JP2002120234A - Method of manufacturing photocurable resin sheet - Google Patents

Abstract

(57) [Problem] To provide a photocurable resin sheet which can be easily formed into a thin film, can form a wide area photocurable resin sheet without damage, and has good quality including surface smoothness. Providing a method of manufacturing with good productivity. SOLUTION: A pair of plate-shaped molds, at least one of which transmits an active energy ray, are formed at predetermined intervals to face each other and are formed by sealing a peripheral portion, and a film is formed on each inner surface of the pair of plate-shaped molds. The photocurable resin is injected into the molding cavity fixed through the adhesive layer, and the active photocurable resin is irradiated with active energy rays through a plate-shaped mold that transmits active energy rays. Is cured, and then the photocurable resin molded article is released from the plate-shaped mold to obtain a photocurable resin sheet, wherein the thickness of the adhesive layer is 1 to 30 μm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a photocurable resin sheet having particularly excellent surface smoothness and having few defects. More specifically, the present invention relates to an improvement in a method of manufacturing a smooth photocurable resin sheet by injecting a photocurable resin between molds, curing the resin, and then removing the mold. The photocurable resin sheet molded by the present method is used for display for organic EL display panels, display for touch panels, etc., storage and recording for optical disks and the like, optical members for solar cell panels, etc., particularly low birefringence optical members. It is particularly suitable for a liquid crystal display panel.

[0002]

2. Description of the Related Art Conventionally, a photo-curable resin sheet is prepared by injecting a photo-curable resin between molding dies and curing the photo-curable resin.
The light-cured resin sheet is molded by releasing the mold and the molded body,
Manufactured. However, in the above molding method, when the photocurable resin sheet is released from the molding die, since the adhesive force between the molding die and the cured photocurable resin sheet is strong, when the photocurable resin sheet is released from the molding die. In addition, there is a problem that the sheet is easily damaged. Further, the problem is more remarkable when the thickness of the sheet is small and when the area of the sheet is large.

[0003] For this reason, various methods have been proposed for forming a photocurable resin in a state in which a film is interposed between the inner surfaces of a pair of plate-shaped molds and obtaining the photocurable resin without breakage. For example, Japanese Patent Application Laid-Open No. 2000-832 proposes a method in which a photocurable resin sheet is released from a molding die without damage using a molding die in which a film is fixed to an inner surface with an adhesive or the like. .

[0004]

However, in this case, with a normal pressure-sensitive adhesive, coating unevenness and defects are likely to occur,
There is a disadvantage that the surface smoothness of the film surface in the fixed state is reduced, and accordingly, the surface smoothness of the formed photocurable resin sheet is also reduced. For this reason, when the obtained resin sheet is applied to an application where it is important to have surface smoothness, for example, a liquid crystal display sheet or a touch panel sheet, a problem may occur.

According to the present invention, a photocurable resin is injected into an injection mold in which a cavity is formed using a molding die and a peripheral portion thereof is sealed, and the photocurable resin is cured by irradiating an active energy ray. Then, in a method of releasing a molding die to form a smooth photocurable resin sheet, producing a photocurable resin sheet having a small surface roughness and very few defects which can be used as a sheet for a liquid crystal display or a touch panel. It seeks to provide a way.

[0006]

In the present invention, as a result of intensive studies in view of the above circumstances, it has been found that a film is fixed on each inner surface of a pair of plate-shaped molds with an adhesive having a specific thickness. In such a case, it was found that a desired resin sheet having a smooth surface and very few defects was obtained, and the present invention was completed.

