JP2002046055A - Polishing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effect high-precision polishing by always applying the polishing load of a polisher in a normal direction to the polished surface of a workpiece, and stably imposing a predetermined polishing load. SOLUTION: This polishing apparatus includes a workpiece drive 22 for rotating the workpiece 2 about a C-axis 41 serving as its axis of rotation; a Z-axis mechanism portion 8 for moving the workpiece 2 in the direction of Z-axis (B-axis) which is the direction of the axis of rotation; an X-axis mechanism portion 7 for moving the workpiece 2 in the direction of X-axis (A-axis) perpendicular to the Z-axis; a θ-axis mechanism portion 6 for tilting the workpiece 2 about a Y-axis 5 perpendicular to the X-axis and the Z-axis; and a control means for controlling the Z-axis mechanism portion 8, the X-axis mechanism portion 7 and the θ-axis mechanism portion 6 so that the point of contact between the workpiece 2 and the polisher 39 is always located on or near the Y-axis 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing a surface of a lens or a lens forming mold with high precision, and more particularly to a polishing apparatus for polishing a rotationally symmetric curved surface, that is, a so-called aspherical optical curved surface. Related to the device.

[0002]

2. Description of the Related Art Conventionally, a technique (prior art 1) disclosed in Japanese Patent Application Laid-Open No. 62-114866 is disclosed as a processing apparatus for polishing a work having a rotationally symmetric curved surface (so-called aspherical surface). FIG. 6 (a) shows this prior art 1.
This will be described with reference to FIG.

In this processing apparatus, as shown in FIG. 6A, a workpiece 51 is moved on a rotary table 53 mounted on an X-axis mechanism 52 which can be moved and positioned in a horizontal direction (X-axis direction). Is fixed to the work chuck 54.
Therefore, the work 51 can be moved in the horizontal direction by the X-axis mechanism 52 and can be rotated around the rotation axis of the rotary table 53.

A tool 55 for polishing the work 51 is attached to a tip of a spindle 56 located above the work 51 and is rotatable.

[0005] The spindle 56 has a horizontal axis (θ-axis) orthogonal to the X-axis direction by a θ-axis mechanism 58 movable vertically in the Z-axis direction (Z-axis direction) orthogonal to the X-axis direction by a Z-axis mechanism 57. 6B, the rotation of the spindle 56 can be tilted so that the axis of the spindle 56 coincides with the normal direction at the X and Z points on the surface of the work 51, as shown in FIG. The spindle 56 is supported by a slider 60 mounted on an R-axis mechanism 59 on one end surface of the θ-axis mechanism 58 so that the spindle 56 can move in the direction.

A compression spring 61 is interposed between the slider 60 and the spindle 56 to apply a spring force in the axial direction of the tool 55 so that the pressure at which the tool 55 contacts the workpiece 51 can be adjusted. ing.

The θ-axis mechanism 58 is provided with a balancer 62 for balancing its rotation.
The shaft mechanism 58 includes a guide surface 63 of the balancer 62 and the roller 6.
4 and driven by a rotary encoder 65 to detect the rotational position.

According to the processing apparatus having the above structure, the surface of the work 61 can be polished while pressing the tool 55 in the normal direction of the work 61.

Further, as a polishing apparatus, Japanese Patent Laid-Open No. 8-141 is disclosed.
No. 899 (Prior Art 2) is disclosed.
This prior art 2 will be described with reference to FIG.

In FIG. 7, a polishing head 71 of a polishing apparatus is used.
Is for polishing the polished surface P while being moved along the surface of the work R, and includes a load generating section 72, a load detecting section 73, a tool rotation drive section 74, and a polishing tool 75. Further, when the attitude of the polishing head 71 is controlled in the normal direction H of the surface of the workpiece R, the polishing head 71 has an angle detection unit 76 that detects an inclination angle θ between the polishing head 71 and the vertical direction.

