JP2002037979A - Sealing resin composition and semiconductor sealing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flame-retardant, continuous productive, moisture-resistant and reliable, especially by using a novel phosphorus-nitrogen-based flame retardant and zinc borate which do not contain a halogen compound and antimony oxide. Provided are a sealing resin composition and a semiconductor sealing device. A resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a crosslinked phenoxyphosphazene compound crosslinked with, for example, a phenylene group, (D) zinc borate, and (E) an inorganic filler as essential components. 0.1 to 7% by weight of the crosslinked phenoxyphosphazene compound (C), 1 to 10% by weight of zinc borate (D),
A sealing resin composition comprising the inorganic filler (E) in a proportion of 40 to 95% by weight. Further, the present invention is a semiconductor sealing device in which a semiconductor chip is sealed with a cured product of the sealing resin composition.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has excellent flame retardancy without adding a halogen compound (compound containing a chlorine atom or a bromine atom) and antimony trioxide, and has good moldability and moisture resistance. And a sealing resin composition and a semiconductor sealing device having excellent reliability.

[0002]

2. Description of the Related Art In a semiconductor device, it is general that a sealing resin thereof is provided with flame retardancy.
A flame retardant effect is exhibited by using a halogen compound and a metal oxide alone or in combination. Specifically, a combination of a brominated epoxy resin and antimony trioxide is generally used. However, a halogen compound added to exhibit the flame retardant effect of the sealing resin composition, particularly a brominated epoxy resin,
In addition, metal oxides added to assist the flame-retardant effect, particularly antimony trioxide, all have the drawback of lowering the reliability of the semiconductor device. Not only that, but it has recently been pointed out that it has a negative impact on the environment.

[0003] Therefore, there is a strong demand for the development of a sealing resin composition containing no halogen compound and no metal oxide, and studies on phosphorus-based flame retardants, metal hydrates and the like as alternatives have been widely promoted. Have been. However, most of the phosphorus-based flame retardants are phosphate ester-based, and even if the flame-retardant effect is obtained, phosphoric acid generated by hydrolysis causes a decrease in the moisture resistance reliability of the semiconductor sealing device. As a result, sufficient reliability cannot be ensured. In addition, not only the metal hydrate cannot secure sufficient moldability, but also the deterioration of the moisture absorption property has a disadvantage that the reliability of the semiconductor sealing device is greatly reduced.

[0004] Therefore, there has been a strong demand for the development of a sealing resin composition containing no halogen compound and no metal oxide and having excellent moldability, moisture resistance and reliability. In addition, the crosslinked phenoxyphosphazene compound used this time is also an organic substance that does not participate in the reaction except for those in the reaction system, and thus causes a problem in continuous productivity and the like.
There is a drawback that the amount added is limited, and in order to provide the sealing resin composition with a flame retardant effect alone, the content of the inorganic filler is required to a certain degree or more, so it is used throughout the sealing resin composition. It was impossible at present.

The basic skeleton of the phenoxyphosphazene compound used in the present invention is generally synthesized from ammonium chloride and phosphorus pentachloride. In this case, the phenoxyphosphazene compound is obtained as a mixture of cyclic and linear compounds having different molecular weights. Since the phenoxyphosphazene compound obtained as a mixture is a highly viscous substance, there is a problem in the production and operation of the sealing resin, and in order to improve this, a purification operation such as distillation or recrystallization is performed. Even in the case of a single substance or a mixed state, a solid substance is obtained by increasing the purity. If a phenoxyphosphazene compound which is a solid in a synthesized state without such a purification step can be developed, the process of producing a sealing resin can be simplified.

[0006]

DISCLOSURE OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks and to meet the above-mentioned needs, and it is an object of the present invention to provide a phosphorus-nitrogen flame retardant which is not hydrolyzed and therefore does not generate phosphoric acid. By the combination of the appropriate combination with the thing,
A resin composition for encapsulation and a semiconductor encapsulation that imparts sufficient flame retardancy without containing a halogen compound and antimony oxide, and has good productivity, continuous moldability, moisture resistance and reliability of the encapsulating resin. It is intended to provide a device.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, a resin composition containing a specific crosslinked phenoxyphosphazene compound and zinc borate. It has been found that, by quantifying and combining the components, sufficient flame retardancy, moldability (continuous productivity), moisture resistance and reliability are improved, and the above object is achieved, and the present invention has been completed. .

