JP2002093840A - Apparatus and method for mounting conductive ball - Google Patents

Abstract

(57) [Problem] To provide a mounting device and a mounting method of a conductive ball, which can prevent a problem caused by scattering of a paste. SOLUTION: A conductive ball 6 is sucked by a suction head 13.
When the conductive balls 6 are transferred by vacuum suction and held on the substrate 3, the protrusions 13 b formed on the lower surface of the suction head 13 are brought into contact with the upper surface of the substrate 3 in the ball mounting operation, so that the suction is performed. The outflow of air from the space between the lower surface of the head 13 and the upper surface of the substrate 3 is regulated to suppress the ejection of air from the suction holes 13a in the space. Thereby, the scattering of the paste 19 on the electrode 3a by the air blow from the suction hole 13a can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball mounting apparatus and method for mounting a conductive ball on a work.

[0002]

2. Description of the Related Art A flip chip or a BGA (Ball G
2. Description of the Related Art As a method for manufacturing an electronic component with a bump such as a lid array, a method using a conductive ball such as a solder ball is widely used. As a method for mounting conductive balls on a work such as a chip or a substrate, a method using a suction head is known.

According to this method, the conductive balls stored in a container or the like are vacuum-sucked into suction holes formed in a large number on the lower surface of the suction head and picked up, and the suction head is moved above the workpiece to move the conductive balls. Is mounted on the electrode of the work. In this mounting operation on the work, the conductive balls are landed on the electrodes to which the paste is applied in advance, so that the conductive balls are held by the adhesive force of the paste. After the landing, a positive pressure is applied to the inside of the suction head and air is blown from the suction hole to release the conductive ball from the suction hole.

[0004]

However, in the above-described conventional method of mounting conductive balls, the following problems have occurred due to the air blow. In other words, in this mounting operation, the conductive balls do not always land uniformly due to variations in ball size or undulation of the work surface, and a positive pressure is applied while the conductive balls are partially unlanded. Then, air blow is performed from the suction holes holding the unlanded conductive balls toward the upper surface of the work, and the paste on the work may be scattered. If the scattered paste adheres to the suction head, the viscosity of the paste at the time of ball adsorption causes a problem that extra conductive balls are adhered.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive ball mounting apparatus and a mounting method capable of preventing a problem caused by scattering of a paste.

[0006]

According to a first aspect of the present invention, there is provided an apparatus for mounting a conductive ball, wherein the conductive ball is vacuum-adsorbed and held by a suction head having a plurality of suction holes formed on a lower surface from a ball supply unit. A conductive ball mounting device provided on the lower surface of the suction head, the lower surface of the suction head being brought into contact with or approaching the upper surface of the work in a mounting operation of mounting the conductive ball on the work. And an air outflow restricting member for restricting air outflow from the space between the upper surface and the upper surface.

According to a second aspect of the present invention, there is provided a conductive ball mounting apparatus according to the first aspect.
An exhaust unit is provided to prevent the pressure inside the suction head from rising by opening the inside of the suction head to the atmosphere.

According to a third aspect of the present invention, there is provided a method for mounting a conductive ball on a workpiece by vacuum-sucking and holding the conductive ball by a suction head having a plurality of suction holes formed on a lower surface from a ball supply unit. In the mounting operation of mounting the conductive ball on the work, the air outflow regulating member provided on the lower surface of the suction head is brought into contact with or close to the upper surface of the work, so that the lower surface of the suction head is Outflow of air from the space between the suction hole and the upper surface of the work is restricted by restricting outflow of air from the space between the upper surface of the work and the work.

According to a fourth aspect of the present invention, there is provided a method for mounting a conductive ball, comprising the steps of:
In the mounting operation, the pressure inside the suction head is prevented from rising by opening the inside of the suction head to the atmosphere.

According to the present invention, the lower surface of the suction head is brought into contact with or close to the upper surface of the work by the air outflow restricting member provided on the lower surface of the suction head in the mounting operation of mounting the conductive ball on the work. It is possible to restrict the outflow of air from the space between the workpiece and the upper surface of the work, to suppress the ejection of air from the suction holes in the space, and to prevent the paste from scattering on the work surface.

[0011]

(Embodiment 1) Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a conductive ball mounting apparatus according to one embodiment of the present invention, FIG. 2 is a partial cross-sectional view of the conductive ball mounting apparatus of one embodiment of the present invention, and FIGS. It is operation | movement explanatory drawing of the mounting apparatus of the conductive ball of one Embodiment of this invention.

