JP2002053975A - METHOD FOR DEPOSITING CHROMIUM-FREE CORROSION RESISTANT FILM ON Sn-Zn ALLOY PLATING - Google Patents
METHOD FOR DEPOSITING CHROMIUM-FREE CORROSION RESISTANT FILM ON Sn-Zn ALLOY PLATINGInfo
- Publication number
- JP2002053975A JP2002053975A JP2001061459A JP2001061459A JP2002053975A JP 2002053975 A JP2002053975 A JP 2002053975A JP 2001061459 A JP2001061459 A JP 2001061459A JP 2001061459 A JP2001061459 A JP 2001061459A JP 2002053975 A JP2002053975 A JP 2002053975A
- Authority
- JP
- Japan
- Prior art keywords
- alloy plating
- film
- acid
- chromium
- salt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract description 29
- 229910045601 alloy Inorganic materials 0.000 title abstract description 26
- 239000000956 alloy Substances 0.000 title abstract description 26
- 229910020994 Sn-Zn Inorganic materials 0.000 title abstract description 18
- 229910009069 Sn—Zn Inorganic materials 0.000 title abstract description 18
- 238000005260 corrosion Methods 0.000 title abstract description 17
- 230000007797 corrosion Effects 0.000 title abstract description 17
- 238000000034 method Methods 0.000 title abstract description 13
- 238000000151 deposition Methods 0.000 title description 3
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 abstract description 11
- 239000000126 substance Substances 0.000 abstract description 11
- 238000006243 chemical reaction Methods 0.000 abstract description 10
- -1 inorganic acid ions Chemical class 0.000 abstract description 10
- 239000007864 aqueous solution Substances 0.000 abstract description 9
- 229910052751 metal Inorganic materials 0.000 abstract description 9
- 239000002184 metal Substances 0.000 abstract description 9
- 239000000758 substrate Substances 0.000 abstract description 9
- 229910052748 manganese Inorganic materials 0.000 abstract description 6
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 6
- 229910052710 silicon Inorganic materials 0.000 abstract description 6
- 239000000243 solution Substances 0.000 abstract description 6
- 229910052720 vanadium Inorganic materials 0.000 abstract description 6
- 229910052725 zinc Inorganic materials 0.000 abstract description 6
- 229910052721 tungsten Inorganic materials 0.000 abstract description 5
- 229910052726 zirconium Inorganic materials 0.000 abstract description 5
- 229910052719 titanium Inorganic materials 0.000 abstract description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052804 chromium Inorganic materials 0.000 abstract description 2
- 239000011651 chromium Substances 0.000 abstract description 2
- 150000003839 salts Chemical class 0.000 description 16
- 239000011701 zinc Substances 0.000 description 9
- 150000007524 organic acids Chemical class 0.000 description 7
- 239000010936 titanium Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000011572 manganese Substances 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 150000007513 acids Chemical class 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910001297 Zn alloy Inorganic materials 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000007739 conversion coating Methods 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910017604 nitric acid Inorganic materials 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- KQTIIICEAUMSDG-UHFFFAOYSA-N tricarballylic acid Chemical compound OC(=O)CC(C(O)=O)CC(O)=O KQTIIICEAUMSDG-UHFFFAOYSA-N 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 101100325793 Arabidopsis thaliana BCA2 gene Proteins 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- 102100033041 Carbonic anhydrase 13 Human genes 0.000 description 1
- 102100033007 Carbonic anhydrase 14 Human genes 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 101000867860 Homo sapiens Carbonic anhydrase 13 Proteins 0.000 description 1
- 101000867862 Homo sapiens Carbonic anhydrase 14 Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910021380 Manganese Chloride Inorganic materials 0.000 description 1
- GLFNIEUTAYBVOC-UHFFFAOYSA-L Manganese chloride Chemical compound Cl[Mn]Cl GLFNIEUTAYBVOC-UHFFFAOYSA-L 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 235000002867 manganese chloride Nutrition 0.000 description 1
- 239000011565 manganese chloride Substances 0.000 description 1
- 229940099607 manganese chloride Drugs 0.000 description 1
- 229940099596 manganese sulfate Drugs 0.000 description 1
- 235000007079 manganese sulphate Nutrition 0.000 description 1
- 239000011702 manganese sulphate Substances 0.000 description 1
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- DCKVFVYPWDKYDN-UHFFFAOYSA-L oxygen(2-);titanium(4+);sulfate Chemical compound [O-2].[Ti+4].[O-]S([O-])(=O)=O DCKVFVYPWDKYDN-UHFFFAOYSA-L 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229910000348 titanium sulfate Inorganic materials 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
Landscapes
- Chemical Treatment Of Metals (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、Sn−Zn合金め
っき皮膜上にクロムフリー耐食性皮膜を形成する方法及
びそのために用いるクロムフリー皮膜形成用水溶液に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a chromium-free corrosion-resistant film on a Sn-Zn alloy plating film and an aqueous solution for forming a chromium-free film used therefor.
