JP2002279388A - IC memory card and method of manufacturing the same - Google Patents

Abstract

(57) Abstract: An IC memory card and a method of manufacturing the same that eliminate variations in the bonding strength between a panel member and a main body resin frame, have a more stable and strong bonding force, and can reduce manufacturing costs. I will provide a. SOLUTION: A projection 1 is provided at an end of a front metal panel 10.
6 are provided. The protrusion 16 is formed such that the width of the tip is larger than the width of the root. A groove 17 for inserting the protrusion 16 is formed in the main body resin frame 12. Also, the main body resin frame 1
A printed circuit board is fixed to 2 and is combined with the front and back metal panels 10 and 11 to manufacture an IC memory card 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC memory card formed by connecting a body resin frame and a panel member, and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, the density of IC memory cards has been increasing, and the size of card substrates has been increased in order to increase the area in which components can be mounted. For this reason, IC memory cards manufactured using an ultrasonic welding method that can increase the size of a substrate have come to be used.

For example, a conventional IC as shown in FIG.
In the memory card, an integrally molded product of a front metal panel 100 and a front resin frame 101 (hereinafter, referred to as a front frame 104), and a back metal panel 103 and a back resin frame 10
2 (hereinafter, referred to as a back frame 105). Then, a substrate (not shown) on which an IC such as a memory or an LSI is mounted is fitted between the front frame 104 and the back frame 105, and the resin portion is melted by irradiating ultrasonic waves, so that the front frame 104 and the back frame 105 are fused. Then, the IC memory card is manufactured by welding.

More recently, an IC memory card of a type in which a back metal panel 110 and a main body resin frame 111 as shown in FIG. 17 are integrally formed and a front metal panel 112 is bonded thereto by welding is also manufactured.

In addition, as shown in FIG. 18, a front metal panel 130 and a back metal panel 13 are
There is also an IC memory card of a type in which two are welded from both sides.

Japanese Unexamined Patent Publication No. 9-58164 discloses an IC memory card having an assembly structure shown in FIG. 17 and a method of manufacturing the same, among the above-mentioned conventional IC memory cards.

In the IC memory card of the above publication, as shown in FIG. 19, an end of a metal panel 140 is bent,
Hole 14 for allowing resin to flow into this bent portion 141
2 are formed. The bent portion 141 is fitted into the groove 144 of the main body resin frame 143, and the metal panel 140 and the main body resin frame 143 are joined by ultrasonic welding.
And are combined. In this connection, the resin of the main body resin frame 143 is melted by the ultrasonic vibration, the resin flows into the holes 142 and then hardens, so that the metal panel 140 and the main body resin frame 143 are connected.

With such a configuration, it is possible to improve the bonding strength as compared with an IC memory card in which a hole is not provided in a bent portion, and to use an IC having excellent impact resistance by a simple method.
You can get a memory card.

Further, as shown in FIG. 20, a ground clip 15 formed to increase the area of the ground is provided.
An IC memory card in which 3 is provided on at least one of the front and back metal panels 150 and 152 is also manufactured.

[0010]

However, the conventional IC memory card disclosed in the above publication has the following problems.

That is, when the main body resin frame 143 and the metal panel 140 are welded and joined, most of the joining force is:
Hole 1 provided in bent portion 141 of metal panel 140
Since the amount of resin flowing into the hole 142 is not constant for each bent portion 141, the bonding strength of each bent portion 141, that is, the impact resistance of each IC memory card tends to vary. The bent portion 14 of the metal panel 140 in the main body resin frame 143
When the resin is melted by irradiating ultrasonic waves to the groove 144 into which the groove 1 is inserted, there is a problem that the melted resin does not easily flow into the hole 142. This is considered to be due to the fact that the molten resin easily flows in the direction perpendicular to the opening direction of the hole 142.

For example, even if the bent portions 141 are formed on all four sides of the metal panel 140 and the holes 142 are formed in the bent portions 141, the bonding strength is improved, but the variation in the bonding strength of each bent portion 141 is not improved. , Hole 1
The problem that it is difficult for the molten resin to flow into 42 cannot be solved.

