JP2002299789A - Circuit substrate designing system and method for manufacturing the circuit substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit substrate, in which manufacturing costs are reduced by improving a test pad, and to provide a layout method for parts in a circuit substrate designing process. SOLUTION: A pattern design part 1 extracts a net list from a blueprint of an electronic circuit, and designs a wire of a circuit substrate and a layout pattern of a through hole, based on the net list. A test pad addition part 2 adds a test pad for sampling and applying electrical signal to the layout pattern to form an additional layout pattern. An inspecting press board design part 4 designs an upper press board, in which a test probe to be erected on the test pad and heat-dissipating parts are disposed; and a lower press board, in which a backup which is brought into contact with a rear face of the circuit substrate opposite to the test pad, heat-dissipating parts, and the like are disposed. A region comparison part 3 determines whether the layout pattern of the circuit substrate is overlapped on the layout pattern of the inspecting press board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board design system for designing a layout of a circuit board layout pattern and an inspection press board used for a jig for inspecting an electronic circuit formed on the circuit board. And a circuit board manufacturing method using the circuit board design system.

[0002]

2. Description of the Related Art In recent years, personal computers, workstations, and the like have been frequently used.
Circuit boards, such as U (Central Processing Unit) boards (also called motherboards), have been manufactured in large quantities. At this time, it is necessary to perform a function test for confirming the operation of the basic function of the circuit board as the press board to be manufactured.

In addition, unlike a normal electronic circuit, a circuit board has a CPU that operates according to a program stored in a memory or a hard disk. Must be operated to perform a function test for each item. Therefore, in the function test of the circuit board, not only the input / output of the signal from each terminal but also the test probe is brought into contact with the test pad added to the layout pattern of the circuit board, thereby sampling the signal in the electronic circuit or sampling the signal. It is necessary to apply the signal (input and output of signals at the test pad).

[0004] Therefore, in the inspection jig, in order to bring the test probe into contact with the test pad, an inspection press board (hereinafter referred to as an upper press board) on which the test probe is to be set up, and the pressure of the portion in contact with the test probe are absorbed. The circuit board is sandwiched (pressed) by an inspection press board (hereinafter referred to as a lower press board) for setting up a backup (a cylindrical or prismatic member having a uniform height) in a region opposite to the test pad of the circuit board. ), Bringing the test probe into contact with the corresponding test pad.

[0005]

However, the upper and lower press boards do not always correspond to all circuit boards, and each time a new personal computer or the like is commercialized, a new circuit board is required. It is necessary to create the one corresponding to. At this time, when an electronic component or the like is mounted on the opposite side of the test pad on the circuit board, a backup may not be provided at an appropriate place (there is no appropriate arrangement area).

At this time, depending on the number of test probes to be set up, backups can be distributed over a certain area, but if the number exceeds a certain value, backups cannot be provided. In the conventional circuit board manufacturing, since the circuit board is already completed, it is necessary to make many upper and lower press boards in order to reduce the number of test probes to be set up.

As a result, when manufacturing a conventional circuit board,
Even if only one test is required if the test pad can be used, a plurality of tests may be required because the test pad cannot be used. In the worst case, since the test pad cannot be used, the inspection becomes impossible, and it is necessary to redesign the circuit board. As described above, there is a problem that the efficiency of the design and the manufacturing process is reduced and the manufacturing cost is increased. The present invention has been made in view of such a background, and provides a method of manufacturing a circuit board in which a layout method of test pads and components is improved in a circuit board design process so as to reduce manufacturing costs. Is to do.

