JP2002299868A - Heat radiation structure of heating element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation structure of a heating element which improves the cooling efficiency. SOLUTION: The radiation structure for radiating heat generated by a heating element 4 mounted on a radiator 3 to an air flow through the radiator 3 while the air flow contacts a radiating surface of the radiator 3. The heating element 4 and the radiator 3 are disposed in a box 1 having a fan 5 for blowing air out of the box 1, and an air intake 1b and radiating faces 3a, 3a,... of the radiator 3 are exposed in the narrowest portions of air passages extending from the air intake 1b to the fan 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure of a heating element, and more particularly, to a heat dissipation structure of a heating element suitable for electronic equipment.

[0002]

2. Description of the Related Art FIG. 5 shows an example of a heat dissipation structure of a transistor used in a conventional on-vehicle acoustic device or the like. As shown in the figure, the transistor 4 is in close contact with the radiator 3, and the transistor 4 and the radiator 3 are arranged inside the housing 8. In order to prevent the temperature of the air in the housing 8 from becoming high due to the heat radiation of the transistor 4, air inlets 8a, 8a,.
And a fan 5 are provided, and the air inlets 8a, 8a,.
The air taken in is exhausted from the fan 5 to the outside of the housing 8.

[0003]

In the above-described conventional heat dissipation structure of the transistor, the airflow generated by the fan 5 does not concentrate on the surface of the radiator 3 and the speed of the airflow on the surface of the radiator 3 is small, so that the heat radiation is sufficient. There was a disadvantage that it was not performed.

[0004] Further, when used for mounting on a vehicle, as shown in FIG. 6, it may be fastened to an instrument panel or the like by screws 9 via brackets 6, 6.
Depending on the model, there are various shapes of the bracket,
Many air intake ports 8a, 8a,... Are closed by the brackets, and the temperature of the air in the housing 8 becomes high, which may further hinder the heat radiation of the transistors.

The present invention has been made in view of the above points, and an object thereof is to increase the cooling efficiency by intensively contacting a radiator closely contacting a heating element with an airflow from a fan. To provide a heat dissipation structure for the heating element.

Another object of the present invention is to provide a heat-dissipating structure for a heating element for lowering the temperature of air inside a housing by replacing air in the housing with an air suction port and a fan. An object of the present invention is to provide a heat-dissipating structure for a heat-generating element that does not block the mouth.

[0007]

The heat radiating structure of the heat generating element according to the present invention has a structure in which the heat generating element is attached to a heat radiator, and the heat generated in the heat generating element by an air current in contact with the heat radiating surface of the heat radiator is transmitted through the heat radiator. A heat-dissipating structure that dissipates heat to the airflow by disposing the heat-generating element and the radiator inside the housing, and providing a fan that sends air from inside the housing to the outside, and an air suction port provided in the housing; The heat radiation surface of the radiator is exposed at the narrowest part of the air flow path from the fan to the fan.

In the heat radiation structure of the heating element,
The air inlet is formed on a surface which is parallel to a bottom surface or a ceiling surface of the housing and has a different height from these surfaces.

In the heat radiation structure of each of the heat generating elements, a shielding plate for dividing a space inside the housing into an upstream space and a downstream space of an air flow path near the radiator is provided. It is.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a heat dissipation structure of a transistor according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a heat dissipation structure of a transistor according to a first embodiment of the present invention through some members, and FIG. 2A is a side view showing the heat dissipation structure of the transistor through some members. Figure,
FIG. 2B is a plan view showing the heat dissipation structure of the transistor with some members seen through.

The transistor 4 in FIGS. 1 and 2 is in close contact with the radiator 3, and the radiator 3 is arranged inside the housing 1. Step surface 1 that is one step higher than the bottom surface
a is formed on the stepped surface 1a.
Are formed. Then, the grooves 3a, 3a,.
The surface on which is formed is closely contacted with the side surface of the housing 1, and the grooves 3a, 3a
are connected to the air suction port 1b. Case 1
The fan 5 provided in the housing 1 exhausts the air in the housing 1 to the outside.

