JP2002037855A - Photocurable resin composition for photorecording disk - Google Patents
Photocurable resin composition for photorecording diskInfo
- Publication number
- JP2002037855A JP2002037855A JP2000228119A JP2000228119A JP2002037855A JP 2002037855 A JP2002037855 A JP 2002037855A JP 2000228119 A JP2000228119 A JP 2000228119A JP 2000228119 A JP2000228119 A JP 2000228119A JP 2002037855 A JP2002037855 A JP 2002037855A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- ethyl
- photocurable resin
- ether
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 32
- 239000000178 monomer Substances 0.000 claims abstract description 28
- 229920001577 copolymer Polymers 0.000 claims abstract description 25
- 230000009477 glass transition Effects 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 24
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 18
- 125000003566 oxetanyl group Chemical group 0.000 claims description 14
- 125000002091 cationic group Chemical group 0.000 claims description 12
- 125000000466 oxiranyl group Chemical group 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 229920006243 acrylic copolymer Polymers 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 20
- 239000000853 adhesive Substances 0.000 abstract description 12
- 150000001768 cations Chemical class 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- -1 (3-ethyl-3-oxetanyl) Methoxy Chemical group 0.000 description 21
- FNYWFRSQRHGKJT-UHFFFAOYSA-N 3-ethyl-3-[(3-ethyloxetan-3-yl)methoxymethyl]oxetane Chemical compound C1OCC1(CC)COCC1(CC)COC1 FNYWFRSQRHGKJT-UHFFFAOYSA-N 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 9
- 239000004417 polycarbonate Substances 0.000 description 9
- 239000010408 film Substances 0.000 description 8
- 239000003085 diluting agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 5
- 229910052753 mercury Inorganic materials 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- UNMJLQGKEDTEKJ-UHFFFAOYSA-N (3-ethyloxetan-3-yl)methanol Chemical compound CCC1(CO)COC1 UNMJLQGKEDTEKJ-UHFFFAOYSA-N 0.000 description 2
- LMIOYAVXLAOXJI-UHFFFAOYSA-N 3-ethyl-3-[[4-[(3-ethyloxetan-3-yl)methoxymethyl]phenyl]methoxymethyl]oxetane Chemical compound C=1C=C(COCC2(CC)COC2)C=CC=1COCC1(CC)COC1 LMIOYAVXLAOXJI-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 150000001242 acetic acid derivatives Chemical class 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000012943 hotmelt Substances 0.000 description 2
- 229910052752 metalloid Inorganic materials 0.000 description 2
- 150000002738 metalloids Chemical class 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 2
- 150000004010 onium ions Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229940090181 propyl acetate Drugs 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- AWOGBOARESKNBA-UHFFFAOYSA-N 1-[(3-ethyloxetan-3-yl)methoxy]propan-2-ol Chemical compound CC(O)COCC1(CC)COC1 AWOGBOARESKNBA-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- RVGLEPQPVDUSOJ-UHFFFAOYSA-N 2-Methyl-3-hydroxypropanoate Chemical compound COC(=O)CCO RVGLEPQPVDUSOJ-UHFFFAOYSA-N 0.000 description 1
- MJNGDTGKCWWIOP-UHFFFAOYSA-N 2-[(3-ethyloxetan-3-yl)methoxy]ethanol Chemical compound OCCOCC1(CC)COC1 MJNGDTGKCWWIOP-UHFFFAOYSA-N 0.000 description 1
- SNAGVRNJNARVRV-UHFFFAOYSA-N 2-[(3-ethyloxetan-3-yl)methoxymethyl]oxolane Chemical compound C1CCOC1COCC1(CC)COC1 SNAGVRNJNARVRV-UHFFFAOYSA-N 0.000 description 1
- HSDVRWZKEDRBAG-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COC(CCCCC)OCC1CO1 HSDVRWZKEDRBAG-UHFFFAOYSA-N 0.000 description 1
- DVSDTPMZVLDKRT-UHFFFAOYSA-N 2-[2-[(3-ethyloxetan-3-yl)methoxy]butoxy]ethanol Chemical compound OCCOCC(CC)OCC1(CC)COC1 DVSDTPMZVLDKRT-UHFFFAOYSA-N 0.000 description 1
- VSRMIIBCXRHPCC-UHFFFAOYSA-N 2-[2-[2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxy]ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCCOCCOCC1CO1 VSRMIIBCXRHPCC-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- ICPWFHKNYYRBSZ-UHFFFAOYSA-M 2-methoxypropanoate Chemical compound COC(C)C([O-])=O ICPWFHKNYYRBSZ-UHFFFAOYSA-M 0.000 description 1
- HGCHXPWVBFSUDT-UHFFFAOYSA-N 3-(2-butoxyethoxymethyl)-3-ethyloxetane Chemical compound CCCCOCCOCC1(CC)COC1 HGCHXPWVBFSUDT-UHFFFAOYSA-N 0.000 description 1
- WKXMZIDBVDIVME-UHFFFAOYSA-N 3-[(3-ethyloxetan-3-yl)methoxy]-2,2-bis[(3-ethyloxetan-3-yl)methoxymethyl]propan-1-ol Chemical compound C1OCC1(CC)COCC(CO)(COCC1(CC)COC1)COCC1(CC)COC1 WKXMZIDBVDIVME-UHFFFAOYSA-N 0.000 description 1
- FVGDNYRHKDREFL-UHFFFAOYSA-N 3-ethyl-3-(1-phenoxyethoxymethyl)oxetane Chemical compound C=1C=CC=CC=1OC(C)OCC1(CC)COC1 FVGDNYRHKDREFL-UHFFFAOYSA-N 0.000 description 1
- BIDWUUDRRVHZLQ-UHFFFAOYSA-N 3-ethyl-3-(2-ethylhexoxymethyl)oxetane Chemical compound CCCCC(CC)COCC1(CC)COC1 BIDWUUDRRVHZLQ-UHFFFAOYSA-N 0.000 description 1
- PWGAXPBJOGFFMY-UHFFFAOYSA-N 3-ethyl-3-(2-methylpropoxymethoxymethyl)oxetane Chemical compound CC(C)COCOCC1(CC)COC1 PWGAXPBJOGFFMY-UHFFFAOYSA-N 0.000 description 1
- DILMQZOSIJKYHA-UHFFFAOYSA-N 3-ethyl-3-[(2,3,4,5,6-pentabromophenoxy)methyl]oxetane Chemical compound BrC=1C(Br)=C(Br)C(Br)=C(Br)C=1OCC1(CC)COC1 DILMQZOSIJKYHA-UHFFFAOYSA-N 0.000 description 1
- FQUZJULGTSCUDF-UHFFFAOYSA-N 3-ethyl-3-[(2,3,4,5,6-pentachlorophenoxy)methyl]oxetane Chemical compound ClC=1C(Cl)=C(Cl)C(Cl)=C(Cl)C=1OCC1(CC)COC1 FQUZJULGTSCUDF-UHFFFAOYSA-N 0.000 description 1
- PBXYBVUSKINNJL-UHFFFAOYSA-N 3-ethyl-3-[(2,3,4-tribromophenoxy)methyl]oxetane Chemical compound C=1C=C(Br)C(Br)=C(Br)C=1OCC1(CC)COC1 PBXYBVUSKINNJL-UHFFFAOYSA-N 0.000 description 1
- JCBNYALMACLNBI-UHFFFAOYSA-N 3-ethyl-3-[(3-fluorophenyl)methoxymethyl]oxetane Chemical compound FC1=CC(=CC=C1)COCC1(COC1)CC JCBNYALMACLNBI-UHFFFAOYSA-N 0.000 description 1
- PENKVNGNXDMJKV-UHFFFAOYSA-N 3-ethyl-3-[(4-methoxyphenyl)methoxymethyl]oxetane Chemical compound C=1C=C(OC)C=CC=1COCC1(CC)COC1 PENKVNGNXDMJKV-UHFFFAOYSA-N 0.000 description 1
- SLNCKLVYLZHRKK-UHFFFAOYSA-N 3-ethyl-3-[2-[(3-ethyloxetan-3-yl)methoxy]ethoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCOCC1(CC)COC1 SLNCKLVYLZHRKK-UHFFFAOYSA-N 0.000 description 1
- ARTCZOWQELAGLQ-UHFFFAOYSA-N 3-ethyl-3-[2-[2-[2-[(3-ethyloxetan-3-yl)methoxy]ethoxy]ethoxy]ethoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCOCCOCCOCC1(CC)COC1 ARTCZOWQELAGLQ-UHFFFAOYSA-N 0.000 description 1
- WUGFSEWXAWXRTM-UHFFFAOYSA-N 3-ethyl-3-[2-[2-[2-[2-[(3-ethyloxetan-3-yl)methoxy]ethoxy]ethoxy]ethoxy]ethoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCOCCOCCOCCOCC1(CC)COC1 WUGFSEWXAWXRTM-UHFFFAOYSA-N 0.000 description 1
- GBDPVIKGIRHANI-UHFFFAOYSA-N 3-ethyl-3-[6-[(3-ethyloxetan-3-yl)methoxy]hexoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCCCOCC1(CC)COC1 GBDPVIKGIRHANI-UHFFFAOYSA-N 0.000 description 1
