JP2002154041A - Polishing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device capable of easily positioning a polishing head 7 and a material P to be polished, by enlarging an contact area of the material P to be polished, fixed on a polishing board 1, with a polishing tape 7 in the polishing head 7. SOLUTION: This polishing device is provided with a polishing head body 2 to which the polishing tape T is attached, and the polishing board 1 to which the material to be polished P is attached, and the device brings the polishing tape T into contact with an outer peripheral surface portion of the material P to be polished placed on the polishing board 1 to thereby polish the material P to be polished. The polishing head body 2 is rotatable, and comprises a running mechanism 6 for running the polishing tape T, and the polishing head 7 for urging the polishing tape T onto the material P to be polished on the polishing board 1. The polishing head 7 has an urging surface 71 provided with a plane surface orthogonal to a rotary axis (a) of the polishing head body 2, and brings the polishing tape T positioned on the urging surface 71 into contact with the material P to be polished.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a polishing head body on which a polishing tape is mounted, and a polishing table on which a material to be polished is mounted. The polishing tape is mounted on the outer peripheral surface of the material to be polished installed on the polishing table. The present invention relates to a polishing apparatus for polishing a material to be polished in contact therewith.

[0002]

2. Description of the Related Art A semiconductor silicon wafer whose surface has been mirror-finished is subjected to chamfering on the outer peripheral end face, and then mirror-finished on the outer peripheral end face. The polishing apparatus for performing the mirror finishing includes a polishing head body on which a polishing tape is mounted, and a polishing table on which a material to be polished is mounted. The polishing tape is brought into contact with the outer peripheral surface of the material to be polished installed on the polishing table. There is a polishing apparatus that polishes a material to be polished (JP-A-11-338).
No. 93).

In this type of polishing apparatus, a wafer is fixed to a polishing table by suction means, a plurality of pulleys are provided on a polishing head body, and an endless belt-shaped polishing tape is wrapped around these pulleys, and the polishing tape is transferred to the polishing head. The two pulleys are used to press the outer peripheral surface of the workpiece.

That is, the polishing head has one pulley,
The polishing tape is used as a pressing roller for pressing the polishing tape against the outer peripheral surface of the workpiece, so that the polishing tape located on the outer peripheral surface of the pulley is brought into contact with the outer peripheral end surface of the wafer fixed to the polishing table.

[0005] Each of the pulleys is driven to rotate so that the polishing tape runs, and the polishing table is rotated to mirror-process the end face of the wafer.

Further, since the polishing table is chamfered on the wafer end face, the contact angle of the wafer end face with respect to the tape surface of the polishing tape can be arbitrarily changed in accordance with the chamfering angle.

[0007]

By the way, in the conventional polishing apparatus, a pulley is used as a pressing roller for pressing the polishing tape against the material to be polished. However, the roller surface of the pressing roller is attached to the outer peripheral surface of the wafer. When the contact is made, since the roller surface is a curved surface, the portion of the roller surface parallel to the surface to be polished of the wafer fixed to the polishing table becomes linear, and the portion that can be extremely contacted becomes narrower. High accuracy was required for positioning the roller surface and the wafer mounted on the polishing table.

Further, if the position of the pulley and the polishing table is fixed, since the roller surface of the pulley and the outer peripheral surface of the wafer have curved surfaces, the wafer end surface can be formed only at one point in the width direction of the polishing tape. It comes into contact with the polishing tape. For this reason, when polishing while rotating the pulley and running the polishing tape, only the portion of the polishing tape that is in contact with the end surface of the wafer is used, and the other portions are unused, and the width of the polishing tape becomes wider. The more waste there is, the more waste there is.

Therefore, in order to eliminate waste of the polishing tape, in the conventional polishing apparatus, the polishing table can be moved so as to reciprocate the wafer in the width direction of the polishing tape. Since the switching is performed by using the moving direction, it takes a predetermined time to switch the rotation direction of the forward / reverse rotation motor when switching the moving direction, and thus there is a problem that efficiency is deteriorated.

