JP2002001209A - Method for coating resin molding and coated article - Google Patents
Method for coating resin molding and coated articleInfo
- Publication number
- JP2002001209A JP2002001209A JP2000193014A JP2000193014A JP2002001209A JP 2002001209 A JP2002001209 A JP 2002001209A JP 2000193014 A JP2000193014 A JP 2000193014A JP 2000193014 A JP2000193014 A JP 2000193014A JP 2002001209 A JP2002001209 A JP 2002001209A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- coating
- liquid crystal
- film
- crystal polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 43
- 239000011248 coating agent Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 22
- 229920005989 resin Polymers 0.000 title claims description 14
- 239000011347 resin Substances 0.000 title claims description 14
- 238000000465 moulding Methods 0.000 title abstract description 8
- 229910052751 metal Inorganic materials 0.000 claims abstract description 45
- 239000002184 metal Substances 0.000 claims abstract description 45
- 238000007747 plating Methods 0.000 claims abstract description 32
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 26
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims abstract description 26
- 229920000728 polyester Polymers 0.000 claims description 16
- 239000004973 liquid crystal related substance Substances 0.000 claims description 14
- 230000006870 function Effects 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 238000005034 decoration Methods 0.000 abstract 1
- 239000007921 spray Substances 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 8
- 239000007924 injection Substances 0.000 description 8
- 238000005530 etching Methods 0.000 description 7
- 239000003973 paint Substances 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000008188 pellet Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000004372 Polyvinyl alcohol Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000013329 compounding Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 102100028780 AP-1 complex subunit sigma-2 Human genes 0.000 description 1
- 101100325793 Arabidopsis thaliana BCA2 gene Proteins 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 101100055680 Homo sapiens AP1S2 gene Proteins 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 108010064539 amyloid beta-protein (1-42) Proteins 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Casings For Electric Apparatus (AREA)
- Laminated Bodies (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は樹脂成形体の塗装方
法及び塗装品に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for coating a resin molded article and a coated article.
【0002】[0002]
【従来の技術】最近、電子部品の筐体、とくにメモリー
スティック筐体には薄肉化が要求され、剛性や機械的強
度を向上させるとともに薄肉成形性を確保するために、
筐体の材料として液晶ポリエステルが用いられるように
なった。2. Description of the Related Art In recent years, housings for electronic parts, especially memory stick housings, have been required to be thinner. In order to improve rigidity and mechanical strength and to secure thin-walled formability,
Liquid crystal polyester has come to be used as a material for the housing.
【0003】この液晶ポリエステルは、耐熱性、機械的
特性、電気的特性など、物性面で種々の優れた性質を有
している。[0003] The liquid crystal polyester has various excellent properties in terms of physical properties such as heat resistance, mechanical properties, and electrical properties.
【0004】[0004]
【発明が解決しようとする課題】しかし、その反面にお
いて、この液晶ポリエステルは不活性で且つ耐溶剤性が
良好であるので、そのペレットに着色剤を添加させた
り、その成形品の表面に塗装を施すことが困難である。
とくに、後者の場合は塗装はできても塗膜の付着力が弱
く、剥離し易い問題があった。However, on the other hand, on the other hand, since the liquid crystal polyester is inert and has good solvent resistance, a coloring agent is added to the pellets or a coating is applied to the surface of the molded article. Difficult to apply.
In particular, in the case of the latter, there is a problem that even if the coating can be performed, the adhesion of the coating film is weak and the coating film is easily peeled.
【0005】その結果、塗装した成形体は、およそ外装
品として不向きな、商品価値の低いものが多かった。こ
のように、液晶ポリエステルに対しては、上塗り塗料の
1コートのみでは塗装不可能とされるため、表面にエッ
チング処理を施したり、プライマーと上塗り塗装とを組
合わせる等、工程を増やす必要があった。例えば、プラ
イマーとして塩素化ポリオレフィン/アクリル系を用
い、上塗り塗料としてアクリル/ウレタン系を塗装する
ことにより、塗料の密着性は上るものの、プライマーは
ハロゲン化合物のため、環境面から使用には適さない。[0005] As a result, many of the coated molded articles are unsuitable as exterior parts and have low commercial value. As described above, since it is impossible to apply the liquid crystal polyester with only one coat of the top coat, it is necessary to increase the number of steps such as etching the surface and combining the primer and the top coat. Was. For example, when a chlorinated polyolefin / acrylic system is used as a primer and an acrylic / urethane system is applied as a top coating, the adhesion of the coating is improved, but the primer is a halogen compound and is not suitable for use from an environmental point of view.
【0006】本発明は上記事情を改善するためになされ
たもので、その目的は、工程数を少なくして付着力の強
い塗膜を得ることができ、そして特に電子製品の用途向
きに外装と機能をともに満足し、かつ作業効率が高くて
環境にも悪影響のない樹脂成形体の塗装方法、及び塗装
品を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to improve the above circumstances, and an object of the present invention is to obtain a coating film having a strong adhesive force by reducing the number of steps, and to provide an exterior and a coating especially for electronic products. It is an object of the present invention to provide a method for coating a resin molded article which satisfies both functions, has a high working efficiency and does not adversely affect the environment, and a coated product.