【従来の技術】近年、亜鉛めっきの耐食性を改良する目
的で亜鉛と異種金属との合金めっきがいろいろ検討され
実用化に至っている。この中でもSn−Zn合金めっき
は、耐食性、耐塩水性、二次加工性及びハンダ付け性に
優れているため、自動車部品、電子部品等に用いる工業
用めっきとして広く使用されてきている。このSn−Z
n合金めっき単独では耐食性が十分ではなく、めっき後
クロム酸処理、いわゆるクロメート処理が産業界で広範
囲に採用されている。しかしながら、近年、六価クロム
が人体や環境に悪い影響を与えることが指摘され、六価
クロムの使用を規制する動きが、活発になってきている2. Description of the Related Art In recent years, various alloy platings of zinc and dissimilar metals have been studied for the purpose of improving the corrosion resistance of zinc plating, and have been put to practical use. Among them, Sn—Zn alloy plating has been widely used as industrial plating used for automobile parts, electronic parts, etc. because of its excellent corrosion resistance, salt water resistance, secondary workability, and solderability. This Sn-Z
The n-alloy plating alone does not have sufficient corrosion resistance, and post-plating chromic acid treatment, a so-called chromate treatment, is widely used in the industry. However, in recent years, it has been pointed out that hexavalent chromium has a bad effect on the human body and the environment, and the movement to regulate the use of hexavalent chromium has become active.
【0002】[0002]
【発明が解決しようとする課題】本発明は、Sn−Zn
合金めっきに、人体や環境に影響を与えるクロムを用い
ない化成処理を施しかつ従来のクロメートと同等な耐食
性を有する皮膜を形成させることができる方法を提供す
ることを目的とする。本発明は、又、この方法に用いる
クロムフリー皮膜形成用水溶液を提供することを目的と
する。SUMMARY OF THE INVENTION The present invention relates to a Sn--Zn
An object of the present invention is to provide a method capable of performing a chemical conversion treatment on chromium alloy that does not use chromium, which affects the human body and the environment, and forming a film having corrosion resistance equivalent to that of a conventional chromate. Another object of the present invention is to provide an aqueous solution for forming a chromium-free film used in this method.
【課題を解決するための手段】本発明は、基体上にSn
−Zn合金めっきを析出させた後、特定の組成の処理液
を用いて化成処理を行うと、上記課題を効率的に解決で
きるとの知見に基づいてなされたのである。すなわち、
本発明は、基体上に5〜95質量%のZnを含有するS
n−Zn合金めっき皮膜を有する基体を、(1)Ti、
V、Mn、Zr、Mo、W及びSiからなる群から選ば
れる少なくとも1種の金属の塩または酸素酸塩及び(2)
無機酸イオンを含有する水溶液に接触させることを特徴
とするSn−Zn合金めっき皮膜上にクロムフリー皮膜
を形成させる方法を提供する。本発明は、又、(1)T
i、V、Mn、Zr、Mo、W及びSiからなる群から
選ばれる少なくとも1種の金属の塩または酸素酸塩及び
(2)及び無機酸イオンを含有するすることを特徴とす
る、Sn−Zn合金めっき皮膜上にクロムフリー皮膜形
成用水溶液を提供する。SUMMARY OF THE INVENTION The present invention relates to a method for forming a Sn film on a substrate.