Further, since the polishing table is reciprocated and the contact angle of the wafer end surface with respect to the tape surface of the polishing tape can be arbitrarily changed, there is a problem that the structure becomes complicated.

Accordingly, the present invention provides a polishing apparatus which can increase the contactable area of a polishing material fixed to a polishing table with a polishing tape in a polishing head and can easily position the polishing head and the polishing material. In addition, the present invention provides a polishing apparatus capable of efficiently using a polishing tape and improving a processing ability.

[0012]

According to the first aspect of the present invention, there is provided a polishing head body on which a polishing tape is mounted,
A polishing table for mounting the workpiece, and a polishing apparatus for polishing the workpiece by bringing a polishing tape into contact with an outer peripheral surface of the workpiece mounted on the polishing table, wherein the polishing head body is rotatable. The polishing head main body includes a traveling mechanism for running the polishing tape, and a polishing head for pressing the polishing tape against the material to be polished installed on the polishing table, and the polishing head is a rotation axis of the polishing head main body. And a pressing surface having a plane perpendicular to the surface, and a polishing tape positioned on the pressing surface is brought into contact with the workpiece.

According to a second aspect of the present invention, in the polishing apparatus according to the first aspect, the contact position of the material to be polished on the pressing surface is set at a position radially outward from the rotation center position of the polishing head body. Configuration.

According to a third aspect of the present invention, in the polishing apparatus according to the first or second aspect, the center of the pressing surface is aligned with the rotation axis of the polishing head main body.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a polishing apparatus according to the present invention will be described with reference to the drawings. FIG. 1 shows an overall configuration diagram of a polishing apparatus of the present invention. The polishing apparatus includes a polishing table 1 on which a material to be polished such as a silicon wafer is mounted,
A polishing head main body 2 on which a polishing tape T is mounted.

The polishing table 1 includes a suction stage 21 having a large number of holes, and a support 22 for supporting the suction stage 21.
And the suction stage 21 provided below the support 22.
Spindle section 2 for rotating support section 22 together with
3 are provided on the installation table 41 via the polishing table fixing frame 42.

A communication passage 24 is formed in the polishing table 1 and passes through the support section 22 and the spindle section 23 and communicates with a large number of holes of the suction stage section 21. A joint 25 is provided, and a pipe 26 is connected to the rotary joint 25 to form a pipe 26.
Is connected to a vacuum pump 27. By driving the vacuum pump 27, air is drawn in from the hole of the suction stage 21 through the pipe 26 and the communication path 24,
The material to be polished P placed on the suction stage 21 is sucked and fixed to the suction stage 21.

A polishing table rotation motor 31 for rotating the spindle unit 23 is fixed to the polishing table fixing frame 42. A first pulley 32 provided on the polishing table rotation motor 31 and a spindle unit The second provided in 23
Hang the endless belt 34 between the pulley 33 and
The spindle unit 23 is driven by the driving of the polishing table rotating motor 31.
Is rotated.

Further, the polishing table fixing frame 42 is mounted on the mounting table 41 and the suction stage 21 is mounted on the polishing head body 2.
And a frame-side fitting portion fixed to an installation table-side rail 41 a fixed to the installation table 41 and to a lower surface of a polishing table fixing frame 42. 42a, the polishing table fixing frame 42 along the installation table side rail 41a.
Reciprocate (in the left-right direction in FIG. 1).

When the polishing table fixing frame 42 is reciprocated, a weight string (not shown) is hooked on a hook 42b fixed to the wall surface of the polishing table fixing frame 42, so that the weight of the weight is reduced. The suction stage 21 moves in a direction (rightward in FIG. 1) approaching the polishing head body 2, and the polishing table fixing frame 42 comes into contact with a stopper (not shown) and stops, or the polishing It comes into contact with the head 7 and stops.

Then, the polishing table fixing frame 42 is pushed against the weight load by using an air cylinder 35 fixed to the installation table 41 so that the polishing table fixing frame 42 moves the suction stage 21 to the polishing head body. 2 (in the left direction in FIG. 1).

