JP2002005485A - Clean room equipment - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To provide a clean room facility capable of performing air conditioning while reliably maintaining cleanliness of a clean room. SOLUTION: A floor plate 22 for dividing the inside of a clean room 20 into an upper floor portion 24 and a lower floor portion 26 is formed by a solid floor having no opening. Then, control is performed such that the pressure is increased in the order of the preliminary chamber 38, the bay 28, the maintenance area 40, and the lower floor 26 provided in the upper floor 26, and the cleanliness of each is maintained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a clean room facility having a plurality of areas having different degrees of cleanliness to be held, and more particularly to a clean room facility for processing semiconductor wafers.

[0002]

2. Description of the Related Art Conventionally, when processing semiconductor wafers, it is necessary to form a clean room with high cleanliness in order to prevent dust and the like from adhering to the semiconductor wafers during the processing steps. FIG. 4 is a sectional view showing an example of a clean room facility used for processing a semiconductor wafer having a diameter of 200 mm. As shown in FIG. 4, an air conditioner 2 which is a supply source of air is connected to the clean room equipment 1 a, and the temperature-controlled air 4 is supplied from the air conditioner 2 to the ceiling chamber 3. The air 4 is purified through the fan filter unit 7 into the bay 5 and the maintenance area 6 below the ceiling chamber 3. In this manner, the clean air 15 is stored in the bay 5 and the maintenance area 6.
Can be supplied.

On the other hand, the floor plate 10 of the bay 5 and the maintenance area 6 is a grating floor having a plurality of openings 11. The clean air 15 and the high clean air 17 flow out from the opening 11 of the floor panel 10 to the lower floor 12 to air-condition the floor panel section 12. Part of the air (hereinafter, referred to as “processed air”) 18 that has air-conditioned the lower floor 12 is
The air is supplied again to the ceiling chamber 3 via the supply path of the air conditioner 2. The remaining part of the treated air 18 is
The air is exhausted to the outside of the clean room equipment 1a via the exhaust path.

In the clean room equipment 1a formed as described above, the inside of the bay 5 can be maintained at a high cleanliness level of about JIS class 3. However, in the clean room facility 1a, the fan filter unit 7 is installed not only in the bay 5 but also in the maintenance area to perform air conditioning. Therefore, there is a problem that initial costs and running costs increase.

Therefore, conventionally, a clean room facility 1b as shown in FIG. 5 is also used. FIG. 5 is a sectional view of a clean room facility 1b used for processing a semiconductor wafer having a diameter of 300 mm. In this clean room facility 1b, a partition wall between the bay 5 and the maintenance area 6 is formed by an eyelid 19. As a result, the clean air 15 in the bay 5 is supplied to the maintenance area 6 via the partition wall. In order to prevent the semiconductor wafer from being exposed to air in the bay 5, a highly airtight sealing means for sealing the semiconductor wafer and a transport means for transporting the sealing means are provided. By doing so, the cleanliness of the clean air 15 in the bay 5 can be reduced to about JIS class 6. Further, the number of fan filter units 7 can be reduced as compared with the clean room 1a shown in FIG. For this reason,
Initial costs and running costs can be reduced as compared with the clean room 1a shown in FIG.

[0006]

However, the above-mentioned conventional clean room equipment has the following problems.
When the processing apparatus 16 is operated to process a semiconductor wafer, the processed air 18 cooled by the processing apparatus 16 is cooled.
Is discharged into the maintenance area 6 by a fan (not shown). As a result, the pressure in the maintenance area 6 may be higher than the pressure in the bay 5. When the bay 5 and the maintenance area 6 are separated by the eyelid 19, the processed air 1 in the maintenance area 6
8 may flow back into the bay 5 and contaminate the clean air 15 in the bay 5.

Further, conventional clean room equipment 1a, 1
In (b), the floor plate 10 is formed of a grating floor having an opening 11. For this reason, the clean air 15 in the bay 5 and the maintenance area 6 and the highly clean air 17 in the spare room 8 are immediately discharged from the opening 11 of the floor panel 10 to the lower floor 1.
2 is supplied. Although the lower floor 12 does not need to be air-conditioned with clean air, the air-conditioning is performed with the clean air 15 and the clean air 17 with high cleanliness. Further, auxiliary equipment 13 such as a vacuum pump connected to a processing device 16 is disposed in the lower floor portion 12. Since the accessories 13 act as a heat load on the processed air 18, the processed air 18 receives a large amount of heat. Re-adjusting the treated air 18 to an appropriate temperature, humidity, and cleanliness and circulating the treated air 18 to the bay 5 or the like requires a large amount of energy and cost, and thus has a problem of a large burden.