- TZLWQJKQWIJXJN-UHFFFAOYSA-N 3-ethyl-3-[8-[(3-ethyloxetan-3-yl)methoxy]octoxymethyl]oxetane Chemical compound C1OCC1(CC)COCCCCCCCCOCC1(CC)COC1 TZLWQJKQWIJXJN-UHFFFAOYSA-N 0.000 description 1
- HPINXYMPRYQBGF-UHFFFAOYSA-N 3-ethyl-3-[[3-[(3-ethyloxetan-3-yl)methoxy]-2,2-bis[(3-ethyloxetan-3-yl)methoxymethyl]propoxy]methyl]oxetane Chemical compound C1OCC1(CC)COCC(COCC1(CC)COC1)(COCC1(CC)COC1)COCC1(CC)COC1 HPINXYMPRYQBGF-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- MFKRHJVUCZRDTF-UHFFFAOYSA-N 3-methoxy-3-methylbutan-1-ol Chemical compound COC(C)(C)CCO MFKRHJVUCZRDTF-UHFFFAOYSA-N 0.000 description 1
- QMYGFTJCQFEDST-UHFFFAOYSA-N 3-methoxybutyl acetate Chemical compound COC(C)CCOC(C)=O QMYGFTJCQFEDST-UHFFFAOYSA-N 0.000 description 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical compound OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 description 1
- ACQVEWFMUBXEMR-UHFFFAOYSA-N 4-bromo-2-fluoro-6-nitrophenol Chemical compound OC1=C(F)C=C(Br)C=C1[N+]([O-])=O ACQVEWFMUBXEMR-UHFFFAOYSA-N 0.000 description 1
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- JYBUPYFFXFJVER-UHFFFAOYSA-N C(C)C1(COC1)C1CCC(C2(COC2)CC)O1 Chemical compound C(C)C1(COC1)C1CCC(C2(COC2)CC)O1 JYBUPYFFXFJVER-UHFFFAOYSA-N 0.000 description 1
- 229920002284 Cellulose triacetate Polymers 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 1
- PFHLXMMCWCWAMA-UHFFFAOYSA-N [4-(4-diphenylsulfoniophenyl)sulfanylphenyl]-diphenylsulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC(C=C1)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 PFHLXMMCWCWAMA-UHFFFAOYSA-N 0.000 description 1
- SJWFRIPVKWSATF-UHFFFAOYSA-N [4-[4-bis[4-(2-hydroxyethyl)phenyl]sulfoniophenyl]sulfanylphenyl]-bis[4-(2-hydroxyethyl)phenyl]sulfanium Chemical compound C1=CC(CCO)=CC=C1[S+](C=1C=CC(SC=2C=CC(=CC=2)[S+](C=2C=CC(CCO)=CC=2)C=2C=CC(CCO)=CC=2)=CC=1)C1=CC=C(CCO)C=C1 SJWFRIPVKWSATF-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- AENNXXRRACDJAY-UHFFFAOYSA-N bis(2-dodecylphenyl)iodanium Chemical compound CCCCCCCCCCCCC1=CC=CC=C1[I+]C1=CC=CC=C1CCCCCCCCCCCC AENNXXRRACDJAY-UHFFFAOYSA-N 0.000 description 1
- HKWWDSQUZURFQR-UHFFFAOYSA-N bis(4-methylphenyl)iodanium Chemical compound C1=CC(C)=CC=C1[I+]C1=CC=C(C)C=C1 HKWWDSQUZURFQR-UHFFFAOYSA-N 0.000 description 1
- DNFSNYQTQMVTOK-UHFFFAOYSA-N bis(4-tert-butylphenyl)iodanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 DNFSNYQTQMVTOK-UHFFFAOYSA-N 0.000 description 1
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- VUEYQLJAKGLDNR-UHFFFAOYSA-N butyl 2-ethoxyacetate Chemical compound CCCCOC(=O)COCC VUEYQLJAKGLDNR-UHFFFAOYSA-N 0.000 description 1
- FYRUCHOYGVFKLZ-UHFFFAOYSA-N butyl 2-ethoxypropanoate Chemical compound CCCCOC(=O)C(C)OCC FYRUCHOYGVFKLZ-UHFFFAOYSA-N 0.000 description 1
- VFGRALUHHHDIQI-UHFFFAOYSA-N butyl 2-hydroxyacetate Chemical compound CCCCOC(=O)CO VFGRALUHHHDIQI-UHFFFAOYSA-N 0.000 description 1
- IWPATTDMSUYMJV-UHFFFAOYSA-N butyl 2-methoxyacetate Chemical compound CCCCOC(=O)COC IWPATTDMSUYMJV-UHFFFAOYSA-N 0.000 description 1
- JDJWQETUMXXWPD-UHFFFAOYSA-N butyl 2-methoxypropanoate Chemical compound CCCCOC(=O)C(C)OC JDJWQETUMXXWPD-UHFFFAOYSA-N 0.000 description 1
- MVWVAXBILFBQIZ-UHFFFAOYSA-N butyl 3-ethoxypropanoate Chemical compound CCCCOC(=O)CCOCC MVWVAXBILFBQIZ-UHFFFAOYSA-N 0.000 description 1
- MENWVOUYOZQBDM-UHFFFAOYSA-N butyl 3-hydroxypropanoate Chemical compound CCCCOC(=O)CCO MENWVOUYOZQBDM-UHFFFAOYSA-N 0.000 description 1
- RRIRSNXZGJWTQM-UHFFFAOYSA-N butyl 3-methoxypropanoate Chemical compound CCCCOC(=O)CCOC RRIRSNXZGJWTQM-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- CKSRFHWWBKRUKA-UHFFFAOYSA-N ethyl 2-ethoxyacetate Chemical compound CCOCC(=O)OCC CKSRFHWWBKRUKA-UHFFFAOYSA-N 0.000 description 1
- GFUIDHWFLMPAGY-UHFFFAOYSA-N ethyl 2-hydroxy-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)O GFUIDHWFLMPAGY-UHFFFAOYSA-N 0.000 description 1
- ZANNOFHADGWOLI-UHFFFAOYSA-N ethyl 2-hydroxyacetate Chemical compound CCOC(=O)CO ZANNOFHADGWOLI-UHFFFAOYSA-N 0.000 description 1
- WHRLOJCOIKOQGL-UHFFFAOYSA-N ethyl 2-methoxypropanoate Chemical compound CCOC(=O)C(C)OC WHRLOJCOIKOQGL-UHFFFAOYSA-N 0.000 description 1
- UKDLORMZNPQILV-UHFFFAOYSA-N ethyl 3-hydroxypropanoate Chemical compound CCOC(=O)CCO UKDLORMZNPQILV-UHFFFAOYSA-N 0.000 description 1
- IJUHLFUALMUWOM-UHFFFAOYSA-N ethyl 3-methoxypropanoate Chemical compound CCOC(=O)CCOC IJUHLFUALMUWOM-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000013847 iso-butane Nutrition 0.000 description 1
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- PPFNAOBWGRMDLL-UHFFFAOYSA-N methyl 2-ethoxyacetate Chemical compound CCOCC(=O)OC PPFNAOBWGRMDLL-UHFFFAOYSA-N 0.000 description 1
- YVWPDYFVVMNWDT-UHFFFAOYSA-N methyl 2-ethoxypropanoate Chemical compound CCOC(C)C(=O)OC YVWPDYFVVMNWDT-UHFFFAOYSA-N 0.000 description 1
- GSJFXBNYJCXDGI-UHFFFAOYSA-N methyl 2-hydroxyacetate Chemical compound COC(=O)CO GSJFXBNYJCXDGI-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical group C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- ADOFEJQZDCWAIL-UHFFFAOYSA-N propyl 2-ethoxyacetate Chemical compound CCCOC(=O)COCC ADOFEJQZDCWAIL-UHFFFAOYSA-N 0.000 description 1
- WNRUCCDVMDOUHC-UHFFFAOYSA-N propyl 2-hydroxy-3-methylbutanoate Chemical compound CCCOC(=O)C(O)C(C)C WNRUCCDVMDOUHC-UHFFFAOYSA-N 0.000 description 1
- FIABMSNMLZUWQH-UHFFFAOYSA-N propyl 2-methoxyacetate Chemical compound CCCOC(=O)COC FIABMSNMLZUWQH-UHFFFAOYSA-N 0.000 description 1
- CYIRLFJPTCUCJB-UHFFFAOYSA-N propyl 2-methoxypropanoate Chemical compound CCCOC(=O)C(C)OC CYIRLFJPTCUCJB-UHFFFAOYSA-N 0.000 description 1
- IYVPXMGWHZBPIR-UHFFFAOYSA-N propyl 3-ethoxypropanoate Chemical compound CCCOC(=O)CCOCC IYVPXMGWHZBPIR-UHFFFAOYSA-N 0.000 description 1
- KNCDNPMGXGIVOM-UHFFFAOYSA-N propyl 3-hydroxypropanoate Chemical compound CCCOC(=O)CCO KNCDNPMGXGIVOM-UHFFFAOYSA-N 0.000 description 1
- JCMFJIHDWDKYIL-UHFFFAOYSA-N propyl 3-methoxypropanoate Chemical compound CCCOC(=O)CCOC JCMFJIHDWDKYIL-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、少なくとも2層以
上の記録層を有する多層光記録ディスクにおいて、記録
層の形成と両面の基板を貼り合わせる接着剤の機能を兼
ね備えた光硬化性樹脂組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable resin composition having a function of an adhesive for forming a recording layer and bonding substrates on both sides in a multilayer optical recording disc having at least two recording layers. About.
【0002】[0002]
【従来技術】近年、光記録メディアの中でも大容量の情
報記録を可能にしたDVD(デジタル・ビデオ・ディス
クまたはデジタル・バーサタイル・ディスク)が、CD
(コンパクトディスク)に代わる記録メディアとなって
いる。現在のDVDは2枚のディスクを貼り合わせる構
造になっており、その接着剤としてはホットメルト接着
剤、ラジカル系またはカチオン系の光硬化型接着剤が使
用されており、接着剤としての機能だけであった。2. Description of the Related Art In recent years, DVDs (digital video discs or digital versatile discs) capable of recording a large amount of information among optical recording media have been replaced by CDs.