On the upper surface of the polishing table fixing frame 42, two frame side rails 42c extending in a direction orthogonal to the installation table side rail 41a are fixed.
Plate-side fitting portion 43 fitted to the frame-side rail 42c on the lower surface of the support plate 43 for supporting the
a is provided so that the support plate 43 can be moved in the front-rear direction in FIG. 1 along the frame-side rail 42c.

Further, the support plate 43 is attached to the polishing table fixing frame 42 via the eccentric cam mechanism 36 in order to continuously perform a fine reciprocating movement of about 20 mm along the frame side rail 42c. It is connected to a reciprocating motor 37.

When the reciprocating motor 37 is driven, the support plate 43 is finely reciprocated by the operation of the eccentric cam mechanism 36 so as to vibrate in the front-rear direction in FIG.

A stage cover 44 surrounding the suction stage 21 is fixed to the polishing table fixing frame 42.

The polishing head main body 2 is assembled to a main body mounting frame 45, and the main body mounting frame 45 is attached to the support frame 4 fixed to the mounting table 41.
6 is supported so as to be able to swing about a swing shaft 47 as a fulcrum.

Since the polishing head main body 2 is mounted on the main body mounting frame 45, the main body mounting frame 45 is swung about the swing shaft 47 as a fulcrum so that the polishing head main body 2 is moved to the position shown in FIG. It swings between the position of the solid line shown and the position of the virtual line (two-dot broken line) shown in FIG.

A pair of side plates 46a, 46a constituting the support frame 46 are provided with a frame 45 for mounting the main body.
Is formed with an arc-shaped arc hole 46b in which a pin 45a provided on the main body is loosely fitted. The frame 45 for mounting the main body is pivoted about the swing shaft 47 while moving the pin 45a along the arc hole 46b. It is made to rock.

Further, the polishing head main body 2 has a cylindrical case 21. As shown in FIGS. 1 to 4, the polishing head main body 2 includes two bearings 22 provided on the outer periphery of the case 21 and a case 21. Is attached to a body mounting frame 45 via a bearing 24 that supports a rotating shaft 23 fixed to one end in the longitudinal direction, and is rotatable about the rotation axis a with respect to the body mounting frame 45.

A pulley 51 for rotating the head for rotating the polishing head body 2 is fixed to one longitudinal end of the case 21 of the polishing head main body 2 where the rotary shaft 23 is supported. 51 is connected to the body mounting frame 45 via the endless belt 52.
The polishing head main body 2 is connected to a pulley 54 provided on a head rotation motor 53 attached to the lower surface of the head, and driven by the head rotation motor 53 to rotate the polishing head body 2 about a rotation axis a.

Further, a specific configuration of the polishing head main body 2 will be described with reference to FIGS.

The polishing head main body 2 has a traveling mechanism 6 for traveling the polishing tape T, and a polishing head 7 for pressing the polishing tape T against the workpiece P set on the suction stage 21 of the polishing table 1. ing.

The traveling mechanism 6 includes a polishing roll mounting portion 62 for mounting a polishing roll 61 around which a new polishing tape T is wound, a storage case 63 for storing a used polishing tape T, and a polishing roll mounting portion 62. A rubber roller 64 for running the attached polishing tape T and storing it in the storage case 63, a pressure roller 65 for pressing the rubber roller 64 and rotating around the rubber roller 64, and a driving unit 66 for rotating and driving the rubber roller 64. And a plurality of transport rollers 67 for guiding the running polishing tape T.

To the case 21, lids 24 and 25 for closing the openings at both ends and a disk member 26 arranged radially transversely inside the case 21 are fixed. In the case 21, a pair of support plates 27, 27 for supporting members such as the polishing roll 61, the rubber roller 64, the pressure roller 65, and the transport roller 67 are provided. , Lid 24, 2
5, supported by the disk member 26.

Further, as shown in FIGS. 3 and 4, a cylindrical portion 24a into which the rotary shaft 23 is inserted is fitted to one lid 24.
3 to 5 on the other lid 25.
As shown in FIG. 3, two tape passage holes 25a serving as passages for the running polishing tape are formed, and one tape passage hole 26a is formed in the disc member 26 as shown in FIGS. .

