JP2002217219A - Method for manufacturing electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a mechanical joint between a connecting electrode of an electronic part and a conductor pattern of a mounting board to be improved in strength and stability through a simple process without having an adverse effect on the operation of the electronic part. SOLUTION: In a method for manufacturing the electronic device, the electronic part 13 and the mounting board 11 are arranged so as to make one side 13a of the electronic part 13 confront one side 11a of the mounting board 11, and the connecting electrode 14 of the electronic part 13 is electrically connected and mechanically joined to the conductor pattern 12 of the mounting board 11. Then, a resin film 15 is disposed on the electronic part 13 and the mounting board 11, and an ambient air is reduced in pressure, by which the resin film 15 is changed in shape so as to come into close contact with the side 13b of the electronic part 13 opposite to the mounting board 11 and one side 11a of the mounting board 11 around the electronic part 13. Next, the resin film 15 is bonded to the mounting board 11 by heating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic device including a mounting board and electronic components mounted on the mounting board.

[0002]

2. Description of the Related Art A surface acoustic wave device is one in which a comb-shaped electrode is formed on one surface of a piezoelectric substrate. This surface acoustic wave element is widely used as a filter in a mobile communication device such as a mobile phone.

[0003] By the way, electronic components such as semiconductor components are mounted on a mounting substrate, connection electrodes of the electronic component are electrically connected to conductor patterns of the mounting substrate, and connection electrodes of the electronic component are connected to the mounting substrate. Is often used in the form of a package having a structure in which an electrical connection with the conductive pattern is sealed. The same applies when the electronic component is a surface acoustic wave element. In the present application, a device including a mounting board and electronic components mounted on the mounting board is referred to as an electronic device.

In an electronic device, a method of electrically connecting a connection electrode of an electronic component to a conductor pattern of a mounting board is roughly divided into a method of arranging the electronic component such that a surface of the electronic component having the connection electrode faces the mounting board. Face-down bonding, and face-up bonding in which electronic components are arranged such that the surface of the electronic component having connection electrodes faces the opposite side to the mounting substrate. To reduce the size of electronic devices,
Face-down bonding is more advantageous.

In a conventional method of manufacturing an electronic device employing face-down bonding, a connection electrode of an electronic component is electrically connected to a conductor pattern of a mounting substrate, and then an underfill material is provided between the electronic component and the mounting substrate. To seal the electrical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.

However, when the electronic component is a surface acoustic wave device, there is a problem peculiar to the surface acoustic wave device, so that the above-described general method is not used. The problem peculiar to the surface acoustic wave element is that the surface acoustic wave element has a comb-shaped electrode formed on its surface, and the surface acoustic wave element is sealed so that foreign substances such as moisture and dust do not adhere to the comb-shaped electrode. On the other hand, it is necessary to prevent sealing resin or the like from contacting the surface acoustic wave propagation region on the surface of the surface acoustic wave element so as not to affect the operation of the surface acoustic wave element. That is.

Therefore, conventionally, as a method of manufacturing an electronic device when the electronic component is a surface acoustic wave element,
For example, after the connection electrode of the surface acoustic wave element is electrically connected to the conductor pattern of the mounting board, the surface acoustic wave element is sealed with a structure such as a cap made of ceramic or metal. The method was used. As another method of manufacturing an electronic device when the electronic component is a surface acoustic wave element, after electrically connecting a connection electrode of the surface acoustic wave element and a conductor pattern of a mounting board, the periphery of the surface acoustic wave element is removed. There is a method in which sealing is performed by surrounding with a sidefill material.

[0008]

In a method of manufacturing an electronic device in which an electronic component is a surface acoustic wave element, a method of enclosing a surface acoustic wave element with a structure such as a cap and sealing the electronic device is not an electronic device. There is a problem that it is difficult to reduce the size of the device. Further, in this method, the structure does not contribute to mechanical joining between the connection electrode of the surface acoustic wave element and the conductor pattern of the mounting board. However, there is a problem that it is not possible to improve the mechanical joining strength and joining stability of the above.

