JP2002066935A - Electroforming sharp-edged grinding wheel and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve sharpness by restraining grinding force of an edge part. SOLUTION: An electroforming sharp-edged grinding wheel 10 is shaped into a ring sheet. A metal plating phase 12 is formed of Ni, Co or an alloy of Ni and Co. Super-abrasive grains 11 are dispersed in this metal plating phase 12. A Sn plating layer 14 having a thickness not exceeding an amount of projection of the super-abrasive grains 11 is formed at a surface 12a of the metal plating phase of the edge part 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroformed thin blade wheel used for cutting or grooving a work material such as silicon or ferrite, and a method of manufacturing the same.

[0002]

2. Description of the Related Art As a tool such as a thin blade used for cutting or grooving a work material such as silicon, GaAs or ferrite with high precision, there is an electroformed thin blade grindstone. FIG. 7 shows an example of such an electroformed thin blade grindstone. This electroformed thin blade grindstone 1 has superabrasive grains such as diamond and cBN in a metal plating phase made of Ni, Co, or an alloy thereof. Are arranged in a ring shape. The electroformed thin blade 1 has a plate shape with a thickness of several tens μm to several hundred μm. The electroformed thin blade whetstone 1 is sandwiched between a pair of mounting flanges 4 and 4 fitted into a small diameter shaft portion 3 of a whetstone shaft 2 rotating around an axis.
The nut 5 is fastened and fixed to the grinding wheel shaft 2. By rotating the grindstone shaft 2 around the axis, a work material such as silicon is ground and cut on the outer peripheral edge 1a of the electroformed thin blade grindstone 1.

[0003] By the way, such an electroformed thin blade 1 is made of N
Due to the effect of sulfur contained in a very small amount in i-plating etc., Ni
Hardness of metal plating phase of Hv = 500
Since the mechanical strength and rigidity were high because of the increase to ７750, it could be used for cutting or the like even if it was thin. However, in such an electroformed thin blade wheel 1, since the hardness of the metal plating phase is high, the wear rate of the metal plating phase is low even if the wear of the superabrasive grains progresses during the cutting process. However, since it does not fall off easily, the spontaneous cutting action cannot be sufficiently exhibited, and there is a disadvantage that the sharpness is reduced and the cutting accuracy is reduced. So, Tokuhei 6-92
As disclosed in Japanese Patent No. 073, etc., the outer peripheral surface of the cutting edge of the electroformed thin blade grindstone 1 is heat-treated at a temperature of 200 ° C. or more by electric discharge machining or the like to participate in cutting of a metal plating phase such as Ni plating. There has been proposed a technique for recrystallizing the structure of the cutting edge to soften and embrittle the metal plating phase. This promotes abrasion removal of the metal plating phase during cutting of the work material, and according to the wear of the superabrasive grains, falls off together with the metal plating phase to expose new superabrasive grains, thereby maintaining a high sharpness. And

[0004]

However, when the metal plating phase of the cutting edge is heat-treated by electric discharge machining or the like, the heated portion is easily deformed due to thermal distortion, and the circular cutting edge is distorted over the entire circumference. As a result, there is a problem that the cutting margin of the work material at the time of the cutting process becomes large, and that a high-precision cutting process or the like cannot be performed. Also, Ni and Co of the metal plating phase may adhere to the work material due to frictional heat during grinding and cutting, and Ni and Ni alloys have large deformation resistance and require a large shear force when shearing the adhered part. Therefore, there is a problem that the grinding resistance is increased, the grinding wheel rigidity is reduced due to accumulation of grinding wheel damage, and the grinding wheel life is short.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide an electroformed thin blade grinding wheel capable of performing processing with a small grinding resistance even when adhesion to a work material occurs during grinding. I do. It is another object of the present invention to provide an electroformed thin blade grindstone capable of enhancing the sharpness by promoting the self-propelled cutting of the cutting edge, and a method of manufacturing the same. Another object of the present invention is to provide an electroformed thin blade grindstone capable of suppressing thermal deformation at the time of heat treatment of a blade edge portion, and a method of manufacturing the same.

