JP2002009495A - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

(57) Abstract: Provided is an electronic component mounting apparatus and a mounting method in which a board recognition camera is appropriately arranged for a transfer head provided with a plurality of nozzles, and complete calibration data can be obtained. thing. SOLUTION: In an electronic component mounting apparatus in which electronic components are picked up by a transfer head 9 from a plurality of tape feeders 5 arranged in parallel in a supply unit 4 and mounted on a substrate, a plurality of suction nozzles are provided in the transfer head 9. X at a given basic pitch
Nozzle rows L1 and L2 arranged in series in the direction are provided. The board recognition camera 17 moves integrally with the transfer head 9 and is arranged on a straight line substantially coinciding with the nozzle row L1.
The calibration data of the X-axis table 6 and the Y-axis table 7 is obtained by imaging the calibration board. This makes it possible to completely cover the calibration target range.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art A mounting apparatus for mounting electronic components on a substrate is provided with a supply section in which a number of parts feeders such as a tape feeder for storing the electronic components are arranged in parallel. Thereby, the mounting operation of picking up the electronic component and transferring it to the substrate is repeatedly performed. This mounting operation is performed by moving the transfer head by a moving means such as an XY table. However, a moving axis constituting the XY table has a mechanical error due to a pitch error of a ball screw or the like.

For this reason, a movement command value from a controller that issues a movement command to each axis does not always coincide with an actual movement reaching position, and each position on the substrate has a unique position shift. In order to correct this displacement, the mounting apparatus performs calibration for previously obtaining a unique displacement amount for each mounting point on the board. That is, when starting up the apparatus or performing maintenance, an image of the calibration substrate having calibration measurement points arranged in a lattice is captured by a substrate recognition camera, and the position of each measurement point detected by this imaging is controlled. By comparing the position with the position on the data, a position shift unique to each mounting point is obtained. Then, in the actual mounting operation, the moving means is driven by correcting these positional deviation amounts.

[0004]

By the way, in recent years, a mounting head provided with a plurality of nozzles has been used in many cases because of a demand for improvement of mounting efficiency. The above-described calibration is performed also when using the multiple-nozzle transfer head. However, when performing calibration using a camera for board recognition provided in such a multiple transfer head, complete calibration data is obtained depending on the position of the camera on the transfer head. Was not possible.

Accordingly, the present invention provides an electronic component mounting apparatus and a mounting method in which a board recognition camera is appropriately arranged for a transfer head provided with a plurality of nozzles, and complete calibration data can be obtained. With the goal.

[0006]

According to a first aspect of the present invention, an electronic component mounting apparatus picks up an electronic component by a transfer head from a plurality of parts feeders arranged in parallel in a supply section of the electronic component and mounts the electronic component on a substrate. An electronic component mounting apparatus, comprising a plurality of nozzle rows each including a plurality of suction nozzles for sucking and holding an electronic component arranged in series at a predetermined basic pitch in a direction in which the parts feeders are arranged. The mounting head and the substrate that move integrally with the transfer head and are disposed closer to the head mounting base than on a straight line substantially coincident with the nozzle row on the supply unit side of the nozzle row or on a straight line of the nozzle row. Imaging means for imaging.

According to a second aspect of the present invention, there is provided a method of mounting an electronic component, wherein the electronic component is picked up by a transfer head from a plurality of parts feeders arranged in parallel in a supply section of the electronic component and mounted on a substrate. A movement for moving a transfer head having a plurality of nozzle rows provided by arranging a plurality of suction nozzles for sucking and holding electronic components at predetermined basic pitches in series in the direction in which the parts feeders are arranged. Means that moves integrally with the transfer head and is arranged closer to the head mounting base than on a straight line substantially coincident with the nozzle row on the supply unit side of the nozzle row or on a straight line of the nozzle row to image the substrate. Moving the imaging unit to perform imaging of the calibration substrate, and obtaining calibration data of the moving unit based on the imaging result. .

