viewpoint of suppressing coloration, particularly yellowing, those having a low content of a compound having a phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group are preferable, and those not containing a compound having a phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group. Is more preferred. The phenolic hydroxyl group in the present invention is a benzene ring, a naphthalene ring,
A hydroxyl group directly bonded to an aromatic hydrocarbon nucleus exemplified by an anthracene ring or the like, and a derivative of a phenolic hydroxyl group means that the hydrogen atom of the phenolic hydroxyl group is an alkyl group such as a methyl group or an ethyl group, a vinyl group, or an allyl group. And a group substituted by an alkenyl group such as a group or an acyl group such as an acetoxy group.

From the viewpoint of good optical characteristics such as low birefringence and low photoelastic coefficient and good weather resistance, the weight ratio of the aromatic ring to the component (B) is preferably It is preferably 50% by weight or less, more preferably 40% by weight or less, even more preferably 30% by weight or less. Most preferred are those that do not contain an aromatic hydrocarbon ring.

The component (B) more preferable from the viewpoint of good optical properties includes a reaction product of 1,3,5,7-tetramethylcyclotetrasiloxane and vinylcyclohexene, 1,3,5,7-tetra Reaction product of methylcyclotetrasiloxane and dicyclopentadiene,
Reaction product of 5,7-tetramethylcyclotetrasiloxane and triallyl isocyanurate, 1,3,5,7-tetramethylcyclotetrasiloxane and 2,2-bis (4-
(Hydroxycyclohexyl) propane diallyl ether reactant; 1,3,5,7-tetramethylcyclotetrasiloxane and 1,2,4-trivinylcyclohexane reactant; particularly preferred component (B) is A reaction product of 1,3,5,7-tetramethylcyclotetrasiloxane and triallyl isocyanurate,
5,7-tetramethylcyclotetrasiloxane and 2,2
A reaction product of diallyl ether of -bis (4-hydroxycyclohexyl) propane, and a reaction product of 1,3,5,7-tetramethylcyclotetrasiloxane and 1,2,4-trivinylcyclohexane.

The mixing ratio of the component (A) and the component (B) is not particularly limited as long as the required strength is not lost, but the mixing ratio (Y) of the number (Y) of SiH groups in the component (B) is not limited. )) The ratio of the number of carbon-carbon double bonds (X) in the component is
2.0 ≧ Y / X ≧ 0.9, preferably 1.8
≧ Y / X ≧ 1.0 is more preferable. When 2.0 <Y / X, sufficient curability may not be obtained, and sufficient strength may not be obtained. When Y / X <0.9, the carbon-carbon double bond becomes excessive and It can cause coloring.

Next, the hydrosilylation catalyst as the component (C) will be described.

As the hydrosilylation catalyst, hydrosilyl
The catalyst is not particularly limited as long as it has catalytic activity for the oxidation reaction.
For example, simple platinum, alumina, silica, carbon black
Solid platinum supported on a carrier such as chloroplatinic acid, salt
Complex of chloroplatinic acid with alcohol, aldehyde, ketone, etc.
, A platinum-olefin complex (for example, Pt (CH₂= C
H ₂)₂(PPh₃)₂, Pt (CH₂= CH₂)₂C
l₂), A platinum-vinylsiloxane complex (for example, Pt
(ViMe₂SiOSiMe₂Vi)_n, Pt [(Me
ViSiO)₄]_m), Platinum-phosphine complexes (eg,
If Pt (PPh₃)₄, Pt (PBu₃)₄),platinum
-Phosphite complex (for example, Pt [P (OPh)₃]
₄, Pt [P (OBu)₃]₄(Where Me is methyl
Group, Bu is butyl group, Vi is vinyl group, Ph is phenyl
Represents a group, and n and m represent integers. ), Dicarbonyldi
Chloroplatinum, Karstedt touch
Medium, also Ashby US Pat.
59601 and 3159662.
Platinum-hydrocarbon complex, as well as Lamorrow
oreaux) in U.S. Pat. No. 3,220,972.
The platinum alcoholate catalyst described in the above. Further
No. 35169 to Modic.
No. 46, a platinum chloride-olefin composite
Bodies are also useful in the present invention.

Examples of catalysts other than platinum compounds include RhCl (PPh) ₃ , RhCl ₃ , and RhAl ₂ O
₃ , RuCl ₃ , IrCl ₃ , FeCl ₃ , AlC
l ₃ , PdCl ₂ .2H ₂ O, NiCl ₂ , TiC
l _4, and the like.

Among these, chloroplatinic acid, a platinum-olefin complex, a platinum-vinylsiloxane complex and the like are preferable from the viewpoint of catalytic activity. These catalysts may be used alone or in combination of two or more.

The amount of the catalyst to be added is not particularly limited. However, in order to have sufficient curability and keep the cost of the curable composition relatively low, 10 ⁻⁸ to 10 mol per mol of SiH group is used.
10 ^- preferably ¹ mole, more preferably in the range of 10
The range is from ^-6 to 10 ^-2 mol.

Further, a co-catalyst is used in combination with the above-mentioned catalyst.
Is possible, for example, triphenylphosphine
1,2-diester such as dimethyl maleate
Compound, 2-hydroxy-2-methyl-1-butyne
Acetylene alcohol-based compounds such as
Amine compounds such as yellow compounds and triethylamine
No. The amount of the cocatalyst added is not particularly limited.
10 moles per mole of medium ^-2-10²Molar range preferred
And more preferably 10^-1In the range of 10 to 10 moles
You.

Further, a curing retarder can be used for the purpose of improving the storage stability of the composition of the present invention or for adjusting the reactivity of the hydrosilylation reaction in the production process. Examples of the curing retarder include a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin compound, and an organic peroxide, and these may be used in combination. As a compound containing an aliphatic unsaturated bond, propargyl alcohols,
Examples include ene-yne compounds, maleic esters and the like. Examples of the organic phosphorus compound include triorganophosphines, diorganophosphines, organophosphones, and triorganophosphites. Examples of the organic sulfur compound include organomercaptans, diorganosulfides, hydrogen sulfide, benzothiazole, benzothiazole disulfide, and the like. Examples of the nitrogen-containing compound include ammonia, primary to tertiary alkylamines, arylamines, urea, hydrazine and the like. Examples of the tin compound include stannous halide dihydrate, stannous carboxylate, and the like.
As the organic peroxide, di-t-butyl peroxide,
Examples thereof include dicumyl peroxide, benzoyl peroxide, t-butyl perbenzoate and the like.

Among these curing retarders, benzothiazole, thiazole, dimethyl maleate, and 3-hydroxy-3-methyl-1-butyne are preferred from the viewpoint of good retardation activity and good raw material availability.

[0069] The addition amount of the curing retarder, with respect to hydrosilylation catalyst 1mol ^used, and is preferably from 10 -1 to 10 ³ mols, more preferably from 1 to 50 mol.

Next, the thermoplastic resin as the component (D) will be described.