It is a recording medium that can replace (compact disc). The current DVD has a structure in which two discs are bonded together, and a hot-melt adhesive, a radical-based or a cationic light-curable adhesive is used as the adhesive, and only functions as an adhesive. Met.
【0003】最近、記録容量を増加させるために2層乃
至5層の記録層を持つDVDが提案されている。このD
VDには、記録層を形成する成型性と両面基板を貼り合
わせる接着剤としての機能を有する透明性に優れる樹脂
が必要となり、ホットメルト樹脂、ラジカルUV型樹脂、
カチオンUV型樹脂が提案されている。ホットメルト樹脂
は、熱可塑性樹脂であるため記録層の成型性には適して
おり、透明性の要求も満たしているが、塗布および成型
時に溶融させる熱による基板の変形、高温時の寸法安定
性および接着性に問題がある。ラジカル系の光硬化型樹
脂は、硬化収縮率が大きいために十分な接着強度が得ら
れない問題のほかに、硬化膜が堅いために記録層の成型
性には適していない。また、透明性も十分でない。カチ
オン系の光硬化型樹脂は、硬化収縮が小さく接着力は期
待できるが、ラジカル系の光硬化樹脂同様に硬化膜が堅
いために記録層の成型性には適しておらず、透明性も十
分でない。Recently, DVDs having two to five recording layers have been proposed to increase the recording capacity. This D
VD requires a resin having excellent moldability for forming a recording layer and an excellent transparency functioning as an adhesive for bonding a double-sided substrate, such as a hot melt resin, a radical UV type resin,
Cationic UV-type resins have been proposed. Hot melt resin is suitable for moldability of the recording layer because it is a thermoplastic resin, and satisfies the requirements for transparency.However, deformation of the substrate due to heat applied during coating and molding, dimensional stability at high temperatures And there is a problem in adhesion. The radical-type photocurable resin is not suitable for moldability of the recording layer because the cured film is hard, in addition to the problem that sufficient adhesive strength cannot be obtained due to a large curing shrinkage. Further, transparency is not sufficient. Cationic photocurable resins have low curing shrinkage and can be expected to have adhesive strength, but are not suitable for moldability of the recording layer because of the rigidity of the cured film, similar to radical photocurable resins, and have sufficient transparency. Not.
【0004】[0004]
【発明が解決しようとする課題】本発明は、2層乃至5
層の記録層を持った光記録ディスクに関して、記録層を
形成する成型性と両面基板を貼り合わせる接着剤として
の機能を有し、さらに波長380乃至800nmの領域
において吸収をもたない光ディスク用光硬化性樹脂組成
物を提供するものである。SUMMARY OF THE INVENTION The present invention provides two layers to five layers.
Optical recording disk having a recording layer having two layers has a moldability for forming the recording layer and a function as an adhesive for bonding a double-sided substrate, and has no absorption in a wavelength range of 380 to 800 nm. A curable resin composition is provided.
【0005】[0005]
【課題を解決するための手段】本発明者らは前記の課題
を解決すべく、種々検討した結果、記録層を形成する成
型性と両面基板を貼り合わせる接着剤としての機能を有
し、さらに波長380乃至800nmの領域において吸
収をもたない光硬化性樹脂組成物を見いだした。Means for Solving the Problems The present inventors have conducted various studies in order to solve the above-mentioned problems, and as a result, have a moldability for forming a recording layer and a function as an adhesive for bonding a double-sided substrate. A photocurable resin composition having no absorption in the wavelength range of 380 to 800 nm was found.
【0006】即ち、本発明は、以下の(1)乃至(7)
を提供するものである。 (1)2層以上からなる多層光記録ディスクの記録層を
形成する樹脂組成物であって、(A)カチオン重合性モ
ノマー、(B)ガラス転移温度(Tg)が、20℃以下
であるカチオン重合性共重合体、(C)光開始剤、を含
有することを特徴とする光ディスク用光硬化性樹脂組成
物。 (2)(A)カチオン重合性モノマーが、分子中にオキ
セタン環およびまたはオキシラン環を有する化合物また
は混合物であることを特徴とする(1)に記載の光記録
ディスク用光硬化性樹脂組成物。 (3)(A)カチオン重合性モノマー中のオキシラン環
を有する化合物が、ビスフェノール型グリシジルエーテ
ル、脂環式エポキシ化合物、脂肪族グリシジルエーテル
中から選ばれる1種類以上の化合物であることを特徴と
する(2)に記載の光記録ディスク用光硬化性樹脂組成
物。 (4)(B)カチオン重合性共重合体が、オキセタニル
(メタ)アクリレートおよびまたはグリシジル(メタ)
アクリレートを含有したアクリル共重合体であることを
特徴とする(1)に記載の光記録ディスク用光硬化性樹
脂組成物。 (5)(C)光開始剤が、オニウム塩であることを特徴
とする(1)乃至(4)のいずれかに記載の光記録ディ
スク用光硬化性樹脂組成物。 (6)樹脂組成物の含有割合が、 (A)カチオン重合性モノマー 30乃至69.7質量%、 (B)カチオン重合性共重合体 63乃至30質量%、 (C)光開始剤 7乃至0.3質量%、 であることを特徴とする(1)乃至(5)のいずれかに
記載の光ディスク用光硬化性樹脂組成物。 (7)(1)乃至(6)のいずれかに記載の光硬化樹脂
組成物を用いて得られる光記録ディスク。That is, the present invention provides the following (1) to (7)
Is provided. (1) A resin composition for forming a recording layer of a multilayer optical recording disk comprising two or more layers, wherein (A) a cationically polymerizable monomer, and (B) a cation having a glass transition temperature (Tg) of 20 ° C. or lower. A photocurable resin composition for an optical disc, comprising a polymerizable copolymer and (C) a photoinitiator. (2) The photocurable resin composition for an optical recording disk according to (1), wherein the (A) cationic polymerizable monomer is a compound or a mixture having an oxetane ring and / or an oxirane ring in a molecule. (3) (A) The compound having an oxirane ring in the cationically polymerizable monomer is at least one compound selected from bisphenol-type glycidyl ether, alicyclic epoxy compound, and aliphatic glycidyl ether. The photocurable resin composition for an optical recording disk according to (2). (4) (B) the cationically polymerizable copolymer is oxetanyl (meth) acrylate and / or glycidyl (meth)
The photocurable resin composition for optical recording disks according to (1), which is an acrylic copolymer containing acrylate. (5) The photocurable resin composition for an optical recording disk according to any one of (1) to (4), wherein the photoinitiator (C) is an onium salt. (6) The content of the resin composition is (A) 30 to 69.7% by mass of a cationically polymerizable monomer, (B) 63 to 30% by mass of a cationically polymerizable copolymer, and (C) a photoinitiator of 7 to 0. The photocurable resin composition for an optical disc according to any one of (1) to (5), wherein the composition is: 3% by mass. (7) An optical recording disk obtained by using the photocurable resin composition according to any one of (1) to (6).
【0007】[0007]
【発明の実施の形態】以下本願発明の2層以上からなる
多層光記録ディスクの記録層を形成する樹脂組成物につ
いて説明する。 [光ディスク用光硬化性樹脂組成物]本発明の光硬化性樹
脂組成物は、(A)カチオン重合性モノマー、(B)カ
チオン重合性共重合体、(C)光開始剤を含有するもの
である。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a resin composition for forming a recording layer of a multilayer optical recording disk comprising two or more layers according to the present invention will be described. [Photocurable Resin Composition for Optical Disc] The photocurable resin composition of the present invention comprises (A) a cationically polymerizable monomer, (B) a cationically polymerizable copolymer, and (C) a photoinitiator. is there.
【0008】本発明に用いられる(A)カチオン重合性
モノマーは、特に限定するものではないが、分子中にオ
キセタン環およびまたはオキシラン環を有する化合物ま
たは混合物であることが好ましい。オキセタン環を有す
る化合物の使用量は、(A)カチオン重合性モノマー中
の5乃至80質量%であることが好ましく、10乃至5
0質量%が更に好ましい。使用量が5質量%以上とする
ことで硬化性が向上して短時間硬化を可能にする。使用
量を80質量%以下とすることで高温時の接着性を向上
する。オキシラン環を有する化合物の使用量は、20乃
至95質量%であることが好ましく、30乃至85質量
%が更に好ましい。使用量が20質量%以上であると高
温時の接着性を向上させ、95質量%以下とすることで
硬化性を向上させ、短時間の硬化を可能にする。The cationic polymerizable monomer (A) used in the present invention is not particularly limited, but is preferably a compound or a mixture having an oxetane ring and / or an oxirane ring in the molecule. The amount of the compound having an oxetane ring to be used is preferably 5 to 80% by mass of (A) the cationically polymerizable monomer, and is preferably 10 to 5% by mass.
0 mass% is more preferred. By setting the amount to be 5% by mass or more, the curability is improved and curing can be performed in a short time. When the amount is 80% by mass or less, the adhesion at high temperatures is improved. The amount of the compound having an oxirane ring is preferably 20 to 95% by mass, more preferably 30 to 85% by mass. When the amount is 20% by mass or more, the adhesiveness at a high temperature is improved, and when the amount is 95% by mass or less, the curability is improved, and the curing can be performed in a short time.