[0008]

SUMMARY OF THE INVENTION A circuit board design system according to the present invention contacts a circuit board having a test pad for sampling a signal of each part of an electronic circuit mounted or applying a signal to each part, and the test pad. In a circuit board design system for designing an inspection press board having a test probe, a layout pattern designing unit that generates a layout pattern of a component arrangement position on the circuit board, and the test probe for testing the layout pattern. A test pad adding section for generating a test pad to be contacted, and an inspection press board design for laying out, on the inspection press board, a position where a test probe to be brought into contact with the test pad is set up corresponding to the test pad on the circuit board. And a layout pattern of the circuit board. And having a over emissions, and a pattern comparison unit which overlaps comparing the position of the inspection pressboard of the test probe. In the circuit board design system of the present invention, the pattern comparison unit determines whether or not there is an arrangement area for contacting a backup absorbing the pressure of the contacting test probe on a surface opposite to the contacting surface of the test probe. It is characterized by. In the circuit board design system according to the present invention, when the pattern comparison unit detects that there is no arrangement area to be brought into contact with a backup, it is determined whether the number of test probes contacting per area exceeds a preset limit number. Is determined. In the circuit board design system of the present invention, when the pattern comparison unit detects that the test probe cannot be arranged at a position corresponding to the test pad in the comparison result, or the arrangement area for contacting a backup is When it is detected that the number of test probes contacting per area exceeds the preset limit, the area where the probe cannot be arranged and the area where there is no backup area are detected as unusable areas. Features. In the circuit board design system according to the present invention, the pattern comparison unit rearranges the layout pattern of the circuit board and the position of the test probe of the inspection press board based on the unusable area. It is characterized by the following.

According to the method of manufacturing a circuit board of the present invention, there is provided a layout pattern designing step of generating a layout pattern at a component arrangement position on a circuit board, and a test pad for bringing the test probe for testing into contact with the layout pattern. A test pad adding step, a test press board designing step of laying out a test probe contacting the test pad with a test pad corresponding to the test pad of the circuit board, and laying out the test press board on the test press board; A pattern comparison step of comparing the overlap between the layout pattern and the position of the test probe of the inspection press board, and a wiring layer forming step of forming a wiring layer corresponding to the layout pattern on the substrate surface of the circuit board, The circuit board corresponding to the layout pattern; An electronic component mounting step of mounting electronic components and output terminals on the board, and a circuit board inspection step of stacking an inspection press board having a test probe and bringing the test probe into contact with a test pad on the board surface to perform a functional test. It is characterized by having. In the method for manufacturing a circuit board according to the present invention, the pattern comparison unit determines whether or not there is an arrangement area where a backup absorbing the pressure of the contacting test probe is brought into contact with a surface opposite to the contacting surface of the test probe. It is characterized by the following. In the method for manufacturing a circuit board according to the present invention, in the pattern comparing step, when it is detected that there is no arrangement area to be brought into contact with the backup, whether the number of test probes in contact per area exceeds a preset limit number It is characterized in that it is determined whether or not it is. In the method for manufacturing a circuit board according to the present invention, in the pattern comparing step, as a comparison result, when it is detected that the test probe cannot be arranged at a position corresponding to the test pad, or when the backup area is contacted, Is detected, and when the number of test probes in contact with the area exceeds the preset limit, the area where the probe cannot be arranged and the area where the backup area cannot be detected are detected as unusable areas. It is characterized by that. In the method for manufacturing a circuit board according to the present invention, in the pattern comparing step, the layout pattern designing unit may relocate the layout pattern of the circuit board and the position of the test probe of the inspection press board based on the unusable area. The method according to any one of claims 6 to 9, wherein the method is performed.

A program for operating the circuit board design system of the present invention includes a circuit board having a test pad for sampling a signal of each part of an electronic circuit mounted or applying a signal to each part, and a test probe for contacting the test pad. A program for operating a circuit board design system for designing an inspection press board having a layout pattern design step of generating a layout pattern of a component arrangement position on the circuit board; and A test pad adding step of generating a test pad for contacting a probe, and corresponding to the test pad of the circuit board,
A test press board design step of laying out the test probe to be brought into contact with the test pad on the test press board, a layout pattern of the circuit board, and an overlap of the test probe position of the test press board. And a pattern comparing step of comparing.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing a configuration of a circuit board design system according to one embodiment of the present invention. In this figure, the pattern design unit 1 has a CAD (Co
mputer Aided Design) extracts a netlist from a design drawing of an electronic circuit, and based on the netlist of the electronic circuit, a circuit board, for example, a circuit board (motherboard).
The layout pattern data (hereinafter, layout pattern) of wirings and through holes is designed in accordance with the positions of the electronic components respectively arranged on both sides.

