JP2002076967A - High frequency signal processing device and vehicle equipped with the same - Google Patents
High frequency signal processing device and vehicle equipped with the sameInfo
- Publication number
- JP2002076967A JP2002076967A JP2000258115A JP2000258115A JP2002076967A JP 2002076967 A JP2002076967 A JP 2002076967A JP 2000258115 A JP2000258115 A JP 2000258115A JP 2000258115 A JP2000258115 A JP 2000258115A JP 2002076967 A JP2002076967 A JP 2002076967A
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- 230000005540 biological transmission Effects 0.000 claims abstract description 36
- 230000008054 signal transmission Effects 0.000 claims abstract description 14
- 239000004020 conductor Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 abstract description 14
- 230000005611 electricity Effects 0.000 abstract description 8
- 230000003068 static effect Effects 0.000 abstract description 8
- 230000006378 damage Effects 0.000 abstract description 5
- 239000000470 constituent Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
- Support Of Aerials (AREA)
- Radar Systems Or Details Thereof (AREA)
- Transceivers (AREA)
- Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
Abstract
(57)【要約】
【課題】 自動車用レーダや無線ＬＡＮ等に用いられる
高周波送受信装置ではその構成要素であるＭＭＩＣや半
導体素子を静電気等の雑音によって生じる破壊から守
り、簡単な構成で信頼性を高めること。
【解決手段】 送受信回路部のＭＭＩＣチップや半導体
素子とアンテナとを繋ぐ信号伝送線路の一部又はアンテ
ナ面の一部に並列に、一端を接地し、長さが使用周波数
の１／４波長の線路を挿入する。これにより、送受信回
路部側の信号伝送線路の電位を直流や低周波領域ではほ
ぼアースに落し、所定の使用周波数の信号に対しては開
放に近い高インピーダンスとすることによって、アンテ
ナからの静電気や不要雑音波は実質的に全てアースに落
としＭＭＩＣや半導体素子まで到達させず、目的の高周
波信号に対しては殆ど影響を与えないで受発信できるよ
うにした。
(57) [Summary] [PROBLEMS] To protect MMICs and semiconductor elements, which are constituent elements of a high-frequency transmitting / receiving device used for an automotive radar, a wireless LAN, and the like, from destruction caused by noise such as static electricity, and improve reliability with a simple configuration. To enhance. SOLUTION: One end is grounded in parallel with a part of a signal transmission line connecting an antenna and an MMIC chip or a semiconductor element of a transmission / reception circuit part, and the length is one quarter wavelength of a working frequency. Insert the track. As a result, the potential of the signal transmission line on the transmission / reception circuit section side is almost grounded in the DC or low frequency region, and a high impedance close to open for a signal of a predetermined operating frequency is used. Substantially all unnecessary noise waves are dropped to the ground so that they do not reach the MMIC or the semiconductor element, so that the desired high-frequency signal can be transmitted and received with almost no influence.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は自動車等の車両用レ
ーダや無線ＬＡＮ等に用いられる高周波信号処理装置及
びそれを取り付けた車両に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency signal processing device used for a vehicle radar such as an automobile, a wireless LAN, and the like, and a vehicle equipped with the same.
【０００２】[0002]
【従来の技術】自動車用レーダや無線ＬＡＮ等に用いら
れる高周波送受信装置ではその構成要素であるＭＭＩＣ
(Microwave Monolithic Integrated Circuit)や半導体
素子を静電気の帯電によって生じる高電圧による破壊か
ら保護し、信頼性を高めることが重要な要素となってい
る。2. Description of the Related Art An MMIC which is a component of a high-frequency transmitting / receiving apparatus used for an automotive radar, a wireless LAN, or the like.
(Microwave Monolithic Integrated Circuit) and semiconductor elements are protected from destruction due to high voltage caused by electrostatic charge, and the reliability is an important factor.
【０００３】従来の送受信装置は、特開平１０−３３９
７７４「ＦＭ−ＣＷレーダ」に示すように、送受信器を
構成する回路とアンテナとは直接線路で繋がっている構
成となっている。A conventional transmitting / receiving apparatus is disclosed in Japanese Patent Laid-Open No. Hei 10-339.
As shown in 774 “FM-CW radar”, a circuit constituting a transceiver is directly connected to an antenna via a line.
