JP2002198699A - Component mounting method and device - Google Patents

Abstract

(57) [Summary] [Problem] To mount on a multiple-panel circuit board in a rational order not related to “circuit patterns not to be mounted”,
Reduce production tact. A discrimination mark identification unit includes a CCD camera.
07, a discrimination mark on the multi-circuit board is detected, and a “circuit pattern to be mounted” and a “circuit pattern not to be mounted” are determined on the circuit board based on the data of the mark library 140, and the mounting data management unit At 10,
Based on the data of the NC program 110, the array program 120, and the component library 130, the mounting order of the circuit patterns for mounting the components is set, and the mounting pattern data of the mounting data management unit 10 is used to determine the circuit pattern determination data by the discrimination mark recognition unit 11. In consideration of the above, the mounting order is rearranged for each circuit board to an optimal one that does not skip “circuit patterns not to be mounted”.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and apparatus for optimizing a mounting order for each section (referred to as a block or a circuit pattern to be a product) on a multi-circuit board (mother board). .

[0002]

2. Description of the Related Art An example of a conventional configuration of a component mounting apparatus will be described with reference to FIGS.

As shown in FIG. 6, an orthogonal table 102 for holding a circuit board and moving the circuit board in the X and Y directions to position the circuit board is disposed in the mounting apparatus. And an input device 101 such as a keyboard for inputting data, and a display unit 100 having a blank display screen for displaying the status of the device and the contents of the data. Further, on the right side, a component supply means 103 having a mechanism for continuously supplying components and having a structure detachable from the component mounting apparatus is arranged, and a component supply table for moving the component supply means 103 to a component suction position. 104 are provided. Further, a mounting head 105 for holding a component is arranged at the front of the orthogonal table 102. The mounting head 105 is provided with a plurality of nozzles capable of selecting an appropriate nozzle according to the component type and a mechanism for selecting the nozzle. ing. These mounting heads 105 are supported via a head moving unit 106, and the head moving unit 10
Reference numeral 6 has a mechanism for moving the mounting head 105 along the circumference from the component suction position to the component mounting position. The mounting head 10 is moved by the head moving unit 106.
The mounting component is sucked from the supply table 104 via the nozzle No. 5 and mounted on the mounting position on the circuit board held by the orthogonal table 102. Further, a two-dimensional CCD camera 107 is arranged in the head moving unit 106, and the CCD camera 10
7, the discrimination mark given in advance on the circuit board is recognized, and the "section to be mounted (hereinafter referred to as a circuit pattern)" and the "circuit pattern not to be mounted" on the circuit board are determined based on the discrimination mark.

[0004] Here, the “circuit pattern not to be mounted” is a multi-panel board on which a plurality of circuits of the same pattern are arranged, and a specific circuit pattern determined to be defective in an inspection in an upstream process or a different product pattern. In a form in which the same product is randomly produced, the same product is created as the same circuit pattern on a program, and the discrimination mark on the circuit board indicates a circuit pattern that does not require mounting.

FIG. 7 shows an NC program 110 that defines the order of mounting components and the supply position of the mounted components.
The NC program 110 includes a block 111 indicating a mounting order by a number, a mounting coordinate 112 defining a mounting position of each block 111 by two-dimensional XY coordinates, and a component supply position of each block 111 in FIG. Z number 113 defined by the number indicating the position of the supply table 104 of
A multi-chamfer circuit pattern definition section 114 for defining the mounting method of the multi-chamfer section and defining the position of each circuit pattern viewed from the first circuit pattern in the mounting coordinates of the block 111; Mark defining unit 11 for defining the type and position of the distinguishing mark to be defined
5 is provided.

FIG. 8 shows an array program 120 that defines the supply position of the component to be mounted and the type of the component to be supplied. This array program has a Z number 121 corresponding to the NC program and a component shape code 122 which is a character string for uniquely identifying the type of the mounted component.

FIG. 9 shows a component library 130 that defines the type, shape, and supply method based on the electrical characteristics of the mounted component for each type of mounted component. The component library 130 includes a component shape code 13 for uniquely identifying the type of the mounted component corresponding to the component shape code 122 in the array program.
1 and component attribute data 132 defining the dimensions of the mounted component
And operating condition data 133 that defines the speed of the mounting head 105, the speed of the orthogonal table 102, the type of nozzle to be used, and the like when sucking and mounting the mounted components of the mounting apparatus
And supply condition data 134 that defines the type of the component supply means 103 of the mounting apparatus.