The test pad adding unit 2 samples a layout pattern generated by the pattern design unit 1 and sets up a test probe for applying an electrical signal, that is, a layout pattern of a test pad to be brought into contact with the layout pattern. An additional layout pattern data (hereinafter referred to as an additional layout pattern) is added based on a design rule that prescribes an arrangement relationship that does not cause a short circuit with the layout pattern of the electronic component, wiring, and through hole.
The inspection press board design unit 4 makes contact with the upper press board on which the test probe and the heat radiating component arranged on the test pad of the circuit board are arranged, and the lower surface (back surface) of the circuit board facing the test pad on which the test probe is set. Design the lower press board on which the backup and heat dissipation components are placed.

The area comparing section 3 overlaps the areas of the electronic components on the upper surface of the circuit board with the test probes and the heat radiation components of the upper press board in the layout pattern on the upper surface of the circuit board and the layout pattern on the upper press board. Is determined. In addition, the area comparison unit 3 determines whether or not the area of the electronic component on the upper surface of the circuit board overlaps with the area of the backup and heat dissipation components of the lower press board in the layout pattern of the lower surface of the circuit board and the layout pattern of the lower press board. Database 5 for judging whether
Stores a layout pattern of a circuit board, an upper press board, and a lower press board for each product such as a CPU board.

Next, an example of the operation of the embodiment will be described with reference to FIGS. 1, 2 and 3. FIG. 2 shows the circuit board 10,
It is a conceptual diagram which shows the positional relationship of each layout pattern of an upper press board and a lower press board. FIG. 3 is a flowchart showing an operation example of the circuit board design system shown in FIG. The manufacturing process of the circuit board 10 according to the present invention can be roughly divided into the following steps of a circuit board designing step, a wiring layer forming step, an electronic component mounting step, a wiring inspection step, and a function inspection step.

That is, in the circuit board design process,
Based on the netlist generated from the circuit diagram of the electronic circuit, a layout pattern of wiring and through holes of the circuit board 10 is generated, and a test pad is added to the layout pattern to generate an additional layout pattern. In the circuit board design process, a test probe, an upper press board on which heat dissipating parts are placed, and a backup,
The layout patterns (upper and lower layout patterns) of the lower press board on which the heat radiating components are arranged are also generated.

In the wiring layer forming step, the CPU mounted on the circuit board is mounted on both sides of the circuit board 10.
A wiring layer for interconnecting a semiconductor element including a memory and the like, a resistor, and a connector is formed. Next, in an electronic component mounting step, electronic components (LSI such as CPU and memory, resistors, capacitors, and the like) and connectors serving as output terminals are mounted on the circuit board 10.

In the wiring inspection step, it is determined whether or not the electronic component and the connector are electrically connected to each other by wiring (whether or not necessary connections are open), and a defect in the wiring. Is detected. Finally, in the function inspection step, a function inspection is performed to determine whether each function of the electronic circuit formed on the circuit board operates according to the specifications. That is, in the function inspection step, a circuit board inspection device (not shown) supplies a control signal to the circuit board 10 and the circuit board 1
The electronic circuit on 0 receives a response signal output in response to the control signal, and the circuit board inspection apparatus compares the response signal with a preset value to determine the quality of the circuit board 10. Thus, a function test of the electronic circuit is performed.

Hereinafter, the circuit board designing process according to the present invention will be described in detail. In step S1, the pattern design unit 1 reads the drawing data of the electronic circuit generated by the CAD from the database 5, and extracts a net list from the drawing data. Then, the pattern design unit 1
Based on the netlist, as shown in FIG. 2, the upper surface 10A and the lower surface 10B of the circuit board 10
A layout pattern 15 of a wiring for electrically connecting these electronic components to each other and a through-hole for arranging the electronic components is generated corresponding to the layout positions 16, 17, and 18 of the electronic components mounted on the electronic component 0.

Next, in step S2, the test pad adding section 2 is connected to, for example, a layout pattern of the upper surface 10A of the circuit board 10, that is, a layout connected to each output of an electronic circuit formed on the circuit board 10. A test pad area 14 is added to the pattern based on the design rule of the circuit board design, and design history information is attached as an additional layout pattern.
To be stored. The test pad is a pattern for contacting a test probe used for sampling an output signal of the electronic circuit or applying an input signal to an input of the electronic circuit.