【0009】樹脂組成物中における(A)カチオン重合
性モノマーの使用量は、30乃至69.7質量%が好ま
しい。使用量が30質量%以上であると硬化性が高くな
り、69.7質量%以下であると樹脂粘度が低下して塗
布適性が向上する。The amount of the cationic polymerizable monomer (A) used in the resin composition is preferably 30 to 69.7% by mass. When the amount is 30% by mass or more, the curability is increased. When the amount is 69.7% by mass or less, the resin viscosity is reduced and the coating suitability is improved.
【0010】以下、(A)カチオン重合性モノマーにつ
いて詳細に説明する。 <オキセタン環を有する重合性モノマー>本願発明に用
いられる、オキセタン環を有する重合性モノマーは、分
子中にオキセタン環を1乃至5個有しており、380乃
至800nmの波長領域で吸収を持たない化合物であれ
ば特に限定されるものではない。Hereinafter, (A) the cationically polymerizable monomer will be described in detail. <Polymerizable monomer having an oxetane ring> The polymerizable monomer having an oxetane ring used in the present invention has 1 to 5 oxetane rings in the molecule and has no absorption in a wavelength region of 380 to 800 nm. It is not particularly limited as long as it is a compound.
【0011】オキセタン環を1個有する重合性モノマー
の具体例としては、3−エチル−3−ヒドロキシメチル
オキセタン、3−(メタ)アリルオキシメチル−3−エ
チルオキセタン、(3−エチル−3−オキセタニルメト
キシ)メチルベンゼン、4−フルオロ−〔1−(3−エ
チル−3−オキセタニルメトキシ)メチル〕ベンゼン、
4−メトキシ−〔1−(3−エチル−3−オキセタニル
メトキシ)メチル〕ベンゼン、〔1−(3−エチル−3
−オキセタニルメトキシ)エチル〕フェニルエーテル、
イソブトキシメチル(3−エチル−3−オキセタニルメ
チル)エーテル、イソボルニルオキシエチル(3−エチ
ル−3−オキセタニルメチル)エーテル、イソボルニル
(3−エチル−3−オキセタニルメチル)エーテル、2
−エチルヘキシル(3−エチル−3−オキセタニルメチ
ル)エーテル、エチルジエチレングリコール(3−エチ
ル−3−オキセタニルメチル)エーテル、ジシクロペン
タジエン(3−エチル−3−オキセタニルメチル)エー
テル、ジシクロペンテニルオキシエチル(3−エチル−
3−オキセタニルメチル)エーテル、ジシクロペンテニ
ルエチル(3−エチル−3−オキセタニルメチル)エー
テル、テトラヒドロフルフリル(3−エチル−3−オキ
セタニルメチル)エーテル、テトラブロモフェニル(3
−エチル−3−オキセタニルメチル)エーテル、2−テ
トラブロモフェノキシエチル(3−エチル−3−オキセ
タニルメチル)エーテル、トリブロモフェニル(3−エ
チル−3−オキセタニルメチル)エーテル、2−トリブ
ロモフェノキシエチル(3−エチル−3−オキセタニル
メチル)エーテル、2−ヒドロキシエチル(3−エチル
−3−オキセタニルメチル)エーテル、2−ヒドロキシ
プロピル(3−エチル−3−オキセタニルメチル)エー
テル、ブトキシエチル(3−エチル−3−オキセタニル
メチル)エーテル、ペンタクロロフェニル(3−エチル
−3−オキセタニルメチル)エーテル、ペンタブロモフ
ェニル(3−エチル−3−オキセタニルメチル)エーテ
ル、ボルニル(3−エチル−3−オキセタニルメチル)
エーテル等が挙げられる。Specific examples of the polymerizable monomer having one oxetane ring include 3-ethyl-3-hydroxymethyloxetane, 3- (meth) allyloxymethyl-3-ethyloxetane, (3-ethyl-3-oxetanyl) Methoxy) methylbenzene, 4-fluoro- [1- (3-ethyl-3-oxetanylmethoxy) methyl] benzene,
4-methoxy- [1- (3-ethyl-3-oxetanylmethoxy) methyl] benzene, [1- (3-ethyl-3
-Oxetanylmethoxy) ethyl] phenyl ether,
Isobutoxymethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyloxyethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyl (3-ethyl-3-oxetanylmethyl) ether, 2
-Ethylhexyl (3-ethyl-3-oxetanylmethyl) ether, ethyldiethylene glycol (3-ethyl-3-oxetanylmethyl) ether, dicyclopentadiene (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyloxyethyl (3 -Ethyl-
3-oxetanylmethyl) ether, dicyclopentenylethyl (3-ethyl-3-oxetanylmethyl) ether, tetrahydrofurfuryl (3-ethyl-3-oxetanylmethyl) ether, tetrabromophenyl (3
-Ethyl-3-oxetanylmethyl) ether, 2-tetrabromophenoxyethyl (3-ethyl-3-oxetanylmethyl) ether, tribromophenyl (3-ethyl-3-oxetanylmethyl) ether, 2-tribromophenoxyethyl ( 3-ethyl-3-oxetanylmethyl) ether, 2-hydroxyethyl (3-ethyl-3-oxetanylmethyl) ether, 2-hydroxypropyl (3-ethyl-3-oxetanylmethyl) ether, butoxyethyl (3-ethyl- 3-oxetanylmethyl) ether, pentachlorophenyl (3-ethyl-3-oxetanylmethyl) ether, pentabromophenyl (3-ethyl-3-oxetanylmethyl) ether, bornyl (3-ethyl-3-oxetanylmethyl)
Ether and the like.
【0012】オキセタン環を2個有する重合性モノマー
の具体例としては、1,4−ビス{〔(3−エチル−3
−オキセタニル)メトキシ〕メチル}ベンゼン、ビス
{〔(1−エチル)3−オキセタニル〕メチル}エーテ
ル、1,4−ビス〔(3−エチル−3−オキセタニル)
メトキシ〕ベンゼン、1,3−ビス〔(3−エチル−3
−オキセタニル)メトキシ〕ベンゼン、3,7−ビス
(3−オキセタニル)−5−オキサ−ノナン、1,4−
ビス〔(3−エチル−3−オキセタニルメトキシ)メチ
ル〕ベンゼン、1,2−ビス〔(3−エチル−3−オキ
セタニルメトキシ)メチル〕エタン、1,2−ビス
〔(3−エチル−3−オキセタニルメトキシ)メチル〕
プロパン、エチレングリコールビス(3−エチル−3−
オキセタニルメチル)エーテル、ジシクロペンテニルビ
ス(3−エチル−3−オキセタニルメチル)エーテル、
トリエチレングリコールビス(3−エチル−3−オキセ
タニルメチル)エーテル、テトラエチレングリコールビ
ス(3−エチル−3−オキセタニルメチル)エーテル、
トリシクロデカンジイルジメチレンビス(3−エチル−
3−オキセタニルメチル)エーテル、1,4−ビス
〔(3−エチル−3−オキセタニルメトキシ)メチル〕
ブタン、1,6−ビス〔(3−エチル−3−オキセタニ
ルメトキシ)メチル〕ヘキサン、ポリエチレングリコー
ルビス(3−エチル−3−オキセタニルメチル)エーテ
ル、EO変性ビスフェノールAビス(3−エチル−3−
オキセタニルメチル)エーテル、PO変性ビスフェノー
ルAビス(3−エチル−3−オキセタニルメチル)エー
テル、EO変性水添ビスフェノールAビス(3−エチル
−3−オキセタニルメチル)エーテル、PO変性水添ビ
スフェノールAビス(3−エチル−3−オキセタニルメ
チル)エーテル、EO変性ビスフェノールFビス(3−
エチル−3−オキセタニルメチル)エーテル等が挙げら
れる。Specific examples of the polymerizable monomer having two oxetane rings include 1,4-bis {[(3-ethyl-3
-Oxetanyl) methoxy] methyl} benzene, bis {[(1-ethyl) 3-oxetanyl] methyl} ether, 1,4-bis [(3-ethyl-3-oxetanyl)
Methoxy] benzene, 1,3-bis [(3-ethyl-3
-Oxetanyl) methoxy] benzene, 3,7-bis (3-oxetanyl) -5-oxa-nonane, 1,4-
Bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 1,2-bis [(3-ethyl-3-oxetanylmethoxy) methyl] ethane, 1,2-bis [(3-ethyl-3-oxetanyl) Methoxy) methyl
Propane, ethylene glycol bis (3-ethyl-3-
Oxetanylmethyl) ether, dicyclopentenylbis (3-ethyl-3-oxetanylmethyl) ether,
Triethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether,
Tricyclodecanediyl dimethylenebis (3-ethyl-
3-oxetanylmethyl) ether, 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl]
Butane, 1,6-bis [(3-ethyl-3-oxetanylmethoxy) methyl] hexane, polyethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol A bis (3-ethyl-3-
Oxetanylmethyl) ether, PO-modified bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol Abis (3 -Ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F bis (3-
Ethyl-3-oxetanylmethyl) ether and the like.
【0013】オキセタン環を3乃至5個有する重合性モ
ノマーの具体例としては、トリメチロールプロパントリ
ス(3−エチル−3−オキセタニルメチル)エーテル、
ペンタエリスリトールトリス(3−エチル−3−オキセ
タニルメチル)エーテル、ペンタエリスリトールテトラ
キス(3−エチル−3−オキセタニルメチル)エーテ
ル、ジペンタエリスリトールペンタキス(3−エチル−
3−オキセタニルメチル)エーテル等が挙げられる。Specific examples of the polymerizable monomer having 3 to 5 oxetane rings include trimethylolpropane tris (3-ethyl-3-oxetanylmethyl) ether,
Pentaerythritol tris (3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis (3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol pentakis (3-ethyl-)
3-oxetanylmethyl) ether and the like.