The polishing roll mounting portion 62 is provided in the manner shown in FIGS.
As shown in FIG. 5, a fixed-side rotating shaft 81 fitted into one end of a cylindrical polishing roll 61 and rotatably supported by one support plate 27 while being prevented from falling off via a bearing 68,
The polishing roll 61 is fitted to the other end side, and is rotatably supported by the case 21 via a bearing 68.
And a moving-side rotation shaft 82 that is exposed to the outside.

The fixed rotating shaft 81 is provided with a flange 81a for positioning the polishing roll 61.

The moving-side rotating shaft 82 is fitted on the polishing roll 61 and is reciprocally movable in the radial direction of the case 21 with respect to the case 21. The moving-side rotating shaft 82 is loosely fitted on the outside of the small-diameter rotating shaft 83. And a large-diameter rotary shaft 84 rotatably supported by the bearing 68 while preventing the case 21 from moving in the radial direction with respect to the case 21.

The polishing roll 6 is also provided at one end of the small-diameter rotary shaft 83.
A collar portion 83a for performing the positioning of No. 1 is formed.

The small-diameter rotary shaft 83 and the large-diameter rotary shaft 84 are fixed to the large-diameter rotary shaft 84 with a screw 85 while the small-diameter rotary shaft 83 is fitted into the polishing roll 61.
It is designed to rotate together. Then, by loosening the screw 85 and pulling out the small-diameter rotary shaft 83 to the outside of the case 21, the small-diameter rotary shaft 83 comes off the polishing roll 61.

Rubber roller 64 and rubber roller 64
As shown in FIGS. 2, 3 and 8, the pressure roller 65 that rotates while being pressed against is rotatably supported via a bearing 68 on a pair of support plates 27 fixed in the case 21. , The rubber roller 64 is forcibly rotated by the driving of the driving unit 66 so that the rubber roller 64 and the pressing roller 65 are rotated.
Forcibly put the polishing tape T sandwiched between
3

As shown in FIGS. 2, 3 and 9, the drive section 66 includes a tape running motor 66a fixed to one support plate 27, and a first tape mounted on the shaft of the tape running motor 66a. Pulley 66b and rubber roller 6
The second drive shaft 64a is composed of a second tape pulley 66c attached to the fourth drive shaft 64a, a first tape pulley 66b, and a tape endless belt 66d wound around the first tape pulley 66b.

By driving the tape running motor 66a, the first tape pulley 66b, the tape endless belt 66d, and the second tape pulley 6d are driven.
The rubber roller 64 is rotated via 6c, and the pressure contact roller 65 that presses against the rubber roller 64 rotates.

According to the traveling mechanism 6 described above, the polishing tape T is pulled out from the polishing roll 61 attached to the polishing roll mounting portion 62 and is wrapped around a plurality of transport rollers 67, and then the rubber roller 64 and the pressing roller 65. When the polishing tape T is sandwiched in between, and the rubber roller 64 is rotated, the polishing tape T is transported by being sandwiched between the rubber roller 64 and the pressure roller 65, and is forcibly sent into the storage case 63, The polishing tape T is sequentially fed from the polishing roll 61.

The storage case 63 is shown in FIGS.
As shown in FIG. 0, a storage port 63a that is fixed to the pair of support plates 27 and 27 and that stores the polishing tape T is formed at a position facing the rubber roller 64 and the pressing roller 65.

As shown in FIGS. 2 to 5, the polishing head 7 is provided on a lid 25 provided on the side opposite to the lid 24 having the cylindrical portion 24a. A pressing plate member 72 having a pressing surface 71 for pressing the polishing tape T at a location, and a holder 73 for holding the pressing plate member 72 are provided.