With this configuration, all the air sucked into the housing 1 passes through the grooves 3a, 3a,... Of the radiator 3, so that the radiator 3 comes into contact with the high-speed airflow and the radiation efficiency of the transistor 4 is increased. In this embodiment, the radiator 3 is a housing 1
, The housing can also be used as a heat dissipation surface, and the heat dissipation efficiency is further improved.

FIG. 3 shows a state in which the housing 1 is mounted on a vehicle via brackets 6,6. As shown in the figure, the stepped surface 1 a provided with the air inlet 1 b is higher than the bottom surface of the housing 1, so that the bracket 6 that contacts the bottom surface of the housing 1 is provided.
, The air inlet 1b is not blocked by the bracket 6.

FIG. 4 is a perspective view showing a heat dissipation structure of a transistor according to a second embodiment of the present invention, with some members seen through. In this example, a casing 1 similar to that of the first embodiment is used, and an air intake port 1b is formed in a step surface 1a of the casing 1. Further, the fan 5 provided in the housing 1 discharges air in the housing. In this example, the radiator 3 to which the transistor 4 is in close contact is arranged such that the surface of the housing 1 on which the grooves 3a, 3a,.

The space inside the housing 1 is divided by a shielding plate 7 except for the inside of the grooves 3a, 3a so that the space provided with the fan 5 and the side provided with the air suction port 1b are divided into two. It is partitioned. Even with such a configuration, all the air sucked into the housing 1 passes through the grooves 3a, 3a,... Of the radiator 3, so that the radiator 3 comes into contact with the high-speed airflow and the heat radiation efficiency of the transistor 4 is increased.

In the embodiment, an example in which the present invention is applied to cooling of a transistor has been described. However, it is of course possible to apply the present invention to cooling of a diode or the like.

[0017]

According to the heat-dissipating structure for a heat-generating element of the present invention, a high-speed airflow is brought into contact with a radiator for cooling the heat-generating element, so that the heat-dissipating efficiency of the heat-generating element can be improved. Further, since the air intake port is not blocked by the bracket or the like, the cooling effect does not decrease.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a heat dissipation structure of a transistor according to a first embodiment of the present invention, with some members seen through.

FIG. 2A is a side view showing a heat dissipation structure of the transistor through some members, and FIG. 2B is a plan view showing a heat dissipation structure of the transistor through some members. is there.

FIG. 3 is a perspective view showing some members for explaining the operation of the heat dissipation structure of the transistor.

FIG. 4 is a perspective view showing a heat dissipation structure of a transistor according to a second embodiment of the present invention, with some members seen through.

FIG. 5 is a perspective view showing an example of a conventional heat dissipation structure of a transistor by seeing through some members.

FIG. 6 is a perspective view for explaining the operation of the heat dissipation structure of the transistor.

[Explanation of symbols]

 Reference Signs List 1 housing, 1a step surface, 1b air inlet 2 panel 3 radiator, 3a groove 4 transistor 5 fan 6 bracket 7 shielding plate 8 housing, 8a air inlet 9 screw

Claims (3)

[Claims] 1. A heat dissipating structure in which a heat generating element is mounted on a radiator and heat generated in the heat generating element is radiated to the air flow through the radiator by an air flow contacting a heat radiating surface of the radiator. Along with disposing the heating element and the radiator, a fan that sends air from the inside of the housing to the outside, and an air suction port is provided in the housing, and the air flow path from the air suction port to the fan is located at the narrowest portion of the air flow path. A heat radiating structure for a heating element, wherein a heat radiating surface of the radiator is exposed. 2. A heat dissipation structure for a heating element according to claim 1, wherein said air inlet is formed on a surface which is parallel to a bottom surface or a ceiling surface of said housing and has a height different from these surfaces. 3. A heat dissipation structure for a heating element according to claim 1, further comprising a shielding plate for dividing a space inside the housing into a space on an upstream side and a space on a downstream side of an air flow path near the radiator. .