JP2002158199A - Method for manufacturing conveying member with cleaning function and cleaning sheet used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a member for cleaning without generating cutting chips at a sheet cutting time in a directly cutting method and capable of surely conveying in a substrate treating unit and simply and surely removing an adhered contamination. SOLUTION: The method for manufacturing a conveying member with a cleaning function comprises the steps of adhering the cleaning sheet having a cleaning layer made of a pressure sensitive adhesive polymerization curd by receiving an active energy to one side surface of a support and the sheet having a normal pressure sensitive adhesive provided on the other surface via the normal pressure sensitive adhesive layer in shape larger than the shape of the conveying member to the conveying member, and cutting the sheet along the shape of the conveying member. In this case, the polymerization curing reaction of the cleaning layer is executed after the sheet is cut in the shape of the conveying member.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a transporting member having a cleaning function for various substrate processing apparatuses, for example, a substrate processing apparatus which does not like foreign substances, such as a manufacturing apparatus such as a semiconductor, a flat panel display and a printed board, and an inspection apparatus. The present invention relates to a method for manufacturing a conveying member having a cleaning function of an apparatus.

[0002]

2. Description of the Related Art A substrate processing apparatus transports a substrate while physically contacting each transport system with the substrate. At that time, if foreign matter is attached to the substrate or the transport system, the subsequent substrate is contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. For this reason, there were problems that the operation rate was reduced and a great deal of labor was required. To solve these problems,
A method for cleaning and removing adhered foreign matter in a substrate processing apparatus by transporting a substrate to which an adhesive substance is fixed (Japanese Patent Laid-Open No. 10-154686), and removing foreign matter attached to the back surface of a substrate by transporting a plate-like member (Japanese Patent Laid-Open No. 11-87458) has been proposed.

[0003]

The method of cleaning and removing the adhered foreign matter in the substrate processing apparatus by transporting the substrate to which the adhesive substance is fixed is an effective method for overcoming the above-mentioned problem. However, in this method, there is a possibility that the adhesive substance and the contact portion of the device are so strongly adhered that they cannot be separated, and that the substrate cannot be transported reliably. In particular, there is a problem when a vacuum suction mechanism is used for the chuck table of the apparatus. In addition, the method of removing foreign matter by transporting the plate-like member can perform transportation without any trouble, but has a problem that the essential dust-removing property is inferior. Further, with respect to a method of manufacturing the conveying member with a cleaning function (hereinafter referred to as a cleaning member), for example, when a cleaning member is manufactured by bonding a cleaning sheet to a conveying member such as a substrate, a cleaning sheet larger than the member shape is bonded. When the cleaning sheet is cut along the member shape after attaching (this method is referred to as the direct cut method), cutting chips are generated from the cleaning layer and the like when cutting the sheet, and adhere to the cleaning member or device. It becomes a problem. Also, when manufacturing a cleaning member by attaching a label cleaning sheet that has been processed in advance to the member shape to the transport member, the generation of cutting chips during label processing can be suppressed as compared with the direct cut method. In addition, since the label sheet must be cut in advance, the number of working steps increases, and the production of the cleaning member becomes complicated, resulting in poor workability. In view of such circumstances, the present invention provides a cleaning member that can reliably transport inside a substrate processing apparatus, can easily and reliably remove adhered foreign matter, and does not generate cutting chips when cutting a sheet in a direct cut method. The purpose of the present invention is to provide a manufacturing method.

[0004]

Means for Solving the Problems The inventors of the present invention have made intensive studies on the above-mentioned objects, and as a result, when manufacturing a cleaning member by bonding a cleaning sheet to a transfer member such as a substrate, a direct cut method has been proposed. When the cleaning member is manufactured by the method, the above problem is solved by forming the cleaning layer into an adhesive that polymerizes and cures by receiving the active energy, and further performs the polymerization curing reaction of the cleaning layer after the cleaning sheet is cut into a conveying member shape. The present inventors have found that it is possible to manufacture a cleaning member that can easily and surely peel off foreign matters without causing any problem, and have completed the present invention.