【0007】[0007]
【課題を解決するための手段】即ち、本発明の樹脂成形
体の塗装方法は、液晶ポリエステルなどの液晶ポリマー
からなる成形体に金属膜(特に金属めっき膜)を形成
し、この金属膜の表面に塗装を施すことを特徴とする。That is, in the method of coating a resin molded article of the present invention, a metal film (particularly a metal plating film) is formed on a molded article made of a liquid crystal polymer such as liquid crystal polyester, and the surface of the metal film is formed. It is characterized in that it is painted.
【0008】また、本発明の塗装品は、液晶ポリエステ
ルなどの液晶ポリマーからなる成形体表面に金属膜(特
に金属めっき膜)が形成され、更にこの金属膜上に塗装
が施されていることを特徴とする。[0008] The coated article of the present invention is characterized in that a metal film (particularly a metal plating film) is formed on the surface of a molded product made of a liquid crystal polymer such as liquid crystal polyester, and that the metal film is further coated. Features.
【0009】本発明によれば、液晶ポリマーからなる成
形体に金属膜を形成し、この金属膜の表面に塗装を施す
ので、耐溶剤性に優れてはいるが塗料付着性が劣る液晶
ポリマー成形体に対して、塗料との密着性の良好な金属
膜を介し、エッチング処理やプライマー及び上塗り塗装
を要さずして1コートのみで、即ち、少ない工数で、付
着力が大きくて、剥離し難い塗膜を形成でき、かつこの
塗膜を有する塗装品を効率的に得ることができる。According to the present invention, a metal film is formed on a molded body made of a liquid crystal polymer, and the surface of the metal film is coated. Therefore, the liquid crystal polymer molding having excellent solvent resistance but poor paint adhesion is obtained. To the body, through a metal film with good adhesion to the paint, with only one coat, without the need for etching treatment, primer and top coating, that is, with a small number of man-hours, the adhesion is large, A difficult coating film can be formed, and a coated article having this coating film can be efficiently obtained.
【0010】そして、特に電子・電気製品向けには、筐
体等の樹脂成形体の塗装時に配線回路用の非塗装部分を
残しておくことによって、塗装部は外観向上用に、非塗
装部は機能用と、外観と機能の一体化した商品価値の高
い樹脂成形体を、高い効率(工数、組立部品の削減によ
り)で提供することが可能である。[0010] Particularly, for electronic and electrical products, by leaving a non-painted portion for a wiring circuit when coating a resin molded body such as a housing, the painted portion is used for improving the appearance, and the unpainted portion is used for improving the appearance. It is possible to provide a high-product-value resin molded product that integrates functions and appearance and function with high efficiency (by reducing man-hours and assembly parts).
【0011】[0011]
【発明の実施の形態】本発明においては、前記液晶ポリ
マーが成形時の流動性に優れる液晶ポリエステルである
ことが望ましい。なお、液晶ポリマー(LCP)の特性
(連続使用温度、熱膨張係数、吸水率)を他のポリマー
と比較すると、図4に示すようになるが、いずれも優れ
た物性を示している。これによって、高流動性、高剛性
等を生かして平均肉厚0.3mm以下の超薄型筐体の成
形が可能となりデバイスの小型化、薄型化が実現でき
る。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, it is desirable that the liquid crystal polymer is a liquid crystal polyester having excellent fluidity during molding. FIG. 4 shows the properties (continuous use temperature, thermal expansion coefficient, water absorption) of the liquid crystal polymer (LCP) as compared with those of other polymers, all of which show excellent physical properties. This makes it possible to form an ultra-thin housing having an average thickness of 0.3 mm or less by taking advantage of high fluidity, high rigidity, and the like, so that the device can be reduced in size and thickness.
【0012】また、前記成形体が電子機器の筐体であ
り、この筐体の体裁面に前記塗装を施すことが望まし
い。[0012] It is preferable that the molded body is a housing of an electronic device, and the paint is applied to the appearance surface of the housing.
【0013】前記筐体は形状にとらわれないが、通常は
メモリースティック筐体又は携帯電話用筐体であるのが
よい。The housing is not limited to a particular shape, but is usually a memory stick housing or a mobile phone housing.
【0014】本発明においては、前記液晶ポリマーから
なる筐体の内面及び外面に金属めっき膜をそれぞれ形成
し、これらのうち、前記内面の金属めっき膜を配線回路
に用い、前記外面の金属めっき膜に前記塗装を施すのが
好ましい。こうして、配線回路(更にはコネクタ)と筐
体(外装を含む)を一体化でき、部品点数の削減、組立
工数の削減を図れ、コストダウンにもなる。In the present invention, a metal plating film is formed on an inner surface and an outer surface of the casing made of the liquid crystal polymer, and the metal plating film on the inner surface is used for a wiring circuit. It is preferable to apply the above-mentioned coating. In this manner, the wiring circuit (further, the connector) and the housing (including the exterior) can be integrated, the number of parts can be reduced, the number of assembly steps can be reduced, and the cost can be reduced.