【0014】<オキシラン環を有する重合性モノマー>
本願発明に用いられる、オキシラン環を有する重合性モ
ノマーは、分子中にオキシラン環を1乃至4個有する化
合物であれば特に限定されるものではない。重合性モノ
マーについて具体例を挙げて説明する。エポキシ基を1
個有する化合物としてはフェニルグリシジルエーテル、
ブチルグリシジルエーテル等があり、エポキシ基を2個
以上有する化合物としては、ヘキサンジオールジグリシ
ジルエーテル、テトラエチレングリコールジグリシジル
エーテル、トリメチロールプロパントリグリシジルエー
テル、ビスフェノールAジグリシジルエーテル等が挙げ
られる。また、3,4−エポキシシクロヘキシルメチル
−3,4−エポキシシクロヘキサンカルボキシレート、
ビス−(3,4−エポキシシクロヘキシル)アジペート
等の脂環式エポキシも挙げられる。これらのカチオン重
合性モノマーは単独で使用しても2種類以上組み合わせ
て使用しても構わない。<Polymerizable monomer having oxirane ring>
The polymerizable monomer having an oxirane ring used in the present invention is not particularly limited as long as it is a compound having 1 to 4 oxirane rings in the molecule. The polymerizable monomer will be described with a specific example. 1 epoxy group
Phenyl glycidyl ether,
There are butyl glycidyl ether and the like, and examples of the compound having two or more epoxy groups include hexanediol diglycidyl ether, tetraethylene glycol diglycidyl ether, trimethylolpropane triglycidyl ether, and bisphenol A diglycidyl ether. 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate;
Alicyclic epoxies such as bis- (3,4-epoxycyclohexyl) adipate are also included. These cationically polymerizable monomers may be used alone or in combination of two or more.
【0015】<カチオン重合性共重合体>次に(B)カ
チオン重合性共重合体について詳細に説明する。本願発
明に用いられる、(B)カチオン重合性共重合体は、ガ
ラス転移温度(Tg)が、20℃以下であれば、特に限
定しないが、オキセタン環、オキシラン環を有するアク
リルモノマーを使用してポリマー中にカチオン性重合基
を導入した、オキセタニル(メタ)アクリレートおよび
またはグリシジル(メタ)アクリレート等のアクリル共
重合体であることが好ましい。その他共重合可能なコポ
リマーとしては、これらモノマーと共重合可能であり、
380乃至800nmの波長領域で吸収のない透明性の
高いモノマーであれば特に限定されない。具体例として
は、メチル(メタ)アクリレート、エチル(メタ)アク
リレート、プロピル(メタ)アクリレート、ブチル(ア
クリレート)、2−エチルヘキシル(メタ)アクリレー
ト、アミル(メタ)アクリレート、ヘキサデシル(メ
タ)アクリレート、オクタデシル(メタ)アクリレー
ト、ブトキシエチル(メタ)アクリレート、フェノキシ
エチル(メタ)アクリレート、2−ヒドロキシエチル
(メタ)アクリレート等を挙げることができる。これら
は、単独で使用しても2種類以上組み合わせても使用す
ることが可能である。(B)カチオン重合性共重合体中
のオキセタニル(メタ)アクリレートおよびグリシジル
(メタ)アクリレートの含有量は10質量%乃至50質
量%が好ましい。10質量%以上であると十分な接着強
度が得られ、50質量%以下であると硬化後の塗膜が十
分に可撓性を有しており、スタンパーの剥離性が良好で
ある。<Cationically polymerizable copolymer> Next, (B) the cationically polymerizable copolymer will be described in detail. The (B) cationically polymerizable copolymer used in the present invention is not particularly limited as long as the glass transition temperature (Tg) is 20 ° C. or lower, but is not limited to using an acrylic monomer having an oxetane ring and an oxirane ring. It is preferable to use an acrylic copolymer such as oxetanyl (meth) acrylate and / or glycidyl (meth) acrylate in which a cationic polymer group is introduced into the polymer. Other copolymerizable copolymers are copolymerizable with these monomers,
The monomer is not particularly limited as long as it is a highly transparent monomer having no absorption in a wavelength range of 380 to 800 nm. Specific examples include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (acrylate), 2-ethylhexyl (meth) acrylate, amyl (meth) acrylate, hexadecyl (meth) acrylate, and octadecyl ( Examples thereof include (meth) acrylate, butoxyethyl (meth) acrylate, phenoxyethyl (meth) acrylate, and 2-hydroxyethyl (meth) acrylate. These can be used alone or in combination of two or more. (B) The content of oxetanyl (meth) acrylate and glycidyl (meth) acrylate in the cationically polymerizable copolymer is preferably from 10% by mass to 50% by mass. When the content is 10% by mass or more, sufficient adhesive strength is obtained, and when the content is 50% by mass or less, the cured coating film has sufficient flexibility, and the removability of the stamper is good.
【0016】共重合体の合成方法は特に限定しないが、
通常公知のラジカル溶液重合による合成を行なう。
(B)カチオン重合性共重合体のガラス転位温度(以
下、Tg)は、20℃以下であれば良く、好ましくは0
℃以下である。Tgが20℃以下であると記録層をスタ
ンパーにて熱圧成型する際に精度の高いパターン転写性
を得ることができる。また、このカチオン重合性共重合
体の分子量は、ゲルパーミエーションクロマトグラフィ
ー(GPC)で測定したポリスチレン換算の数平均分子
量で2000乃至20000が好ましい。さらに好まし
くは、4000乃至15000である。数平均分子量が
2000乃至20000であると良好な塗布性が得られ
る。Although the method for synthesizing the copolymer is not particularly limited,
Usually, synthesis is performed by known radical solution polymerization.
(B) The glass transition temperature (hereinafter, Tg) of the cationically polymerizable copolymer may be 20 ° C. or lower, preferably 0 ° C.
It is below ° C. When Tg is 20 ° C. or less, highly accurate pattern transferability can be obtained when the recording layer is hot-pressed with a stamper. The molecular weight of this cationically polymerizable copolymer is preferably from 2,000 to 20,000 in terms of polystyrene equivalent number average molecular weight measured by gel permeation chromatography (GPC). More preferably, it is 4000 to 15000. When the number average molecular weight is 2,000 to 20,000, good coating properties can be obtained.
【0017】樹脂組成物中におけるカチオン重合性共重
合体の使用量は、30乃至63質量%が好ましい。使用
量が30質量乃至63質量%であると塗布適性が向上す
る。The amount of the cationically polymerizable copolymer used in the resin composition is preferably from 30 to 63% by mass. When the used amount is 30% by mass to 63% by mass, coating suitability is improved.
【0018】<(C)光開始剤>次に(C)光開始剤に
ついて詳細に説明する本発明の(C)光開始剤は、光に
より、(A)および(B)成分のカチオン重合を開始す
る化合物であれば特に限定はなく、いずれでも使用する
ことができる。光カチオン開始剤の好ましい例としてオ
ニウム塩を挙げることができる。このオニウム塩は、光
反応し、ルイス酸を放出する化合物である。 具体的に
は下記一般式(1)で表わされるものである。<(C) Photoinitiator> The (C) photoinitiator of the present invention, which will be described in detail below, is used for the cationic polymerization of the components (A) and (B) by light. There is no particular limitation as long as it is a starting compound, and any compound can be used. Preferred examples of the photocationic initiator include onium salts. This onium salt is a compound that reacts with light and releases a Lewis acid. Specifically, it is represented by the following general formula (1).
【0019】 [R1 aR2 bR3 cR4 dW]m+[MXn+m]m- (1) (式中、カチオンはオニウムイオンであり、Wは、S、
Se、Te、P、As、Sb、Bi、O、I、Br、C
l、またはN≡Nである。R1、R2、R3、およびR4は
同一または異なる有機基であり、a、b、cおよびdは
それぞれ0〜3の整数であって、(a+b+c+d)は
Wの価数に等しい。Mは、ハロゲン化錯体[MXn+m]
の中心原子を構成する金属またはメタロイドであり、例
えば、B、P、As、Sb、Fe、Sn、Bi、Al、
Ca、In、Ti、Zn、Sc、V、Cr、Mn、Co
等である。Xは例えば、F、Cl、Br等のハロゲン原
子であり、mはハロゲン化物錯体イオンの正味の電荷で
あり、nはMの原子価である。)[R 1 a R 2 b R 3 c R 4 d W] m + [MX n + m ] m− (1) (where the cation is an onium ion, and W is S,
Se, Te, P, As, Sb, Bi, O, I, Br, C
1 or N≡N. R 1 , R 2 , R 3 , and R 4 are the same or different organic groups, a, b, c, and d are each an integer of 0 to 3, and (a + b + c + d) is equal to the valence of W. M is a halogenated complex [MX n + m ]
Metal or metalloid constituting the central atom of, for example, B, P, As, Sb, Fe, Sn, Bi, Al,
Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co
And so on. X is, for example, a halogen atom such as F, Cl, or Br; m is the net charge of the halide complex ion; and n is the valence of M. )
【0020】一般式(1)においてオニウムイオンの具
体例としては、ジフェニルヨードニウム、4−メトキシ
ジフェニルヨードニウム、ビス(4−メチルフェニル)
ヨードニウム、ビス(4−tert−ブチルフェニル)
ヨードニウム、ビス(ドデシルフェニル)ヨードニウ
ム、トリフェニルスルホニウム、ジフェニル−4−チオ
フェノキシフェニルスルホニウム、ビス〔4−(ジフェ
ニルスルフォニオ)−フェニル〕スルフィド、ビス〔4
−(ジ(4−(2−ヒドロキシエチル)フェニル)スル
ホニオ)−フェニル〕スルフィド、η5−2,4−(シ
クロペンタジェニル)〔1,2,3,4,5,6−η−
(メチルエチル)ベンゼン〕−鉄(1+)等が挙げられ
る。In the general formula (1), specific examples of the onium ion include diphenyliodonium, 4-methoxydiphenyliodonium, bis (4-methylphenyl)
Iodonium, bis (4-tert-butylphenyl)
Iodonium, bis (dodecylphenyl) iodonium, triphenylsulfonium, diphenyl-4-thiophenoxyphenylsulfonium, bis [4- (diphenylsulfonio) -phenyl] sulfide, bis [4
- (di (4- (2-hydroxyethyl) phenyl) sulfonio) - phenyl] sulfide, eta 5-2,4-(cyclopentadienyl) [1,2,3,4,5,6-.eta.