[0007] That is, the gist of the present invention is to form a pair of plate-shaped molds in which at least one of them faces a pair of plate-shaped molds that transmit an active energy ray at a predetermined interval and seals a peripheral portion thereof. A photo-curable resin is injected into a molding cavity in which a film is fixed to each inner surface of the mold via an adhesive layer, and an active energy ray is applied to the photo-curable resin through a plate-shaped mold that transmits active energy rays. Irradiating to cure the photocurable resin, and then releasing the photocurable resin molded product from the plate mold to obtain a photocurable resin sheet, wherein the thickness of the adhesive layer is 1 to 30 μm. And a method of manufacturing a photocurable resin sheet.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. (Photo-curable resin) The photo-curable resin used in the present invention is not particularly limited as long as it is a resin that can be cured by irradiation with active energy rays such as ultraviolet rays. Specific examples thereof include, for example, Resin composition comprising an acrylate compound having a radical-reactive unsaturated bond, photocurable resin composition comprising an acrylate compound having a radical-reactive unsaturated bond and at least a difunctional mercapto compound, epoxy acrylate, urethane acrylate, polyester Examples include a photocurable resin composition in which an oligomer such as acrylate or polyether acrylate is melted in a polyfunctional acrylate monomer.

Among these, a photocurable resin composition comprising an acrylate compound and at least a bifunctional mercapto compound is preferred in terms of heat resistance, moldability, optical performance and the like. As the acrylate compound, a compound represented by the following formula (I) is preferable, and a compound represented by the formula (I) is preferably used in combination with a compound represented by the following formula (II).

[0010]

Embedded image (Wherein, R ¹ and R ² each independently represent a hydrogen atom or a methyl group, m represents 1 or 2, n represents 0 or 1, p and q each independently represent 0, 1 or 2)

Among the compounds of formula (I), bis (hydroxymethyl) tricyclo [5.2.1.0 ^2,6 ] decane = diacrylate, bis (hydroxymethyl) tricyclo [5.2.1.0 ^{2 , 6} ] decane dimethacrylate,
Bis (hydroxymethyl) tricyclo [5.2.1.0
^2,6 ] decane = acrylate methacrylate and mixtures thereof are preferred.

[0012]

Embedded image

(Wherein, R ³ represents a hydrogen atom or a methyl group, m represents 1 or 2, n represents 0 or 1, r and s each independently represent 0, 1 or 2) Among the compounds of formula (II), bis (hydroxymethyl) tricyclo [5.2.1.0 ^2,6 ] decane = monoacrylate, bis (hydroxymethyl) tricyclo [5.2.
1.0 ^2,6 ] decane = monomethacrylate and mixtures thereof are preferred.

The compounding ratio of the compound of the formula (I) and the compound of the formula (II) is based on 100 parts by weight of the total amount of the compound of the formula (I) and the compound of the formula (II). Is usually 70 to 99 parts by weight, preferably 80 to 98 parts by weight, more preferably 90 to 96 parts by weight, and the compound of the formula (II) is
It is usually 1 to 30 parts by weight, preferably 2 to 20 parts by weight, more preferably 4 to 10 parts by weight. If the proportion of the compound of the formula (II) is too small, the effect of improving the mechanical strength of the cured resin cannot be obtained, and if it is too large, the heat resistance of the cured resin may be reduced.

Examples of the at least bifunctional mercapto compound include compounds represented by the following formulas (III), (IV) and (V).

[0016]

Embedded image

(Wherein, R ⁴ represents a methylene group or an ethylene group, R ⁵ represents a hydrocarbon residue having 2 to 15 carbon atoms which may contain ether oxygen, and a represents an integer of 2 to 6) In the formula (III), R ⁵ is a hydrocarbon residue having 2 to 15 carbon atoms which may contain an ether oxygen. Specific examples thereof include, for example, a pentaerythritol residue and a dipentaerythritol residue. , A trimethylolpropane residue, an ethylene glycol residue, a diethylene glycol residue, a triethylene glycol residue, a butanediol residue, and the like.

The mercapto compounds of the formula (III)
And thioerythritol tetrakis (β-thiopropionate), pentaerythritol tetrakis (thioglycolate), and trimethylolpropane tris (β -Thiopropionate), trimethylolpropane tris (thioglycolate), ethylene glycol bis (β-thiopropionate), ethylene glycol bis (thioglycolate), diethylene glycol bis (β-thiopropionate), diethylene glycol Bis (thioglycolate), triethylene glycol bis (β-thiopropionate), triethylene glycol (thioglycolate), butanediol bis (β-thiopropionate), butanediol bis (thio Rikoreto), dipentaerythritol hexakis (beta-thiopropionate), dipentaerythritol hexakis (thioglycolate), and the like.