The load generating section 72 of the polishing head 71 is controlled by a load control section 77 based on the detection results of the load detecting section 73 and the angle detecting section 76, and makes contact between the polishing tool 75 and the polishing surface P of the workpiece R. The pressure is kept constant. Also,
The tool rotation drive unit 74 is operated by the tool rotation control unit 78. Then, the polishing head 71 is moved by the polishing head support swinging mechanism 79 substantially following the polishing surface P of the work R.

The load controller 77 and the tool rotation controller 78
The polishing head support swinging mechanism 79 is controlled by a main controller 81 to which an operation instruction and various set values are input by an input device 80.

According to the polishing apparatus having the above-described configuration, during polishing, the polishing head 71 moves along the surface of the work R while controlling the attitude in the direction normal to the polishing surface P. At this time, the polishing load is applied by the load generating section 72, but the polishing load is decomposed into components in a normal direction and a direction perpendicular to the normal direction at the polishing processing point so that a constant load is always applied. The polishing is performed while the load control unit 77 performs feedback control of the polishing load.

[0014]

However, the prior arts 1 and 2 have the following problems. In the prior art 1, when the slider 60 moves up and down, sliding resistance occurs at the sliding portion. Therefore, when a low load is applied to the work 51, the above-described sliding resistance causes
The slider 60, that is, the tool 5 with respect to the surface of the workpiece 51
There was a problem that the followability in the normal direction of No. 5 became unstable.

Further, in the prior art 2, there is a problem that the followability of the feedback control of the polishing load, the configuration of the angle detecting section 76 and the like are required, and the polishing apparatus becomes complicated and expensive.

The present invention has been made in view of the above-mentioned problems of the prior art, and always applies a polishing load of a polisher to a polishing surface of a work in a normal direction while stably applying a predetermined polishing load. It is another object of the present invention to provide a polishing apparatus capable of performing polishing with high accuracy.

[0017]

In order to solve the above-mentioned problems, a polishing apparatus according to a first aspect of the present invention is a polishing apparatus for polishing a work surface of a work to a spherical surface symmetrical with a rotational axis by a polisher. Rotating means for rotating around a rotation axis, a Z-axis mechanism for moving the work in the Z-axis direction which is the direction of the rotation axis, and an X-axis for moving the work in the X-axis direction orthogonal to the Z-axis A mechanical unit, a θ-axis mechanical unit that tilts the work about a Y axis orthogonal to the X axis and the Z axis, and a contact point between the work and the polisher when the work is polished. Control means for controlling the Z-axis mechanism, the X-axis mechanism, and the θ-axis mechanism so as to always be positioned on or near the Y-axis.

Further, the polishing apparatus according to the second invention is characterized in that
In the polishing apparatus according to the present invention, the control means controls the Z-axis mechanism so that the polishing load applied to the workpiece by the polisher coincides with or substantially coincides with the normal direction of the work surface of the workpiece.
It is characterized in that the shaft mechanism and the θ-axis mechanism are controlled.

Further, a polishing apparatus according to a third invention is characterized in that, in the polishing apparatus according to the first or second invention, the polisher swings while the work is being polished.

In other words, in the polishing apparatus according to the first aspect of the present invention, when the polishing is performed by contacting the polished surface with the work surface of the workpiece, the contact point (polishing point) between the polished surface and the processed surface of the work. The control means controls the Z-axis mechanism section, the X-axis mechanism section and the θ-axis mechanism section so as to always be positioned on or near the Y-axis, which is the pivot axis of the θ-axis mechanism section, and presses the polisher in the pressing direction. However, the workpiece is polished with high precision by rotating the workpiece, rotating the polisher and applying pressure by the polisher so that the workpiece is oriented in the normal direction of the workpiece processing surface at the contact point.

