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JP2002299773A5 - - Google Patents

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Publication number
JP2002299773A5
JP2002299773A5 JP2001094074A JP2001094074A JP2002299773A5 JP 2002299773 A5 JP2002299773 A5 JP 2002299773A5 JP 2001094074 A JP2001094074 A JP 2001094074A JP 2001094074 A JP2001094074 A JP 2001094074A JP 2002299773 A5 JP2002299773 A5 JP 2002299773A5
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JP
Japan
Prior art keywords
wiring board
flexible wiring
conductor pattern
reinforcing
connection terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001094074A
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Japanese (ja)
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JP2002299773A (en
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Publication date
Application filed filed Critical
Priority to JP2001094074A priority Critical patent/JP2002299773A/en
Priority claimed from JP2001094074A external-priority patent/JP2002299773A/en
Publication of JP2002299773A publication Critical patent/JP2002299773A/en
Publication of JP2002299773A5 publication Critical patent/JP2002299773A5/ja
Pending legal-status Critical Current

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Claims (15)

絶縁基材及び導体パターンを備えたフレキシブル配線基板であって、基板外縁に補強用導体パターンが形成されていることを特徴とするフレキシブル配線基板。A flexible wiring board comprising an insulating base material and a conductor pattern, wherein a reinforcing conductor pattern is formed on an outer edge of the board. 接続端子が形成されてなる接続端子部を有し、前記補強用導体パターンが前記接続端子部の基部側の基板外縁に設けられていることを特徴とする請求項1に記載のフレキシブル配線基板。The flexible wiring board according to claim 1, further comprising a connection terminal portion having a connection terminal formed thereon, wherein the reinforcing conductor pattern is provided on an outer edge of the substrate on a base side of the connection terminal portion. 前記絶縁基材の一部に平面的に重なるように支持基材が固定され、前記補強用導体パターンが前記支持基材の端部に対応する前記絶縁基材の外縁に形成されていることを特徴とする請求項1または請求項2に記載のフレキシブル配線基板。A support base is fixed so as to overlap a part of the insulating base in a plane, and the reinforcing conductor pattern is formed on an outer edge of the insulating base corresponding to an end of the support base. The flexible wiring board according to claim 1, wherein the flexible wiring board is a flexible wiring board. 前記補強用導体パターンは、前記導体パターンに接続されていることを特徴とする請求項1乃至請求項3のいずれか1項に記載のフレキシブル配線基板。4. The flexible wiring board according to claim 1, wherein the reinforcing conductor pattern is connected to the conductor pattern. 5. 前記補強用導体パターンは前記絶縁基材における前記導体パターンの形成面と同じ面上に形成されていることを特徴とする請求項1乃至請求項4のいずれか1項に記載のフレキシブル配線基板。The flexible wiring board according to any one of claims 1 to 4, wherein the reinforcing conductor pattern is formed on the same surface of the insulating base material as the surface on which the conductor pattern is formed. 前記補強用導体パターンは前記導体パターンと同一の階層に形成されていることを特徴とする請求項1乃至請求項4のいずれか1項に記載のフレキシブル配線基板。The flexible wiring board according to any one of claims 1 to 4, wherein the reinforcing conductor pattern is formed on the same level as the conductor pattern. 前記導体パターンが第1方向に延長形成された配線を含み、前記補強用導体パターンは前記第1方向と交差する方向に伸びるように形成されていることを特徴とする請求項1乃至請求項5のいずれか1項に記載のフレキシブル配線基板。6. The conductor pattern includes a wiring extending in a first direction, and the reinforcing conductor pattern is formed to extend in a direction intersecting the first direction. The flexible wiring board according to any one of the above items. 絶縁基材及び導体パターンを備えたフレキシブル配線基板であって、接続端子が形成されてなる接続端子部を有し、前記接続端子部の基部側の基板外縁に補強パターンが形成されていることを特徴とするフレキシブル配線基板。A flexible wiring board provided with an insulating base material and a conductor pattern, having a connection terminal portion on which a connection terminal is formed, wherein a reinforcing pattern is formed on a substrate outer edge on a base side of the connection terminal portion. Characteristic flexible wiring board. 前記補強パターンは、前記絶縁基材の表裏のうち前記接続端子側に形成されていることを特徴とする請求項8に記載のフレキシブル配線基板。The flexible wiring board according to claim 8, wherein the reinforcing pattern is formed on the connection terminal side of the front and back surfaces of the insulating base. 絶縁基材及び導体パターンを備えたフレキシブル配線基板であって、前記絶縁基材の一部に重なるように支持基材が固定され、該支持基材の端部に対応する前記絶縁基材の外縁に補強パターンが形成されていることを特徴とするフレキシブル配線基板。A flexible wiring board comprising an insulating base and a conductive pattern, wherein a supporting base is fixed so as to overlap a part of the insulating base, and an outer edge of the insulating base corresponding to an end of the supporting base. A flexible wiring board, wherein a reinforcing pattern is formed on the flexible wiring board. 前記補強パターンは、前記絶縁基材の表裏のうち前記支持基材側に形成されていることを特徴とする請求項10に記載のフレキシブル配線基板。The flexible wiring board according to claim 10, wherein the reinforcing pattern is formed on the support substrate side of the front and back surfaces of the insulating substrate. 絶縁基材及び導体パターンを備えたフレキシブル配線基板であって、前記導体パターンが第1方向に延長形成された配線を含み、基板外縁に前記第1方向と交差する方向に伸びる補強パターンが形成されていることを特徴とするフレキシブル配線基板。A flexible wiring board provided with an insulating base material and a conductor pattern, wherein the conductor pattern includes a wiring extending in a first direction, and a reinforcing pattern extending in a direction intersecting the first direction is formed on an outer edge of the substrate. A flexible wiring board characterized by the following. 接続端子が形成されてなる接続端子部を有し、前記補強パターンが前記接続端子部の基部側の基板外縁に設けられていることを特徴とする請求項10乃至請求項12のいずれか1項に記載のフレキシブル配線基板。13. The semiconductor device according to claim 10, further comprising a connection terminal portion having a connection terminal formed thereon, wherein the reinforcing pattern is provided on an outer edge of the substrate on a base side of the connection terminal portion. A flexible wiring board according to item 1. 前記絶縁基材の一部に平面的に重なるように支持基材が固定され、前記補強パターンが前記支持基材の端部に対応する前記絶縁基材の外縁に形成されていることを特徴とする請求項12に記載のフレキシブル配線基板。A support base is fixed so as to overlap a part of the insulating base in a plane, and the reinforcing pattern is formed on an outer edge of the insulating base corresponding to an end of the support base. 13. The flexible wiring board according to claim 12, wherein: 少なくとも1枚の基板に沿って電気光学材料が配置されてなる電気光学パネルを備えた電気光学装置であって、前記電気光学パネルに請求項1乃至請求項14のいずれか1項に記載のフレキシブル配線基板が実装されていることを特徴とする電気光学装置。An electro-optical device provided with an electro-optical panel in which an electro-optical material is arranged along at least one substrate, wherein the electro-optical panel has a flexible structure according to any one of claims 1 to 14. An electro-optical device having a wiring board mounted thereon.
JP2001094074A 2001-03-28 2001-03-28 Flexible wiring board and electro-optical device Pending JP2002299773A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001094074A JP2002299773A (en) 2001-03-28 2001-03-28 Flexible wiring board and electro-optical device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001094074A JP2002299773A (en) 2001-03-28 2001-03-28 Flexible wiring board and electro-optical device