FIG. 10 shows a mark library 140 which stores image data when a discrimination mark is recognized by the CCD camera 107 of the mounting apparatus for each discrimination mark type. The mark library 140 includes a mark shape code 141 for uniquely identifying the type of a discrimination mark and a luminance level at the time of discrimination of the discrimination mark, corresponding to the mark type defined in the discrimination mark definition unit 115 of the NC program 110. And recognition data 142 defined as image data (binary data). It should be noted that the image data 142 is obtained by actually setting the discrimination mark on the circuit board
The data recognized by the CD camera 107 and the information obtained at that time is stored.

In the conventional component mounting apparatus configured as described above, it is necessary to determine “circuit patterns to be mounted” and “circuit patterns not to be mounted” on the mounting board by using the discrimination marks on the circuit board. Data creation method,
6 and FIGS. 11 and 12 show actual mounting operations.
It will be described based on.

FIG. 11 is a data creation flowchart showing a data creation procedure for treating a specific defective board as a “circuit pattern not to be mounted” by a discrimination mark on the circuit board in a multiple board.

First, a mounting order and a mounting position for mounting one circuit pattern in the NC program 110 are defined (step S50). Next, NC program 110
The mounting order and the position of each circuit pattern viewed from the first circuit pattern are defined for each circuit pattern based on the multiple circuit pattern definition unit 113 shown in FIG. Next, the discriminating circuit pattern definition unit 11 of the NC program 110
As shown in FIG. 4, the types and positions of the discrimination marks corresponding to the respective circuit patterns are defined (step S52).
Further, according to the definition of the multiple patterning circuit pattern, all mounting coordinates on the mounting board are calculated by (position of the first circuit pattern) +
The position is calculated by (position of each circuit pattern) + (mounting position), and the mounting order is determined (step S53).

[0012] The mounting order is such that after completing the mounting of one circuit pattern, a multiple patterning such as a circuit pattern repeat for mounting the next circuit pattern or a step repeat for mounting the same mounting coordinates first between the circuit patterns. It is determined by the type of circuit pattern definition.

FIG. 12 is a flowchart for a mounting specification procedure showing a procedure for specifying a mounting position by recognizing a discrimination mark during production of a circuit board. First, a circuit board is loaded into the orthogonal table 102 from the upstream process (Step S6).
0). Next, the orthogonal table 102 is positioned so that the discrimination mark of the first circuit pattern on the circuit board is located at the center of the CCD camera 107 (step S61). Then, the discrimination mark is recognized by the CCD camera 107 at that position (step S62), and the mark library 140 is previously determined.
If the data matches the image data of the mark library 141 registered in the memory, it is determined that the circuit pattern is a non-defective circuit pattern and is set as a mounting target (step S63). If they do not match, it is determined that the circuit pattern is a defective product, and is not mounted (step S64).

This is repeated for the number of circuit patterns for the discrimination marks for each circuit pattern (step S65).
Next, in the mounting order determined in step S53 of the data creation flowchart, mounting is performed in order while skipping blocks belonging to the circuit pattern determined not to be mounted in step S64 (step S66). After completing the mounting of all the circuit patterns targeted for mounting,
The circuit board is carried out to a downstream process (Step S67).

[0015]

However, in the above mounting method, even when the “circuit pattern not to be mounted” is different for each circuit board, the mounting order is not changed only by skipping the mounting of the circuit pattern, and The table 102 is moved, and the “circuit pattern not to be mounted” passes below the mounting head 107. Therefore,
Depending on the arrangement of “circuit patterns not to be mounted”,
Since the orthogonal table performs a useless operation, there is a problem that production tact is reduced.

The present invention provides a component mounting method and apparatus which solves the conventional problem and eliminates useless operation of the orthogonal table and improves production tact.

[0017]

According to a first aspect of the present invention, there is provided a component mounting method, comprising the steps of: identifying a discrimination mark on a multi-panel circuit board; Create section determination data that determines sections not to be mounted, NC data that defines the mounting position for each mounted component, mounting order, and array data that defines the component supply position, and the component data for each type of mounted component. From the component data defining the shape and component attributes, mounting order data for mounting the mounted components in the section to be mounted is created, and the circuit board 1
The mounting order is rearranged for each card.