Further, in the polishing apparatus according to the second invention, the pressing direction of the polisher in contact with the work surface of the workpiece is
By always pointing in the normal direction of the processing surface, the dispersion of the polishing load of the polisher at the contact point (polishing point) is eliminated, the processing surface of the work can be polished with a constant pressure, and high-precision polishing can be performed. Become like

Further, in the polishing apparatus according to the third aspect of the present invention, the polisher is swung during the polishing of the work to polish the processing surface of the rotating work over a wide range.

[0023]

(Embodiment 1) Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the entire polishing apparatus, FIG. 2 is an explanatory view of an operation of a polisher at a central portion of a work, and FIG.

In FIG. 1, a polishing apparatus is provided on a polishing apparatus base (hereinafter, simply referred to as a base) 1 and performs a predetermined movement to be described later on a workpiece (hereinafter, referred to as a work) 2. A workpiece driving unit 3 for polishing, a polishing tool unit 35 for polishing a processing surface (upper surface) 2a of the work 2 into a rotationally symmetric curved surface, and a polishing tool unit 35 disposed on the base 1 and And a polisher driving unit 4 for supporting and moving the polishing tool unit 35 in three axes (X, Y, Z axes).

Hereinafter, the workpiece drive unit 3 will be described with reference to FIG. In FIG. 1, a workpiece drive unit 3 includes a Z-axis mechanism unit 8 for reciprocating the work 2 in a direction of its rotation axis (C-axis) 41 (the direction of the arrow A in FIG. 1) and a C-axis 41. X-axis mechanism unit 7 for reciprocating in a direction orthogonal to and perpendicular to the direction (arrow B-axis direction in FIG. 1), and turning (swinging) work 2 around Y-axis 5 in FIG. 1 orthogonal to A-axis and B-axis. Θ)
And a shaft mechanism 6.

Here, when the workpiece drive unit 3 is in the basic posture shown in FIG. 1, the A-axis direction and the Z-axis direction are parallel,
The B-axis direction and the X-axis direction are parallel.

Next, the details of the θ axis mechanism 6 will be described. The θ-axis mechanism unit 6 is attached to a side surface (front surface) of a base 10 erected on the base 1 so as to be rotatable around a rotation axis (Y axis) 5. The θ-axis mechanism unit 6 is a rotary encoder 11 with a built-in motor, and is positioned at a predetermined angle by a control signal from a controller as a control unit.

Next, the X-axis mechanism 7 will be described in detail. The X-axis mechanism 7 is a side (front) of the θ-axis mechanism 6.
, And can be turned around the Y-axis 5 by the θ-axis mechanism 6.

More specifically, two planes parallel to the B-axis direction (X-axis direction in the basic posture shown in FIG. 1) are provided on the front surface of the θ-axis mechanism 6.
X-axis base plate 13 having book guide rails 12
Has been fixed.

On the front surface of the X-axis base plate 13, an X-axis table 14 is mounted so as to be reciprocally movable in the direction of the arrow B, guided by two guide rails 12, 12. Each guide rail 1 is located between the two guide rails 12 and 12.
A ball screw 15 is rotatably journaled in parallel with 2 and 12.

The ball screw 15 is connected to the X-axis table 14
Screwed into a ball nut (not shown) provided on the rear surface of
One end is connected to the output shaft of the motor 16 attached to the X-axis base plate 13. When the ball screw 15 rotates forward and backward by driving the motor 16, the X-axis table 14 reciprocates in the direction of the arrow B and is positioned at a predetermined position.

Next, the Z-axis mechanism 8 will be described in detail. The Z-axis mechanism 8 is attached to the front surface of the X-axis mechanism 7, and is rotatable around the Y-axis 5 by the θ-axis mechanism 6 via the X-axis mechanism 7.

More specifically, the front surface of the X-axis table 14 of the X-axis mechanism section 7 is placed in the A-axis direction (Z direction in the basic posture shown in FIG. 1).
A Z-axis base plate 18 having two guide rails 17, 17 parallel to (axial direction) is fixed.