In the case of an IC memory card having a structure as shown in FIG. 16, the shape is usually prescribed, and the shapes of the front frame 104 and the back frame 105 are different. become. As an example of the IC memory card as described above, there is a card compliant with the PCMCIA (JEIDA) standard.

Further, in an IC memory card provided with a ground clip 153 as shown in FIG. 20, the ground clip 153 is provided only on the back metal panel 152.
Are not formed on the front metal panel 150. Therefore, two molds for manufacturing the front and back metal panels 150 and 152 are required. As a result, there is a problem that the cost of the mold is reflected in the manufacturing cost, and the manufactured IC memory card is very disadvantageous in terms of cost.

The present invention has been made in view of the above problems, and has as its object to eliminate variations in the bonding strength between a metal panel and a main body resin frame, to provide a more stable and strong bonding force. I that can reduce manufacturing costs
An object of the present invention is to provide a C memory card and a method for manufacturing the same.

[0016]

In order to solve the above-mentioned problems, an IC memory card according to the present invention has a substrate provided with a memory therein, and is formed by covering a panel member on a main body resin frame. In the card, a groove for fitting the panel member is formed on a side of the main body resin frame facing the panel member, and the panel member has a projection inserted into the groove. The protruding portion is characterized in that a tip portion has a shape wider than a root portion.

According to the above configuration, it is possible to obtain an IC memory card excellent in impact resistance by suppressing the variation in the bonding strength and improving the bonding strength between the main body resin frame and the panel member.

That is, the panel member is provided with a projection for coupling with the main body resin frame. The projection is inserted into the groove of the main body resin frame, and the resin is melted. The frame and the panel member can be welded and connected. At this time, after the molten resin flows into the vicinity of the protrusion, the resin is hardened, so that an IC memory card having a stronger connection can be obtained.

In a conventional IC memory card, a through hole is provided in a portion where the end of a panel member is bent, and a molten resin is caused to flow into the through hole to improve the bonding strength. However, actually, since the opening direction of the through hole is perpendicular to the flow of the resin, the molten resin does not easily flow in, and it is difficult to obtain a stable bonding strength.

On the other hand, in the IC memory card of the present invention, the projection is provided on the panel member. Therefore, the place where the melted resin should flow in order to improve the bonding force is around the protrusion, and is a space formed when the main body resin frame and the panel member are combined. Therefore, compared with the through-hole provided in the conventional IC memory card, the molten resin flows more easily.

Thus, in the IC memory card of the present invention, since the main body resin frame and the panel member have a structure that has no variation and has a stronger connection, an IC memory card excellent in impact resistance can be obtained. Can be.

Further, the protruding portions is preferably a shape constricted toward the root portion from the tip portion. Thereby, the flow of the melted resin becomes smooth around the protrusion and easily flows around the protrusion, so that the bonding strength between the main body resin frame and the panel member can be further improved.

Further, it is more preferable that the height of the protrusion is at least half the thickness of the main body resin frame.
As a result, the protrusion can be inserted into the depth of the groove provided in the main body resin frame, so that even when the amount of the molten resin is small, the protrusion is easily covered with the resin, and the main body resin frame and the panel member can be inserted into each other. The bond can be made stronger.

[0024] The aforementioned protrusion, more preferably a width of the wide portion is provided a plurality of locations than the roots of the protrusions. Thereby, since a plurality of portions hold the connection, the main body resin frame and the panel member can be connected more firmly.

It is more preferable that the projection has a through hole. Thereby, a part of the melted resin flows into the through hole, so that the bonding force between the main body resin frame and the panel member can be further improved.

It is more preferable that the protrusion has a shape having a protrusion only on the main body side of the panel member. Thus, even when a ground clip for enlarging the area of the ground in the IC memory card is provided at the end of the panel member, both can be provided without contacting the ground clip and the projection.
Therefore, the area of the ground of the IC memory card is enlarged,
A tightly coupled IC memory card can be obtained.