【０００４】また、一般的な高周波回路で良く行われて
いる例を図７に示す。高周波送受信回路９のアンテナ側
はＭＭＩＣチップや半導体素子で構成された送信用電力
増幅器１−１と受信用低雑音増幅器１−２から成り、そ
れぞれ送信用アンテナ６−１や受信用アンテナ６−２と
の間にはコンデンサ１２−１、１２−２やダイオード１
３−１、１３−２が挿入されており、アンテナ側からの
不要波の進入やアンテナ面に触れた場合の静電気による
ＭＭＩＣや半導体素子の破壊を防止している。FIG. 7 shows an example which is often used in a general high-frequency circuit. The antenna side of the high-frequency transmission / reception circuit 9 includes a transmission power amplifier 1-1 and a reception low-noise amplifier 1-2 constituted by an MMIC chip or a semiconductor element, and the transmission antenna 6-1 and the reception antenna 6-2, respectively. Between the capacitors 12-1 and 12-2 and the diode 1
3-1 and 13-2 are inserted to prevent the entry of unnecessary waves from the antenna side and the destruction of the MMIC and the semiconductor element due to static electricity when the antenna surface is touched.
【０００５】[0005]
【発明が解決しようとする課題】図７の例では、アンテ
ナとシリーズに接続されたコンデンサ１２−１や１２−
２の容量を小さくすれば不要波の進入やアンテナ面に触
れた場合の静電気による破壊に対して強くなるが、本来
の送受信信号に対して損失が大きくなる。また、ダイオ
ード１３−１，１３−２も実際に必要なブレークダウン
電圧を確保しようとすると１個ではなく複数個組み合わ
せた形となり、全体に複雑な回路装置構成となるという
課題がある。In the example of FIG. 7, the capacitors 12-1 and 12-
If the capacitance of the antenna 2 is reduced, the antenna is more resistant to the entry of unnecessary waves and the destruction due to static electricity when the antenna surface is touched, but the loss to the original transmission / reception signal increases. In addition, the diodes 13-1 and 13-2 also have a problem in that, in order to secure the actually required breakdown voltage, a plurality of diodes 13-1 and 13-2 are combined instead of one, resulting in a complicated circuit device configuration as a whole.
【０００６】特に、自動車等での衝突防止や障害物認識
用の車両用レーダ装置や自動車用自動料金徴収システム
等の無線ＬＡＮ等においては、かかる微細な電子装置が
車両の外部の表面部に取り付けられ作業者や人がアンテ
ナ部等に触れる機会が多くなってきており、簡単な構造
でより壊れにくく確実に動作する車両用の電子機器装置
を実現することが必要である。[0006] Particularly, in a wireless LAN or the like for a vehicle radar device or a vehicle automatic toll collection system for collision prevention or obstacle recognition in a vehicle or the like, such a fine electronic device is mounted on a surface outside the vehicle. Therefore, there is an increasing number of opportunities for workers and people to touch the antenna unit and the like, and it is necessary to realize a vehicular electronic device that has a simple structure, is less likely to be broken, and operates reliably.
【０００７】[0007]
【課題を解決するための手段】本発明は、上で述べた課
題を解決するため、送受信回路部のＭＭＩＣチップや半
導体素子とアンテナとを繋ぐ伝送線路の一部又はアンテ
ナ面の一部に並列に一端を基準電位源に接続（即ち、接
地）し、長さが使用信号周波数の波長の１／４の長さを
持った線路（１／４ショートスタブ）を挿入する構成と
したことを特徴とする。これにより、信号線路の電位を
所定の信号周波数以外の直流や低周波領域ではほぼアー
スに短絡状態とし（即ち、接地状態とし）、所定の使用
周波数の信号に対しては開放となる高いインピーダンス
がアンテナに対し並列に入ることとなり、アンテナ側か
らの静電気や不要な雑音波は実効的に全てアースに落ち
ＭＭＩＣや半導体素子まで到達せず、目的の高周波信号
に対しては殆ど影響を与えないでＭＭＩＣや半導体素子
まで到達する構成とするものである。According to the present invention, in order to solve the above-mentioned problems, a part of a transmission line connecting an MMIC chip or a semiconductor element of a transmission / reception circuit unit to an antenna or a part of an antenna surface is provided in parallel. One end is connected to a reference potential source (that is, ground), and a line (1/4 short stub) having a length of 1/4 of the wavelength of the used signal frequency is inserted. And As a result, the potential of the signal line is almost short-circuited to ground in a DC or low-frequency region other than a predetermined signal frequency (that is, grounded), and a high impedance that is open to a signal of a predetermined use frequency is generated. Since the antenna enters the antenna in parallel, the static electricity and unnecessary noise waves from the antenna side are effectively all grounded, do not reach the MMIC or the semiconductor element, and have little effect on the intended high-frequency signal. The configuration reaches the MMIC and the semiconductor element.