First, the structure of a conductive ball mounting device will be described with reference to FIGS. In FIG. 1, a positioning table 2 is provided on a base 1, and a substrate 3 is held on the positioning table 2. By driving the positioning table 2, the substrate 3 is positioned at a predetermined position. A ball supply unit 4 that supplies conductive balls 6 (hereinafter simply referred to as “balls 6”) in an aligned state is provided on a side of the positioning table 2. The ball supply unit 4 is provided with an alignment jig 5 for a ball 6, and the alignment jig 5 includes an alignment member 5 a in which recesses 7 for accommodating only one ball 6 are provided in a predetermined arrangement. The periphery of the alignment member 5a is a storage part 5b for storing the ball 6.

As shown in FIG. 2, the alignment jig 5 is rotatable by a predetermined angle around a rotation axis by an inclination mechanism. With this rotation, the alignment jig 5 is tilted from a horizontal posture. Due to the inclination, the ball 6 in the storage portion 5b can be moved onto the alignment member 5a and can be accommodated in the concave portion 7 of the alignment member 5a.

Next, the mounting mechanism 10 for mounting the ball 6 will be described. Above the base 1, a positioning table 2
And a moving table 11 including the ball supply unit 4 as a moving range. A movable plate 11a is mounted on the movable table 11 so as to be horizontally movable. A four-axis moving mechanism 12 is connected to the moving plate 11a. 4
A suction head 13 is mounted on the shaft moving mechanism 12. The suction head 13 is moved by the four-axis moving mechanism 12 to X,
Movement in the Y and Z directions and rotation in the θ direction are possible, and a number of suction holes 13a are provided on the lower surface of the suction head 13 as shown in FIG. The arrangement of the concave portions 7 of the alignment member 5a described above corresponds to the arrangement of the suction holes 13a of the suction head 13.

As shown in FIG. 2, the inside of the suction head 13 is connected to a vacuum suction source 15 and an air feeding device 16 which is a positive pressure applying means via an upper pipe 14.
An exhaust valve 18 serving as an exhaust unit is connected via a dedicated pipe 17. By opening the exhaust valve 18, the internal space of the suction head 13 can be communicated with the outside, and the internal pressure at the time of applying a positive pressure at the time of releasing suction can be rapidly reduced. Therefore, in order to promote the separation of the ball 6, the suction head 13
Even when a positive pressure is applied to the inside, air is not ejected from the suction hole 13a at an excessive pressure.

A suction hole 1 is provided on the lower surface of the suction head 13.
The projecting portions 13 surround the suction area in which
b is provided. The protruding portion 13b is formed of a material having high elasticity such as rubber or resin, and comes into contact with the upper surface of the substrate 3 with the suction head 13 lowered with respect to the substrate 3. In this state, when air is blown from the suction hole 13a to forcibly separate the ball 6 from the lower surface of the suction head 13, air flows out from the space between the lower surface of the suction head 13 and the upper surface of the substrate 3 to the outside. Is regulated. Therefore, the projecting portion 13b is an air outflow restricting member that restricts air outflow from the space to the outside.

The ball mounting device is configured as described above, and the operation will be described below with reference to the drawings. First, in FIG. 2, a predetermined amount of balls 6 is supplied to the storage portion 5b of the alignment jig 5. Next, a ball arrangement operation is performed. This arrangement operation is performed by tilting the alignment jig 5 from the horizontal posture by driving the tilting mechanism to rotate around the rotation axis as shown in FIG. This allows
The ball 6 flows on the alignment member 5a to the opposite side. At this time, the ball 6 gradually moves while being blocked by the squeegee 21.

When the ball 6 moves, the alignment member 5a
Vacuum suction is performed from the inside, and vacuum suction is performed from an opening provided on the bottom surface of the recess 7. As a result, a suction force acts on the ball 6 moving on the upper surface into the recess 7. Due to the movement of the balls 6 and the vacuum suction from the recesses 7, one ball 6 is accommodated in each recess 7 of the alignment member 5a. Then, the vacuum suction inside the alignment member 5a is continued as it is, and the state where the ball 6 is sucked and held in the concave portion 7 is maintained.

When the balls are normally accommodated in the recesses 7 of the alignment member 5a, the alignment jig 5 is returned to the horizontal position. Then, in this state, the suction operation of the ball 6 is performed. As shown in FIG.
Is moved onto the alignment member 5a, and the suction head 13 is lowered with respect to the alignment member 5a while adjusting the position of the suction hole 13a of the suction head 13 to the position of the concave portion 7. Next, a suction operation for sucking the ball 6 on the suction head 13 is started. That is, while vacuum suction is performed from the suction hole 13a of the suction head 13, air is blown from the opening 7a of the recess 7 of the alignment member 5a, and the ball 6 in the recess 7 is separated from the recess 7 and sucked by the suction hole 13a.