(Methylethyl) benzene] -iron (1+).
【0021】一般式(1)において陰イオンの具体例と
しては、テトラフルオロボレート、ヘキサフルオロホス
フェート、ヘキサフルオロアンチモネート、ヘキサフル
オロアルセネート、ヘキサクロロアンチモネート等が挙
げられる。In the general formula (1), specific examples of the anion include tetrafluoroborate, hexafluorophosphate, hexafluoroantimonate, hexafluoroarsenate, hexachloroantimonate and the like.
【0022】これらの光カチオン開始剤は、1種単独で
あるいは2種以上を組み合わせて使用することができ
る。本発明の樹脂組成物における(C)成分の含有割合
は、好ましくは0.3乃至7質量%であり、更に好まし
くは、0.3〜3質量%である。(C)成分の含有割合
0.3質量%以上であるとより樹脂組成物の硬化状況が
良好となり、7質量%以下とすることにより、硬化過程
および硬化後に開始剤の溶出を低減することができる。These photocationic initiators can be used alone or in combination of two or more. The content ratio of the component (C) in the resin composition of the present invention is preferably from 0.3 to 7% by mass, and more preferably from 0.3 to 3% by mass. When the content of the component (C) is 0.3% by mass or more, the curing state of the resin composition becomes better, and when the content is 7% by mass or less, the elution of the initiator during the curing process and after curing can be reduced. it can.
【0023】また、本発明の組成物には必要に応じてそ
の他の添加剤を使用することができる。 <他の樹脂成分>他の樹脂成分としては、例えば、ポリ
アミド、ポリアミドイミド、ポリウレタン、ポリブタジ
エン、ポリクロロプレン、ポリエーテル、ポリエステ
ル、スチレン−ブタジェン−スチレンブロック共重合
体、石油樹脂、キシレン樹脂、ケトン樹脂、セルロース
樹脂、フッ素系オリゴマー、シリコン系オリゴマー、ポ
リスルフィド系オリゴマー等が挙げられる。これらは、
1種単独でも複数種を組み合わせて使用してもよい。Further, other additives can be used in the composition of the present invention, if necessary. <Other resin components> Examples of other resin components include polyamide, polyamideimide, polyurethane, polybutadiene, polychloroprene, polyether, polyester, styrene-butadiene-styrene block copolymer, petroleum resin, xylene resin, and ketone resin. , Cellulose resin, fluorine-based oligomer, silicon-based oligomer, polysulfide-based oligomer, and the like. They are,
One kind may be used alone, or two or more kinds may be used in combination.
【0024】<改質剤>改質剤としては、例えば、重合
開始助剤、老化防止剤、レベリング剤、濡れ性改良剤、
密着付与剤、界面活性剤、可塑剤、紫外線吸収剤等が挙
げられる。これらは、1種単独でも複数種を組み合わせ
て使用してもよい。<Modifier> Examples of the modifier include a polymerization initiator, an antioxidant, a leveling agent, a wettability improver,
Examples include an adhesion promoter, a surfactant, a plasticizer, and an ultraviolet absorber. These may be used alone or in combination of two or more.
【0025】<希釈剤>希釈剤は、塗布性付与又はその
向上のために用いることができる。希釈剤としては通常
有機溶剤が用いられる。この有機溶剤の物性に特に限定
はないが1atmにおける沸点が200℃以下の化合物
または混合物が好ましく、沸点が150℃以下であるこ
とが更に好ましく、70℃以上130℃以下が更に好ま
しい。<Diluent> The diluent can be used for imparting coatability or improving the coatability. As a diluent, an organic solvent is usually used. The physical properties of the organic solvent are not particularly limited, but a compound or a mixture having a boiling point of 200 ° C. or lower at 1 atm is preferable, a boiling point of 150 ° C. or lower is more preferable, and a temperature of 70 ° C. to 130 ° C. is more preferable.
【0026】これら希釈剤は単独でまたは2種類以上を
組み合わせて用いることができ、その使用量は特に限定
されず、塗布適性に応じてその量を選定する。These diluents can be used alone or in combination of two or more. The amount of the diluent is not particularly limited, and the amount is selected according to the suitability for application.
【0027】これらとしては、アルコール類、グリコー
ルエーテル類、エチレングリコールエーテルアセテート
類、芳香族炭化水素類、ケトン類、エステル類、エーテ
ル類等が挙げられる。これらの化合物の具体例としては
以下のものが挙げられる。These include alcohols, glycol ethers, ethylene glycol ether acetates, aromatic hydrocarbons, ketones, esters, ethers and the like. Specific examples of these compounds include the following.
【0028】アルコール類としては例えばメタノール、
エタノール、プロパノール、ブタノール等が挙げられ
る。 グリコールエーテル類としては例えばエチレング
リコールモノメチルエーテル、エチレングリコールモノ
エチルエーテル、エチレングリコールモノブチルエーテ
ル、プロピレングリコールモノメチルエーテル、3−メ
トキシブタノール、3−メチル−3−メトキシブタノー
ル等が挙げられる。Examples of alcohols include methanol,
Ethanol, propanol, butanol and the like can be mentioned. Examples of glycol ethers include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, 3-methoxybutanol, 3-methyl-3-methoxybutanol, and the like.
【0029】エチレングリコールエーテルアセテート類
としては例えば、エチレングリコールモノエチルエーテ
ルアセテート、エチレングリコールモノブチルエーテル
アセテート、プロピレングリコールモノメチルエーテル
アセテート、3−メトキシブチルアセテート、3−メチ
ル−3−メトキシブチルアセテート、エチルエトキシプ
ロピオラート等が挙げられる。Examples of the ethylene glycol ether acetates include ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, and ethyl ethoxypro Piolate and the like.
【0030】芳香族炭化水素類としてはトルエン、キシ
レン等が挙げられる。ケトン類としてはメチルエチルケ
トン、シクロヘキサノン、4−ヒドロキシー4−メチル
−2−ペンタノン等が挙げられる。Examples of the aromatic hydrocarbons include toluene, xylene and the like. Ketones include methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone and the like.
【0031】エステル類としては酢酸メチル、酢酸エチ
ル、酢酸プロピル、酢酸ブチル、2−ヒドロキシ−2−
メチルプロピオン酸メチル、2−ヒドロキシ−2−メチ
ルプロピオン酸エチル、ヒドロキシ酢酸メチル、ヒドロ
キシ酢酸エチル、ヒドロキシ酢酸ブチル、乳酸メチル、
乳酸エチル、乳酸ブチル、3−ヒドロキシプロピオン酸
メチル、3−ヒドロキシプロピオン酸エチル、3−ヒド
ロキシプロピオン酸プロピル、3−ヒドロキシプロピオ
ン酸ブチル、2−ヒドロキシ−3−メチルブタン酸プロ
ピル、メトキシ酢酸メチル、メトキシ酢酸エチル、メト
キシ酢酸プロピル、メトキシ酢酸ブチル、エトキシ酢酸
メチル、エトキシ酢酸エチル、エトキシ酢酸プロピル、
エトキシ酢酸ブチル、2−メトキシプロピオン酸メチ
ル、2−メトキシプロピオン酸エチル、2−メトキシプ
ロピオン酸プロピル、2−メトキシプロピオン酸ブチ
ル、2−エトキシプロピオン酸メチル、2−エトキシプ
ロピオン酸エチル、2−エトキシプロピオン酸プロピ
ル、2−エトキシプロピオン酸ブチル、3−メトキシプ
ロピオン酸メチル、3−メトキシプロピオン酸エチル、
3−メトキシプロピオン酸プロピル、3−メトキシプロ
ピオン酸ブチル、3−エトキシプロピオン酸メチル、3
−エトキシプロピオン酸エチル、3−エトキシプロピオ
ン酸プロピル、3−エトキシプロピオン酸ブチル等が挙
げられる。エーテル類としてはテトラヒドロフラン等が
挙げられる。As esters, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, 2-hydroxy-2-
Methyl methyl propionate, ethyl 2-hydroxy-2-methylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl hydroxyacetate, methyl lactate,
Ethyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, propyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, methoxyacetic acid Ethyl, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate,
Butyl ethoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, 2-ethoxypropion Propyl acetate, butyl 2-ethoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate,
Propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, 3
-Ethyl ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate and the like. Examples of ethers include tetrahydrofuran.