The present invention has been made based on the finding that the above problem can be efficiently solved by performing a chemical conversion treatment using a treatment liquid having a specific composition after depositing the Zn alloy plating. That is,
The present invention relates to an S-containing substrate containing 5-95% by mass of Zn.
A substrate having an n-Zn alloy plating film was prepared by (1) Ti,
(2) a salt or oxyacid salt of at least one metal selected from the group consisting of V, Mn, Zr, Mo, W and Si;
A method for forming a chromium-free film on a Sn—Zn alloy plating film, characterized by contacting with an aqueous solution containing an inorganic acid ion. The present invention also provides (1) T
a salt or oxyacid salt of at least one metal selected from the group consisting of i, V, Mn, Zr, Mo, W and Si;
(2) An aqueous solution for forming a chromium-free film on a Sn—Zn alloy plating film, characterized by containing an inorganic acid ion.
【0003】[0003]
【発明の実施の形態】本発明で用いる基体としては、
鉄、ニッケル、銅などの各種金属、及びこれらの合金、
あるいは亜鉛置換処理を施したアルミニウムなどの金属
や合金の板状物、直方体、円柱、円筒、球状物などの種
々の形状のものがあげられる。本発明では、先ず基体上
に、常法により5〜95質量%(以下、%と略称す
る)、好ましくは5〜80%のZnを含有するSn−Z
n合金めっきを析出させる。この範囲でZnを含有する
Sn−Zn合金めっき皮膜を形成させると、最終製品に
高耐食性を付与することができるので好ましい。基体上
にSn−Zn合金めっきを析出させるには、具体的に
は、特開昭51−75632号公報などに記載の方法に
より行うのが好ましい。基体上に析出するSn−Zn合
金めっきの厚みは任意とすることができるが、1μm以
上、好ましくは5〜20μm厚とするのがよい。DESCRIPTION OF THE PREFERRED EMBODIMENTS The substrate used in the present invention includes:
Various metals such as iron, nickel and copper, and their alloys,
Alternatively, various shapes such as a plate-like material of a metal or alloy such as aluminum subjected to a zinc substitution treatment, a rectangular parallelepiped, a cylinder, a cylinder, and a sphere may be used. In the present invention, first, Sn-Z containing 5 to 95% by mass (hereinafter abbreviated as%), preferably 5 to 80% Zn, is formed on a substrate by a conventional method.
Deposit n alloy plating. It is preferable to form a Sn—Zn alloy plating film containing Zn in this range because high corrosion resistance can be imparted to the final product. To deposit the Sn—Zn alloy plating on the substrate, specifically, it is preferable to carry out the method described in JP-A-51-75632. The thickness of the Sn—Zn alloy plating deposited on the substrate can be arbitrarily set, but is preferably 1 μm or more, and more preferably 5 to 20 μm.
【0004】本発明では、このようにして基体上にSn
−Zn合金めっきを析出させた後、例えば、水洗し、
(1)Ti、V、Mn、Zr、Mo、W及びSiからなる
群から選ばれる少なくとも1種の金属の塩または酸素酸
塩及び(2)無機酸イオン、例えば、塩酸、硫酸、硝酸、
リン酸或いはこれらの塩のうち1種または2種以上含有す
る水溶液に接触、例えば、この水溶液を用いて浸漬処理
を行う。ここで(1)Ti、V、Mn、Zr、Mo、W及
びSiからなる群から選ばれる少なくとも1種の金属の
塩または酸素酸塩としては、Tiに関して、塩化チタン
や硫酸チタン等、Vに関して、バナジン酸塩等、Mnに
関して、塩化マンガン、硫酸マンガンや過マンガン酸塩
等、Zrに関してジルコン酸塩等、Moに関してモリブ
デン酸塩等、Wに関して、タングステン酸塩等、Siに
ついてはケイ酸塩やコロイダルシリカ(コロイド状酸化
ケイ素)などがあげられる。各種金属濃度としては、0.