Further, it is more preferable that a plurality of the protrusions are provided on the end face of the panel member, and that the protrusions are provided symmetrically at the center of the end face. As a result, a uniform bonding force can be applied to the end faces of the panel member, and variations in the bonding force for each end face can be eliminated.

The width of the groove provided in the main body resin frame is 1.0 to 2.0 times the thickness of the panel member.
More preferably, it is twice. Thereby, since the displacement of the position when the panel member is welded can be suppressed at the maximum to a displacement corresponding to the thickness of the panel member,
The main body resin frame and the panel member can be accurately coupled.

The panel member is connected to both sides of the main body resin frame, and the projections provided on the panel member are formed by connecting the panel members connected to the front and back sides of the main body resin frame, respectively. It is more preferable that the projections are provided at positions where the projections do not come into contact with each other when the projections are fitted into the. As a result, projections having a height of at least half the thickness of the main body resin frame are formed, and even in the case of an IC memory card formed by combining panel members from both the front and back sides, the projections on the front and back panel members are connected to each other. Can be prevented from coming into contact with each other.

It is more preferable that the panel member has the same shape on both the front and back surfaces of the main body resin frame. As a result, when the panel member is made of a metal, a thermosetting resin, or the like, since it is not necessary to provide the front and back panel member molding dies, it is possible to reduce the die cost and the manufacturing cost of the IC memory card. Can be.

The method for manufacturing an IC memory card according to the present invention comprises:
In the method of manufacturing an IC memory card, it is more preferable that the groove of the main body resin frame and the protrusion provided on the end surface of the panel member are joined by ultrasonic welding.

By irradiating an ultrasonic wave around the position where the groove of the main body resin frame and the projection of the panel member are in contact with each other to melt the resin, the main body resin frame and the panel member can be separated by a simple method. Can be combined.

[0033]

[Embodiment 1] One embodiment of an IC memory card according to the present invention will be described below with reference to FIGS.

As shown in FIG. 1, the IC memory card of this embodiment includes a front metal panel (panel member) 10, a back metal panel (panel member) 11, and a main body resin frame 12.

For convenience of explanation, FIG. 1 shows an IC memory card in which the back metal panel 11 is already attached to the main body resin frame 12.
Is attached to the main body resin frame 12 in the same manner as the attachment method of the front metal panel 10 described below.

The front metal panel 10 has the same shape as the back metal panel 11, and four ends are bent.
A bent portion 15 is formed. Further, a projection 16 is provided at the tip of the bent portion 15. In this way, by making the front and back metal panels 10 and 11 have the same shape, a molding die for the front and back metal panels 10 and 11 can be shared, and the manufacturing cost can be reduced.

As shown in FIG. 2, the protrusion 16 is formed such that the width of the tip (tip) 21 is larger than the width of the base (base) 22 connected to the bent portion 15. .

The front and back metal panels 10 and 11 are
For example, it is made of stainless steel (SUS304-CSP) and has a thickness of 0.1 mm to 0.2 mm.

The main body resin frame 12 is a frame-shaped member having a hollow inside.
Is formed. Although not shown, a printed circuit board on which a connector, a memory IC, an LSI, and the like are mounted is fixed to the main body resin frame 12, and the IC memory card 20 is manufactured by being combined with the front and back metal panels 10 and 11. .

When assembling the IC memory card 20,
Main body resin frame 12 with back metal panel 11 already attached
The bent portions 15 formed on the four end surfaces of the front metal panel 10 are inserted into the groove portions 17. Next, in a state where the front and back metal panels 10 and 11 are pressed in a direction to close them,
Resin parts of the groove 17 and the ultrasonic waves are irradiated to the contact portion between the projections 16 and grooves 17 of the main body resin frame 12 is melted. And this molten resin is cured,
The main body resin frame 12 and the front metal panel 10 are joined. In addition, the resin melted at this time flows into the periphery of the protrusions 16 formed at the tip of the bent portion 15 of the front metal panel 10 and then hardens, so that the front metal panel 10 and the main body resin frame 12 are hardened. As compared with the case where the projection 16 is not provided, the connection is more firmly performed. As described above, by using the ultrasonic method, the front and back metal panels 10 and 11 and the main body resin frame 12 can be connected to each other by a simple method.