[0008] The present invention overcomes the disadvantages of the prior art,
It is an object of the present invention to be able to perform air conditioning while maintaining cleanliness of a clean room. Another object of the present invention is to save energy by performing air conditioning according to required cleanliness.

[0009]

In order to achieve the above object, in a clean room facility according to the present invention, a clean room is provided with a clean region to which clean air is supplied and a clean region provided in the clean region. A high clean area maintained at a higher clean level, a low clean area provided adjacent to the clean area and maintained at a lower clean level than the clean area, and an underfloor area maintained at a lower clean level than the low clean area And the pressure in each region is increased in the order of decreasing cleanliness. With this configuration, it is possible to prevent the air in the low cleanliness area from flowing back to the high cleanliness area, and to prevent the cleanliness in each area from being disturbed. The floorboard is preferably formed by a solid floor having no opening, but may be formed by a grating floor.

[0010] In the above structure, the flow of air is blocked by the floor material between each of the clean areas and the underfloor area.
It may be configured to be air-conditioned by different air-conditioning systems. With this configuration, it is possible to cut off the flow of the clean air in each clean area and the air in the underfloor area, and to sufficiently perform the air conditioning in each clean area with the clean air. it can.

In the above structure, an exhaust path for discharging the air in the clean room to the outside, a circulation path for returning the air in the clean room to the clean room via an air conditioner, and a circulation path and an exhaust path are provided. The air volume adjusting mechanism, the pressure sensors provided in the clean area and the low clean area, and the air volume adjusting mechanism is controlled based on the detection signals of these pressure sensors, and the pressure of the clean area is reduced to the low clean area. A configuration may be provided that includes a control device that maintains the pressure higher than the pressure by a predetermined value. With this configuration, even when the pressure in the low-clean area increases due to disturbance or the like, the pressure in the high-clean area can be constantly adjusted to be high, and the cleanliness in the high-clean area can be maintained. it can. The differential pressure at this time is preferably 0.5 to 10 Pa.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view of the clean room equipment according to the present embodiment. In the present embodiment,
A clean room facility 200 for processing a semiconductor wafer as a workpiece will be described.

The clean room 20 is a clean room 2
The floor plate 22 provided in the inside of the housing 2 is divided into an upper floor portion 24 and a lower floor portion 26, and the flow of air between the upper floor portion 24 and the lower floor portion 26 is blocked by the floor plate 22. A bay 28, which is a clean area, is formed in the center of the upper floor 24. In the bay 28, a preparatory chamber 36, which is a highly clean area where the semiconductor wafer is exposed to air, is provided at an end side. A maintenance area 40, which is a low-purity area, is formed on both sides of the bay 28. The lower floor 26 is a lower floor area having a lower cleanness than the maintenance area 40. Auxiliary equipment (not shown) is provided in the lower floor portion 26. Thus, the clean room 20
Has a plurality of areas having different degrees of cleanliness to be retained, and the order of the degrees of cleanliness to be retained depends on the order of the spare room 36, the bay 28, the maintenance area 40, and the lower floor 2
The order is 6. The upper part of the bay 28 and the maintenance area 40 is a ceiling chamber 46. The ceiling chamber 46 is connected to an air conditioner 50 via a supply path 57, and the conditioned air 52 is supplied from the air conditioner 50 into the ceiling chamber 46.

Above the bay 28, a fan filter unit 34 is provided. The fan filter unit 34 includes a fan 3 for sending air into the bay 28.
4a and a HEPA filter 34b for collecting fine particles. The conditioned air 52 in the ceiling chamber 36 is sucked by the fan filter unit 34, and fine particles such as dust are removed at the time of the suction to become clean air 72, which is supplied into the bay 28. In this manner, the clean air 72 having a high degree of cleanliness can be supplied into the bay 28.

In the bay 28, a highly airtight wafer holding cassette 30 for holding a semiconductor wafer and a transfer means 3 for transferring the wafer holding cassette 30 are provided.
2 and the like are provided. As the wafer holding cassette 30, a FOUP (Front Opening Unif) is used.
ied Pod) can be preferably used. By holding the semiconductor wafer tightly in such a sealed container, the semiconductor wafer can be prevented from directly contacting air. An AGV (Automated Guide) is used as the transport unit 32.
ed Vehicle) or OHT (Over Head)
d hoist Transport) can be preferably used.