On the front surface of the Z-axis base plate 18, a Z-axis table 19 is mounted so as to be reciprocally movable in the direction of the arrow A by being guided by two guide rails 17, 17. Each guide rail 1 is located between the two guide rails 17.
A ball screw 20 is rotatably supported in parallel with 7, 17.

The ball screw 20 is screwed into a ball nut (not shown) provided on the rear surface of the Z-axis table 19, and one end thereof is connected to the output shaft of a motor 21 mounted on the Z-axis base plate 18. When the ball screw 20 rotates forward and backward by driving the motor 21, the Z-axis table 19 reciprocates in the direction of the arrow A and is positioned at a predetermined position.

An L-shaped spindle mounting plate 23 is fixed on the front surface of the Z-axis table 19. A work drive unit 22 as a rotating means is attached to a portion of the spindle mounting plate 23 protruding in the Y-axis direction. The work drive unit 22 is rotated by the θ-axis mechanism unit 6 around the Y-axis 5 via the Z-axis mechanism unit 8. Can be turned.

Specifically, a work spindle 9 is attached to a portion of the spindle mounting plate 23 projecting in the Y-axis direction in parallel with the A-axis direction (Z-axis direction in the basic posture shown in FIG. 1). I have.

The work spindle 9 has a work holder 24 rotating about a C axis 41 which is the center axis thereof.
Are rotatably held. A motor 25 is connected below the work spindle 9, and the work holder 24 is rotated by the motor 25.

The work holder 24 is configured such that the work 2 with the processing surface 2a facing upward can be attached and detached by a holding chuck (not shown) which can be freely opened and closed.

Next, the polisher driving section 4 will be described in detail. The polisher driving unit 4 is attached to a side surface (front surface) of an L-shaped column 26 erected on the base 1.

More specifically, a Y-axis polisher adjuster 27 (Y-axis drive unit), which is a stage whose position can be adjusted in the Y-axis direction by a micro head (not shown), is fixed to the front surface of the column 26. On the front surface of the Y-axis polisher adjuster 27, an X-axis polisher adjuster 28 (X), which is a stage whose position can be adjusted in the X-axis direction by a micro head (not shown), is provided.
Shaft drive) is fixed.

Further, on the front surface of the X-axis polisher adjuster 28, an air slider 29 having a slider portion 29A movable in the Z-axis direction at a predetermined pressure by controlling the differential pressure of the air pressure.
(Pressure drive unit) is fixed. This slider portion 29
In A, air is sent from hoses 30 and 31 connected to a pneumatic control device (not shown), and a vertical pressure (Z-axis direction), that is, a polisher 39 described later is applied to the processing surface 2a of the workpiece 2 by the pressure difference. Small movement in the direction of pressure,
A predetermined pressure is applied to the processing surface 2a of the work 2.

A mounting block 32 is fixed to the front surface of the air slider 29, and a bar-shaped support member 33 extends downward (Z-axis direction) from the lower surface of the mounting block 32. On the lower side surface of the support member 33, a polisher support member 34 bent in a U-shape is fixed so that the tip of the polisher protrudes forward in the upper position of the work 2.

The polisher supporting member 34 moves the polishing tool unit 35 by α (preferably 30 °) with respect to the Y axis 5.
(Up to 60 °). The polishing tool unit 35 includes a rotary motor 36 held by a polisher support member 34, a polisher spindle 37 attached to a tip of the motor 36, a polisher shaft 38 removably attached to the polisher spindle 37, and a polisher shaft 38. And a spherical polisher 39 fixed to the distal end of the shaft 38.

The polisher 39 is made of a material having elasticity (polyurethane is used in the present embodiment), and can be rotated at a predetermined rotational speed by a motor 36 via a polisher spindle 37 and a polisher shaft 38. I have.

The pressure direction axis (T axis) of the support member 33
Numeral 40 is parallel to the Z-axis, substantially coincides with the rotation center axis (C-axis) 41 of the work spindle 9 (coincident in the present embodiment), and coincides with the center of the polisher 39. I have.