According to the present invention, the moving means for moving the transfer head provided with a plurality of nozzle rows each including a plurality of suction nozzles arranged in series in the direction in which the parts feeders are arranged in parallel at a predetermined basic pitch. The calibration is performed by moving the imaging unit arranged on the head mounting base side from a straight line substantially coincident with the nozzle row on the supply unit side of the nozzle row or from the straight line of the nozzle row to image the calibration substrate. It is possible to capture an image by completely covering the target range.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention. FIG. 2 is a perspective view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention.
3A is a front view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 3B is a side view of the transfer head of the electronic component mounting apparatus of one embodiment of the present invention. FIG. 4 is a sectional view of a suction nozzle unit of the electronic component mounting apparatus according to one embodiment of the present invention. FIG. 5 is a partial detailed view of the suction nozzle unit of the electronic component mounting apparatus of one embodiment of the present invention. ,
FIG. 6 is a partial cross-sectional view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention, FIG. 7 is a partial perspective view of the transfer head of the electronic component mounting apparatus of one embodiment of the present invention, FIG. 8 is an explanatory diagram of calibration in the electronic component mounting method according to one embodiment of the present invention.

First, the overall structure of an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is provided in an electronic component mounting apparatus 1, and the transport path 2 transports and positions a substrate 3 on which electronic components are mounted. A supply unit 4 for electronic components is disposed on the side of the transport path 2, and a tape feeder 5 as a number of parts feeders is arranged in the supply unit 4.

An X-axis table 6 and a Y-axis table 7 are arranged above the supply section 4 and the transport path 2. The X-axis table 6 and the Y-axis table 7 have feed screws 8X and 8Y and drive motors MX and MY, respectively, and the Y-axis drive motor MY
, The X-axis table 6 moves in the Y direction. A transfer head 9 is mounted on the X-axis table 6, and the transfer head 9 picks up an electronic component from the tape feeder 5 of the supply unit 4 and transfers the electronic component onto the substrate 3 positioned on the transport path 2. The X-axis table 6 and the Y-axis table 7 are moving means for horizontally moving the transfer head 9.

A line camera 10 for recognizing electronic components is provided between the transport path 2 and the supply unit 4, and a transfer head 9 that picks up electronic components from the supply unit 4 passes over the line camera 10. At this time, the line camera 10 images the electronic component from below. Then, by performing image processing on the obtained imaging data, recognition of the electronic component is performed. That is, the line camera 10 is a recognition unit that recognizes the electronic component held by the suction nozzle of the transfer head 9 from below.

Next, the transfer head 9 will be described with reference to FIGS. As shown in FIGS. 2 and 3, the transfer head 9 is a multiple head in which a plurality of suction nozzles move integrally, and the suction nozzles are integrated with a lifting mechanism and a suction mechanism on a common vertical base 11. A plurality of suction nozzle units 12 are arranged in parallel. In the example shown in the present embodiment, two nozzle rows in which four suction nozzle units 12 are arranged in series in the X direction (the direction in which the tape feeders 5 are arranged) are arranged in two rows in the Y direction. ing.

By adopting such an arrangement of the suction nozzle units 12, compared to a conventional multiple nozzle type transfer head in which a plurality of suction nozzles are arranged in series in a single row, the transfer head in the X direction is used. Can be significantly shortened. Therefore, the stroke of the transfer head in the X direction can be shortened to reduce the device space.
Also, since the number of nozzles arranged in series decreases,
Accumulation of pitch error between each nozzle can be suppressed,
As will be described later, it is possible to reduce problems caused by positional deviation when performing simultaneous pickup of a plurality of components.

As shown in FIG. 3, a guide rail 13a is provided on the side surface of the frame 6a of the X-axis table 6 in a horizontal direction, and a slider 13b slidably fitted to the guide rail 13a is provided on a base portion. 11. A nut 14 screwed to the feed screw 8X is fixed to the base 11, and when the feed screw 8X is rotationally driven by the X-axis drive motor MX, the base 11 moves horizontally in the X direction. Thereby, the plurality of suction nozzle units 12 move integrally.

The structure of the transfer head 9 will be described. A box-shaped upper frame 15 and a lower frame 16 having a variable cross section are fixedly provided on the side surface of the base portion 11. On the upper surface of the upper frame 15, a nozzle elevating motor 20 constituting the suction nozzle unit 12 is vertically disposed.
The rotation of the nozzle elevating motor 20 is transmitted to an elevating mechanism 25 provided below the upper frame 15, where the rotational movement of the nozzle elevating motor 20 is converted into a vertical movement of the elevating shaft member 30. Control unit 39 controls these nozzle elevating motors 20
, The suction nozzles of the transfer head 9 can be individually moved up and down with variable strokes.

