JP2002189120A - Color filter substrate, method for manufacturing color filter substrate, and liquid crystal device - Google Patents

Abstract

(57) Abstract: The present invention reduces the cost of the color filter substrate and the cost of various devices using the color filter substrate by reducing the consumption of the material of the protective film constituting the color filter substrate. SOLUTION: A base material 2, a partitioning material 5 for partitioning the surface of the base material 2 into a plurality of regions, a color picture element 3 provided thinner than the partitioning material 5 in the plurality of regions, Protective film 4 provided on color picture element 3 with thickness not exceeding partition material 5
And a color filter substrate 1 having: Since the protective film 4 is formed in each area defined by the partitioning material 5 and is not formed over the entire surface of the substrate 2, the protective film 4 is formed.
Material consumption can be kept low.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a color filter substrate formed by forming a plurality of color picture elements such as R, G, B or C, M, Y on a substrate, and a method of manufacturing the same. The invention also relates to a liquid crystal device formed using the color filter substrate.

[0002]

2. Description of the Related Art In recent years, liquid crystal devices have been widely used in electronic devices such as portable telephones and portable personal computers. In addition, liquid crystal devices having a structure in which color display is performed using a color filter substrate have been widely used.

Conventionally, as a color filter substrate, for example, as shown in FIG. 18, R (red), G (red),
(Green) and B (blue) color picture elements 202R, 202
A configuration is known in which G and 202B are formed in a predetermined arrangement, for example, a stripe arrangement, a mosaic arrangement, a delta arrangement, and the like, and a protective film 203 is further formed thereon.

There are several possible reasons for forming the protective film 203. First, when the surface of the color filter substrate is flattened by forming a protective film, the electrode is prevented from being cut when the electrode is formed on the surface of the color filter substrate. Second, the contrast ratio between pixels is improved by lowering the resistance of the electrode on the protective film. Third, in order to prevent a pixel in the color filter substrate from being damaged in a step performed after formation of the protective film, that is, to perform a protective function. Fourth, when the color filter substrate is used in a liquid crystal device, after the liquid crystal is sealed in the cell gap, diffusion of impurities from the color filter substrate to the liquid crystal is prevented.

[0005]

The conventional protective film 203 on the color filter substrate is formed by forming a transparent resist or the like with a uniform thickness on the entire surface of the substrate 201, for example, by using a spin coating method to form a uniform thickness. In general, it was produced by forming the same. However, such a conventional method has a problem that it is uneconomical because a large amount of the protective film material is consumed.

The present invention has been made in view of the above problems, and reduces the consumption of the protective film material to reduce the cost of the color filter substrate and the cost of various devices using the color filter substrate. The purpose is to reduce.

[0007]

Means for Solving the Problems (1) In order to achieve the above object, a color filter substrate according to the present invention comprises: a base material; a partitioning material for partitioning the surface of the base material into a plurality of regions; A color picture element provided thinner than the partition material in a plurality of regions, and a protective film provided on the color picture elements in the plurality of regions with a thickness not exceeding the partition material. And

According to the color filter substrate having this configuration,
Since the protective film is formed in each region defined by the partitioning material and is not formed over the entire surface of the base material, the consumption of the protective film material can be suppressed low, so that the color filter substrate can be used. It can be manufactured at low cost.

In the color filter substrate having the above structure,
The plurality of protective layers may include protective layers having different thicknesses. According to this configuration, the surface of the color filter substrate can be made flat even when the thickness of the plurality of color picture elements formed on the base material is different for each region partitioned by the partition material.

In the color filter substrate having the above structure, it is preferable that the top surfaces of the plurality of protective films are formed at a height substantially equal to the top surface of the partition material. This makes the surface of the color filter substrate flat, so that, for example, when an electrode is formed on the surface of the color filter substrate, the electrode can be prevented from being cut.

Here, "substantially equal" means that
Even if a difference occurs due to a manufacturing error or the like, if the function as the protective film can be achieved, it means that such an error is included.

In the color filter substrate having the above structure, the plurality of color picture elements include color picture elements having different thicknesses,
The protection film may include a protection film having a different thickness according to a difference in the thickness of the color picture element. According to this configuration, by making the thicknesses of the color picture elements different, a color display with a desired hue can be realized. Further, since the thickness of the protective film is made different depending on the thickness of the color picture element, it is possible to prevent the unevenness of the color picture element from appearing as unevenness on the surface of the color filter substrate.

Further, in the color filter substrate having the above structure, the partitioning material can be formed on a black mask or can also serve as a black mask. When the partitioning material is formed on the black mask, the partitioning material can be formed of either a light shielding material or a non-light shielding material. Also,
When the partitioning material also serves as a black mask, the black mask is formed of a light shielding material. In this embodiment, the partitioning material is formed thicker than the color picture elements.

(2) Next, in the method for manufacturing a color filter substrate according to the present invention, a partitioning material forming step of forming a partitioning material for partitioning the surface of the base material into a plurality of regions on the base material; A color picture element forming step of forming a color picture element thinner than the partitioning material in a plurality of areas, and a protective film forming step of forming a protective film on the color picture elements of the plurality of areas,
In the protective film forming step, the protective film material is discharged as droplets to the plurality of regions to form a protective film.

The above protective film forming step can be achieved by selecting a material for the protective film as the ink to be ejected in a so-called ink jet type ink ejection method.
As the ink jet method, a method of discharging ink using elastic deformation of a piezoelectric element, a method of discharging ink using thermal expansion of ink, or any other method can be adopted.

According to the method for manufacturing a color filter substrate having the above-described structure, the protective film is supplied in the form of dots for each of a plurality of regions. it can. For this reason, the protective film material is not consumed unnecessarily, and the color filter substrate can be manufactured at low cost.

In the method for manufacturing a color filter substrate having the above-described structure, it is preferable that, in the protective film forming step, the protective film is formed such that the top surface thereof is substantially equal in height to the top surface of the partition material. In the manufacturing method of the present invention, since the protective film is formed for each partitioned area, the above-described top surface adjustment can be performed easily and accurately. If the top surface of the protective film and the top surface of the partitioning material are formed at substantially the same height as in the present invention, the surface of the color filter substrate can be formed with an accurate flat surface.

Here, "almost equal" means that
Even if a difference occurs due to a manufacturing error or the like, if the function as the protective film can be achieved, it means that such an error is included.

In the method for manufacturing a color filter substrate having the above-mentioned structure, in the color picture element forming step, the plurality of color picture elements form color picture elements having different thicknesses, and in the protective film forming step, the protective film is a color picture element. A protective film having a different thickness can be formed according to the difference in the thickness of the protective film. According to the manufacturing method of this configuration, by making the thickness of the color picture element different,
A color display with a desired hue can be realized. Also,
Since the thickness of the protective film varies depending on the thickness of the color picture element,
The unevenness of the color picture element can be prevented from appearing as unevenness on the surface of the color filter substrate.

In the method for manufacturing a color filter substrate having the above structure, it is preferable that in the color picture element forming step, a color picture element is formed by discharging a color picture element material as droplets to the plurality of regions. This configuration can be achieved by selecting a color picture element material as ink to be ejected in a so-called ink jet type ink ejection method. Also in this case, as the ink jet method, a method of discharging ink using elastic deformation of a piezoelectric element, a method of discharging ink using thermal expansion of ink, or any other method can be adopted.

According to the method of manufacturing a color filter substrate having this configuration, ink, that is, a color picture element material can be supplied to each position of a plurality of regions on a base material at a desired discharge amount.
This is very advantageous in manufacturing the color filter substrate according to the present invention.

Further, in the method for manufacturing a color filter substrate having the above structure, the protective film material may include at least one of an acrylic resin, an epoxy resin, an imide resin or a fluorine resin.

In the method of manufacturing a color filter substrate having the above-mentioned structure, the viscosity of the protective film material is 4 cps to 5 cps.
It is desirably 0 cps. The viscosity of the protective film material is 4
If it is less than cps, the fluidity of the protective film material may be too high to form a desired film. If the viscosity of the protective film material exceeds 50 cps, the desired amount of the protective film material may not be discharged from the inkjet head. Therefore, the viscosity of the protective film material is 4 cps or more.
Desirably, it is 50 cps.

(3) Next, the liquid crystal device according to the present invention comprises:
In a liquid crystal device including a pair of substrates that sandwich liquid crystal and a color filter substrate formed on at least one substrate, the color filter substrate includes a substrate and a partition that divides the surface of the substrate into a plurality of regions. An image material, a color picture element provided thinner than the partition material in the plurality of regions, and a protective film provided on the color picture elements in the plurality of regions with a thickness not exceeding the partition material. It is characterized by having.