In the method of manufacturing an electronic device in the case where the electronic component is a surface acoustic wave element, the method of enclosing the surface acoustic wave element with a sidefill material and sealing the surface acoustic wave element includes:
There is a problem that the sidefill material may enter the surface acoustic wave propagation region on the surface of the surface acoustic wave element.

In addition to the surface acoustic wave element, even when the electronic component is a vibrator or a high-frequency circuit component, if the sealing resin or the like contacts the surface of the electronic component, the operation of the electronic component is affected. There is. Therefore, the above problem is not limited to the case where the electronic component is a surface acoustic wave element, but also applies, for example, to the case where the electronic component is a vibrator or a high-frequency circuit component.

The present invention has been made in view of the above problems, and a first object of the present invention is to provide a method of manufacturing an electronic device including a mounting board and electronic components mounted on the mounting board. Improved the strength of mechanical bonding and the stability of bonding between the connection electrodes of electronic components and the conductor pattern of the mounting board without affecting the operation of the electronic components in a simple process. An object of the present invention is to provide a method for manufacturing an electronic device.

A second object of the present invention, in addition to the first object, is to provide an electronic device capable of sealing an electronic component by a simple process without affecting the operation of the electronic component. It is to provide a manufacturing method of.

[0013]

According to a method of manufacturing an electronic device of the present invention, a mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface are provided. A method for manufacturing an electronic device comprising: an electronic component disposed so as to face one surface of a mounting substrate, and a connection electrode electrically connected to a conductor pattern of the mounting substrate and mechanically bonded thereto. Disposing the electronic component and the mounting substrate such that one surface of the electronic component faces one surface of the mounting substrate, electrically connecting a connection electrode of the electronic component to a conductor pattern of the mounting substrate, and mechanically Bonding the resin film to the electronic component and the mounting board, and arranging the resin film so as to cover the electronic component and the mounting board. A step of changing the shape of the resin film so as to cover the electronic component and the mounting board in close contact with the surface on the side opposite to the mounting substrate and one surface of the mounting board in a peripheral portion of the electronic component; Bonding to a mounting substrate.

In the method of manufacturing an electronic device according to the present invention, the resin film is provided so that the resin film is in close contact with a surface of the electronic component opposite to the mounting substrate and one surface of the mounting substrate in a peripheral portion of the electronic component. And covers the mounting board and is bonded to the mounting board. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board.

In the method of manufacturing an electronic device according to the present invention, the resin film may seal the electronic component. In the method of manufacturing an electronic device according to the present invention, a space may be formed between one surface of the electronic component and one surface of the mounting board.

In the method of manufacturing an electronic device according to the present invention, the step of bonding the resin film includes heating the resin film so that the resin film has fluidity, and then curing the resin film. The film may be bonded to the mounting substrate.

In the method of manufacturing an electronic device according to the present invention, the step of changing the shape of the resin film may include changing the shape of the resin film while the resin film is softened.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. First, a configuration of an electronic device to which an embodiment of the present invention is applied will be described with reference to FIG. Electronic device 10 in the present embodiment
Is a conductor pattern 12 exposed on one surface 11a.
And a connection electrode 14 on one surface 13a. The surface 13a having the connection electrode 14 is disposed so as to face the one surface 11a of the mounting substrate 11, and the connection electrode 14 is mounted on the mounting substrate 11. Electronic component 13 electrically connected to and mechanically joined to the conductor pattern 12
And the surface 13b of the electronic component 13 on the side opposite to the mounting substrate 11
And a resin film 15 that covers the electronic component 13 and the mounting substrate 11 so as to be in close contact with one surface 11a of the mounting substrate 11 in a peripheral portion of the electronic component 13, and is bonded to the mounting substrate 11.