In the transfer head 9 having a plurality of suction nozzles as described above, the suction nozzles are individually moved up and down with variable strokes, so that it is not necessary to perform the lifting operation on the entire transfer head 9. Therefore, the driving load of the lifting mechanism can be reduced as compared with the conventional mechanism for lifting and lowering the entire transfer head 9, and the lifting and lowering operation of the suction nozzle in the mounting operation is made a single operation of only one driving system. Can reduce the mounting tact time.

The elevating shaft member 30 is provided with a shaft rotating portion 32, and rotation is transmitted to the shaft rotating portion 32 via endless belts 51a and 51b by a nozzle rotating motor 50 fixed to the lower frame 16. You. Thus, the elevating shaft member 30 rotates around the axis. The lower end of the elevating shaft member 30 is connected to a nozzle head 37 through a swivel portion 36, and a suction tool 38 having a reflection plate 38a and a suction portion 38b is detachably mounted on the nozzle head 37. . That is, the suction tool 38 is attached to the lower end of the elevating shaft member 30.

The swivel unit 36 is connected to a vacuum suction device.
Vacuum suction is performed from the lower end of the suction portion 38b while allowing the suction tool 38 to rotate around the axis. Then, the suction tool 38 sucks and holds the electronic component by performing vacuum suction with the electronic component in contact with the lower end. The reflection plate 38a
At the time of imaging by the line camera 10, the illumination light emitted from below is reflected to transmit and illuminate the electronic component held by the suction unit 38b.

Next, the structure of the suction nozzle unit 12 will be described with reference to FIGS. In FIG. 4, a top plate 15a of the upper frame 15 has a shaft hole 15 of the nozzle elevating motor 20.
c is provided, and a rotary shaft 20a on which the coupling member 21 is mounted is inserted into the shaft hole 15c. The shaft member 15 of the elevating mechanism 25 is provided in the shaft hole 15c and the shaft hole 15d provided in the bottom plate 15b of the upper frame 15.
2 are supported by bearings 24a and 24b, respectively. At the upper end of the housing member 22, FIG.
A slit 22a is provided as shown in FIG.
The slit 22a has a flat tooth portion 21 of the coupling member 21.
a is fitted. Therefore, when the rotation shaft 21a rotates, the housing member 22 also rotates.

The housing member 22 is provided with an inner hole 22b penetrating vertically, and the lower part of the inner hole 22b communicates with a mounting hole 22c in which a nut member 26 is fitted as shown in FIG. are doing. Nut member 2 in mounting hole 22c
6 are fitted, and the color plate 43 is pressed by the pressing member 41 via the ring 42 made of an elastic material, whereby the nut member 26 is sandwiched by the stepped portion indicated by the arrow in FIG. Fixed to

A feed screw 23 for inserting the inner hole 22b is screwed into the nut member 26. A lower end of the feed screw 23 has a holding member 27 for holding a bearing 28 from above and below.
29, it is rotatably connected to the elevating shaft member 30. Therefore, by driving the nozzle elevating motor 20, the nut member 2 fixed to the housing member 22 is
6 rotates. The nozzle elevating motor 20 includes a nut member 26
Is a driving means for driving the rotation. This causes the feed screw 23 to move up and down, and this up and down movement is
Is transmitted to the elevating shaft member 30 connected to the
And the elevating shaft member 30 move up and down together. At this time, relative rotation of the elevating shaft member 30 with respect to the feed screw 23 is allowed by the bearing 28.

A spring member 31 is mounted on the outer periphery of the elevating shaft member 30, and the spring member 31 contacts the holding member 29 to transmit an upward urging force. This urging force is further transmitted to the feed screw 23 via the holding member 27. Accordingly, when the nut member 26 rotates to move the feed screw 23 up and down, the feed screw 23 moves up and down while being pressed in the axial direction against the nut member 26, and the feed screw 23 moves with the nut member 26. Rotation is prevented. That is, the spring member 31 serves as a rotation stopping means for preventing the feed screw 23 from rotating.

A shaft hole 16a provided in the lower frame 16
As shown in FIG. 5C, the bearings 45a, 45
The housing member 44 is pivotally supported via b. The housing member 44 is provided with an inner hole 44a penetrating vertically, and a mounting hole 44b provided below the inner hole 44a.
Is fitted with a slide guide 35. The elevating shaft member 30 is inserted through the slide guide 35 while restraining the displacement in the rotation direction. That is, when the housing member 44 is rotated, the elevating shaft member 30 is also rotated.