Various components (D) can be used. For example, a polymethyl methacrylate resin such as a homopolymer of methyl methacrylate or a random, block or graft polymer of methyl methacrylate and another monomer is used. Acrylic resin represented by polybutyl acrylate resin such as homopolymer of butyl acrylate or random, block or graft polymer of butyl acrylate and another monomer; bisphenol A; Resins such as polycarbonate resins containing, as a monomer structure, 3,3,5-trimethylcyclohexylidenebisphenol (e.g., APEC manufactured by Teijin Limited); norbornene derivatives, vinyl monomers, etc. Or copolymerization resin, the resin was ring-opening metathesis polymerization of norbornene derivatives, or cycloolefin resins such as a hydrogenated product thereof (e.g., manufactured by Mitsui Chemicals, Inc. APEL, Nippon Zeon Co., Ltd. ZEONO
R, ZEONEX, ARTON manufactured by JSR); olefin-maleimide resins such as copolymers of ethylene and maleimide (eg, TI-PAS manufactured by Tosoh); bisphenol A, bis (4- (2-hydroxyethoxy) phenyl) ) Bisphenols such as fluorene and diols such as diethylene glycol and terephthalic acid,
Examples thereof include polyester resins such as polyester obtained by polycondensation of phthalic acids such as isophthalic acid and aliphatic dicarboxylic acids (for example, O-PET manufactured by Kanebo); polyether sulfone resins, polyarylate resins, polyvinyl acetal resins, and the like. However, the present invention is not limited to this. Among these, acrylic resins, polycarbonate resins, cycloolefin resins, olefin-maleimide resins, and polyester resins are preferable from the viewpoint of high transparency.

The glass transition temperature of the thermoplastic resin (D) is not particularly limited, and various ones can be used.
The glass transition temperature is preferably 100 ° C. or lower, more preferably 50 ° C. or lower, and even more preferably 0 ° C. or lower, from the viewpoint that the obtained cured product tends to be tough. Preferred examples of the resin include a polybutyl acrylate resin. On the contrary, from the viewpoint that the heat resistance of the obtained cured product is increased, the glass transition temperature is preferably 100 ° C. or higher, more preferably 120 ° C. or higher, and 150 ° C.
More preferably, the temperature is 170 ° C. or higher. Examples of preferred resins in this case include polyether sulfone resin, APEC manufactured by Teijin Limited,
APEL manufactured by Mitsui Chemicals, ZEONOR manufactured by Zeon Japan,
ZEONEX, JSR ARTON, Kanebo OP
ET, TI-PAS manufactured by Tosoh Corporation, Optrez manufactured by Hitachi Chemical, and the like. The glass transition temperature can be determined as the temperature at which tan δ shows a maximum in viscoelasticity measurement.

The thermoplastic resin as the component (D) may have a carbon-carbon double bond and / or a SiH group reactive with a SiH group in the molecule. In terms of the fact that the obtained cured product tends to be tougher, S
It is preferable to have on average one or more carbon-carbon double bonds and / or SiH groups reactive with the iH group in one molecule.

The thermoplastic resin of the component (D) may have another crosslinkable group. Examples of the crosslinkable group in this case include an epoxy group, an amino group, a radically polymerizable unsaturated group, a carboxyl group, an isocyanate group, a hydroxyl group, and an alkoxysilyl group. From the viewpoint that the heat resistance of the obtained cured product is likely to be increased, it is preferable that the cured product has one or more crosslinkable groups in one molecule on average.

The molecular weight of the thermoplastic resin (D) is not particularly limited, but the number average molecular weight is 10,000 or less in that compatibility with the component (A) and the component (B) is easily improved. Preferably 5000
It is more preferred that: Conversely, from the viewpoint that the obtained cured product tends to be tough, the number average molecular weight is preferably 10,000 or more, and
More preferably, it is the above. Although there is no particular limitation on the molecular weight distribution, the molecular weight distribution is preferably 3 or less, more preferably 2 or less, from the viewpoint that the viscosity of the mixture is reduced and the moldability is easily improved. It is more preferred that:

As the thermoplastic resin (D) as described above, a single resin may be used, or a plurality of resins may be used in combination.

The blending amount of the thermoplastic resin (D) is not particularly limited, but is preferably 5 to 50% by weight, more preferably 5 to 20% by weight of the whole composition. If the amount is small, the obtained cured product tends to be brittle, and if it is large, the heat resistance (elastic modulus at high temperature) tends to be low.

As the thermoplastic resin (D), those having a desired light transmittance of 80% or more are preferable. In this case, the target light differs depending on the application. For example, when the application is a display device such as a liquid crystal display device, the target light is visible light, and when the application is a light emitting diode, light emitted from a light emitting element is used. It is. The light transmittance of the thermoplastic resin is the light transmittance at a thickness equivalent to 1 mm, and can be determined by measuring by a conventionally known method such as a spectrophotometer.

The difference between the refractive index of the thermoplastic resin (D) and the refractive index of the cured product obtained by curing the curable composition comprising the components (A), (B) and (C) is as follows. Is ±
It is preferably 0.05 or less. The refractive index is determined by measuring with an Abbe refractometer.

The thermoplastic resin of the component (D) may be dissolved in the component (A) and / or the component (B) and mixed in a uniform state, or may be pulverized and mixed in a particle state. It may be in a dispersed state by dissolving in a solvent and mixing.
From the viewpoint that the obtained cured product is more likely to be transparent, it is preferable to dissolve the component (A) and / or the component (B) and mix them in a uniform state. Again,
The thermoplastic resin of the component (D) may be directly dissolved in the component (A) and / or the component (B), may be uniformly mixed by using a solvent, or the like, and then may be uniformly removed by removing the solvent. It may be in a dispersed state and / or a mixed state. The thermoplastic resin (D) may be contained uniformly, or may be contained with a gradient in the content.

When the thermoplastic resin (D) is used in a dispersed state, the average particle diameter is preferably not more than the wavelength of the target light. In this case, the target light is as described above. The distribution of the particle system may be, may be monodispersed or may have multiple peak particle sizes,
From the viewpoint that the viscosity of the curable composition is low and the moldability is likely to be good, the coefficient of variation of the particle diameter is preferably 10% or less. The average particle size can be measured by a sub-sieve sizer method based on an air permeation method.

As the thermoplastic resin (D), those having a low content of a compound having a phenolic hydroxyl group and / or a derivative of a phenolic hydroxyl group are preferable in that light resistance is likely to be high. Those containing no compound having a derivative of a basic hydroxyl group and / or a phenolic hydroxyl group are preferred. The phenolic hydroxyl group in the present invention refers to a hydroxyl group directly bonded to an aromatic hydrocarbon nucleus exemplified by a benzene ring, a naphthalene ring, an anthracene ring, and the like, and a phenolic hydroxyl group derivative is a hydrogen atom of the phenolic hydroxyl group described above. A group substituted by an alkyl group such as a methyl group and an ethyl group, an alkenyl group such as a vinyl group and an allyl group, and an acyl group such as an acetoxy group.

As the thermoplastic resin (D), a resin having a low carbon-carbon double bond content is preferred from the viewpoint that light degradation resistance is likely to be high. Specifically, the content of the carbon-carbon double bond in the component (D) is 0.0
It is preferably 1 mol / g or less, and 0.001 m
ol / g or less is more preferable, and 0.0001
More preferably, it is not more than mol / g.

From the viewpoint of good optical characteristics and good weather resistance, such as low birefringence and low photoelastic coefficient, the weight ratio of the aromatic ring to the component (D) is It is preferably 50% by weight or less, more preferably 40% by weight or less, even more preferably 30% by weight or less. Most preferred are those that do not contain an aromatic hydrocarbon ring.

As the composition of the present invention, various combinations can be used as described above. From the viewpoint of good heat resistance, the cured product obtained by curing the composition has a Tg of 50 ° C. or more. Are preferable, those having a temperature of 100 ° C. or higher are more preferable, and those having a temperature of 150 ° C. or higher are particularly preferable.

