JP2002064176A - Electronic component mounting board, electronic component using the same and electronic apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting board which has a general availability and can prevent degradation of high frequency characteristics, an electronic component using the same, and an electronic apparatus using the same. SOLUTION: Nine narrow strip electrodes 12 extending from near one end face of a board 11 near to the opposite end face are formed together with connecting electrodes 13 formed near them on approximately a central portion of one main surface of the board 11, the strip electrodes 12 are connected to low frequency terminals 15 through the other main surface of the board 11, respectively, and the connecting electrodes 13 are similarly connected to high frequency terminals 16 to constitute an electronic component mounting board 10. This provides a general availability, reduces the cost and prevents the degradation of high frequency characteristics.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting board for mounting high frequency electronic components, an electronic component using the same, and an electronic device using the same.

[0002]

2. Description of the Related Art FIG. 7 is a plan view of an electronic component using a conventional electronic component element mounting board. In FIG. 7, an electronic component 1 includes an electronic component element mounting board 2 and an electronic component element 7 mounted thereon.

The electronic component mounting board 2 includes a substrate 3 made of an insulator, a plurality of connection electrodes 4 and a ground electrode 5 formed on one main surface of the substrate 3, and an end surface of the substrate 3. And external connection terminals 6. The connection electrode 4 is arranged at a predetermined position, and is connected to the external connection terminal 6 via the other main surface of the substrate 3 or an inner layer having a multilayer structure. The other main surface of the substrate 3 is a mounting surface mounted on a printed circuit board or the like.

The electronic component 1 has an electronic component 7 mounted on a predetermined position of a ground electrode 5 formed on one main surface of a substrate 3 constituting an electronic component mounting board 2, and a connection electrode 5 is provided. A bonding pad 7 a formed on the electronic component element 7 is connected by a wire 8.
Although not shown, a cover that covers the electronic component element 7, the connection electrode 5, and the wire 8 may be provided on one main surface of the substrate 3.

[0005]

In the conventional electronic component element mounting board 2 shown in FIG. 7, it is assumed that predetermined electronic component elements are mounted. However, there is a problem that there is no versatility, and it is necessary to change the pattern of the electronic component element mounting board according to the change in the size and type of the electronic component element.

On the other hand, electrodes of a predetermined size are arranged in a grid on one main surface of the substrate, and each electrode is connected to a terminal formed on the back surface or an end surface of the substrate to thereby mount the electronic component element mounting substrate. It is possible to realize the versatility of
In that case, it is difficult to make the connection between all the electrodes and the terminals with a configuration in which the high-frequency characteristics are not deteriorated, and there is a problem that the high-frequency characteristics are deteriorated.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems, and to provide an electronic component mounting board capable of providing versatility and preventing deterioration of high frequency characteristics, and an electronic component using the same. And an electronic device using the same.

[0008]

In order to achieve the above object, an electronic component element mounting board according to the present invention has one main surface of the substrate as an electronic component element mounting surface, the other main surface as a mounting surface, and an end surface. In the electronic component element mounting board provided with the external connection terminals, a plurality of strip electrodes are provided on one main surface of the board.

Further, the electronic component element mounting board of the present invention comprises:
The strip electrode is formed so as to extend from the vicinity of one end face of the substrate to the vicinity of the other opposing end face.

Further, the electronic component element mounting board of the present invention comprises:
The strip electrode is divided into a plurality in the longitudinal direction.

Further, the electronic component element mounting board of the present invention comprises:
Two or more of the strip electrodes are electrically connected to each other.

Further, the electronic component element mounting board of the present invention comprises:
A ground electrode is provided on the other main surface of the substrate, and at least one of the strip electrodes is electrically connected to the ground electrode.

Further, the electronic component element mounting board of the present invention comprises:
The external connection terminal includes a high-frequency terminal and a low-frequency terminal, and at least one of the strip electrodes is electrically connected to the low-frequency terminal.

Further, an electronic component according to the present invention includes an electronic component element mounting board according to any one of the above, and at least one electronic component element mounted on one or more strip electrodes of the electronic component element mounting board. It is characterized by having.

Further, an electronic device of the present invention is characterized by using the above electronic component.

With this configuration, in the electronic component element mounting board of the present invention, versatility, cost reduction and deterioration of high frequency characteristics can be prevented.

Further, in the electronic component of the present invention, higher performance and lower cost can be achieved.

Further, in the electronic device of the present invention, high performance and low cost can be achieved.