The upper part of the housing member 44 is the shaft rotating part 32 to which rotation is transmitted from the nozzle rotating motor 50. The shaft rotating unit 32 is provided with a transmission pulley unit 33 and an idler pulley unit 34. The transmission pulley portion 33 includes a pulley 33a fixed to the housing member 44, and rotation is transmitted to the housing member 44 by an endless belt 51a tuned to the pulley 33a.

On the other hand, a pulley 34b provided on the idler pulley portion 34 is mounted on a housing member 44 via a bearing 34a. Therefore, the rotation is not transmitted to the housing member 44 from the endless belt 51b tuned to the idler pulley portion 34, and the rotation is simply transmitted to the endless belt 5b.
It functions only as an idler for guiding 1b.

Here, the arrangement of the nozzle rows in the transfer head 9 and the nozzle rotation motor 50 for rotating the suction nozzles of each nozzle row will be described. As shown in FIGS. 6 and 7, the transfer head 9 is provided with a first nozzle row L1 and a second nozzle row L2 each including four suction nozzles in order from the X-axis table 6 side, that is, from the supply unit 4 side. Have been. A nozzle rotation motor 50 is disposed at an intermediate position between the first nozzle row L1 on the supply unit 4 side and the second nozzle row L2 on the substrate 3 side. The nozzle rotation motor 50 is a single θ rotation drive unit that rotates the suction nozzles of each nozzle row around the nozzle axis.

The rotation of each suction nozzle by the nozzle rotation motor 50 is performed by the two endless belts 51a and 51b tuned in upper and lower two stages according to the pulley position of the shaft rotation unit 32 as shown in FIGS. Each of the nozzle rows is rotationally driven by the nozzle rotation motor 50 via one of the endless belts. That is, as shown in FIG. 6A, the lower endless belt 51a includes four suction nozzles of the second nozzle row L2, and as shown in FIG. 6B, the upper endless belt 51a.
b drives each of the four suction nozzles of the first nozzle row L1 to rotate. A tension pulley 53 is provided at each of the upper and lower stages so that the belt tension can be adjusted.

Here, the type of the shaft rotating portion 32 of each suction nozzle unit 12 will be described. As shown in FIG. 6C, there are four types of combinations of the transmission pulley portion 33 and the idler pulley portion 34 of the shaft rotating portion 32, types A to D. Each of the nozzle rows L1 and L2 has these four types. The types are arranged in combination.

Type A is a type in which a pulley 33a is mounted on an upper stage and a pulley 34b is mounted on a lower stage via a bearing 34a. Type B is a type in which a pulley 33a is mounted on an upper stage and only the bearing 34a is mounted on a lower stage. is there. The type C and the type D have a configuration in which the upper stage and the lower stage of the types B and A are exchanged. Then, the first nozzle row L1,
As shown in FIG. 6, the second nozzle row L2 converts the types A to D into (A, B, B, A), (D, C, C,
D).

By adopting such a configuration and arrangement of the shaft rotating unit 32, the endless belt 51 is attached to the transmission pulley 33a mounted on each shaft of the nozzle row to be rotationally driven.
In addition to abutting the tooth surfaces of a and 51b, it is possible to use the shaft rotating part 32 of another nozzle row as a guide idler. Here, the endless belts 51a, 51
Only the pulley 34b is used at the position guided on the tooth surface side of 1b, and only the bearing 34a is used at the position guided on the rear surface side. As can be seen from FIG. 6, since the arrangement of the transmission pulley portion and the idler pulley portion in the upper stage and the lower stage are symmetrical, it is possible to use the endless belts 51a and 51b of the same length in each of the upper and lower stages. Management of maintenance parts is easy.

As described above, by rotating the nozzle shafts of a plurality of suction nozzles of the same nozzle row with one endless belt, it is possible to perform high-precision θ rotation with a small rotation transmission error and to achieve compactness. A multi-nozzle transfer head is realized. Further, in the above configuration, by disposing the nozzle rotation motor 50 of the θ-axis rotation means at an intermediate position of each nozzle row, the symmetry in the transmission arrangement is ensured, and the projecting portion of the transfer head 9 from the X-axis table 6 is provided. The mass moment of the motor can be reduced as much as possible, and the occurrence of vibration during driving can be suppressed to enable high-speed driving.