According to a third aspect of the present invention, there is provided the component mounting apparatus, wherein the detecting means identifies the discrimination mark on the circuit board, and outputs the section determination data for determining the section to be mounted on the circuit board and the section not to be mounted on the circuit board. A discrimination mark recognition unit to be created;
From the NC data that defines the mounting position and mounting order for each mounted component, the array data that defines the component supply position, and the component data that defines the component shape and component attributes for each type of mounted component, A mounting data management unit that creates mounting order data for mounting the mounting components in the section to be mounted; and a mounting order optimization unit that rearranges the mounting order for each circuit board in consideration of the section determination data in the mounting order data. It is provided with.

According to the first or third aspect of the present invention, for each circuit board, a discrimination mark attached to the circuit board is identified, a section not to be mounted is identified, and a mounting order of the circuit pattern is determined. The mounting order is rearranged so that the mounting can be performed in a reasonable order so that mounting can be performed continuously without waste, excluding sections not to be mounted, so that mounting should be performed in an appropriate mounting order according to the circuit board Can be. As a result, the advantageous effect of improving the production tact and improving the line operation rate can be obtained.

According to a second aspect of the present invention, in the component mounting method, in an upstream process of the mounting process, external partition determination data is created for each circuit board by determining a partition to be mounted and a partition not to be mounted. From the mounting data for each mounted component, the NC data defining the mounting order, and the array data defining the component supply position, and the component data defining the component shape and component attributes for each type of mounted component are determined as mounting targets. Create mounting order data to mount the mounted components in the section,
In consideration of the external partition determination data in the mounting order data,
The mounting order is rearranged for each circuit board.

Further, in the component mounting apparatus according to the fourth aspect, in the upstream process of the mounting process, the external partition determination data for determining the partition to be mounted and the partition not to be mounted for each circuit board is provided. NC data for defining an external section discriminating means to be created, a mounting position and a mounting order for each mounting component,
From the array data that defines the component supply position and the component data that defines the component shape and component attributes for each type of mounted component, the mounting order that creates the mounting order data for mounting the mounted component in the section where the component is to be mounted A data management unit; and a mounting order optimizing unit that rearranges the mounting order for each circuit board in consideration of the external partition determination data in the mounting order data.

According to the second or fourth aspect of the present invention, in addition to the function and effect of the first or third aspect, information on a circuit pattern serving as an information source for optimizing a mounting order is obtained in an upstream process, By performing optimization before carrying in the substrate, the recognition time of the discrimination mark can be omitted, and the production tact can be shortened.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a component mounting apparatus according to the present invention will be described below with reference to FIGS. The constituent members in the drawings and the description shown in the conventional example including FIG. 10 are denoted by the same reference numerals, and the description is omitted.

FIG. 1 is a block diagram showing the structure of a data processing unit in the control device of the component mounting apparatus. A mounting data management unit 10 for holding and setting the mounting order and mounting position for each mounted component is provided. The management unit 10 includes an NC program 110 that defines the order in which components are mounted and a supply position of components to be mounted, an array program 120 that defines a supply position of components to be mounted and the type of mounted components to be supplied, It has a component library 130 that defines the type, shape, and supply method according to the electrical characteristics of the mounted components for each type.

The discrimination mark recognition section 11 has a CCD camera (detection means) 107, an image processing section 21, and a mark library 140. Then, the “circuit pattern (section, block) to be mounted” and the “circuit pattern (section, block) not to be mounted” are determined based on the plurality of determination marks on the circuit board, and the information is determined by the mounting data management unit. 10 has the function of notifying. Further, the mounting order optimizing unit 12 rearranges the mounting order of the circuit patterns based on the recognition result of the discrimination mark recognition unit 11 so that the production tact is the shortest for the “circuit pattern to be mounted”, and manages the mounting data. It has a function of re-registering in the unit 10. Further, the mounting operation unit 13 includes the mounting order optimizing unit 12
Has a function of mounting components in the order based on the result.