In the IC memory card 20 of the present embodiment,
Particularly, the shape of the projection 16 formed on the bent portion 15 of the front metal panel 10 is characterized.

That is, as shown in FIG. 2, the projection 16 is formed such that the tip 21 is wider than the root 22.

Further, by forming a constricted shape, that is, a curved shape from the root portion 22 to the distal end portion 21 of the projection 16, the molten resin can flow more easily.

The molten resin of the main body resin frame 12 which has been irradiated and melted by the ultrasonic wave is applied to the groove 1 of the main body resin frame 12.
7 formed when the front metal panel 10 is inserted into
It flows to fill the surrounding space. Therefore, the molten resin easily flows around the base portion 22 of the protrusion 16 that holds the bond after the molten resin is hardened, and the bonding force between the protrusion 16 and the main body resin frame 12 is made stronger and uniform. it can. Thereby, an IC memory card with improved impact resistance can be provided.

Here, a comparison will be made between a conventional IC memory card in which only a through hole is provided in the bent portion 15 and the IC memory card of the present embodiment.

In the conventional IC memory card, the opening direction of the through hole is perpendicular to the flowing direction of the molten resin, so that the molten resin does not easily flow into the through hole, and it is difficult to obtain a stable coupling amount. .

On the other hand, the IC memory card 20 of the present embodiment
The protrusions 16, uneven portions of the projections 16 the molten resin should flow into are the space, the molten resin tends to flow than providing holes, the coupling between the main body resin frame 12 and the front metal panel 10 Can be more robust.

The shape of the projection 16 provided on the end face of the front and back metal panels 10 and 11 of the IC memory card described in the present embodiment is not limited to the shape shown in FIG. For example, as shown in FIG. 3, the same effect as described above can be obtained even when the protrusion 16a in which two or more wide portions similar to the tip 21 shown in FIG. it can.

Further, the protrusion 1 shown in FIGS.
6 and 16a, through holes 30 as shown in FIGS.
And a portion of the molten resin flows into the through hole 30 by forming the projections 16b and 16c,
A stronger bonding force can be obtained as compared with the case where 0 is not provided.

The length from the bent portion of the bent portion 15 to the tip of the projection 16 is equal to the length of the tip 2 of the projection 16.
It is more preferable that the thickness is at least half the thickness of the main body resin frame 12 so that 1 is inserted into the groove portion 17 of the main body resin frame 12 as deep as possible.

As a result, even when the amount of the molten resin is small, the protrusion 16 is inserted to a deep position of the groove 17, so that the resin can easily flow into the root 22 of the protrusion 16, and the IC of strong connection can be formed. You can get a memory card.

It should be noted that the height of the protrusion 16 is
It is more preferable that the thickness of the main body resin frame 12 is equal to or less than the thickness of the main body resin frame 12 so that the front end of the main body 6 does not penetrate the main body resin frame 12.

The shape of the projection 16 may be any of the shapes shown in FIGS.

[0054] For example, it may be a protrusion protruding portion as shown in FIG. 6 (a) (i) - (viii) are provided only on one side, projections as shown in (c) May have a hexagonal shape. Furthermore, the tip of the projection is
The shape may be trapezoidal as shown in (a) and (e) of (a), triangular as shown in (f), or rectangular as shown in (g). You may.

Further, even if the projections shown in FIG. 6A are provided with through holes 30 and have the shapes shown in FIGS. The effect can be obtained.

Here, the positions of the front and back metal panels 10 and 11 where the protrusions 16 are provided will be described. For convenience of explanation, the shape of the protrusions described below, it is a one of the projections 16 shown in FIG. 2, but is not limited thereto. Regardless of which of the above-described projections is applied, the same effects as those described below can be obtained.

As shown in FIG. 7, it is more preferable that the protrusions 16 are provided symmetrically at the center of one side of the front metal panel 10. Thereby, a uniform bonding force can be provided for each end face of the front metal panel 10.