001〜5モル/リットルであるのが好ましく、より好まし
くは、0.005〜0.5モル/リットルである。本発明におい
てこの濃度範囲で成分(1)を用いると、連続的に安定な
化成皮膜が形成でき、すぐれた耐食性が得られる。又、
無機酸イオン濃度は、水溶液中0.5〜100g/リットルで
あるのが好ましく、より好ましくは、1〜50g/リット
ルである。本発明では、上記処理液中に、更に有機酸を
含有させることができる。有機酸を含有させると、より
均一で強固なクロムフリー皮膜が生成されるので好まし
い。使用できる有機酸としては、例えば、蟻酸、酢酸、
プロピオン酸、酪酸、吉草酸、安息香酸等の炭素数1〜
10のモノカルボン酸、シュウ酸、マロン酸、マレイン
酸、コハク酸、アジピン酸、グルタル酸、フタル酸等の
炭素数2〜10のジカルボン酸、乳酸、グリコール酸、
グリセリン酸、グルコン酸、β−オキシ酪酸、サリチル
酸等の炭素数3〜10のオキシモノカルボン酸等が特に
効果が高いので好ましい。[0004] In the present invention, Sn on the substrate in this way
-After depositing Zn alloy plating, for example, washed with water,
(1) a salt or oxyacid salt of at least one metal selected from the group consisting of Ti, V, Mn, Zr, Mo, W and Si; and (2) inorganic acid ions, for example, hydrochloric acid, sulfuric acid, nitric acid,
Contact with an aqueous solution containing one or more of phosphoric acid and salts thereof, for example, immersion treatment using this aqueous solution. Here, (1) As a salt or oxyacid salt of at least one metal selected from the group consisting of Ti, V, Mn, Zr, Mo, W and Si, with respect to Ti, titanium chloride, titanium sulfate, etc. , Manganese chloride, manganese sulfate, permanganate, etc. for Zr, zirconate, etc. for Zr, molybdate, etc. for Mo, tungstate, etc. for W, silicate for Si, etc. Colloidal silica (colloidal silicon oxide) and the like. For various metal concentrations, 0.
It is preferably from 001 to 5 mol / l, more preferably from 0.005 to 0.5 mol / l. When the component (1) is used in this concentration range in the present invention, a stable chemical conversion film can be continuously formed, and excellent corrosion resistance can be obtained. or,
The inorganic acid ion concentration in the aqueous solution is preferably 0.5 to 100 g / liter, more preferably 1 to 50 g / liter. In the present invention, the treatment liquid may further contain an organic acid. It is preferable to include an organic acid because a more uniform and strong chromium-free film is generated. Examples of usable organic acids include, for example, formic acid, acetic acid,
1 to 1 carbon atoms such as propionic acid, butyric acid, valeric acid and benzoic acid
10 monocarboxylic acids, oxalic acid, malonic acid, maleic acid, succinic acid, adipic acid, glutaric acid, dicarboxylic acids having 2 to 10 carbon atoms such as phthalic acid, lactic acid, glycolic acid,
Oxymonocarboxylic acids having 3 to 10 carbon atoms, such as glyceric acid, gluconic acid, β-oxybutyric acid, and salicylic acid, are particularly preferred because of their high effects.