[0019]

FIG. 1 is a plan view showing an embodiment of an electronic component element mounting board according to the present invention. In FIG. 1, an electronic component element mounting board 10 includes a board 11 made of an insulator,
Nine narrow strip electrodes 12 extending from the vicinity of one end face of the substrate 11 to the vicinity of the other opposite end face thereof, the four connection electrodes 13, and the ground at substantially the center of one main surface of the substrate 11. It comprises an electrode 14 and external connection terminals formed on the end face of the substrate 11, that is, a low-frequency terminal 15 and a high-frequency terminal 16.

The strip electrode 1 on the substrate 11
The external connection terminal formed on the end surface orthogonal to the longitudinal direction of the strip electrode 2 is the terminal 15 for low frequency, and the external connection terminal formed on the end surface parallel to the longitudinal direction of the strip electrode 12 is the terminal 16 for high frequency. Each strip electrode 12 is connected to the low-frequency terminal 15 via the other main surface of the substrate 11 or an inner layer having a multilayer structure. Each connection electrode 13 is also connected to the high-frequency terminal 16 via the other main surface of the substrate 11 or an inner layer having a multilayer structure. The other main surface of the substrate 11 is a mounting surface mounted on a printed circuit board or the like.

The term "strip electrode" as used herein is a general term for a substantially rectangular electrode having a short side and a long side. However, the shape is not necessarily limited to a perfect rectangular shape, and may be bent in the longitudinal direction, tapered or rounded at a corner, or partially constricted. .

FIG. 2 is a plan view of one embodiment of an electronic component using the electronic component element mounting board of the present invention. The electronic component 20 shown in FIG. 2 is configured using the electronic component element mounting board 10 shown in FIG.

In FIG. 2, an electronic component 20 has four electronic component elements 21 mounted on a strip electrode 12 formed on one main surface of a substrate 11 constituting an electronic component element mounting substrate 10, and a connection electrode. 13 and strip electrode 12 and bonding pad 2 formed on electronic component element 21
1a is connected by a wire 22. Here, each of the electronic component elements 21 is mounted over the three strip electrodes 12 with, for example, a conductive adhesive, a non-conductive adhesive, solder, or the like. Then, the bonding pad 21a formed on the electronic component element 21
Is a part of the low frequency terminal 1 through the strip electrode 12.
5, another part is connected to the high-frequency terminal 1 via the connection electrode 13.
6 is connected.

In the electronic component 20 configured as described above, the mounting portion of the electronic component element 21 of the electronic component element mounting board 10 is a strip electrode 12, so that the electronic component elements 21 can be relatively freely arranged. Can be. Thereby, even if the size and type of the electronic component element are slightly changed, they can be mounted on the same electronic component element mounting substrate. In this way, since the general-purpose use of the electronic component element mounting board can be realized, the cost of the electronic component element mounting board can be reduced, the cost of the electronic component itself can be reduced, and further, the redesign time of the electronic component (TAT: Turn Around Time). Can be reduced.

Further, by connecting the strip electrode 12 to the low-frequency terminal 15 on the electronic component element mounting substrate 10, the strip electrode 12 can be used not only as a simple mounting electrode for electronic component elements but also as a plurality of electronic component elements. It can also be used as an electrode for supplying a common power supply or a ground electrode. That is, the electrode for supplying power can be regarded as a kind of electrode through which a low-frequency signal passes because it is not necessary to consider the high-frequency characteristics. Useful for. In addition, since one strip electrode 12 can be adjacent to a plurality of electronic component elements, it is not necessary to provide power supply wiring exclusively. On the other hand, since the strip electrode 12 is an electrode having a relatively large area, the parasitic inductance component can be reduced, and the strip electrode 12 can be used as a highly stable ground electrode. However, when the strip electrode 12 is used as a ground electrode, the low-frequency terminal 15 connected to the strip electrode 12 needs to be grounded, for example, on the printed circuit board side of the mounting partner. Further, the strip electrode 12 can be used as a supply electrode for a low-frequency signal such as a reference clock common to each electronic component element, in addition to a power supply and a ground electrode.

On the other hand, in the electronic component element mounting substrate 10, the connection electrode 13 is connected to the high frequency terminal 16.
At this time, the connection between the connection electrode 13 and the high-frequency terminal 16 is designed to minimize high-frequency mismatch. The connection electrode 13 is connected to a bonding pad 21 a to which a high-frequency signal of the electronic component element 21 is input or output. Therefore, the electronic component element 21
Can be prevented from deteriorating in the high-frequency characteristics.

