JP2002289753A - Attaching structure to substrate of radiation and shield plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an attaching structure to the substrate of a radiation and shield plate capable of displaying shield effect and radiation effect by one simple shaped shield plate and contriving cost reduction without needing any radiation plate in a simple configuration. SOLUTION: Engaging holes 3, 3 are drilled at a part in the neighborhood of both the sides of a heat generation part 1 on the substrate mounting the heat generation part 1 such as IC, the engaging leg parts 4a, 4a of both the ends of the shield plate 4 having spring property so as to be curved toward the side of the heat generation part 1 are engaged with the engaging holes of a part in the neighborhood of both the sides of the heat generation part 1 on the substrate 2, the engaging leg parts 4a, 4a are locked and fixed in both the engaging holes 3, 3 by the spring property curved to the outside of the engaging leg parts 4a, 4a, the shield plate 4 is brought into contact with the heat generation part 1 by the spring property, and heat generation generated from the heat generation part 1 is radiated through the shield plate 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for attaching a heat-dissipating shield plate to a substrate, the heat-dissipating component such as an IC mounted on the substrate being dissipated using the shield plate.

[0002]

2. Description of the Related Art Conventionally, this type of shield plate is used to shield and radiate heat generated by a heat-generating component mounted on a board. For example, Japanese Patent Application Laid-Open No. 8-116195 discloses a circuit unit. There is a shield structure. This is because, as shown in FIGS.
A shield case lid 103b facing the first surface is provided with a metal spring plate 106, a heat conductive metal plate 109 is connected to the inside of the metal spring plate 106, and the heat conductive metal plate 109 is pressed against the heat generating component 102. It is. However, in this case, in addition to the shield case lid 103b, the heat conductive metal plate 1
However, the use of 09 has a problem that the number of parts is large, the structure is complicated, and the cost is high.

[0003] Japanese Utility Model Application Laid-Open No. 61-27297 describes a heat dissipation structure for a printed circuit board. This is, as shown in FIGS. 4A and 4B, a plurality of electronic components 2.
03 is mounted on the printed circuit board 201, the package section 204 of the electronic component 203 is attached to the printed circuit board 201.
Metal heat sink 20 having contact piece 207 for pressing
6 is provided detachably so as to cover the electronic component 203. However, in this case, the heat of the plurality of electronic components 203 is dissipated by the contact pieces 20 of the conductive metal heat sink 206.
7 can be pressed against a plurality of electronic components 203, but there is a problem that the conductive metal radiating plate 206 has a hole in the contact piece 207, so that shielding of the plurality of electronic components 203 can hardly be performed. Was.

Japanese Utility Model Application Laid-Open No. Sho 63-174498 describes a shield case that also serves as a radiator. As shown in FIGS. 5A, 5B, and 5C, the heat generating component 302 inside the shield case 301 is attached to the shield case 30.
The shield case itself can be used as a radiator plate by contacting a part of the shield case. However, in this case, since a concave portion 301a for covering and making contact with the heat-generating component 302 must be provided in the shield case 301, a processing operation for forming the concave portion 301a to form the shield case 301 is required. There was a problem that the shape of 301 was complicated.

[0005]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned conventional problems, and can achieve a shielding effect and a heat radiation effect with a single shield plate having a simple shape. It is an object of the present invention to provide a structure for attaching a heat-radiating / shield plate to a substrate, which can reduce cost without requiring a plate.

[0006]

Means for Solving the Problems The present invention has been proposed to solve the above-mentioned problems, and the invention according to the first aspect is directed to the heat generation on a substrate on which a heat generation component such as an IC is mounted. Engagement holes are formed at locations near both sides of the component, and engagement legs at both ends of a shield plate having spring properties so as to be curved toward the heat-generating component side are formed at locations near both sides of the heat-generating component on the substrate. The engaging leg is engaged with the engaging hole, and the engaging leg is locked and fixed to the two engaging holes by a spring property that curves outwardly of the engaging leg. It is characterized in that heat generated from the heat-generating component in contact with the component is dissipated through the shield plate.

According to a second aspect of the present invention, both ends of the two engaging legs of the shield plate are engaged with the back side of the substrate when the two engaging holes of the substrate are engaged. It is characterized in that a claw portion is provided. The invention according to claim 3 is characterized in that the shield plate is configured to be in contact with the surface of the heat generating component by its spring property so that the entire surface of the heat generating component is covered by the shield plate.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing an embodiment of a structure for attaching a heat-radiating / shield plate to a substrate according to the present invention. FIG. 1 is a front vertical sectional view showing a mounting structure of a heat-radiating / shield plate to a substrate according to an embodiment of the present invention;
FIG. 2 is a bottom view of the mounting structure of the heat radiation and shield plate to the substrate according to the embodiment.