【０００８】この発明は、固定されたセンチメートルオ
ーダの波長を使用するＩＴＳ自動車自動料金徴収システ
ム等の無線ＬＡＮを構成する高周波送受信装置のみなら
ず、特に固定されたミリメートルオーダの波長を使用す
る自動車用レーダの高周波送受信装置に適用した場合に
はＭＭＩＣの小型化と合致してその効果が大きい。The present invention is applicable not only to a high-frequency transmitting / receiving apparatus constituting a wireless LAN such as an ITS automobile automatic toll collection system using a fixed wavelength on the order of centimeters, but also particularly to an automobile using a fixed wavelength on the order of millimeters. When applied to a high-frequency transmitting / receiving device of a radar for use, the effect is large in accordance with the miniaturization of the MMIC.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施例について詳
細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail.
【００１０】図１は本発明を適用した高周波信号送受信
装置等の高周波信号処理装置であり、発振器や増幅器や
ミクサ回路からなる高周波信号送受信回路部９を構成す
る送信用のＭＭＩＣ（ＰＡ）チップ１−１と送信用アン
テナ６−１とを接続する伝送線路４−１の一部に前記伝
送線路と並列に、即ち一端を基準電位源に接地して、信
号送信周波数での波長の１／４の長さで構成された線路
７−１が設けられている。また、同様に受信用のＭＭＩ
Ｃ（ＬＮＡ）チップ１−２と受信用アンテナ６−２とを
接続する伝送線路４−２の一部に並列に、即ち一端を基
準電位源に接地して、受信信号周波数での波長の１／４
の長さで構成された線路７−２が設けられている。FIG. 1 shows a high-frequency signal processing apparatus such as a high-frequency signal transmitting / receiving apparatus to which the present invention is applied, and a transmitting MMIC (PA) chip 1 constituting a high-frequency signal transmitting / receiving circuit section 9 comprising an oscillator, an amplifier and a mixer circuit. -1 and a part of the transmission line 4-1 connecting the transmission antenna 6-1 in parallel with the transmission line, that is, one end is grounded to a reference potential source, and １ ／ of the wavelength at the signal transmission frequency. 7-1 is provided. Also, similarly, the reception MMI
The C (LNA) chip 1-2 is connected in parallel to a part of the transmission line 4-2 connecting the receiving antenna 6-2, that is, one end is grounded to a reference potential source, and one of the wavelengths at the reception signal frequency is set. / 4
A line 7-2 having a length of is provided.
【００１１】なお、この図１では受発信の両方の伝送線
路に１／４波長の長さの線路を設けているが、特に、ア
ンテナからの入力信号が電界効果トランジスタ（ＦＥ
Ｔ）等のゲート電極に伝達される受信処理装置の伝送線
路にはこの１／４波長の長さの線路を設けることが必要
である。In FIG. 1, a line having a length of 1/4 wavelength is provided for both transmission and reception transmission lines. In particular, an input signal from an antenna is a field effect transistor (FE).
It is necessary to provide a line having a length of 1/4 wavelength in a transmission line of a reception processing device transmitted to a gate electrode such as T).
【００１２】図２及び図３に本発明を適用した高周波送
受信装置等の高周波信号処理装置の構成例を示す。図２
はその概略を説明するための裏面から見た模式的な平面
図であり、図３は図２のＡ−Ａラインでの主要部の断面
図である。図において１０はアンテナ用誘電体基板であ
り、１１は表裏に送受信回路部とアンテナ部を設けた共
通の導体板である。この構成例では、送受信部とアンテ
ナ部とが一枚の共通基板（導体板）１１の裏面側とおも
て面側にそれぞれ形成されたアンテナ一体形送受信器の
場合を示し、送受信回路の一部を形成するＭＭＩＣチッ
プ１とアンテナ６とはＭＭＩＣ上に形成された出力用ボ
ンディングパッド２からボンディングワイヤ３により伝
送線路４、導体板１１の表裏を繋ぐ同軸線路部の中心導
体５により繋がれており、基板の裏面側において前記伝
送線路４と並列に１/４波長の線路７が設けられ、この
線路７の一端はビヤ８−２で接地された接地導体８−１
に接続されている。FIGS. 2 and 3 show examples of the configuration of a high-frequency signal processing device such as a high-frequency transmitting / receiving device to which the present invention is applied. FIG.