[0019]

Embedded image

(Wherein X is HS- (CH ₂ ) _b -CO-
_{(OCH 2 CH 2) d -} (CH 2) c - shows a. However,
b and c each independently represent an integer of 1 to 8,
d represents 0, 1 or 2) The compound of the formula (IV) is a β-thiol group-containing isocyanate. Specific examples of the compound of the formula (IV) include, for example, tris [2- (β-thiopropionyloxy) ethyl] isocyanurate, tris (2-thioglyconyloxyethyl) isocyanurate, tris [2- (β- Thioglyconyloxyethoxy) ethyl] isocyanurate, tris (2-thioglyconyloxyethoxy) ethyl) isocyanurate, tris [3- (β-thiopropionyloxy) propyl] isocyanurate, tris (3-thioglyconyloxy Propyl) isocyanurate and the like.

[0021]

Embedded image

(Wherein, R ⁶ and R ⁷ each independently represent an alkylene group, e and f each independently represent 0 or 1, and g represents 1 or 2)

The compound of the formula (V) is a thiol group-containing hydrocarbon. Specific examples of the compound of the formula (V) include, for example, benzenedimercaptan, xylylenedimercaptan,
4,4'-dimercaptodiphenyl sulfide and the like. The mixing ratio of the mercapto compound is usually 1 to 10 parts by weight with respect to 100 parts by weight of the acrylate compound.
Preferably it is 4 to 8 parts by weight. If the proportion of the mercapto compound is too small, the birefringence of the cured resin increases, and if it is too large, the heat resistance of the cured resin may be reduced.

Usually, a photopolymerization initiator which generates a radical by an active energy ray is mixed with the photocurable resin composition. Known compounds can be used as the photopolymerization initiator. The mixing ratio of the photopolymerization initiator is usually 0.01 to 1 part by weight, preferably 0.02 to 0.3 part by weight, based on 100 parts by weight of the monomer in the photocurable resin composition. If the proportion of the photopolymerization initiator is too small, the composition cannot be sufficiently cured, and if it is too large, the polymerization proceeds rapidly and not only increases the birefringence,
Hue may also deteriorate. In the photocurable resin composition,
Additives such as antioxidants, ultraviolet absorbers, surfactants, leveling agents, dyes, pigments, and thixotropic agents may be mixed.

(Mold) A mold used for molding the photocurable resin composition is an example of the mold 1 shown in FIG. As shown in FIG. 1, the mold 1 includes a pair of plate-shaped molds 2 a,
2b are opposed to each other at a predetermined interval, and the periphery thereof is sealed with a sealing material 3. The plate-shaped molds 2a, 2b
In addition to being a flat plate as shown in FIG. 1, it can be shaped into a curved or corrugated plate state according to the purpose. Further, only the inner surface can be provided with an article shape or pattern such as a waveform, a grating lens structure or the like. At least one of the plate-shaped molds 2a and 2b is made of a material through which active energy rays pass and which is not easily deformed by heat or a solvent.
Glass and a plastic plate such as an acrylic resin plate can be used, but a glass plate is preferable in terms of heat resistance and low thermal expansion. The other plate-shaped mold may be the same material as the one plate-shaped mold, or may be a different material that does not transmit active energy rays, such as metal.

Plate-shaped molds 2a, 2b provided opposite to each other
There is no particular limitation on the material of the sealing material 3 for sealing the peripheral portion of the device, and rubber, plastic, metal, or the like can be used. If a thick sealing material 3 is used, it acts as a spacer for regulating the interval between the plate-shaped molds 2a and 2b. However, if necessary, a spacer (shown in the figure) is provided between the plate-shaped molds 2a and 2b. And a tape or the like can be used as a sealing material.