The θ-axis mechanism section 6, X-axis mechanism section 7, Z-axis mechanism section 8, and polisher driving section 4 are linearly or circularly interpolated by an NC program or the like by a controller (not shown). Can be controlled simultaneously.

Next, a method of polishing a workpiece using the polishing apparatus having the above-described configuration will be described with reference to FIGS. 1 and 2, first, the work 2 held by the work holder 24
Is moved in the direction of the arrow B (X-axis) by the X-axis mechanism 7, and stopped when the processing surface 2a faces the polisher 39. And the center of the polisher 39 is
1 is adjusted by the micro heads of the Y-axis polisher adjuster 27 and the X-axis polisher adjuster 28 so as to coincide with the rotation center axis of the C axis 41 in FIG.

On the other hand, the shape data of the processing surface 2a of the work 2 is input to the controller, and an NC program is created.
This NC program sets the contact point O between the polisher 39 and the work 2 as the turning center of the θ-axis mechanism unit 6 (that is, sets the contact point O on the Y axis 5), and based on each coordinate data, Also in the peripheral polishing operation, the contact point O becomes the turning center of the θ-axis mechanism unit 6 as shown in FIG.
It is created so that the X-axis mechanism 7 and the Z-axis mechanism 8 are controlled simultaneously.

Accordingly, it is possible to always apply the pressure action (polishing load) of the polisher 39 in the normal direction of the processing surface 2a of the work 2.

The pressure applied to the polisher 39 during the polishing process is supplied from the hoses 30 and 31 to the air slider 29, respectively.
Of the air supplied to the slider portion 29A.

When polishing the work 2, first,
The work 2 is moved in the direction of the arrow B (X-axis) by the X-axis mechanism 7 and then the polisher 39 is brought into contact with the polishing start point of the work 2 (the position shown in FIG. 3). Is turned around the Y-axis 5 by the θ-axis mechanism unit 6. At this time, the T axis 40 is oriented in the normal direction of the processing surface 2a of the work 2.

Next, the work 2 is raised by the Z-axis mechanism 8 in the direction of the arrow A-axis (Z-axis),
The motor is stopped in a state where a approaches the polisher 39. Thereafter, the polisher 39 is rotated by the motor 36, and the work 2 is rotated by the motor 25 about the C axis 41.

Then, the polisher 39 is moved to the air slider 2.
The workpiece 9 is pressurized downward by 9 and brought into contact with the processing surface 2a of the work 2 at a predetermined polishing pressure. Then, the work surface 2 of the work 2
Then, a is polished by scanning a with an NC program (a program controlled by X, Z coordinates and θ values shown in FIG. 3) adjusted to a predetermined spherical shape.

According to the present embodiment, the polisher 39 can always act on the entire surface of the work surface 2a of the work 2 in the normal direction of the work surface 2a of the work 2, and the polishing pressure can be reduced by the normal line. Since it acts in the direction at a constant value, there is no dispersion of the polishing pressure depending on the polishing position, and a stable polishing amount can be obtained, so that highly accurate polishing can be performed.

Also, as for the structure of the polishing apparatus, since each of the mechanical units (the workpiece driving unit 3 and the polisher driving unit 4) can be simplified, it is possible to provide a polishing apparatus that can be manufactured at low cost.

(Embodiment 2) Embodiment 2 of the present invention will be described with reference to FIG. FIG. 4 is a side view showing the polishing apparatus. In the present embodiment, the workpiece driving unit and the polisher driving unit are arranged in the same manner as in the first embodiment. FIG. 4 shows the polishing apparatus of the present embodiment in which the polisher driving unit 4 is moved from the X-axis direction in FIG. It is the figure you saw.