According to the liquid crystal device having this configuration, in the color filter substrate which is a component of the liquid crystal device, the protective film is formed in each region partitioned by the partition material, and is formed over the entire surface of the base material. Therefore, the consumption of the protective film material can be reduced, and the color filter substrate can be manufactured at low cost.

In the liquid crystal device having the above structure, the plurality of protective films may include protective films having different thicknesses. According to this configuration, the surface of the color filter substrate can be made flat even when the thickness of the plurality of color picture elements formed on the base material is different for each region partitioned by the partition material.

In the liquid crystal device having the above structure, it is preferable that the top surfaces of the plurality of protective films are formed at a height substantially equal to the top surface of the partition material. This way,
Since the surface of the color filter substrate in the liquid crystal device becomes flat, for example, when an electrode is formed on the surface of the color filter substrate, the electrode can be prevented from being cut.

Here, "almost equal" means that
Even if a difference occurs due to a manufacturing error or the like, if the function as the protective film can be achieved, it means that such an error is included.

Further, in the liquid crystal device having the above structure, the plurality of color picture elements include color picture elements having different thicknesses, and the protective film includes a protection film having a different thickness according to the difference in the thickness of the color picture elements. be able to. According to this configuration, by making the thicknesses of the color picture elements different, a color display with a desired hue can be realized. Further, since the thickness of the protective film is made different depending on the thickness of the color picture element, it is possible to prevent the unevenness of the color picture element from appearing as unevenness on the surface of the color filter substrate.

In the liquid crystal device having the above structure, the partition member may be formed on a black mask or may also serve as a black mask. When the partitioning material is formed on the black mask, the partitioning material can be formed of either a light shielding material or a non-light shielding material. When the partitioning material also serves as a black mask, the black mask is formed of a light shielding material. In this embodiment, the partitioning material is formed thicker than the color picture elements.

In the liquid crystal device having the above structure, the liquid crystal is an STN (Super Twisted Nematic) liquid crystal or a TN liquid crystal.
(Twisted Nematic) liquid crystal is desirable. ST
In a liquid crystal device using an N liquid crystal and a TN liquid crystal, display is performed using birefringence in a liquid crystal layer, and it is desired that the thickness of the liquid crystal layer be uniform over the entire display region. Therefore, the present invention, which can ensure the flatness of the color filter substrate, is particularly advantageous when an STN liquid crystal or a TN liquid crystal is used.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) FIG. 2A shows a plan structure of one embodiment of a color filter substrate according to the present invention. FIG. 1 shows a cross-sectional structure taken along the line II of FIG. As shown in FIG. 1, a color filter substrate 1 according to the present embodiment includes a substrate 2 formed of glass, plastic, or the like, a black mask 6 formed on the surface of the substrate 2, and a black mask 6. A bank 5 as a partition material formed thereon, and a plurality of color picture elements 3 formed in a region surrounded by the bank 5
And a protective film 4, which is also a region surrounded by the bank 5 and is formed on the color picture element 3.

Bank 5 and black mask 6 below it
2 (a) are formed in a lattice shape with the portions where the color picture elements 3 and the protective film 4 are formed as lattice holes, and the protective film 4 and the color picture elements 3 thereunder are formed so as to fill those lattice holes. You. Thus, the plurality of color picture elements 3 are formed on the surface of the base material 2 in a dot pattern shape, in this embodiment, in a dot matrix shape.

The black mask 6 is formed of a non-translucent metal or resin material. Each of the color picture elements 3 is formed of, for example, any one of R (red), G (green), and B (blue) color materials, and the color picture elements 3 are arranged in a predetermined arrangement. It is arranged in. As this arrangement, for example, a stripe arrangement shown in FIG.
A mosaic arrangement shown in FIG. 3B and a delta arrangement shown in FIG. 3C are known.

The stripe arrangement is a color arrangement in which all columns of the matrix have the same color. The mosaic arrangement is a color scheme in which any three color picture elements arranged on a vertical and horizontal straight line have three colors of R, G, and B. In the delta arrangement, the arrangement of the color picture elements is made uneven, and three adjacent color picture elements are R, G, B
Are the three colors.

In FIG. 2A, the size of the color filter substrate 1 is, for example, 1.8 inches diagonally. The size of one color picture element 3 is, for example, 30 μm.
m × 100 μm. Also, the interval between each color picture element 3,
The so-called inter-element pitch is, for example, 75 μm.

In this embodiment, the color picture elements 3R, 3G, 3
The height, that is, the thickness, of B is smaller than that of the bank 5,
Furthermore, each thickness is different. Specifically, G
The color picture element 3G is the thickest, the R color picture element 3R is the next thickest,
The B color picture element 3B is formed thinnest. The reason why the thickness differs among the color picture elements is mainly to emphasize or weaken a specific color according to the wishes of the observer. In addition, G color picture element 3 which has a large effect on the resolution
Thickness control such as forming G lower than other color picture elements may be performed.

When there is a difference in thickness among the color picture elements 3R, 3G, 3B, the protective film 4 has a different thickness depending on the difference in thickness of the color picture elements 3R, 3G, 3B. Formed. Specifically, the thickness of the protective film 4 corresponding to the G color picture element 3G is the smallest, and the thickness of the protective film 4 corresponding to the R color picture element 3R is small.
Is next thinner, and the protective film 4 corresponding to the B color picture element 3B is formed thickest. By such a thickness control, the height of the top surface of the protective film 4 formed on each color picture element 3 is substantially equal to the height of the bank 5.

In this case, “substantially equal” means that the protective film 4
In addition to the case where the heights of the bank 5 and the bank 5 are physically completely the same, even when the heights are slightly different due to manufacturing errors or unavoidable manufacturing, If the can function similarly, it is meant to include such a difference in height.

The height of the protective film 4 does not necessarily have to be substantially equal to the height of the bank 5. Also in this case, the protection film 4 can achieve a protection function for preventing the color picture element 3 from being damaged and a function for preventing diffusion of impurities into the liquid crystal.

Considering the case where the color filter substrate 1 of this embodiment is used, for example, as a color filter substrate in a liquid crystal device, an electrode is provided on the surface of the color picture element 3 in FIG. At this time, if there is unevenness on the surface of the color filter substrate 1 on which the color picture elements 3 are formed, a step is formed on the electrode,
The electrode may be cut. On the other hand, according to the color filter substrate 1 of the present embodiment in which the surface is formed smoothly by providing the protective film 4, such cutting of the electrodes can be reliably prevented.

When the color filter substrate 1 according to the present embodiment is used as an optical element for full-color display, one pixel is formed with three color picture elements 3 of R, G, and B as one unit, and one pixel is formed. By passing light selectively through any one of R, G, and B or a combination thereof, full-color display is performed. At this time, the black mask 6 formed of a non-translucent metal or resin material prevents light from leaking from portions other than the color picture elements 3.

The color filter substrate 1 shown in FIG. 1 is, for example, cut out from a mother substrate 12 having a large area as shown in FIG. Specifically, first, a pattern for one color filter substrate 1 is formed on each surface of the plurality of color filter formation regions 11 set in the mother base material 12, and the color filter formation regions 11 are further formed.
Are formed around each other, and the mother substrate 12 is cut along these grooves, whereby individual color filter substrates 1 are formed.

Hereinafter, a method and an apparatus for manufacturing the color filter substrate 1 shown in FIG. 2A will be described.

FIG. 4 schematically shows a method of manufacturing the color filter substrate 1 in the order of steps. First, a black mask 6 is formed in a lattice pattern on a surface of a mother substrate 12 formed of glass, plastic, or the like, using a metal or resin material having no light transmission property, for example, Cr (chromium) as viewed in the direction of arrow B. The portion 7 of the lattice hole of the lattice pattern is a region where the color picture element 3 is formed, that is, a color picture element formation area. The plane dimensions of the individual color picture element forming regions 7 formed by the black mask 6 when viewed from the direction of arrow B are, for example, about 30 μm × 100 μm.

The black mask 6 is formed by depositing a material, for example, Cr or the like by an arbitrary film forming method, for example, sputtering.
After uniformly forming with a uniform thickness of about 0.2 μm, a lattice pattern is formed by an appropriate patterning method, for example, a photolithography method (step P1). After the formation of the black mask 6, the bank 5 is formed in a process P2. Specifically, desirably, an ink-repellent resin is formed to a predetermined thickness using, for example, a spin coating method,
Further, it is formed in a predetermined lattice shape by using an appropriate patterning method, for example, a photolithography method. At this time, the width of the black mask 6 and the width of the bank 5 do not necessarily have to match.