FIG. 3 is a schematic plan view seen from the back side for explaining the outline, and FIG. 3 is a cross-sectional view of a main part taken along line AA in FIG. In the figure, reference numeral 10 denotes a dielectric substrate for an antenna, and reference numeral 11 denotes a common conductor plate provided with a transmitting / receiving circuit unit and an antenna unit on the front and back. This configuration example shows a case of an integrated antenna type transceiver in which a transmission / reception unit and an antenna unit are formed on the back side and the front side of one common substrate (conductor plate) 11, respectively. The MMIC chip 1 and the antenna 6 are connected by an output bonding pad 2 formed on the MMIC to a transmission line 4 by a bonding wire 3 and a center conductor 5 of a coaxial line portion connecting the front and back of the conductor plate 11. A line 7 of 1/4 wavelength is provided in parallel with the transmission line 4 on the back side of the substrate, and one end of the line 7 is connected to a ground conductor 8-1 grounded by a via 8-2.
It is connected to the.
【００１３】この１／４波長の長さの線路は他の線路と
区別するために短絡線路（又は、保護線路）とも称する
が、それを設ける位置はアンテナ６とＭＭＩＣや半導体
素子１との間であればどこでもよく、適用する電子機器
乃至その実装構造に応じてきめることが可能である。The line having a length of 1/4 wavelength is also referred to as a short-circuit line (or a protection line) to distinguish it from other lines, but is provided at a position between the antenna 6 and the MMIC or the semiconductor element 1. Any device can be used as long as it can be determined according to the applied electronic device or its mounting structure.
【００１４】また、この線路の幅は原理的には特に規定
されるものではないが、図示したように伝送線路４の幅
の１／２乃至それよりも小さくした方が実装基板を設計
する上で望ましい。Although the width of the line is not particularly limited in principle, as shown in the figure, the width of the transmission line 4 should be smaller than 1/2 or less than that in designing the mounting substrate. Is desirable.
【００１５】また、その実際の長さについても、例えば
７６．５ＧＨｚの受発信信号で動作させるミリ波の自動
車用レーダではその波長は空気中で３．９２ｍｍである
ので、３．９２／４＝０．９８ｍｍ（ε＝２の基板では
約０．７ｍｍ）の長さの線路を伝送線に並列に接続する
だけで簡単に実現でき、しかも微細なＭＭＩＣや伝送線
路を搭載した実装基板に対して整合性よく作り込むこと
ができる。[0015] Regarding the actual length, for example, in a millimeter-wave automotive radar operated with a transmission / reception signal of 76.5 GHz, the wavelength is 3.92 mm in the air, so that 3.92 / 4 = It can be realized simply by connecting a line of 0.98 mm (about 0.7 mm for a substrate with ε = 2) in parallel with the transmission line. It can be made with good consistency.
【００１６】更にまた、５ＧＨｚで動作させるＩＴＳ自
動車自動料金徴収システムにおいては、空気（ε＝１）
に換算した場合６／４＝１．５ｃｍの長さの線路を伝送
線に並列に設ければ良い。Furthermore, in an ITS automobile automatic toll system operating at 5 GHz, air (ε = 1)
In this case, a line having a length of 6/4 = 1.5 cm may be provided in parallel with the transmission line.
【００１７】図４は図２、図３で示した送受信部とアン
テナ部とが一枚の導体板の表と裏に形成された場合の他
の構成例を説明するための裏面から見た主要部の平面図
であり、高周波信号が伝播する伝送線路４やアンテナ接
続部を接地用の複数のビヤ８−２を設けた金属の接地導
体層８−１で取り囲み、アンテナ給電用の中心導体５と
伝送線路４の接続点で前記伝送線路４と反対側に１/４
波長の長さを持った短絡線路（保護線路）７が設けられ
ている。このような構成にすることによって伝送線路の
電気的特性が確保され望ましいが、そのためには図示し
たように１/４波長の長さを持った短絡線路（保護線
路）７を共通基板の裏面側即ち、ＭＭＩＣ等の受発信処
理回路部が実装されているその同じ平面に設けることが
望ましい。FIG. 4 is a main view from the back side for explaining another configuration example in which the transmitting / receiving section and the antenna section shown in FIGS. 2 and 3 are formed on the front and back of one conductive plate. FIG. 2 is a plan view of the portion, and a transmission line 4 through which a high-frequency signal propagates and an antenna connection portion are surrounded by a metal ground conductor layer 8-1 provided with a plurality of grounding vias 8-2, and a central conductor 5 for antenna feeding is provided. At the connection point between the transmission line 4 and the
A short-circuit line (protection line) 7 having a wavelength length is provided. Such a configuration desirably secures the electrical characteristics of the transmission line, but for this purpose, a short-circuit line (protective line) 7 having a length of 1/4 wavelength as shown in FIG. That is, it is desirable to provide on the same plane where the transmission / reception processing circuit unit such as the MMIC is mounted.