Films 4a and 4b are interposed on the inner surfaces of the plate-shaped molds 2a and 2b used in the present invention. Film 4
For a and 4b, a material that transmits an active energy ray sufficient to cure the photocurable resin is used. Usually, the transparency (light transmittance) of the films 4a and 4b is 80% or more. The films 4a and 4b are made of an active energy ray for curing the photocurable resin or a substance that does not easily deform its shape due to heat generated at the time of curing, and the glass transition temperature (Tg) of the film is usually 100-200
° C.

As a material suitable for this purpose, polyethylene terephthalate, polymethylpentene, polycarbonate and the like can be used, but polyethylene, for example, is low in transparency, heat resistance, strength and adhesion to a photocurable resin. Terephthalate is particularly preferred. Also, film 4
The surfaces of a and 4b may be subjected to surface treatment such as coating treatment and corona treatment for various purposes such as imparting releasability, improving slipperiness, improving surface roughness, and improving gas barrier properties. The surface roughness Ra of the films 4a and 4b is usually 5
0 nm or less. If Ra is larger than this, the surface smoothness of the obtained photocurable resin sheet cannot be obtained, which is not preferable.

The preferred range of the thickness of the films 4a and 4b of the present invention is 10 to 500 μm. When the thickness of the film is larger than 500 μm, the flexibility of the film is insufficient, and when the photocurable resin sheet is released, the photocurable resin sheet tends to be damaged. This tendency is particularly remarkable. On the other hand, when the thickness of the film is less than 10 μm, the film portion is easily damaged when the film is removed from the plate-shaped mold. The films 4a and 4b of the present invention are used by being fixed to a mold with an adhesive. Thereby, the shape stability of the molded body can be improved, or repeated use as a molding die can be facilitated. Further, in order to prevent the film from bending or wrinkling, it is more preferable to use a film on which an adhesive layer has been applied in advance.

As the pressure-sensitive adhesive layer of the film of the present invention, a known pressure-sensitive adhesive, particularly a solvent-based weak pressure-sensitive adhesive (L-peel strength 150 g / c)
m or less) type pressure-sensitive adhesives can be used, and specific examples thereof include a commercially available acrylic pressure-sensitive adhesive, a mixed pressure-sensitive adhesive of a commercially available acrylic pressure-sensitive adhesive, and a commercially available urethane-based curing agent. The application of the adhesive layer to the film can be performed by a coating device such as a gravure coater. In the present invention, the thickness of the adhesive layer is 1 to 30 μm,
More preferably, the thickness is 5 to 30 μm.
If the thickness of the adhesive layer is less than 1 μm, crater-like defects are likely to occur in the solvent drying step, which is not preferable. This is presumed to be due to the low viscosity of the pressure-sensitive adhesive, which causes minute unevenness in the drying phenomenon to immediately cause defect formation. Conversely, if it is larger than 30 μm, coating unevenness is likely to occur, and therefore the smoothness of the film surface in a fixed state is impaired, which is not preferable.

The solvent for the pressure-sensitive adhesive has a boiling point of 50 to 15
An organic solvent at 0 ° C. is preferable, and among them, a mixed solvent in which an aromatic hydrocarbon such as benzene, toluene, and xylene is combined with an aliphatic carboxylic acid ester such as methyl acetate and ethyl acetate is preferable. Among them, a mixed solvent of toluene and ethyl acetate (weight ratio: 1/99 to 99/1)
Is particularly preferable in that uneven coating is hardly generated and crater-shaped defects are hardly generated.

It is preferable that the pressure-sensitive adhesive is filtered through a filter in advance before coating on a film to remove various impurities, gel components, and the like, since defects can be further reduced. The roughness of the filter is 10 μm or less, more preferably 7 μm
It is as follows. As a fixing means of the film with the adhesive layer,
A method of laminating with a laminator is preferably used. In this case, in order to ensure the surface smoothness of the molded product, it is preferable to set the lamination pressure relatively high, and the lamination pressure is usually 1.5 MPa or more and 0.5 MPa or more.
MPa or less. The laminating roll can be heated for the purpose of performing good lamination.