Further, as described above, the bent portion 1
The length from the bent portion 5 to the tip of the projection 16 is
When the bent portion 15 is formed so as to be inserted more than half the thickness of the main body resin frame 12, the front and back metal panel 1 is formed.
It is conceivable that the protruding portions 16 provided at the positions 0 and 11 come into contact with each other at the time of welding. For this reason, as shown in FIGS. 8 and 9, the protrusions 16e provided at the ends of the front and back metal panels 10 and 11 have a size not more than half the thickness of the main body resin frame 12, and are provided at other positions. projections 16d which is so as not to contact each other, the front and back metal panels 10, 11, and more preferably projecting portions 16d of the opposite sides is provided by shifting the position.

By changing the position of the protrusion 16 on the opposite side to a different position between the front and back metal panels 10 and 11, the front and back metal panels 10 and 11 are attached to the main body resin frame 12.
When the front and back metal panels 10 and 11 can be firmly connected to each other with the protrusion 16 inserted deeply, the front and back metal panels 10 and 11 can be molded with the same mold.

Further, as shown in FIG. 10, the width T of the groove 17 and the thickness of the projection 16, ie, the surface metal panel 1
The relationship between the thickness t and the thickness t is preferably such that the width T of the groove 17 is 1.0 to 2.0 times the thickness t.

Thus, the displacement of the front metal panel 10 when the front metal panel 10 is fitted into the main body resin frame 12 can be reduced to the thickness of the front metal panel 10 or less.
Workability can be improved.

In general, the front metal panel 10 of the present embodiment
Is 0.1 mm to 0.15 mm, and if the width of the groove 17 is limited to the above range, the displacement of the front metal panel 10 can be suppressed to 0.15 mm at the maximum.

In this embodiment, as shown in FIG. 1, a bent portion 15 is provided, and a protrusion 16
Has been described, but the present invention is not limited to this. For example, an I in which the bent portion 15 is not provided and only the protrusion 16 is provided.
Even with a C memory card, the same effect as the effect obtained by the present embodiment can be obtained.

[Second Embodiment] The following will describe another embodiment of the IC memory card of the present invention with reference to FIGS.

For convenience of explanation, members having the same functions as those in the drawings described in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIG. 11, the IC memory card 40 according to the first embodiment differs from the IC memory card 20 according to the first embodiment in that the ground clips 33 are provided on one side of the front and back metal panels 31 and 32, respectively. Is different. When the front and back metal panels 31 and 32 are fitted into the main body resin frame 12, the ground clips 3 are attached to the same side.
A ground clip 33 is formed so as not to come off.

The ground clip 33 is a member provided when a large ground area is required. The provision of the ground clip 33 allows grounding from the side of the IC memory card.
This is effective when grounding is desired from the device equipped with the C memory card.

The ground clip 33 is a member formed at the same time as the molding. The metal panel provided with the ground clip 33 has a projection 1 having the shape shown in the first embodiment.
6 cannot be formed because the ground clip 33 is in the way.

Therefore, the IC memory card 5 of the present embodiment
0, front and back metal panels 31.3 as shown in FIG.
2 are provided with the protrusions 16 shown in FIG.
The shape is such that the protruding portion in the outward direction as viewed from the center of the IC memory card 50 from the tip 21 of the IC memory card 50 is deleted.

As shown in FIG. 13, the protrusion 51
As viewed from the center line of the protrusion 51, the width increases from the root 52 to the tip 53 in the direction toward the main body of the front metal panel 31. On the other hand, when viewed from the center line of the protrusion 51, the width does not change from the root 52 to the tip 53 in the outward direction of the front metal panel 31.
Is formed so that the projection of the tip 53 of the projection 51 does not protrude from the end face of the projection 51.

As described above, by forming the protrusion 51 into the shape shown in FIG. 13, even if the IC memory card 50 provided with the ground clip 33,
3 does not contact the protrusion 51. Therefore, both the ground clip 33 and the protrusion 51 can be provided, and both the enlargement of the ground area and the strong connection can be realized.

In this embodiment, an example in which a metal panel is used as the panel member has been described, but the present invention is not limited to this. For example, thermosetting resin,
The same effect as described above can be obtained with a non-molten material that is not melted by heat, such as paper, wood, and stone.