【００１８】なお、この図４の例では短絡線路７を伝送
線路４のアンテナ側の端部の１個所のみに１本設けた場
合を説明したが、同図中に点線で示したようにアンテナ
６と伝送線路４との接続点即ち中心導体５を基点として
放射状に複数本設けてもよく、その場合には機械的強度
が増しより効率的に確実に電子機器を保護することがで
きる。In the example shown in FIG. 4, the case where one short-circuit line 7 is provided only at one end of the transmission line 4 on the antenna side has been described. However, as shown by a dotted line in FIG. A plurality of connection points may be provided radially from the connection point between the transmission line 6 and the transmission line 4, that is, the center conductor 5. In this case, the mechanical strength is increased and the electronic device can be protected more efficiently and reliably.
【００１９】図５は本発明を適用した高周波信号処理装
置の他の構成例を説明するための主要部の平面図であ
る。この図から判るように、複数のパッチ状のアンテナ
エレメント２１（図では８個が２列に対向配置されてい
る）を並べた構成のアンテナパターンにおいて、基板裏
面に設けられた送受信回路部（図示省略）からの給電点
２２は各アンテナエレメント２１を共通に接続するマイ
クロストリップ線路２３の中央部に設けられ、前記マイ
クロストリップ線路２３の両端の部分に対称的に１／４
波長の長さの短絡線路（保護線路）２４−１、２４−２
を設けその先をビヤ２５−１，２５−２で基板裏面のア
ース導体層に接地した場合を示している。FIG. 5 is a plan view of a main part for explaining another configuration example of the high-frequency signal processing device to which the present invention is applied. As can be seen from this figure, in an antenna pattern having a configuration in which a plurality of patch-shaped antenna elements 21 (eight elements are arranged in two rows facing each other in the figure), a transmission / reception circuit unit (shown in FIG. The feed point 22 is omitted at the center of a microstrip line 23 that connects the antenna elements 21 in common.
Short-circuit lines (protection lines) 24-1 and 24-2 having a wavelength length
And the ground is connected to the ground conductor layer on the back surface of the substrate by the vias 25-1 and 25-2.
【００２０】図６は本発明の動作原理を判りやすく説明
するための他の回路全体構成を示すものであり、ＭＭＩ
Ｃチップ１とアンテナ６とを繋ぐ伝送線路３２の一部に
インピーダンス素子（同図ではインダクタンス素子）３
３が並列に設けられており、使用する所定の信号の周波
数で見た場合にはその部分のインピーダンスが実質的に
開放状態と同等位に大きく、それ以外の周波数の他の信
号や雑音に対しては実質的にアースへ短絡と同程度位に
低いインピーダンスと成ることを特徴としている。同図
ではインダクタンス素子を用いた場合を示しているが、
このような場合には所定の信号周波数よりも低い周波数
の雑音入力に対してそのインピーダンスが低くなるよう
に設計することによって、電子機器を取り扱う人に帯電
している静電気による悪影響を有効に防止することがで
きる。FIG. 6 shows another overall circuit configuration for explaining the operation principle of the present invention in an easy-to-understand manner.
An impedance element (in the figure, an inductance element) 3 is provided in a part of the transmission line 32 connecting the C chip 1 and the antenna 6.
3 are provided in parallel, and when viewed at the frequency of a predetermined signal to be used, the impedance of that portion is substantially as large as that in the open state, and it is insensitive to other signals and noise at other frequencies. In this case, the impedance is substantially as low as a short circuit to the ground. Although the figure shows a case where an inductance element is used,
In such a case, by designing the impedance to be low with respect to a noise input having a frequency lower than a predetermined signal frequency, it is possible to effectively prevent an adverse effect due to static electricity charged to a person who handles the electronic device. be able to.
【００２１】この図からも理解されるように、前記した
図１乃至５での送受信信号の波長の１／４の長さの線路
がこのインピーダンス素子に相当するものである。As can be understood from this figure, the line having a length of 1/4 of the wavelength of the transmission / reception signal in FIGS. 1 to 5 corresponds to this impedance element.