That is, according to the present invention, a cleaning sheet comprising a pressure-sensitive adhesive which is polymerized and cured by receiving active energy on one side of a support, and a normal pressure-sensitive adhesive layer provided on the other side, is used for cleaning the sheet. In a method for manufacturing a conveying member with a cleaning function of pasting the conveying member through the agent layer in a shape larger than the conveying member shape, and then cutting the cleaning sheet along the conveying member shape, the polymerization curing reaction of the cleaning layer is A method for manufacturing a transporting member with a cleaning function, which is performed after the cleaning sheet is cut into a transporting member shape (Claim 1), wherein the cleaning layer has a pressure-sensitive adhesive polymer and one unsaturated double bond in the molecule. The use of a cleaning sheet that is a curable pressure-sensitive adhesive comprising at least one polymerizable unsaturated compound and a polymerization initiator 2. A method for manufacturing a transport member with a cleaning function according to claim 1 (claim 2).
3. The method according to claim 2, wherein the pressure-sensitive adhesive polymer is an acrylic polymer having an alkyl (meth) acrylate as a main monomer. 3. The method according to claim 2, wherein the initiator is a photopolymerization initiator, and the cleaning layer is a photocurable pressure-sensitive adhesive layer. Tensile modulus of elasticity when cutting a sheet (Test method JIS K71
27) is 1 Mpa or less, and the method according to any one of claims 1 to 4, wherein the cleaning member has a cleaning function.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In the method of manufacturing a cleaning member according to the present invention, it is necessary that the cleaning layer be an adhesive which is polymerized and cured by active energy, and that the polymerization and curing reaction be performed after cutting the sheet. If the cleaning layer is polymerized and cured before the sheet is cut, the cleaning layer has a high elastic modulus due to crosslinking, and a large amount of cutting chips are generated at the time of cutting, and adhere to cleaning members and devices. To prevent cutting chips from being generated from the cleaning layer when cutting the sheet, the tensile elasticity of the cleaning layer (test method J
ISK7127) is 1Mpa or less, preferably 0.1M
It is desirably not more than pa. By setting the tensile modulus to be equal to or less than the specific value, generation of cutting chips from the cleaning layer at the time of cutting the sheet can be suppressed, and a cleaning member to which no cutting chips adhere in the direct cut method can be manufactured. In addition, when an adhesive that polymerizes and cures is used for the cleaning layer, it is polymerized and cured after the sheet is cut, so that the cleaning layer has substantially no tackiness and can strongly adhere to the device contact portion when transporting the cleaning member. Thus, an effect is obtained that a cleaning member that can be transported reliably can be provided.

The active energy source used for curing the pressure-sensitive adhesive layer includes ultraviolet rays, heat and the like, and ultraviolet rays are preferred. The material and the like of the cleaning layer are not particularly limited as long as it has a property of being cured by an active energy source to form a three-dimensional network molecular structure. For example, the pressure-sensitive adhesive polymer has a unsaturated double bond in the molecule. And a polymerization initiator containing at least one polymerizable unsaturated compound and a polymerization initiator. Examples of such a pressure-sensitive adhesive polymer include acrylic polymers having a main monomer of (meth) acrylic acid and / or (meth) acrylic ester selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester. . In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is synthesized from the synthesized acrylic polymer. By introducing an unsaturated double bond into the molecule of the acrylic polymer, for example, by forming a chemical bond through a reaction between functional groups, the polymer itself can be involved in the polymerization curing reaction by active energy. Can also.

Here, the compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is a low molecular weight compound which is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, the adhesive layer preferably has a molecular weight of 5,000 or less so that the three-dimensional network of the adhesive layer at the time of curing can be efficiently formed.

Here, as the polymerizable unsaturated compound,
It is preferable that the low molecular weight compound is non-volatile and has a weight average molecular weight of 10,000 or less, and particularly has a molecular weight of 5000 or less so that the three-dimensional network of the cleaning layer at the time of curing can be efficiently formed. preferable. Examples of such polymerizable compounds include phenoxypolyethylene glycol (meth) acrylate, ε-caprolactone (meth) acrylate, polyethylene glycol di (meth) acrylate, and polypropylene glycol (Meth) acrylate, trimethylpropane tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, oligoester (meth) )
Acrylate and the like can be mentioned, and one or more of these are used.