In this manner, the ball 6 is inserted into each suction hole 13a.
Then, the suction head 13 moves up from the ball supply unit 4 and moves onto the positioning table 2 as shown in FIG. And here, the electrode 3a
By moving the suction head 13 up and down with respect to the substrate 3 on which the paste 19 is applied, the ball 6 held by suction is mounted on the substrate 3. In this mounting operation, FIG.
As shown in (b), the suction head 13 is lowered, and the protrusion 13b of the suction head 13 is brought into contact with the upper surface of the substrate 3;
In this state, the vacuum suction source 15 is stopped, the vacuum suction of the suction head 13 is released, and the exhaust valve 18 of the suction head 13 is opened. After this, the air supply device 16
Is driven to apply a positive pressure to the inside of the suction head 13, thereby forcibly separating the ball 6 from the suction hole 13a.
When the ball 6 is detached, by exhausting air from the exhaust valve 18 provided exclusively for the suction head 13, an excessive increase in the pressure inside the suction head 13 when a positive pressure is applied can be prevented.

In this air blowing process, the outflow of air from the space between the lower surface of the suction head 13 and the upper surface of the substrate 3 to the outside is restricted. 13 prevents the pressure inside the suction holes 13 from being excessively increased.
Air ejection from a is suppressed. Therefore, ball 6
After the is released from the suction hole 13a, the air is not blown from the suction hole 13a to the upper surface of the substrate 3 with strong force. For this reason, the paste 19 applied on the electrode 3a
Does not occur due to the air blow and adheres to the lower surface of the suction tool 13, and it is possible to prevent a ball mounting error due to the paste adhesion.

In the above example, an example is shown in which the projecting portion 13b provided on the suction head 13 is brought into contact with the upper surface of the substrate 3. However, it is not always necessary to make contact with the projecting portion 13b. Good. Even in this state, the projecting portion 13b
If the gap between the lower end of the substrate 3 and the upper surface of the substrate 3 is sufficiently small, outflow of air to the outside is effectively restricted, and the effect of preventing the paste from scattering in the ball mounting operation is obtained as in the above-described example.

[0023]

According to the present invention, in the mounting operation for mounting the conductive ball on the work, the air outflow regulating member formed on the lower surface of the suction head is brought into contact with or close to the upper surface of the work. It is possible to restrict the outflow of air from the space between the lower surface of the suction head and the upper surface of the work, to suppress the ejection of air from the suction hole in the space, and to prevent the paste from scattering on the work surface. .

[Brief description of the drawings]

FIG. 1 is a perspective view of a conductive ball mounting device according to an embodiment of the present invention.

FIG. 2 is a partial sectional view of a conductive ball mounting device according to an embodiment of the present invention;

FIG. 3 is an operation explanatory view of the conductive ball mounting apparatus according to the embodiment of the present invention;

FIG. 4 is an operation explanatory view of the conductive ball mounting apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 3 Substrate 4 Ball supply unit 5 Alignment jig 5a Alignment member 6 Ball 13 Suction head 13a Suction hole 13b Projection

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) H01L 21/92 604Z

Claims (4)

[Claims] 1. A conductive ball mounting apparatus for vacuum-holding and holding a conductive ball from a ball supply unit by a suction head having a plurality of suction holes formed on a lower surface thereof and mounting the conductive ball on a work. An air outflow restricting member that restricts air outflow from the space between the lower surface of the suction head and the upper surface of the work by contacting or approaching the upper surface of the work in a mounting operation of mounting the conductive ball on the work provided on the lower surface. A mounting device for a conductive ball, comprising: 2. The conductive ball mounting apparatus according to claim 1, further comprising exhaust means for preventing the pressure inside the suction head from rising by opening the inside of the suction head to the atmosphere. 3. A method for mounting a conductive ball on a work, wherein the conductive ball is vacuum-sucked from a ball supply unit by a suction head having a plurality of suction holes formed on a lower surface thereof, and the conductive ball is mounted on a work. In the mounting operation for mounting on the work, the air outflow restricting member provided on the lower surface of the suction head is brought into contact with or close to the upper surface of the work, so that the air flows out of the space between the lower surface of the suction head and the upper surface of the work. The method for mounting a conductive ball, comprising: restricting air flow from the suction hole in the space by restricting air flow. 4. A method for mounting a conductive ball according to claim 3, wherein in said mounting operation, a pressure inside the suction head is prevented from rising by opening the inside of the suction head to the atmosphere.