FIG. 2 is a flowchart showing a data processing procedure according to the present invention. First, a circuit board is loaded into the orthogonal table 102 from the upstream process (Step S20). Next, the determination mark of the first circuit pattern on the circuit board is the CCD
The orthogonal table 102 is positioned so as to be located at the center of the field of view (image) of the camera 107 (step S21). At this position, the discrimination mark is recognized by the CCD camera 107 (step S22). If the discrimination mark matches the image data registered in the mark library 140 in advance, it is determined that the circuit pattern is a non-defective circuit pattern and " The target circuit pattern is determined (step S23).
If they do not match, it is determined to be a defective circuit pattern,
It is determined as "a circuit pattern not to be mounted" (step S24). This is repeated for the number of circuit patterns for the discrimination marks for each circuit pattern (step S25).
Next, the mounting order is optimized by the mounting order optimizing unit 12 with the “circuit pattern not to be mounted” removed (step S26). The optimization of the mounting order is to stop the mounting operation by operating the orthogonal table 102 so that the mounting head 105 does not skip as much as possible on the “circuit pattern not to be mounted” for each circuit board. The orthogonal table 102 is formed in such a manner that the circuit pattern to be mounted does not remain at a distance from the mounting head 105 at the end and is a reasonable shortest path in consideration of the entire circuit board. Move
This is to reduce useless operation as much as possible. The operation signal is output to the mounting operation unit 13 and mounted in the order (step S27). After all mounting is completed, the circuit board is carried out to the downstream process (Step S28).

FIG. 3 shows an embodiment when the mounting order is optimized. In this example, for the sake of simplicity, the mounting of one circuit pattern is completed, and then the mounting of the next circuit pattern is performed.

FIG. 3 (a) shows the mounting order in the case where all the circuit patterns are the "circuit patterns to be mounted" on the 9-chamfered circuit board 31, which is the same as the conventional mounting order. The mounting work is sequentially performed according to the arrows up to the arrow.

FIG. 3B shows a case where there is a circuit pattern e which is not to be mounted. Conventionally, similarly to FIG. 3A, the circuit pattern e is skipped and mounted below the mounting head 105 without mounting. Is passed, and the next circuit pattern f is mounted. By optimizing the mounting order, after the circuit patterns a, b, c, and d are completed, the circuit pattern is moved to the circuit pattern i adjacent to the circuit pattern d. The mounting is performed continuously, and then the mounting order is rearranged in the order of the circuit patterns h, g, and f.
By eliminating one useless mounting operation and reducing one operation stroke, mounting tact can be improved.

In the above-described embodiment, the CCD camera 107 recognizes the discrimination mark on the circuit board and discriminates between “circuit pattern to be mounted” and “circuit pattern not to be mounted”. Instead of 107, the discrimination mark can be detected and identified using a dedicated sensor.

In the above embodiment, the discrimination mark on the circuit board is recognized by the CCD camera 107 attached to the component mounting apparatus shown in FIG. 10, and the "circuit pattern to be mounted" and the "circuit pattern not to be mounted" However, as shown in FIG. 4, in the upstream process from the mounting process, information on the circuit pattern to be mounted is obtained in advance by the external pattern determining unit 31, and is input via the external interface 32, and the circuit pattern is input. It is conceivable that the mounting order is optimized by the mounting order optimizing unit 12 based on the information before the substrate is carried in.

Further, in the above-described embodiment, the specification of the "circuit pattern not to be mounted" which has been determined to be defective in the inspection in the upstream process has been described with respect to the multiple board in which a plurality of the same circuit patterns are juxtaposed. Identify the discrimination marks on the circuit board, even for a multi-panel circuit board that randomly produces different products, and process the "circuit pattern to be mounted" as the same circuit pattern in the program even if the discrimination marks are different Thus, a “circuit pattern not to be mounted” can be specified.

Further, in the above-described embodiment, the component mounting apparatus including the head moving unit (rotary head) 106 and the orthogonal table 102 shown in FIG. 6 has been described, but the orthogonal mounting apparatus having the mounting head 42 as shown in FIG. Robot 4
1 and a component mounting apparatus having the orthogonal table 102.

[0034]

As described above, according to the first or third aspect of the present invention, for each circuit board, a discrimination mark attached to the circuit board is identified, and a section not to be mounted is identified.
The circuit pattern mounting order is optimized so that mounting can be performed continuously without waste, except for sections not to be mounted, so that the mounting order can be optimized according to the circuit board. Can be implemented. As a result, the advantageous effect of improving the production tact and improving the line operation rate can be obtained.