[0006]

According to the present invention, there is provided an electroformed thin blade grinding wheel in which superabrasive grains are dispersed and arranged in a metal binding phase made of Ni, Co or an alloy thereof. An Sn plating layer having a thickness not exceeding the amount of protruding superabrasive grains from the phase is formed on the surface of the metal bonding phase at the cutting edge. When a work material containing metal is ground at the cutting edge of an electroformed thin blade, the surface of the cutting edge adheres to the work material due to frictional heat generated during the grinding, but the Sn plating layer formed on the surface of the metal bonding phase is slid. Due to good mobility and good lubricity, it has low deformation resistance and low mechanical strength, so the adhered part is easily sheared on the surface of the Sn plating layer adhered to the work material, and the adhesion is easily cut off. Grinding resistance can be reduced by suppressing wear of the steel. Moreover, by coating the surface with a soft Sn plating layer, the chipping of the work material is suppressed by the synergistic effect of the effect of improving the slidability, reducing the aggressiveness of the opponent, and the effect of suppressing the projection amount of the superabrasive grains. Can be. The cutting edge portion includes a region involved in the grinding of the electroformed thin blade, for example, a region having a predetermined width radially inward from the outer peripheral edge.

[0007] Further, the edge portion may be heat-treated to melt the Sn plating layer and alloy with the metal bonding phase. By alloying, an intermetallic compound such as Sn and Ni is produced as a recrystallized structure, and since the cutting edge becomes brittler than the original metal bonding phase, spontaneous cutting of superabrasive grains can be promoted and the cutting edge can be reduced. Easy to break adhesions. In addition, since the Sn—Ni intermetallic compound is formed and chemically stabilized, adhesion itself does not easily occur. The width of the recrystallized structure obtained by heat-treating the cutting edge may be 2 mm or less. By performing heat treatment using laser light or the like, at least a region of the cutting edge portion involved in grinding can have a recrystallized structure, and rigidity can be maintained high in other regions. When a laser beam is used, the heat treatment range can be set precisely, and only the region involved in grinding can be recrystallized with high precision over the entire circumference of the electroformed thin blade grindstone.

The electroformed thin blade grinder according to the present invention is made of Ni, Co
Alternatively, in an electroformed thin blade grindstone in which superabrasive grains are dispersed and arranged in a metal binder phase made of these alloys, a Sn plating layer having a thickness not exceeding the amount of protrusion of the superabrasive grains from the metal binder phase is formed on the metal at the cutting edge. After forming slits at predetermined intervals along the extending direction of the cutting edge portion on the binding phase surface, the cutting edge portion is heat-treated to melt the Sn plating layer and alloy it with the metal binding phase. And Since the cutting edge is divided by slits, thermal deformation of the cutting edge during heat treatment is small and thermal distortion occurs only in the area divided by the slit without reaching the entire cutting edge, so the accuracy of the cutting edge is improved and sharpness Good grinding can be performed.