Thereafter, in a process P3, R, G, and B color picture elements 3 are formed in each area defined by the bank 5 by using the ink jet method. Specifically, while scanning the surface of the mother base material 12 with the inkjet head 22, the color picture element material 8 is supplied from the nozzles 27 provided in the inkjet head 22 at a predetermined timing corresponding to the arrangement pattern shown in FIG. The ink droplets are ejected and adhere on the mother substrate 12. Then, the color picture element material is solidified by a baking treatment, an ultraviolet irradiation treatment, or a vacuum drying treatment to form the color picture element 3. This process is repeated for each color picture element 3R, 3G, 3B to form a color picture element pattern of a desired arrangement.

Thereafter, in a process P4, a protective film 4 is formed on each of the color picture elements 3 in each area defined by the bank 5 by using the ink jet method. In particular,
In the same manner as in the case of the color picture element 3, the ink jet head 2
While scanning the surface of the mother base material 12 with the ink jet head 2, the protective film material 10 is ejected from the nozzles 27 provided in the inkjet head 22 as ink droplets at predetermined timings corresponding to the arrangement pattern shown in FIG. It is attached on each color picture element 3 on the base material 12. And then
For example, the protective film material is solidified by baking at 200 ° C. for 30 minutes to 60 minutes to form the protective film 4.

In the ink jet processing in the color picture element forming step P3, the color picture elements are formed by repeating the scanning of the ink jet head 22 for each of the R, G, B colors of the color picture elements 3, or one ink jet head 22 is formed.
It is also possible to equip three nozzles for R, G and B colors and to simultaneously form R, G and B colors by one scan.

On the other hand, in the inkjet processing in the protective film forming step P4, a predetermined amount of ink droplets are supplied to all of the plurality of grid holes formed by the banks 5 during one scanning period of the inkjet head 22. However, when the thickness of the color picture element 3 formed in the lattice hole differs for each of the colors R, G, and B, the ejection amount of the ink ejected from the nozzle 27 also becomes an appropriate amount for each color. Adjust.

The ink jet head 22 used in the color picture element forming step P3 and the ink jet head 22 used in the protective film forming step P4 may be exchanged and mounted on the same ink jet device, or they may be separately installed. , And these ink jet devices may be used individually. In some cases, the same ink jet head 22 and the same ink jet device to which the ink jet head is mounted are used, and the ink supplied to the same ink jet head 22 is exchanged between a color picture element material and a protective film material. Can also be adopted.

The method of scanning the mother substrate 12 by the ink jet head 22 in the color picture element forming step P3 and the protective film forming step P4 is not limited to a special method, but may be variously considered. For example, a plurality of nozzles 27 are arranged at substantially the same length as one side of the mother substrate 12 to form a nozzle row, and the pixel material 8 and the protective film material 10 are supplied to the entire surface of the mother substrate 12 by one scan. A main scanning for ejecting ink and a sub-scanning for shifting a main scanning position with respect to the inkjet head 22 having a nozzle row having a length shorter than one side of the mother base material 12. A method of supplying ink to the entire surface of the material 12 or the like can be considered.

FIG. 5 shows an embodiment of an ink jet apparatus which is an example of an apparatus for performing the color picture element forming step P3 and the protective film forming step P4 of FIG. This ink jet device 16 discharges and attaches a color picture element material or a protective film material as ink droplets to a predetermined position in each color filter forming area 11 in the mother substrate 12 (see FIG. 2B). Device.

In FIG. 5, the ink jet device 16
A head unit 26 having an inkjet head 22; a head position controller 17 for controlling the position of the inkjet head 22; a substrate position controller 18 for controlling the position of the mother substrate 12;
A main scanning drive device 19 that moves the inkjet head 22 in the main scanning direction with respect to the mother base material 12, a sub scanning driving device 21 that moves the inkjet head 22 in the sub scanning direction with respect to the mother base material 12,
A substrate supply device 23 for supplying the mother base material 12 to a predetermined working position in the inkjet device 16 and a control device 2 for controlling the overall control of the inkjet device 16
And 4.

Head position control device 17, substrate position control device 18, main scanning drive device 19, and sub-scanning drive device 2
Each device of 1 is installed on the base 9. Each of those devices is covered with a cover 14 as needed.

The ink jet head 22 is, for example, as shown in FIG.
As shown in the figure, a plurality of, in this embodiment, six head units 2
And a carriage 25 as support means for supporting the head units 20 side by side. Carriage 25
Has holes or recesses slightly larger than the head portion 20 at positions where the head portion 20 is to be supported, and each head portion 20 is inserted into those holes and further fixed by screws, adhesives or other fastening means. Is done. Also, the carriage 25
If the position of the head section 20 with respect to the head section 20 is accurately determined, the head section 20 may be fixed by simple press-fitting without using any special fastening means.

As shown in FIG. 7B, the head section 20 has a nozzle row 28 formed by arranging a plurality of nozzles 27 in a row. The number of the nozzles 27 is, for example, 180, the hole diameter of the nozzles 27 is, for example, 28 μm, and the nozzle pitch between the nozzles 27 is, for example, 141 μm.
It is. 2A and 2B, the main scanning direction with respect to the base material 2 and the mother base material 12 is the X direction, the Y direction orthogonal thereto is the sub-scanning direction, and the X direction and the Y direction are the same. In FIG. 7A, the ink jet head 22 is set as illustrated.

The ink-jet head 22 makes a main scan of the mother substrate 12 by moving in parallel in the X direction. During this main scan, a color picture element material or a protective film material as an ink By selectively discharging from the nozzle 27, a color pixel material or a protective film material is attached to a predetermined position in the mother base material 12. The main scanning position of the inkjet head 22 is shifted at a predetermined interval by moving the inkjet head 22 in the sub-scanning direction Y by a predetermined distance, for example, the length L of one nozzle row 28 or an integral multiple thereof. Can be

The nozzle array 28 of each head unit 20 is set so as to be in a straight line Z when each head unit 20 is mounted on the carriage 25. The distance D between the adjacent head units 20 is such that the distance between the nozzles 27 at the extreme end positions belonging to each of the pair of adjacent head units 20 is equal to the length L of the nozzle row 28 in each head unit 20. Set to be equal. Such an arrangement with respect to the nozzle row 28 is a measure for simplifying the main scanning control in the X direction and the sub-scanning control in the Y direction with respect to the ink jet head 22. The arrangement form can be arbitrarily set in addition to the above.

The individual head units 20 are, for example, as shown in FIG.
It has the internal structure shown in FIG. Specifically, the head unit 20 includes, for example, a nozzle plate 29 made of stainless steel, a diaphragm 31 facing the nozzle plate 29, and a plurality of partition members 32 that join them together. A plurality of ink chambers 33 and liquid reservoirs 34 are formed between the nozzle plate 29 and the vibration plate 31 by the partition member 32. The plurality of ink chambers 33 and the liquid reservoir 34 communicate with each other via a passage 38.

An ink supply hole 36 is formed at an appropriate position on the vibration plate 31, and an ink supply device 37 is provided in the ink supply hole 36.
Is connected. The ink supply device 37 includes a color picture element material M
Alternatively, the protective film material M is supplied to the ink supply hole 36. The supplied color picture element material M or protective film material M fills the liquid reservoir 34 and further fills the ink chamber 33 through the passage 38. With respect to the color picture element material M, the one supplied from the ink supply device 37 is any one of R, G, and B, and a different head unit 20 is prepared for each color.

The color picture element material M is formed by dispersing each of the R, G, and B color materials in a solvent. Also,
The protective film material M is a translucent thermosetting resin or photocurable resin, and can be formed, for example, by including at least one of an acrylic resin, an epoxy resin, an imide-based resin, and a fluorine-based resin. The viscosity of the protective film material M is desirably set to 4 cps to 50 cps. This is 4c
If it is less than ps, the fluidity is too high to form a specific shape, and if it is more than 50 cps, it becomes difficult to discharge a fixed amount from the nozzle 27.

The nozzle plate 29 is provided with nozzles 27 for jetting the color picture element material M or the protective film material M from the ink chamber 33 in a jet shape. Also, the diaphragm 3
On the back surface of the surface on which one ink chamber 33 is formed, an ink pressurizing body 39 is attached so as to correspond to the ink chamber 33. As shown in FIG. 8B, the ink pressurizing member 39 includes a piezoelectric element 41 and a pair of electrodes 42 sandwiching the same.
a and 42b. The piezoelectric element 41 bends and deforms so as to protrude outward as indicated by the arrow C by energizing the electrodes 42a and 42b, thereby increasing the volume of the ink chamber 33. Then, the color picture element material M corresponding to the increased volume
Alternatively, the protective film material M flows from the liquid reservoir 34 into the ink chamber 33 through the passage 38.