That is, the present invention provides (A) an epoxy resin,
(B) a phenolic resin, (C) a crosslinked phenoxyphosphazene compound, (D) zinc borate and (E) an inorganic filler are essential components, and the crosslinked phenoxyphosphazene compound (C) is added to the resin composition in an amount of 0%. 0.1 to 7% by weight,
Preferably, 0.5 to 3% by weight of the zinc borate (D) is 1%.
10 to 10% by weight, and the inorganic filler (E) is 40 to 9% by weight.
It is a resin composition for encapsulation characterized by being contained at a ratio of 5% by weight. Further, there is provided a semiconductor encapsulating apparatus characterized in that a semiconductor chip is encapsulated with a cured product of the encapsulating resin composition.

Hereinafter, the present invention will be described in detail.

The epoxy resin (A) used in the present invention is not particularly limited in molecular structure and molecular weight as long as it is a compound having at least two epoxy groups in the molecule, and is generally used as a sealing material. Can be widely encompassed. For example, an aromatic resin such as a biphenyl type epoxy resin or a bisphenol type, an aliphatic type such as a cyclohexane derivative, or an epoxy resin represented by each of the following general formulas may be used.

Embedded image (Wherein, R ¹ and R ² represent a hydrogen atom or an alkyl group, and n represents 0 or an integer of 1 or more, respectively)

Embedded image (In the formula, n represents an integer of 0 to 5.) These epoxy resins can be used alone or in combination of two or more.

As the phenolic resin (B) used in the present invention, any compound having at least two phenolic hydroxyl groups capable of reacting with the epoxy resin (A) can be used without any particular limitation. Specific examples include, for example, phenol resins represented by the following general formulas.

[0012]

Embedded image (Where n represents 0 or an integer of 1 or more)

Embedded image (In the formula, n represents 0 or an integer of 1 or more.) These resins can be used alone or in combination of two or more.

(B) The mixing ratio of the phenol resin is the equivalent ratio (a) / (b) of the epoxy group (a) of the epoxy resin and the phenolic hydroxyl group (b) of the phenol resin.
Is desirably in the range of 0.1 to 10. If the equivalent ratio is less than 0.1 or exceeds 10, the moisture resistance, heat resistance, molding workability, and electrical properties of the cured product are deteriorated,
Either case is not preferred. Therefore, it is better to limit to the above range.

The crosslinked phenoxyphosphazene compound (C) used in the present invention has the following structural formula

Embedded image (Wherein m represents an integer of 3 to 25, preferably 3 to 10), and / or the following structural formula

Embedded image (Wherein X is a group -N = P (OC ₆ H ₅ ) ₃ or a group -N =
P (O) OC ₆ H ₅ , Y represents a group —P (OC ₆ H ₅ ) ₄ or a group —P (OC ₆ H ₅ ) ₂ , and n represents an integer of 3 to 10,000, preferably 3 to 15, respectively. ) Is at least one phosphazene compound selected from the chain phenoxyphosphazene compounds represented by
Phenylene group, p-phenylene group and bisphenylene group represented by the following structural formula

Embedded image (Wherein, A represents a group —C (CH ₃ ) ₂ —, a group —SO ₂ —, a group —S— or a group —O—, and a represents 0 or 1). Is a crosslinked phenoxyphosphazene compound crosslinked by

(A) the cross-linking group is interposed between the two oxygen atoms from which the phenyl group of phenoxy has been eliminated in the phosphazene compound; and (b) the content of the non-eliminated phenyl group in the cross-linked compound. Is 50 to 99.9% based on the total number of all phenyl groups in the phosphazene compound (9) and / or (10), and (c) is a crosslinked phenoxyphosphazene compound having no free hydroxyl group in the molecule. These crosslinked phenoxyphosphazene compounds can be used alone or in combination of two or more.