Next, in step S3, the inspection press board designing unit 4 reads an additional layout pattern of a corresponding product in order to design a layout pattern of the inspection press board (upper press board, lower press board). Then, the inspection press board designing unit 4 determines whether or not the additional layout pattern is the one after the rearrangement. At this time, when the inspection press board designing unit 4 detects from the attached history information that the additional layout pattern is not the one after the rearrangement, the press board designing unit 4 does not determine whether the rearrangement is successful. The process proceeds to step S4.

Next, in step S4, the inspection press board design unit 4 tests the upper press board 11 based on the read additional layout pattern, corresponding to the position of the additional layout pattern arranged on the test pad. An upper layout pattern data (hereinafter referred to as an upper layout pattern) for an area 13 for disposing a probe and an area for disposing other components such as a heat dissipating component (not shown) is formed (laid). In addition, based on the additional layout pattern, the inspection press board design unit 4 associates an area 20 where the backup 19 is disposed on the lower press board 12 with a position corresponding to the position of the additional layout pattern disposed on the test pad. A lower layout pattern data (hereinafter referred to as a lower layout pattern) of a region in which other components such as a heat dissipating component not to be disposed are formed (laid). Then, the inspection press board designing unit 4 stores the upper layout pattern and the lower layout pattern in the database 5 in association with the circuit board of each product, and advances the processing to step S5.

Next, the area comparison unit 3 reads out from the database 5 the additional layout pattern, the upper layout pattern, and the lower layout pattern of the product whose area is to be compared. The area comparison unit 3 includes areas 16 and 17 where electronic components are arranged on the upper surface 10A of the circuit board 10 in the additional layout pattern, an area 13 where the test probe is arranged, and an arrangement of components such as heat dissipating components. It is determined whether or not the areas to be overlapped.

Here, the area comparison section 3 determines the distance between the areas 16 and 17 where the electronic components are arranged on the upper surface 10A, and the areas 13 and the areas where the components such as the heat dissipation components are arranged in the upper layout pattern. It is also determined that they overlap when the value is equal to or less than the first specified value. When the circuit board 10 and the upper press board 11 are overlapped with each other, the first specified value is determined by an error caused by an electronic component on the upper surface 10A of the circuit board 10 and a test probe and a heat radiating component arranged on the upper press board 11. Is defined as the distance at which the parts do not touch.

The area comparison section 3 includes an area 18 where the electronic components are arranged on the lower surface 10B of the circuit board 10 in the additional layout pattern, an area 20 where the backup is arranged in the lower layout pattern, and a heat radiation component. It is determined whether or not the areas where the components are arranged overlap. Here, the area comparison unit 3 includes the lower surface 10
In the case where the distance between the region 18 where the electronic components are arranged in B and the region where the components such as the region 20 and the heat dissipating component are arranged in the lower layout pattern is equal to or less than the predetermined second predetermined value, it is assumed that they overlap. judge.

When the circuit board 10 and the lower press board 12 are overlapped with each other, the electronic component on the upper surface 10A of the circuit board 10 and the backup and heat radiation It is defined as the distance at which parts such as parts do not touch. Then, the region comparison unit 3 advances the processing to Step S6.

Next, in step S6, the area comparison section 3 determines, in the comparison in step S5 described above, the area 1 in which the electronic components to be arranged on the upper surface 10A of the circuit board 10 are to be arranged.
6, 17, a region where test probes are arranged, a region where components such as heat dissipation components are arranged, a region 18 where electronic components are arranged on the lower surface 10B of the circuit board 10, and a lower layout pattern If it is determined that neither the area 20 where the backup is arranged nor the area where the components such as the heat dissipating parts are arranged in the above, the process proceeds to steps S7A and 7B.

Next, in step S7A, based on the upper layout pattern and the lower layout pattern read from the database 5, in the above-described wiring layer forming step, the inspection press board (upper press board 1) is used.
1, lower press board). Similarly, in step S7A, based on the additional layout pattern read from the database 5, the circuit board 10 is created in the above-described wiring layer forming step.