The composition of the present invention can be formed into a film or the like as it is, but the composition can be dissolved in an organic solvent to form a varnish. Solvents that can be used are not particularly limited, and if specifically exemplified,
Hydrocarbon solvents such as benzene, toluene, hexane, heptane, tetrahydrofuran, 1,4-dioxane,
Ether solvents such as diethyl ether, acetone, ketone solvents such as methyl ethyl ketone, chloroform,
Halogen solvents such as methylene chloride and 1,2-dichloroethane can be suitably used. The solvent can be used as a mixed solvent of two or more kinds. As the solvent,
Preferred are toluene, tetrahydrofuran and chloroform. The amount of the solvent used is based on 1 g of the component (A) used.
It is preferably used in the range of 0 to 10 mL, and 0.5 to 5 mL.
It is more preferably used in the range of mL, and particularly preferably used in the range of 1-3 mL. If the amount is small, it is difficult to obtain the effect of using a solvent such as a low viscosity,
In addition, when the amount is large, the solvent remains in the material, which tends to cause problems such as thermal cracks. Further, the cost is disadvantageous and the industrial use value is reduced.

The composition of the present invention further comprises an antioxidant, a radical inhibitor, an ultraviolet absorber, an adhesion improver, a flame retardant, a surfactant, a storage stability improver, an ozone deterioration inhibitor, and a light stabilizer. , Thickener, plasticizer, coupling agent, antioxidant, heat stabilizer, conductivity imparting agent, antistatic agent, radiation blocking agent, nucleating agent, phosphorus-based peroxide decomposer, lubricant, pigment, metal-free An activator, a physical property modifier and the like can be added as long as the object and effects of the present invention are not impaired. In addition, as a coupling agent, a silane coupling agent is mentioned, for example. The silane coupling agent is not particularly limited as long as it has at least one functional group reactive with an organic group and at least one hydrolyzable silicon group in the molecule. The group reactive with the organic group is preferably at least one functional group selected from an epoxy group, a methacryl group, an acryl group, an isocyanate group, an isocyanurate group, a vinyl group, and a carbamate group from the viewpoint of handleability. From the viewpoints of properties and adhesiveness, an epoxy group, a methacryl group, and an acrylic group are particularly preferable. As the hydrolyzable silicon group, an alkoxysilyl group is preferable from the viewpoint of handleability, and a methoxysilyl group and an ethoxysilyl group are particularly preferable from the viewpoint of reactivity. Preferred silane coupling agents include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane,
-(3,4-epoxycyclohexyl) ethyltrimethoxysilane, 2- (3,4-epoxycyclohexyl)
Alkoxysilanes having an epoxy functional group such as ethyltriethoxysilane; 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-acryloxypropyltriethoxysilane ,
Examples thereof include alkoxysilanes having a methacryl group or an acryl group such as methacryloxymethyltrimethoxysilane, methacryloxymethyltriethoxysilane, acryloxymethyltrimethoxysilane, and acryloxymethyltriethoxysilane.

The composition of the present invention may optionally contain an inorganic filler. Addition of the inorganic filler is effective in preventing the fluidity of the composition and increasing the strength of the material. As the inorganic filler, fine particles that do not degrade the optical properties are preferable, and include alumina, aluminum hydroxide, fused silica, crystalline silica, ultrafine amorphous silica and hydrophobic ultrafine silica, talc, barium sulfate, and the like. Can be.

As a method for adding a filler, for example, a hydrolyzable silane monomer or oligomer such as alkoxysilane, acyloxysilane, or halogenated silane, or an alkoxide, acyloxide, or halide of a metal such as titanium or aluminum is used. The method of adding to the composition of the invention and reacting in the composition or a partial reactant of the composition to generate an inorganic filler in the composition can also be mentioned.

Further, various thermosetting resins can be added for the purpose of modifying the properties of the composition of the present invention. Examples of the thermosetting resin include, but are not limited to, an epoxy resin, a cyanate resin, a phenol resin, a polyimide resin, and a urethane resin. Among these, a transparent epoxy resin is preferred from the viewpoint of high transparency and excellent practical properties such as adhesiveness.

Examples of the transparent epoxy resin include bisphenol A diglycidyl ether, 2,2′-bis (4
-Glycidyloxycyclohexyl) propane, 3,4
-Epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, vinylcyclohexene dioxide, 2- (3,4-epoxycyclohexyl) -5,5-spiro- (3,4-epoxycyclohexane) -1,3- Epoxy resins such as dioxane, bis (3,4-epoxycyclohexyl) adipate, 1,2-cyclopropanedicarboxylic acid bisglycidyl ester, triglycidyl isocyanurate, monoallyl diglycidyl isocyanurate, diallyl monoglycidyl isocyanurate and the like are treated with hexahydroanhydride. Examples include those cured with an aliphatic acid anhydride such as phthalic acid, methylhexahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, and hydrogenated methylnadic anhydride. These epoxy resins or curing agents may be used alone or in combination.

Further, various additives for improving the characteristics of light emitting diodes may be added to the composition of the present invention. As an additive, for example, a fluorescent substance such as a yttrium aluminum garnet-based fluorescent substance activated with cerium, which absorbs light from a light emitting element and emits longer-wavelength fluorescence,
Coloring agents such as bluing agents that absorb specific wavelengths, silicon oxides such as titanium oxide, aluminum oxide, silica and quartz glass for diffusing light, talc, calcium carbonate, melamine resin, CTU guanamine resin, benzoguanamine resin, etc. And inorganic or organic diffusing materials such as the above, glass, metal oxides such as aluminosilicate, and heat conductive fillers such as metal nitrides such as aluminum nitride and boron nitride.

The additive for improving the characteristics of the light-emitting diode may be contained uniformly or may be contained with a gradient in the content. Such a filler-containing resin portion can be formed as a mold member behind the light emitting surface by flowing the resin containing the filler after flowing the resin for the mold member on the front surface of the light emitting surface into the mold. Also, after forming the mold member, the lead terminals are covered by applying tape from both front and back surfaces, and in this state, the entire lead frame is immersed in the lower half of the light emitting diode mold member in a tank containing a filler-containing resin, and then pulled up. And dried to form a filler-containing resin portion.

The optical material referred to in the present invention generally means a material used for the purpose of transmitting light such as visible light, infrared light, ultraviolet light, X-ray, and laser through the material.

More specifically, a liquid crystal display such as a substrate material in the liquid crystal display field, a light guide plate, a prism sheet, a deflecting plate, a retardation plate, a viewing angle correction film, an adhesive, and a liquid crystal film such as a polarizer protective film. Material around the device. In addition, color PDP (plasma display) encapsulants, anti-reflection films, optical correction films, housing materials, front glass protection films, front glass replacement materials, adhesives expected as next-generation flat panel displays; Light emitting element molding material, light emitting diode sealing material, front glass protection film, front glass substitute material, adhesive used in display devices;
Also, substrate materials for plasma-addressed liquid crystal (PALC) displays, light guide plates, prism sheets, polarizing plates, retardation plates, viewing angle correction films, adhesives, polarizer protective films; and front glass for organic EL (electroluminescence) displays. Protective film, alternative material for front glass, adhesive; various film substrates in field emission display (FED); protective film for front glass, alternative material for front glass, adhesive.

In the field of optical recording, VD (video disc), CD / CD-ROM, CD-R / RW, DVD-
R / DVD-RAM, MO / MD, PD (phase change disk), disk substrate material for optical card, pickup lens, protective film, sealing material, adhesive, etc.

In the field of optical instruments, materials for steel camera lenses, finder prisms, target prisms,
The viewfinder cover and light receiving sensor. Also, it is a shooting lens and a finder of a video camera. Further, it is a projection lens of a projection television, a protective film, a sealing material, an adhesive or the like. Materials for optical sensing devices such as lenses, sealing materials, adhesives, and films.