【００２２】なお、送受信信号の波長の１／４の長さの
線路を伝送線路に並列に接続する方が図６に示したイン
ダクタンス素子を設ける場合よりも構成が簡単で、高精
度でかつ雑音や電波に対する方向依存性もなく全方向で
有効に機能する点で好ましい。特に、ミリ波等の高周波
信号処理装置においてはＭＭＩＣとあわせて組立てるこ
とが容易になり好ましい。It should be noted that connecting a line having a length of 1/4 of the wavelength of the transmission / reception signal in parallel to the transmission line has a simpler configuration, higher accuracy and higher noise than the case where the inductance element shown in FIG. 6 is provided. It is preferable because it functions effectively in all directions without any direction dependency on radio waves. In particular, in a high-frequency signal processing device such as a millimeter wave, it is preferable because it can be easily assembled together with the MMIC.
【００２３】以上詳細に説明したミリ波等の高周波を受
発信する装置９をアンテナ部６を含めて自動車等の車両
の前方部又は最前部に搭載することによって、そのアン
テナ部６が外部に露出しやすくなるが本発明によれば作
業者や人がこのアンテナ部６に接触しても静電気等でこ
の装置が破壊されにくくなり、安心してこの装置を利用
することができる。By mounting the device 9 for transmitting and receiving high-frequency waves such as millimeter waves described in detail above, including the antenna unit 6, at the front or the front of a vehicle such as an automobile, the antenna unit 6 is exposed to the outside. According to the present invention, even if a worker or a person comes into contact with the antenna portion 6, the device is less likely to be damaged by static electricity or the like, and the device can be used with confidence.
【００２４】[0024]
【発明の効果】本発明によれば、送受信回路を構成する
ＭＭＩＣチップや半導体素子とアンテナとを繋ぐ信号線
路とアースとの間に直流や低周波領域ではほぼ短絡、使
用周波数の信号に対しては開放に近い高いインピーダン
スが並列に入ることとなり、アンテナ側からの静電気や
不要波は実質的に全てアースに落ちＭＭＩＣや半導体素
子まで到達せず、目的の高周波信号に対してはは殆ど影
響を与えない構成とすることができる。このため、静電
破壊や不要波の進入に対して極めて丈夫で高信頼なＲＦ
送受信部が小型、簡素な構成で実現でき、ＭＭＩＣチッ
プや半導体素子の破損や誤動作を防止することができ
る。According to the present invention, a signal line between a MMIC chip or a semiconductor element constituting a transmitting / receiving circuit and a signal line connecting an antenna to an antenna and a ground are substantially short-circuited in a DC or low-frequency region, and a signal of a used frequency is used. Means that high impedance close to open enters in parallel, so that static electricity and unnecessary waves from the antenna side fall to the ground substantially, do not reach the MMIC or semiconductor element, and have little effect on the target high-frequency signal. It is possible to adopt a configuration that does not provide. For this reason, extremely strong and highly reliable RF
The transmitting and receiving unit can be realized with a small and simple configuration, and damage and malfunction of the MMIC chip and the semiconductor element can be prevented.
【００２５】更に、かかる高周波受発信装置等の製品の
製造工程においての静電気対策の許容度が増し、製造ラ
インの簡素化と製品の歩留まり向上にも役立つと共に、
作業者や車両等のユーザの取り扱いに対しての信頼性も
向上する。Further, the tolerance of static electricity countermeasures in the manufacturing process of such a high-frequency receiving / transmitting device or the like is increased, which contributes to simplification of the manufacturing line and improvement of the product yield.
The reliability of handling of a user such as a worker or a vehicle is also improved.
【図１】 本発明の高周波送受信装置の構成を示す要部
回路図である。FIG. 1 is a main part circuit diagram showing a configuration of a high-frequency transmitting / receiving apparatus of the present invention.
【図２】 本発明の高周波送受信装置の要部平面図であ
る。FIG. 2 is a plan view of a main part of the high-frequency transmitting / receiving device of the present invention.
【図３】 本発明の高周波送受信装置の要部断面図であ
る。FIG. 3 is a sectional view of a main part of the high-frequency transmitting / receiving device of the present invention.
【図４】 本発明の他の高周波送受信装置の要部平面図
である。FIG. 4 is a plan view of a main part of another high frequency transmitting / receiving device of the present invention.
【図５】 本発明の他の高周波送受信装置の構成を示す
要部回路図である。FIG. 5 is a main part circuit diagram showing a configuration of another high frequency transmitting / receiving device of the present invention.
【図６】 本発明の他の高周波送受信装置の構成を示す
要部回路図である。FIG. 6 is a main part circuit diagram showing a configuration of another high frequency transmitting / receiving device of the present invention.
【図７】 従来の高周波送受信装置の構成を示す要部回
路図である。FIG. 7 is a main part circuit diagram showing a configuration of a conventional high frequency transmitting / receiving device.