The polymerization initiator added to the pressure-sensitive adhesive layer is
Known ones can be used without particular limitation.For example, when heat is used for active energy, benzoyl peroxide, a thermal polymerization initiator such as azobisisobutyronitrile,
When light is used, benzoyl, benzoin ethyl ether, sibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone chlorothioxanthone, dodecyl thioxanthone, cimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α-hydroxycyclohexyl phenyl ketone , 2-hydroxymethylphenylpropane, 2,
Photopolymerization initiators such as 2-dimethoxy-2-phenylacetophenone are exemplified.

Further, in the present invention, the tensile elastic modulus of the cleaning layer after cutting the sheet is increased by 10 Mp by promoting the crosslinking reaction and curing by the active energy source.
a or more, preferably 10 Mpa to 2000 Mpa. If the tensile modulus exceeds 2,000 MPa, the ability to remove adhering foreign matter on the transport system is reduced,
If it is smaller than 10 Mpa, it may adhere to a portion to be cleaned in the apparatus at the time of transport, which may cause a transport trouble. The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually 5 to 1
It is about 00 μm.

In the production of the cleaning member according to the present invention, the above specific pressure-sensitive adhesive layer is provided as a cleaning layer on one side of the support, and a normal pressure-sensitive adhesive layer is provided on the other side. An uncured cleaning sheet is used. The material of the pressure-sensitive adhesive layer on the other side is not particularly limited as long as it satisfies the pressure-sensitive adhesive function, and a normal pressure-sensitive adhesive (for example, acrylic or rubber-based) can be used. When the transport member is reused, it is peeled off from the pressure-sensitive adhesive layer. Therefore, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer is such that the 180-degree peeling pressure on the silicon wafer (mirror surface) is 0.20 to 0.1 mm. If it is 98 N / 10 mm, especially about 0.40 to 0.98 N / 10 mm, it can be easily peeled again after cleaning without peeling during transportation.

The support for supporting such a cleaning layer is not particularly limited. For example, polyethylene, polyethylene terephthalate, acetylcellulose, polycarbonate, polypropylene, polyimide,
Examples include plastic films such as polyamide, polycarbodiimide, and nylon films. The thickness of the support film is usually about 10 μm to 100 μm.

The transport member to which the cleaning sheet is adhered is not particularly limited, and examples thereof include semiconductor wafers, substrates for flat panel displays such as LCDs and PDPs, and other substrates such as compact disks and MR heads.

[0015]

The present invention will be described below with reference to examples, but the present invention is not limited to these examples. Hereinafter, “parts” means “parts by weight”. Example 1 Acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture composed of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid
100 parts of polyethylene glycol 200 dimethacrylate (manufactured by Shin-Nakamura Chemical: trade name: Nk ester 4)
G) 50 parts, urethane acrylate (manufactured by Shin-Nakamura Chemical: trade name: UN-01) 50 parts, polyisocyanate compound (manufactured by Nippon Polyurethane Industry: trade name: Coronate L)
3 parts of benzyldimethyl ketal (trade name: Irgacure 651 manufactured by Ciba Specialty Chemicals) as a photopolymerization initiator were uniformly mixed to prepare a UV-curable pressure-sensitive adhesive solution A. On the other hand, a normal pressure-sensitive adhesive solution A obtained in the same manner as above except that benzyldimethylketanol was removed from the above-mentioned adhesive was obtained. This normal pressure-sensitive adhesive solution A was applied to one side of a polyester support film having a width of 250 mm and a thickness of 25 μm so that the thickness after drying became 10 μm to form an ordinary pressure-sensitive adhesive layer. A 38 μm polyester release film was applied. On the other side of the support film, the above-mentioned UV-curable pressure-sensitive adhesive solution A is applied so that the thickness after drying becomes 30 μm to provide a pressure-sensitive adhesive layer as a cleaning layer, and a similar release film is formed on the surface thereof. Was applied to prepare a cleaning sheet A.

