JP2002248562A - Jet solder bath - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jet solder bath suitable for an automatic soldering apparatus which can accurately solder a work without manufacturing many solder jet nozzles. SOLUTION: A solder jet nozzle (20) is provided with a plurality of injection holes (21).
Is almost uniformly dispersed and formed in a plate shape, restricting the ejection of molten solder from the injection holes except for the injection holes at the positions corresponding to the soldering parts of the work (W), and removing the molten solder from the injection holes. Jetting to form one or more solder jets. A molten solder pool (16) with a predetermined depth is formed above the injection hole,
It is preferable that the solder jet is formed almost in a three-dimensional shape of the parabolic rotator by the injection force of the molten solder and the surface tension of the molten solder pool, and brought into pinpoint contact with the soldering portion of the work.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet soldering bath most suitable for an automatic soldering apparatus, and more particularly, to a method in which jet solder is pin-pointed to, for example, leads or terminals of an arbitrary discrete part without manufacturing many solder jet nozzles. The present invention relates to a structure that can be brought into contact and soldered accurately.

[0002]

2. Description of the Related Art For example, in a ballast for a fluorescent lamp, a coil wire is pulled out and soldered to a terminal. Recently, however, the soldering operation of such a ballast also requires automation.

Conventionally, in an automatic soldering apparatus, a solder jet nozzle having a long groove-shaped jet port is provided on a side of a conveyor.
A jet pump supplies molten solder toward the jet nozzle and jets out the molten solder, while a conveyor conveys a ballast and contacts its terminals to the solder jet to perform soldering. The method is adopted.

On the other hand, in recent ballasts, there is a tendency to use a connector function in combination with a terminal. If extra solder is attached to a terminal having such a connector function, a problem such as a short circuit in a circuit may be caused. , Accurate soldering is required.

However, in the conventional automatic soldering apparatus, since the molten solder is simply jetted upward, it is difficult to control the attitude and shape of the solder jet due to its specific gravity and viscosity. The only way is to spray molten solder from the mouth and make it contact the underside of the ballast terminal.In the case of a terminal with a connector function, it can not be applied because the solder adheres to unnecessary parts and it can not be applied. In fact, they had to rely on the manual work of workers.

On the other hand, the inventor of the present invention arranges a solder jet nozzle in which the upper surface of the injection hole is covered with a molten solder pool having a predetermined depth in the vicinity of the conveyor, and the molten solder pool is formed through the injection hole of the solder jet nozzle. A three-dimensional shape of a parabolic rotator, in which a molten solder is jetted upward against surface tension to form a substantially conical solder jet swelling, that is, the solder jet is a vertical axis passing through the highest point of the molten solder as a rotation axis. The height of the solder jet is adjusted by increasing or decreasing the jet force from the injection hole or the depth of the molten solder pool above the injection hole, and the work is conveyed by the conveyor to cross the solder jet. Therefore, a jet-type automatic soldering apparatus for performing soldering on a work to be soldered has been developed and has been filed (see Japanese Patent Application Laid-Open No. 08-90217).

[0007]

In the above-mentioned jet type automatic soldering apparatus, solder is not attached to unnecessary portions,
Although it can be expected to perform accurate soldering on the soldering part of the work, it is necessary to manufacture a solder jet nozzle according to the position and shape of the soldering part of the work, and if there are many types of work, It was necessary to manufacture and prepare a large number of solder jet nozzles.

The present invention has been made in view of the above problems, and has as its object to provide a jet solder bath which can accurately perform soldering on various works without manufacturing many solder jet nozzles. Make it an issue.

[0009]

Accordingly, a jet solder bath according to the present invention is a jet solder bath in which molten solder is jetted from a solder jet nozzle onto a work to be soldered. A molten solder tank for storing, a pump means for feeding the molten solder toward an upper surface opening of the molten solder tank, and a plurality of injection holes formed so as to be substantially uniformly dispersed, for soldering a work to be soldered. The ejection of the molten solder from the injection holes other than the injection hole at the position corresponding to the part is restricted, the molten solder is mounted in the molten solder tank below the liquid level of the molten solder, and the molten solder is injected into the injection hole by the pump means. And a plate-shaped solder jet nozzle which bulges and forms one or a plurality of solder jets at a position where the soldering portion of the work to be soldered can come into contact with the workpiece by feeding. .