Further, in the present embodiment, the main body resin frame 12 is molded of LCP (liquid crystal polymer) mixed with GF (glass fiber), but is not limited to this. For example, it may be another thermoplastic resin, in addition to the resin may be a thermoplastic material that can be melted by the irradiation of ultrasonic wave or the like.

In the present embodiment, an example has been described in which the groove 17 of the main body resin frame 12 is melted by ultrasonic waves to join the main body resin frame 12 and the panel member. However, the present invention is not limited to this. In addition to the ultrasonic wave, any other means (vibration applying means) capable of applying a vibration to a predetermined member to melt the same can provide the same effects as those of the present embodiment.

The IC memory card 5 described in the present embodiment
0 means that the ground clip 33 is the front and back metal panel 31.3
Although the example in which one is provided in 2 is described, it is not limited to this. For example, as shown in FIG.
One may be provided on each opposite side of 1 and 62. Thus, the ground clip 33 is attached to the front and back metal panels 61.
By using two or more IC memory cards 60 provided in 62, as shown in FIG. 15, by using the projection 51 and the ground clip 33 together, it is possible to increase the area of the ground and firmly couple.

In the IC memory card of the present invention, a bent portion is provided on an end surface of the metal panel in an IC memory card having a metal panel to be embedded in and bonded to a main body resin frame by ultrasonic welding. May be an IC memory card in which the protruding portion provided has a width narrower than the front end thereof.

Further, the IC memory card according to the present invention may be an IC memory card in which the protruding portion has a curved end portion or an IC memory card in which a plurality of the narrow width portions are provided. It may be.

Further, in the IC memory card of the present invention, when connecting the metal panel to the front and back surfaces of the resin frame of the main body, at least one half of the width of the protrusion and the same end surface from the symmetrical position of the front and back metal panels. An IC memory card may be formed by shifting the projections provided on the front and back metal panels within a range not more than the distance between the adjacent projections provided.

Further, the IC memory card of the present invention may be an IC memory card in which ground clips are provided on front and back metal panels, and one ground clip may be provided at one end of each metal panel. When a metal panel is fitted into the main body resin frame, the IC memory card may be an IC memory card in which ground clips are provided on opposite sides of the IC memory card.

As described above, according to the lid sealing method of the present invention, the lid member (panel member) is provided with a protruding portion having a shape whose tip portion is wider than the root portion, and this protruding portion is attached to the main body frame. This is a method of inserting into the formed groove, melting the groove, and joining the two, but this method is not limited to only the IC memory card. For example, even when the present invention is applied to a liquid crystal display panel, a display device such as a CRT, an information communication device such as a mobile phone, a terminal such as a personal computer, etc., the bonding strength between the main body and the cover member can be improved.

Further, in addition to the above, if the lid attached to the main body is applied to a casing which will not be removed later, the lid can be sealed with a large bonding force.

The lid sealing method of the present invention is a lid sealing method formed by covering a main body frame with a lid member, wherein the main body frame is formed with a groove for fitting the lid member. In addition, the lid member is characterized in that the distal end portion has a shape wider than the root portion, and is provided with a protrusion inserted into the groove.

[0083]

As described above, in the IC memory card of the present invention, the groove portion for fitting the panel member is formed on the side of the main body resin frame facing the panel member. The member is provided with a protrusion inserted into the groove, and the protrusion has a configuration in which a tip portion is wider than a root portion.

Therefore, it is possible to suppress the variation in the bonding strength and to improve the bonding strength between the main body resin frame and the panel member, so that an IC memory card excellent in impact resistance can be obtained.

In the IC memory card of the present invention, a projection is provided on the panel member. Therefore, the place where the melted resin should flow in order to improve the bonding force is around the protrusion, and is a space formed when the main body resin frame and the panel member are combined. Therefore, compared with the through-hole provided in the conventional IC memory card, the molten resin flows more easily.

Thus, in the IC memory card of the present invention, by manufacturing the resin frame of the main body and the panel member so as to have a firmer connection without variation, an IC memory card excellent in impact resistance can be obtained. Obtainable.