The mounting substrate 11 is formed of glass, resin, ceramic, or the like. The electronic component 13 is, for example, a surface acoustic wave element, a vibrator, a high-frequency circuit component, or the like, but may be another electronic component. As described above, the electronic component 13 has the surface 13 a having the connection electrode 14 on the mounting substrate 1.
1 is mounted on the mounting board 11 by face-down bonding arranged so as to face. Electronic component 1
A space 16 is formed between one surface 13 a of the mounting substrate 3 and one surface 11 a of the mounting board 11.

The surface 13 b of the electronic component 13 on the side opposite to the mounting board 11 is covered with the resin film 15 without any gap. A part around the electronic component 13 on one surface 11a of the mounting substrate 11 is also covered with the resin film 15 without any gap. In addition, the resin film 15 includes the connection electrode 14 of the electronic component 13 and the conductor pattern 1 of the mounting board 11.
The entire electronic component 13 is sealed, including the portion electrically connected to the electronic component 2.

The resin film 15 is made of, for example, a thermosetting resin such as an epoxy resin. The thickness of the resin film 15 is, for example, 50 to 150 μm.

Next, an outline of a method of manufacturing the electronic device 10 according to the present embodiment will be described. The method of manufacturing the electronic device 10 is such that the electronic component 13 has one surface 13 a facing the one surface 11 a of the mounting substrate 11.
And the mounting board 11 are arranged, and the connection electrodes 1 of the electronic component 13 are arranged.
Electrically connecting the substrate 4 to the conductor pattern 12 of the mounting substrate 11 and mechanically joining the same, and mounting the substrate 13 on the surface 13 b of the electronic component 13 on the side opposite to the mounting substrate 11 and on the peripheral portion of the electronic component 13. A resin film 15 is disposed so as to cover the electronic component 13 and the mounting substrate 11 in close contact with one surface 11a of the first substrate 11 and adhere the resin film 15 to the mounting substrate 11.

Next, an example of the characteristics of the resin film 15 used in the present embodiment will be conceptually described with reference to FIG. In FIG. 2, white circles and solid lines indicate the correspondence between the temperature of the resin film 15 and the length in an arbitrary direction. In FIG. 2, black circles and broken lines indicate BT for comparison with the characteristics of the resin film 15.
(Bismaleimide triazine) Shows the correspondence between the temperature and the length in an arbitrary direction in a resin whose shape is stable against a temperature change such as a resin. As shown by reference numeral 110, the length of the resin whose shape is stable with respect to the temperature change changes almost linearly with the temperature change.

The resin film 15 maintains its film shape when its temperature is room temperature (room temperature) RT. As indicated by reference numeral 101, when the temperature of the resin film 15 is increased from the room temperature RT to the glass transition temperature TG, the resin film 15 gradually softens and changes in length almost linearly with the temperature change. Inflate to do. Code 10
As shown by 2, as the temperature of the resin film 15 is raised from the glass transition temperature TG to the curing start temperature HT, the resin film 15 becomes fluid and expands rapidly. As indicated by reference numeral 103, when the temperature of the resin film 15 is equal to or higher than the curing start temperature HT, the resin film 15 starts to cure. When the curing of the resin film 15 is completed, the resin film 15 contracts as indicated by reference numeral 104. At this time, a force in the contracting direction (hereinafter, referred to as a contracting force) is generated in the resin film 15. After the curing of the resin film 15 is completed, as indicated by reference numeral 105, the resin film 15
The shape is stable against temperature changes without softening or fluidity. The curing start temperature HT varies depending on the characteristics of the resin film 15;
The temperature is about 00 ° C., which is around 150 ° C. in the case of the resin film 15 formed using an epoxy resin. Also,
The time required from the start of the curing of the resin film 15 to the end of the curing also varies depending on the characteristics of the resin film 15.

The characteristics of the resin film 15 shown in FIG. 2 are conceptual only. So, for example,
If the amount of temperature change per unit time changes, resin film 1
5 also changes.