One of the features of the present invention is that a plurality of injection holes are formed in a plate-like solder jet nozzle by dispersing them almost uniformly.
The point is that the jet of the molten solder from the unnecessary injection holes among the plurality of injection holes is restricted by an appropriate method.

[0011] Thus, the solder jet can be formed to bulge at a position corresponding to the soldering portion of the work, so that the solder jet can be brought into pinpoint contact only with the soldering portion, and accurate soldering can be performed. Therefore,
Even when accurate soldering is required, such as for discrete components, the molten solder can be accurately adhered only to the soldered portion of the work, and an accurate and efficient automatic soldering operation can be realized.

In addition, for a work having a different soldering portion, it is sufficient to restrict the ejection of the molten solder from the injection holes other than the position corresponding to the soldering portion of the work. Since there is no need to manufacture the jet nozzle, there is no need to increase the cost, and there is no need to replace the solder jet nozzle.

[0013] With regard to the solder jet nozzle, the solder jet nozzle is mounted in the molten solder tank so that a molten solder pool of a predetermined depth is formed above the injection hole. Due to the jetting force and the surface tension of the molten solder pool, the solder jet flows into a three-dimensional shape of a parabolic rotator with the vertical axis passing through the highest point of the molten solder as the axis of rotation. Vinegar that can make point contact is preferred.

In this case, the height of the solder jet can be arbitrarily adjusted while maintaining a stable posture by increasing or decreasing the jet force of the molten solder from the injection hole or increasing or decreasing the depth of the molten solder pool. Therefore, it can be easily applied to soldering of any work.

Here, the reason why a substantially conical solder jet is formed by swelling will be briefly described with reference to FIG. 7. The upper surface of the injection hole 100 is covered with a molten solder pool 110, and molten solder is supplied to the injection hole 100. Then, the injection hole 10
The molten solder P is ejected from 0 and the molten solder pool 110 above the injection hole 100 is lifted upward. However, the surface tension S acts on the molten solder pool 100, so that a substantially conical solder jet is formed. Is done. In addition, the surface tension S of the molten solder pool 110 is constant unless the conditions such as the heating temperature change, and the jet force from the injection hole 100 is almost constant, so that the solder jet flows in a vertical line passing through the highest point of the molten solder. Is formed in a three-dimensional shape of the parabolic rotator having the rotation axis as a rotation axis, that is, a substantially conical shape, and the shape is stably maintained.

In some cases, it is necessary to jet the solder jet to a high position depending on the working conditions and the like. However, a sufficient height may not be ensured only by supplying the pump means. In such a case, if the jet hole of the solder jet nozzle is integrally formed with a jet maintaining pipe portion extending to a height exceeding the liquid level of the molten solder, the solder jet is jetted to a high position by feeding the molten solder by the pump means. It becomes possible. Moreover, in this case, the same as in the case of forming the molten solder pool by the injection force caused by the supply of the molten solder to the injection hole by the pump means and the tensile force caused by the wettability between the molten solder and the jet maintaining pipe. In addition, the solder jet from the tip of the jet maintaining pipe can be formed almost bulging into a three-dimensional shape of a parabolic rotator with the vertical axis passing through the highest point of the molten solder as the axis of rotation. And pinpoint contact.

Further, when the maintenance pipe is provided, even when the viscosity of the molten solder is low, the fall of the solder jet can be reliably prevented, and the solder jet can be formed high without increasing the supply pressure of the molten solder. This increases the degree of freedom in designing the soldering device.

The present invention has a great effect when applied to the soldering of the coil terminals of the ballast for fluorescent lamps, but can also be applied to the soldering of other works. H60 is used as the solder in the present invention.
In addition to ordinary solders such as A (S) and H63A (S), other low melting point metals and alloys that can be used for bonding are included.

The diameter of the injection holes is appropriately set in the range of 0.1 to 100 mm according to the size of the work soldering portion and the viscosity of the molten solder, and the interval between the injection holes is also 1 to 100 mm.
Can be set from the range. The shape of the injection hole is not particularly limited, and may be a polygonal hole such as a triangle or a square, a round hole such as a circle or an ellipse, or a hole of any shape. What is necessary is just to set suitably according to conditions, such as a structure and a shape of a site | part.