The method for producing an electroformed thin blade according to the present invention comprises:
The super-abrasive grains are dispersed and arranged in a metal bonding phase made of Ni, Co or an alloy thereof, and an electroformed thin blade having an Sn plating layer formed on the surface of the metal bonding phase is rotated at a predetermined speed while the cutting edge portion is rotated. Is irradiated with a laser beam and recrystallized over a predetermined width. By rotating the electroformed thin blade whetstone while irradiating the cutting edge with the laser beam, the laser beam irradiating portion is sequentially moved relative to each other, and is cooled sequentially after heating for a short time, thereby suppressing the thermal distortion of the cutting edge portion and forming the Sn plating layer. The metal bonding phase is alloyed, that is, recrystallized by melting, and the amount of heat input by the laser beam can be controlled by the rotation speed of the electroformed thin blade. Prior to laser beam irradiation, slits may be formed at predetermined intervals in the blade edge. Since the laser irradiation is performed while rotating the electroformed thin blade, the heat of the cutting edge is efficiently radiated by the slit during heating, and even if thermal distortion occurs, the distortion occurs in the blade piece unit divided by the slit, so the outer periphery A large distortion that continues in the direction does not occur, and thermal deformation in a region partitioned by the slit at the cutting edge portion is suppressed, and alloying with high accuracy can be performed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electroformed thin blade grindstone according to the present invention will be described below with reference to the accompanying drawings.
FIG. 1 is an enlarged cross-sectional view of the cutting edge of an electroformed thin blade grindstone according to the first embodiment, FIG. 2 is a plan view of the electroformed thin blade grindstone, and FIG.
FIG. 3 is an enlarged cross-sectional view of a cutting edge portion of an electroformed thin blade whetstone before a plating layer is formed. Electroformed thin blade whetstone 10 according to first embodiment
Has a substantially ring-shaped thin plate shape as shown in FIGS. 1 and 2, and has a thickness in the range of, for example, several tens μm to several hundreds μm. This electroformed thin blade grindstone 10 is made of diamond or cB.
The superabrasive grains 11 such as N are dispersed and arranged in a metal plating phase (metal bonding phase) 12, and the metal plating phase 12 is made of, for example, a Ni—Co alloy, Ni, Co, or an alloy thereof. Moreover, sulfur is contained in the Ni-based alloy in an amount of 0.01 to 0.3% by weight based on the total weight including the superabrasive grains. In the ring-shaped cutting edge portion 16 located on the outer peripheral side of the electroformed thin blade grindstone 10 shown in FIGS. 1 and 2, a part of the surface 12 a of the metal plating phase 12 has a thickness t = 10 to 1 for example.
It is covered with a Sn plating layer 14 of about 5 μm. The Sn plating layer 14 is formed, for example, only on the cutting edge 16. Note that the Sn plating layer 14 only needs to cover at least the cutting edge 16, but the entire metal plating phase of the electroformed thin blade grindstone 10 as well as the cutting edge 16 may be formed by plating with the Sn plating layer 14.

The electroformed thin blade grindstone 10 according to the present embodiment has the above-described configuration. Next, a method of manufacturing the electroformed thin blade grindstone 10 will be described. First, masking is performed on a stainless steel substrate on which the metal to be plated has been subjected to a releasability process, leaving a portion of the original shape of the grindstone, and a cleaning process such as degreasing is performed. Next, the substrate is immersed in a plating solution in a plating bath. The plating solution is an electrolytic plating solution containing an organic brightener containing sulfur and Ni-base or Co-base in which superabrasive grains such as diamond are dispersed, and an anode plate is disposed in the plating bath so as to face the substrate. Connect the substrate to the cathode.
When electricity is supplied to the cathode and anode in this state, a Ni alloy, Co alloy or Ni-Co alloy plating phase is deposited on the substrate,
An abrasive layer in which superabrasives are uniformly dispersed is formed in the plating phase. The plating is completed when the thickness of the abrasive layer is several tens μm to several hundred μm. Next, the substrate on which the abrasive layer has been formed is taken out of the plating solution and subjected to a washing process including brushing and the like, and then the abrasive layer is peeled from the substrate. Then, the obtained abrasive layer is formed into a circular whetstone shape by punching or the like, further processed into a perfect circle, and electroformed thin blade whetstone 10 ′
Get.

Then, masking is performed while leaving the cutting edge portion 16 of the electroformed thin blade grindstone 10 ', and if necessary, the surface of the metal plating phase 12 is removed by etching or the like, and as shown in FIG. The protruding amount T of the superabrasive grains 11 is set to be relatively protruded. Next, with the masking applied, the electroformed thin blade whetstone 10 is immersed in a plating solution containing Sn ions in a plating bath, and the cathode is energized in the same manner as described above to perform electroplating. The Sn plating layer 14 is formed on the entire cutting edge portion 16 by depositing on the edge 12. In this case, the Sn plating does not precipitate on the superabrasive grains 11, but only on the metal plating phase surface 12a. Thus, the electroformed thin blade grindstone 10 shown in FIG. 1 is obtained.