In the polishing apparatus according to the present embodiment, the shape of the polisher 39 in the polisher driving section 4 is a disc shape, and the outer peripheral portion 39a of the disc has the processing surface 2a of the workpiece 2.
Embodiment 1 is only configured to polish
Is different. Therefore, only the portions different from the first embodiment will be described, and the same members as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

In FIG. 4, the polishing tool unit 35 is supported by a polisher support member 34 in parallel with the Y axis 5. The polisher 39 of the polishing tool unit 35 has a disk shape, and is parallel to the Y axis 5 (see FIG. 1) via a polisher shaft 38 fixed to the center of the disk.
7.

The polisher 29 has a pressure direction axis (T axis) orthogonal to the Y axis 5 so that the disk-shaped outer peripheral portion 39a polishes the processing surface 2a of the work 2 in the polishing process.
The rotation motor 36 is disposed in parallel with the axis 40 and on the T axis 40 and held by the polisher support member 34.
Polisher spindle 37 and polisher shaft 38
And rotated in parallel with the X-axis direction (see FIG. 1). The polisher support member 34 is mounted on a mounting block 32 fixed to the air slider 29 via a rod-shaped support member 33. Other configurations are the same as those of the first embodiment.

Next, a method of polishing a workpiece using the polishing apparatus having the above-described configuration will be described. The polishing method using the polishing apparatus according to the present embodiment is the same as the polishing method according to the first embodiment except that the processing surface 2 a of the work 2 is processed by the outer peripheral portion 39 a of the disc-shaped polisher 39.
Since it is the same as that of the polishing apparatus described above, the description thereof will be omitted.

According to the present embodiment, similarly to the first embodiment, the polisher 39 can always act in the normal direction of the processing surface 2a of the work 2, and the polishing pressure also decreases in the normal direction. Since it is operated at a constant value, there is no dispersion of the polishing pressure depending on the polishing position, and a stable polishing amount can be obtained, so that highly accurate polishing can be performed.

Since the shape of the polisher 39 is disk-shaped and the outer peripheral portion 39a is a polishing surface, the peripheral speed of the polisher 39 can be increased, and efficient polishing can be performed.

In the present embodiment, the rotation direction of the polisher 39 is configured to be parallel to the X-axis direction. However, the rotation direction of the polisher 39 may be configured to be parallel to the Y-axis direction. . In this case, it can be implemented by fixing the polisher support member 34 to the support member 33 while rotating the polisher support member 90 by 90 degrees in the horizontal direction from the state of FIG.

(Embodiment 3) Embodiment 3 of the present invention will be described with reference to FIG. FIG. 5 is a side view showing the polishing apparatus. In this embodiment, the workpiece drive unit and the polisher drive unit are arranged in the same manner as in the first embodiment. FIG. 5 shows the polishing apparatus of the present embodiment in which the polisher drive unit 4 is moved from the X-axis direction in FIG. It is the figure you saw.

The polishing apparatus according to the present embodiment is configured such that the shape of the polisher 39 in the polisher driving section 4 is cylindrical and the processing surface 2a of the work 2 is polished on the end face side of the cylinder. Is different from the first embodiment. Therefore, only the portions different from the first embodiment will be described, and the same members as those in the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

In FIG. 5, the polishing tool unit 35 is supported by a support member 33 in parallel with a pressure direction axis (T axis) 40. The polisher 39 of the polishing tool unit 35 has a cylindrical shape, and is held by a polisher spindle 37 via a polisher shaft 38 fixed to the center of the end surface of the cylinder. The polisher spindle 37 is attached to the tip of a rotary motor 36 held by a rod-shaped support member 33 attached to an attachment block 32 fixed to the air slider 29.

The polisher 39 has a sheet-like elastic member (a polyurethane sheet is used in this embodiment) 42 attached to the opposite end face to which the polisher shaft 38 is fixed. The surface 2a is a polishing action surface.

The support member 33, the motor 36, the polisher spindle 37, the polisher shaft 38, and the polisher 39 are linearly arranged on the T axis 40 with the elastic member 42 of the polisher 39 on the lower side. The polishing pressure acts directly on the polisher shaft 38 and the polisher 39 via the air slider 29 and the support member 33 in a downward direction so that the workpiece 42 comes into contact with the processing surface 2 a of the work 2. Other configurations are the same as those of the first embodiment.