In the field of optical components, there are fiber materials, lenses, waveguides, sealing materials for elements, adhesives, etc. around optical switches in optical communication systems. Optical fiber materials, ferrules, sealing materials, adhesives, etc. around the optical connector. In the case of an optical passive component or an optical circuit component, it is a lens, a waveguide, a sealing material for a light emitting element, an adhesive or the like. Optoelectronic integrated circuits (OEI
C) Peripheral substrate material, fiber material, element sealing material,
An adhesive or the like.

In the optical fiber field, it is an optical fiber for industrial use such as illumination and light guide for decorative display, display and sign, etc., and for communication infrastructure and for connecting digital equipment in home.

The semiconductor integrated circuit peripheral material is a resist material for microlithography for LSI and super LSI materials.

In the field of automobiles and transportation equipment, lamp reflectors for automobiles, bearing retainers, gears, corrosion-resistant coatings, switches, headlamps, engine parts, electric parts, various interior and exterior parts, drive engines, brake oil tanks, Rustproof steel plates for automobiles, interior panels,
It is an interior material, protection and bundling wire, fuel hose, car lamp, and glass substitute. Further, it is a double glazing for railway vehicles. Also, a toughening agent for aircraft structural materials,
Peripheral components for the engine, wireness for protection and binding, and corrosion-resistant coating.

In the architectural field, there are materials for interior and processing, electric covers, sheets, glass interlayers, glass substitutes, and solar cell peripheral materials. For agriculture, it is a film for house covering.

As next-generation optical / electronic functional organic materials,
Organic EL element peripheral materials, organic photorefractive elements, light-to-light conversion devices such as optical amplifier elements, optical operation elements, substrate materials around organic solar cells, fiber materials, element sealing materials, adhesives, and the like.

The composition for an optical material of the present invention is mixed in advance and cured by reacting a part or all of the SiH group with a carbon-carbon double bond having reactivity with the SiH group in the composition. It can be an optical material.

As a method of mixing the components (A), (B) and (C), various methods can be used.
A method in which the component (C) is mixed with the component (A) and the component (B) are preferably mixed. When the method of mixing the component (C) with the mixture of the component (A) and the component (B), it is difficult to control the reaction. When the method of mixing the component (A) with the component (B) mixed with the component (B) is used, the component (B) has reactivity with environmental moisture in the presence of the component (C). May deteriorate during storage. As the method of mixing the component (D), various methods can be used for compatibility, storage stability, viscosity adjustment, and other purposes. It may be mixed with the component (A), the component (B), or the components (A) and (B) at an appropriate ratio.

In the case where the composition is reacted and cured, the necessary amounts of the components (A), (B), (C) and (D) may be mixed at once and reacted. After mixing and reacting, the remaining amount is mixed and further reacted, or after mixing, only a part of the functional groups in the composition is reacted by controlling the reaction conditions and utilizing the difference in reactivity of the substituents ( (B stage), and then a process such as molding may be performed to further cure. According to these methods, viscosity adjustment at the time of molding becomes easy.

As a method of curing, the reaction can be carried out simply by mixing, or the reaction can be carried out by heating. From the viewpoint that the reaction is fast and a material having high heat resistance is generally easily obtained, a method of performing the reaction by heating is preferable.

The reaction temperature can be variously set. For example, a temperature of 30 to 300 ° C. can be applied, and a temperature of 100 to 250 ° C.
Is more preferable, and 150 to 200C is further preferable.
When the reaction temperature is low, the reaction time for causing a sufficient reaction is prolonged, and when the reaction temperature is high, molding tends to be difficult.

The reaction may be carried out at a constant temperature, but the temperature may be changed in multiple stages or continuously as required. It is preferable to carry out the reaction while increasing the temperature stepwise or continuously, rather than performing the reaction at a constant temperature, since a uniform cured product without distortion is easily obtained.

Although the reaction time can be variously set, it is preferable to carry out the reaction at a relatively low temperature for a long time rather than at a high temperature for a short time because a uniform cured product without distortion is easily obtained.

The pressure during the reaction can also be set variously as required.
The reaction can be performed at normal pressure, high pressure, or reduced pressure. In terms of easy removal of volatiles generated,
The reaction is preferably performed under reduced pressure.

The shape of the optical material obtained by curing can be various depending on the application, and is not particularly limited. For example, the optical material is formed into a shape such as a film, a sheet, a tube, a rod, a coating, and a bulk. be able to.

Various molding methods can be used, including a conventional method of molding a thermosetting resin. For example, a molding method such as a casting method, a pressing method, a casting method, a transfer molding method, a coating method, and a RIM method can be applied. As the molding die, a polishing glass, a hard stainless steel polishing plate, a polycarbonate plate, a polyethylene terephthalate plate, a polymethyl methacrylate plate, or the like can be used. Further, a polyethylene terephthalate film, a polycarbonate film, a polyvinyl chloride film, a polyethylene film, a polytetrafluoroethylene film, a polypropylene film, a polyimide film, or the like can be used to improve the releasability from a mold.

Various processes can be performed as required during molding. For example, a process of defoaming the composition or a partially reacted composition by centrifugation, decompression, or the like to suppress voids generated during molding, a process of once releasing the pressure during pressing, and the like can be applied.

A liquid crystal display device can be manufactured using the optical material of the present invention.

In this case, the optical material of the present invention may be used as a liquid crystal film such as a plastic cell for a liquid crystal, a polarizing plate, a retardation plate, a polarizer protective film, etc., and a liquid crystal display device may be manufactured by a usual method.

A light emitting diode can be manufactured using the optical material of the present invention. In this case, the light emitting diode can be manufactured by coating the light emitting element with the curable composition as described above.

In this case, the light emitting element is not particularly limited, and a light emitting element used for a conventionally known light emitting diode can be used. As such a light emitting element, for example, M
Examples thereof include those formed by laminating a semiconductor material on a substrate provided with a buffer layer such as GaN or AlN as necessary by various methods such as an OCVD method, an HDVPE method, and a liquid phase growth method. Various materials can be used for the substrate in this case, for example, sapphire, spinel,
SiC, Si, ZnO, GaN single crystal and the like can be mentioned.
Of these, sapphire is preferably used from the viewpoint that GaN having good crystallinity can be easily formed and the industrial utility value is high.

The semiconductor material to be laminated is GaAs
s, GaP, GaAlAs, GaAsP, AlGaIn
P, GaN, InN, AlN, InGaN, InGaAs
1N, SiC and the like. Among these, from the viewpoint of obtaining high luminance, a nitride-based compound semiconductor (I
n _x Ga _y Al _z N) are preferred. Such a material may contain an activator or the like.

The structure of the light emitting element includes a MIS junction, p
Examples include an n-junction, a homojunction having a PIN junction, a heterojunction, and a double heterostructure. Also, a single or multiple quantum well structure can be used.

The light emitting element may or may not be provided with a passivation layer.

An electrode can be formed on the light emitting element by a conventionally known method.

The electrode on the light emitting element can be electrically connected to a lead terminal or the like by various methods. As the electric connection member, those having good ohmic mechanical connection with the electrode of the light emitting element and the like are preferable, and examples thereof include a bonding wire using gold, silver, copper, platinum, aluminum, or an alloy thereof. Alternatively, a conductive adhesive or the like in which a conductive filler such as silver or carbon is filled with a resin can be used. Of these, from the viewpoint of good workability, it is preferable to use an aluminum wire or a gold wire.

A light emitting element is obtained as described above.
In the light emitting diode of the present invention, any light emitting element having a vertical luminous intensity of 1 cd or more can be used as the luminous intensity of the light emitting element. Is remarkable, and the effect of the present invention is further remarkable when a light emitting element of 3 cd or more is used.