When performing grinding and cutting of a workpiece such as silicon using the electroformed thin blade grindstone 10 according to the present embodiment, the electroformed thin blade grindstone 10 is mounted on a grindstone shaft 2 and rotated while the cutting edge 1 is rotated.
In step 6, the work material is ground. Then, the surface of the cutting edge 16 adheres to the work material due to frictional heat during grinding. Here, the Sn plating layer 14 is coated on the surface 12a of the metal plating phase 12 of the cutting edge portion 16, and since the Sn plating layer 14 has good slidability and good lubricity, the deformation resistance is small, and the mechanical resistance is high. Since the strength is small, the Sn plating layer 1 adhered to the work material
(4) The adhered portion is easily sheared on the surface to easily break the adhered portion. Therefore, since the adhesion is easily sheared on the surface of the Sn plating layer 14, the cutting force and the grinding resistance can be reduced by reducing the shearing force, and the sharpness of the electroformed thin blade grindstone can be improved. Further, since the grinding resistance can be reduced, the load on the grindstone can be reduced, and the accumulation of grindstone damage can be suppressed, so that the life of the grindstone can be improved. Moreover, by coating the soft Sn plating layer 14 on the surface, chipping of the work material is achieved by a synergistic effect of the effect of improving the slidability and reducing the aggressiveness of the opponent and the effect of suppressing the protrusion amount of the superabrasive grains 11. Can be suppressed.

As described above, according to the present embodiment, the shearing force at the time of adhesion between the workpiece and the electroformed thin blade whetstone 10 at the time of grinding and cutting is small, so that the cutting resistance can be reduced and the sharpness can be improved. In addition, the reduction in grinding resistance reduces the load on the grindstone and suppresses the accumulation of grindstone damage, so that the life of the grindstone can be improved. In addition, by covering the soft Sn plating layer 14, the chipping of the work material is suppressed by the synergistic effect of the effect of improving the slidability, reducing the aggressiveness of the opponent, and the effect of suppressing the protrusion amount of the superabrasive grains 11. Can be.

Next, a second embodiment of the present invention will be described with reference to FIGS. 4 to 6, and the same or similar parts and components as those in the above-described embodiment will be described using the same reference numerals. The electroformed thin blade grindstone 20 according to the second embodiment is similar to that shown in FIG.
As shown in FIG. 5 and having the same configuration as the electroformed thin blade grindstone 10 according to the first embodiment, the superabrasive grains 11 are ring-shaped thin plates and the superabrasive grains 11 are in a metal plating phase 12 such as a Ni—Co alloy. The blade edge portion 16 has a configuration in which the Sn plating layer 14 is formed on the surface 12 a of the metal plating phase 12. In addition, when the cutting edge 16 of the electroformed thin blade grindstone 20 is heat-treated at a temperature of 200 ° C. to 500 ° C., for example, 250 ° C., the Sn plating layer 14 is melted, alloyed with Ni of the metal plating phase 12, and The crystallized phase 12 together with the Sn plating layer 14 constitutes a recrystallized structure 22 made of a Sn-Ni intermetallic compound.