In the present invention, "having no free hydroxyl group in the molecule" is described in Analytical Chemistry Handbook (Revised 3rd Edition, edited by The Japan Society for Analytical Chemistry, Maruzen Co., Ltd., 1981), page 353. It means that the amount of free hydroxyl groups is below the detection limit when quantified according to the acetylation method using acetic anhydride and pyridine. Here, the detection limit is a detection limit as a hydroxyl equivalent per 1 g of a sample (crosslinked phenoxyphosphazene compound of the present invention), and more specifically, 1 ×
It is 10 ^-6 hydroxyl group equivalent / g or less. When the crosslinked phenoxyphosphazene compound of the present invention is analyzed by the above acetylation method, the amount of hydroxyl groups of the remaining raw phenol is also added.However, since the raw phenol can be quantified by high performance liquid chromatography, Only free hydroxyl groups can be quantified.

The compounding ratio of the crosslinked phenoxyphosphazene compound (C) is 0.1 to 7 with respect to the whole resin composition.
%, Preferably 0.5 to 3% by weight. If this proportion is less than 0.1% by weight, the effect of flame retardancy cannot be sufficiently obtained, and if it exceeds 7% by weight, it oozes on the surface of the cured product of the sealing resin and adversely affects the properties of the cured product. Is not suitable for practical use and is not preferred.

The zinc borate (D) used in the present invention is desirably contained in an amount of 1 to 10% by weight based on the whole resin composition. If this proportion is less than 1% by weight, the flame retardant effect cannot be sufficiently obtained, and if it exceeds 10% by weight, the flame retardant effect of the sealing resin is not improved, so the above content is appropriate.

The inorganic filler (E) used in the present invention includes fused silica, crystalline silica, alumina, talc, zircon, calcium silicate, calcium carbonate, silicon carbide,
Powders of boron nitride, beryllia, zirconia, titanium oxide or the like or spherical beads thereof, potassium titanate,
Single crystal fibers such as silicon carbide, silicon nitride, and alumina; glass fibers; and the like.
More than one kind can be mixed and used. Among these, silica powder and alumina powder are particularly preferable, and these are often used.

(D) It is desirable that the compounding ratio of the inorganic filler is 40 to 95% by weight based on the whole resin composition. If the proportion is less than 40% by weight, heat resistance, moisture resistance, soldering heat resistance, mechanical properties and moldability deteriorate, and if it exceeds 95% by weight, the bulk becomes large and the moldability deteriorates, which is not suitable for practical use. .

The encapsulating resin composition of the present invention contains the above-mentioned epoxy resin, phenolic resin, crosslinked phenoxyphosphazene compound, zinc borate and inorganic filler as essential components. If necessary, for example, natural waxes, synthetic waxes, linear aliphatic metal salts, acid amides, esters, paraffin-based release agents, elastomers and other low-stress components, carbon black and the like Colorants, various organic silanes, organic titanates, treating agents for inorganic fillers such as coupling agents such as aluminum alcoholate, and various curing accelerators for accelerating the curing reaction between the epoxy resin and the phenolic resin, as appropriate. It can be added and blended.

A general method for preparing the encapsulating resin composition of the present invention as a molding material includes the above-described epoxy resin, phenol resin, crosslinked phenoxyphosphazene compound, zinc borate, inorganic filler and other components. After mixing uniformly with a mixer or the like, a melt-mixing process using a hot roll, or a mixing process using a kneader or the like is performed, and then the mixture is cooled and solidified, and pulverized to an appropriate size to obtain a molding material. it can. If the molding material thus obtained is applied to sealing, coating, insulating, etc. of electronic parts or electric parts such as semiconductor devices, excellent properties and reliability can be imparted.

The semiconductor sealing device of the present invention can be easily manufactured by sealing a semiconductor chip using the sealing resin obtained as described above. The most common method of sealing is low pressure transfer molding, but sealing by injection molding, compression molding, casting or the like is also possible. The sealing resin composition is heated and cured at the time of sealing, and finally a semiconductor sealing device sealed with a cured product of this composition is obtained. Curing by heating
It is desirable to heat and cure at 150 ° C. or higher. As a semiconductor device for sealing, for example, an integrated circuit, a large-scale integrated circuit, a transistor, a thyristor, a diode, and the like are not particularly limited.

[0024]

The resin composition for sealing and the semiconductor sealing device of the present invention can obtain desired properties by using a crosslinked phenoxyphosphazene compound and zinc borate as resin components. That is, in addition to the stability of the crosslinked phenoxyphosphazene compound, by adding a suitable combination of the crosslinked phenoxyphosphazene compound and zinc borate, while maintaining sufficient moldability, imparts excellent flame retardancy to the resin composition. However, in the semiconductor device, particularly, the moisture resistance and the reliability can be improved.

[0025]

Next, the present invention will be described in detail with reference to examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, “%” means “% by weight”.

Example 1 Cresol novolak type epoxy resin (epoxy equivalent 2
00) 16%, novolak type phenol resin (phenol equivalent 105) 10%, and a crosslinked phenoxyphosphazene compound ( _Mw = 1) having a phenylene group as a crosslinkable group.
100) 2%, zinc borate 3%, fused silica powder 67% and ester waxes 0.3% are mixed, mixed at room temperature, further kneaded at 90-95 ° C, and cooled and pulverized to obtain a molding material. Manufactured.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. Flammability and moisture resistance of this molded product,
A continuous productivity test was performed. Table 1 shows the results.

Example 2 Cresol novolak type epoxy resin (epoxy equivalent 2
00) 12%, 12% of a novolak type phenol aralkyl resin (phenol equivalent: 175), 1.5% of a crosslinked phenoxyphosphazene compound having a phenylene group as a crosslinkable group (M _w = 1100), 2.5% of zinc borate, 70% fused silica powder and 0.3% ester wax
Was mixed at room temperature, kneaded at 90 to 95 ° C., and cooled and pulverized to produce a molding material. Further, a molded article was prepared in the same manner as in Example 1, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 1 shows the results.

Example 3 Cresol novolak type epoxy resin (epoxy equivalent 2
00) 11%, 6% of a novolak type phenol resin (phenol equivalent 105), and a crosslinked phenoxyphosphazene compound ( _Mw = 11) having a phenylene group as a crosslinkable group.
00) 1%, zinc borate 2%, fused silica powder 77% and ester waxes 0.2% are mixed, mixed at room temperature, further kneaded at 90-95 ° C, and cooled and pulverized to obtain a molding material. Manufactured. Further, a molded article was prepared in the same manner as in Example 1, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 1 shows the results.

Comparative Example 1 Cresol novolak type epoxy resin (epoxy equivalent 2
00) 14% with a brominated epoxy resin (epoxy equivalent 2
70) 3%, 9% of novolak type phenol resin (phenol equivalent 105), 70% of fused silica powder, 2% of antimony trioxide and 0.3% of ester waxes, mixed at room temperature, and further mixed at 90 to 95 ° C. The mixture was cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 1, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 2 shows the results.

Comparative Example 2 Cresol novolak type epoxy resin (epoxy equivalent 2
00) 14%, novolak type phenol resin (phenol equivalent 105) 8%, polyphosphate 7%, fused silica powder 70% and ester wax 0.3%
Was mixed at room temperature, kneaded at 90-95 ° C., and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 1, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 2 shows the results.

Comparative Example 3 Cresol novolak type epoxy resin (epoxy equivalent 2
00) 17%, 10% of novolak type phenol resin (phenol equivalent 105), 71% of fused silica powder and 0.3% of ester waxes, and mixed at room temperature.
The mixture was further kneaded at 90 to 95 ° C. and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 1, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 2 shows the results.

Comparative Example 4 Cresol novolak type epoxy resin (epoxy equivalent 2
14), 8% of a novolak type phenol resin (phenol equivalent: 105), 7% of the above-mentioned crosslinked phenoxyphosphazene compound (M _w = 1100), 70% of fused silica powder, and 0.3% of ester wax. The mixture was mixed at room temperature, further kneaded at 90 to 95 ° C., and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 1, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 2 shows the results.

The notes in Tables 1 to 6 are as follows.

* 1: 120 by transfer molding
A molded product of × 12 × 3.2 mm was prepared and left at 175 ° C. for 8 hours, and then subjected to a flammability test based on the UL-94V flame resistance test standard.

* 2: A silicon chip (test element) having two aluminum wirings was adhered to a copper frame using a molding material, and transfer molded at 175 ° C. for 2 minutes.
After making TO-92 molded product, post-curing at 175 ° C for 4 hours, solder immersion at 260 ° C, 127 ° C,
PCT was performed in 2.5 atm of saturated steam, and the disconnection due to aluminum corrosion was evaluated as defective.

* 3: The continuous productivity of DIP-14 was evaluated by transfer molding at 175 ° C. × 90 s under molding conditions, and the number of shots until the appearance failure of the package was counted.

[0038]

[Table 1]

[Table 2] Example 4 Biphenyl type epoxy resin (epoxy equivalent 192) 5
%, Novolak type phenol resin (phenol equivalent 10
5) 4%, 1% of a cross-linked phenoxyphosphazene compound (M _w = 1100) having the above-mentioned phenylene group as a cross-linking group,
1% of zinc borate, 87% of fused silica powder and 0.2% of ester waxes were blended and mixed at room temperature.
The mixture was kneaded at ~ 95 ° C and cooled and pulverized to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. Flammability and moisture resistance of this molded product,
A continuous productivity test was performed. Table 3 shows the results.

Example 5 Biphenyl type epoxy resin (epoxy equivalent: 192) 4
%, Cresol novolak epoxy resin (epoxy equivalent 200) 2%, novolak type phenol resin (phenol equivalent 105) 3%, a crosslinked phenoxyphosphazene compound having a phenylene group as a crosslinkable group ( _Mw = 110)
0) 1%, zinc borate 1%, fused silica powder 87% and ester waxes 0.2% were mixed and mixed at room temperature,
The mixture was further kneaded at 90 to 95 ° C. and cooled and pulverized to produce a molding material. Further, a molded article was prepared in the same manner as in Example 4, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 3 shows the results.

Comparative Example 5 Biphenyl type epoxy resin (epoxy equivalent: 192) 4
%, Cresol novolak epoxy resin (epoxy equivalent 200) and brominated epoxy resin (epoxy equivalent 2)
70) 1%, 4% of novolak type phenol resin (phenol equivalent 105), 85% of fused silica powder, 2% of antimony trioxide and 0.2% of ester waxes, mixed at room temperature, and further mixed at 90 to 95 ° C. The mixture was cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 4, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 4 shows the results.

Comparative Example 6 Biphenyl type epoxy resin (epoxy equivalent: 192) 4
%, Cresol novolak epoxy resin (epoxy equivalent 200) 2%, novolak type phenol resin (phenol equivalent 105) 3%, polyphosphate 1%, zinc borate 1%, fused silica powder 87% and ester waxes 0. 2%, mix at room temperature, and further add 90-9
The mixture was kneaded at 5 ° C and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 4, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 4 shows the results.

Comparative Example 7 Biphenyl epoxy resin (epoxy equivalent: 192)
4.5%, cresol novolak epoxy resin (epoxy equivalent 200) 2%, novolak type phenol resin (phenol equivalent 105) 4.5%, fused silica powder 8
7% and 0.2% of ester waxes were blended, mixed at room temperature, further kneaded at 90 to 95 ° C, and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 4, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 4 shows the results.

Comparative Example 8 The biphenyl type epoxy resin (epoxy equivalent: 192)
3.5%, cresol novolak epoxy resin (epoxy equivalent 200) 1%, novolak type phenol resin (phenol equivalent 105) 3.5%, crosslinked phenoxyphosphazene compound ( _Mw = 1100) 4%, fused silica powder 86% and ester waxes 0.2
%, Mixed at room temperature, kneaded at 90-95 ° C., and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 4, and tests for combustibility, moisture resistance and continuous productivity were performed. Table 4 shows the results.

[0045]

[Table 3]

[Table 4] Example 6 Epoxy resin represented by Chemical formula 6 (epoxy equivalent: 260)
10%, novolak type phenol resin (phenol equivalent: 105), 5%, cross-linked phenoxyphosphazene compound (M _w = 1100) 1 having a phenylene group as a cross-linking group
%, Zinc borate 2%, fused silica powder 80% and ester waxes 0.3% were mixed at room temperature, kneaded at 90-95 ° C, and cooled and pulverized to produce a molding material.

This molding material is transfer-injected into a mold heated to 175 ° C. and cured to form a molded product (sealed product).
Was molded. Flammability and moisture resistance of this molded product,
A continuous productivity test was performed. Table 5 shows the results.

Example 7 Epoxy resin represented by Chemical formula 6 (epoxy equivalent: 260)
8%, 7% of a novolak type phenol aralkyl resin (phenol equivalent 170), a crosslinked phenoxyphosphazene compound having a phenylene group as a crosslinkable group ( _Mw = 11)
00) 1%, 2% of zinc borate, 80% of fused silica powder and 0.3% of ester wax are mixed, mixed at room temperature, further kneaded at 90 to 95 ° C, and cooled and pulverized to obtain a molding material. Manufactured. Further, a molded article was prepared in the same manner as in Example 6, and a test for combustibility, moisture resistance and continuous productivity was performed. Table 5 shows the results.

Example 8 Epoxy resin represented by Chemical formula 6 (epoxy equivalent: 260)
6%, cresol novolak epoxy resin (epoxy equivalent 200) 2%, novolak type phenol aralkyl resin (phenol equivalent 170) 6%, 1% of a crosslinked phenoxyphosphazene compound ( _Mw = 1100) having a phenylene group as a crosslinkable group, 2% of zinc borate, 81.5% of fused silica powder and 0.2% of ester waxes were blended, mixed at room temperature, kneaded at 90 to 95 ° C, and cooled and pulverized to produce a molding material. Further, a molded article was prepared in the same manner as in Example 6, and a test for combustibility, moisture resistance and continuous productivity was performed. Table 5 shows the results.

Comparative Example 9 Epoxy resin represented by Chemical formula 6 (epoxy equivalent: 260)
7%, brominated epoxy resin (epoxy equivalent 270) 2
%, Novolak type phenol aralkyl resin (phenol equivalent: 170), 7%, fused silica powder, 80%, antimony trioxide, 2%, and ester waxes, 0.3%, mixed at room temperature, and kneaded at 90-95 ° C. This was cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 6, and a test for combustibility, moisture resistance and continuous productivity was performed. Table 6 shows the results.

Comparative Example 10 Epoxy resin represented by Chemical formula 6 (epoxy equivalent: 260)
8%, 7% of novolak type phenol aralkyl resin (phenol equivalent 170), 2% of polyphosphate, 2% of zinc borate, 79% of fused silica powder and 0.3% of ester wax are mixed and mixed at room temperature. 90-9
The mixture was kneaded at 5 ° C and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 6, and a test for combustibility, moisture resistance and continuous productivity was performed. Table 6 shows the results.

Comparative Example 11 Epoxy resin represented by Chemical formula 6 (epoxy equivalent: 260)
9%, 8% of novolak type phenol aralkyl resin (phenol equivalent 170), 82% of fused silica powder and 0.3% of ester wax are mixed, mixed at room temperature, further kneaded at 90 to 95 ° C. and cooled. It was ground to form a molding material. Further, a molded article was prepared in the same manner as in Example 6, and a test for combustibility, moisture resistance and continuous productivity was performed.
Table 6 shows the results.