The light-emitting output of the light-emitting device can be any one without particular limitation. The effect of the present invention is remarkable when a light-emitting device of 1 mW or more at 20 mA is used, and the light emission of 4 mW or more at 20 mA is used. The effect of the present invention is more remarkable when a device is used, and the effect of the present invention is more remarkable when a light emitting device of 5 mW or more at 20 mA is used.

Various light emission wavelengths can be used from the ultraviolet region to the infrared region of the light emitting element. The effect of the present invention is particularly remarkable when the light emitting device has a main light emission peak wavelength of 550 nm or less.

A single type of light emitting element may be used to emit monochromatic light, or a plurality of light emitting elements may be used to emit monochromatic or multicolor light.

As the lead terminals used in the light emitting diode of the present invention, those having good adhesion to an electric connection member such as a bonding wire and electric conductivity are preferable.
The electrical resistance of the lead terminal is preferably 300 μΩ-cm or less, more preferably 3 μΩ-cm or less.
Examples of these lead terminal materials include iron, copper, copper with iron, copper with tin, and those plated with silver, nickel, or the like. The glossiness of these lead terminals may be appropriately adjusted in order to obtain good light spread.

The light-emitting diode of the present invention can be manufactured by coating a light-emitting element with the curable composition as described above. In this case, the coating is not limited to one in which the light-emitting element is directly sealed. And indirect coating. Specifically, the light emitting device may be directly encapsulated with the curable composition of the present invention by various methods conventionally used, or a conventionally used epoxy resin, silicone resin, acrylic resin, urea resin, imide resin, etc. After the light-emitting element is sealed with the sealing resin or glass described above, the light-emitting element may be coated on or around it with the curable composition of the present invention. After the light emitting element is sealed with the curable composition of the present invention, it may be molded with a conventionally used epoxy resin, silicone resin, acrylic resin, urea resin, imide resin, or the like. By the above-described method, various effects such as a lens effect can be provided by a difference in refractive index and specific gravity.

Various methods can be applied as the sealing method. For example, a liquid curable composition may be poured into a cup, a cavity, a package concave portion, or the like having a light emitting element disposed at the bottom by a dispenser or other method and cured by heating or the like, or may be a solid or high-viscosity liquid. The curable composition may be flowed by heating or the like, and may be similarly poured into a package recess or the like and further cured by heating or the like. The package in this case can be made using various materials, and examples thereof include a polycarbonate resin, a polyphenylene sulfide resin, an epoxy resin, an acrylic resin, a silicone resin, and an ABS resin. Alternatively, a method in which a curable composition is previously injected into a mold frame, and a lead frame or the like to which a light emitting element is fixed is immersed therein and then cured, or a method in which a light emitting element is inserted into a mold frame can be applied. A sealing layer made of a curable composition may be molded and cured by injection using a dispenser, transfer molding, injection molding, or the like. further,
The curable composition simply in a liquid or fluid state may be dropped or coated on the light emitting element and cured.
Alternatively, the curable composition can be molded and cured by stencil printing, screen printing, or application via a mask on the light emitting element. Alternatively, a method in which a curable composition partially cured or cured in advance into a plate shape, a lens shape, or the like may be fixed on a light emitting element. Further, the light-emitting element can be used as a die bonding agent for fixing to a lead terminal or a package, or can be used as a passivation film on the light-emitting element. Further, it can be used as a package substrate.

The shape of the covering portion is not particularly limited, and can take various shapes. For example, a lens shape, a plate shape, a thin film shape, a shape described in JP-A-6-244458, and the like can be mentioned. These shapes may be formed by molding and curing the curable composition, or may be formed by post-processing after curing the curable composition.

The light emitting diode of the present invention can be of various types, for example, any type such as a lamp type, an SMD type and a chip type. Various types of SMD type and chip type package substrates are used, for example, epoxy resin, BT resin,
Ceramics and the like can be mentioned.

In addition, various conventionally known methods can be applied to the light emitting diode of the present invention. For example, a method of providing a layer for reflecting or condensing light on the back of the light emitting element, a method of forming a complementary colored portion on the bottom corresponding to yellowing of the sealing resin,
A method in which a thin film that absorbs light having a wavelength shorter than the main emission peak is provided on the light emitting element, a method in which the light emitting element is sealed with a soft or liquid sealing material, and then the surroundings are molded with a hard material, and light from the light emitting element is removed. A method in which a light-emitting element is sealed with a material containing a phosphor that emits longer-wavelength fluorescent light by absorption and then molding is performed around the light-emitting element; a method in which a material containing the phosphor is molded in advance and then molded together with the light-emitting element; As described in −244458, a method of increasing the luminous efficiency by using a molding material in a special shape, a method of forming a two-step recessed package to reduce uneven brightness, a method of inserting and fixing a light emitting diode in a through hole, and light emission A method of forming a thin film on the element surface that absorbs light having a wavelength shorter than the main emission wavelength, and connecting the light emitting element by flip chip connection using solder bumps etc. Method in which light is taken out from the substrate direction by connecting the lead member or the like Te, and the like.

The light emitting diode of the present invention can be used for various known applications. Specifically, for example, a backlight, an illumination, a sensor light source, an instrument light source for a vehicle, a signal light, an indicator light, a display device, a light source of a planar light emitter, a display, a decoration, various lights, and the like can be given.

[0135]

EXAMPLES Examples and comparative examples of the present invention will be shown below, but the present invention is not limited by the following. (Synthesis Example 1) A magnetic stirrer and a cooling tube were set in a 200 mL two-necked flask. Toluene 50
g, 11.3 μL of a xylene solution of platinum vinylsiloxane complex (containing 3 wt% as platinum), 5.0 g of triallyl isocyanurate, 37.04 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and 90 ° C. The mixture was heated and stirred in an oil bath for 30 minutes. Further, the mixture was heated and refluxed for 2 hours in a 130 ° C. oil bath. 1-ethynyl-
176 mg of 1-cyclohexanol was added. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure. ^{By 1} H-NMR, it was found that this was a product in which a part of the SiH groups of 1,3,5,7-tetramethylcyclotetrasiloxane had reacted with triallyl isocyanurate (referred to as partial reactant A). . (Example 1) 2.5 g of triallyl isocyanurate,
3.0 g of the partial reactant A synthesized in Synthesis Example 1 and a molecular weight of 2
500 and 1.1 g of polybutyl acrylate having a glass transition temperature of −30 ° C. were mixed in a cup to obtain a curable composition. As shown in Synthesis Example 1, partial reactant A contains a platinum vinyl siloxane complex as component (C) of the present invention. This was poured into a cell formed by inserting a silicone rubber sheet having a thickness of 0.5 mm between two glass plates as spacers, and then flowing at 100 ° C./90° C. for 16 hours.
Heating was carried out for 1 hour, 120 ° C./1 hour, and 150 ° C./10 hours to obtain a colorless and transparent sheet-like cured product. The obtained cured product was hard and had no surface tack. (Comparative Example) A colorless and transparent sheet-like cured product was obtained in the same manner as in Example except that polybutyl acrylate having a molecular weight of 2500 was not used. The obtained cured product was hard and had no surface tack. (Measurement Example 1) When a bending test was performed using the cured products prepared in Example 1 and Comparative Example by a method according to JIS K6911, the cured product prepared in Comparative Example was broken during the test. The prepared cured product did not break. It can be seen that the cured products of the examples have high toughness. (Measurement Example 2) The cured product prepared in Example 1 was applied to a Suga tester S
Irradiation was performed for 70 hours using an X120 type xenon weather meter (black panel temperature: 63 ° C., irradiation: 18 minutes during rainfall for 2 hours), and the state of the cured product was visually observed. The cured product did not show yellowing and maintained a colorless and transparent state. (Embodiment 2) The sheet-like cured product prepared as in Embodiment 1 is cut into an appropriate shape and fixed to a light transmitting window provided on a metal cap for a can type. On the other hand, M
A light emitting device having a double hetero structure in which an InGaN active layer doped with Si and Zn formed on a sapphire substrate by an OCVD (metal organic chemical vapor deposition) method is sandwiched between n-type and p-type AlGaN cladding layers is prepared. . Subsequently, after mounting this light emitting element on a metal stem for a can type, p
The electrode and the n-electrode are wire-bonded to the respective leads with an Au wire. This is hermetically sealed with the above-mentioned metal cap for can type. In this manner, a can-type light emitting diode can be manufactured. (Example 3) MOCVD on a cleaned sapphire substrate
An n-type GaN layer, which is an undoped nitride semiconductor, a GaN layer, on which an Si-doped n-type electrode is formed to serve as an n-type contact layer, and an n-type GaN, which is an undoped nitride semiconductor, by (metal organic chemical vapor deposition) method. Layer, then a GaN layer serving as a barrier layer constituting the light emitting layer, and InGaN constituting a well layer
Layer, a GaN layer serving as a barrier layer (quantum well structure), and a p-type cladding layer doped with Mg on the light emitting layer, such as AlGa.
N layer, Ga which is a p-type contact layer doped with Mg
N layers are sequentially laminated. The surface of each pn contact layer is exposed on the same side of the nitride semiconductor on the sapphire substrate by etching. Al is deposited on each contact layer by a sputtering method to form positive and negative electrodes. After a scribe line is drawn on the completed semiconductor wafer, the semiconductor wafer is divided by an external force to form light emitting elements.