The holder 73 has a U-shaped cross section.
A circular convex portion 73a for positioning, which is fixed to the lid 25 by a screw, is formed on a surface facing the lid 25 so as to be fitted in the circular concave portion 25b of the lid 25. A pair of protruding walls 73b, 73b having a U-shaped cross section are formed on the surface opposite to the surface having.
Also, on both end sides of each protruding wall 73b, 73b,
Bearing 7 for rotatably supporting transport roller 67
3c are formed, and the two transport rollers 67 are supported by the holder 73 via the bearing 73c.

The pressing plate member 72 has a rectangular shape in a plan view having a predetermined thickness, and the pressing surface 71 is formed by one of the flat surfaces. When held and attached to the lid 25, the pressing surface 71 is orthogonal to the rotation axis a of the polishing head main body 2, and the center of the pressing surface 71 is aligned with the rotation axis a of the polishing head main body 2. I have.

The pressing plate member 72 is provided between the two transport rollers 67 in the holder 73 and
It is designed to fit between the protruding walls 73b, 73b,
When the pressing plate member 72 is fitted to the holder 73, the thickness of the pressing plate member 72 is adjusted so that the pressing surface 71 has a height that protrudes from the end surface in the protruding direction at the center of the protruding walls 73b, 73b. You have set. Further, the pressing plate member 72 has stepped portions 72a, which are located at the same height or lower than the end surfaces in the protruding direction of the protruding walls 73b, 73b.
72a are formed.

After the polishing head 7 is positioned by fitting the circular projection 73a of the holder 73 into the circular recess 25b of the lid 25, the holder 73 is fixed to the lid 25 with a screw, and the projecting wall of the holder 73 is fixed. A pressing plate member 72 is installed between the 73b and 73b, and the central portion of the protruding wall 73b and the step portions 72a and 72a are covered with two pressing plates 74 and 74,
The holding plate members 72 are fixed to the holder 73 by screwing the holding plates 74, 74 to the holder 73, thereby forming the polishing head 7.

Then, as shown in FIG.
A polishing tape T is attached to the polishing roll mounting portion 62 of the polishing head body 2 to which various components such as a rubber roller 64 and the like are attached.
Is mounted on the polishing roll 61 wound with. The polishing tape T is fed out from the assembled polishing roll 61, the polishing tape T is wrapped around the transport roller 67 near the polishing roll 61, passed through the tape passage hole 26 a provided in the disk member 26, and further provided on the lid 25. The two transport rollers 67 supported by the holder 73 so as to pass over the pressing surface 71 of the polishing head 7 through the tape passage hole 25a.
After that, the other tape passage hole 2 of the lid 25
After passing the polishing tape T through 5 a and passing over the transport roller 67, the polishing tape T is sandwiched between the rubber roller 64 and the pressing roller 65, and the end of the polishing tape T is inserted into the storage opening 63 a of the storage case 63. By inserting it, the work of attaching the polishing tape T to the polishing head main body 2 is completed.

A plurality of working holes 21a are formed in a part of the case 21 so that the mounting operation of the polishing tape T can be performed in a state where each part is stored in the case 21.

The material P to be polished is
The case where the end face of the silicon wafer is polished will be described.

Polishing table fixing frame 4 on which polishing table 1 is mounted
2 is moved using the air cylinder 35 in a direction away from the polishing head main body 2 (to the left in FIG. 1).

The material to be polished P is applied to the suction stage 2 of the polishing table 1.
1 and driven by the vacuum pump 27, the material to be polished P is passed through the pipe 26 and the communication path 24 to the suction stage 2
Adsorb to 1 and fix.

The shaft of the air cylinder 35 is retracted, and the polishing table fixing frame 42 is brought close to the polishing head main body 2 by the weight of the weight. Contact At this time, the contact position of the polishing target material P with the pressing surface 71 is shown in FIG.
As shown in FIG. 4, the pressing surface 71 is set so as to be located radially outward from the rotation center (rotation axis a) of the pressing surface 71.

The angle of the polishing head main body 2 with respect to the material P to be polished is set with the swing shaft 47 as a fulcrum, and the main body mounting frame 4 is used.
5 is adjusted by swinging and fixed at a predetermined position.

The angle of the polishing head main body 2 with respect to the material to be polished is adjusted because the end face of the silicon wafer is chamfered, so that it is necessary to perform mirror polishing in accordance with each face. .