Publications (2)

Publication Number Publication Date
JP2002299773A JP2002299773A (en) 2002-10-11
JP2002299773A5 true JP2002299773A5 (en) 2004-11-18

Family

ID=18948324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001094074A Pending JP2002299773A (en) 2001-03-28 2001-03-28 Flexible wiring board and electro-optical device

Country Status (1)

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JP (1) JP2002299773A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4543772B2 (en) 2003-09-19 2010-09-15 セイコーエプソン株式会社 Electro-optical device and electronic apparatus
JP3976019B2 (en) 2004-02-10 2007-09-12 セイコーエプソン株式会社 Mounting structure, electro-optical device, and electronic apparatus
KR20060002209A (en) 2004-07-01 2006-01-09 삼성전자주식회사 Flexible base film bonding method and display device bonded by the method
JP3915928B2 (en) * 2004-11-24 2007-05-16 セイコーエプソン株式会社 Electronic component and manufacturing method thereof
JP2016006829A (en) * 2014-06-20 2016-01-14 株式会社村田製作所 Resin multilayer substrate
US20200066822A1 (en) * 2017-07-28 2020-02-27 Sharp Kabushiki Kaisha Display device, manufacturing method for display device, and manufacturing device for display device
WO2019021466A1 (en) * 2017-07-28 2019-01-31 シャープ株式会社 Display device, display device manufacturing method, and display device manufacturing apparatus
WO2019030891A1 (en) * 2017-08-10 2019-02-14 シャープ株式会社 Flexible display device and method for manufacturing flexible display device
JP6691178B2 (en) * 2018-07-10 2020-04-28 矢崎総業株式会社 Protector and bus bar module
CN113169148A (en) * 2018-12-19 2021-07-23 深圳市柔宇科技股份有限公司 Flexible module and manufacturing method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02137061U (en) * 1989-04-14 1990-11-15
JPH0334266U (en) * 1989-08-11 1991-04-04
JPH07321426A (en) * 1994-05-24 1995-12-08 Casio Comput Co Ltd Film wiring board and electronic device using the same

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