The light emitting device is die-bonded on the bottom surface of the cup of the mount lead made of iron-containing copper plated with silver on the surface by using an epoxy resin composition as a die-bonding resin. This is heated at 170 ° C. for 75 minutes to cure the epoxy resin composition and fix the light emitting element. Next, the positive and negative electrodes of the light emitting element are wire-bonded to the mount lead and the inner lead with an Au wire to establish electrical continuity.

The curable composition prepared in the same manner as in Example 1 is poured into a casting case which is a shell-shaped mold. A part of the mount lead and the inner lead in which the light emitting element is arranged in the cup is inserted into a casting case, and initial curing is performed at 100 ° C. for 1 hour. The light emitting diode is extracted from the casting case and cured at 120 ° C. for 1 hour in a nitrogen atmosphere. Thereby, a lamp type light emitting diode such as a shell type can be produced. (Example 4) A curable composition and a light emitting device are prepared by the method described in Example 3.

A substrate having lead electrodes is formed by forming a pair of copper foil patterns on a glass epoxy resin by etching. The light emitting element is die-bonded on a glass epoxy resin using an epoxy resin. Each electrode of the light emitting element and each lead electrode are wire-bonded with an Au wire, respectively, to establish electrical continuity. A glass epoxy resin having a through hole as a mask and a side wall is fixedly arranged on the substrate with the epoxy resin. In this state, the curable composition is dispensed on a glass epoxy resin substrate on which a light emitting element is disposed, and the curable composition is filled in a cavity using a through hole. In this state, it is cured at 100 ° C. for 1 hour and further at 150 ° C. for 1 hour. By dividing each light emitting diode chip, a chip type light emitting diode can be produced. (Example 5) A curable composition and a light emitting device are prepared by the method described in Example 3.

A chip type light emitting diode package is formed by insert molding using PPS resin. The inside of the package has an opening in which the light emitting element is arranged, and a silver-plated copper plate is arranged as an external electrode. A light emitting element is fixed inside the package by die bonding using an epoxy resin. An Au wire, which is a conductive wire, is wire-bonded to each electrode of the light-emitting element and each external electrode provided on the package to be electrically connected.
The curable composition is filled in the package opening as a mold member. In this state, at 100 ° C. for 1 hour,
Cure at 0 ° C. for 1 hour. Thus, a chip type light emitting diode can be manufactured. (Example 6) A curable composition and a light emitting device are prepared by the method described in Example 3.

The curable composition is heated to 90 ° C. for 30 minutes to be B-staged.

A substrate having lead electrodes is formed by forming a pair of copper foil patterns on a glass epoxy resin by etching. The light emitting element is die-bonded on a glass epoxy resin using an epoxy resin. Each electrode of the light emitting element and each lead electrode are wire-bonded with an Au wire, respectively, to establish electrical continuity. The light emitting element and a part of the lead electrode are sealed by transfer molding using the curable composition in the B-stage. An SMD type light emitting diode can be manufactured.

(Embodiment 7) A nitride semiconductor is sequentially etched from the p-type nitride semiconductor layer side by an RIE (reactive ion etching) apparatus to form a negative electrode in the same manner as in Embodiment 3. The surface of the n-type contact layer is exposed. Next, Ni / Au is applied to the entire surface of the uppermost p-type contact layer by a lift-off method to a film thickness of 60/2.
The first positive electrode having good ohmic contact and excellent transmissivity is formed by laminating at 00 °. Further, Au is laminated on a part of the translucent first positive electrode to a thickness of 1 μm,
A second positive electrode serving as a positive electrode side bonding portion is formed.

On the other hand, W / Al / W / Au was sputtered on the surface of the n-type contact layer exposed by etching to a film thickness of 200.degree.
000Å / 2000Å / 3000Å
An unnecessary resist film is removed to form a negative electrode, thereby forming an LED element. As a result, a negative electrode having good ohmic contact without performing annealing is formed. Further, although the negative electrode serves as a bonding portion, the above-described configuration has high mechanical strength, and thus an LED element that can be driven stably can be obtained.

Next, the patterning of each electrode is performed by patterning.
Only the exposed portion is exposed to contact the entire surface of the device.
₂An insulating inorganic compound layer made of
D element. The insulating inorganic compound layer is at least short.
What is necessary is just to be formed so as to prevent the
If provided on the upper surface of the semiconductor layer between the pole and the negative electrode
Good. Providing the insulating inorganic compound layer in this manner,
When mounting miniaturized light emitting devices with high reliability,
Always important. The material of the insulating inorganic compound layer is small.
Both may be insulating, for example, SiO 2₂, TiO₂,
Al₂O₃, Si ₃N₄Single layer or multiple layers consisting of
Can be.

In this embodiment, the insulating inorganic compound layer is provided continuously up to the end face of the light emitting element. Thereby, the shaved end surface and the exposed surface of the substrate can be protected from high temperature and high humidity, and a light emitting element capable of maintaining high reliability even when used for a long time under severe environmental conditions can be obtained. Further, the insulating inorganic compound layer provided in direct contact with the sapphire substrate or gallium nitride preferably has a thermal expansion coefficient close to that of the member in contact therewith, whereby reliability can be further improved. Incidentally, the thermal expansion coefficient of each material is 7.5 to 8.5 for the sapphire substrate.
× 10 ⁻⁶ / k, gallium nitride is 3.2 to 5.6 × 10
⁻⁶ / k, silicon dioxide 0.3 to 0.5 × 10 ⁻⁶ /
k, silicon nitride is 2.5 to 3.0 × 10 ⁻⁶ / k.