【0005】上記有機酸の他に、クエン酸、酒石酸、リ
ンゴ酸等のオキシ多価カルボン酸、トリカルバリル酸等
の多価カルボン酸も有効である。ここで、有機酸として
は前記の酸、あるいはそれらの塩(例えばナトリウム、
カリウム、アンモニウム等の塩)の一種または二種以上
を使用することができ、有機酸あるいはそれらの塩を合
計1〜100g/リットル含有させるのが好ましく、よ
り好ましくは5〜80g/リットルである。なお、化成
処理液のpHを0.5〜7.0にするのが好ましい。この範囲
にpHを調整するために、前記無機酸及び/又は有機酸
を用いてもよく、又水酸化アルカリ、アンモニア水など
のアルカリ剤を用いてもよい。本発明で用いる化成処理
液における上記必須成分の残分は水であるが、メチルア
ミン、エチレンジアミン、ジエチレントリアミン等のア
ミン類等を加えることができる。In addition to the above organic acids, oxypolycarboxylic acids such as citric acid, tartaric acid and malic acid, and polycarboxylic acids such as tricarballylic acid are also effective. Here, as the organic acid, the above-mentioned acids or salts thereof (eg, sodium,
One or two or more kinds of salts such as potassium and ammonium) can be used, and the organic acid or a salt thereof is preferably contained in a total amount of 1 to 100 g / l, more preferably 5 to 80 g / l. It is preferable that the pH of the chemical conversion treatment liquid is 0.5 to 7.0. In order to adjust the pH to this range, the above-mentioned inorganic acid and / or organic acid may be used, or an alkali agent such as alkali hydroxide or aqueous ammonia may be used. The remainder of the essential components in the chemical conversion treatment solution used in the present invention is water, and amines such as methylamine, ethylenediamine, diethylenetriamine and the like can be added.
【0006】本発明のSn−Zn合金めっきクロムフリ
ー皮膜形成のための処理方法としては、上記水溶液に合
金めっき物を浸漬するのが一般的である。例えば10〜50
℃の液温で5〜600秒浸漬するのが好ましく、より好まし
くは15〜120秒浸漬し、例えば、厚さ0.01〜3μm、好ま
しくは0.05〜1μmのクロムフリー皮膜を形成させるの
が良い。なお、亜鉛めっきではクロメート皮膜の光沢を
増すために、通常、クロメート処理前に被処理物を希硝
酸溶液に浸漬させることが行われるが、本発明ではこの
ような前処理を用いなくともよい。上記以外の条件や処
理操作は、従来のクロメート処理方法に準じて行うこと
ができる。[0006] As a treatment method for forming a chromium-free coating of the Sn-Zn alloy plating according to the present invention, it is general to immerse the alloy plating in the above aqueous solution. For example, 10 to 50
It is preferable to soak at a liquid temperature of 5 ° C. for 5 to 600 seconds, more preferably for 15 to 120 seconds, for example, to form a chromium-free film having a thickness of 0.01 to 3 μm, preferably 0.05 to 1 μm. In addition, in zinc plating, in order to increase the luster of the chromate film, the object to be treated is usually immersed in a dilute nitric acid solution before the chromate treatment. However, in the present invention, such a pretreatment may not be used. Conditions and processing operations other than those described above can be performed according to a conventional chromate treatment method.
【0007】また、本発明のクロムフリー皮膜上にオー
バーコート処理を施すことにより、更に耐食性を向上さ
せることが出来、より耐食性を持たせるには、大変有効
な手段である。例えば、まず、Sn−Zn合金めっき上
に上記クロメートフリー化成皮膜処理を行い、水洗後オ
ーバーコート処理液に浸漬、乾燥するする。また、クロ
メートフリー化成皮膜処理乾燥後、新たにオーバーコー
ト処理液に浸漬、乾燥することも出来る。ここで、オー
バーコートとは、珪酸塩、リン酸塩等の無機皮膜は勿論
の事、ポリエチレン、ポリ塩化ビニル、ポリスチレン、
ポリプロピレン、メタクリル樹脂、ポリカーボネート、
ポリアミド、ポリアセタール、フッ素樹脂、尿素樹脂、
フェノール樹脂、不飽和ポリエステル樹脂、ポリウレタ
ン、アルキド樹脂、エポキシ樹脂、メラミン樹脂等の有
機皮膜も有効である。このようなオーバーコートを施す
ためのオーバーコート処理液としては、例えば、ディッ
プソール(株)製のディップコートWなどを用いること
ができる。オーバーコート皮膜の厚みは任意とすること
ができるが、0.1〜20μmとするのがよい。Further, by performing an overcoating treatment on the chromium-free film of the present invention, the corrosion resistance can be further improved, and this is a very effective means for imparting more corrosion resistance. For example, first, the above-mentioned chromate-free conversion coating treatment is performed on the Sn-Zn alloy plating, washed with water, immersed in an overcoat treatment liquid, and dried. Further, after the chromate-free chemical conversion coating treatment and drying, it can be newly immersed in an overcoat treatment solution and dried. Here, the overcoat means not only inorganic films such as silicates and phosphates, but also polyethylene, polyvinyl chloride, polystyrene,
Polypropylene, methacrylic resin, polycarbonate,
Polyamide, polyacetal, fluororesin, urea resin,
Organic films such as phenolic resins, unsaturated polyester resins, polyurethanes, alkyd resins, epoxy resins, and melamine resins are also effective. As an overcoat treatment solution for applying such an overcoat, for example, Dipcoat W manufactured by Dipsol Corporation can be used. The thickness of the overcoat film can be arbitrarily set, but is preferably 0.1 to 20 μm.