Further, it is preferable that the projection has a narrow shape from the tip to the root, so that the flow of the molten resin becomes smooth around the projection and easily flows into the vicinity of the projection. This has the effect that the bonding strength between the main body resin frame and the panel member can be more reliably improved.

The height of the projection is preferably at least half the thickness of the main body resin frame.
Since the protrusions can be inserted all the way into the body resin frame, even when the amount of the molten resin is small, the protrusions are easily covered with the resin, and the connection between the body resin frame and the panel member can be further strengthened. To play.

[0089] The aforementioned projections, because it is more preferable that portion wider than the base of the protruding portions are provided a plurality of locations, the portion for holding the bond strength becomes a plurality of locations, and the main resin frame There is an effect that the panel member and the panel member can be connected more firmly.

It is more preferable that the projection has a through hole, and a part of the molten resin flows into the through hole to further improve the connection between the main body resin frame and the panel member. It has the effect of being able to do so.

It is more preferable that the projection has a shape having a projection only on the main body side of the panel member. Therefore, even when a ground clip for enlarging the area of the ground in the IC memory card is provided at the end of the panel member, the ground clip and the projection can coexist without contacting each other. To play. Therefore, the area of the ground is enlarged, and an IC memory card that is firmly connected can be obtained.

[0092] Further, it is more preferable that a plurality of the protrusions are provided on the end surface of the panel member, and that the protrusions are provided symmetrically at the center of the end surface. Therefore, a uniform bonding force can be given to the end of the panel member, and the effect of eliminating the variation in the bonding force for each end face can be achieved.

The width of the groove provided in the main body resin frame is 1.0 to 2.0 times the thickness of the panel member.
More preferably, it is twice. Therefore, the displacement of the position when the panel member is welded can be suppressed at most to the displacement corresponding to the thickness of the panel member, and thus the main body resin frame and the panel member can be accurately coupled. It has the effect of being able to do it.

Further, the panel member is connected to both sides of the main body resin frame, and the projections provided on the panel member are formed by connecting the panel members respectively connected to the front and back sides of the main body resin frame to the main body resin frame. It is more preferable that the projections are provided at positions where the projections do not come into contact with each other when the projections are fitted into the. Therefore, a protrusion having a height of at least half the thickness of the main body resin frame is formed, and the I and B formed by joining the panel members from both front and back surfaces are formed.
Even in the case of the C memory card, there is an effect that the projections of the front and back panel members can be prevented from contacting each other.

It is more preferable that the panel member has the same shape on both the front and back surfaces of the main body resin frame. Therefore, since it is not necessary to provide the front and back panel member molding dies, it is possible to reduce the cost of the die and to suppress the manufacturing cost of the IC memory card.

The method of manufacturing an IC memory card according to the present invention comprises:
In the method of manufacturing an IC memory card, it is more preferable that the groove of the main body resin frame and the protrusion provided on the end surface of the panel member are joined by ultrasonic welding. Therefore, by irradiating ultrasonic waves around the position where the groove of the main body resin frame and the projection of the panel member are in contact,
By melting the resin, there is an effect that the main body resin frame and the panel member can be joined by a simple method.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an embodiment of an IC memory card of the present invention.

FIG. 2 is an enlarged front view showing a protrusion provided on a front and back metal panel of the IC memory card of FIG. 1;

FIG. 3 is a front view showing another example of a protrusion provided on the IC memory card.

FIG. 4 is a front view showing an example in which a through hole is provided in the protrusion shown in FIG. 2;

FIG. 5 is a front view illustrating an example in which a through hole is provided in the protrusion illustrated in FIG. 3;

FIGS. 6A and 6B are front views showing the shapes of protrusions applicable to the present invention.

FIG. 7 is a cross-sectional view showing an example in which the protrusions are provided on front and back metal panels.

FIG. 8 is a cross-sectional view showing another example in which the protrusions are provided on front and back metal panels.

FIG. 9 is a cross-sectional view showing still another example in which the protrusions are provided on front and back metal panels.