Comparative Example 12 Epoxy resin represented by Chemical formula 6 (epoxy equivalent: 260)
7%, 6% of novolak type phenol aralkyl resin (phenol equivalent 170), 5% of the above-mentioned crosslinked phenoxyphosphazene compound (M _w = 1100), 80% of fused silica powder and 0.3% of ester waxes were blended at room temperature. The mixture was mixed, further kneaded at 90 to 95 ° C, and cooled and pulverized to prepare a molding material. Further, a molded article was prepared in the same manner as in Example 6, and a test for combustibility, moisture resistance and continuous productivity was performed. Table 6 shows the results.

[0053]

[Table 5]

[Table 6]

[0054]

As apparent from the above description and Tables 1 to 6, the encapsulating resin composition and the semiconductor encapsulating apparatus of the present invention have excellent flame retardancy but are continuously manufactured. It was excellent in moisture resistance reliability without lowering the reliability, and as a result, disconnection failure due to electrode corrosion could be significantly reduced, and long-term reliability could be guaranteed.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C09K 3/10 C09K 3/10 L 4M109 Z 21/12 21/12 21/14 21/14 H01L 23/29 C07F 9/6581 23/31 9/659 // C07F 9/6581 H01L 23/30 R 9/659 (72) Inventor Atsushi Fujii 9-2 Chidoricho, Kawasaki-ku, Kawasaki-shi, Kanagawa Kawasaki Plant, Toshiba Chemical Corporation (72) Inventor Yuji Tada 463 Kagasuno, Kawauchi-machi, Tokushima City, Tokushima Prefecture F-term (reference) in Otsuka Chemical Co., Ltd.Tokushima Research Laboratories AA03 AB80 4J002 CC03X CD02W CD03W CD05W CQ013 DE097 DE137 DE147 DE237 DJ007 DJ017 DJ047 DK006 DK007 DL007 FA047 FD020 FD090 FD140 FD150 FD150 FD160 GQ01 GQ05 4J036 AA01 AA04 AB01 AB07 AC01 AC08 AD01 AD08 AD11 DA01 DA04 DB06 FB06 FB07 JA07 KA05 KA06 4M109 AA01 CA21 EA02 EB03 EB07 EB12 EC01 EC20

Claims (4)

[Claims] (A) an epoxy resin, (B) a phenolic resin, (C) (1) a cyclic phenoxyphosphazene compound represented by the following structural formula, and (Wherein, m represents an integer of 3 to 25) (2) A chain phenoxyphosphazene compound represented by the following structural formula: (Wherein X is a group -N = P (OC ₆ H ₅ ) ₃ or a group -N =
P (O) OC ₆ H ₅ , Y is a group —P (OC ₆ H ₅ ) ₄ or a group —P (OC ₆ H ₅ ) ₂ , and n is an integer of 3 to 10,000. At least one phosphazene compound is an o-phenylene group, an m-phenylene group, a p-phenylene group, and a bisphenylene group represented by the following structural formula. (Wherein, A represents a group —C (CH ₃ ) ₂ —, a group —SO ₂ —, a group —S— or a group —O—, and a represents 0 or 1). (A) the crosslinking group is interposed between two oxygen atoms from which the phenyl group of the phosphazene compound has been eliminated, and (b)
The content of phenyl groups in the crosslinked compound is 50 to 99.9% based on the total number of all phenyl groups in the phosphazene compound (1) and / or (2), and (c) A crosslinked phenoxyphosphazene compound having no free hydroxyl group, (D) zinc borate and (E) an inorganic filler are essential components, and the crosslinked phenoxyphosphazene compound (C) is used in an amount of 0.1 to the entire resin composition. 1 to 10% by weight of the zinc borate (D) and 40 to 95% by weight of the inorganic filler (E), respectively. Composition. 2. The sealing resin composition according to claim 1, wherein the epoxy resin (A) is a biphenyl type epoxy resin. 3. The epoxy resin according to claim 1, wherein the epoxy resin is represented by the following formula: The sealing resin composition according to claim 1, wherein 4. A semiconductor encapsulation device comprising a semiconductor chip encapsulated with a cured product of the encapsulation resin composition according to claim 1.