When exposing a semiconductor wafer to air, a cleanliness of about JIS class 3 is required to protect the semiconductor wafer from dust. However, as described above, in the bay 28, the semiconductor wafers are stored in the wafer holding cassette 30.
And is not directly exposed to air. For this reason,
The required cleanliness in the bay 28 can be approximately JIS class 6, and the required cleanliness can be greatly reduced. For this reason, the number of fan filter units 34 to be installed in the bay 28 can be greatly reduced, and initial costs and running costs can be significantly reduced.

In the bay 28, the spare chambers 36 are provided at both ends of the bay 28 as described above. An opener 31 is arranged in the bay 28 so as to abut on the preliminary chamber 36. The wafer holding cassette 30 having a semiconductor wafer therein is disposed on the opener 31 via a transfer unit 32. The wafer holding cassette 30 in which the semiconductor wafer is sealed by the opener 31
Can be introduced into the spare chamber 36. A transfer machine 33 is provided in the preliminary chamber 36, and the transfer machine 3
The semiconductor wafer is taken out from the opener 31 by 3.
A fan filter unit 38 having the same structure as that of the fan filter unit 36
Is provided. The clean air 72 in the bay 28 can be introduced into the spare chamber 36 as high clean air 74 of JIS class 3 having higher cleanliness by passing through the fan filter unit 38. Since the inside of the spare chamber 36 can be held at about JIS class 3 in this manner, there is no possibility that dust adheres to the semiconductor wafer to deteriorate the performance, and the processing can be performed while maintaining the quality.

The floor plate 22 of the bay 28 has a solid floor shape without an opening. Therefore, the bay 28
The flow of the clean air 72 introduced into the inside and the high clean air 74 introduced into the preliminary chamber 36 into the lower floor 24 is controlled by the floor plate 22.
Can be cut off. Therefore, the air conditioning in the bay 28 and the spare room 36 can be sufficiently performed by the clean air 72 and the high clean air 74.

On both sides of the bay 28, maintenance areas 40 are provided. In the maintenance area 40, a processing device 42 for processing a semiconductor wafer is provided. The processing apparatus 42 is disposed so as to be in close contact with the preliminary chamber 36, and the semiconductor wafer taken out of the preliminary chamber 36 can be introduced into the processing apparatus 42 by the transfer device 33. The semiconductor wafer thus introduced is processed in the processing apparatus 42.

The maintenance area 40 and the bay 28 are separated by a partition wall 44. The partition wall 4
Reference numeral 4 denotes an eyelid having a gap between the spare chamber 36 and the ceiling, and the clean air 72 in the bay 28 can flow into the maintenance area 40 through the gap.

The maintenance area 40 and the ceiling chamber 46 are formed integrally without a partition. For this reason, a part of the processed air 76 that has air-conditioned the maintenance area 40 circulates above the maintenance area 40 and is supplied to the ceiling chamber 46, and is again converted into clean air 72 via the fan filter unit 34. It can be supplied to the bay 28.

The floor plate 22 of the maintenance area 40
Is provided with a suction port 56, and the suction port 56 is connected to a circulation path 58. Thereby, the treated air 7
6 can flow into the circulation path 58. The circulation path 58 joins the introduction path 51 connected to the air conditioner 50 so that the treated air 76 can be introduced again into the air conditioner 50. The circulation path 58 is provided with an air volume regulator 60. The air volume regulator 60 has a structure having a damper and a fan. The flow rate of the treated air 76 can be adjusted by the air volume regulator 60, and the treated air 76 can be positively sucked and sent to the circulation path 58.

As described above, by circulating the treated air 76 having relatively little contamination again and supplying it to the ceiling chamber 46, it is possible to easily purify the air supplied into the bay 28, thereby reducing cost and cost. Energy can be reduced.

The maintenance area 40 is provided with an exhaust path 69 connected to the outside. The exhaust path 69 allows a part of the processed air 76 to be exhausted. An air flow regulator 64 is provided in the exhaust path 62 so that the exhaust air volume of the processed air 76 can be adjusted by the air flow regulator 64.