According to the second or fourth aspect of the present invention, in addition to the function and effect of the first or third aspect, information on a circuit pattern serving as an information source for optimizing a mounting order is acquired in an upstream process. By performing the optimization before loading the circuit board, the recognition time of the identification mark can be omitted, and the production tact can be shortened.

[Brief description of the drawings]

FIG. 1 is a configuration diagram illustrating an embodiment of a component mounting apparatus according to the present invention and illustrating a data processing unit of a control device.

FIG. 2 is a flowchart illustrating a mounting operation in the component mounting apparatus.

3 (a) and 3 (b) each show an embodiment of a mounting order, FIG. 3 (a) is an explanatory diagram showing a mounting order of a substrate circuit having no circuit pattern not to be mounted, and FIG. 3 (b) performs optimization FIG. 5 is an explanatory view showing a mounting order of the circuit boards.

FIG. 4 is a configuration diagram illustrating another embodiment of the component mounting apparatus according to the present invention and illustrating a data processing unit of the control device.

FIG. 5 is a perspective view showing another embodiment of the component mounting apparatus according to the present invention.

FIG. 6 is a perspective view showing an embodiment of a conventional (common to the present invention) component mounting apparatus.

FIG. 7 is an explanatory diagram showing a data structure of a conventional (common to the present invention) NC program.

FIG. 8 is an explanatory diagram showing a data structure of a conventional (common to the present invention) array program.

FIG. 9 is an explanatory diagram showing a data structure of a conventional (common to the present invention) component library.

FIG. 10 is an explanatory diagram showing a data structure of a conventional (common to the present invention) mark library.

FIG. 11 is a flowchart showing a conventional procedure for creating mounting data.

FIG. 12 is a flowchart showing a procedure for specifying a circuit pattern to be mounted in a conventional example.

[Explanation of symbols]

 Reference Signs List 10 mounting data management unit 11 discrimination mark recognition unit 12 mounting order optimizing unit 13 mounting operation unit 31 external circuit pattern discriminating means 41 orthogonal robot 42 mounting head 101 data input device 102 orthogonal table 103 component supply means 104 component supply table 105 mounting head 106 Head moving unit 107 CCD camera 110 NC program 120 Array program 130 Parts library 140 Mark library

Claims (4)

[Claims] 1. A section determination data for identifying a section to be mounted on a circuit board and a section not to be mounted on a circuit board by identifying a determination mark on a multi-panel circuit board, creating a mounting position for each mounting component, From the NC data that defines the mounting order, the array data that defines the component supply position, and the component data that defines the component shape and component attributes for each type of mounted component, mounting that mounts the mounted component in the section to be mounted A component mounting method comprising: creating order data; and rearranging a mounting order for each circuit board in consideration of section determination data in the mounting order data. 2. In an upstream process of a mounting process, external partition determination data is created for each circuit board in which a partition to be mounted and a partition not to be mounted are determined, and a mounting position and a mounting position for each mounting component are determined. From the NC data defining the order, the array data defining the component supply position, and the component data defining the component shape and component attributes for each type of mounted component, the mounting order for mounting the mounted components in the section to be mounted Create data, considering the external partition determination data in the mounting order data,
A component mounting method, wherein the mounting order is rearranged for each circuit board. 3. A discrimination mark recognizing unit for discriminating a discrimination mark on a circuit board by a detection means and creating section discrimination data for discriminating a section to be mounted and a section not to be mounted on the circuit board; A component is to be mounted based on NC data defining a mounting position and a mounting order for each component, and array data defining a component supply position, and component data defining a component shape and a component attribute for each type of mounted component. A mounting data management unit that creates mounting order data for mounting the mounting components in the sections, and a mounting order optimization unit that rearranges the mounting order for each circuit board in consideration of the section determination data in the mounting order data. A component mounting apparatus characterized by comprising: 4. An external section discriminating means for generating external section judgment data for discriminating a section to be mounted and a section not to be mounted for each circuit board in an upstream step of a mounting step; From the NC data that defines the mounting position, mounting order, and the array data that defines the component supply position, and the component data that defines the component shape and component attributes for each type of mounted component, A mounting data management unit that creates mounting order data for mounting the mounted components, and in consideration of external partition determination data in the mounting order data,
A component mounting apparatus, comprising: a mounting order optimizing unit that rearranges a mounting order for each circuit board.