Next, when the current supply to the piezoelectric element 41 is released, both the piezoelectric element 41 and the diaphragm 31 return to their original shapes. As a result, the ink chamber 33 also returns to its original volume, so that the color picture element material M or the protective film material M inside the ink chamber 33 is removed.
Of the mother substrate 12 (FIG. 2)
The color picture element material M or the protective film material M is ejected as droplets 8 and 10 toward (b). In addition, an ink-repellent layer 43 made of, for example, a Ni-tetrafluoroethylene eutectoid plating layer is provided on the periphery of the nozzle 27 in order to prevent the liquid droplets 8 and 10 from bending and flying or clogging the hole of the nozzle 27. .

In FIG. 6, the head position controller 17
Is an α motor 44 for rotating the inkjet head 22 in a plane, a β motor 46 for swingingly rotating the inkjet head 22 about an axis parallel to the sub-scanning direction Y, and an axis parallel to the main scanning direction X. A γ motor 47 for swinging and rotating around, and a Z motor 48 for horizontally moving the inkjet head 22 in a vertical direction
And

The board position control device 18 shown in FIG. 5 includes a table 49 on which the mother base material 12 is placed as shown in FIG.
And a θ motor 51 for rotating the table 49 in-plane as indicated by an arrow θ. The main scanning drive device 19 shown in FIG. 5 includes a guide rail 52 extending in the main scanning direction X and a slider 53 containing a pulse-driven linear motor, as shown in FIG. The slider 53 translates in the main scanning direction along the guide rail 52 when the built-in linear motor operates.

The sub-scanning driving device 21 shown in FIG.
Has a guide rail 54 extending in the sub-scanning direction Y and a slider 56 containing a pulse-driven linear motor, as shown in FIG. The slider 56 moves in the sub-scanning direction Y along the guide rail 54 when the built-in linear motor operates.

A linear motor pulse-driven in the slider 53 or the slider 56 can precisely control the rotation angle of the output shaft by a pulse signal supplied to the motor. Therefore, the inkjet head supported by the slider 53 22 in the main scanning direction X and the table 4
9 can be controlled with high definition in the sub-scanning direction Y. The position control of the ink jet head 22 and the table 49 is not limited to the position control using a pulse motor, but can also be realized by feedback control using a servo motor or any other control method.

The substrate supply device 23 shown in FIG. 5 includes a substrate accommodating portion 57 for accommodating the mother substrate 12 and a mother substrate 12.
And a robot 58 for transporting. The robot 58
A base 59 placed on an installation surface such as a floor, the ground, etc .; an elevating shaft 61 moving up and down with respect to the base 59; a first arm 62 rotating about the elevating shaft 61;
And a suction pad 64 provided on the lower surface of the distal end of the second arm 63. The suction pad 64 can suction the mother substrate 12 by air suction or the like.

In FIG. 5, the ink jet head 22 which is driven by the main scanning driving device 19 and moves in the main scanning.
A capping device 76 and a cleaning device 77 are disposed below the locus and at one side position of the sub-scanning driving device 21. An electronic balance 78 is provided at the other side position. The cleaning device 77 is a device for cleaning the inkjet head 22. The electronic balance 78 is a device that measures the weight of ink droplets ejected from the individual nozzles 27 in the inkjet head 22 for each nozzle. The capping device 76 is a device for preventing the nozzle 27 from drying when the inkjet head 22 is in a standby state.

A head camera 81 is disposed near the ink jet head 22 so as to move integrally with the ink jet head 22. Further, the substrate camera 8 supported by a supporting device (not shown) provided on the base 9.
2 is arranged at a position where the mother substrate 12 can be photographed.

The control device 24 shown in FIG. 5 includes a computer main body 66 containing a processor, a keyboard 67 as an input device, and a CRT as a display device.
(Cathode Ray Tube) display 68. As shown in FIG. 9, the processor performs C
It has a PU (Central Processing Unit) 69 and a memory for storing various information, that is, an information storage medium 71.

The head position control device 17, the substrate position control device 18, the main scanning drive device 19, the sub-scanning drive device 21, and the piezoelectric element 41 in the ink jet head 22 shown in FIG. 5 (see FIG. 8B). In FIG. 9, each device of the head drive circuit 72 for driving is connected to the CPU 69 via the input / output interface 73 and the bus 74.
In addition, each device of the substrate supply device 23, the input device 67, the display 68, the electronic balance 78, the cleaning device 77, and the capping device 76 is also an input / output interface 73.
And a CPU 74 via a bus 74.

The memory 71 has a random access memory (RAM).
mory), semiconductor memory such as ROM (Read Only Memory), hard disk, CD-ROM reader,
This is a concept including an external storage device such as a disk-type storage medium. Functionally, the storage region stores program software in which a control procedure of the operation of the inkjet device 16 is described, and the storage region in the main scanning direction X in FIG. Slider 53
A storage area for storing the main scanning movement amount and the sub-scanning movement amount of the mother substrate 12 in the sub-scanning direction Y;
Area, which functions as a work area or a temporary file, and other various storage areas.

In the method for manufacturing a color filter substrate according to the present embodiment, the ink jet device 16 is used in both the color picture element forming step P3 and the protective film forming step P4 in FIG. The ink jet device 16 used in these steps can be almost the same mechanically.

The memory 71 shown in FIG. 9 provided in the ink jet apparatus 16 used in the color picture element forming step P3 includes program software for regulating the overall procedure of color picture element formation and the desired color picture element arrangement shown in FIG. R, G, B to realize
Forming position data and R, G, and B adhesion amount data that specify how much each color material is supplied to each of the R, G, and B positions are stored. The R, G, and B adhesion amount data can be specified for each color, or can be specified in relation to the coordinate position on the mother board 12.

The CPU 69 for the ink jet device 16 for forming a color picture element determines which of the plurality of nozzles 27 during the main scanning of the ink jet head 22 based on the R, G, B formation position data and the R, G, B adhesion amount data. From
At which timing the ink, that is, the color picture element material is ejected, is calculated.

On the other hand, the memory 71 shown in FIG. 9 provided in the ink jet device 16 used in the protective film forming step P4 has the same structure as the ink jet device 16 used in the color picture element forming step P3. Program software that regulates the overall procedure, R, G, B formation position data that realizes the desired color picture element arrangement in FIG. 3, and how much each color material is supplied to each position of R, G, B Is stored.

The CPU 69 for the ink jet device 16 for forming the protective film determines which of the plurality of nozzles 27 during the main scan of the ink jet head 22 based on the R, G, B formation position data and the R, G, B adhesion amount data. From
At which timing the ink, that is, the protective film material is ejected, is calculated. For example, as shown in FIG. 1, considering the case where the discharge amount of the protective film material is determined so that the top surface of the protective film 4 and the top surface of the bank 5 are substantially equal, the CPU 6
Numeral 9 calculates the volume obtained by subtracting the volume of the color picture element 3 from the volume of the lattice holes formed by the banks 5 as the discharge amount of the protective film material.

Of course, instead of storing the R, G, and B adhesion amount data as the memory 71 for the ink-jet device 16 for forming the protective film, the R, G, and B color image elements can be used. It is also possible to directly memorize the specific amount of the protective film to be discharged.

The CPU 69 in FIG. 9 performs control for discharging ink, that is, a color picture element material or a protective film material, to a predetermined position on the surface of the mother base material 12 in accordance with the program software stored in the memory 71. Yes, as specific function realizing units, a cleaning arithmetic unit for performing arithmetic for realizing the cleaning process, a capping arithmetic unit for realizing the capping process, and an electronic balance 78
It has a weight measurement operation unit for performing an operation for realizing weight measurement using (see FIG. 5) and a drawing operation unit for performing an operation for drawing a color picture element material or a protective film material by ink jet.

Further, if the drawing calculation section is divided in detail, a drawing start position calculation section for setting the ink jet head 22 to the initial position for drawing, and the ink jet head 22 can be scanned at a predetermined speed in the main scanning direction X. A main-scan control arithmetic unit for calculating control for moving, a sub-scan control arithmetic unit for calculating control for shifting the mother substrate 12 by a predetermined sub-scan amount in the sub-scan direction Y, and an inkjet head Various functions such as a nozzle discharge control calculation unit that performs a calculation for controlling which of the plurality of nozzles 27 in the nozzle 22 is to be operated at which timing to discharge the ink, that is, the color picture element material or the protective film material. It has a calculation unit.

In this embodiment, each of the above functions is implemented by C
Although the software is realized by using the PU 69, when each of the above functions can be realized by a single electronic circuit without using the CPU, such an electronic circuit can be used.

Hereinafter, the operation of the ink jet apparatus 16 having the above configuration will be described with reference to the flowchart shown in FIG.