In the method of manufacturing the electronic device 10 according to the present embodiment, for example, when the temperature of the resin film 15 is raised and the resin film 15 is softened, the resin film 15 The shape of the resin film 15 is changed so that the opposite surface 13b and the one surface 11a of the mounting substrate 11 in the peripheral portion of the electronic component 13 are uniformly adhered to cover the electronic component 13 and the mounting substrate 11. Thereafter, the temperature of the resin film 15 is further increased,
After the resin film 15 is made to have fluidity, the resin film 15 is cured, so that the resin film 15 is adhered to the mounting substrate 11 and the resin film 1 is cured.
5 is fixed. When the resin film 15 is cured, a contraction force is generated as described above. The contraction force of the resin film 15 acts so as to press the electronic component 13 against the mounting board 11 side. Thereby, the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 is more reliably reinforced. In addition, since the resin film 15 contracts, the resin film 15 comes into close contact with the electronic component 13 and the mounting board 11.

If the resin film 15 has sufficient flexibility even at room temperature, the resin film
5 may be deformed to determine its shape, and then the resin film 15 may be cured by increasing the temperature of the resin film 15.

In a state where the resin film 15 is softened at a temperature equal to or lower than the glass transition temperature, the resin film 1
After determining the shape of the resin film 5, the resin film 15 may be cured over a relatively long time at a temperature equal to or lower than the glass transition temperature.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

When the resin film 15 is formed of a resin that is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 to cure the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

In the present embodiment, the connection electrode 14 of the electronic component 13 and the conductor pattern 1 of the mounting board 11 are used.
Various methods can be used as the method of electrical connection and mechanical joining with the second. Hereinafter, several examples of a method of electrical connection and mechanical bonding (hereinafter, simply referred to as a bonding method) between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 will be described.

First, an example of a conventional bonding method will be described with reference to FIGS. 3 to 5 for comparison with the present embodiment. 3 to 5, the electrical connection and the mechanical connection between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 are illustrated larger than other portions.

In the example shown in FIG. 3, a bump 14A made of, for example, gold and connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14A and the connecting portion 12A are metal-bonded, so that the bump 14A and the connecting portion 12A
Are electrically connected and mechanically joined.

In the example shown in FIG. 4, a bump 14B made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bump 14B and the connecting portion 12A
It is electrically connected by the conductive paste 18. Thereafter, an underfill material 19 is filled between the electronic component 13 and the mounting board 11, and the mechanical bonding of the bump 14B, the conductive paste 18, and the connection portion 12A is stabilized by the contraction force of the underfill material 19. Is secured.

In the example shown in FIG. 5, a bump 14A made of, for example, gold connected to the conductor pattern 17 of the electronic component 13 is provided as the connection electrode 14 of the electronic component 13. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. In this example, the bumps 14A and the connection portions 12A are arranged so as to be in contact with each other, whereby the bumps 14A
And the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the joining paste 20.
A mechanical connection with A is stably ensured.

Next, an example of a joining method according to the present embodiment will be described with reference to FIGS. In addition,
6 to 8, the portions of the electrical connection and the mechanical connection between the connection electrodes 14 of the electronic component 13 and the conductor patterns 12 of the mounting board 11 are drawn larger than other portions.

In the example shown in FIG. 6, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are metal-joined, whereby the bump 14A and the connecting portion 12A are electrically connected and mechanically joined. In this example, the resin film 15 of the present embodiment is further provided. Then, the bumps 14A and the connection portions 12 are formed by the contraction force of the resin film 15.
The mechanical connection with A is reinforced.

In the example shown in FIG. 7, as in the example shown in FIG.
A bump 14B made of, for example, gold, which is connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14B and the connection portion 12A are electrically connected by the conductive paste 18. In this example, the resin film 15 of the present embodiment is further provided. Then, without using the underfill material 19, mechanical contraction of the bump 14 </ b> B, the conductive paste 18, and the connection part 12 </ b> A is stably secured by the contraction force of the resin film 15.

In the example shown in FIG. 8, as in the example shown in FIG.
A bump 14A made of, for example, gold and connected to the third conductor pattern 17 is provided. On the other hand, on the mounting substrate 11 side, a connection portion 12A made of, for example, gold, which is a part of the conductor pattern 12, is provided. The bump 14A and the connecting portion 12A are arranged so as to be in contact with each other,
The bump 14A and the connection portion 12A are electrically connected. A non-conductive or anisotropic conductive bonding paste 20 is injected between the electronic component 13 and the mounting substrate 11 around the bumps 14A and the connection portions 12A. Then, the bumps 14A are formed by the contraction force of the joining paste 20.
Mechanical connection between the wire and the connecting portion 12A is stably secured.
In this example, the resin film 15 of the present embodiment is further provided. And this resin film 15
, The mechanical joining between the bump 14A and the connecting portion 12A is reinforced.

The joining method in the present embodiment is as follows.
The bonding method is not limited to those shown in FIGS. 6 to 8, and most of the conventional bonding methods in face-down bonding can be used.

Next, an example of the surface acoustic wave element 13A as the electronic component 13 will be described with reference to FIG. The surface acoustic wave element 13A shown in FIG.
Comb-shaped electrode 22 formed on one surface of this piezoelectric substrate 21
And a conductor pattern 23 and a connection electrode 24 formed at an end of the conductor pattern 23. Connection electrode 24
Corresponds to the connection electrode 14 in FIG. The surface acoustic wave element 13A is an element that uses a surface acoustic wave generated by the comb-shaped electrode 22 for a basic operation, and has a function as a bandpass filter in the present embodiment.

In FIG. 9, the connection electrode 24 with the symbol “IN” is an input terminal, the connection electrode 24 with the symbol “OUT” is an output terminal, and the connection electrode 24 with the symbol “GND” is This is a ground terminal. Also, in FIG.
An area surrounded by a broken line indicated by reference numeral 25 is an area including the surface acoustic wave propagation area and in which it is necessary to prevent a sealing material or the like from entering inside.

Next, a method for manufacturing the electronic device 10 according to the present embodiment will be described in detail with reference to FIGS. In the present embodiment, the electronic devices 10 may be manufactured one by one, or a plurality of electronic devices 10 may be manufactured simultaneously. Hereinafter, a case where a plurality of electronic devices 10 are manufactured at the same time will be described.

In the method of manufacturing an electronic device according to the present embodiment, first, as shown in FIG. 10, mounting is performed such that one surface 13a of the electronic component 13 faces one surface 11a of the mounting substrate 11. The electronic component 13 is arranged on the substrate 11, and the connection electrodes 14 of the electronic component 13 are electrically connected to the conductor pattern 12 of the mounting substrate 11 and mechanically joined. next,
A resin film 15 having a substantially same planar shape as the shape of one surface 11a of the mounting board 11 is disposed so as to cover the electronic component 13 and the mounting board 11.

The mounting substrate 11 in FIG. 10 includes portions corresponding to the plurality of electronic components 13.
Then, a plurality of electronic components 13 are mounted on the mounting board 11.
Is arranged.

Next, as shown in FIG. 11, the resin film 15 is heated so that the resin film 15 is softened.
By decompressing the gas around 5, a part of the gas in the cavity formed between the resin film 15 and the mounting board 11 is removed, and the resin film 15 is opposite to the mounting board 11 of the electronic component 13. The shape of the resin film 15 is changed so that the electronic component 13 and the mounting board 11 are covered with the side surface 13b and the one side 11a of the mounting board 11 in the peripheral portion of the electronic component 13. The gas here is
The air, nitrogen gas, inert gas, and the like vary depending on the atmosphere in which the treatment is performed. At this time, the temperature of the resin film 15 is set to be lower than the temperature at which the resin film 15 cures.

When the resin film 15 is formed of a resin that is softened by ultraviolet rays, instead of raising the temperature of the resin film 15 to soften the resin film 15, the resin film 15 is irradiated with ultraviolet rays to be softened. The film 15 may be softened. Alternatively, the resin film 15 may be softened by irradiating the resin film 15 with ultraviolet rays while increasing the temperature of the resin film 15.

As described above, the mounting substrate 11, the electronic component 13
By changing the shape of the resin film 15 by reducing the pressure of the gas around the resin film 15, the shape of the resin film 15 can be easily determined. Further, by changing the shape of the resin film 15 in a state where the resin film 15 is softened, the shape of the resin film 15 can be more easily determined.
When the resin film 15 has sufficient flexibility even at room temperature, the shape of the resin film 15 may be changed only by the above-described reduced pressure without heating the resin film 15.

In this embodiment, a heating furnace 32 capable of reducing the pressure is used as a means for heating the resin film 15 and a means for reducing the pressure of the gas around the mounting substrate 11 and the like. However, other means may be used as the means for heating or the means for reducing pressure. The heating furnace 32 has a heater 33 on which the mounting substrate 11 is placed. The heater 33 heats the mounting board 11 and the resin film 15. Heating furnace 32
When the inside gas is discharged and the inside of the heating furnace 32 is decompressed, a part of the gas in the cavity between the resin film 15 and the mounting substrate 11 escapes outside the cavity.

Next, as shown in FIG.
3, the mounting substrate 11 and the resin film 15 are heated so that the temperature of the resin film 15 is equal to or higher than the temperature at which the resin film 15 is cured. Thereby, the resin film 15
Is made to have fluidity, and then cured to bond the resin film 15 to the mounting substrate 11 and fix the shape of the resin film 15. When the temperature of the mounting substrate 11 and the resin film 15 is returned to normal temperature, the temperature of the gas in the cavity formed between the resin film 15 and the mounting substrate 11 decreases, so that the pressure of the gas in the cavity decreases. .

When the resin film 15 is formed of a resin which is cured by ultraviolet rays, instead of raising the temperature of the resin film 15 and curing the resin film 15, the resin film 15 is irradiated with ultraviolet rays to cure the resin film 15. The film 15 may be cured. Alternatively, the resin film 15 may be cured by increasing the temperature of the resin film 15 and irradiating the resin film 15 with ultraviolet rays.

Next, as shown in FIG. 13, the mounting substrate 11 and the resin film 1 are cut at the cutting position indicated by reference numeral 41.
5 are cut to complete the individual electronic devices 10. Figure 1
4 is the mounting substrate 1 before the cutting step shown in FIG.
1 is a plan view showing an electronic component 13 and a resin film 15. The manufacturing method for manufacturing the electronic device 10 one by one includes the mounting substrate 11 and the resin film 1 described above.
This is the same as the case where a plurality of electronic devices 10 are manufactured at the same time, except that the step of cutting 5 is unnecessary.

As described above, in the method of manufacturing the electronic device 10 according to the present embodiment, the resin film 15 is formed so that the surface 13 b of the electronic component 13 on the opposite side to the mounting substrate 11 and the peripheral portion of the electronic component 13 are formed. The electronic component 13 and the mounting substrate 11 are covered so as to be in close contact with one surface 11a of the mounting substrate 11 in the above, and are adhered to the mounting substrate 11. The connection film 1 of the electronic component 13 is formed by the resin film 15.
4 and the conductive pattern 12 of the mounting board 11 are reinforced mechanically. In the present embodiment, the electronic component 13
The underfill material is not filled between the substrate and the mounting substrate 11. Therefore, according to the present embodiment, the mechanical structure between the connection electrode 14 of the electronic component 13 and the conductor pattern 12 of the mounting board 11 can be achieved with a simple configuration and a simple process without affecting the operation of the electronic component 13. It is possible to improve the bonding strength and the bonding stability.

Particularly, in the step of bonding the resin film 15, the resin film 15 is heated to
When the resin film 15 is adhered to the mounting substrate 11 by curing the resin film 15 after the resin film 5 has fluidity, the resin film 15
Of the connection electrode 14 of the electronic component 13 due to the shrinkage force of the
It is possible to more reliably improve the strength of mechanical joining and the stability of joining between the conductive pattern 12 and the conductive pattern 12 of the mounting board 11.

In the present embodiment, the mounting substrate 11
The shape of the resin film 15 is changed by reducing the pressure of the gas around the electronic component 13 and the resin film 15. Therefore, according to the present embodiment, the resin film 15 and the mounting substrate 11 are controlled by controlling the pressure reduction conditions.
By adjusting the amount of gas remaining in the cavity formed between the resin film 15 and the mounting substrate 11, the state of the cavity between the resin film 15 and the mounting board 11 can be stabilized.

The mounting substrate 11 and the resin film 1
The density of the gas in the cavity at the time of heating changes according to the temperature at the time of heating, and as a result, the amount of gas remaining in the cavity when the temperature of the mounting board 11 and the resin film 15 is returned to normal temperature. . Therefore, the amount of gas remaining in the cavity can be adjusted also by the temperature at the time of heating the mounting substrate 11 and the resin film 15.

Further, according to the present embodiment, since the electronic component 13 is sealed by the resin film 15, the operation of the electronic component 13 is not affected by the simple configuration and the simple process without affecting the operation of the electronic component 13. 13 can be sealed. Thereby, the resistance of the electronic device 10 to the environment and the like can be secured.

According to the present embodiment, the electronic component 1
Since the space 16 is formed between the one surface 13a of the electronic component 13 and the one surface 11a of the mounting board 11, the operation of the electronic component 13 is caused by the one surface 13a of the electronic component 13 coming into contact with another object. Can be prevented from being affected. This is particularly effective when the electronic component 13 is a surface acoustic wave element, a vibrator, or a high-frequency circuit component.

From the above, according to the present embodiment, the reliability of the electronic device 10 can be improved.
Further, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, compared to the case where the electronic component 13 is sealed using a structure such as a cap,
The electronic device 10 can be reduced in size, weight, and thickness.
In addition, according to the present embodiment, since the electronic component 13 is sealed using the resin film 15, the above-described respective effects can be obtained at low cost.

Note that the present invention is not limited to the above embodiment, and various modifications are possible. For example, resin film 1
In the case where the resin film 15 is heated and adhered to the mounting substrate 11, the gas around the mounting substrate 11 and the like is decompressed to change the shape of the resin film 15, and then the resin film 1 is kept decompressed.
5 may be heated and adhered to the mounting substrate 11.

[0061]

As described above, claims 1 to 5
In the method for manufacturing an electronic device according to any one of the above, the resin film is provided so that the electronic component is in close contact with a surface of the electronic component opposite to the mounting substrate and one surface of the mounting substrate in a peripheral portion of the electronic component. And covers the mounting board and is bonded to the mounting board. The resin film reinforces the mechanical connection between the connection electrode of the electronic component and the conductor pattern of the mounting board. Therefore, according to the present invention, the strength of mechanical bonding and the stability of bonding between the connection electrode of the electronic component and the conductor pattern of the mounting board can be improved in a simple process without affecting the operation of the electronic component. Is achieved. Further, in the present invention, the pressure of the gas around the mounting substrate, the electronic component and the resin film is reduced, so that the resin film is formed on one side of the surface of the electronic component on the side opposite to the mounting substrate and the peripheral portion of the electronic component. The shape of the resin film is changed so as to adhere to the surface of the electronic component and the mounting board. Therefore,
ADVANTAGE OF THE INVENTION According to this invention, there exists an effect that the shape of a resin film can be determined easily.

According to the method for manufacturing an electronic device according to the second aspect, the electronic component is sealed with the resin film, so that the operation of the electronic component can be easily performed without affecting the operation of the electronic component. This has the effect of being able to be sealed.

According to the method of manufacturing an electronic device according to the third aspect, a space is formed between one surface of the electronic component and one surface of the mounting board, so that one surface of the electronic component is formed. This has the effect that the operation of the electronic component can be prevented from being affected by contact with another object.

According to a fourth aspect of the present invention, in the step of bonding the resin film, the resin film is heated, so that the resin film has fluidity, and then the resin film is cured. As a result, the resin film is adhered to the mounting board, so that the mechanical bonding strength and the bonding stability between the connection electrode of the electronic component and the conductor pattern of the mounting board can be more reliably improved. It works.

According to the method of manufacturing an electronic device of the fifth aspect, the step of changing the shape of the resin film is such that the shape of the resin film is changed while the resin film is softened. There is an effect that the shape of the resin film can be more easily determined.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an electronic device to which an embodiment of the present invention is applied.

FIG. 2 is an explanatory view conceptually showing an example of characteristics of a resin film used in an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing an example of a conventional joining method for comparison with an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing another example of a conventional joining method for comparison with one embodiment of the present invention.

FIG. 5 is a cross-sectional view showing still another example of the conventional joining method for comparison with one embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating an example of a bonding method according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view showing another example of the bonding method according to the embodiment of the present invention.

FIG. 8 is a sectional view showing still another example of the joining method according to the embodiment of the present invention.

FIG. 9 is a plan view showing an example of a surface acoustic wave device as an electronic component according to one embodiment of the present invention.

FIG. 10 is an explanatory view showing one step in the method of manufacturing the electronic device according to the embodiment of the present invention.

FIG. 11 is an explanatory diagram showing a step that follows the step of FIG. 10;

FIG. 12 is an explanatory diagram showing a step that follows the step of FIG. 11;

FIG. 13 is an explanatory diagram showing a step that follows the step of FIG. 12;

FIG. 14 is a plan view showing a mounting board, electronic components, and a resin film before a cutting step shown in FIG. 13;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Electronic device, 11 ... Mounting board, 12 ... Conductor pattern, 13 ... Electronic component, 14 ... Connection electrode, 15 ... Resin film, 16 ... Space, 32 ... Heating furnace, 33 ... Heater.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Bunsaku Kurosawa 1-1-13 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation (72) Seiichi Tajima 1-13-1 Nihonbashi, Chuo-ku, Tokyo F-term in TDK Corporation (reference)

Claims (5)

[Claims] 1. A mounting substrate having a conductor pattern exposed on one surface and a connection electrode on one surface, and a surface having the connection electrode is arranged so as to face one surface of the mounting substrate. An electronic device manufacturing method, comprising: an electronic component in which the connection electrode is electrically connected to a conductor pattern of the mounting substrate and mechanically joined thereto, wherein one surface of the electronic component is the mounting substrate. Arranging the electronic component and the mounting board so as to face one surface of the electronic component, electrically connecting a connection electrode of the electronic component to a conductor pattern of the mounting board, and mechanically joining the connection electrodes; Disposing a resin film so as to cover the electronic component and the mounting board; and reducing the pressure of gas around the mounting board, the electronic component and the resin film, so that the resin film is Changing the shape of the resin film so as to cover the electronic component and the mounting board in close contact with the surface on the opposite side to the mounting substrate and one surface of the mounting substrate in a peripheral portion of the electronic component; Adhering a film to the mounting substrate. 2. The method according to claim 1, wherein the resin film seals the electronic component. 3. The method of manufacturing an electronic device according to claim 1, wherein a space is formed between one surface of the electronic component and one surface of the mounting board. 4. The step of bonding the resin film includes bonding the resin film to a mounting board by heating the resin film so that the resin film has fluidity and then curing the resin film. 4. The method for manufacturing an electronic device according to claim 1, wherein: 5. The electronic device according to claim 1, wherein in the step of changing the shape of the resin film, the shape of the resin film is changed while the resin film is softened. Device manufacturing method.