On the other hand, another air conditioner (not shown) is connected to the lower floor 26, and the other air conditioner takes in outside air to perform general air conditioning in the lower floor 26. With such general air conditioning, it is possible to cause the lower floor 26 to perform necessary and sufficient air conditioning. The lower floor 26 has an exhaust path 69 connected to the outside.
Is provided, and the air 77 that has conditioned the lower floor 26 can be discharged by the exhaust path 62. In the present embodiment, the pressure in the lower floor portion 26 is set lower than the maintenance area 40. With this configuration, it is possible to prevent the air in the lower part of the floor 26 from flowing into the upper part 24 of the floor, and to prevent dust in the lower part of the floor 26 from flowing into the upper part 24 and disturb the cleanliness of the upper part 24. Can be prevented.

In the present embodiment, a control device is provided for maintaining the pressure in the clean area in the clean room facility 20 higher than the pressure in the low clean area by a predetermined value. This will be described below. A pressure sensor 66 is provided in the bay 28 which is a clean area, and a pressure sensor 68 is provided in the maintenance area 40 which is a low clean area. The pressure in the bay 28 and the maintenance area 40 can be measured by the pressure sensor 66 and the pressure sensor 68. Then, the pressure sensor 66 and the pressure sensor 68 are electrically connected to an air volume controller 70 which is a measuring means so that a differential pressure between the bay 28 and the maintenance area 40 can be measured. I have. On the other hand, an air flow controller 64 is provided in the exhaust path 62, and an air flow controller 60 is provided in the circulation path 58, so that the air flow of the respective paths 62, 58 can be adjusted by the respective air flow controllers 64, 60. It is. The air volume regulator 64 and the air volume regulator 60 are each electrically connected to the air volume controller 70. Because of this, the air volume controller 60 and the air volume regulator 64 can be controlled by the air volume controller 70 in accordance with the differential pressure measured by the pressure sensor 66 and the pressure sensor 68. That is, the exhaust amount of the exhaust path 62 and the circulation amount of the circulation path 58 can be adjusted according to the differential pressure.

The clean room equipment 2 thus formed
The air conditioning operation of 0 will be described. In the present embodiment, an air conditioner 50 is provided as a means for supplying the conditioned air 52. The air conditioner 50 is connected to an outside air intake 54 via an introduction path 51 so that outside air can be taken in. The air conditioner 50 adjusts the temperature and humidity of the air in the introduction path 51 and removes dust in the air to form the conditioned air 52. This conditioned air 52 is supplied into the ceiling chamber 46 via the supply path 57.

The air-conditioned air 52 flowing into the ceiling chamber 46 is purified by the fan filter unit 34 provided above the bay 28 and flows into the bay 28 as clean air 72. In the present embodiment, the fan filter unit 34 is adjusted so that the cleanness of the clean air 72 flowing into the bay 28 is about JIS class 6.

A part of the clean air 72 in the bay 28 is formed by a fan filter unit 38 provided above the spare chamber 36.
The air is further purified and flows into the preliminary chamber 36 as high-purity air 74. In the present embodiment, the cleanliness in the preliminary chamber 36 is maintained at a high degree of cleanliness of about JIS class 3, so that the semiconductor wafer can be prevented from being contaminated by fine particles and the like. In the spare chamber 36, the clean air 74 in the bay 28 is
, The pressure in the preliminary chamber 36 can be kept higher than the pressure in the bay 28. In addition, since the bay 28 and the floor plate 22 of the spare room 36 are formed by a solid floor having no opening, the clean air 72 and the high clean air 74 can be blocked from flowing into the lower part 26 of the floor.

Further, a part of the clean air 72 in the bay 28 flows into the maintenance area 40 through the partition wall 44 having the shape of a leaning wall. As described above, since the maintenance area 40 is air-conditioned by using the clean air 72 in the bay 28, the number of fan filter units 34 to be installed can be reduced, and cost and energy can be saved. In this embodiment, the pressure in the bay 28 is set to 0.5 to 10 Pa with respect to the maintenance area 40.
High. Thereby, the clean air 72 is supplied from the inside of the bay 28 to the maintenance area 40, so that the backflow can be prevented.

The air that has been air-conditioned in the maintenance area 40 and the processed air 76 that has been air-cooled in the processing unit 42
Is raised above the maintenance area 40 and is introduced into the ceiling chamber 46 again. Another part of the treated air 76 is supplied to the circulation path 58 through the suction port 56.
And merges with the air in the introduction path 51.
Thereby, the treated air 76 can be supplied again to the air conditioner 50, and the temperature of the treated air 76 can be adjusted again and introduced into the ceiling chamber 46 as the conditioned air 52.