Next, a method of polishing a workpiece using the polishing apparatus having the above-described configuration will be described. The polishing method by the polishing apparatus of the present embodiment is the same as that of the polishing apparatus of the first embodiment except that the processing surface 2a of the work 2 is processed by the elastic member 42 attached to the end surface of the cylindrical polisher 39. Therefore, the description is omitted.

According to the present embodiment, similarly to the first embodiment, the polisher 39 can always act in the normal direction of the processing surface 2a of the work 2, and the polishing pressure also decreases in the normal direction. Since it is operated at a constant value, there is no dispersion of the polishing pressure depending on the polishing position, and a stable polishing amount can be obtained, so that highly accurate polishing can be performed.

Further, since the shape of the polisher 39 is cylindrical, and the elastic member 42 attached to the end face thereof is used as a polishing surface, the area of the polisher 39 that is in sliding contact with the processing surface 2a of the work 2 can be increased. In addition, efficient polishing can be performed.

Although the first to third embodiments have been described above, in actual polishing, by using a polishing method based on a combination of these embodiments, it is possible to improve the efficiency of polishing and improve the accuracy of polishing. Becomes possible.

The technical idea having the following configuration is derived from the above specific embodiment. (Supplementary note) (1) In the polishing of the rotational axis symmetric curved surface, the work
Rotating means for rotating around an axis, and X, Z, θ of the work
Control means for controlling the axis, the point of contact between the polisher and the work is on the Y axis which is the rotation center line of the θ axis,
Or a polishing apparatus characterized by being in the vicinity thereof.

(2) The control means for controlling the X, Z, and θ axes of the work makes the direction of the polishing load applied to the work by the polisher coincide with or substantially coincides with the normal direction of the work at the polishing point. The polishing apparatus according to (1), wherein:

(3) The polishing apparatus according to (1) or (2), wherein the polisher rotates or swings.

(4) In a polishing apparatus for polishing a work surface of a work to a spherical surface symmetrical with a rotational axis by a polisher, a rotating means for rotating the work about the rotational axis thereof, and an A-axis for rotating the work in the direction of the rotational axis. A Z-axis mechanism for moving the workpiece in the direction, an X-axis mechanism for moving the workpiece in the B-axis direction orthogonal to the A-axis direction, and the workpiece orthogonal to the A-axis direction and the B-axis direction. A θ-axis mechanism for tilting about the Y-axis to be rotated and the polisher
A polisher driving unit that moves in the X-axis direction perpendicular to the axis, the Y-axis direction parallel to the Y-axis, and the Z-axis direction perpendicular to the X-axis and the Y-axis; During polishing, the Z-axis mechanism, the X-axis mechanism, the θ drive, and the polisher drive are so positioned that the contact point between the workpiece and the polisher is always located on or near the Y-axis. And a control means for controlling.

(5) The polisher driving section comprises: an X-axis driving section for moving the polisher in the X-axis direction;
The polishing apparatus according to (4), further comprising: a Y-axis driving unit that moves in the axial direction; and a pressure driving unit that moves in the Z-axis direction.

According to the polishing apparatus described in the appendix (1), the point (contact point) between the polished surface and the work surface of the work, which is the polished surface.
Is always positioned on or near the Y axis, which is the rotation center of the θ axis, so that the pressure direction of the polisher can be directed to the normal direction of the work surface at the contact point, and the work can be highly accurate Can be polished.

According to the polishing apparatus of the supplementary note (2), the polisher pressing direction is always directed to the normal direction of the processing surface, so that the polishing load of the polisher is dispersed at the contact point (polishing point). As a result, the work surface of the work can be polished at a constant pressure, and highly accurate polishing can be performed.

According to the polishing apparatus of the supplementary note (3), it is possible to perform the polishing process over a wide range of the processing surface of the rotating work.