The material of the perforated plate or the jet shaping plate constituting the solder jet nozzle is not particularly limited, and for example, stainless steel, a titanium-based material, and other metal materials can be used. Although a flat plate is used as the perforated plate or the jet shaping plate, a corrugated plate may be used.

When restricting the ejection of the molten solder from the ejection holes, the following method can be employed to restrict the ejection without increasing the cost.

That is, the solder jet nozzle is constituted by a perforated plate, and a plurality of injection holes are formed in the perforated plate so as to be substantially uniformly dispersed, and the plurality of injection holes correspond to a soldering portion of a work. If the injection holes other than the injection hole at the position are removably closed by the closing member, the jet flow of the molten solder can be restricted without increasing the cost. As the closing member, a bolt or a nut may be used, or a female screw may be cut into the injection hole and screwed into the screw to close the opening. Further, a taper pin may be driven into the injection hole from below (or from above) to close the injection hole. In this case, the injection hole is preferably formed in a tapered shape.

The solder jet nozzle comprises a perforated plate and a jet shaping plate laminated on the upper and / or lower side of the perforated plate, and a plurality of jet holes are formed in the perforated plate in a substantially uniform manner. On the other hand, a hole or opening may be formed in the jet shaping plate at a position corresponding to the soldering portion of the work, and the molten solder may be jetted only from an injection hole matching the hole or opening.

When a solder jet nozzle is formed by combining a perforated plate and upper and lower jet shaping plates, jet holes are formed on xy grid points in the perforated plate, and an x or y direction is formed in the upper jet shaping plate. A plurality of long groove-shaped openings extending in the lower jet flow shaping plate, a plurality of long groove-shaped openings extending in the y direction or the x direction are formed, and the upper and lower jet flow shaping plates are slid in directions perpendicular to each other. It is also possible to selectively open and close the injection holes to jet the molten solder. In this case, the x-
The position on y can be controlled relatively easily by computer, so that the position of the solder jet can be automatically controlled.

When a jet maintaining pipe is provided, a jet maintaining pipe is formed integrally with a hole of a jet shaping plate laminated on the upper side of the perforated plate so as to extend to a height exceeding the liquid level of the molten solder. It is also possible to form the solder jet from the tip of the jet maintaining pipe portion into a substantially three-dimensional shape of a parabolic rotator whose rotation axis is a vertical line passing through the highest point of the molten solder.

When the jet maintaining pipe portion is provided, the surface tension of the molten solder outside the pipe portion does not act on the solder jet, but the tensile force caused by the wettability between the inner surface of the pipe portion and the molten solder causes the solder to flow. It is considered that the shape of the swell of the jet flow is affected, and a substantially conical solder jet is formed as in the case of the molten solder pool.

In the present invention, since the solder jet nozzle is below the liquid level of the molten solder, the injection hole of the solder jet nozzle is not blocked by oxidized slag or flux of the molten solder. It is preferable to form an atmosphere for reducing the temperature. That is, it is preferable to further include an inert gas supply unit that supplies a high-temperature inert gas to the space including the liquid surface of the molten solder and the solder jet to form an inert atmosphere. In this case, when the concentration of the inert gas, for example, nitrogen gas is 99.9% or more, it is confirmed that dross in which oxidized slag and flux of molten solder are mixed can be reduced, and the oxide film of the solder due to the jet can be eliminated. Have been. It is more preferable to control the temperature of the inert gas atmosphere so that there is no difference between the temperature at the top of the solder jet and the set temperature.

The work may be brought close to the solder jet by any mechanism. For example, the work may be brought into contact with the solder jet by a robot arm. In general, a transport conveyor is preferably used. The transport conveyor may be of any type, for example, a belt conveyor, a plate conveyor in which a plurality of plates are connected in a transport direction by a chain or the like so as to be movable on a guide, or the like.

The above-mentioned solder jet nozzle is also novel. That is, the solder jet nozzle of the jet solder bath according to the present invention is a solder jet nozzle attached to a molten solder bath that stores molten solder to form a solder jet, and is configured using a perforated plate. In the plurality of injection holes are formed almost uniformly dispersed, among the plurality of injection holes,
The injection holes except for the injection holes at positions corresponding to the soldering parts of the work are removably closed by closing members, and are mounted in the molten solder tank so that a molten solder pool of a predetermined depth is formed above. And supplying one or more solder jets having a height at which the soldering portion can come into contact with a position at which the soldering portion of the work to be soldered can be brought into pinpoint contact by feeding the molten solder to the injection hole. The parabolic rotator has a three-dimensional shape with a vertical axis passing through the highest point as a rotation axis.