On the other hand, in step S6, the area comparison section 3 determines the area 1 in which the electronic components to be arranged on the upper surface 10A of the circuit board 10 are to be arranged in the comparison in step S5.
6, 17, a region where test probes are arranged, a region where components such as heat dissipation components are arranged, a region 18 where electronic components are arranged on the lower surface 10B of the circuit board 10, and a lower layout pattern In the case where it is determined that any one of the area where the backup is arranged and the area where the component such as the heat radiating part is arranged overlaps, the position data of the area (unusable area) overlapping the additional layout pattern is added. And the process proceeds to step S8.

Next, in step S8, the inspection press board designing unit 4 reads out the additional layout pattern, the upper layout pattern, and the lower layout pattern from the database 5. Then, the inspection press board designing unit 4 performs a first rearrangement process based on the position data of the overlapping area in the additional layout pattern,
In the lower layout, the area 20 where the backup of the corresponding area is located is shifted to the vicinity, and the rearrangement distance shifted at this time is shifted to a position satisfying the second specified value. Next, the inspection press board design unit 4 determines whether or not the number per test probe area set up in the area opposed to the backup 19 exceeds a preset number for each rearrangement distance. I do.

That is, the inspection press board design unit 4
Means that as the repositioning distance moves away from the original area, the distance from the position of the area 14 of the test pad with which the test probe comes into contact decreases, and the opposing force of the backup decreases with respect to the pressure with which the test probe stands and contacts. By doing so, extra stress is applied to the circuit board 10, and therefore, a table of how many test probes can correspond to the contact pressure for each rearrangement distance is internally provided.

At this time, the inspection press board design unit 4
When detecting that the number of test probes in the overlapping area is within the range of the number per unit corresponding to the rearrangement distance, the lower layout pattern in which the area 20 is shifted by the rearrangement distance is stored in the database 5. At the same time, information indicating that the rearrangement has succeeded and that the rearrangement has succeeded is written in the history information of the additional layout pattern stored in the database 5, and the process proceeds to step S3.
Proceed to.

Next, in step S3, the inspection press board designing unit 4 reads an additional layout pattern of a corresponding product in order to design a layout pattern of the inspection press board (upper press board, lower press board). Then, the inspection press board designing unit 4 determines whether or not the additional layout pattern is a rearranged one based on the attached history information.

That is, the inspection press board design unit 4
Detects from the history information whether or not the rearrangement is successful, when it is detected from the attached history information that the additional layout pattern is after the rearrangement. When the press board design unit 4 for inspection determines that the rearrangement is successful from the history information, the process proceeds to step S5 without performing the process of step S4. Thereby, the area comparison unit 3
Determines whether the rearranged area has a new overlap with another area (the processing including this processing is the same as that of steps S5 to S6, step 7A, and step 7B described above). As described).

On the other hand, in step S8, when the inspection press board designing unit 4 detects that the number of test probes in the overlapping area exceeds the range of the number per unit corresponding to the rearrangement distance, the second step is performed. As the relocation, a relocation request is output to the pattern designing unit 1 together with the position data of the relocated area 20. Then, the pattern design unit 1 determines whether or not to shift the test pad area 14 to a position corresponding to the rearranged area 20 according to a design rule in designing the circuit board 10.

Next, the pattern designing unit 1 shifts the regions 16, 17, 18 and 14 to positions corresponding to the rearranged region 20 within the range of the above-mentioned design rules, and newly generates the additional layout. After the pattern is rearranged in the history information, data indicating that the rearrangement is successful is attached to the database 5 and stored in the database 5, and a signal indicating that the rearrangement is successful is sent to the inspection press board designing unit 4. Output to When a signal indicating that the rearrangement is successful is input, the inspection press board designing unit 4 checks the lower layout pattern in which the backup area 20 has been rearranged and the test pad area in the new additional layout pattern. Corresponding to 14, the upper layout pattern in which the area for disposing the test probe is rearranged is stored in the database 5, and the process proceeds to step 3.