(Curing Reaction) When a photocurable resin sheet is formed using such a mold 1, polymerization is initiated in the cavity 5 defined by the opposing plate-shaped molds 2a and 2b and the sealing material 3. A photo-curable resin containing an agent and other additives is injected, and the photo-curable resin is cured by irradiating with an active energy ray 6 from the direction of the active energy ray-transmissive plate-shaped mold 2a. At this time, the mold 1 can be heated or cooled as needed. The active energy ray may be any as long as it cures the photocurable resin to be used, and examples thereof include ultraviolet rays and electron beams. The irradiation amount of the active energy ray may be an amount that cures the photocurable resin to be used,
Considering the type and amount of the monomer and the polymerization initiator, for example, ultraviolet light having a wavelength of 200 to 400 nm is usually 0.1 to 400 nm.
Irradiate in the range of 200j.

Irradiation with active energy rays may be carried out in one step, but in order to obtain a photocurable resin sheet having good surface properties, it is preferable to carry out irradiation in a plurality of steps and at least two steps. When the irradiation is carried out in two stages, the first stage is usually 15% or less, preferably 1% or less of the required amount of the active energy ray for curing.
Irradiation is performed at 0% or less, particularly preferably at 7% or less, so that the photocurable resin composition in the mold has a self-retaining property, that is, gels so that the resin does not leak even if the spacer is removed. . In the specification, the required curing amount of the active energy ray refers to the irradiation amount required to eliminate 80% of the ethylenic carbon-carbon double bond of the photocurable resin composition in the mold. . The rate of disappearance of the ethylenic carbon-carbon double bond due to irradiation with active energy rays is calculated by the following equation.

[0035]

[Number 1] loss amount = (1-K / M) × 100 (%) M = A M / B M A M: peak area of the double bond in the infrared absorption before active energy ray irradiation B _M: active energy C- in infrared absorption before X-ray irradiation
H bond peak area _{K = A K / B K A} K: the peak area of the double bond in the infrared absorption after irradiation with an active energy ray B _K: C-in infrared absorption after active energy ray irradiation
The peak area of the H bond is 1658.5 to 1591 cm.
^-1 and the peak of CH bond is 3210-280.
Appears at 9.8 cm ^-1 .

In the second stage, 95-100% of the monomer
Irradiation is carried out so as to react to complete the polymerization. The atmosphere for irradiating the active energy ray may be any of ordinary air or an inert gas atmosphere. The temperature during irradiation is usually from room temperature to 100 ° C. in the first stage, from room temperature to 300 ° C. in the second stage, and the irradiation time is usually from 1 second to 1 minute in the first stage and from 2 seconds to 1 minute. 10 seconds to 10 minutes. As a light source of the active energy ray, a chemical lamp, a xenon lamp, a low-pressure mercury lamp, a high-pressure mercury lamp, a metal halide lamp, or the like is used.

(Release) After the curing by irradiation with the active energy ray 6 is completed, the plate-shaped molds 2 a and 2 b are released from the photocurable resin sheet 7. Usually, only the photocurable resin sheet 7 is released while the plate-shaped molds 2a and 2b and the films 4a and 4b are fixed. Light curable resin sheet is usually 100
When the mold is released while being heated to about 150 ° C., the film is softened, the flexibility increases, and the release becomes easy.

After the photocurable resin sheet 7 with the films 4a and 4b attached thereto is released from the plate-shaped molds 2a and 2b, the films 4a and 4b may be peeled off. In this case, if the adhesive layer for fixing the films 4a and 4b to the plate-shaped molds 2a and 2b, the adhesive strength of which is reduced by irradiating active energy rays is used, This is preferable because the mold can be easily released between the films 4a and 4b. The photocurable resin seal thus obtained has a surface roughness Ra of usually 20 nm or less, preferably 10 nm or less, and a surface roughness Rmax.
However, it is usually 150 nm or less, preferably 100 nm or less, and is excellent in surface smoothness. The thickness of the obtained photocurable resin sheet is usually 50 to 3000 μm, and the birefringence is usually 1
It is 0 nm or less, preferably 5 nm or less.