Further, the solder jet nozzle of the jet solder tank according to the present invention is a solder jet nozzle which is attached to a molten solder tank for storing molten solder and forms a solder jet, and comprises a perforated plate and an upper side of the perforated plate. And / or a jet-shaping plate laminated on the lower side, wherein a plurality of jet holes are formed in the perforated plate substantially uniformly dispersed, and the jet-shaping plate corresponds to a soldering portion of a work. A hole or an opening is formed at a position, is mounted in the molten solder tank so that a molten solder pool of a predetermined depth is formed above, and a hole or an opening of the jet shaping plate is supplied by feeding the molten solder. One or a plurality of solder jets having a height at which the soldering part can be brought into contact with a position where the soldering part of the work to be soldered can come into pinpoint contact only from the injection hole matching the Characterized in that none so as to be substantially raised formed on the three-dimensional shape of the parabolic body of revolution the vertical line passing through the highest goal of fusion solder and the rotary shaft.

Also in this case, it is preferable to provide a jet maintaining pipe portion on the perforated plate or the jet shaping plate.

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the drawings. 1 to 3 show a preferred embodiment of an automatic soldering apparatus provided with a jet solder bath according to the present invention. In the figure, the molten solder tank 10 has an open upper surface, and a heater is provided in the molten solder tank 10 so that the molten solder tank 1
A molten solder 15 is stored in the space 0, and a transport conveyor 14 for transporting the work W is disposed above the molten solder tank 10.

A jet box 11 is mounted in the molten solder tank 10 by being immersed in the molten solder 15. The jet box 11 has an open upper surface, and a jet pump (pump means) 12 is provided beside the jet box 11. The molten solder 15 is provided toward the upper surface opening of the jet box 11.

A solder jet nozzle 20 is mounted on the jet box 11 so as to cover the upper opening. The solder jet nozzle 20 is configured using a perforated plate made of, for example, stainless steel (or a titanium-based material), and the perforated plate has a plurality of injection holes 21 having a predetermined diameter as shown in FIG.
Are formed on lattice points, and a molten solder pool 16 having a predetermined depth is formed above the injection holes 21.

The plurality of injection holes 21 of the solder jet nozzle 20
.. Internal threads are engraved on the inner surface, and as shown in FIG. 3, screws 22 are screwed into injection holes 21. Have been. When a taper pin or a bolt / nut is used, there is no need to provide a female screw.

Next, when performing soldering, an inert atmosphere is formed by supplying a high-temperature nitrogen gas having a concentration of 99.9% or more to the automatic soldering apparatus and capable of maintaining the set temperature of the solder jet, and forming an inert atmosphere. .. Of the solder jet nozzle 20 are closed with screws 22... While the solder 15 in the solder melting tank 10 is heated and melted by a heater to a predetermined temperature. After the temperature is adjusted, the jet pump 12 is operated to rotate the jet blades 13, and the molten solder 1 is rotated.
5 is sent to the solder jet nozzle 20 at a predetermined pressure, the molten solder 15 is applied to each of the injection holes 2 of the solder jet nozzle 20.
It is jetted upward from 1.

At this time, a molten solder pool 16 is formed above the injection holes 21... When the molten solder 15 is jetted from the injection holes 21. Although the molten solder pool 16 is lifted by the jet force, surface tension acts on the molten solder pool 16, so that the solder jet has a three-dimensional shape of a parabolic rotator whose rotation axis is a vertical line passing through the highest point of the molten solder, that is, a substantially conical shape The swell is formed stably. When the workpiece W is transported by the transport conveyor 14, only the soldered portion of the workpiece W crosses the solder jet, and the molten solder adheres to the soldered portion by pinpoint contact, and soldering is performed.

When soldering a different work W, if the injection holes 21... Of the solder jet nozzle 20 other than the position corresponding to the soldering site of the work W are closed with screws 22, unnecessary work is performed in the same manner as described above. The soldering can be accurately performed by causing the solder jet to be in pinpoint contact only with the portion to be soldered without attaching the solder to the portion. In this way, it is possible to cope very easily without incurring high costs.