１：ＭＭＩＣチップ（又は半導体素子）で構成された高
周波信号処理回路部、４：高周波信号伝送線路、６：ア
ンテナ部、７：１／４波長の長さの線路（短絡線路又は
保護線路）、８：接地（又はアース）導体、９：高周波
信号処理装置、１０：誘電体板、１１：導体板。1: a high-frequency signal processing circuit unit composed of an MMIC chip (or a semiconductor element), 4: a high-frequency signal transmission line, 6: an antenna unit, 7: a line having a length of 1/4 wavelength (short-circuit line or protection line), 8: ground (or earth) conductor, 9: high-frequency signal processing device, 10: dielectric plate, 11: conductor plate.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｈ０１Ｑ 23/00 Ｈ０１Ｑ 23/00 ５Ｋ０６２ Ｈ０４Ｂ 1/40 Ｈ０４Ｂ 1/40 (72)発明者 永石 英幸 東京都国分寺市東恋ヶ窪一丁目280番地株 式会社日立製作所中央研究所内 Ｆターム(参考） 5J021 AA01 AB06 CA06 FA17 FA24 FA25 FA26 HA04 HA05 JA07 JA08 5J045 AA05 AA21 AB05 DA10 EA07 HA03 NA01 5J046 AA05 AA17 AA18 AB13 MA09 5J047 AA05 AA17 AA18 AB13 EA02 5K011 DA01 DA25 JA01 KA11 5K062 AA01 AB15 AB19 AC01 AD04 AF01 BB03 BB16 BF07 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01Q 23/00 H01Q 23/00 5K062 H04B 1/40 H04B 1/40 (72) Inventor Hideyuki Nagaishi Kokubunji, Tokyo 1-280, Higashi-Koigakubo, Hitachi, Ltd.F-term in Hitachi, Ltd. Central Research Laboratory (reference) EA02 5K011 DA01 DA25 JA01 KA11 5K062 AA01 AB15 AB19 AC01 AD04 AF01 BB03 BB16 BF07
Claims (6)
を送受信するためのアンテナ部、及び上記高周波信号送
受信回路部と上記アンテナ部とを接続する高周波信号伝
送線路とを有し、上記高周波信号伝送線路に他端が基準
電位源に接続され上記高周波信号の波長の１／４の長さ
を有する線路が接続されたことを特徴する高周波信号処
理装置。A high-frequency signal transmission / reception circuit unit, an antenna unit for transmitting / receiving the high-frequency signal, and a high-frequency signal transmission line connecting the high-frequency signal transmission / reception circuit unit and the antenna unit; A high-frequency signal processing device, characterized in that a line having the other end connected to a reference potential source and having a length of 1/4 of the wavelength of the high-frequency signal is connected to the line.
号送受信回路部及び上記高周波信号伝送線路が設けら
れ、上記基板のおもて面側に上記アンテナ部が設けら
れ、上記１／４波長の長さを有する線路が上記基板の裏
面側で上記高周波信号伝送線路に接続して設けられてい
ることを特徴とする請求項１記載の高周波信号処理装
置。2. The high-frequency signal transmitting / receiving circuit section and the high-frequency signal transmission line are provided on the back side of one common board, and the antenna section is provided on the front side of the board. 2. The high-frequency signal processing device according to claim 1, wherein a line having a length is provided on the back side of the substrate so as to be connected to the high-frequency signal transmission line.
号送受信回路部及び上記高周波信号伝送線路が設けら
れ、上記基板のおもて面側に上記アンテナ部が設けら
れ、上記高周波信号伝送線路から離間してそれを取り囲
むように上記裏面側に接地導体層が設けられ、上記１／
４波長の長さを有する線路が上記接地導体層と上記高周
波信号伝送線路との間を接続して設けられていることを
特徴とする請求項１記載の高周波信号処理装置。3. The high-frequency signal transmission / reception circuit unit and the high-frequency signal transmission line are provided on the back side of one common substrate, and the antenna unit is provided on the front side of the substrate, and the high-frequency signal transmission line is provided. A ground conductor layer is provided on the back side so as to be spaced from and surround the same.
2. The high-frequency signal processing device according to claim 1, wherein a line having a length of four wavelengths is provided so as to connect between the ground conductor layer and the high-frequency signal transmission line.
号送受信回路部及び上記高周波信号伝送線路が設けら
れ、上記基板のおもて面側に上記アンテナ部が設けら
れ、上記１／４波長の長さを有する線路が上記基板のお
もて面側で上記アンテナ部に接続して設けられているこ
とを特徴とする請求項１記載の高周波信号処理装置。4. The high-frequency signal transmitting / receiving circuit section and the high-frequency signal transmission line are provided on the back side of one common board, and the antenna section is provided on the front side of the board, and the 1/4 wavelength 2. The high-frequency signal processing device according to claim 1, wherein a line having a length is provided on the front side of the substrate so as to be connected to the antenna unit.