As described above, in the electronic component element mounting substrate 10 of the present invention, the strip electrode 12 and the connection electrode 13 are formed on one main surface of the substrate 11, and the strip electrode 12 is used as the mounting electrode of the electronic component element 21. In addition, by using the electrode connected to the low-frequency terminal 15 and the connection electrode 13 as the electrode connected to the high-frequency terminal 16, not only general versatility can be obtained, but also an electrode through which a low-frequency signal and a high-frequency signal flow. Can also prevent deterioration of the high frequency characteristics of the electronic component element.

In the electronic component 20 of the present invention,
It is possible to reduce the cost by generalizing the electronic component element mounting board 10 and shorten the redesign time, and at the same time, it is possible to prevent the deterioration of the high frequency characteristics.

The electronic component elements mounted on the electronic component element mounting board are not limited to semiconductor elements such as IC chips, but may be individual elements such as chip capacitors, chip resistors, chip inductors, and surface mount transistors. An electronic component element in which electrodes such as strip lines are formed on parts and small pieces of a dielectric substrate with a high dielectric constant to form passive elements such as matching circuits and filters, and a hybrid configuration in which a semiconductor chip is further mounted. The electronic component element may be used.

FIG. 3 is a plan view of another embodiment of an electronic component using the electronic component element mounting board of the present invention. 3, the same or equivalent parts as those in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted.

The electronic component 30 shown in FIG. 3 is constituted by using the electronic component element mounting board 31 of the present invention. The electronic component mounting board 31 is basically the same as the electronic component mounting board 10 shown in FIG. However, although not shown, a ground electrode is formed on the other main surface of the substrate 11. Then, some of the strip electrodes 12
3 (the left and right end strip electrodes in FIG. 3) are connected to a ground electrode formed on the other main surface of the substrate 11 via the via hole 32. Also, on one main surface of the substrate 11, the second and third strip electrodes 12 from the left
Are electrically connected to each other via a wire 33. Here, it is not necessary that all the strip electrodes 12 are connected to the low-frequency terminals 15. For example, the strip electrodes connected to the ground electrode formed on the other main surface are connected to the low-frequency terminals 15. Sometimes not.

In the electronic component element mounting board 31 configured as described above, the strip electrode 12 used as the ground electrode is connected to the ground electrode formed on the other main surface of the board 11 via the via hole 32. There is an effect that the parasitic inductance component of the strip electrode 12 for grounding is further reduced, the ground potential is further stabilized, and the high frequency characteristics are further improved. Further, by connecting a plurality of strip electrodes 12 with wires 33,
For example, when used as an electrode for supplying a power supply or a low-frequency signal, the area can be widened and the same power supply or low-frequency signal can be supplied to more electronic component elements. In addition, when connecting the strip electrodes 12 used as a plurality of ground electrodes, there is an effect that the ground potential is stabilized.

The connection between the strip electrode and the ground electrode formed on the other main surface of the substrate is not limited to a via hole, but may be a through hole. Further, the electrical connection of the plurality of strip electrodes is not limited to a wire, but may be a conductive adhesive or the like.

In the electronic component 30, by using such an electronic component element mounting board 31,
The ground potential applied to the electronic component element 21 can be further stabilized, and the high-frequency characteristics of the electronic component can be improved.

FIG. 4 is a plan view of still another embodiment of an electronic component using the electronic component element mounting board of the present invention. 4, the same or equivalent parts as those in FIG. 2 are denoted by the same reference numerals, and the description thereof will be omitted.

The electronic component 40 shown in FIG. 4 is configured using the electronic component element mounting board 41 of the present invention. The electronic component mounting board 41 is different from the electronic component mounting board 10 shown in FIG. 1 in the shape of the strip electrode. At the approximate center of one main surface of the substrate 11 of the electronic component element mounting substrate 41, three wide strip electrodes 42 are formed extending from near one end surface of the substrate 11 to near the other opposite end surface. Have been. Each strip electrode 42 is connected to the low-frequency terminal 15 via the other main surface of the substrate 11 or an inner layer having a multilayer structure.