FIG. 4 shows a second embodiment, in which the same reference numerals as those in FIGS. 1 to 3 denote the same or corresponding parts. In this example, the solder jet is restricted by changing the structure of the solder jet nozzle 20 instead of the screw 22. That is, the solder jet nozzle 20 is configured by a combination of a perforated plate and a jet shaping plate 30, the jet shaping plate 30 is laminated on the upper side or the lower side of the porous plate, and the solder shaping portion of the work W Or an opening 32 is formed at a location corresponding to.

Therefore, the holes 31 of the jet shaping plate 30
.. or molten solder 15 is jetted only from injection holes 21... Matching opening 32, and other injection holes 21.
From the molten solder can be restricted.

FIGS. 5 and 6 show a third embodiment, in which the same reference numerals as those in FIGS. 1 to 4 denote the same or corresponding parts. In this embodiment, the solder jet nozzle 20 is integrally formed with jet maintenance pipe portions 23 extending to a height exceeding the liquid level of the molten solder so as to communicate with the plurality of angle injection holes 21. A female screw is engraved on the inner surface on the tip side of the maintenance pipe 23..., So that the screw 24 can be screwed to restrict the jet of the molten solder.

In this example, even when there is a relatively large distance between the work W and the liquid level of the molten solder 15, not only the molten solder can be jetted to the height reaching the work W, but also the falling of the solder jet Can be prevented, and can be soldered to an accurate portion. In particular, when performing fine soldering or when a jet height is required, a method of combining rotation control of the jet maintaining pipe section 23 and the jet pump 12 is extremely effective.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing a preferred embodiment of an automatic soldering apparatus having a jet solder bath according to the present invention.

FIG. 2 is a plan view showing a perforated plate constituting a solder jet nozzle in the embodiment.

FIG. 3 is a sectional view showing a main part of the solder jet nozzle.

FIG. 4 is a plan view showing a jet shaping plate (a) and a perforated plate (b) constituting a solder jet nozzle according to a second embodiment.

FIG. 5 is a schematic side view showing a third embodiment.

FIG. 6 is a side sectional view showing a main part of the solder jet nozzle in the embodiment.

FIG. 7 is a diagram for explaining means for solving the problem.

[Explanation of symbols]

 Reference Signs List 10 molten solder tank 11 jet box 12 jet pump (pump means) 14 transport conveyor 15 molten solder 16 molten solder pool 20 solder jet nozzle 21 jet hole 22 screw 23 jet maintaining pipe part 24 screw 30 jet shaping plate 31 hole 32 opening W work

Claims (11)