In addition, air 77 is introduced into the lower floor 26 from the outside, and general air conditioning is performed by the air 77. The air 77 is discharged to the outside via the exhaust path 62.
Therefore, there is no need to air-condition the air 77 that has been subjected to the heat load by cooling the auxiliary devices (not shown). By doing so, significant energy and cost savings can be made.

In the present embodiment, adjustment is performed by the above-described control device so that the differential pressure between the maintenance area 40 and the bay 28 becomes 0.5 to 10 Pa. Hereinafter, this will be described. FIG. 2 is an explanatory diagram of the control device according to the present embodiment. As shown in step A of FIG. 2, when a disturbance occurs due to the operation of the processing device 42 or the like, the pressure in the maintenance area 40 increases, and the pressure difference between the maintenance area 40 and the bay 28 may decrease. As mentioned above, bay 2
A pressure sensor 66 and a pressure sensor 68 are provided in the inside 8 and the maintenance area 40, respectively. As shown in step B of FIG. 2, when the pressure difference is detected by the air flow controller 70 electrically connected to the pressure sensor 66 and the pressure sensor 68, as shown in step C of FIG. The air volume controller 60 is opened by the air volume controller 70. Thus, the flow rate of the processed air 76 in the circulation path 58 can be increased, and the pressure in the maintenance area 40 can be reduced.

After performing the above processing, the differential pressure is measured again as shown in step D of FIG. If the decrease in the differential pressure does not improve, the air flow controller 7 is switched as shown in step E of FIG.
When 0, the air volume regulator 64 is opened. Thus, the exhaust path 6
By increasing the flow rate of the processed air 76 in 2, the exhaust amount can be increased. Thus, the pressure in the maintenance area 40 is reduced, and the decrease in the differential pressure is recovered.
The differential pressure is measured again as shown in Step F of FIG.
If the differential pressure recovers, the current state is maintained as shown in step G of FIG. If the differential pressure has not recovered, the process of step C in FIG. 2 is performed, and the above-described steps are repeated until the differential pressure recovers. By performing these processes, the differential pressure between the inside of the bay 28 and the inside of the maintenance area 40 is always 0.5 to 10 P
a. In the present embodiment,
The control unit reads the pressure values of the pressure sensors 66 and 68 every predetermined time (for example, every 10 microseconds) to determine whether there is an abnormality. For this reason, it is possible to prevent the air in the maintenance area 40 from flowing back to the bay 28, and it is possible to maintain high cleanliness in the bay 28. Further, as described above, the pressure in the preliminary chamber 36 is higher than that in the bay 28. The lower floor 26 has the lowest pressure. For this reason, it is possible to control the pressure level so that the spare chamber 36 is always the highest, the bay is the next, the maintenance area is the next, and the floor is the lower floor. For this reason, each of the plurality of areas can be held by increasing the pressure in the order of higher cleanliness to be held. As described above, since the pressure of each region is increased in the order of higher cleanliness, it is possible to prevent air in the lower cleanness region from flowing back to the higher cleanness region, and maintain the cleanliness of each region. be able to.

FIG. 3 is a sectional view of a clean room facility 20b according to another embodiment of the present invention. The same members as those in FIG. 1 are denoted by the same reference numerals. As shown in FIG. 3, the floor plate 22 has a shape having an opening 59, and the processed air 76 b can flow into the lower floor 26 through the opening 59. In the present embodiment, the circulation path 58 is connected to the suction port 56, and a part of the circulation path 58 is disposed in the lower floor 26. By doing so, the space of the clean room equipment 20 can be saved.

Outside air is introduced into the lower floor 26 by another air conditioner (not shown). The general air conditioning of the lower floor 26 is performed by the outside air and the processed air 76b thus introduced.
The processed air 76b that has air-conditioned the lower floor 26 is discharged to the outside through the exhaust path 62 without circulating. Thus, the upper floor 24 and the lower floor 2 divided by the floor plate 22
By using a separate system for air conditioning, energy and cost can be significantly reduced. In the present embodiment, the air volume adjuster 6 provided in the exhaust path 62 is used.
4 is controlled by the air volume control device 70 so that the processed air 76
By adjusting the exhaust amount of b, the pressure of the bay 28 is set within a certain range (for example, 0.5
-10 Pa).