According to the polishing apparatus of the supplementary note (4), the effect of the supplementary note (1) can be obtained, and the polishing apparatus is composed of two units, ie, a workpiece driving unit and a polisher driving unit, each of which is constituted by a mechanism. And a polishing apparatus can be provided.

According to the polishing apparatus described in the appendix (5), the polisher driving section can be simplified with a simple configuration.

[0084]

As described above, according to the first aspect of the present invention,
According to the polishing apparatus according to the above, the contact point (polishing point) between the polished surface and the work surface of the work, which is the polishing surface, is always positioned on or near the Y axis, which is the turning axis of the θ-axis mechanism. By controlling, the pressure direction of the polisher can be directed to the normal direction of the work surface at the contact point, and the work can be polished with high precision.

Further, since the rotating means and each mechanism can be simplified with a simple configuration, a polishing apparatus which can be manufactured at low cost can be provided.

According to the polishing apparatus of the second aspect of the present invention, the pressing direction of the polisher is always directed to the normal direction of the processing surface, so that the polisher at the contact point (polishing point). Dispersion of the polishing load is eliminated, and the work surface of the work can be polished at a constant pressure, so that highly accurate polishing can be performed.

Further, according to the polishing apparatus of the third aspect of the present invention, the polishing can be performed over a wide range of the processing surface of the rotating work by swinging the polisher.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a polishing apparatus according to Embodiment 1 of the present invention.

FIG. 2 is an explanatory diagram of an operation of a polisher at a central portion of a work according to the first embodiment of the present invention.

FIG. 3 is an operation explanatory view of a polisher around a work according to the first embodiment of the present invention;

FIG. 4 is a side view showing a polishing apparatus according to a second embodiment of the present invention.

FIG. 5 is a side view showing a polishing apparatus according to Embodiment 3 of the present invention.

6A and 6B show prior art 1, in which FIG. 6A is a perspective view of a polishing apparatus, and FIG. 6B is an enlarged view of a processed portion of the polishing apparatus.

FIG. 7 is an explanatory view of a polishing apparatus according to Prior Art 2;

[Explanation of symbols]

 2 Workpiece (work) 2a Work surface 3 Workpiece drive unit 4 Polisher drive unit 5 Y axis 6 θ axis mechanism unit 7 X axis mechanism unit 8 Z axis mechanism unit 22 Work drive unit 27 Y axis polisher adjuster 28 X axis Polisher adjuster 29 Air slider 35 Polishing tool unit 39 Polisher

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shunji Chiaki 2-43-2 Hatagaya, Shibuya-ku, Tokyo Inside Olympus Optical Industrial Co., Ltd. (72) Inventor Hideaki Makino 2-43-2 Hatagaya, Shibuya-ku, Tokyo Olympus Optical Co., Ltd. F-term (reference) 3C058 AA09 AA14 AB04 AB06 BA07 CA01 CB01

Claims (3)

[Claims] 1. A polishing apparatus for polishing a work surface of a work to a spherical surface symmetrical with a rotational axis by a polisher, a rotating means for rotating the work around its rotational axis, and a Z-axis direction which is a direction of the rotational axis. Move to Z
A shaft mechanism, an X-axis mechanism for moving the work in the X-axis direction perpendicular to the Z-axis, and a tilt θ about the work about the Y-axis perpendicular to the X-axis and the Z-axis. A shaft mechanism, and when the workpiece is being polished, the Z-axis mechanism, the X-axis mechanism, and the contact point between the workpiece and the polisher are always positioned on or near the Y-axis. and a control means for controlling the θ-axis mechanism. 2. The Z-axis mechanism section, the X-axis mechanism section, and the θ-axis mechanism section so that the polishing load applied to the workpiece by the polisher coincides or substantially coincides with the normal direction of the work surface of the workpiece. The polishing apparatus according to claim 1, wherein the polishing is controlled. 3. The polishing apparatus according to claim 1, wherein the polisher swings while the workpiece is being polished.