[0039]

EXAMPLES Hereinafter, the content of the present invention will be described more specifically with reference to examples, but the present invention is not limited to the following examples unless it exceeds the gist thereof. The evaluation method is as follows. Releasability: When releasing the cured photocurable resin sheet from the mold, the sheet was visually inspected for breakage or not. Surface roughness: Ra was measured with a Surfcom surface roughness meter (manufactured by Tokyo Seimitsu Co., Ltd.). Defects: The number was visually counted.

Example 1 As an adhesive, 100 parts by weight of a commercially available acrylic adhesive was used.
1 part by weight of a urethane curing agent is added to toluene / ethyl acetate = 5
It was dissolved in a 0/50 (weight ratio) solvent to prepare a solution having a solid content of 20%. This adhesive was applied to a 25 μm thick polyethylene terephthalate film (surface roughness Ra = 20).
nm; manufactured by Mitsubishi Chemical Polyester Film Co.) with a gravure coater (coating speed 5 m / sec),
Apply a three-stage drying process at 70 ° C + 120 ° C + 80 ° C,
A film with an adhesive layer was obtained. The thickness of the adhesive layer was 15 μm. The resulting film with an adhesive layer was laminated and fixed to two glass flat plates (300 mm long × 300 mm wide × 5 mm thick) using a laminator. The two glass flat plates are opposed to each other so that the surface on which the polyethylene terephthalate film is fixed is an inner surface,
A cavity was formed using a silicone plate having a width of 5 mm and a thickness of 1 mm as a spacer, and a peripheral portion was sealed with a tape to form an injection mold.

The photocurable resin includes 99 parts by weight of p-bis (β-methacryloyloxyethylthio) xylylene, 1 part by weight of pentaerythritol tetrakis (β-thiopropionate), and 2,4,4 as a photopolymerization initiator. 6-
0.1 parts by weight of trimethylbenzoyldiphenylphosphine oxide (manufactured by BASF), benzophenone 0.1
After uniformly stirring and mixing parts by weight, a composition obtained by defoaming was used. This composition was poured into a casting mold, and cured by irradiating ultraviolet rays in two stages of 30 seconds and 5 minutes with a metal halide lamp having an output of 80 W / cm from both upper and lower surfaces at a distance of 400 mm from the glass surface for 30 seconds. Thereafter, the entire injection mold was put into an oven at 150 ° C. to soften the polyethylene terephthalate film and release the sheet. The evaluation results are as shown in Table 1.

Example 2 The same procedure as in Example 1 was carried out except that a silicone plate having a width of 5 mm and a thickness of 0.5 mm was used as a spacer. The evaluation results are as shown in Table 1.

Example 3 As raw materials for a photocurable resin, 95 parts by weight of bis (oxymethyl) tricyclo [5.2.1.0 ^2,6 ] decanedimethacrylate, pentaerythritol tetrakis (β-thiopropionate) 5 parts by weight, 2,
Example 1 was repeated except that 0.1 part by weight of 4,6-trimethylbenzoyldiphenylphosphine oxide and 0.1 part by weight of benzophenone were used. The evaluation results are as shown in Table 1.

Example 4 As a raw material for a photocurable resin, 94 parts by weight of bis (oxymethyl) tricyclo [5.2.1.0 ^2,6 ] decanedimethacrylate and bis (oxymethyl) tricyclo [5.
2.1.0 ^2,6 ] decane monomethacrylate 6 parts, pentaerythritol tetrakis (β-thiopropionate) 5 parts by weight, photopolymerization initiator 2,4,6-trimethylbenzoyldiphenylphosphine oxide 0.1 parts by weight Parts, and 0.1 parts by weight of benzophenone, in the same manner as in Example 1. The evaluation results are as shown in Table 1.