When the ink jet device 16 is operated by turning on the power by the operator, first, in step S1, initialization is executed. Specifically, the head unit 26, the substrate supply device 23, the control device 24, and the like are set to a predetermined initial state.

Next, when the weight measurement timing comes (YES in step S2), the head unit 26 shown in FIG.
Is moved to the position of the electronic balance 78 in FIG. 5 by the main scanning drive device 19 (step S3), and the amount of ink ejected from the nozzles 27 is measured using the electronic balance 78 (step S4). The piezoelectric elements 41 corresponding to the respective nozzles 27 are adjusted in accordance with the ink ejection characteristics of the individual nozzles 27.
Is adjusted (step S5).

Next, when the cleaning timing comes (YES in step S6), the head unit 26 is moved to the cleaning device 77 by the main scanning drive device 19 (step S7), and the ink jet head is moved by the cleaning device 77. 22 is cleaned (step S8).

If the weight measurement timing or cleaning timing has not arrived (N in steps S2 and S6)
O), or when those processes are completed, the motherboard 12 is supplied to the table 49 by operating the substrate supply device 23 in FIG. Specifically, the mother base material 12 in the substrate accommodation portion 57 is
Then, the mother base material 12 is transported to the table 49 by moving the elevating shaft 61, the first arm 62 and the second arm 63, and the positioning pins 50 provided at appropriate places on the table 49 are provided in advance. (See FIG. 6). In order to prevent the mother substrate 12 from being displaced on the table 49, it is desirable to fix the mother substrate 12 to the table 49 by means such as air suction.

Next, while observing the mother base material 12 with the board camera 82 of FIG. 5, the output shaft of the θ motor 51 of FIG.
The mother substrate 12 is positioned by rotating the substrate 9 in a plane by a minute angle (step S10). Next, while observing the mother substrate 12 with the head camera 81 of FIG. 5, the position at which drawing is started by the inkjet head 22 is determined by calculation (step S11), and the main scanning driving device 19 and the sub-scanning driving device are determined. The inkjet head 22 is moved to the drawing start position by appropriately operating (Step S12). At this time, the inkjet head 22 is set such that the extending direction Z of the nozzle row 28 of each head unit 20 is perpendicular to the main scanning direction X, as shown in FIG.

When the ink jet head 22 is placed at the drawing start position in step S12 in FIG. 10, thereafter, in step S13, main scanning in the X direction is started, and at the same time, ink ejection is started. Specifically, the main scanning drive device 19 shown in FIG.
Scans linearly in the main scanning direction X at a constant speed, and during the movement, when the nozzle 27 reaches a region where the color picture element material or the protective film material is to be ejected, ink from the nozzle 27, that is, the color picture element material Alternatively, the protective film material is discharged to fill the area.

For example, considering the color picture element forming step P3 in FIG. 4, the discharge amounts of the R color picture elements 3R in FIG.
Assuming that the discharge amount of the color picture element 3G is VG and the discharge amount of the B color picture element 3B is VB, VG>VR> VB... (1) It is formed using.

On the other hand, when considering the protective film forming step P4 in FIG. 4, if each color picture element 3 is already formed in the state of the above equation (1) as shown in FIG. 1, the protective film for B Material> R Protective Film Material> G Protective Film Material The protective film 4 is formed using one ink jet device 16 with the discharge amount of (2). FIG. 11B shows that the dot-like protective film material M is applied to each of the color picture elements 3R and 3R so as to satisfy the above equation (2).
A state is shown in which the ink is discharged onto them in amounts suitable for the amounts of G and 3B.

In FIG. 11, the ink jet head 2
2 completes one main scan on the mother substrate 12 (YES in step S14), the inkjet head 22 reversely moves and returns to the initial position (step S14).
15). And further, the inkjet head 22
A predetermined sub-scanning amount in the sub-scanning direction Y driven by the sub-scanning driving device 21, for example, one head unit 20
(Step S16). Then, the main scanning and the ink ejection are repeatedly performed, and the color picture element 3 or the protection film 4 is formed in a region where the color picture element 3 or the protection film 4 has not been formed yet (step S13).

The drawing operation of the color picture element 3 or the protective film 4 by the ink jet head 22 as described above is performed by the mother substrate 12.
Is completed for all areas (YE in step S17).
S), the processed mother substrate 12 is discharged to the outside by the substrate supply device 23 or another transport device in step S18. Thereafter, unless an operator gives an instruction to end the process (NO in step S19), the process returns to step S2, and the operation of depositing the protective film material on another mother substrate 12 is repeated.

When the operator gives an instruction to end the work (YES in step S19), the CPU 69 conveys the ink jet head 22 to the capping device 76 in FIG. 5, and the capping device 76 caps the ink jet head 22. Processing is performed (step S20).

As described above, the patterning of each color picture element 3 constituting the color filter substrate 1 or the patterning of the protective film 4 is completed. When the patterning of the protective film 4 is completed, a mother substrate 1 on which a plurality of color filter substrates 1 (FIG. 2A) having a desired R, G, B dot arrangement such as a stripe arrangement is formed.
2 is manufactured.

If the present color filter substrate 1 is used for color display of a liquid crystal device, electrodes, alignment films and the like are further laminated on the surface of the present color filter substrate 1. In such a case, if the mother substrate 12 is cut off before laminating the electrodes, the alignment films and the like, and the individual color filter substrates 1 are cut out, the subsequent steps of forming the electrodes and the like become very troublesome. Therefore, in such a case, after the color filter substrate 1 is completed on the mother substrate 12, the mother substrate 12 is not cut immediately, but necessary additional steps such as electrode formation and alignment film formation are performed. It is desirable to cut the mother substrate 12 after the completion of the above.

As described above, according to the color filter substrate and the method of manufacturing the same according to the present embodiment, the protective film 4 is not formed over the entire surface of the base material 2 as shown in FIG. The cost can be reduced by keeping the consumption of the material of the film 4 low.

(Second Embodiment) FIG. 12 shows a modification of the head section 20 shown in FIG. 7B. In the head unit 20 shown in FIG. 7B, only one nozzle row 28 is provided in the main scanning direction X. Instead, in the head unit 20 shown in FIG. 12, a plurality of nozzle rows 28 are provided in the main scanning direction X, and two nozzle rows are provided in the present embodiment. If the head unit 20 is used, when the carriage 25 in FIG. 7A performs main scanning in the X direction, ink can be ejected by the two nozzles 27 arranged in the main scanning direction X. The method of controlling the discharge amount of the protective film material can be diversified.

(Third Embodiment) FIG. 13 shows main steps of another embodiment of a method for manufacturing a color filter substrate according to the present invention. This step is shown in FIG. 11 in the previously described embodiment. Performed in place of the above steps. The color filter substrate manufactured by the manufacturing method according to the present embodiment can be a color filter substrate indicated by reference numeral “1” in FIG. Further, the color filter substrate 1 can be formed by cutting out from the mother base material 12 shown in FIG.

The arrangement of the color picture elements formed on the color filter substrate 1 can be various arrangements such as the stripe arrangement shown in FIG. Also, the color filter substrate 1
Can be adopted as steps P1 to P4 in FIG. Further, as the ink jet device used in the color picture element forming step P3 and the protective film forming step P4, an apparatus having a structure shown in FIG. 5 can be adopted.

The difference between the embodiment shown in FIG. 13 and the previous embodiment is that, when the ink jet head 22 is placed at the initial position with respect to the mother substrate 12, that is, the main scanning start position, as apparent from comparison with FIG. , Carriage 25
Are inclined at an angle θ with respect to the sub-scanning direction Y, so that the extending direction Z of the six nozzle rows 28 is
With respect to the angle θ.

According to the structure of this embodiment, each head 2
0 performs the main scanning in the X direction at an angle θ with respect to the sub-scanning direction Y, so that the nozzle pitch of the plurality of nozzles 27 belonging to each head unit 20 is set to The interval and the interval between the protective film forming regions, that is, the pitch between the elements can be made to match. If the pitch between the nozzles and the pitch between the elements are geometrically matched in this manner, the position of the nozzle row 28 need not be controlled in the sub-scanning direction Y, which is advantageous.

(Fourth Embodiment) FIG. 14 shows the main steps of still another embodiment of the method for manufacturing a color filter substrate according to the present invention. This step is also the same as that of FIG. It is performed instead of the steps shown. The color filter substrate manufactured by the manufacturing method according to the present embodiment can be a color filter substrate indicated by reference numeral “1” in FIG. Also, the color filter substrate 1
Can be formed by cutting out the mother substrate 12 shown in FIG.

The arrangement of the color picture elements formed on the color filter substrate 1 can be various arrangements such as the stripe arrangement shown in FIG. Also, the color filter substrate 1
Can be adopted as steps P1 to P4 in FIG. Further, as the ink jet device used in the color picture element forming step P3 and the protective film forming step P4, an apparatus having a structure shown in FIG. 5 can be adopted.

The difference between the embodiment shown in FIG. 14 and the previous embodiment is that, when the ink jet head 22 is placed at the initial position with respect to the mother substrate 12, that is, the main scanning start position, as is apparent from comparison with FIG. , Carriage 25
Does not tilt with respect to the sub-scanning direction Y,
Since the six head units 20 are individually inclined at an angle θ with respect to the sub-scanning direction Y, the extending direction Z of each nozzle row 28 is
Is inclined at an angle θ with respect to the sub-scanning direction Y.

According to the configuration of this embodiment, each nozzle row 2
8 performs main scanning in the X direction at an angle θ with respect to the sub-scanning direction Y, so that the nozzle pitch of the plurality of nozzles 27 belonging to each nozzle row 28 is The interval and the interval between the protective film forming regions, that is, the pitch between the elements can be made to match. If the pitch between the nozzles and the pitch between the elements are geometrically matched in this manner, the position of the nozzle row 28 need not be controlled in the sub-scanning direction Y, which is advantageous.

Further, in the present embodiment, the individual head portions 20 are inclined instead of the entirety of the carriage 25 as shown in FIG. The distance from the nearest nozzle 27 to the farthest nozzle 27 can be significantly reduced as compared with the case of FIG. 13, and therefore, the time of the main scanning in the X direction can be shortened. Thereby, the manufacturing time of the color filter substrate can be reduced.

(Fifth Embodiment) FIG. 15 shows an embodiment of the liquid crystal device according to the present invention. FIG. 16 shows FIG.
5 shows a cross-sectional structure of the liquid crystal device taken along line XX in FIG. The liquid crystal device of the present embodiment is a transflective liquid crystal device that performs full-color display by a simple matrix method.

In FIG. 15, a liquid crystal device 101 includes a liquid crystal driving IC 1 as a semiconductor chip on a liquid crystal panel 102.
03a and 103b are mounted, and F
It is formed by connecting a PC (Flexible Printed Circuit) 104 to the liquid crystal panel 102 and providing an illumination device 106 as a backlight on the back side of the liquid crystal panel 102.

The liquid crystal panel 102 is formed by bonding a first substrate 107a and a second substrate 107b with a sealing material. The sealing material 108 is formed by, for example, attaching an epoxy resin in an annular shape to the inner surface of the first substrate 107a or the second substrate 107b by screen printing or the like. In addition, the sealing material 10
As shown in FIG. 16, a conductive material 109 formed of a conductive material in a spherical or cylindrical shape is dispersed in the inside of the conductive material 109.

In FIG. 16, the first substrate 107a has a plate-like substrate 111a formed of transparent glass, transparent plastic, or the like. A reflection film 112 is formed on the inner surface (upper surface in FIG. 16) of the base material 111a, an insulating film 113 is laminated thereon, and a first electrode 114a is formed thereon in a stripe shape as viewed in the direction of arrow D (see FIG. 16). FIG.
), And an alignment film 116a is further formed thereon. Further, a polarizing plate 117a is attached to the outer surface (the lower surface in FIG. 16) of the base material 111a by sticking or the like.

In FIG. 15, in order to clearly show the arrangement of the first electrodes 114a, the interval between the stripes of the first electrodes 114a is drawn much wider than the actual one. Therefore, the number of the first electrodes 114a is reduced. In practice, the first electrode 11
As for 4a, a larger number are formed on the base material 111a.

In FIG. 16, the second substrate 107b has a plate-like substrate 111b formed of transparent glass, transparent plastic, or the like. A color filter 118 is formed on the inner surface (the lower surface in FIG. 16) of the base material 111b, and the second electrode 114b is provided thereon with the first electrode 1b.
14a, is formed in a stripe shape (see FIG. 15) in the direction perpendicular to the direction of arrow D when viewed from the direction of arrow D, and the alignment film 1
16b are formed. Further, a polarizing plate 117b is attached to the outer surface (upper surface in FIG. 16) of the base material 111b by sticking or the like.

In FIG. 15, in order to clearly show the arrangement of the second electrodes 114b, as in the case of the first electrodes 114a, the spacing between the stripes is drawn much wider than the actual one. Although the number of the second electrodes 114b is small, in practice, a larger number of the second electrodes 114b are formed on the base material 111b.

In FIG. 16, the first substrate 107a and the second
In a gap surrounded by the substrate 107b and the sealing material 108, a so-called cell gap, a liquid crystal such as STN
(SuperTwisted Nematic) Liquid crystal L is sealed. A large number of minute and spherical spacers 119 are dispersed on the inner surface of the first substrate 107a or the second substrate 107b, and the thickness of the cell gap is kept uniform by the presence of these spacers 119 in the cell gap. .

The first electrode 114a and the second electrode 114b are arranged orthogonally to each other, and their intersections are arranged in a dot matrix when viewed from the direction of arrow D in FIG. Then, each intersection in the dot matrix forms one picture element pixel. The color filter 118
It is formed by arranging each color element of (red), G (green), and B (blue) in a predetermined pattern as viewed in the direction of arrow D, for example, a pattern such as a stripe arrangement, a delta arrangement, and a mosaic arrangement. The one picture element pixel corresponds to each of R, G, and B, and the three-color picture element pixels of R, G, and B form one unit to constitute one pixel.

By selectively emitting light from a plurality of picture element pixels arranged in a dot matrix, that is, pixels, an image such as a character or a number is displayed on the outside of the second substrate 107b of the liquid crystal panel 102. . The area in which an image is displayed in this manner is an effective pixel area, and the planar rectangular area indicated by an arrow V in FIGS. 15 and 16 is an effective display area.

In FIG. 16, the reflection film 112 is formed of a light-reflective material such as an APC alloy, Al (aluminum) or the like. Opening 1
21 are formed. As a result, the opening 121 is
, Are arranged in the same dot matrix as the picture element pixels.

First electrode 114a and second electrode 114b
Is formed of, for example, ITO which is a transparent conductive material. The alignment films 116a and 116b are formed by attaching a polyimide resin to a film having a uniform thickness. By subjecting these alignment films 116a and 116b to the rubbing treatment, the initial alignment of the liquid crystal molecules on the surfaces of the first substrate 107a and the second substrate 107b is determined.

In FIG. 15, the first substrate 107a is
The first substrate 107a has a larger area than the substrate 107b, and the first substrate 107a has a substrate overhang portion 107c that extends outside the second substrate 107b when these substrates are bonded to each other with the sealant 108. Then, the second electrode 114b on the second substrate 107b is connected to the substrate overhang portion 107c via a lead wire 114c extending from the first electrode 114a and a conductive material 109 (see FIG. 16) existing inside the sealing material 108. Wiring 114d that is electrically connected to the liquid crystal driving IC 103a, the input bump of the liquid crystal driving IC 103a, that is, the metal wiring 114e connected to the input terminal, and the liquid crystal driving IC
Metal wiring 114f connected to input bump 103b
And the like are formed in an appropriate pattern.

In this embodiment, the lead wiring 114c extending from the first electrode 114a and the lead wiring 114d conducting to the second electrode 114b are formed of ITO, that is, a conductive oxide, which is the same material as those electrodes. The metal wires 114e and 114f, which are wires on the input side of the liquid crystal driving ICs 103a and 103b, are formed of a metal material having a low electric resistance value, for example, an APC alloy.
APC alloys are alloys that mainly contain Ag and concomitantly contain Pd and Cu, for example, 98% Ag, 1% Pd, Cu
1% alloy.

Liquid crystal driving IC 103a and liquid crystal driving I
C103b is an ACF (Anisotropic Conductive Fil)
m: anisotropic conductive film) 122
It is mounted by being adhered to the surface of c. That is, in the present embodiment, a so-called COG (Chip On Glass) liquid crystal panel having a structure in which a semiconductor chip is directly mounted on a substrate is formed. In this COG type mounting structure, the input side bumps of the liquid crystal driving ICs 103a and 103b and the metal wirings 114e and 114f are conductively connected by the conductive particles contained in the ACF 122, and the output side of the liquid crystal driving ICs 103a and 103b. The bumps and the lead wirings 114c and 114d are conductively connected.

In FIG. 15, the FPC 104 has a flexible resin film 123, a circuit 126 including a chip component 124, and a metal wiring terminal 127. The circuit 126 is directly mounted on the surface of the resin film 123 by soldering or another conductive connection method. The metal wiring terminals 127 are formed of an APC alloy, Cr, Cu, or another conductive material. The portion of the FPC 104 where the metal wiring terminals 127 are formed is the first substrate 10
The ACF 122 is connected to a portion of the wiring 7a where the metal wiring 114e and the metal wiring 114f are formed. Then, due to the function of the conductive particles contained in the ACF 122, the metal wirings 114e and 114f on the substrate side and the metal wiring terminal 127 on the FPC side are conducted.

An external connection terminal 131 is formed at the opposite side end of the FPC 104, and the external connection terminal 131 is connected to an external circuit (not shown). Then, based on the signal transmitted from the external circuit, the liquid crystal driving IC 103a
And 103b are driven, and a scanning signal is supplied to one of the first electrode 114a and the second electrode 114b, and a data signal is supplied to the other. Thereby, the voltage of the pixel elements in the dot matrix arranged in the effective display area V is controlled for each pixel, and as a result, the orientation of the liquid crystal L is controlled for each pixel element.

In FIG. 15, a lighting device 106 functioning as a so-called backlight is provided as shown in FIG.
A light guide 132 made of acrylic resin or the like, a diffusion sheet 133 provided on a light exit surface 132b of the light guide 132, and a reflection sheet provided on a surface opposite to the light exit surface 132b of the light guide 132 134 and L as a light source
ED (Light Emitting Diode) 136.

The LED 136 is supported by an LED substrate 137, and the LED substrate 137 is mounted on a support (not shown) formed integrally with the light guide 132, for example. LE
When the D substrate 137 is mounted at a predetermined position on the support, the LED 136 is placed at a position facing the light intake surface 132 a, which is a side end surface of the light guide 132. Reference numeral 138 denotes a cushioning material for buffering an impact applied to the liquid crystal panel 102.

When the LED 136 emits light, the light is taken in from the light taking-in surface 132a, guided to the inside of the light guide 132, and propagated while being reflected by the reflection sheet 134 and the wall surface of the light guide 132 while being propagated. The light is emitted from the surface 132b through the diffusion sheet 133 to the outside as plane light.

Since the liquid crystal device 101 of the present embodiment is configured as described above, if the external light such as sunlight or indoor light is sufficiently bright, the external light from the second substrate 107b in FIG. Is taken into the liquid crystal panel 102, the light passes through the liquid crystal L, is reflected by the reflection film 112, and is supplied to the liquid crystal L again. The orientation of the liquid crystal L is controlled for each of the R, G, and B picture elements by the electrodes 114a and 114b sandwiching the liquid crystal L.
The light supplied to the liquid crystal panel 102 is modulated for each pixel pixel, and an image such as a character or a number is displayed outside the liquid crystal panel 102 by the light that passes through the polarizing plate 117b and the light that cannot pass through the modulation. Thus, a reflective display is performed.

On the other hand, when the amount of external light is not sufficient, the LED 136 emits light to emit plane light from the light emitting surface 132b of the light guide 132, and the light is
The liquid crystal L is supplied to the liquid crystal L through an opening 121 formed in the liquid crystal L. At this time, similarly to the reflection type display, the supplied light is modulated for each pixel by the liquid crystal L whose orientation is controlled, whereby an image is displayed outside. As a result, a transmissive display is performed.

The liquid crystal device 101 having the above configuration is manufactured by, for example, a manufacturing method shown in FIG. In this manufacturing method, a series of steps P1 to P6 is a step of forming the first substrate 107a, and steps P11 to P1 are performed.
A series of steps 4 is a step of forming the second substrate 107b. Usually, each of the first substrate forming step and the second substrate forming step is independently performed.

First, the first substrate forming step will be described. A plurality of reflective films 112 of the liquid crystal panel 102 are formed on the surface of a large-area mother substrate formed of translucent glass, translucent plastic or the like. The insulating film 113 is formed thereon by using a known film forming method (Step P1), and then the first electrode 114a and the wiring 114 are formed by using a photolithographic method or the like.
c, 114d, 114e and 114f are formed (step P
2).

Next, an alignment film 116a is formed on the first electrode 114a by coating, printing, or the like (step P3), and rubbing is performed on the alignment film 116a to determine the initial alignment of the liquid crystal. (Step P4). next,
For example, the sealing material 108 is formed in a ring shape by screen printing or the like (Step P5), and the spherical spacers 119 are dispersed thereon (Step P6). As described above, a large-area mother first substrate having a plurality of panel patterns on the first substrate 107a of the liquid crystal panel 102 is formed.

In addition to the above-described first substrate forming step, a second substrate forming step (steps P11 to P14 in FIG. 17) is performed. First, a large-area mother substrate made of a light-transmitting glass, a light-transmitting plastic, or the like is prepared, and a plurality of the color filters 118 of the liquid crystal panel 102 are provided on the surface thereof.
Is formed (Step P11). The process of forming the color filter is performed by using the manufacturing method shown in FIG. 4, and the color picture element forming step P3 and the protective film forming step P4 in the manufacturing method are performed by using the inkjet apparatus 16 of FIG. 1
3, executed according to the control method of the ink jet head shown in FIG. The method of manufacturing these color filters and the method of controlling the ink jet head are the same as those already described, and thus description thereof will be omitted.

After the black mask 6, the bank 5, the color picture element 3, and the protective film 4 are formed on the mother substrate 12 as shown in FIG. 1, the second electrode 114b is formed by photolithography. (Step P12) Further, an alignment film 116b is formed by coating, printing, or the like (Step P12).
13) Further, a rubbing process is performed on the alignment film 116b to determine the initial alignment of the liquid crystal (step P1).
4). As described above, the second substrate 107 of the liquid crystal panel 102
A large-area mother second substrate having a plurality of panel patterns on the substrate b is formed.

After the mother first substrate and the mother second substrate having a large area are formed as described above, the mother substrates are aligned with each other with the sealing material 108 interposed therebetween, that is, are aligned and bonded to each other (step P21). ). As a result, an empty panel structure including the panel portions for a plurality of liquid crystal panels and in which the liquid crystal is not yet sealed is formed.

Next, a scribe groove, that is, a cutting groove is formed at a predetermined position of the completed empty panel structure, and the panel structure is broken, that is, cut based on the scribe groove (step P22). As a result, the liquid crystal injection opening 11 of the sealing material 108 of each liquid crystal panel portion is formed.
A so-called strip-shaped empty panel structure in which 0 (see FIG. 15) is exposed to the outside is formed.

Thereafter, the liquid crystal L is injected into each liquid crystal panel through the exposed liquid crystal injection opening 110, and each liquid crystal injection port 110 is sealed with a resin or the like (step P23). In a normal liquid crystal injection process, for example, a liquid crystal is stored in a storage container, and the storage container storing the liquid crystal and a strip-shaped empty panel are placed in a chamber or the like, and the chamber or the like is evacuated, and then the chamber is evacuated. This is performed by immersing a strip-shaped empty panel in the liquid crystal inside the device, and then opening the chamber to atmospheric pressure. At this time, since the inside of the empty panel is in a vacuum state, the liquid crystal pressurized by the atmospheric pressure is introduced into the inside of the panel through the liquid crystal injection opening. Since liquid crystal adheres around the liquid crystal panel structure after the liquid crystal injection, the strip-shaped panel after the liquid crystal injection processing is subjected to a cleaning process in step P24.

After that, a scribe groove is formed again at a predetermined position on the strip-shaped mother panel after the liquid crystal injection and the washing are completed, and the strip-shaped panel is cut with reference to the scribe groove to obtain a plurality of pieces. The individual liquid crystal panels are cut out individually (step P25). As shown in FIG. 15, liquid crystal driving ICs 103a and 103b are mounted on each of the liquid crystal panels 102 thus manufactured, and a lighting device 106 is mounted as a backlight.
By connecting the liquid crystal device 104 to the target liquid crystal device 10
1 is completed (Step P26).

Regarding the liquid crystal device described above, especially in the portions of the color filter substrates 111b and 118,
As shown in FIG. 1, since the protective film 4 is not formed over the entire surface of the substrate 2, the amount of material used for the protective film 4 can be reduced and the cost can be reduced.

The color filter substrates 111b and 11b
8 can be made even more precise than the conventional color filter substrate shown in FIG. 18, so that the layer thickness of the liquid crystal L can be kept uniform in a plane, and as a result, the STN liquid crystal can be maintained. Display quality can be maintained at the time of displaying using birefringence as in the case of using TN liquid crystal. Further, the overall thickness of the color filter substrate 1 including the protective film 4 can be made smaller than that of the conventional color filter substrate shown in FIG.

(Other Embodiments) The present invention has been described with reference to the preferred embodiments. However, the present invention is not limited to the embodiments, and various modifications may be made within the scope of the invention described in the claims. Can be modified to

For example, in the above description, R,
Although G and B are used, the present invention is not limited to R, G and B. For example, C (cyan), M (magenta), and Y (yellow) may be employed. In that case,
Instead of the R, G and B color picture element materials, color picture element materials having C, M and Y colors may be used.

In the above-described embodiment, FIG.
Although six head units 20 are provided in the ink jet head 22 as shown in the drawings, the number of head units 20 can be reduced or increased.

Further, in the embodiment shown in FIG.
Although the case where a plurality of rows of color filter forming regions 11 are set in the mother base material 12 is illustrated, the present invention is also applicable to the case where one row of color filter forming regions 11 is set in the mother base material 12. Applicable. In addition, the present invention can be applied to a case where only one color filter forming region 11 having substantially the same size as the mother substrate 12 or considerably smaller than the mother substrate 12 is set in the mother substrate 12.

In the ink jet device 16 shown in FIGS. 5 and 6, the ink jet head 22 is moved in the X direction to scan the base material 12 in the main direction, and the base material 12 is moved in the Y direction by the sub-scanning driving device 21. In this case, the base 12 is sub-scanned by the inkjet head 22. Conversely, the main scanning is performed by moving the base 12 in the Y direction, and the X-
Sub-scanning can also be performed by moving in the direction.

Further, in the above embodiment, the ink jet head having a structure for discharging ink by using the bending deformation of the piezoelectric element is used, but an ink jet head having any other structure may be used.

[0148]

According to the color filter substrate and the method of manufacturing the same according to the present invention, and the liquid crystal device of the present invention, the protective film is formed in each region partitioned by the partition material.
Since the protective film is not formed over the entire surface of the base material, the consumption of the protective film material can be suppressed low, so that the color filter substrate or the liquid crystal device can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is an enlarged cross-sectional view showing a cross-sectional structure of one pixel portion of an embodiment of a color filter substrate according to the present invention.

FIG. 2A is a plan view of an embodiment of a color filter substrate according to the present invention, and FIG. 2B is a plan view of a mother substrate on which the color filter substrate is based.

FIG. 3 is a diagram illustrating an example of an arrangement form of a plurality of types of color picture elements formed on the surface of a color filter substrate.

FIG. 4 is a process chart showing one embodiment of a method for manufacturing a color filter substrate according to the present invention.

5 is a perspective view showing one embodiment of an ink jet device used in one step of the manufacturing method shown in FIG.

FIG. 6 is an enlarged perspective view showing a main part of the apparatus of FIG. 5;

7 is a perspective view showing one embodiment of an ink jet head used in the apparatus of FIG. 6 and one embodiment of a head unit used for the ink jet head.

FIG. 8 is a view showing the internal structure of the head portion of the ink jet head, (a) showing a partially cutaway perspective view,
(B) shows a cross-sectional structure along the line JJ of (a).

FIG. 9 is a block diagram showing an electric control system used in the ink jet device of FIG.

FIG. 10 is a flowchart showing a flow of control executed by the control system of FIG. 9;

FIG. 11 is a plan view schematically showing main steps of one embodiment of a color filter manufacturing method according to the present invention.

FIG. 12 is a perspective view showing a modified example of a head section of an inkjet head.

FIG. 13 is a plan view schematically showing main steps of another embodiment of the color filter manufacturing method according to the present invention.

FIG. 14 is a plan view schematically showing main steps of still another embodiment of the method for manufacturing a color filter according to the present invention.

FIG. 15 is a perspective view showing an embodiment of a liquid crystal device according to the present invention in an exploded state.

16 is a cross-sectional view showing a cross-sectional structure of the liquid crystal device according to line XX in FIG.

17 is a process chart showing one embodiment of a method for manufacturing the liquid crystal device shown in FIG.

FIG. 18 is a cross-sectional view illustrating a cross-sectional structure of one pixel portion of an example of a conventional color filter substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Color filter substrate 2 Base material 3 Color picture element 4 Protective film 5 Bank (partition material) 6 Black mask 7 Color picture element forming area 8 Color picture element material 10 Protective film material 11 Color filter forming area 12 Mother base material 16 Ink jet device 17 Head position Control device 18 Substrate position control device 19 Main scanning drive device 20 Head unit 21 Sub-scanning drive device 22 Inkjet head 25 Carriage 26 Head unit 27 Nozzle 28 Nozzle row 39 Ink pressurizing body 41 Piezoelectric element 49 Table 81 Head camera 82 Head substrate Camera 101 Liquid crystal device 102 Liquid crystal panel 107a, 107b Substrate 111a, 111b Base material 114a, 114b Electrode 118 Color filter L Liquid crystal M Color picture element material, protective film material X Main scanning direction Y Sub scanning direction

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Satoru Katakami 3-3-5 Yamato, Suwa City, Nagano Prefecture Inside Seiko Epson Corporation (72) Inventor Masaharu Shimizu 3-5-5 Yamato, Suwa City, Nagano Prefecture Seiko Epson (72) Inventor Hiroshi Kiguchi 3-3-5 Yamato, Suwa City, Nagano Prefecture Seiko Epson Corporation F-term (reference) 2H048 BA11 BA64 BB02 BB24 BB37 BB42 2H090 HA05 HB07X HB08X HB15X HC01 HC05 LA05 LA15 2H091 FA02Y FAY GA16 HA07 HA10 LA12 LA30

Claims (17)

[Claims] 1. A base material, a partition material for partitioning the surface of the base material into a plurality of regions, a color picture element provided thinner in the plurality of regions than the partition material, A color filter substrate, comprising: a protective film provided on the color picture element with a thickness not exceeding the partition material. 2. The color filter substrate according to claim 1, wherein the plurality of protective films include protective films having different thicknesses. 3. The color filter substrate according to claim 1, wherein the top surfaces of the plurality of protective films are formed at a height substantially equal to the top surface of the partitioning material. 4. The color picture element according to claim 1, wherein the plurality of color picture elements include color picture elements having different thicknesses, and the protective film is formed according to a difference in the thickness of the color picture elements. A color filter substrate comprising protective films having different thicknesses. 5. The color filter substrate according to claim 1, wherein the partition member is formed on a black mask or doubles as a black mask. 6. A partitioning material forming step of forming a partitioning material for partitioning the surface of the base material into a plurality of regions on the base material, and forming a color picture element thinner than the partitioning material in the plurality of regions. A protective film forming step of forming a protective film on the color picture elements of the plurality of regions formed on the plurality of regions. A method for manufacturing a color filter substrate, comprising forming a protective film by discharging to a region. 7. The color filter substrate according to claim 6, wherein in the protective film forming step, the protective film has a top surface formed at substantially the same height as a top surface of the partitioning material. Production method. 8. The color picture element forming step according to claim 6, wherein in the color picture element forming step, the plurality of color picture elements form color picture elements having different thicknesses, and in the protective film forming step, the protective film has a thickness of the color picture element. A method for manufacturing a color filter substrate, comprising forming a protective film having a different thickness according to a difference in thickness. 9. The color picture element according to claim 6, wherein in the color picture element forming step, a color picture element material is discharged as droplets to the plurality of regions to form a color picture element. Manufacturing method of a color filter substrate. 10. The protective film material according to claim 6, wherein the protective film material is an acrylic resin,
A method of manufacturing a color filter substrate, comprising at least one of an epoxy resin, an imide resin, and a fluorine resin. 11. The protective film according to claim 6, wherein the viscosity of the protective film is 4 cps to 4 cps.
A method for manufacturing a color filter substrate, wherein the method is 50 cps. 12. A liquid crystal device comprising: a pair of substrates sandwiching liquid crystal; and a color filter substrate formed on at least one of the substrates, wherein the color filter substrate includes a base material and a plurality of base material surfaces. A partition material for partitioning into areas, a color picture element provided thinner than the partition material in the plurality of areas, and a color picture element provided on the color picture elements in the plurality of areas with a thickness not exceeding the partition material. A liquid crystal device comprising: a protective film; 13. The liquid crystal device according to claim 12, wherein the plurality of protective films include protective films having different thicknesses. 14. The method according to claim 12, wherein
A liquid crystal device, wherein the plurality of protective films have their top surfaces formed at a height substantially equal to the top surface of the partition material. 15. The color picture element according to claim 12, wherein the plurality of color picture elements include color picture elements having different thicknesses, and the protective film is formed according to a difference in the thickness of the color picture elements. A liquid crystal device comprising protective films having different thicknesses. 16. The liquid crystal device according to at least one of claims 12 to 15, wherein the partitioning material is formed on a black mask or doubles as a black mask. 17. The liquid crystal display device according to claim 12, wherein the liquid crystal is an STN (Super Twist).
A liquid crystal device characterized by being an isted Nematic) liquid crystal or a TN (Twisted Nematic) liquid crystal.