Next, in the polishing step, the motor 3 for rotating the polishing table is used.
By driving the polishing table 1, the polishing table 1 is rotated to polish the workpiece P while rotating. At the same time, the reciprocating motor 37 is also driven to operate the eccentric cam mechanism 36 to cause the polishing table 1 to reciprocate finely along the frame-side rail 42c parallel to the pressing surface 71 of the polishing head 7.
The reciprocating distance at this time is about 20 mm.

Next, the tape driving motor 66a in the polishing head 7 is driven to slowly move the polishing tape T so as to pass over the polishing head 7. Then, the polishing head main body 2 itself is rotated by driving the head rotation motor 53.

In the present embodiment, the polishing apparatus rotates the polishing head main body 2 while running the polishing tape T to polish the outer peripheral end surface of the material P to be polished. Since the polishing can be performed while pressing the tape T on the pressing surface 71, the contact allowable area when positioning the polishing target material P fixed to the polishing table 1 at a predetermined position of the polishing head 7 can be increased, and the positioning accuracy can be increased. Can be widened, and workability can be improved as compared with the conventional case where the pressing roller is in contact with the pressing roller.

The contact position of the workpiece P on the pressing surface 71 is set at a position radially outward from the rotation center (rotation axis a) of the polishing head body 2, that is, a virtual line (two points) in FIG. (A broken line) is set within the range of the double circle, so that the portion of the polishing tape T that is cut by contact with the material to be polished will draw an arc shape by one rotation of the polishing head body 2, and the polishing is performed. Despite rotating the head body 2, the polishing tape T
Is formed not in one point but in a linear shape. As a result, when the polishing tape T is run while rotating the polishing head 7, the area of the used portion of the polishing tape T can be increased in the width direction of the polishing tape T, and the waste of the polishing tape T can be reduced as much as possible. Can be.

In the present embodiment, the pressing surface 71
Is aligned with the rotation axis a of the polishing head main body 2, as shown by a virtual line (two-dot broken line) in FIG.
A portion of the polishing tape T that is cut by contact with the material to be polished P draws a circle by one rotation of the polishing head main body 2, and as a result, when the polishing tape T is run while rotating the polishing head 7, Since the material to be polished P can be constantly polished while being in contact with the polishing tape T, the polishing efficiency can be improved.

Further, in the present embodiment, the eccentric cam mechanism 36 is operated by driving the reciprocating motor 37 so that the polishing table 1 makes a fine reciprocating motion with respect to the pressing surface 71 of the polishing head 7. As compared with the case where the polishing head main body 2 is rotated without performing reciprocating motion and the polishing is performed, the portion of the polishing tape T that is cut by the contact with the material to be polished is smaller in the width direction of the tape. As a result, the usage of the polishing tape T can be increased accordingly, and waste can be further reduced.

It is needless to say that polishing may be performed by rotating only the polishing head main body 2 without operating the eccentric cam mechanism 36.

Further, the reciprocating motion of the polishing table 1 of the present embodiment is not based on the switching of the rotation direction of the forward / reverse rotation motor, but can be performed with a simple structure by the eccentric cam mechanism 36, so that the reciprocating motion is efficiently performed. Can be performed.

In the present embodiment, the pressing surface 71
Are aligned with the rotation axis a of the polishing head body 2, but the center of the pressing surface 71 may be set at a position shifted from the rotation axis a of the polishing head body 2.

In this case, since the distance from the center of rotation to the contact position of the workpiece P is long, a large arc can be drawn, and the contact portion of the workpiece P drawn by the rotation of the polishing head body 2 can be drawn. The trajectory becomes larger than the width of the polishing tape T, so that the entire width of the polishing tape T can be used, and the polishing tape T can be used more efficiently.

The polishing apparatus of the present invention can be used not only for the silicon wafer as the material to be polished but also for polishing the end face of a liquid crystal panel or the end face of another flat member such as a corner chamfer.