In the light-emitting element used in this embodiment, most of the light emitted from the light-emitting layer is totally reflected at the interface between the upper and lower layers, and tends to emit light from the light-emitting end with a high light density. When such a light emitting element is directly covered with a resin, light and heat from the light emitting element concentrate on the light emitting element, so that an adjacent resin portion is significantly deteriorated locally. It is considered that this causes a change in color tone and a decrease in reliability of the light emitting diode. Therefore, in this embodiment, a light-emitting element having an insulating inorganic compound layer on the surface is a curable composition of the present invention which has a relatively high adhesiveness to the insulating inorganic compound layer and has excellent light resistance and heat resistance. By directly coating with an object, light emitted from the end of the light emitting region is efficiently extracted to the outside, deterioration at the interface is suppressed, and a highly reliable light emitting device is provided.

The light emitting end means the light emitting layer and the end of the n-type contact layer. Therefore, it is preferable that the insulating inorganic compound layer provided at these ends is made of an inorganic substance having a smaller refractive index than GaN, which is often used as an n-type contact layer. Thereby, deterioration of the curable composition can be suppressed. Further, the insulating inorganic compound is, for example, SiO ₂ as a first layer directly in contact with a light emitting end of a light emitting element, and a _second layer having a higher refractive index than the first layer in contact with the first layer. From a two-layer structure such as TiO ₂ / SiO ₂ or TiO ₂ / MgF ₂ in which TiO ₂ is laminated as a layer of TiO ₂ or a three-layer structure formed by laminating an insulating film and a metal such as SiO ₂ / Al / SiO _2. By providing such an optical multilayer film, it is possible to impart reflectivity.
In the case of a plurality of layers, the film thickness is preferably 5000 to 5 μm, more preferably 1 to 3 μm.

When a light emitting device having an inorganic compound layer on the surface is directly coated with the curable composition of the present invention, the inorganic compound layer preferably contains silicon in consideration of light refraction and thermal expansion. . The inorganic compound layer containing silicon,
There is no particular limitation as long as at least silicon is contained in the inorganic compound. Specifically, SiO ₂ , SiN, Si
ON, and an inorganic compound layer made of SiH ₄ or the like. When an inorganic compound layer containing silicon is provided and the inorganic compound layer is directly coated with the curable composition of the present invention,
Reliability is improved as compared with the case where another inorganic compound layer is provided, and high reliability and optical characteristics tend to be maintained even under environmental conditions such as high temperature and high humidity. The reason for this is not clear, but is thought to be because the inorganic compound layer containing silicon forms an interface with good affinity and high adhesion with the curable composition of the present invention, and the intrusion of moisture and outside air is suppressed. Can be

The wafer having the LED elements formed as described above is ground by a polishing process to a scribable substrate thickness, placed on an adhesive sheet so that the substrate surface is in contact with the adhesive sheet, and formed into a chip by the scribing process. Divided into The divided LED chips are electrically connected and fixedly arranged on the same substrate as in the fourth embodiment by the same method.

In the present invention, various fluorescent substances such as an inorganic fluorescent substance and an organic fluorescent substance can be contained in each constituent member. As an example of such a fluorescent substance, there is a fluorescent substance containing a rare earth element which is an inorganic fluorescent substance. As the rare earth element-containing phosphor, specifically, Y, Lu, Sc, La,
A garnet-type phosphor having at least one element selected from the group consisting of Gd and Sm and at least one element selected from the group consisting of Al, Ga, and In is given. In particular, a yttrium / aluminum oxide-based phosphor activated with cerium is preferable. In addition to Ce, Tb, Cu, Ag, Au, Fe, Cr,
It is also possible to contain Nd, Dy, Ni, Ti, Eu, Pr, and the like. Here, as the particulate phosphor,
A solution obtained by dissolving rare earth elements of Y, Gd, and Ce in an stoichiometric ratio in an acid was coprecipitated with oxalic acid. This is mixed with a coprecipitated oxide obtained by calcination and aluminum oxide to obtain a mixed raw material. This is mixed with aluminum fluoride as a flux, packed in a crucible, and fired at a temperature of 1400 ° C. for 3 hours in a weak reducing atmosphere and a reducing atmosphere to obtain a fired product. The calcined product is ball milled in water, washed, separated, dried, and finally formed through a sieve. Formed (Y
_0.6 Gd _0.4 ) ₃ Al ₅ O ₁₂ : Ce fluorescent substance 25
100 parts by weight of the curable composition obtained by the method described in Example 3 is sufficiently stirred to obtain a mixed solution.

Next, a mask having a through hole is coated on the insulating substrate on which the light emitting elements and the wires are arranged so that the light emitting elements and the like are arranged inside, and the mixed solution is used as an ink for printing. A chip type LED in which a sealing material containing a phosphor is sealed on a substrate on which a light emitting element is arranged by removing the mask after curing by casting a sealing material on a stencil and then removing the mask after curing. Can be formed. It should be noted that bubbles and the like can be very easily defoamed by performing stencil printing under a reduced or increased pressure during these steps. In particular, in the present invention, the curable composition easily adjusted to the desired viscosity by adjusting the content of each component is added to the inorganic phosphor YAG:
Since Ce is contained, air bubbles tend to enter during mixing. Such bubbles are generated by the light-emitting element LED
Since the light from the chip and the fluorescent light from the phosphor are refracted, the color unevenness and the luminance unevenness are easily observed. Therefore, printing under reduced pressure or increased pressure has a particularly great effect. In addition, in order to maintain the dispersion uniformity of the fluorescence resistance, the curable composition of the present invention is measured by a B-type viscometer with 5,
The pressure is preferably adjusted to 000 PS or more and 100,000 PS or less, more preferably adjusted to 9,000 PS or more and 30,000 PS or less, and after such adjustment, a phosphor is preferably added.

The light emitting diode can be configured as a white LED display by arranging a plurality of light emitting elements on the same substrate in a dot matrix.
After being formed in a dot matrix shape, the light emitting diode can be formed individually with good mass productivity. In addition, a segment display or the like can be configured by disposing a light emitting diode at a desired position on a substrate.

The curable composition of the present invention can maintain a relatively high viscosity before molding. Therefore, unlike a liquid having a low viscosity, the phosphor does not freely settle or float in the curable composition. Therefore, the mixed state of the phosphors can be maintained relatively well. In the stencil printing molding, the period during which the curable composition is melted and present as a liquid at the time of molding is several minutes to several tens of seconds, which is extremely short. Further, the time until solidification is extremely short, and hardly any separation between the curable composition and the phosphor occurs.

That is, it is extremely unlikely that the resin and the fluorescent substance are separated from each other before molding and before solidification after molding. Thereby, in the light emitting diode of the present invention, the phosphor can be uniformly dispersed in the curable composition regardless of the specific gravity difference. Therefore, not only the distribution of the phosphors in the light emitting diode can be made uniform, but also the variation in the phosphor content among the production lots is extremely small, so that a light emitting diode with high mass productivity can be formed.

In particular, when a light emitting diode capable of emitting white light containing a YAG: Ce phosphor as a fluorescent substance,
Even with a YAG: Ce phosphor having a higher specific gravity than the translucent resin, an extremely uniform distribution can always be obtained. Therefore, a light emitting diode having a uniform color temperature can be formed stably. In addition,
By curing after removing the mask, the surface of the translucent resin containing the fluorescent substance can be formed into a convex lens shape by surface tension.

Further, the curable composition of the present invention has excellent heat resistance and toughness. In the present invention, since the light emitting element and the wire are covered with such a resin, it is possible to prevent the resin and the light emitting element from being cracked and the wire from being broken due to thermal stress during mounting or lighting. Further, the light emitting element generates heat during lighting, and the vicinity of the light emitting element is in a high temperature state. In the present invention, since the curable composition of the present invention having excellent heat resistance is used as a resin for directly coating a light emitting element, high reliability can be maintained even when used for a long time without deterioration of the resin. . Further, even if the light emitting diode of the present invention is mounted on a conductive member having no Pb and having a high melting point, the chromaticity does not fluctuate and the reliability is not reduced. Can be.