As shown in FIG. 1 and FIG. 2, the mounting structure of the heat-dissipating shield plate to the substrate according to the present embodiment is provided at a position near both sides of the heat-generating component 1 on the substrate 2 on which the heat-generating component 1 such as an IC is mounted. Engagement holes 3, 3 are formed, and the width of both ends of a shield plate 4 having a substantially M-shaped shape as viewed from the front, having a spring property so as to be curved toward the heat-generating component 1, is reduced at both ends. 4a,
4 a is engaged with the engaging holes 3, 3 in the vicinity of both sides of the heat generating component 1 on the substrate 2. Then, the engaging legs 4a, 4a
The engaging legs 4a, 4a are locked and fixed to both engaging holes 3, 3 by a spring property which curves outward.

With this arrangement, the central portion in the longitudinal direction of the shield plate 4 is brought into contact with the surface of the heat-generating component 1 by its spring property, and the heat generated from the heat-generating component 1 is radiated through the shield plate 4. The heat generating component 1 is shielded. Furthermore, both engaging legs 4a, 4a of the shield plate 4 having a small width.
At both ends of the substrate 2 when the two engaging holes 3 of the substrate 2 are engaged,
Locking claw portions 4b and 4b are provided on the opposite surface side of the substrate 2 so that the shield plate 4 is locked and fixed by the locking claw portions 4b and 4b so as not to come off. Further, the shield plate 4 is made to come into contact with the surface of the heat generating component 1 by its spring property so as to cover the entire surface of the heat generating component 1.

Therefore, according to the mounting structure of the heat-radiating / shield plate to the substrate according to the present embodiment, the shield effect and the heat-radiating effect for the heat-generating component 1 can be exhibited by one shield plate 4 having a simple shape. The structure is simple, and the cost can be reduced without requiring a heat sink. In addition, the two engaging legs 4a, 4a are engaged with the two engaging holes 3, 3 of the substrate 2, and the locking claws 4 at both ends of the two engaging legs 4a, 4a.
Since the b and 4b are locked on the opposite side of the substrate 2, the shield plate 4 can be fixed to the substrate 2 so as not to come off. Also, by releasing the locking of the locking claws 4b, 4b to the substrate 2, the shield plate 4 can be easily removed from the substrate 2.

[0012]

As described above, according to the first aspect of the present invention, engaging holes are formed at positions near both sides of a heat generating component on a board on which a heat generating component such as an IC is mounted, and the heat generating component side is formed. A spring that bends outwardly from the engaging legs at both ends of the shield plate having spring properties so as to be bent toward the engaging holes near both sides of the heat generating component on the substrate. The engaging leg is locked and fixed to both engaging holes, and the shield plate is configured to contact the heat-generating component with its spring property to radiate heat generated from the heat-generating component through the shield plate. Therefore, the following effects are obtained. That is, the shield effect and the heat radiation effect can be exhibited by one shield plate having a simple shape, the structure is simple, and the cost can be reduced without the need for the heat radiation plate.

According to a second aspect of the present invention, when both ends of both engaging legs of the shield plate are engaged in both engaging holes of the substrate,
Since the locking claw portion for locking on the back side of the substrate is provided, the shield plate can be fixed to the substrate so as not to come off. Claim 3
In the invention described in (1), the shield plate is configured to be in contact with the surface of the heat generating component by its spring property so as to cover the entire surface of the heat generating component with the shield plate. The heat generated from the whole can be dissipated by the shield plate, and the entire heat generating component can be shielded.

[Brief description of the drawings]

FIG. 1 is a front vertical sectional view showing a structure for mounting a heat-radiating / shield plate to a substrate according to an embodiment of the present invention.

FIG. 2 is a bottom view of a mounting structure of the heat-radiating / shield plate of the embodiment to a substrate.

FIG. 3 shows a conventional circuit unit shielding device,
(A) is a sectional view, and (b) is a plan view.

4A and 4B show a conventional heat dissipation structure of a printed circuit board, and FIG.
Is an exploded perspective view illustrating the assembly of the printed circuit board,
(B) is a partially enlarged view.

FIG. 5 shows a conventional heatsink-shielding case,
(A) is a perspective view, (b) is a side view, and (c) is a cross-sectional view of a state where a shield case is mounted on a printed circuit board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Heat generation component 2 Board 3 Engagement hole 4 Shield plate 4a Engagement leg 4b Locking claw

Claims (3)

[Claims] 1. A shield plate having a spring property so as to be curved toward the heat-generating component side by forming an engagement hole at a position near both sides of the heat-generating component on a substrate on which a heat-generating component such as an IC is mounted. The engaging legs at both ends are engaged with engaging holes near both sides of the heat-generating component on the substrate, and the engaging legs are spring-curved outwardly of the engaging legs. The shield plate is locked and fixed in a hole, and the shield plate is configured to be in contact with the heat-generating component by its spring property so that heat generated from the heat-generating component is radiated through the shield plate. Mounting structure of shield plate to substrate. 2. At both ends of both engaging legs of the shield plate,
2. The mounting of the heat-dissipating shield plate to the substrate according to claim 1, wherein a locking claw portion is provided for locking the rear surface side of the substrate when the both holes are engaged with the two insertion holes of the substrate. Construction. 3. The heat shield according to claim 1, wherein the shield plate is configured to contact the surface of the heat generating component with its spring property so as to cover the entire surface of the heat generating component with the shield plate. The mounting structure of the heat-radiating / shielding plate described in 1 to the substrate.