FIG. 10 is a cross-sectional view showing a relationship between a width of a groove provided in a main body resin frame of the IC memory card and a thickness of a front metal panel.

FIG. 11 is an exploded perspective view showing a configuration of an IC memory card provided with a ground clip according to another embodiment of the present invention.

FIG. 12 is a cross-sectional view showing the positions of protrusions provided on the front and back metal panels of the IC memory card of FIG. 11;

FIG. 13 is an enlarged front view showing a protrusion of FIG. 12;

FIG. 14 is an exploded perspective view showing another example of the IC memory card of FIG. 11;

FIG. 15 is an exploded perspective view showing an example of an IC memory card provided with both the ground clip and the protrusion of FIG. 14;

FIG. 16 is a side view showing a configuration of a conventional IC memory card.

FIG. 17 is a side view showing the configuration of another conventional IC memory card.

FIG. 18 is a side view showing the configuration of still another conventional IC memory card.

19 is an exploded perspective view showing an assembly structure of the IC memory card of FIG.

FIG. 20 is an exploded perspective view showing an assembly structure of a conventional IC memory card.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 front metal panel (panel member) 11 back metal panel (panel member) 12 main body resin frame 15 bent portion 16 protruding portion 17 groove portion 20 IC memory card 21 tip portion (tip portion) 22 root portion (root portion) 30 through hole 31 Front metal panel (panel member) 32 Back metal panel (panel member) 33 Ground clip 40 IC memory card 50 IC memory card 51 Protrusion 52 Root (root) 53 Tip (tip) 60 IC memory card 61 Surface metal Panel (panel member) 62 Back metal panel (panel member)

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hidenaga Tanaka 22-22, Nagaikecho, Abeno-ku, Osaka-shi, Osaka Inside Sharp Corporation (72) Inventor Anju Sakamoto 22-22, Nagaikecho, Abeno-ku, Osaka-shi, Osaka F-term (for reference) 2C005 MA17 MA19 MB03 NB04 NB05 NB10 RA24 5B035 AA04 AA07 AA08 BA04 BB09 CA01

Claims (11)

[Claims] 1. A includes a substrate having a memory therein, in an IC memory card which is formed by covering the panel member to the body resin frame, on the side facing to the panel member in the main body resin frame, the panel A groove for fitting the member is formed, and the panel member is provided with a projection to be inserted into the groove, and the projection has a tip portion wider than a root portion. An IC memory card having a shape. 2. The projection according to claim 1, wherein the projection has a constricted shape from a tip portion to a root portion.
2. The IC memory card according to claim 1. 3. The IC memory card according to claim 1, wherein the height of the protrusion is at least half the thickness of the main body resin frame. 4. The IC memory card according to claim 1, wherein the protrusion has a plurality of portions wider than a root of the protrusion. 5. The IC according to claim 1, wherein a through hole is provided in said projection.
Memory card. 6. The panel according to claim 1, wherein the projection has a shape having a projection only on the main body side of the panel member.
6. The IC memory card according to any one of claims 1 to 5. 7. The panel according to claim 1, wherein a plurality of said projections are provided on an end face of said panel member, and are provided symmetrically at the center of said end face.
An IC memory card according to any one of the preceding claims. 8. The apparatus according to claim 1, wherein the width of the groove provided in the main body resin frame is 1.0 to 2.0 times the thickness of the panel member. 2. The IC memory card according to claim 1. 9. The panel member is connected to both sides of the main body resin frame, and the projections provided on the panel member are formed by connecting the panel members respectively connected to the front and back sides of the main body resin frame to the main body resin frame. The IC memory card according to any one of claims 1 to 8, wherein the IC memory card is provided at a position where the projections do not come into contact with each other when the IC memory card is inserted into the IC card. 10. The IC memory card according to claim 9, wherein the panel member has the same shape on both the front and back surfaces of the main body resin frame. 11. The method for manufacturing an IC memory card according to claim 1, wherein the groove of the main body resin frame and the projection provided on the end face of the panel member are superposed. A method for manufacturing an IC memory card, wherein the bonding is performed by sonic welding.