【0015】更に、本発明の塗装方法を実施するとき
は、前記筐体の内面に前記配線回路をMID(Mold int
erconnect device)形成法により直接形成する工程と、
前記筐体の外面に前記金属めっき膜を形成する工程と
を、同時に行なうことが好ましい。即ち、液晶ポリマー
製の筐体内面に、MID形成法で電子回路を金属めっき
により形成すると同時に、外装面側の前面にも金属めっ
きを施し、この上に、例えばアクリル/シリコン系の塗
料を1コートでコーティングするのがよい。Further, when the coating method of the present invention is carried out, the wiring circuit is provided on the inner surface of the housing by MID (Mold int).
erconnect device) forming directly by a forming method;
Preferably, the step of forming the metal plating film on the outer surface of the housing is performed simultaneously. That is, an electronic circuit is formed by metal plating on the inner surface of a liquid crystal polymer housing by the MID forming method, and at the same time, metal plating is also performed on the front surface on the exterior surface side. It is good to coat with a coat.
【0016】そして、電子や電気製品向けには、前記筐
体の前記内面の前記配線回路上に電子部品をマウントす
ることが好ましい。[0016] For electronic and electrical products, it is preferable to mount an electronic component on the wiring circuit on the inner surface of the housing.
【0017】次に、本発明を好ましい実施の形態に基づ
いて適宜、図面を参照しながら詳しく説明する。Next, the present invention will be described in detail based on preferred embodiments with reference to the drawings as appropriate.
【0018】図1、図2及び図3は本発明の好ましい塗
装方法のフローを示すもので、このフローは、(A)か
ら(J)に至る工程からなる。FIG. 1, FIG. 2 and FIG. 3 show a flow of a preferred coating method of the present invention. This flow comprises steps from (A) to (J).
【0019】(A)工程:1はメモリスティック用の筐
体を示し(図6も参照)、この筐体1は液晶ポリエステ
ル等の液晶ポリマーより構成され、主に射出成形によっ
て製造される。図5はこの射出成形に用いられる射出成
形機20を示すもので、その動作は次のとおりである。Step (A): Step 1 shows a case for a memory stick (see also FIG. 6), and this case 1 is made of a liquid crystal polymer such as liquid crystal polyester, and is mainly manufactured by injection molding. FIG. 5 shows an injection molding machine 20 used for this injection molding, and its operation is as follows.
【0020】型閉じ:異物のないことを確め、金型で
ある固定型21と可動型22を低圧で閉じる。 型締め:固定型21、可動型22を高圧で締め、射出
圧力で開かないようにする。 射出:スクリュー19を内装した射出シリンダー23
内にホッパー25を介して投入した液晶ポリマーのペレ
ット24をヒーター26で溶かし、この溶融物を、スク
リュー19を介してキャビティ18に注入する。 保圧:射出シリンダー23内の圧力を高圧に保持す
る。 冷却硬化(可塑化):射出シリンダー23内の圧力を
下げ、可動型22内の液晶ポリマーの加熱可塑化を行な
う。 型開き:固定型21、可動型22を開く 離型、成形。Close the mold: Make sure that there are no foreign matters, and close the fixed mold 21 and the movable mold 22 which are dies at low pressure. Mold clamping: The fixed mold 21 and the movable mold 22 are clamped at high pressure so as not to be opened by injection pressure. Injection: Injection cylinder 23 with screw 19 inside
The pellets 24 of the liquid crystal polymer put into the inside through the hopper 25 are melted by the heater 26, and the melt is injected into the cavity 18 through the screw 19. Holding pressure: The pressure in the injection cylinder 23 is maintained at a high pressure. Cooling and curing (plasticization): The pressure in the injection cylinder 23 is reduced, and the liquid crystal polymer in the movable mold 22 is plasticized by heating. Mold opening: Opening the fixed mold 21 and the movable mold 22 Release and molding.
【0021】液晶ポリマーとしてはとくに限定されない
が、たとえば液晶ポリエステルが好ましい。この液晶ポ
リエステルは、公知の種々のものから選択できるが、こ
れは2種以上のモノマーの共重合体であり、そのほぼ全
てにAlthough the liquid crystal polymer is not particularly limited, for example, a liquid crystal polyester is preferable. This liquid crystal polyester can be selected from various known ones, and is a copolymer of two or more monomers, and almost all of them are
【化1】 (以下、OBA成分と略す)が含まれ、しかもそれが全
体の50モル%以上を占めている(例外として、このO
BA成分を含んでいないものもある)。Embedded image (Hereinafter abbreviated as OBA component), which accounts for 50 mol% or more of the whole (except for this OBA component).
Some do not contain a BA component).
【0022】このように共重合体でかつ50モル%以上
が前記OBA成分であることが、本発明にとって好都合
な有用な性質を示すことになる。As described above, the fact that the copolymer is the above-mentioned OBA component in an amount of 50 mol% or more exhibits advantageous properties useful for the present invention.
【0023】液晶ポリエステルの結合様式は一般にはエ
ステル結合のみ(ポリエステル)であるが、さらに、ア
ミド結合やイミド結合、カーボネート結合、ウレタン結
合等が導入される場合もある。The bonding mode of the liquid crystal polyester is generally only an ester bond (polyester). However, an amide bond, an imide bond, a carbonate bond, a urethane bond, or the like may be introduced.
【0024】液晶ポリマーは、エポキシ樹脂に比べてハ
ロゲン等の環境を害する物質を用いないので、環境を損
なわず、使用上の問題は生じない。Since the liquid crystal polymer does not use environmentally harmful substances such as halogens as compared with the epoxy resin, the environment is not impaired and there is no problem in use.
【0025】また、この液晶ポリマーは、成形時に分子
鎖が流動方向に配向して補強効果が生じ、高い強度と弾
性率が得られる。そして弾性率が高いにもかかわらず、
優れた振動吸収特性を示し、特に流動方向の線膨張率は
通常のプラスチックよりずっと小さく、金属に匹敵する
ものとなり、厚みの薄い成形品ほど表層の配向層の占め
る割合が大きく、薄肉になるほど、大きな強度と弾性率
が得られる。その他、緻密な結晶構造をもっているの
で、融点が比較的低いにもかかわらず、高い荷重たわみ
温度、連続使用温度、耐熱性や低い吸水率も示す(図4
参照)。Further, in the liquid crystal polymer, the molecular chains are oriented in the flow direction at the time of molding, and a reinforcing effect is produced, and high strength and elastic modulus can be obtained. And despite the high modulus,
It shows excellent vibration absorption characteristics, especially the coefficient of linear expansion in the flow direction is much smaller than that of ordinary plastic, comparable to metal, and the thinner the molded product, the larger the proportion of the surface orientation layer, High strength and elastic modulus can be obtained. In addition, since it has a dense crystal structure, it exhibits a high deflection temperature under load, a continuous use temperature, heat resistance, and a low water absorption despite its relatively low melting point (FIG. 4).
reference).
【0026】(B)工程:化学アルカリエッチング工程
であり、液晶ポリマー筐体の表面を適度に粗らし、投錨
効果により、後述の金属めっき膜の密着性を高めるのが
目的である。この処理に用いるアルカリとしては、たと
えば水酸化カリウムなど好ましい。なお、このエッチン
グ処理は、筐体1の内外両面1a、1bに施されるが、
このエッチングは本発明では必ずしも必要ではない。Step (B): This is a chemical alkali etching step, which aims to moderately roughen the surface of the liquid crystal polymer housing and enhance the adhesion of a metal plating film described later by an anchoring effect. As the alkali used for this treatment, for example, potassium hydroxide is preferable. This etching process is performed on the inner and outer surfaces 1a and 1b of the housing 1.
This etching is not always necessary in the present invention.
【0027】(C)工程:これは二次側成形工程であっ
て、筐体1の内面1aにたとえばポリビニルアルコール
2を所定のマスクを用いて所望の箇所に付着させる。こ
の材料は水や湯に溶け易い材料で、これにより被覆され
た部分は、後述するように触媒が付かず、従って金属め
っきが付かない部分となる。Step (C): This is a secondary molding step in which, for example, polyvinyl alcohol 2 is adhered to a desired portion on the inner surface 1a of the housing 1 using a predetermined mask. This material is a material that is easily soluble in water or hot water, and the portion covered with the material is a portion that is not coated with a catalyst as described later, and thus is not coated with metal plating.
【0028】(D)工程:パターンを用いて触媒処理を
する工程である。これにはたとえば触媒として塩化パラ
ジウムが用いられ、この触媒は前記ポリビニルアルコー
ルで被われない箇所(一次材料のむき出し部分)1b、
1cに浸透する。Step (D): a step of performing a catalyst treatment using a pattern. For this purpose, for example, palladium chloride is used as a catalyst, and this catalyst is not covered with the polyvinyl alcohol (exposed portion of the primary material) 1b,
1c.
【0029】(E)工程(図2参照):二次側溶解の工
程である。前述したように水や湯を用いてポリビニルア
ルコール2を溶解する。Step (E) (see FIG. 2): This is a step of secondary side dissolution. As described above, the polyvinyl alcohol 2 is dissolved using water or hot water.
【0030】(F)工程:金属めっきを行う工程であ
る。その方法はとくに制約を受けないが、実用上、無電
解めっき法が好ましい。めっき層の構成も単層でも複数
層でもよい。また、めっきする金属も当分野で公知のも
のでよい。たとえば3層の構成としてAu/Ni/Cu
/母材面とするのがよい。Step (F): a step of performing metal plating. The method is not particularly limited, but in practice, electroless plating is preferred. The configuration of the plating layer may be a single layer or a plurality of layers. Also, the metal to be plated may be a metal known in the art. For example, Au / Ni / Cu as a three-layer structure
/ It is better to use the base metal surface.
【0031】この金属めっきを施すことによって、筐体
1の内面1aには触媒層1cのパターン上に回路パター
ン3が形成されるとともに、外面1b、いわゆる体裁面
が金属めっき膜4で覆われることになる。なお、上記回
路パターン3の形成と上記外面1bのめっき膜形成工程
とは個々に行なうことも可能であるが、効率面からすれ
ば、同時に行なうことが好ましい。By applying this metal plating, the circuit pattern 3 is formed on the pattern of the catalyst layer 1 c on the inner surface 1 a of the housing 1, and the outer surface 1 b, the so-called appearance surface, is covered with the metal plating film 4. become. The formation of the circuit pattern 3 and the step of forming the plating film on the outer surface 1b can be performed individually, but are preferably performed simultaneously from the viewpoint of efficiency.
【0032】(G)工程:筐体内面1aに対してレジス
ト処理とはんだ処理を行ない、はんだ5は前記回路パタ
ーン3上に、またレジスト6はめっき膜の被われていな
い部分に形成される。Step (G): A resist process and a solder process are performed on the inner surface 1a of the housing, and a solder 5 is formed on the circuit pattern 3 and a resist 6 is formed on a portion where the plating film is not covered.
【0033】(H)工程:ここでは、外面1b側には、
金属めっき膜4上にたとえばスプレー塗装法やローラコ
ートを行なって、塗膜7を形成する。この外面1bには
前記(F)工程においてめっき膜4が既に形成されてお
り、これに塗膜7が強く付着する。Step (H): Here, on the outer surface 1b side,
The coating film 7 is formed on the metal plating film 4 by, for example, spray coating or roller coating. The plating film 4 has already been formed on the outer surface 1b in the step (F), and the coating film 7 is strongly adhered to this.
【0034】(I)工程:前記はんだ5の部分に電子部
品、たとえば抵抗チップ8を固着させる。この際、熱を
加えてはんだ5をリフローさせることが必要である。Step (I): An electronic component, for example, a resistor chip 8 is fixed to the solder 5. At this time, it is necessary to reflow the solder 5 by applying heat.
【0035】(J)工程:こうして製作した下ケース9
と、上記したと同様の別の工程で体裁面に金属めっき及
び塗装を施した上ケース10とを接合する。この接合に
は、たとえば超音波振動ホーン(振動部)11をあてが
って、超音波溶着法を実施するのがよい。Step (J): Lower case 9 thus manufactured
And the upper case 10 in which the metal plating and painting are applied to the appearance surface in another process similar to the above. For this joining, for example, an ultrasonic vibration horn (vibrating part) 11 is preferably applied, and an ultrasonic welding method is performed.
【0036】以上は本発明の好ましい一実施形態を示し
たのにすぎず、本発明はその要旨を外れない限りにおい
て、種々の実施形態とり得るものである。The above is only a preferred embodiment of the present invention, and the present invention can take various embodiments without departing from the gist of the present invention.
【0037】[0037]
【実施例】次に、実施例について更に具体的に本発明を
説明するが、本発明がそれに限定されることは言うまで
もないことである。EXAMPLES Next, the present invention will be described in more detail with reference to Examples, but it goes without saying that the present invention is limited thereto.
【0038】実施例1 (1)樹脂成形体の製造 粉末状液晶ポリエステル(ポリプラスチック(株)製、
ベクトラ)を押出機により温度300〜360℃で溶融
混練し、6mmφのペレットを得た。その際、押出機の
スクリュー回転数は樹脂の発熱、分解を防ぐため、50
0rpm以下とした。 Example 1 (1) Production of Resin Molded Product Powdery liquid crystalline polyester (manufactured by Polyplastics Co., Ltd.)
Vectra) was melt-kneaded at a temperature of 300 to 360 ° C. using an extruder to obtain 6 mmφ pellets. At this time, the screw rotation speed of the extruder is set at 50 to prevent heat generation and decomposition of the resin.
0 rpm or less.
【0039】次に、図5に示したような射出成形機(東
芝社製(1S75E)を用いて、そのホッパーに上記ペ
レットを投入し、射出シリンダーの温度を250〜33
0℃(ホッパー側から金型側にかけて段階的に昇温させ
た)、金型温度を150℃、射出圧を140kg/cm
2に保持して、図6に示すような筐体を成形した。そし
て前記液晶ポリエステルの種類を変えるか、又は添加物
を加えるか、更には成形品を表面処理(アルカリエッチ
ング、本発明に基づくめっき処理等)することによって
下記の7種の筐体試料を用意した。Next, using an injection molding machine (1S75E, manufactured by Toshiba Corporation) as shown in FIG. 5, the pellets were put into the hopper, and the temperature of the injection cylinder was adjusted to 250 to 33.
0 ° C. (the temperature was increased stepwise from the hopper side to the mold side), the mold temperature was 150 ° C., and the injection pressure was 140 kg / cm.
2, and a casing as shown in FIG. 6 was formed. Then, the following seven kinds of casing samples were prepared by changing the type of the liquid crystal polyester, adding an additive, and further subjecting the molded article to surface treatment (alkali etching, plating treatment based on the present invention, and the like). .
【0040】(1)C820(表面性向上メッキグレー
ド) (2)A410(低異方性グレード) (3)A950(無充填グレード) (4)B130(ガラス繊維強化超高剛性グレード) (5)LCX364(流動性改善グレード) (6)C810(標準めっき(Cu/Ni/Au)グレ
ード):本発明品に相当 (7)C810(表面アルカリエッチング+めっき処理
品):本発明品に相当(1) C820 (Plating grade with improved surface properties) (2) A410 (Low anisotropy grade) (3) A950 (Unfilled grade) (4) B130 (Glass fiber reinforced ultra-high rigidity grade) (5) LCX364 (fluidity improving grade) (6) C810 (standard plating (Cu / Ni / Au) grade): equivalent to the present invention (7) C810 (surface alkali etching + plating treated article): equivalent to the present invention
【0041】塗装条件:前記試料を、下記2種類の塗料
を別々に用いて塗装した。なお、この塗装に先立って、
その表面をイソプロピルアルコール(IPA)で丹念に
拭いた。 (イ)アクリル/シリコン系塗料(アルティパワール
ド、武蔵塗料社製) 配合比:主剤(アンチパワールド・ブラック787):
硬化剤(787−10B):シンナー(アンチパワール
ドシンナ−27885)=10:1:8(重量比) (ロ)無電解めっき用プライマー(MPCスーパープラ
イマー) 配合比:主剤(スーパープライマークリヤー):硬化剤
(8954NY):シンナー(スーパープライマーシン
ナー2868)=10:1:4(重量比) 注)ただし、括弧内の数値は品番を指す。Coating conditions: The sample was coated using the following two types of coatings separately. Prior to this painting,
The surface was carefully wiped with isopropyl alcohol (IPA). (A) Acrylic / silicone paint (Altipa World, manufactured by Musashi Paint Co., Ltd.) Compounding ratio: Main agent (antipa world black 787):
Curing agent (787-10B): thinner (anti-pa world thinner 27885) = 10: 1: 8 (weight ratio) (b) Primer for electroless plating (MPC super primer) Compounding ratio: main agent (super primer clear): Curing agent (8954NY): Thinner (Super Primer Thinner 2868) = 10: 1: 4 (weight ratio) Note) Numerical values in parentheses indicate part numbers.
【0042】(3)試験項目及び条件:下表の条件で塗
膜の剥離及び付着性の試験を行った。(3) Test items and conditions: The peeling and adhesion tests of the coating film were performed under the conditions shown in the following table.
【表1】 [Table 1]
【0043】(4)試験結果 上記試験の結果のうち、塗料としてアクリル/シリコン
系塗料を用いた場合を、下表に示す。(4) Test Results The results of the above tests are shown in the table below when acrylic / silicone paint is used as the paint.
【表2】 ○…合格 ×…剥離 注)3ケの試料のうち、全てが良品の場合に「○」、1
ケでも不良な場合は「×」とした。[Table 2] ○… Pass ×× Peeling Note) When all of the three samples are non-defective, "○", 1
If the test was not successful, it was rated "x".
【0044】上記に明らかなように、筐体の非めっき面
では塗膜が一様に剥離したが、めっき面では塗膜の付着
力が強く、外装品として良好な結果を示した。なお、塗
料として無電解めっき用プライマーを用いた場合も、上
記と同様の結果が得られた。As apparent from the above, the coating film was uniformly peeled off on the non-plated surface of the housing, but the coating film had a strong adhesive force on the plated surface, and showed good results as an exterior product. In addition, when the primer for electroless plating was used as the paint, the same result as described above was obtained.
【0045】[0045]
【発明の作用効果】本発明は上述した如く、液晶ポリマ
ーからなる成形体に金属膜を形成し、この金属膜の表面
に塗装を施すので、従来技術では得られなかった付着力
の大きな、剥離し難い塗膜を工数少なくして得ることが
できる。As described above, according to the present invention, a metal film is formed on a molded body made of a liquid crystal polymer, and the surface of the metal film is coated. A coating film that is difficult to perform can be obtained with a reduced number of steps.
【0046】そして、特に電子、電気製品向けには、筐
体等の樹脂成形体の塗装時に配線回路用の非塗装部分を
残しておくことによって、塗装部は外観向上用に、非塗
装部は電子回路等の機能用と、外装と機能の一体化した
商品価値の高い樹脂成形体を高い効率で提供することが
可能である。In particular, for electronic and electric products, by leaving a non-painted portion for a wiring circuit when coating a resin molded body such as a housing, the painted portion is used for improving the appearance, and the unpainted portion is used for improving the appearance. It is possible to provide a highly productive resin molded product having a function for an electronic circuit or the like and an exterior and a function integrated with high efficiency.
【図1】本発明に基づく筐体作製工程を順次示す縦断面
図である。FIG. 1 is a longitudinal sectional view sequentially showing a housing manufacturing process based on the present invention.
【図2】同、工程の続きを示す縦断面図である。FIG. 2 is a longitudinal sectional view showing a continuation of the process.
【図3】同、工程の更に続きを示す縦断面図である。FIG. 3 is a longitudinal sectional view showing a further continuation of the process.
【図4】液晶ポリマーの物性を他高分子化合物と比較し
て示す表である。FIG. 4 is a table showing physical properties of a liquid crystal polymer in comparison with other polymer compounds.
【図5】本発明に基づいて筐体を成形するための射出成
形機とその動作を示す概略断面図である。FIG. 5 is a schematic sectional view showing an injection molding machine for molding a housing based on the present invention and its operation.
【図6】同、成形された筐体の斜視図である。FIG. 6 is a perspective view of the molded housing.
1…筐体、1a…内面、1b…外面、1c…触媒浸透
部、2…ポリビニルアルコール、3…回路パターン、4
…金属めっき膜、5…はんだ、6…レジスト、7…塗
膜、8…チップ、9…下ケース、10…上ケース、11
…ホーン、18…キャビティ、19…スクリュー、20
…射出成形機、21…固定型、22…可動型、23…射
出シリンダー、24…ペレット、25…ホッパー、26
…ヒーターDESCRIPTION OF SYMBOLS 1 ... Housing, 1a ... Inner surface, 1b ... Outer surface, 1c ... Catalyst penetration part, 2 ... Polyvinyl alcohol, 3 ... Circuit pattern, 4
... metal plating film, 5 ... solder, 6 ... resist, 7 ... coating film, 8 ... chip, 9 ... lower case, 10 ... upper case, 11
... horn, 18 ... cavity, 19 ... screw, 20
... Injection molding machine, 21 ... Fixed mold, 22 ... Movable mold, 23 ... Injection cylinder, 24 ... Pellet, 25 ... Hopper, 26
…heater
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) H05K 1/02 H05K 1/02 A 5E343 3/18 3/18 E 3/34 507 3/34 507C 5/02 5/02 J (72)発明者 中吉 浩和 東京都品川区北品川6丁目7番35号 ソニ ー株式会社内 Fターム(参考) 4D075 AA01 BB87X CA04 CA18 CA21 DA23 DB48 DC19 DC22 EA05 4E360 AA02 AB02 AB42 EE02 EE12 EE13 GA06 GA51 GB26 GB97 GC08 4F100 AB00B AK25 AK41A AK52 AL05 AS00A AT00A BA03 BA07 BA10C CA02 CC00C EH36 EH71B GB41 JK06 JL11 5E319 AA03 AC02 BB05 CC33 5E338 AA05 AA16 BB63 BB75 CC01 CC05 EE13 EE22 5E343 AA16 BB17 BB23 BB24 BB44 BB71 CC71 CC73 DD33 ER04 FF01 FF16 FF27 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H05K 1/02 H05K 1/02 A 5E343 3/18 3/18 E 3/34 507 3/34 507C 5 / 02 5/02 J (72) Inventor Hirokazu Nakayoshi 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo F-term in Sony Corporation (reference) 4D075 AA01 BB87X CA04 CA18 CA21 DA23 DB48 DC19 DC22 EA05 4E360 AA02 AB02 AB42 EE02 EE12 EE13 GA06 GA51 GB26 GB97 GC08 4F100 AB00B AK25 AK41A AK52 AL05 AS00A AT00A BA03 BA07 BA10C CA02 CC00C EH36 EH71B GB41 JK06 JL11 5E319 AA03 AC02 BB05 CC33 5E338 AA05 AA16 BB05 BB17 BB17 BB17 BB17 BB17 BB17 BB17 BB75 FF01 FF16 FF27
Claims (13)
形成し、この金属膜の表面に塗装を施す、樹脂成形体の
塗装方法。1. A method for coating a resin molded article, comprising forming a metal film on a molded article made of a liquid crystal polymer, and applying a coating on the surface of the metal film.
液晶ポリマーが液晶ポリエステルである、請求項1に記
載の樹脂成形体の塗装方法。2. The method according to claim 1, wherein the metal film is a metal plating film, and the liquid crystal polymer is a liquid crystal polyester.
の筐体の体裁面に前記塗装を施す、請求項1に記載の樹
脂成形体の塗装方法。3. The method for coating a resin molded article according to claim 1, wherein the molded article is a housing of an electronic device, and the coating is applied to a appearance surface of the housing.
携帯電話用筐体である、請求項3に記載の樹脂成形体の
塗装方法。4. The method according to claim 3, wherein the housing is a memory stick housing or a mobile phone housing.
び外面に金属膜をそれぞれ形成し、これらのうち、前記
内面の金属膜を配線回路に用い、前記外面の金属膜に前
記塗装を施す、請求項1に記載の樹脂成形体の塗装方
法。5. A metal film is formed on each of an inner surface and an outer surface of the casing made of the liquid crystal polymer, and among these, the inner metal film is used for a wiring circuit, and the coating is applied to the outer metal film. A method for coating a resin molded article according to claim 1.
前記配線回路を形成する工程と、前記筐体の外面に金属
めっき膜を形成する工程とを、同時に行なう、請求項5
に記載の樹脂成形体の塗装方法。6. The step of forming the wiring circuit made of a metal plating film on the inner surface of the housing and the step of forming a metal plating film on the outer surface of the housing are performed simultaneously.
The method for coating a resin molded article according to the above.
電子部品をマウントする、請求項5に記載の樹脂形成体
の塗装方法。7. The method according to claim 5, wherein an electronic component is mounted on the wiring circuit on the inner surface of the housing.
属膜が形成され、更にこの金属膜上に塗装が施されてい
る、塗装品。8. A coated article in which a metal film is formed on a surface of a molded body made of a liquid crystal polymer, and a coating is applied on the metal film.
液晶ポリマーが液晶ポリエステルである、請求項8に記
載の塗装品。9. The coated article according to claim 8, wherein the metal film is a metal plating film, and the liquid crystal polymer is a liquid crystal polyester.
この筐体の体裁面に前記塗装が施されている、請求項8
に記載の塗装品。10. The electronic device according to claim 10, wherein the molded body is a housing of an electronic device.
The said coating is given to the appearance surface of this housing | casing.
Painted products described in.
は携帯電話用筐体である、請求項10に記載の塗装品。11. The coated article according to claim 10, wherein the housing is a memory stick housing or a mobile phone housing.
には金属めっき膜からなる配線回路が、また外面には金
属めっき膜がそれぞれ形成され、この金属めっき膜の表
面に前記塗装が施されている、請求項8に記載の塗装
品。12. A wiring circuit made of a metal plating film is formed on the inner surface of the casing made of the liquid crystal polymer, and a metal plating film is formed on the outer surface. The coating is applied to the surface of the metal plating film. The coated article according to claim 8, wherein
に電子部品がマウントされている、請求項12に記載の
塗装品。13. The painted product according to claim 12, wherein an electronic component is mounted on the wiring circuit on the inner surface of the housing.
Priority Applications (1)
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JP2000193014A JP4432221B2 (en) | 2000-06-27 | 2000-06-27 | Method for manufacturing casing for electronic device and method for manufacturing electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000193014A JP4432221B2 (en) | 2000-06-27 | 2000-06-27 | Method for manufacturing casing for electronic device and method for manufacturing electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2002001209A true JP2002001209A (en) | 2002-01-08 |
JP4432221B2 JP4432221B2 (en) | 2010-03-17 |
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ID=18692075
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JP2000193014A Expired - Fee Related JP4432221B2 (en) | 2000-06-27 | 2000-06-27 | Method for manufacturing casing for electronic device and method for manufacturing electronic device |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101543A (en) * | 2003-08-15 | 2005-04-14 | Semiconductor Energy Lab Co Ltd | Resist composition and fabricating method of semiconductor device using it |
JP2015039661A (en) * | 2013-08-21 | 2015-03-02 | 株式会社村田製作所 | Method of manufacturing electronic component |
WO2015108085A1 (en) * | 2014-01-14 | 2015-07-23 | 太陽インキ製造株式会社 | Three-dimensional circuit board and solder resist composition used for same |
-
2000
- 2000-06-27 JP JP2000193014A patent/JP4432221B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101543A (en) * | 2003-08-15 | 2005-04-14 | Semiconductor Energy Lab Co Ltd | Resist composition and fabricating method of semiconductor device using it |
JP2015039661A (en) * | 2013-08-21 | 2015-03-02 | 株式会社村田製作所 | Method of manufacturing electronic component |
WO2015108085A1 (en) * | 2014-01-14 | 2015-07-23 | 太陽インキ製造株式会社 | Three-dimensional circuit board and solder resist composition used for same |
CN105917751A (en) * | 2014-01-14 | 2016-08-31 | 太阳油墨制造株式会社 | Three-dimensional circuit board and solder resist composition used for same |
JPWO2015108085A1 (en) * | 2014-01-14 | 2017-03-23 | 太陽インキ製造株式会社 | 3D circuit board and solder resist composition used therefor |
EP3096592A4 (en) * | 2014-01-14 | 2018-01-17 | Taiyo Ink Mfg. Co., Ltd. | Three-dimensional circuit board and solder resist composition used for same |
Also Published As
Publication number | Publication date |
---|---|
JP4432221B2 (en) | 2010-03-17 |
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