When the tensile elasticity modulus (test method JIS K7127) of this UV-curable pressure-sensitive adhesive A was measured, it was determined that the UV-curable pressure-sensitive adhesive A had a value of 0.1 in a state where the curing reaction was not performed by ultraviolet rays.
1Mpa, integrated light quantity 10
It was 49 Mpa after irradiation with 00 mJ / cm ² . Also,
The 180 ° peeling adhesive strength of this normal adhesive layer to a silicon wafer (mirror surface) is 0.25 N / 10 mm.
Met. Using this cleaning sheet A, a direct-cut tape applicator (NEL-D manufactured by Nitto Seiki)
R8500II), the sheet was attached to the wafer.
At this time, the sheet A was attached to the back surface (mirror surface) of an 8-inch silicon wafer, and cut into a wafer shape by direct cutting. When this operation was continuously performed on 25 sheets, no cutting chips were generated at the time of cutting the sheet. Thereafter, the center wavelength 36
Ultraviolet light of 5 nm was irradiated at an integrated light quantity of 1000 mJ / cm ² to prepare a transfer cleaning wafer A having a cleaning function. On the other hand, using a laser type foreign matter measuring device, foreign matter of 0.2 μm or more was measured on the mirror surface of four new 8-inch silicon wafers.
The 9th sheet and the 4th sheet were 5. After transporting these wafers to a substrate processing apparatus having separate electrostatic suction mechanisms with the mirror surface facing down,
When a foreign substance having a size of 0.2 μm or more was measured, one was 31254 pieces in an 8-inch wafer size area, and the other was 2
9954, the third 28683, the fourth 2798
There were six. Next, the release film on the cleaning layer side of the transport cleaning wafer A obtained above was peeled off, and was transported into the substrate processing apparatus having the wafer stage to which the above-mentioned 31254 foreign substances had adhered. Thereafter, a new 8-inch silicon wafer was transported with the mirror surface facing downward, and a foreign substance having a size of 0.2 μm or more was measured by a laser type foreign substance measuring apparatus. This operation was performed five times, and the results are shown in Table 1.

Example 2 As an ultraviolet-curable pressure-sensitive adhesive, an acrylic polymer (weight average molecular weight 2.8 million) obtained from a monomer mixture comprising 30 parts of 2-ethylhexyl acrylate, 70 parts of methyl acrylate and 10 parts of acrylic acid 100 parts), 100 parts of a polyfunctional urethane acrylate (trade name: UV 1700B, manufactured by Nippon Synthetic Chemical Company), 3 parts of a polyisocyanate compound (trade name: Coronate L, manufactured by Nippon Polyurethane Industry), and a photopolymerization initiator Example 1 except that UV-curable pressure-sensitive adhesive solution B obtained by uniformly mixing 10 parts of benzyldimethyl ketal (trade name: Irgacure 651 manufactured by Ciba Specialty Chemicals) was used.
A cleaning sheet B was prepared in the same manner as described above. When the tensile elasticity modulus of the ultraviolet-curable pressure-sensitive adhesive B was measured, it was measured that after irradiation with an integrated light amount of 1000 mJ / cm ² of 0.01 Mpa and a central wavelength of 365 nm before curing, 14%.
It was 40 Mpa.

Using this cleaning sheet B, 25 wafers with a sheet were produced by the direct cut method in the same manner as in Example 1. As a result, no cutting chips were generated when cutting the sheet. Five of these were irradiated with an integrated light quantity of 1000 mJ / cm ² with ultraviolet light having a central wavelength of 365 nm, and a transfer cleaning wafer B with a cleaning function was applied.
Was prepared. Next, the release film on the cleaning layer side of the transport cleaning wafer B obtained above was peeled off, and was transported into a substrate processing apparatus having a wafer stage to which 29954 foreign substances had adhered. After that, the 8-inch silicon wafer is transported with the mirror surface facing downward, and the laser type foreign matter measuring device is used to transfer the silicon wafer.
Foreign matter having a size of μm or more was measured. This operation was performed five times, and the results are shown in Table 1.