In addition, as shown in FIG. 4, a plurality of slits 24 are formed in the cutting edge portion 16 at predetermined intervals from the outer peripheral edge 16a toward the inside in the radial direction. The number of slits 24 depends on the outer diameter of the electroformed thin blade grindstone 20, but when the outer diameter of the electroformed thin blade grindstone 20 is, for example, 93.2 mm, the number of slits 24 is, for example, 8 or more, preferably 16 or more, in the circumferential direction. They are formed at equal intervals. If the number of slits 24 is increased, thermal deformation during heat treatment can be suppressed, but there is a disadvantage that the rigidity of the cutting edge 16 is reduced. Conversely, if the number of slits 24 is small, the thermal deformation of the cutting edge 16 becomes longer and larger, resulting in higher accuracy. Will result in a decline. The cutting edge 16 is heat-treated radially inward from the outer peripheral edge 16a, for example, within a range of 2 mm or less to form a recrystallized structure 22 of an intermetallic compound, and this region constitutes a grinding region involved in grinding and cutting. The cutting edge portion 16 is formed by dividing each area partitioned by circumferentially adjacent slits 24, 24 into cutting edge pieces 2.
The length of the slit 24 is the same as that of the recrystallized structure 22.
Is preferred, but may be less than or equal to the recrystallized structure 22. Even in this case, if the inner edge of the slit 24 is near the base edge of the recrystallized structure 22, the adverse effect of thermal distortion due to the heat treatment is small.

Next, a method of manufacturing the electroformed thin blade grindstone 20 according to the second embodiment will be described. The super-abrasive grains 11 are dispersed and arranged in the metal plating phase 12, and at least until the Sn plating layer 14 is formed on the surface 12 a of the metal plating phase 12 of the cutting edge 16, the electroformed thin blade 10 according to the first embodiment.
Is the same as Then, with respect to the obtained electroformed thin blade grindstone 20, the outer peripheral edge 1 of the blade edge portion 16 is cut using a laser device for cutting or the like.
The slits 24 are formed at predetermined intervals radially inward from 6a. Next, as shown in FIG. 6, the electroformed thin blade grindstone 20 is sandwiched between a pair of flanges 28, 28 having a circular cup shape, for example, provided on a rotary table 27 connected to a motor.
Only the outer peripheral side including 6 is made to protrude in a ring shape all around. At that time, the electroformed thin blade grindstone 20 is fixed so as to form a concentric circle with the flanges 28, 28. In this state, the laser device 30 is provided so that the vicinity of the outer peripheral edge 16a of the cutting edge 16 of the electroformed thin blade grindstone 20 can be irradiated with laser light. Laser device 30
For example, a low-temperature heating device for brazing, soldering, or the like is used, but another appropriate type of laser device can be used. In this state, the electroformed thin blade grindstone 20 is rotated around the center axis of the turntable 27.
The laser beam is irradiated from the laser device 30 while rotating the cutting edge portion 16 to sequentially heat a range of 2 mm or less radially inward from the outer peripheral edge 16a of the rotating blade edge portion 16. The heating temperature by laser irradiation is in a range from 200 ° C. to 500 ° C., for example,
It is about 50 ° C.

As a result, the edge portion 16 can be heat-treated in a spot manner, so that the Sn plating layer 14 is melted in the heated region and alloyed with the inner metal plating phase 12 to form an intermetallic compound to form a recrystallized structure 22. Moreover, since the rotating electroformed thin blade grindstone 20 is continuously heated in a spot-like manner, the blade portion 16 heated for a short time is quickly deviated from the laser beam irradiation point and is cooled. Can be prevented. At the same time, the slits 24 are formed at predetermined intervals in the blade edge portion 16.
Heat is also dissipated in 4, 24. Due to these factors, the cutting edge 1
6 is effectively cooled after heating, and the cutting edge 1
6 can be prevented from being thermally deformed. And slit 2
4 does not cause a large thermal distortion in the circumferential direction,
Only small thermal distortions can occur at each cutting edge 26.
Therefore, the reed structure 22 of the intermetallic compound can be manufactured by heat-treating the cutting edge portion 16 with high precision over a predetermined range of, for example, a width of 2 mm or less, and it is ensured that the recrystallization structure 22 becomes wavy or staggered due to thermal strain. Can be prevented.