[Claims] 1. A jet solder tank for jetting molten solder from a solder jet nozzle onto a work to be soldered, wherein the molten solder tank has an open upper surface and stores the molten solder; Pump means for feeding toward the upper surface opening of the workpiece, and a plurality of injection holes are formed substantially uniformly dispersed and melted from the injection holes except for the injection holes at positions corresponding to the soldering portions of the work to be soldered. The ejection of the solder is restricted, and the soldering portion of the work to be soldered is mounted in the molten solder tank so as to be positioned below the liquid level of the molten solder, and the molten solder is supplied to the injection hole by the pump means. A jet solder bath, comprising: a plate-shaped solder jet nozzle that bulges and forms one or a plurality of solder jets at positions where they can come into contact with each other. 2. The solder jet nozzle is mounted in the molten solder tank so that a molten solder pool having a predetermined depth is formed above the injection hole, and the pump means feeds the molten solder to the injection hole. Due to the resulting jetting force and the surface tension of the molten solder pool, the solder jet is almost swelled into a three-dimensional shape of a parabolic rotator having a vertical axis passing through the highest point of the molten solder as a rotation axis and formed with a soldering portion of the work. 2. A jet solder bath according to claim 1, wherein the jet solder bath can be brought into pinpoint contact. 3. An injection hole of the solder jet nozzle is integrally formed with a jet maintaining pipe portion extending to a height exceeding the liquid level of the molten solder, and is caused by feeding of the molten solder to the injection hole by the pump means. Parabolic rotation about the vertical axis of which the solder jet flows from the tip of the jet maintaining pipe section through the highest point of the molten solder due to the jetting force and the tensile force caused by the wettability between the molten solder and the jet maintaining pipe 2. The jet solder bath according to claim 1, wherein the solder bath is formed so as to be substantially raised to a three-dimensional shape of the body so as to be able to make a pinpoint contact with a soldering portion of the work. 4. The solder jet nozzle is constituted by a perforated plate, and a plurality of injection holes are formed in the perforated plate so as to be substantially uniformly dispersed, and the plurality of injection holes correspond to soldering portions of a work. 2. An injection hole excluding an injection hole at a position where the injection hole is located is removably closed by a closing member.
Or the jet solder bath according to 2. 5. The solder jet nozzle comprises a perforated plate and a jet shaping plate laminated on the upper and / or lower side of the perforated plate, and the perforated plate has a plurality of jet holes substantially uniformly dispersed therein. On the other hand, a hole or an opening is formed in the jet shaping plate at a position corresponding to the soldering portion of the work, so that the molten solder is jetted only from an injection hole matching the hole or the opening. The jet solder bath according to claim 1. 6. A jet maintaining pipe portion integrally formed in a hole of the jet shaping plate stacked on the upper side of the perforated plate and extending to a height exceeding a liquid level of the molten solder, and a tip of the jet maintaining pipe portion 6. The jet solder bath according to claim 5, wherein the solder jet is formed so as to be substantially bulged in a three-dimensional shape of a parabolic rotator whose rotation axis is a vertical line passing through the highest point of the molten solder. 7. An inert gas supply means for supplying a high-temperature inert gas to a space containing a liquid surface of the molten solder and a solder jet to form an inert atmosphere.
The jet solder bath according to any one of the above. 8. A solder jet nozzle attached to a molten solder tank for storing molten solder and forming a solder jet, comprising a perforated plate, wherein the perforated plate has a plurality of injection holes substantially uniformly. Of the plurality of injection holes, the injection holes except for the injection hole at a position corresponding to the soldering part of the work are detachably closed by a closing member, and the molten solder having a predetermined depth upward is formed. The soldering portion is mounted in the molten solder bath so that a pool is formed, and the soldering portion contacts a position where the soldering portion of the work to be soldered can be in pinpoint contact by feeding the molten solder to the injection hole. One or a plurality of solder jets having an obtained height are formed almost in a three-dimensional shape of a parabolic rotator having a vertical axis passing through the highest point of the molten solder as a rotation axis. Solder ejection nozzle flow solder bath. 9. A solder jet nozzle attached to a molten solder bath for storing molten solder and forming a solder jet, comprising: a perforated plate; and a jet shaping plate laminated on the upper and / or lower side of the perforated plate. A plurality of injection holes are formed substantially uniformly dispersed in the perforated plate, and holes or openings are formed in the jet shaping plate at positions corresponding to the soldering portions of the work, and upward. A work piece to be soldered is mounted in the molten solder bath so that a molten solder pool of a predetermined depth is formed, and only the injection holes matching the holes or openings of the jet flow shaping plate are supplied by feeding the molten solder. One or a plurality of solder jets having a height at which the soldering part can come into contact with the soldering part at a point where the soldering part can come into contact with the soldering part have a vertical axis passing through the highest point of the molten solder as a rotation axis. Solder jet nozzle of the jet solder bath, characterized in that none so as to be substantially raised formed on the three-dimensional shape of the object beam rotational body. 10. An injection hole of the perforated plate is integrally formed with a jet maintaining pipe portion extending to a height exceeding a liquid level of the molten solder, and a solder jet flows from a tip of the jet maintaining pipe portion to a maximum of the molten solder. The solder jet nozzle of the jet solder bath according to claim 8 or 9, wherein the solder jet nozzle is formed so as to be substantially raised in a three-dimensional shape of a parabolic rotator having a vertical axis passing through a reaching point as a rotation axis. 11. A jet maintaining pipe portion integrally formed in a hole of the jet shaping plate laminated on the upper side of the perforated plate and extending to a height exceeding a liquid level of the molten solder, and a tip of the jet maintaining pipe portion 10. The solder jet nozzle for a jet solder bath according to claim 8, wherein the solder jet is formed so as to be substantially raised in a three-dimensional shape of a parabolic rotator having a vertical axis passing through the highest point of the molten solder as a rotation axis.