Next, in step S3, the inspection press board designing unit 4 reads an additional layout pattern of a corresponding product in order to design a layout pattern of the inspection press board (upper press board, lower press board). Then, the inspection press board designing unit 4 determines whether or not the additional layout pattern is the one after the rearrangement. At this time, if the inspection press board designing unit 4 detects from the attached history information that the additional layout pattern is the one after the rearrangement, it determines from the history information whether or not the rearrangement was successful.

Then, the inspection press board designing unit 4
If it is determined from the history information that the relocation has succeeded, the process proceeds to step S5 without performing the process in step S4.
Accordingly, the area comparison unit 3 determines whether the rearranged area has a new overlap with another area (the processing including this processing is the same as the processing in steps S5 to S6 described above). , Step A7, the same as the description of Step 7B).

On the other hand, in step S8, if the rearrangement is not successful in both the first and second rearrangements, the pattern designing unit 1 stores the additional layout pattern in the history information after the rearrangement. Yes, the rearrangement has failed, the position data of the failed test pad area 14 is added as non-rearrangeable area data, stored in the database 5, and the process proceeds to step S3.

Next, in step S3, the inspection press board designing unit 4 reads out an additional layout pattern of a corresponding product in order to design a layout pattern of the inspection press board (upper press board, lower press board). Then, the inspection press board designing unit 4 determines whether or not the additional layout pattern is a rearranged one based on the attached history information. At this time, if the inspection press board designing unit 4 detects from the attached history information that the additional layout pattern is the one after the rearrangement, it determines from the history information whether or not the rearrangement was successful. If the inspection press board designing unit 4 determines from the history information that the rearrangement is not successful, the test press board design unit 4 detects which of the test pad areas 14 did not succeed in the rearrangement. Extract the area data and notify the worker.

Next, the worker examines alternatives based on the position of the test pad area 14 in the non-relocation area data and the non-relocation conditions. For example, the worker
As the position of the circuit board 10 in the test pad area 14 and the unusable condition, if a connector can be arranged,
A connector is provided on the circuit board 10, and an output signal of the electronic circuit is sampled and a control signal is supplied to the electronic circuit via the connector.

Further, the operator sets the conditions for disabling rearrangement as follows:
If the connector cannot be arranged, a backup is made to an electronic component that can be backed up and is sealed in a package such as an IC or an LSI. Further, when the operator cannot secure the area 14 of the test pad due to the influence of the neighboring test probes as a condition of non-relocation, the operator generates an inspection press board as another jig.

As described above, the circuit board 10, the upper press board 11, and the lower press board 12 are formed based on the additional layout pattern, the upper layout pattern, and the lower layout pattern in the wiring layer forming step. In the electronic component mounting step, electronic components (LSI such as CPU and memory, resistors, capacitors, etc.), connectors serving as output terminals, and the like are mounted and completed. Then, after the wiring inspection process, in the function inspection process, it is determined whether or not each function of the electronic circuit formed on the circuit board operates according to the specification by the jig using the upper press board 11 and the lower press board. 12, a test probe is brought into contact with a test pad, and a signal is transmitted and received to perform a function test of the electronic circuit.

As described above, according to the circuit board design system of one embodiment, the layout patterns of the circuit board 10 and the inspection press board (the upper press board 11 and the lower press board 12) are different from each other. While detecting the overlap of the areas, the feedback is applied so that the test pad and the test probe can be corresponded, and the layout pattern of each of the substrate circuit board 10 and the inspection press board is created. After the board is completed, the test press board is designed, so at the time of making the test press board, it is not possible to secure a backup area to absorb the contact pressure between the test pad and the test probe. Test board for inspection press board used for functional inspection The blanking, it is possible to reduce the number of steps in the creation of a conventional inspection pressboard to correspond to the test pads of the circuit board, it is possible to reduce the man-hour of the circuit board design process.

According to the circuit board design system of one embodiment, in the layout patterns of the circuit board 10 and the inspection press board (the upper press board 11 and the lower press board 12), the areas of the mutual layout pattern overlap. While providing the feedback, give feedback so that the test pad and the test probe can correspond,
Since the layout pattern of each of the circuit board 10 and the test press board is created, a test probe can not be set on the test pad as compared with the conventional case where the circuit board and the test press board are independently designed. Since the test is divided into a plurality of steps as a corresponding measure, the problem of creating a plurality of inspection press boards can be prevented, the number of steps in the board design process can be significantly reduced, and the circuit board 10 and the There is an effect that the press board can be manufactured quickly.