The thus obtained electroformed thin blade whetstone 20
When cutting a work material such as silicon by using a cutting tool, the electroformed thin blade grindstone 20 is mounted on the grindstone shaft 2 while being rotated at a predetermined rotation speed, and the cut material is cut by the cutting edge portion 16. At this time, since the grinding region of the cutting edge portion 16 has a recrystallized structure 22 made of an Sn-Ni intermetallic compound, the structure of the original metal plating phase 12 is softened and embrittled. Recrystallized structure 2 faster than wear by grinding
2 is abraded and removed, and new superabrasive grains 11 are exposed, so that good sharpness can be continuously maintained. Therefore, the spontaneous cutting action can be promoted in the grinding area, and good sharpness can be maintained, so that excellent grinding performance can be exhibited. Moreover, adhesion to the work material is easily cut off, and the metal plating phase 12 maintains a high rigidity in a region not involved in grinding, so that the holding strength of the electroformed thin blade grindstone 20 is high.

As described above, according to the present embodiment, the spontaneous cutting action of the cutting edge portion 16 is promoted to maintain good sharpness, and excellent grinding performance can be exhibited. Electroformed thin blade whetstone 20
At the time of manufacturing, a recrystallized structure 22 made of an intermetallic compound
When the cutting edge 16 is heated to form
Is provided and the electroformed thin blade grindstone 20 is rotated, so that the thermal distortion of the blade edge portion 16 can be suppressed to a small level for each blade edge piece 26 to produce a highly accurate recrystallized structure 22 with little distortion, which may cause a decrease in the strength of the peripheral region. There is no.

[0021]

As described above, in the electroformed thin blade grinding wheel according to the present invention, an Sn plating layer having a thickness not exceeding the amount of protrusion of superabrasive grains from the metal bonding phase is formed on the surface of the metal bonding phase at the cutting edge. Therefore, even if the surface of the cutting edge adheres to the work material during grinding, the Sn plating layer formed on the surface of the metal bonding phase has good sliding properties and good lubricity, so it has low deformation resistance and low mechanical strength. Since it is small, the adhered portion is easily sheared on the surface of the adhered Sn plating layer, the abrasion of the metal binding phase is suppressed, the grinding resistance can be reduced, and the sharpness can be improved. Moreover, by coating the surface with a soft Sn plating layer, the chipping of the work material is suppressed by the synergistic effect of the effect of improving the slidability, reducing the aggressiveness of the opponent, and the effect of suppressing the projection amount of the superabrasive grains. Can be. In addition, the reduction in grinding resistance reduces the load on the grindstone and suppresses the accumulation of grindstone damage, so that the life of the grindstone can be improved.

Also, since the edge portion is heat-treated to melt the Sn plating layer and alloy with the metal bonding phase, Sn and Ni
Intermetallic compound is formed with the metal constituting the metal binding phase, etc., and the cutting edge is more brittle than the original metal, which can promote the spontaneous cutting of superabrasive grains and easily cut off adhesion with the work material . In addition, since Sn-Ni intermetallic compound is formed and chemically stabilized, adhesion itself is less likely to occur. In addition, since the width of the recrystallized structure obtained by heat-treating the cutting edge is 2 mm or less, only the region involved in grinding such as cutting can be made the recrystallized structure, so that the sharpness can be improved and other regions can be improved. Can keep the synthesis high.

In the electroformed thin blade grinding wheel according to the present invention, an Sn plating layer having a thickness not exceeding the amount of the superabrasive grains protruding from the metal bonding phase is formed on the surface of the metal plating phase at the edge of the blade and in the direction in which the edge extends. After forming slits at predetermined intervals along,
Since the cutting edge is heat-treated and the Sn plating layer is melted and alloyed with the metal bonding phase, the thermal deformation of the cutting edge during the heat treatment is small, the accuracy of the cutting edge is increased, and sharp cutting can be performed.

