JP2002162417A - Electric inspection jig - Google Patents

Abstract

(57) [Problem] To provide an electric inspection jig having a structure in which even if there is a difference in the height of the inspection point of the object to be inspected, it follows the height difference of the inspection point and does not cause a contact failure. And A wiring substrate and a pad for connecting a measuring instrument are provided on one surface of a film substrate, and a test electrode is provided on the other surface.
1 are formed, and cuts 41 are formed in the periphery of the tip of the test electrode 31 and the wiring 21 to obtain the electric test jig 100 of the present invention.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electrical inspection jig used for electrical inspection of various circuit boards and semiconductor circuit elements.

[0002]

2. Description of the Related Art Inspection is performed on printed wiring boards, substrates for semiconductor packages such as TAB (tape automated bonding), BGA (ball grid array), and CSP (chip size package), or electrical inspection jigs for semiconductor circuit elements. Inspection jig with spring probe or rigid probe for each point, Inspection jig combining anisotropic conductive rubber and conversion board, Two-pass inspection jig using conductive rubber, Membrane made of conversion board with thin film There are mold inspection jigs.

An inspection jig in which a spring probe or a rigid probe is set for each inspection point has the advantages of high processing performance and 100% net guarantee, but has a high jig manufacturing cost and is expensive. There is a problem that it is not possible to cope with a point having a very small pitch.

An inspection jig combining an anisotropic conductive rubber and a conversion board, like the above-mentioned inspection jig, has a high processing capability and 10
Although there is an advantage that a 0 (%) net can be guaranteed, the jig manufacturing cost is high, and it is not possible to cope with a narrow inspection point pitch due to the structure of the anisotropic conductive rubber. However, there is a problem that contact failure is not easily generated.

[0005] The two-pass inspection using conductive rubber has the advantage that the jig manufacturing cost is low. On the other hand, since the continuity inspection and the insulation inspection are performed separately, the processing capacity is reduced to about half. There is a problem that a defect may not be detected.

[0006] A membrane-type inspection jig having an inspection electrode in contact with an inspection point on a thin film and a pad for connecting a measuring instrument, and a wiring connecting the inspection electrode is a jig as compared with a jig using a spring probe or a rigid probe. In addition to the low production cost, 100 (%) net guarantee is possible, and there is an advantage that the inspection electrode having the same pitch as the inspection object and the inspection point can be easily reproduced. However, they have a problem that they cannot follow irregularities and are likely to cause poor contact.

Hereinafter, a conventional membrane-type inspection jig will be described with reference to the drawings. FIG. 3A is a perspective view showing an example of a conventional membrane-type inspection jig 200, and FIG.
FIG. 3B shows the tip of the wiring above the test electrode in FIG.
FIGS. 4A and 4B are cross-sectional views taken along line A ′, and FIGS. 4A and 4B show a test object 3 using a conventional membrane-type test jig 200.
The schematic cross-sectional views each showing a state where the inspection point of 00 is inspected are shown. The conventional membrane-type inspection jig 200 is such that a wiring 121 and a pad 122 for connecting a measuring instrument are formed on one surface of a film substrate 111, and an inspection electrode 131 is formed on the other surface (FIG. 3A). ) And (b)).

FIG. 4A shows a state in which a continuity test is performed on a test object 300 having test points 61 and 61 a formed on a base material 51 using a conventional membrane-type test jig 200.
And (b). Here, the inspection point 61 indicates an inspection point having the same height, and the inspection point 61a indicates an inspection point formed at a position lower than the inspection point 61. In the case of the inspection point 61 where there is no difference in the height of the inspection point, as shown in FIG.
The inspection electrode 131 of 0 is in contact with the inspection point 61 of the device 300 to be inspected, and a conductive state is obtained.
a does not contact, and a contact failure occurs. Further, the pressing member 7
When the pressure of 1 is increased, the inspection electrode 131 approaches the inspection point 61a and tries to contact it. However, when the inspection electrode 131 approaches a certain distance, the inspection electrode 131 stops and cannot approach any more. This is because the inspection electrodes 131 are connected to the film substrate 111.
The connection is caused by the force of attracting each other, and a certain distance or more cannot approach the inspection point 61a, resulting in poor contact. This contact failure is caused by the film substrate 13
1 changes depending on the material, thickness, electrode pitch, and the like, and is a factor that causes contact instability in electrical inspection.

[0009]

SUMMARY OF THE INVENTION The present invention has been devised in view of the above problems, and follows the difference in the height of the inspection point even if the height of the inspection point of the object to be inspected is different. An object of the present invention is to provide an electric inspection jig having a structure that does not cause a contact failure.

[0010]

According to the present invention, there is provided an inspection jig for performing an electrical inspection of various circuit boards and semiconductor circuit elements. On a substrate, an inspection electrode for contacting an inspection point of an object to be inspected, a pad for connecting a measuring device, and a membrane-type inspection jig having a wiring connecting them, A membrane-type electric inspection jig characterized in that a cut is made in the periphery of the tip of the wiring.

[0011]

Embodiments of the present invention will be described below. FIG. 1A is a perspective view showing an embodiment of a membrane-type electric inspection jig 100 of the present invention, FIG. 1B is a partially enlarged plan view of a region B in FIG. FIG. 2C is a cross-sectional view taken along line AA ′ of FIG.
(A) and (b) are membrane-type inspection jigs 1 of the present invention.
00 is a schematic cross-sectional view showing a state where the inspection point of the inspection object 300 is inspected using 00. In the membrane-type electric inspection jig 100 of the present invention, a wiring 21 and a pad 22 for connecting a measuring instrument are formed on one surface of a film substrate 11, and an inspection electrode 31 is formed on the other surface. A cut 41 is formed in the periphery of the leading end of the wiring 21 (see FIGS. 1A, 1B and 1C). As the film substrate 11, a polyester film or a polyimide film is used. The wiring 21, the pad 22, and the inspection electrode 31 are manufactured by a known method, and the wiring 21 and the inspection electrode 31 are electrically connected by a via hole. The notch 41 is formed by laser processing or the like on the periphery of the tip of the inspection electrode 31 and the wiring 21, and the length of the notch 41 is appropriately set according to the type and thickness of the film substrate 11, the pitch of the inspection electrode 31, etc., but is about 1 mm. Is preferred. If the length is too short, sufficient followability with respect to an inspection point having a low height cannot be obtained, and if the length is too long, a lateral blur occurs.

[0012] The membrane type electric inspection jig 10 of the present invention.
FIG. 2 shows a state in which a continuity test is performed on the test object 300 in which the test points 61 and 61a are formed on the base material 51 using 0.
(A) and (b) show schematically. Here, the inspection point 61
Indicates an inspection point having the same height, and inspection point 61a indicates an inspection point formed at a position lower than inspection point 61.

In the case of the inspection point 61 where there is no difference in the height of the inspection point, the inspection electrode 31 of the inspection jig 100 is covered with the pressing member 71 slightly pressed as shown in FIG. In contrast to the inspection point 61 of the inspection body 300, a conduction state is obtained, and in the case of the inspection point 61a having a difference in the height of the inspection point, the inspection electrode 31 does not contact the inspection point 61a. Further, when the pressure member 71 is pressed, the inspection electrode 61 and the inspection point 61 having a difference in the height of the inspection point come into contact with each other, so that reliable electrical conduction is obtained. This is because the film base 1 is formed by the cuts 41 formed in the periphery of the tip of the test electrode 31 and the wiring 21.
This is because the inspection electrode 31 is easily moved in the vertical direction with respect to 1.

[0014]

The electrical inspection jig of the membrane type according to the present invention has a difference in the height of inspection points in electrical inspection of printed circuit boards, substrates for semiconductor packages such as TAB, BGA, CSP, etc., or semiconductor circuit elements. Even in some cases, the inspection electrode can surely come into contact with the inspection point, and improvement in reliability and processing ability of the electrical inspection can be expected.

[Brief description of the drawings]

FIG. 1A is a perspective view showing an embodiment of a membrane-type electric inspection jig 100 according to the present invention. (B)
FIG. 3A is a partially enlarged plan view of a region B in FIG. (C)
FIG. 2B is a cross-sectional view of the configuration taken along line AA ′.

FIGS. 2A and 2B are schematic cross-sectional views showing a state where an inspection point of an inspection object 300 is inspected using a membrane-type inspection jig 100 of the present invention.

FIG. 3A shows a conventional membrane-type inspection jig 20;
It is a perspective view which shows an example of 0. FIG. 2B is a cross-sectional view taken along the line AA ′ of the tip of the wiring above the inspection electrode in FIG.

FIGS. 4A and 4B are schematic cross-sectional views showing a state where an inspection point of an inspection object 300 is inspected using a conventional membrane-type inspection jig 200. FIGS.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Film base material 21 ... Wiring 22 ... Pad 31 ... Inspection electrode 41 ... Cut 51 ... Base material 61, 61a ... Inspection point 71 ... Pressing member 100 ... Electrical inspection judge of this invention Tool 111 Film base material 121 Wiring 122 Pad 131 Test electrode 200 Conventional electric test jig 300 Test object

 ──────────────────────────────────────────────────の Continued on the front page F term (reference) 2G003 AA00 AG03 AG07 AG12 2G011 AA15 AA21 AB01 AB06 AB08 AC14 AE01 AE03 AE22 AF06 2G032 AA00 AF02 AL03 5E024 CB04

Claims (1)

[Claims] An inspection jig for performing an electrical inspection of various circuit boards and semiconductor circuit elements, comprising an inspection electrode for contacting an inspection point of an inspection object on a thin film-like base material. In a membrane-type inspection jig having a pad for connecting a measuring machine and a wiring connecting the same, a cut is made in a periphery of a tip of the wiring near the inspection electrode, wherein a membrane-type electrical inspection is performed. jig.