Further, according to the circuit board manufacturing method of one embodiment, in the layout pattern of the circuit board 10 and the inspection press board (the upper press board 11 and the lower press board 12), the overlapping of the mutual layout pattern areas. Detecting and applying feedback so that the test pad and the test probe can correspond, and creating the layout pattern of each board, it is possible to perform functional inspection with a small press board, and in the manufacturing process The processing time of the circuit board design step, the wiring layer forming step, and the function inspection step is shortened, the efficiency of manufacturing the circuit board 10 is greatly increased, and the manufacturing cost of the circuit board 10 can be reduced.

Next, a program executed by the computer according to the embodiment of the present invention will be described. The program executed by the CPU of the computer system in the circuit board design system in FIG. 1 constitutes the program according to the present invention. As a recording medium for storing this program, a magneto-optical disk, an optical disk, a semiconductor memory, a magnetic recording medium, and the like can be used. These are ROM, RAM, CD-ROM, floppy (registered trademark) disk, and memory card. And the like.

The recording medium is a fixed medium such as a volatile memory such as a RAM inside a computer system serving as a server or a client when a program is transmitted through a network such as the Internet or a communication line such as a telephone line. The one that holds the time program is also included. The program may be transmitted from a computer system storing the program in a storage device or the like to another computer system via a transmission medium or by a transmission wave in the transmission medium. The transmission medium refers to a medium having a function of transmitting information, such as a network (communication network) such as the Internet or a communication line (communication line) such as a telephone line.

The above program may be for realizing a part of the functions described above. Furthermore, what can realize the above-described function in combination with a program already recorded in the computer system, that is, a so-called difference file (difference program) may be used. Therefore,
When this program is used in a system or apparatus different from the system or apparatus in FIG. 1 and the computer of the system or apparatus executes this program, the functions and effects equivalent to the functions and effects described in the above embodiment can be obtained. Can be obtained, and the object of the present invention can be achieved.

As described above, one embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration is not limited to this embodiment, and a design change or the like may be made without departing from the gist of the present invention. The present invention is also included in the present invention.

[0050]

According to the circuit board manufacturing method of the present invention, a circuit board (eg, circuit board 10) and a press board for inspection (eg, upper press board 11, lower press board 1) are used.
In the layout pattern of 2), the layout pattern of each board is created by applying feedback so that the test pad can correspond to the test probe while detecting the overlap of the areas of the mutual layout pattern. Function inspection can be performed with a small number of press boards, the processing time of the circuit board design process, wiring layer formation process, and function inspection process in the manufacturing process is shortened, and the circuit board manufacturing efficiency is greatly increased. Manufacturing cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a configuration of a circuit board design system according to an embodiment of the present invention.

FIG. 2 is a conceptual diagram illustrating the relationship between the circuit board 10, the upper press board 11, and the lower press board 12, for explaining the operation of the circuit board design system according to one embodiment of the present invention.

FIG. 3 is a flowchart illustrating an operation example of the circuit board design system of FIG. 1;

[Explanation of symbols]

 Reference Signs List 1 Test pattern design part 2 Test pad addition part 3 Area comparison part 4 Inspection press board design part 5 Database 10 Circuit board 10A Upper surface 10B Lower surface 11 Upper press board 12 Lower press board 13, 14, 16, 17, 18, 20 area 19 Backup

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 1/11 H05K 1/11 Z // G01R 31/02 G01R 31/02 (72) Inventor Masafumi Tamura Niigata 7546 Yasuda, Kashiwazaki, Niigata Niigata Nippon Electric Co., Ltd. F-term (reference) 2G014 AA01 AB59 AC09 5B046 AA08 JA02 5E317 AA02 GG16

Claims (11)