[0070]

As described above, the invention according to claim 1 of the present invention includes a polishing head body on which a polishing tape is mounted and a polishing table on which a material to be polished is mounted, and is mounted on the polishing table. A polishing apparatus for polishing a material to be polished by bringing a polishing tape into contact with an outer peripheral surface portion of the material to be polished, wherein a polishing head main body is rotatable, and a polishing mechanism for moving the polishing head main body, A polishing head for pressing a polishing tape against a material to be polished installed on a polishing table, the polishing head having a pressing surface having a plane orthogonal to a rotation axis of the polishing head main body, the pressing surface The polishing tape located at the position is brought into contact with the member to be polished, so that the contact allowable area when positioning the material to be polished fixed to the polishing table at a predetermined position of the polishing head can be increased, and the positioning can be performed. Spirit Can widen the range of, the workability can be improved as compared with the case that has been brought into contact with the pressing as in the conventional roller.

According to a second aspect of the present invention, in the polishing apparatus according to the first aspect, the contact position of the material to be polished on the pressing surface is set at a position radially outward of the rotational center position of the polishing head body. Because of the configuration, the portion of the polishing tape that is cut by contact with the material to be polished is drawn in an arc shape by one rotation of the polishing head body, and despite the rotation of the polishing head body, the polishing tape Is formed not in one point but in a linear shape. As a result, when the polishing tape is run while rotating the polishing head, the area of the used portion of the polishing tape can be increased in the width direction of the polishing tape, and the waste of the polishing tape can be reduced as much as possible.

According to a third aspect of the present invention, in the polishing apparatus of the first or second aspect, the center of the pressing surface is aligned with the rotation axis of the main body of the polishing head. When the polishing tape is run while rotating the polishing tape, the material to be polished can always be brought into contact with the polishing tape for polishing, so that the polishing efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a schematic overall configuration diagram of a polishing apparatus according to the present invention.

FIG. 2 is a perspective view of a polishing head main body of the polishing apparatus shown in FIG.

FIG. 3 is a sectional view of a polishing head body of the polishing apparatus shown in FIG. 1;

4 is a sectional view of the polishing head main body shown in FIG. 3 taken along line AA.

5 is a sectional view of the polishing head main body shown in FIG. 3, taken along line BB.

6 is a sectional view of the polishing head main body shown in FIG. 3, taken along the line CC.

FIG. 7 is a sectional view taken along line DD of the polishing head main body shown in FIG. 3;

8 is a cross-sectional view of the polishing head main body shown in FIG. 3 taken along line EE.

9 is a cross-sectional view of the polishing head main body shown in FIG. 3, taken along line FF.

FIG. 10 is a sectional view taken along line GG of the polishing head main body shown in FIG. 3;

[Explanation of symbols]

 T Polishing tape P Material to be polished a Rotation axis 1 Polishing table 2 Polishing head body 6 Traveling mechanism 7 Polishing head 71 Pressing surface

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kohei Nishise 1333 Nishinochi, Inami-cho, Hidaka-gun, Hidaka-gun Wakayama Prefecture F-term (reference) 3C058 AA05 AA09 AA12 AA13 AA14 AA16 AB04 CB03 CB04 DA17

Claims (3)

[Claims] A polishing head main body on which a polishing tape is mounted, and a polishing table on which a material to be polished is mounted, wherein the polishing tape is brought into contact with an outer peripheral surface of the material to be polished installed on the polishing table. A polishing apparatus for polishing, the polishing head body is rotatable, the polishing head body is a traveling mechanism for running the polishing tape, and for pressing the polishing tape against the material to be polished installed on the polishing table With a polishing head,
The polishing head has a pressing surface having a plane orthogonal to the rotation axis of the polishing head main body, and a polishing tape positioned on the pressing surface is brought into contact with the material to be polished. apparatus. 2. The polishing apparatus according to claim 1, wherein the position of contact of the material to be polished on the pressing surface is set at a position radially outward of the rotation center position of the polishing head main body. 3. The polishing apparatus according to claim 1, wherein the center of the pressing surface coincides with the rotation axis of the polishing head main body.