【0032】[樹脂組成物の調整]本発明の光ディスク用
光硬化性樹脂組成物は、各組成物を均一に混合し、粘度
が25℃において0.01乃至500Pa・sになるよ
うに調製する。0.01〜500Pa・sの粘度範囲は
塗布作業性がより効率的に実施できる。粘度範囲は、
0.1〜100Pa・sであることがより好ましい。粘
度は、(A)カチオン重合性モノマーと(B)カチオン
重合性共重合体との割合で調整でき、希釈剤の使用も可
能である。[Adjustment of Resin Composition] The photocurable resin composition for an optical disk of the present invention is prepared by uniformly mixing the respective compositions and having a viscosity of 0.01 to 500 Pa · s at 25 ° C. . In the viscosity range of 0.01 to 500 Pa · s, the coating workability can be more efficiently performed. The viscosity range is
The pressure is more preferably 0.1 to 100 Pa · s. The viscosity can be adjusted by the ratio of (A) the cationically polymerizable monomer and (B) the cationically polymerizable copolymer, and a diluent can be used.
【0033】[記録層および光記録ディスク形成方法]本
発明において記録層の形成方法は、まず粘度調整した本
発明組成物をポリカーボネート製等の透明基板上に、 ・スピンコート方法により均一に塗布、 ・スクリーン印刷により均一に塗布、 ・予め準備しておいた離型紙上に塗布後、希釈剤を蒸発
させて均一な膜を形成し、透明基板上に転写させるなど
の方法により透明基板上に透明な組成物の薄膜を形成す
る。透明基板はポリカーボネートの他にトリアセチルセ
ルロース、ポリメチルメタクリレート、ポリエチレンテ
レフタレート等のポリエステル樹脂、ポリアリレート樹脂
等の芳香族ポリエステル樹脂等の使用も可能である。[Method of Forming Recording Layer and Optical Recording Disc] In the present invention, the method of forming the recording layer is as follows. First, the composition of the present invention, whose viscosity has been adjusted, is uniformly coated on a transparent substrate made of polycarbonate or the like by spin coating.・ Apply evenly by screen printing ・ After applying on release paper prepared in advance, diluent is evaporated to form a uniform film, and it is transparent on the transparent substrate by a method such as transferring to a transparent substrate To form a thin film of a suitable composition. As the transparent substrate, a polyester resin such as triacetyl cellulose, polymethyl methacrylate, or polyethylene terephthalate, or an aromatic polyester resin such as a polyarylate resin can be used in addition to polycarbonate.
【0034】次に、ニッケル製等のスタンパーを使用し
て上記組成物の薄膜に記録層を転写する。この際、数P
aで加圧する。その状態で透明基板面から光を照射し、
本発明組成物の薄膜を硬化させて記録層とする。Next, the recording layer is transferred to a thin film of the above composition using a stamper made of nickel or the like. At this time, the number P
Pressurize with a. In that state, irradiate light from the transparent substrate surface,
The thin film of the composition of the present invention is cured to form a recording layer.
【0035】ここで使用できる光源としては、所定の作
業時間内で硬化させることができるものであればいずれ
でも良い。通常、紫外線光、可視光の範囲の光が照射で
きる光源を用いられ、具体的には、低圧水銀灯、高圧水
銀灯、キセノンランプ、メタルハライド灯等が挙げられ
る。また、通常の照射光量は、200乃至3000mJ
/cm2である。照射量の上限は特にはないが、過多で
ある場合には不要なエネルギーを浪費し生産性が低下す
るので好ましくない。The light source that can be used here may be any light source that can be cured within a predetermined working time. Usually, a light source capable of emitting light in the range of ultraviolet light and visible light is used, and specific examples thereof include a low-pressure mercury lamp, a high-pressure mercury lamp, a xenon lamp, and a metal halide lamp. In addition, the normal irradiation light amount is 200 to 3000 mJ.
/ Cm 2 . There is no particular upper limit to the irradiation amount, but an excessive amount is not preferable because unnecessary energy is wasted and productivity is reduced.
【0036】その後、スタンパーを取り外し、記録層の
表面に酸化ケイ素をスパッタリングして透明反射層を形
成し、その後に同じ記録層形成過程を繰り返す。目的と
する層数を形成させた後、透明基板を貼り合わせて、光
記録ディスクが完成する。Thereafter, the stamper is removed, silicon oxide is sputtered on the surface of the recording layer to form a transparent reflective layer, and then the same recording layer forming process is repeated. After forming the desired number of layers, a transparent substrate is attached to complete the optical recording disk.
【0037】[0037]
【実施例】以下、実施例、比較例により本発明を更に詳
細に説明する。 <カチオン重合性共重合体1の合成>冷却管、2つのフ
ィード口、温度計を備えたセパラブルフラスコにトルエ
ン200gを仕込み窒素でパージする。攪拌下120℃
に昇温後、フィード口1よりパーブチルオクタノエイト
6gとn−ドデシルメルカプタン0.4g、フィード口
2よりグリシジルメタアクリレート40g、メチルメタ
クリレート40g、2−エチルヘキシルアクリレート1
20gの混合液をそれぞれ4時間で連続フィードする。
パーブチルオクタノエイト1g添加後、120℃にて3
時間重合を継続してカチオン重合性共重合体1(固形分
50.8%のトルエン溶液)を得た。このカチオン重合
性共重合体1の数平均分子量は8000(GPC:ポリ
スチレン換算)、Tgは−32℃(粘弾性測定装置)で
あった。The present invention will be described below in more detail with reference to Examples and Comparative Examples. <Synthesis of Cationic Polymerizable Copolymer 1> 200 g of toluene was charged into a separable flask equipped with a cooling tube, two feed ports, and a thermometer, and purged with nitrogen. 120 ° C under stirring
6 g of perbutyl octanoate and 0.4 g of n-dodecyl mercaptan from the feed port 1, 40 g of glycidyl methacrylate, 40 g of methyl methacrylate, and 2-ethylhexyl acrylate 1 from the feed port 2.
20 g of the mixture are each continuously fed for 4 hours.
After addition of 1 g of perbutyl octanoate,
The polymerization was continued for a period of time to obtain a cationically polymerizable copolymer 1 (a toluene solution having a solid content of 50.8%). The number average molecular weight of this cationically polymerizable copolymer 1 was 8000 (GPC: in terms of polystyrene), and Tg was −32 ° C. (viscoelasticity measuring device).
【0038】<カチオン重合性共重合体2乃至5の合成
>表1に示す組成としたこと以外は、カチオン重合性共
重合体1の合成方法と同様にしてカチオン重合性共重合
体2乃至5を合成した。<Synthesis of Cationic Polymerizable Copolymers 2 to 5> The cationic polymerizable copolymers 2 to 5 were prepared in the same manner as in the method of synthesizing the cationic polymerizable copolymer 1 except that the compositions shown in Table 1 were used. Was synthesized.
【0039】(実施例1)3−エチル−3−ヒドロキシ
メチルオキセタン30g、カチオン重合性共重合体1を
70g、ジフェニル−4−チオフェノキシフェニルスル
ホニウム1gを褐色ガラス容器中にて攪拌混合して組成
物1を得た。組成物1を離型紙に塗布後、80℃、30
分間乾燥してトルエンを蒸発させ膜厚40μmの均一な
フィルムを形成し、以下評価1−4に使用した。Example 1 30 g of 3-ethyl-3-hydroxymethyloxetane, 70 g of the cationically polymerizable copolymer 1 and 1 g of diphenyl-4-thiophenoxyphenylsulfonium were stirred and mixed in a brown glass container. The product 1 was obtained. After the composition 1 was applied to release paper,
After drying for a minute, the toluene was evaporated to form a uniform film having a thickness of 40 μm, which was used in Evaluations 1-4 below.
【0040】(評価方法) [1 光透過度試験]フィルム化した組成物1をポリカ
ーボネート基板に転写した後、ポリカーボネート基板を
貼り合わせ紫外線を照射(高圧水銀ランプ:トスキュア
251(東芝ライテック製))して硬化させた。貼り合
わせた基板を紫外−可視分光光度計にて380nm乃至
800nmの透過度を測定し、透過率の最も低い値とそ
の波長を表2に示した。 [2 スタンパ−による成型性評価試験]フィルム化し
た組成物1をポリカーボネート基板に転写した後、ニッ
ケル製のスタンパを使用して圧力0.5MPa、50℃
でパターンを転写させた。ニッケルスタンパは凹凸差1
80nmのものを使用した。ポリカーボネート基板面よ
り紫外線を照射(高圧水銀ランプ:トスキュア251
(東芝ライテック製))して硬化させ、スタンパ剥離後
に組成物1に形成したパターンをAFM(原子間力顕微
鏡)で観察してスタンパの凹凸差と比較して成型性を%
表示で表した。結果を表2に示した。 [3 接着力試験]フィルム化した組成物1をポリカー
ボネート基板に転写した後、ポリカーボネートを貼り合
わせ、紫外線を照射(高圧水銀ランプ:トスキュア25
1(東芝ライテック製))して硬化させた。貼り合わせ
ポリカーボネート基板のピール強度を測定した。結果を
表2に示した。 [4 スタンパー剥離性試験]評価方法3同様にスタン
パーで記録層を形成、硬化後にスタンパを剥がした際の
剥離のし易さを以下の3段階で評価した。 ○ 外観に異常がなく容易に剥離できた △ ディスクに歪みはないが、剥離が困難であった × ディスクに歪みが発生した 結果を表2に示した。(Evaluation method) [1 Light transmittance test] After transferring composition 1 in the form of a film to a polycarbonate substrate, the polycarbonate substrate was bonded and irradiated with ultraviolet rays (high-pressure mercury lamp: Toskure 251 (manufactured by Toshiba Lighting & Technology)). And cured. The transmittance of the bonded substrates was measured at 380 nm to 800 nm using an ultraviolet-visible spectrophotometer, and the lowest value of the transmittance and the wavelength thereof are shown in Table 2. [2 Moldability evaluation test by stamper] After transferring the composition 1 formed into a film onto a polycarbonate substrate, the pressure was set to 0.5 MPa and 50 ° C using a nickel stamper.