【0008】[0008]
【発明の効果】本発明によれば、Sn−Zn合金めっき
上に直接クロムフリー化成皮膜を生成することができ
る。この方法により得られためっき物は、Sn−Zn合
金めっき自体の耐食性に加え、更にクロムフリー化成皮
膜のもつ優れた耐食性を合わせもつ。従って、Sn−Z
n合金めっき上に直接クロムフリー化成処理より得られ
る皮膜は、耐食性、耐塩水性及び耐熱性が従来の六価ク
ロメートと同等で、また、Sn−Zn合金めっきのもつ
延展性のために曲げ加工にも強いために、今後いろいろ
な分野で幅広く利用されることが期待できる。次に、実
施例および比較例を示して本発明を説明する。According to the present invention, a chromium-free chemical conversion film can be formed directly on Sn-Zn alloy plating. The plated material obtained by this method has the excellent corrosion resistance of the chromium-free chemical conversion film in addition to the corrosion resistance of the Sn—Zn alloy plating itself. Therefore, Sn-Z
The film obtained by direct chromium-free conversion treatment on the n-alloy plating has the same corrosion resistance, salt water resistance and heat resistance as the conventional hexavalent chromate, and can be bent due to the spreadability of the Sn-Zn alloy plating. Is expected to be widely used in various fields in the future. Next, the present invention will be described with reference to examples and comparative examples.
【0009】[0009]
【実施例】実施例1 鋼板にZn含有量を変えたSn−Zn合金めっきを厚さ
8μmに施したものを、表1に示す化成処理液に浸漬し
た(浴温:25℃−処理時間:30秒)。EXAMPLE 1 A steel sheet coated with a Sn—Zn alloy having a different Zn content to a thickness of 8 μm was immersed in a chemical conversion treatment solution shown in Table 1 (bath temperature: 25 ° C.—treatment time: 30 seconds).
【表1】 表1 表中、Ti、V、Mn、Mo及びSiは、それぞれTi
Cl3、NH4VO3、KMnO4、(NH4)6M07O24・
4H2O、Na2SiO3として添加した。又、Cl-及び
SO4 2-は、それぞれTiCl3、HCl、NaCl、H
2SO4、Na2SO4として添加した。又、残部は水であ
る。[Table 1] Table 1 In the table, Ti, V, Mn, Mo and Si are each Ti
Cl 3 , NH 4 VO 3 , KMnO 4 , (NH 4 ) 6 M 07 O 24.
4H 2 O, added as Na 2 SiO 3 . Also, Cl - and SO 4 2-respectively TiCl 3, HCl, NaCl, H
2 SO 4 and Na 2 SO 4 were added. The balance is water.
【0010】実施例2 実施例1No3のTi化成皮膜処理後、オーバーコート
処理を行った。オーバーコート処理条件を表2に示す。Example 2 Example 1 After the No. 3 Ti chemical conversion coating treatment, an overcoat treatment was performed. Table 2 shows the overcoat treatment conditions.