In the electronic component 40, three electronic component elements 43 are mounted on a strip electrode 42 formed on one main surface of the substrate 11 constituting the electronic component element mounting substrate 41, and the connection electrodes 13 and The strip electrode 42 and a bonding pad 43 a formed on the electronic component element 43 are connected by a wire 44. here,
Each of the electronic component elements 43 has one strip electrode 4.
2 is mounted with a conductive adhesive, a non-conductive adhesive, solder, or the like. There is no electronic component element mounted over a plurality of strip electrodes. Then, the bonding pad 43a formed on the electronic component element 43
Is a low-frequency terminal 1 partially through the strip electrode 42.
5, another part is connected to the high-frequency terminal 1 via the connection electrode 13.
6 is connected.

In the electronic component 40 thus configured, as in the case of the electronic component 20, the cost of the electronic component element mounting board, the cost of the electronic component itself, and the redesign time of the electronic component are reduced. Can be reduced. In particular, when the strip electrode is formed wide as in the electronic component element mounting board 41, when this is used as a ground electrode, the parasitic inductance component can be further reduced, and the strip electrode is used as a highly stable ground electrode. it can.

It is to be noted that even when an electronic component element mounting substrate having such a wide strip electrode is used,
An electronic component element mounted over a plurality of strip electrodes may be provided.

FIG. 5 is a plan view of still another embodiment of an electronic component using the electronic component element mounting board of the present invention. 5, the same or equivalent parts as those in FIG. 2 are denoted by the same reference numerals, and description thereof will be omitted.

The electronic component 50 shown in FIG. 5 is constituted by using the electronic component element mounting board 51 of the present invention. The electronic component mounting board 51 is different from the electronic component mounting board 10 shown in FIG. 1 in the shape of the strip electrode. A substantially central portion of one main surface of the substrate 11 of the electronic component element mounting substrate 51 extends from the vicinity of one end surface of the substrate 11 to the vicinity of the other opposite end surface, and is divided into two in the longitudinal direction. Ten strip electrodes 52 are formed. Each strip electrode 52 is connected to the low-frequency terminal 15 via the other main surface of the substrate 11 or an inner layer having a multilayer structure. Each strip electrode 52 has a rectangular shape having a short side and a long side as before before being divided in the longitudinal direction.

In the electronic component 50, four electronic component elements 53 are mounted on a strip electrode 52 formed on one main surface of the substrate 11 constituting the electronic component element mounting substrate 51, and the connection electrodes 13 and The strip electrode 52 and the bonding pad 53 a formed on the electronic component element 53 are connected by a wire 54. here,
The three electronic component elements 53 are two strip electrodes 52.
For example, it is mounted with a conductive adhesive, a non-conductive adhesive, solder, or the like, and the other one is mounted on one strip electrode 52 in a similar manner. A part of the bonding pad 53 a formed on the electronic component element 53 is connected to the low-frequency terminal 15 via the strip electrode 52, and another part is connected to the high-frequency terminal 16 via the connection electrode 13. ing. Further, two strip electrodes 52 on which no electronic component elements are mounted are electrically connected to each other via three wires 55.

In the electronic component 50 configured as described above, the strip electrode 52 formed on one main surface of the electronic component mounting board 51 is formed by being divided into two in the longitudinal direction. The degree of freedom regarding how to use the strip electrode 52 is increased. That is, the degree of freedom as to which of the strip electrodes 52 is used as the electrode on which the electronic component element 53 is mounted, which is used as the power supply electrode, and which is used as the ground electrode is increased. As a result, even if the size and type of the electronic component elements mounted on the strip electrode 52 are further different, the same electronic component element mounting board 51
Can be used, further reducing the cost of electronic components,
Design time can be reduced.

Although not shown in FIGS. 4 and 5,
A ground electrode is formed on the other main surface of the substrate 11 of the electronic component element mounting board, and this strip electrode is connected to any of the strip electrodes via via holes. Can be used as Further, in FIG. 5, the two strip electrodes 52 are connected by the wire 55, but may be connected by using a solder or a conductive adhesive, and the same operation and effect as in the case of the wire can be obtained. .

The electronic component element mounting boards 10, 41,
In 51, all the strip electrodes are connected to the low frequency terminal 1
5 is connected, but a part of the strip electrode may be connected to the low-frequency terminal 15.

In each of the above embodiments of the electronic components, the electronic components are constituted by the electronic component element mounting board and the electronic component elements mounted thereon.
A cover that covers the electronic component element, the strip electrode, the connection electrode, and the wire may be provided on one main surface of the electronic component element mounting substrate.

FIG. 6 is a perspective view of an embodiment of the electronic device of the present invention. In FIG. 6, a mobile phone 60, which is one of the electronic devices, includes a housing 61, a printed circuit board 62 disposed therein, and an electronic component 63 of the present invention mounted on the printed circuit board 62. . The electronic component 63 is a high-frequency component such as an amplifier, an oscillator, and a filter.

In the mobile phone 60 thus configured, since the electronic component 63 of the present invention is used, cost reduction and improvement in performance can be achieved.

In FIG. 6, a mobile phone is shown as an electronic device. However, the electronic device is not limited to a mobile phone, and any electronic device using the electronic component of the present invention, such as a notebook personal computer or a portable information device. Anything is fine.

[0050]

According to the electronic component element mounting substrate of the present invention, a plurality of strip electrodes are formed on one main surface of the substrate so as to extend from the vicinity of one end surface of the substrate to the vicinity of the other opposing end surface. Thereby, the versatility can be reduced, the cost can be reduced, and the deterioration of the high-frequency characteristics can be prevented.

The versatility can be further expanded by dividing the strip electrode into a plurality in the longitudinal direction.

Since two or more strip electrodes are electrically connected to each other, it is possible to increase the area of an electrode having a common potential or to use the electrode as a stable ground potential.

Further, since at least one of the strip electrodes is electrically connected to the ground electrode, the strip electrode can be used as a stable ground electrode.

Further, according to the electronic component of the present invention, by using the electronic component element mounting board of the present invention, higher performance and lower cost can be achieved.

Further, according to the electronic device of the present invention, by using the electronic component of the present invention, higher performance and lower cost can be achieved.

[Brief description of the drawings]

FIG. 1 is a plan view showing one embodiment of an electronic component element mounting board of the present invention.

FIG. 2 is a plan view showing one embodiment of an electronic component using the electronic component element mounting board of the present invention.

FIG. 3 is a plan view showing another embodiment of an electronic component using the electronic component element mounting board of the present invention.

FIG. 4 is a plan view showing still another embodiment of an electronic component using the electronic component element mounting board of the present invention.

FIG. 5 is a plan view showing still another embodiment of the electronic component using the electronic component element mounting board of the present invention.

FIG. 6 is a partially broken perspective view showing one embodiment of the electronic device of the present invention.

FIG. 7 is a plan view showing an electronic component using a conventional electronic component element mounting board.

[Explanation of symbols]

 10, 31, 41, 51 ... electronic component element mounting substrate 11 ... substrate 12, 42, 52 ... strip electrode 13 ... connection electrode 14 ... ground electrode 15 ... low frequency terminal 16 ... high frequency terminal 20, 30, 40, 50 ... Electronic components 21, 43, 53 ... Electronic component elements 21a, 43a, 53a ... Bonding pads 22, 33, 44, 54, 55 ... Wires 32 ... Via holes 60 ... Mobile phones

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E317 AA22 BB01 BB11 CD34 GG11 GG16 5E336 AA04 BB01 BC34 CC32 DD03 GG11 5E338 AA00 BB31 BB65 BB75 CC01 CC04 CC06 CD13 CD25 CD33 EE11 EE31

Claims (8)

[Claims] 1. An electronic component mounting board having one main surface as an electronic component element mounting surface, the other main surface as a mounting surface, and an external connection terminal on an end surface. An electronic component element mounting board comprising a strip electrode. 2. The electronic component mounting board according to claim 1, wherein the strip electrode is formed to extend from near one end face of the substrate to near the other end face facing the strip electrode. 3. The strip electrode according to claim 1, wherein the strip electrode is divided into a plurality of pieces in the longitudinal direction.
An electronic component element mounting board according to claim 1. 4. The electronic component element mounting board according to claim 1, wherein two or more of said strip electrodes are electrically connected to each other. 5. A ground electrode on the other main surface of the substrate,
5. The electronic component mounting board according to claim 1, wherein at least one of said strip electrodes is electrically connected to said ground electrode. 6. The external connection terminal has a high-frequency terminal and a low-frequency terminal, and at least one of the strip electrodes is electrically connected to the low-frequency terminal. An electronic component element mounting board according to any one of claims 1 to 5. 7. The electronic component element mounting board according to claim 1, wherein the electronic component element mounting board is one of the electronic component element mounting board.
An electronic component having at least one electronic component element mounted on one or a plurality of strip electrodes. 8. An electronic device using the electronic component according to claim 7.