Was used to transfer the pattern. Nickel stamper is uneven 1
The thing of 80 nm was used. Irradiation of ultraviolet light from the polycarbonate substrate surface (high-pressure mercury lamp: Toskure 251
(Manufactured by Toshiba Lighting & Technology)) and cured, and the pattern formed on the composition 1 after the stamper was peeled off was observed with an AFM (atomic force microscope).
Displayed. The results are shown in Table 2. [3 Adhesion Test] After transferring the composition 1 in the form of a film to a polycarbonate substrate, the polycarbonate was bonded and irradiated with ultraviolet rays (high-pressure mercury lamp: Toscure 25).
1 (manufactured by Toshiba Lighting & Technology)). The peel strength of the bonded polycarbonate substrate was measured. The results are shown in Table 2. [4 Stamper Peelability Test] In the same manner as in Evaluation Method 3, a recording layer was formed with a stamper, and the ease of peeling when the stamper was peeled off after curing was evaluated in the following three grades. ○ The disk was easily peeled without any abnormality in appearance. △ The disk was not distorted, but the disk was difficult to peel. × The disk was distorted. The results are shown in Table 2.
【0041】(実施例2−10)表2に示す配合組成と
したこと以外は実施例1に従い組成物を得て、その評価
を行った。結果を表2に示す。(Example 2-10) A composition was obtained according to Example 1 except that the composition shown in Table 2 was used, and the composition was evaluated. Table 2 shows the results.
【0042】[0042]
【表1】 [Table 1]
【0043】[0043]
【表2】 [Table 2]
【0044】<ウレタンアクリレートオリゴマーの合成
>温度計、フィード口、攪拌機を備えたセパラブルフラ
スコにイソホロンジイソシアネート100g、ジラウリ
ル酸ジ−n−ブチルスズ0.4gを仕込み、乾燥空気雰
囲気下20℃一定として2−ヒドロキシエチルアクリレ
ート50gを1時間でフィードする。その後、水酸基価
109.7mgKOH/gのポリテトラメチレングリコ
ール240gを一括で添加する。50℃で3時間反応さ
せた後、数平均分子量2000のオリゴマーを合成し
た。<Synthesis of urethane acrylate oligomer> 100 g of isophorone diisocyanate and 0.4 g of di-n-butyltin dilaurate were charged into a separable flask equipped with a thermometer, a feed port and a stirrer, and kept at 20 ° C. in a dry air atmosphere at a constant temperature. -Feed 50 g of hydroxyethyl acrylate in one hour. Thereafter, 240 g of polytetramethylene glycol having a hydroxyl value of 109.7 mgKOH / g is added all at once. After reacting at 50 ° C. for 3 hours, an oligomer having a number average molecular weight of 2,000 was synthesized.
【0045】(比較例1−5)表3に示す配合組成とし
た以外は実施例1と同様に組成物を得て、その評価を行
った。結果を表3に示す。(Comparative Example 1-5) A composition was obtained and evaluated in the same manner as in Example 1, except that the composition shown in Table 3 was used. Table 3 shows the results.
【0046】[0046]
【表3】 [Table 3]
【0047】[0047]
【発明の効果】本発明組成物は、成型性と両面透明基板
を貼り合わせる接着剤としての機能を有し、さらに波長
380乃至800nmの領域において吸収をもたない透
明性に優れた材料を提供することを可能にした。The composition of the present invention has a moldability and a function as an adhesive for bonding a double-sided transparent substrate, and further provides a material having excellent transparency without absorption in a wavelength range of 380 to 800 nm. Made it possible.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) G11B 7/24 522 G11B 7/24 522Y 522P (72)発明者 山本 祐五 神奈川県横浜市栄区笠間町1190番地 三井 化学株式会社内 Fターム(参考) 4J036 AB01 AB02 AB10 AD08 AJ09 AJ24 AK11 DB30 FB03 GA01 GA03 GA07 HA02 JA15 4J100 AL08P AL10P BC53P CA01 CA04 HA19 HA53 HC38 HC39 HE22 HE41 JA36 5D029 JB13 KB07 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI theme coat ゛ (Reference) G11B 7/24 522 G11B 7/24 522Y 522P (72) Inventor Yugo Yamamoto 1190 Kasama-cho, Sakae-ku, Yokohama-shi, Kanagawa Address F-term in Mitsui Chemicals, Inc. (reference) 4J036 AB01 AB02 AB10 AD08 AJ09 AJ24 AK11 DB30 FB03 GA01 GA03 GA07 HA02 JA15 4J100 AL08P AL10P BC53P CA01 CA04 HA19 HA53 HC38 HC39 HE22 HE41 JA36 5D029 JB13 KB07
Claims (7)
記録層を形成する樹脂組成物であって、(A)カチオン
重合性モノマー、(B)ガラス転移温度(Tg)が、2
0℃以下であるカチオン重合性共重合体、(C)光開始
剤、を含有することを特徴とする光ディスク用光硬化性
樹脂組成物。1. A resin composition for forming a recording layer of a multilayer optical recording disk comprising two or more layers, wherein (A) a cationically polymerizable monomer and (B) a glass transition temperature (Tg) of 2
A photocurable resin composition for an optical disc, comprising: a cationically polymerizable copolymer having a temperature of 0 ° C. or lower; and (C) a photoinitiator.
中にオキセタン環およびまたはオキシラン環を有する化
合物または混合物であることを特徴とする請求項1に記
載の光記録ディスク用光硬化性樹脂組成物。2. The photocurable resin composition for an optical recording disk according to claim 1, wherein (A) the cationically polymerizable monomer is a compound or a mixture having an oxetane ring and / or an oxirane ring in the molecule. object.
シラン環を有する化合物が、ビスフェノール型グリシジ
ルエーテル、脂環式エポキシ化合物、脂肪族グリシジル
エーテル中から選ばれる1種類以上の化合物であること
を特徴とする請求項2に記載の光記録ディスク用光硬化
性樹脂組成物。3. The compound having an oxirane ring in the cationic polymerizable monomer (A) is at least one compound selected from bisphenol glycidyl ether, alicyclic epoxy compound and aliphatic glycidyl ether. The photocurable resin composition for an optical recording disk according to claim 2.
セタニル(メタ)アクリレートおよびまたはグリシジル
(メタ)アクリレートを含有したアクリル共重合体であ
ることを特徴とする請求項1に記載の光記録ディスク用
光硬化性樹脂組成物。4. The optical recording according to claim 1, wherein the cationic polymerizable copolymer (B) is an acrylic copolymer containing oxetanyl (meth) acrylate and / or glycidyl (meth) acrylate. Photocurable resin composition for disks.
とを特徴とする請求項1乃至4のいずれかに記載の光記
録ディスク用光硬化性樹脂組成物。5. The photocurable resin composition for an optical recording disk according to claim 1, wherein the photoinitiator (C) is an onium salt.
載の光ディスク用光硬化性樹脂組成物。6. The content of the resin composition is (A) 30 to 69.7% by mass of a cationically polymerizable monomer, (B) 63 to 30% by mass of a cationically polymerizable copolymer, and (C) a photoinitiator 7. The photocurable resin composition for an optical disk according to any one of claims 1 to 5, wherein the content is from 0.1 to 0.3% by mass.
の光硬化樹脂組成物を用いて得られる光記録ディスク。7. An optical recording disk obtained by using the photocurable resin composition according to claim 1.
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JP2000228119A JP2002037855A (en) | 2000-07-28 | 2000-07-28 | Photocurable resin composition for photorecording disk |
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Cited By (2)
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---|---|---|---|---|
CN100430156C (en) * | 2005-06-06 | 2008-11-05 | 精碟科技股份有限公司 | Organic medium coating method |
CN108485184A (en) * | 2018-02-11 | 2018-09-04 | 东莞爱的合成材料科技有限公司 | One kind can be used for clinical medical thermostable transparent photosensitive resin and preparation method thereof |
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JPH11116903A (en) * | 1997-10-20 | 1999-04-27 | Sekisui Chem Co Ltd | Light curable adhesive sheet |
JPH11185291A (en) * | 1997-10-14 | 1999-07-09 | Sony Corp | Storage medium, its manufacturing method and manufacturing device |
JPH11315132A (en) * | 1998-05-07 | 1999-11-16 | Dainippon Ink & Chem Inc | UV curable composition for optical disc and optical disc using the same |
JP2000290488A (en) * | 1999-04-07 | 2000-10-17 | Toagosei Co Ltd | Production of cationic curable composition |
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2000
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JPH11185291A (en) * | 1997-10-14 | 1999-07-09 | Sony Corp | Storage medium, its manufacturing method and manufacturing device |
JPH11116903A (en) * | 1997-10-20 | 1999-04-27 | Sekisui Chem Co Ltd | Light curable adhesive sheet |
JPH11315132A (en) * | 1998-05-07 | 1999-11-16 | Dainippon Ink & Chem Inc | UV curable composition for optical disc and optical disc using the same |
JP2000290488A (en) * | 1999-04-07 | 2000-10-17 | Toagosei Co Ltd | Production of cationic curable composition |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN100430156C (en) * | 2005-06-06 | 2008-11-05 | 精碟科技股份有限公司 | Organic medium coating method |
CN108485184A (en) * | 2018-02-11 | 2018-09-04 | 东莞爱的合成材料科技有限公司 | One kind can be used for clinical medical thermostable transparent photosensitive resin and preparation method thereof |
CN108485184B (en) * | 2018-02-11 | 2020-11-24 | 东莞爱的合成材料科技有限公司 | A kind of high temperature resistant transparent photosensitive resin which can be used in clinical medicine and preparation method thereof |
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