【表2】 表2 [Table 2] Table 2
【0011】比較例1 比較例として鋼板に8μmSn−Zn合金めっきを施し
たものに六価クロメート処理を行った。六価クロメート
はディップソール(株)製SZ−248S(50ml/l)を
使用した。実施例1、2及び比較例で得られたSn−Z
n合金めっきの外観及び塩水噴霧試験(JIS−Z−2
371)結果をまとめて表3に示す。表3に示されるよ
うに、実施例1No1〜14の皮膜の場合でも比較例N
o1〜3の従来クロメート皮膜と比較し同等の耐食性が
得られた。また、実施例2でオーバーコート処理した皮
膜は、従来のクロメートより良い耐食性結果が得られ
た。Comparative Example 1 As a comparative example, a steel sheet plated with 8 μm Sn—Zn alloy was subjected to hexavalent chromate treatment. The hexavalent chromate used was SZ-248S (50 ml / l) manufactured by Dipsol Corporation. Sn-Z obtained in Examples 1 and 2 and Comparative Example
Appearance of n alloy plating and salt spray test (JIS-Z-2
371) The results are summarized in Table 3. As shown in Table 3, even in the case of the coatings of Examples 1 No. 1 to 14, Comparative Example N
As compared with the conventional chromate films of Nos. o1 to o3, the same corrosion resistance was obtained. Further, the film overcoated in Example 2 had better corrosion resistance results than the conventional chromate.
【0012】[0012]
【表3】 表3 塩水噴霧試験結果(JIS−Z−2371)[Table 3] Table 3 Salt spray test results (JIS-Z-2371)
───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4K026 AA02 AA12 AA22 BA01 BA02 BA03 CA13 CA14 CA18 CA23 CA26 CA27 CA29 CA30 CA31 CA32 CA33 CA34 CA38 CA41 EB02 EB08 4K044 AA02 AB02 BA10 BA11 BA14 BA17 BA21 BB03 BB04 CA16 CA18 CA53 ────────────────────────────────────────────────── ─── Continued on front page F term (reference) 4K026 AA02 AA12 AA22 BA01 BA02 BA03 CA13 CA14 CA18 CA23 CA26 CA27 CA29 CA30 CA31 CA32 CA33 CA34 CA38 CA41 EB02 EB08 4K044 AA02 AB02 BA10 BA11 BA14 BA17 BA21 BB03 BB04 CA16 CA53
Claims (5)
るSn−Zn合金めっき皮膜を有する基体を、(1)T
i、V、Mn、Zr、Mo、W及びSiからなる群から
選ばれる少なくとも1種の金属の塩または酸素酸塩及び
(2)無機酸イオンを含有する水溶液に接触させることを
特徴とするSn−Zn合金めっき皮膜上にクロムフリー
皮膜を形成させる方法。1. A substrate having a Sn—Zn alloy plating film containing 5 to 95% by mass of Zn on a substrate is prepared by using (1) T
a salt or oxyacid salt of at least one metal selected from the group consisting of i, V, Mn, Zr, Mo, W and Si;
(2) A method of forming a chromium-free film on a Sn—Zn alloy plating film, which is brought into contact with an aqueous solution containing inorganic acid ions.
o、Wの塩または酸素酸塩である請求項1記載の方法。2. The component (1) is composed of Ti, V, Mn, Zr, M
The method according to claim 1, which is a salt or an oxyacid salt of o, W.
項1又は2記載の方法。3. The method according to claim 1, wherein the aqueous solution further contains an organic acid.
ーバーコート処理を施す請求項1〜3のいずれか1項記
載の方法。4. The method according to claim 1, wherein the obtained chromium-free film is further overcoated.
びSiからなる群から選ばれる少なくとも1種の金属の
塩または酸素酸塩及び(2)及び無機酸イオンを含有する
ことを特徴とする、Sn−Zn合金めっき皮膜上にクロ
ムフリー皮膜形成用水溶液。5. It contains (1) a salt or oxyacid salt of at least one metal selected from the group consisting of Ti, V, Mn, Zr, Mo, W and Si, (2) and an inorganic acid ion. An aqueous solution for forming a chromium-free film on a Sn-Zn alloy plating film.
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