Next, the arrangement of the camera 17 for substrate recognition in the transfer head 9 will be described. As shown in FIG.
The transfer head 9 includes a camera 17 that moves integrally. The camera 17 is provided with a nozzle row on the supply unit 4 side, that is, a first nozzle.
The nozzles are arranged on the same straight line as the nozzle row L1. By driving the X-axis table 6 and the Y-axis table 7, the camera 17 horizontally moves integrally with the transfer head 9, and images the substrate 3 positioned on the transport path 2 to recognize the position of the substrate 3. I do. The camera 17 serves as an imaging unit for imaging the substrate 3. By arranging the camera 17 as described above, the following advantages can be obtained when the Y-axis table 7 is driven to move the camera 17 in the Y direction and image the substrate 3.

The electronic component mounting apparatus is configured as described above. Hereinafter, mounting of the electronic component by the mounting apparatus will be described. First, the calibration performed at the time of starting the mounting apparatus or at the time of maintenance and inspection will be described. This calibration is performed by the transfer head 9 when the X-axis table 6 and the Y-axis table 7 are driven by the control data at the positions on the control data of the respective mounting points on the substrate 3 positioned on the transport path 2. The error from the position to actually reach is obtained in advance.

In the calibration, a calibration board is used in which measurement points for calibration are provided in a grid pattern with high positional accuracy, and the camera 17 for board recognition is moved over the measurement points of the calibration board. To obtain the calibration data of the X-axis table 6 and the Y-axis table 7. That is, first, the calibration substrate 3 'is placed on the transport path 2 as shown in FIG. Then, the X-axis table 6 and the Y-axis table 7 are driven to move the camera 17 onto the calibration substrate 3 'positioned at a predetermined position, and sequentially image the measurement points Pi to recognize the positions of the measurement points Pi. I do.

At this time, the movement of the camera 17 is controlled on the control data so that the origin 0 of the optical coordinate system coincides with the center of the measurement point Pi.
Because of the mechanical error between the X-axis table 6 and the Y-axis table 7, the origin 0 does not always coincide with the center of the measurement point Pi.
As shown in (b), the measurement point Pi of the calibration board 3 ′ is Δx with respect to the origin 0 of the optical coordinate system.
The displacement of i, Δyi is detected. This displacement is
Generally, due to a mechanical error of the X-axis table 6 and the Y-axis table 7, each point in the moving range shows a unique value. Therefore, a correct mounting position can be obtained by previously obtaining this positional deviation as a unique position error for each point and correcting the position by the unique position error for each mounting point during mounting operation.

Camera 1 in the above calibration
When the camera 17 captures an image of the measurement point Pym having the largest amount of movement in the Y direction on the calibration board 3 ′ in the imaging of each measurement point Pi by the camera 7, the camera 17 operates in the same manner as the first nozzle row L1 as described above. Since the measurement points Pym are arranged on a straight line, the movement range in the Y direction in the movement for imaging the measurement point Pym is the same as the movement range in the actual mounting operation at the farthest point in the Y direction. Therefore, the pitch error of the feed screw 8Y is detected in all the moving ranges in the mounting operation.

FIG. 8C shows the transfer head 9 for reference.
4 shows a state at the time of calibration when the camera 17 is arranged in the second nozzle row L2. In this case, even in a state where the camera 17 is positioned on the measurement point Pym, the actual required movement range of the feed screw 8Y, that is, the first nozzle row L1 is the farthest point (the farthest point at the end of the substrate 3 in the Y direction). The Y-axis movement range required to move to the mounting point near the measurement point Pym) is not covered, and complete calibration data for the Y-axis has not been obtained.

On the other hand, the camera 17 is connected to the first nozzle row L
The above-mentioned situation does not occur when the arrangement is made on the same straight line as 1. That is, by employing the arrangement of the camera 17 as shown in the present embodiment, complete calibration data covering the entire necessary range can be obtained. In the arrangement of the camera 17, the position of the camera 17 does not need to completely coincide with the first nozzle row L1. It goes without saying that it is included. Further, the first nozzle row L1 may be disposed closer to the head mounting base than on a straight line.

When the calibration is completed as described above, the mounting operation is started. First, a suction tool corresponding to the electronic component to be mounted is mounted on the transfer head 9, and then the mounting operation is started. First, in FIG. 1, the transfer head 9 is moved to the supply unit 4, and electronic components are picked up from each tape feeder 5 by the suction tool 38.

