JP2002100892A - Hermetically sealed electronics housing - Google Patents

Abstract

(57) [Summary] To dissipate heat from a high-density electronic circuit package, a wiring board is provided between the electronic circuit package and the housing, and heat is not sufficiently dissipated. The ventilated air-cooled structure with ventilation holes could not be used as a sealed housing. A heat-dissipating structure in which a heat-collecting heat sink and a heat-dissipating heat sink are transferred by a heat pipe, wherein the heat pipe is passed through a small hole formed in a wiring board.
It efficiently transfers heat from high-density electronic circuit packages.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to, for example, an electronic equipment housing on which electronic circuit packages are mounted at high density, in particular, a heat sink for collecting heat of the electronic package and a heat sink for radiating heat outside the apparatus are transferred by a heat pipe. The present invention relates to an electronic device housing.

[0002]

2. Description of the Related Art Conventionally, a housing of an electronic device equipped with a communication device is generally provided with a ventilation hole, and the electronic device inside the housing is generally cooled by utilizing an air flow by natural air cooling. In recent years, due to contamination of electric components due to dust and the like, disconnection of electronic devices due to intrusion of insects, short-circuiting, security problems, and the like, the housing has recently been moved to a hermetic direction even for indoor installation. In this case, it is necessary to add a cooling device to suppress a rise in temperature inside the housing due to heat generation of the electronic components and the like to protect the electronic components and the like.

[0003] As a method of cooling an electronic device housing, for example, as described in Japanese Patent Application Laid-Open No. 7-288388, a heat pipe is brought into direct contact with an outer wall of the electronic device housing to cool the housing wall itself. Methods are known. In addition, JP-A-7-2
As described in JP 83564, a method of mounting a heat pipe and fins on an electronic circuit package for cooling is known.

[0004]

However, in the prior art described in Japanese Patent Application Laid-Open No. 7-288388, the heat transfer method from the electronic circuit package inside the housing to the wall of the housing is not well studied. Cooling of electronic circuit components is not sufficient when electronic circuit packages are mounted at high density. On the other hand, in the prior art described in Japanese Patent Application Laid-Open No. 7-283564, it is unclear how to transfer the heat of the electronic circuit package to the outside of the housing. It can be applied only when the number of mounted electronic components is small, and is small in size, has a large number of mounted electronic circuit packages, and cannot be mounted at high density.

SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem, and to efficiently dissipate heat to the outside of a housing even when an electronic circuit package is densely mounted in a small hermetic electronic housing. Is to provide the body.

[0006]

In order to achieve the above object, in an electronic apparatus having an electric circuit formed by connecting a plurality of heating elements such as electronic circuit packages to a wiring board by a connector, heat generated from the electronic circuit package is obtained. Collects the heat of the air heated by the radiant heat from the electronic circuit package and the convection with a heat collecting heat sink. A heat transfer heat pipe is mounted on the heat collection heat sink, and the other end of the heat transfer heat pipe is mounted on a heat radiation heat sink mounted outside the housing. With this heat dissipation structure, heat from the electronic circuit package is efficiently radiated to the outside of the housing. In a high-density electronic device sealed housing in which a plurality of electronic circuit packages are mounted on a wiring board with a connector, heat is not directly radiated to the housing because the wiring board is provided on the housing side.
For this purpose, a small hole for passing a heat pipe was provided in the wiring board. By mounting the heat pipe through the small heat pipe hole, the heat collecting heat sink and the heat radiating heat sink can be thermally connected at the shortest distance, and heat can be efficiently radiated. Further, by adopting this heat dissipation structure, the housing can be made a sealed structure, and the reliability as an electronic device can be improved. In particular, by having a plurality of heat pipes and a plurality of through holes for the heat pipes provided on the wiring board, the heat radiation efficiency is improved.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of a cross section showing an embodiment of a sealed electronic device housing according to the present invention, wherein 1 is a housing,
Is a heat sink for heat collection, 3 is a wiring board, 4 is a heat sink for heat dissipation, 5 is a heat pipe for heat transfer, 7 is an electronic circuit package, and 7a is an electronic circuit package connector. Heat from the plurality of electronic circuit packages 7 is collected by the heat collecting heat sink. Figure 4 shows the detailed shape of the heat sink for heat collection.
As shown in FIG. 1, the upper part and both side surfaces of the electronic circuit package are surrounded, and a member having high thermal conductivity such as aluminum absorbs heat from the electronic circuit package.

FIG. 2 is a view showing a heat radiation structure according to the present invention, in which a housing is not shown and only the heat radiation structure is shown. The electronic circuit package is an example in which a plurality of electronic circuit packages are mounted in a horizontal direction, and further, mounted in upper and lower two rows. The electronic circuit package is electrically connected to the wiring board 3 by a connector 7a as shown in FIG. FIG. 3 shows only the electric circuit part,
The illustration of the guide structure of the electronic circuit package is omitted. Further, the electronic circuit package 7 has a structure in which the connector can be easily attached to and detached from the wiring board 2 from the opposite side of the wiring board 2 by using a connector. Since there is no wiring or cables, the electronic circuit package 7 is mounted at high density. it can. On the opposite side of the wiring board 3, it is necessary to provide a door (not shown) on the housing for operations such as mounting and removing the electronic circuit package, and heat radiation of the electronic circuit package 7 must be performed from the wiring board side. There is. Since a power supply (not shown), a connector for electrical connection to the outside (not shown), and the like are mounted on the wiring board 3, the size cannot be reduced. For this purpose, a wiring board hole 8 is provided in the wiring board 3 as shown in FIG. The housing structure of the mold was realized. The plurality of heat pipes 5 are attached on one side to the heat sink 2 for heat collection with the heat pipe fixing plate 6, and one side is attached to the heat sink 4 for heat radiation with the heat pipe fixing plate 6 a. The end of the heat pipe on the heat dissipation side was mounted above the end of the heat pipe on the heat collection side so that the performance of the heat pipe was sufficiently brought out. An external heat sink 4 for heat dissipation is provided so that a large number of fins are adapted to the flow of the wind to improve the heat dissipation effect.
It was provided vertically. The holes in the wiring board were φ10 to φ20 in order to minimize the influence on the wiring pattern.

[0009]

As described above, according to the present invention,
The heat of the electronic circuit package can be efficiently dissipated. Also,
With this heat dissipation structure, the housing can be made small and hermetically sealed, and the reliability of the electronic device can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view of a section showing an embodiment of a sealed electronic device housing according to the present invention.

FIG. 2 is a view showing a heat dissipation structure according to the present invention.

FIG. 3 is a diagram showing a configuration of only electronic circuit components before mounting a heat radiation component.

FIG. 4 is a view showing a heat collecting heat sink 2;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Housing, 2 ... Heat sink for heat collection, 3 ... Wiring board, 4
... heat sink for heat dissipation, 5 ... heat pipe for heat transfer, 6,
6a: heat pipe fixing plates a, b, 7: electronic circuit package, 7a: electronic circuit package connector, 8: hole of wiring board.

Claims (2)

[Claims] 1. A heat-dissipating device, wherein heat from a plurality of heat-generating elements such as electronic circuit packages is collected by a heat-collecting heat sink, a heat pipe is attached to the heat-collecting heat sink, and one end of the heat pipe is externally mounted. A sealed electronic device characterized in that a heat pipe is mounted through a through hole for a heat pipe provided in a wiring board in a sealed housing that dissipates heat by attaching the heat pipe to a heat sink. Housing. 2. The sealed electronic device casing according to claim 1, further comprising a plurality of heat pipes and a plurality of heat pipe through holes provided on the wiring board.