Further, the curable composition of the present invention gives a cured product having flexibility under thermal stress. Conventionally, rubber-like elastic resins, gel resins, and the like are known as resins having flexibility in thermal stress, but these resins have low mechanical strength because they have a low crosslinking density or do not have a crosslinking structure, and Since it has tackiness, it has a problem that foreign substances easily adhere to it, and is not suitable for forming as a light emitting surface that is the outermost surface portion. On the other hand, the curable composition of the present invention does not attach foreign matter and is not likely to be damaged by the mounting device.
As described above, according to the present invention, by using the curable composition of the present invention, a member for covering a light emitting element and a wire portion and a member for a light emitting surface serving as a surface portion of a light emitting device can be integrally formed, and mass productivity and A light emitting diode with excellent workability can be obtained. Further, since it has excellent light resistance to sunlight, the light emitting surface is not discolored even when mounted on an outdoor display substrate, and good reliability can be maintained.

The interface between the curable composition and the phosphor tends to have good adhesion due to chemical bonding or the like. Thus, a color conversion type light-emitting diode capable of uniformly emitting light with high luminance can be obtained with improved light absorption and light extraction efficiency of the phosphor.

[0159]

The material produced from the composition of the present invention has high optical transparency, low photodegradation, toughness, and is suitable for an optical material which is hard and has no surface tackiness. Material.

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02F 1/1335 G02F 1/1335 H01L 33/00 H01L 33/00 N (72) Inventor Manabu Tsumura Settsu, Osaka 5-23 Ichitorikai Nishi 5 chome Hironori Dormitory A 101 (72) Inventor Harumi Sakamoto 1-28-8 Torikai Wado, Settsu-shi, Osaka Sunny Court Room 401 (72) Inventor Masayuki Fujita 5-Chome Torikai Nishi, Settsu-shi, Osaka 5-32-102 (72) Inventor Masafumi Kuramoto 491-1 Kagaminakamachi Oka, Anan City, Tokushima Prefecture Inside Nichika Gaku Kogyo Co., Ltd. F-term (reference) in Gaku Kogyo Co., Ltd. 2H091 FA08X FA08Z FA11Z FA45X FA45Z FB02 LA02 LA04 4J002 BB161 BB211 BG001 CF001 CG001 EA016 EA026 EA036 EU196 GP00 5F041 AA44 DA43

Claims (26)

[Claims] (A) a carbon having a reactivity with a SiH group;
An organic compound containing at least two carbon double bonds in one molecule, (B) a silicon compound containing at least two SiH groups in one molecule, (C) a hydrosilylation catalyst, and (D) a thermoplastic resin , As an essential component. 2. The composition for an optical material according to claim 1, wherein the component (A) is an organic compound containing at least one vinyl group reactive with a SiH group in one molecule. 3. The composition for an optical material according to claim 1, wherein the component (A) is an organic compound containing at least one allyl group reactive with a SiH group in one molecule. 4. The optical material according to claim 1, wherein the component (A) is 1,2-polybutadiene, vinylcyclohexene, cyclopentadiene, dicyclopentadiene, divinylbiphenyl, or bisphenol A diallyl ether. Composition. 5. The composition for an optical material according to claim 1, wherein the component (A) is triallyl isocyanurate or trivinylcyclohexane. 6. The thermoplastic resin is an acrylic resin,
The resin according to any one of claims 1 to 5, wherein the resin is one or more resins selected from the group consisting of a polycarbonate resin, a cycloolefin resin, an olefin-maleimide resin, and a polyester resin. Compositions for optical materials. 7. The glass transition temperature of the thermoplastic resin is as follows:
The composition for an optical material according to any one of claims 1 to 6, wherein the temperature is 50 ° C or lower. 8. The composition for an optical material according to claim 1, wherein the optical material is a liquid crystal film. 9. The composition for an optical material according to claim 1, wherein the optical material is a plastic cell for a liquid crystal. 10. The composition for an optical material according to claim 1, wherein the optical material is a sealing material for a light emitting diode. 11. The optical material composition according to claim 1, which is mixed in advance, and a carbon-carbon double bond having a reactivity with a SiH group in the composition and SiH
An optical material cured by reacting a part or all of the groups. 12. A carbon-carbon double bond having a reactivity with a SiH group in the composition, wherein the composition for an optical material according to any one of claims 1 to 10 is mixed in advance.
12. The method according to claim 11, wherein a part or all of the groups are reacted.
A method for producing an optical material according to item 1. 13. A liquid crystal display device using the optical material according to claim 11. 14. A light-emitting diode using the optical material according to claim 11. 15. An organic compound containing (A) at least two carbon-carbon double bonds reactive with a SiH group in one molecule, and (B) an organic compound containing at least two SiH groups in one molecule. A silicon compound, (C) a hydrosilylation catalyst,
And (D) a light emitting diode coated with a light emitting element using a curable composition containing a thermoplastic resin as an essential component. 16. The light emitting diode according to claim 15, wherein the component (A) is an organic compound containing at least one vinyl group reactive with a SiH group in one molecule. 17. The light emitting diode according to claim 15, wherein the component (A) is an organic compound containing at least one allyl group reactive with a SiH group in one molecule. 18. The light emitting diode according to claim 15, wherein the component (A) is 1,2-polybutadiene, vinylcyclohexene, cyclopentadiene, dicyclopentadiene, divinylbiphenyl, or bisphenol A diallyl ether. 19. The light emitting diode according to claim 15, wherein the component (A) is triallyl isocyanurate or trivinylcyclohexane. 20. The thermoplastic resin is one or a plurality of resins selected from the group consisting of acrylic resins, polycarbonate resins, cycloolefin resins, olefin-maleimide resins, and polyester resins. The light emitting diode according to any one of claims 15 to 19, wherein 21. The light emitting diode according to claim 15, wherein a glass transition temperature of the thermoplastic resin is 50 ° C. or less. 22. The curable composition is mixed in advance before coating the light emitting device, and a part or all of a carbon-carbon double bond and a SiH group reactive with a SiH group in the composition are mixed. 16. A reacting substance.
22. The light emitting diode according to any one of claims 21 to 21. 23. The curable composition according to claim 1, wherein the curable composition contains a phosphor capable of absorbing a part of light emitted from the light emitting element and emitting other fluorescence.
23. The light emitting diode according to any one of 5 to 22. 24. The light-emitting device, wherein at least a light-emitting layer is a nitride semiconductor that emits visible light, and the phosphor is at least one selected from the group consisting of Y, Lu, Sc, La, Gd, and Sm. The light-emitting diode according to claim 23, wherein the garnet-based phosphor is a cerium-based phosphor having two elements and at least one element selected from the group consisting of Al, Ga, and In. 25. (A) an organic compound containing at least two carbon-carbon double bonds reactive with a SiH group in one molecule, and (B) an organic compound containing at least two SiH groups in one molecule. A silicon compound, (C) a hydrosilylation catalyst,
And (D) a method for producing a light-emitting diode in which a light-emitting element is coated using a curable composition containing a thermoplastic resin as an essential component, wherein the curable composition is used before coating the light-emitting element. In the composition previously mixed with
A method for producing a light emitting diode, wherein a carbon-carbon double bond reactive with an iH group and a part or all of a SiH group are reacted. 26. A stencil plate obtained by adding and mixing and dispersing a phosphor capable of absorbing a part of light emitted from the light emitting element and emitting other fluorescence to the curable composition. The method for manufacturing a light emitting diode according to claim 25, wherein the light emitting element is sealed by printing.