At this time, when the arrangement of the electronic components of the tape feeder 5 in the supply unit 4 matches the arrangement of the suction tools in the transfer head 9, simultaneous suction is possible. In this case, the suction tool is simultaneously lowered in the plurality of suction nozzle units 12, and a plurality of electronic components having different sizes are simultaneously picked up. In other cases, electronic components to be picked up are individually picked up by individual suction tools corresponding to the components in accordance with the mounting sequence data.

In the electronic component pickup, since the length of the transfer head 9 in the X direction is set to be small, the moving distance of the transfer head 9 in the pick-up operation is reduced to shorten the mounting tact time. In addition, the accumulation of pitch errors between the plurality of suction nozzles in the transfer head 9 is small, and therefore, it is possible to minimize the occurrence of a pickup failure due to a displacement between the suction nozzle and the electronic component. ing.

The transfer head 9 holding a plurality of electronic components in this manner is moved above the substrate 3 by the X-axis table 6 and the Y-axis table 7. In this movement path, the transfer head 9 passes above the line camera 10 at a predetermined moving speed. As a result, the electronic components held by the transfer head 9 are imaged from below by the line camera 10, and each electronic component is recognized by performing image processing on the imaged result.

The electronic component whose position has been recognized and the position shift has been detected is mounted on each mounting point on the substrate 3 after correcting the position shift. In this mounting operation, if the pitch of the held electronic components, that is, the arrangement pitch of the suction nozzle units 12 and the pitch of the mounting points on the substrate 3 match, the suction tool 38 holding these electronic components is used.
At the same time. In other cases, the suction tool holding each electronic component is sequentially lowered based on the mounting sequence data, and the electronic component is mounted at each mounting point.

[0045]

According to the present invention, there is provided a moving means for moving a transfer head having a plurality of nozzle rows in which a plurality of suction nozzles are arranged in series at a predetermined basic pitch in the direction in which the parts feeders are arranged. Accordingly, the calibration board is imaged by moving the imaging means disposed on the head mounting base side more than on a straight line substantially coincident with the nozzle row on the supply section side of the nozzle row or on a straight line of the nozzle row. And complete calibration data can be obtained by imaging the entire calibration target range.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a transfer head of the electronic component mounting apparatus according to the embodiment of the present invention;

3A is a front view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention; FIG. 3B is a side view of the transfer head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 4 is a sectional view of a suction nozzle unit of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 5 is a partial detailed view of a suction nozzle unit of the electronic component mounting apparatus according to one embodiment of the present invention.

FIG. 6 is a partial sectional view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 7 is a partial perspective view of a transfer head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 8 is an explanatory diagram of calibration in the electronic component mounting method according to one embodiment of the present invention;

[Explanation of symbols]

 2 Conveyance path 3 Substrate 4 Supply unit 5 Tape feeder 6 X-axis table 7 Y-axis table 9 Transfer head 10 Line camera 12 Suction nozzle unit 17 Camera 20 Nozzle elevating motor 23 Feed screw 25 Elevating mechanism 30 Elevating shaft member 32 Shaft rotating part 38 suction tool 39 control unit 50 nozzle rotation motor 51a, 51b endless belt

Claims (2)

[Claims] An electronic component mounting apparatus for picking up an electronic component by a transfer head from a plurality of parts feeders arranged side by side in an electronic component supply unit and mounting the electronic component on a substrate,
A transfer head in which a plurality of nozzle rows are provided in which a plurality of suction nozzles for sucking and holding electronic components are arranged in series in a direction in which the parts feeders are arranged at a predetermined basic pitch,
An imaging unit that moves integrally with the transfer head and is arranged closer to the head mounting base than on a straight line substantially coincident with the nozzle row on the supply unit side of the nozzle row or on a straight line of the nozzle row, and captures an image of the substrate; An electronic component mounting apparatus comprising: 2. A method of mounting an electronic component, comprising picking up an electronic component by a transfer head from a plurality of parts feeders arranged side by side in an electronic component supply section and mounting the electronic component on a substrate,
A moving means for moving a transfer head provided with a plurality of nozzle rows formed by serially arranging a plurality of suction nozzles for sucking and holding electronic components at a predetermined basic pitch in a direction in which the parts feeder is arranged, An imaging unit that moves integrally with the transfer head and is arranged closer to the head mounting base than on a straight line substantially coincident with the nozzle row on the supply unit side of the nozzle row or on a straight line of the nozzle row, and captures an image of the substrate; Moving the device to image the calibration substrate; and obtaining calibration data of the moving means based on the imaging result.