Comparative Example 1 Direct cutting was performed in the same manner as in Example 1 except that the cleaning sheet A was irradiated with an integrated amount of 1000 mJ / cm ² of ultraviolet light having a central wavelength of 365 nm before the wafer was attached to the cleaning sheet A to prepare and use the cleaning sheet C. When a wafer with a sheet was manufactured by the method, a large amount of cutting chips was generated from the cleaning layer at the time of cutting the sheet, and a large number of cutting chips adhered to the edge of the wafer with the sheet, the back surface of the wafer, and the tape attaching device. Therefore, the production of the wafer C with a sheet was stopped.

Comparative Example 2 A cleaning sheet D was prepared in the same manner as in Example 1 except that the pressure-sensitive adhesive solution A shown in Example 1 was used as the cleaning layer adhesive. In this case, the tensile modulus of the cleaning layer was 0.1 Mpa. When a wafer with a sheet was produced from this cleaning sheet D by the direct cut method in the same manner as in Example 1, no cutting chips were generated at the time of cutting the sheet, and 25 sheets could be produced. When the transfer cleaning wafer D was transferred by a substrate processing apparatus having a wafer stage to which 27986 foreign substances had adhered, the first cleaning wafer D was fixed to the wafer stage and could not be transferred.

[0021]

[0022]

As described above, according to the method of manufacturing a cleaning member of the present invention, it is possible to manufacture a cleaning member free from generation of cutting chips at the time of manufacturing by a direct cut method, and to ensure the inside of a substrate processing apparatus. And a cleaning member that can easily and surely remove foreign matters adhering in the apparatus.

Claims (8)

[Claims] 1. A cleaning sheet comprising a pressure-sensitive adhesive which is polymerized and cured by receiving active energy on one side of a support, and a cleaning sheet having a normal pressure-sensitive adhesive layer provided on the other side. In the method of manufacturing a conveying member with a cleaning function of bonding the conveying member to the conveying member in a shape larger than the conveying member shape, and thereafter cutting the cleaning sheet along the conveying member shape, the polymerization and curing reaction of the cleaning layer causes the cleaning sheet to A method for producing a conveying member with a cleaning function, which is performed after cutting into a conveying member shape. 2. A cleaning sheet as a curable pressure-sensitive adhesive, wherein the cleaning layer comprises a pressure-sensitive adhesive polymer, a polymerizable unsaturated compound having at least one unsaturated double bond in a molecule, and a polymerization initiator. 2. The method according to claim 1, wherein the conveying member has a cleaning function. 3. The method according to claim 2, wherein the pressure-sensitive adhesive polymer according to claim 2 is an acrylic polymer having an alkyl (meth) acrylate as a main monomer. 4. The conveying member with a cleaning function according to claim 2, wherein the polymerization initiator according to claim 2 is a photopolymerization initiator, and the cleaning layer is a photocurable pressure-sensitive adhesive layer. Production method. 5. The tensile modulus of the cleaning layer at the time of cutting the sheet (according to the test method JIS K7127) is 1M.
The method for producing a transport member with a cleaning function according to any one of claims 1 to 4, wherein the transport member is not more than pa. 6. The tensile modulus of the cleaning layer after polymerization and curing (according to the test method JIS K7127) is 10 Mp.
The method for producing a conveying member with a cleaning function according to any one of claims 1 to 5, wherein the number is not less than a. 7. A method for cleaning a substrate processing apparatus, comprising transporting a transport member obtained by the method for manufacturing a transport member with a cleaning function according to claim 1 into a substrate processing apparatus. 8. A cleaning layer made of a pressure-sensitive adhesive that can be polymerized and cured by receiving active energy on one side of the support, and a normal pressure-sensitive adhesive layer is provided on the other side, and the cleaning layer is in an uncured state. A cleaning sheet used in the method of manufacturing a transport member with a cleaning function according to claim 1.