Comparative Example 1 The procedure of Example 1 was repeated, except that the film and the adhesive were not used. The evaluation results are as shown in Table 1.

Comparative Example 2 The procedure of Example 1 was repeated, except that the thickness of the adhesive layer was adjusted to 50 μm for coating. The evaluation results are as shown in Table 1.

Example 5 The procedure of Example 1 was repeated, except that only ethyl acetate was used as the solvent for the adhesive. Adhesive layer thickness 15
μm. The evaluation results are as shown in Table 1.

Example 6 The procedure of Example 1 was repeated, except that only toluene was used as the solvent for the adhesive. Adhesive layer thickness 15μ
m. The evaluation results are as shown in Table 1.

[0049]

[Table 1]

[0050]

According to the method of the present invention, a photocurable resin sheet which can be used as a substrate for a liquid crystal display, a sheet for a touch panel, a transparent conductive sheet, or the like can be easily thinned.
A wide-area photocurable resin sheet can be molded without damage, and a photocurable resin sheet of good quality including surface smoothness can be manufactured with high productivity.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of a molding die showing an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mold 2a, 2b Plate-shaped mold 3 Sealing material 4a, 4b Film 5 Cavity 6 Active energy ray 7 Photocurable resin sheet

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08F 220/20 C08F 220/20 // (C08F 220/20 (C08F 220/20 220: 28) 220: 28 ) B29K 101: 00 B29K 101: 00 B29L 7:00 B29L 7:00 F term (reference) 4F202 AA44 AG01 AJ03 AR12 CA01 CB01 CD30 CK11 CK13 CK86 CL02 CM90 4F204 AA44 AG01 AJ03 AR12 EA03 EA05 EB01 EF27 EW01 EA24 EA27 BA03 BB06 DA02 DB12 DB14 FA06 FB01 FB19 GA05 GB08 PA45 PB40 PC02 QA03 QA12 QA34 QA45 UA01 VA05 WA10 4J100 AL08Q AL66P BA03Q BC12P BC12Q CA04 CA23 FA00 JA32 JA36

Claims (5)

[Claims] 1. A pair of plate-shaped molds, at least one of which transmits an active energy ray, are formed at predetermined intervals to face each other and are formed by sealing a peripheral portion, and a film is formed on each inner surface of the pair of plate-shaped molds. The photocurable resin is injected into a molding cavity in which is fixed via an adhesive layer, and the photocurable resin is irradiated with active energy rays through a plate-shaped mold that transmits active energy rays to form a photocurable resin. A method for obtaining a photocurable resin sheet by curing a resin and then releasing the photocurable resin molded article from a plate-shaped mold, wherein the thickness of the adhesive layer is 1 to 30 μm. Manufacturing method. 2. The method according to claim 1, wherein the film comprises a polyethylene terephthalate resin. 3. The method according to claim 1, wherein the adhesive of the film is dissolved in a solvent system consisting of toluene and ethyl acetate. 4. The method according to claim 1, wherein the pressure-sensitive adhesive of the film is filtered through a filter having a size of 10 μm or less. 5. A photocurable resin composition in which the photocurable resin contains the following components A, B and C (provided that the proportion of each component is 100 parts by weight of the total of the component A and the component B). 5) The method according to any one of claims 1 to 4. Component A: alicyclic skeleton bis (meth) acrylate represented by the general formula (I): 70 to 99 parts by weight (Wherein, R ¹ and R ² each independently represent a hydrogen atom or a methyl group, m represents 1 or 2, n represents 0 or 1, p and q each independently represent 0, 1, or 2) Component B: a monocyclic (meth) acrylate having an alicyclic ring skeleton represented by the general formula (II): 1 to 30 parts by weight (Wherein, R ³ represents a hydrogen atom or a methyl group, m represents 1 or 2, n represents 0 or 1, r and s each independently represent 0, 1 or 2) C: at least bifunctional mercapto compound: 1 to
10 parts by weight