The method for producing an electroformed thin blade according to the present invention comprises:
The super-abrasive grains are dispersed and arranged in the metal bonding phase, and the blade is irradiated with laser light at a predetermined width while rotating the electroformed thin blade grinding wheel having an Sn plating layer formed on the surface of the metal bonding phase at a predetermined speed. By rotating the electroformed thin blade whetstone while irradiating the cutting edge with laser light, recrystallization can be performed while suppressing the thermal distortion of the cutting edge, and the laser is rotated by the rotation speed of the electroformed thin blade whetstone. The amount of heat input by light can be controlled. Moreover, since the Sn plating layer can be melted to form an intermetallic compound with the metal constituting the metal bonding phase and recrystallized, spontaneous cutting during grinding can be promoted. In addition, since slits are formed at predetermined intervals in the blade edge portion prior to laser beam irradiation, heat radiation during laser beam irradiation proceeds further by the slit, and thermal distortion of the blade edge portion can be further suppressed.

[Brief description of the drawings]

FIG. 1 is an enlarged sectional view of a cutting edge portion of an electroformed thin blade grindstone according to a first embodiment of the present invention.

FIG. 2 is a plan view of an electroformed thin blade grindstone according to the embodiment.

FIG. 3 is an enlarged cross-sectional view of a cutting edge portion showing an electroformed thin blade grindstone before forming an Sn plating layer.

FIG. 4 is an enlarged sectional view of a cutting edge portion of an electroformed thin blade grindstone according to a second embodiment.

FIG. 5 is a plan view of the electroformed thin blade grindstone according to the embodiment.

FIG. 6 is an explanatory view showing a step of irradiating a laser beam to a cutting edge of an electroformed thin blade grindstone.

FIG. 7 is a longitudinal sectional view showing a state in which a conventional electroformed thin blade grindstone is mounted on a grindstone shaft.

[Description of Signs] 10, 20 Electroformed thin blade whetstone 11 Super abrasive grain 12 Metal plating phase 12a Surface 16 Cutting edge 22 Recrystallized structure 24 Slit

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Naoto Suzuki 246-1 Egoshi, Kurosuno, Izumi-cho, Iwaki-shi, Fukushima F-term in Mitsubishi Materials Corporation Iwaki Works (reference) 3C063 AA02 AB03 BA23 BB02 BC02 BC08 BG01 BG07 CC12 EE31 FF30

Claims (6)

[Claims] 1. An electroformed thin blade grindstone in which superabrasive grains are dispersed and arranged in a metal binder phase made of Ni, Co or an alloy thereof, the thickness not exceeding the amount of protrusion of the superabrasive grains from the metal binder phase. An electroformed thin blade grinding wheel characterized in that the Sn plating layer of (1) is formed on the surface of the metal binding phase at the cutting edge. 2. The electroformed thin blade wheel according to claim 1, wherein the blade edge portion is heat-treated to melt the Sn plating layer and alloy with the metal bonding phase. 3. The electroformed thin blade wheel according to claim 1, wherein a width of an alloyed recrystallized structure obtained by heat-treating the blade edge portion is 2 mm or less. 4. An electroformed thin-blade stone in which superabrasive grains are dispersed and arranged in a metal binder phase made of Ni, Co or an alloy thereof, the thickness not exceeding the amount of protrusion of the superabrasive grains from the metal binder phase. After forming a Sn plating layer on the surface of the metal binding phase of the cutting edge portion and forming slits at predetermined intervals along the extending direction of the cutting edge portion, heat-treating the cutting edge portion,
An electroformed thin blade grindstone wherein the Sn plating layer is melted and alloyed with a metal binder phase. 5. An electroformed thin blade grindstone having super-abrasive grains dispersed in a metal binder phase composed of Ni, Co or an alloy thereof and having an Sn plating layer formed on the surface of the metal binder phase, is provided at a predetermined speed. A method for manufacturing an electroformed thin blade grindstone, which comprises irradiating a laser beam onto a blade edge while rotating the blade to recrystallize over a predetermined width. 6. A slit is formed at a predetermined interval in a cutting edge portion prior to irradiation with a laser beam.
A method for producing the electroformed thin blade grinding wheel according to the above.