部、上記受信した高周波信号を処理する回路部、及び上
記アンテナ部と上記高周波信号処理回路部とを接続する
上記高周波信号の伝送線路とを有し、上記伝送線路に他
端が基準電位源に接続され上記高周波信号の波長の１／
４の長さを有する線路が接続されたことを特徴する高周
波信号処理装置。5. An antenna unit for receiving a high-frequency signal, a circuit unit for processing the received high-frequency signal, and a transmission line for the high-frequency signal for connecting the antenna unit and the high-frequency signal processing circuit unit. The other end of the transmission line is connected to a reference potential source, and 1 /
A high-frequency signal processing device, wherein a line having a length of 4 is connected.
上記請求項１から５のいずれかに記載の高周波信号処理
装置が車両に取り付けられたことを特徴とする車両。6. A vehicle, wherein the high-frequency signal processing device according to claim 1 for transmitting or receiving a millimeter-wave high-frequency signal is mounted on a vehicle.
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|---|---|---|---|
| JP2000258115A JP4057768B2 (en) | 2000-08-23 | 2000-08-23 | High frequency signal processing apparatus and vehicle with the same |
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|---|---|---|---|
| JP2000258115A JP4057768B2 (en) | 2000-08-23 | 2000-08-23 | High frequency signal processing apparatus and vehicle with the same |
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| JP4057768B2 JP4057768B2 (en) | 2008-03-05 |
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| JP2000258115A Expired - Fee Related JP4057768B2 (en) | 2000-08-23 | 2000-08-23 | High frequency signal processing apparatus and vehicle with the same |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7158074B2 (en) | 2002-09-20 | 2007-01-02 | Hitachi, Ltd. | Radar system and car radar system |
| SG137652A1 (en) * | 2003-05-06 | 2007-12-28 | Amplus Comm Pte Ltd | Apparatus and method of acquiring and storing data of close contacts |
| US7408423B2 (en) | 2004-12-24 | 2008-08-05 | Fujitsu Limited | Semiconductor device and adjusting method for semiconductor device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7158074B2 (en) | 2002-09-20 | 2007-01-02 | Hitachi, Ltd. | Radar system and car radar system |
| SG137652A1 (en) * | 2003-05-06 | 2007-12-28 | Amplus Comm Pte Ltd | Apparatus and method of acquiring and storing data of close contacts |
| US7394370B2 (en) | 2003-05-06 | 2008-07-01 | Amplus Communication Pte. Ltd. | Apparatus and method of acquiring and storing data of close contacts |
| US7408423B2 (en) | 2004-12-24 | 2008-08-05 | Fujitsu Limited | Semiconductor device and adjusting method for semiconductor device |
| US7619490B2 (en) | 2004-12-24 | 2009-11-17 | Fujitsu Microelectronics Limited | Semiconductor device and adjusting method for semiconductor device |
| JP2011509518A (en) * | 2007-12-22 | 2011-03-24 | ヨハン ヴォルフガング ゲーテ−ウニヴェルジテート フランクフルト アム マイン | Monolithic integrated antenna and receiver circuit for detecting terahertz waves |
| US11500059B2 (en) | 2017-07-11 | 2022-11-15 | Mitsubishi Electric Corporation | Radar device |
| JPWO2019012741A1 (en) * | 2017-07-11 | 2019-12-12 | 三菱電機株式会社 | Radar equipment |
| JP2020201280A (en) * | 2017-07-11 | 2020-12-17 | 三菱電機株式会社 | Radar system |
| CN109782235A (en) * | 2019-01-30 | 2019-05-21 | 成都西科微波通讯有限公司 | A kind of anti-jamming circuit of 77GHz automobile collision avoidance radar |
| CN109782235B (en) * | 2019-01-30 | 2023-09-05 | 成都西科微波通讯有限公司 | Anti-interference circuit of 77GHz automobile anti-collision radar |
| JP2023500257A (en) * | 2019-11-01 | 2023-01-05 | アドバンスト フュージョン システムズ エルエルシー | Method and apparatus for isolating high level electromagnetic interference from microwave signals |
| JP7590427B2 (en) | 2019-11-01 | 2024-11-26 | アドバンスト フュージョン システムズ エルエルシー | Method and apparatus for isolating high levels of electromagnetic interference from microwave signals - Patents.com |
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