[Claims] 1. A circuit board having a test pad for sampling a signal of each part of an electronic circuit mounted or applying a signal to each part, and a test press board having a test probe for contacting the test pad are designed. In the circuit board design system, a layout pattern designing unit that generates a layout pattern at a position of a component arrangement on the circuit board; and a test pad adding unit that generates a test pad for bringing the test probe for testing into contact with the layout pattern. A test press board design unit for laying out a test probe to be brought into contact with the test pad in correspondence with a test pad of the circuit board, and laying out the test press board; a layout pattern of the circuit board; Test board for inspection press board Circuit board design system and having a pattern comparison unit for comparing the overlap between the position of the over drive. 2. The method according to claim 1, wherein the pattern comparing unit determines whether or not there is an arrangement area for contacting a backup for absorbing the pressure of the contacting test probe on a surface opposite to the contacting surface of the test probe. The circuit board design system according to claim 1. 3. The pattern comparing section, when detecting that there is no arrangement area for contacting a backup, determines whether or not the number of test probes contacting per area exceeds a preset limit number. 3. The circuit board design system according to claim 2, wherein the circuit board design is performed. 4. The pattern comparison section, when the comparison result detects that the test probe cannot be arranged at a corresponding position of the test pad, or when there is no arrangement area for making a backup contact, and When detecting that the number of test probes contacting per hit exceeds a preset limit number, a portion where a probe cannot be arranged and a portion where a backup area cannot be provided are detected as an unusable area. The circuit board design system according to any one of claims 1 to 3. 5. The pattern comparing section, wherein the layout pattern designing section rearranges a layout pattern of a circuit board and a position of a test probe of an inspection press board based on the unusable area. The circuit board design system according to any one of claims 1 to 5. 6. A layout pattern designing step of generating a layout pattern of a component arrangement position on a circuit board; a test pad adding step of generating a test pad for bringing a test probe for testing into contact with the layout pattern; An inspection press board design step of laying out a test probe to be brought into contact with the test pad in correspondence with a test pad of the circuit board, and laying out the inspection press board; and a layout pattern of the circuit board; A pattern comparing step of comparing an overlap with a position of a test probe of a press board; a wiring layer forming step of forming a wiring layer corresponding to the layout pattern on a substrate surface of the circuit board; Electronic components and output terminals on the circuit board A circuit board inspection step of stacking an inspection press board having a test probe, and bringing the test probe into contact with a test pad on a substrate surface to perform a functional test. Substrate manufacturing method. 7. The method according to claim 1, wherein the pattern comparing section determines whether or not there is an arrangement area for contacting a backup absorbing the pressure of the contacting test probe on a surface opposite to the contacting surface of the test probe. A method for manufacturing a circuit board according to claim 6. 8. In the pattern comparing step, when it is detected that there is no arrangement area to be brought into contact with a backup, it is determined whether or not the number of test probes to be contacted per area exceeds a preset limit number. The method according to claim 7, wherein the method is performed. 9. In the pattern comparison step, as a result of comparison, when it is detected that the test probe cannot be arranged at a corresponding position on the test pad, or when there is no arrangement area for making backup contact, and When it is detected that the number of test probes contacting per hit exceeds a preset limit number, a portion where a probe cannot be arranged and a portion where a backup area cannot be provided are detected as an unusable area. The method for manufacturing a circuit board according to any one of claims 6 to 8. 10. In the pattern comparing step, the layout pattern designing unit rearranges a layout pattern of a circuit board and a position of a test probe of an inspection press board based on the unusable area. The method for manufacturing a circuit board according to claim 6. 11. A circuit for designing a circuit board having a test pad for sampling a signal of each part of an electronic circuit mounted or applying a signal to each part, and a test press board having a test probe for contacting the test pad. In a program for operating a board design system, a layout pattern designing step of generating a layout pattern at a position of a component arrangement on the circuit board; and a test pad for generating a test pad for bringing the test probe for testing into contact with the layout pattern. An adding step, a test press board designing step of laying out a position of a test probe to be brought into contact with the test pad corresponding to a test pad of the circuit board on the test press board, and a layout pattern of the circuit board And the said査用 program for operating the circuit board design system and having a pattern comparison step of comparing the overlap between the position of the test probe of pressboard.