Although the embodiment has been described with reference to the clean room equipment for processing semiconductor wafers, it is needless to say that the present invention can be applied to other clean room equipment having a plurality of areas having different cleanliness to be held. Further, in the embodiment, the spare chamber 36 is provided in the bay 28, but the spare chamber 36 may not be provided.

[0038]

As described above, according to the present invention, the clean room is provided with a clean area to which clean air is supplied.
A high-purity region that is maintained at a higher degree of cleanness than the clean region provided in the clean region; a low-purity region that is provided adjacent to the clean region and that is maintained at a lower degree of cleanness than the clean region; The area is divided into an underfloor area that is maintained at a lower degree of cleanliness than the area, and the pressure in each area is increased in descending order of the degree of cleanliness. Further, according to the present invention, energy saving can be achieved by performing air conditioning according to the required cleanliness.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a clean room facility according to an embodiment of the present invention.

FIG. 2 is a process diagram of a control device according to the embodiment of the present invention.

FIG. 3 is a sectional view showing a clean room facility according to another embodiment of the present invention.

FIG. 4 is a sectional view showing a conventional clean room facility.

FIG. 5 is a sectional view showing a conventional clean room facility.

[Explanation of symbols]

1a Clean room equipment 1b Clean room equipment 2, Air conditioner 3, Ceiling chamber 4,
... air, 5 ... bay, 6 ... maintenance area, 7 ... fan filter unit, 8 ... spare room, 9 ... fan filter unit, 10 ... floor plate, 11 ... ... Opening, 12 ... Bottom floor, 13 ...
Auxiliary equipment, 14: Circulation path, 15: Clean air, 1
6 processing equipment 17 high-purity air 18
Processed air, 19 ... Eye lid, 20 ... Clean room, 22 ... Floor plate, 24 ... Upper floor, 26 ...
... lower floor, 28 ... bay, 30 ... wafer holding cassette, 31 ... opener, 32 ... transfer means, 3
3 ... transfer machine, 34 ... fan filter unit,
36 ... preliminary room, 38 ... fan filter unit, 40 ... maintenance area, 42 ... processing equipment, 44 ... partition wall, 46 ... ceiling chamber, 5
0 ... air conditioner, 51 ... introduced air, 52 ... conditioned air, 54 ... outside air intake, 56 ... suction port, 5
7 ... supply path, 58 ... circulation path, 59 ... exhaust port, 60 ... air flow regulator, 62 ... exhaust path, 6
4 Airflow regulator 66 Pressure sensor 68
… Pressure sensor, 69… exhaust path, 70… air volume controller, 72… clean air, 74… high clean air, 7
6… treated air, 200… clean room equipment

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shigeru Nishimura 1-1-14 Uchikanda, Chiyoda-ku, Tokyo Inside Hitachi Plant Construction Co., Ltd. (72) Keiji Suzuki 1-1-1, Uchikanda, Chiyoda-ku, Tokyo No. 14 Inside Hitachi Plant Construction Co., Ltd. (72) Inventor Junta Hirata 1-1-14 Uchikanda, Chiyoda-ku, Tokyo F-term inside Hitachi Plant Construction Co., Ltd. 3L058 BE02 BF01 BF09 BF09 BG01

Claims (3)

[Claims] A clean room is provided adjacent to a clean area to which clean air is supplied, a high clean area maintained at a higher degree of cleanness than a clean area provided in the clean area, and a clean area. The area is divided into a low-clean area that is maintained at a lower degree of cleanliness than the clean area, and an underfloor area that is maintained at a lower degree of cleanness than the low-clean area, and the pressure in each area is increased in descending order of cleanliness. Clean room equipment. 2. The clean room equipment according to claim 1, wherein the air flow of each of the clean areas and the underfloor area is blocked by a floor material and air-conditioned by different air conditioning systems. 3. An exhaust path for discharging the air in the clean room to the outside, a circulation path for returning the air in the clean room to the clean room via an air conditioner, and air flow adjustment provided in the circulation path and the exhaust path. A pressure sensor provided in the clean area and the low clean area; controlling the air volume adjusting mechanism based on a detection signal of the pressure sensor; and setting the pressure in the clean area to a predetermined value based on the pressure in the low clean area. The clean room equipment according to claim 1 or 2, further comprising: a control device that keeps the value high by the value of: