JP2001343332A - Method and device for evaluating electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and a device for evaluating electronic parts capable of improving the quality and obtaining a high yield by evaluating the quality of various thin films in a many-sided manner in manufacturing line. SOLUTION: In this evaluation method, a substrate is irradiated with light, reflected light from the substrate is taken in as linear light for spectroscopic analysis, and the substrate is inspected for evaluation.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a method for forming various types of metal, insulating film, transparent conductive film, etc. on a single or plural regions on a substrate of metal, glass, plastic, ceramics, silicon or the like having a columnar or flat shape. The present invention relates to an evaluation method and an evaluation apparatus for an electronic component formed by forming a thin film and performing various processes, and more specifically, to reduce the occurrence of defects in these electronic components, improve the yield, stabilize the quality, The present invention relates to a method and an apparatus for evaluating an electronic component for stabilizing an operation rate by predicting a service life and a trouble. Further, more specifically, for example, a liquid crystal display device including a substrate having a liquid crystal alignment film subjected to an alignment treatment such as rubbing, a semiconductor integrated circuit element having a thin film on the substrate, an image sensor, a plasma display device, and an EL display The present invention relates to an apparatus, a digital mirror device, various sensors for temperature, pressure, sound waves, and the like, and a method and an apparatus for evaluating electronic components such as a solar cell and a photosensitive drum.

[0002]

2. Description of the Related Art A product to which the present invention is directed relates to electronic components in general, and among them, a liquid crystal display device will be mainly described.

[0003] Among various display devices, a liquid crystal display device is relatively light, small, and thin, and is expected to be widely applied to information terminals, video cameras, wall-mounted televisions, head-mounted displays, and the like. In addition, applications for various monitors and displays of personal computers are on a growing trend, and there is a demand for a screen with higher definition, a wider viewing angle, a larger size, and the like. Further, from the viewpoint of cost reduction, the size of the manufacturing substrate has been increased. To meet these demands, it is necessary to more uniformly and stably align the liquid crystal molecules. The rubbing method of rubbing a substrate on which an organic film such as a polyimide film is formed with a rotating roller wrapped with a cloth filled with fibers in a certain direction is effective for giving liquid crystal molecules a desired pretilt angle. is there. Further, even in a large substrate, the liquid crystal molecules can be relatively uniformly and stably aligned in the liquid crystal display device. For this reason,
As a simple and inexpensive method, it is widely used in the production of liquid crystal display devices.

In the manufacture of a liquid crystal display device, a metal film,
Various thin films such as an insulating film, a semiconductor film, and a transparent conductive film are formed in a plurality of layers through many steps. In particular, a large liquid crystal display device may be formed on a large substrate of about 1 meter square.

In the formation of the above-mentioned alignment film and various thin films, (a) an alignment film having a uniform thickness is formed in order to stably perform a uniform alignment treatment of liquid crystal molecules, and (b) display quality is improved. It is important to prevent foreign substances and scratches that degrade the film quality and to (c) uniformly form various thin films. Further, it is important for the color filter layer to be formed accurately, preventing foreign matters, scratches and color loss. In addition, the color filter layer
There are many colors such as three colors such as red (R), green (G) and blue (B), or four colors including black, but not limited to these.

The rubbing conditions used in the above-described rubbing method include the number of rotations of the roller, the feed speed of the substrate, the distance between the roller around which the fiber-implanted cloth is wound and the glass substrate with the organic thin film, and the rotation axis of the roller relative to the substrate. It is determined by parameters such as an angle. These factors vary over time or suddenly due to variations in some of these parameters. When variations of various factors of the alignment film occur in the substrate, the liquid crystal molecules are not uniformly aligned in the surface of the liquid crystal display element, causing color unevenness, luminance unevenness, and the like, and significantly degrade display quality. In addition, even if the rubbing conditions are fixed, fine scratches may occur on the surface of the rubbed organic thin film due to the deterioration, wear, or adhesion of foreign matter implanted on the rubbing cloth during mass production. May be. Conventionally, the determination of the state of the rubbed organic thin film or the determination of the quality of the rubbing process is performed by performing a lighting test by applying a signal voltage after actually assembling a liquid crystal display panel through several steps. Had been done.
For this reason, unless the liquid crystal display panel is actually assembled, it is not possible to find the above-mentioned defects that occur suddenly due to the rubbing process. Therefore, a large number of defective liquid crystal display devices must be produced while leaving the cause of the defect, resulting in a loss of materials, man-hours, and time, thereby increasing the production cost.

In order to solve the above problem, a method has been proposed in which, before assembling a liquid crystal display device, the alignment characteristics of a rubbed liquid crystal alignment film are inspected so that defective products are not assembled. JP-A-10-325958 and JP-A-9-126891). According to this method, the production yield of the liquid crystal display element can be improved and the production cost can be reduced.

[0008]

However, the above method is a method for performing an inspection dedicated to the rubbing process, and does not include the detection of scratches or foreign substances in the rubbing process, or the evaluation of the thickness of other insulating films and the like. , Use is limited. In addition, the method described in Japanese Patent Application Laid-Open No. 10-325958 has a problem that a large space is required for installing the inspection units because many inspection units are provided. For example, since a substrate transport unit and a heater are arranged below a substrate, a major remodeling is required to arrange the inspection unit on an existing line. Further, it is difficult to arrange the inspection unit compactly in-line even on a new line.
Further, when the substrate is an opaque substrate such as ceramics or silicon, or in an electronic component having an opaque film such as a light reflection film made of metal or the like on a substrate such as a reflection type liquid crystal display device, light is emitted. Since the light is not transmitted, the alignment film cannot be inspected.

In order to clarify the above-mentioned problems, a detailed description will be given of a recent manufacturing process in a large-scale manufacturing factory for a liquid crystal display device. TFT using thin film transistor
The drive type liquid crystal display device is manufactured by the manufacturing process shown in FIG. This manufacturing process differs depending on the manufacturer, and although not all liquid crystal display units are manufactured through the same process, they can be said to be substantially similar. FIG. 9 is a process chart showing a liquid crystal layer manufacturing process including an alignment film forming process by a rubbing method. The manufacturing process of a thin film transistor (TFT) drive type liquid crystal display device usually includes a cleaning process of cleaning the substrate received, a process of forming various inorganic thin films in a multilayer, and an organic transparent film for planarization. For example, a process for forming the above is arranged. Then, after a process of forming an alignment film, a process of assembling a liquid crystal cell, and other processes, a lighting inspection process for visually inspecting the appearance and function of a liquid crystal display device as a product ends.
The formation process of the alignment film usually starts with the alignment film printing process of printing the alignment film on the substrate surface that has been sent after the formation process of the electrode pattern and the like, and drying the alignment agent printed on the substrate surface. Through the orientation film drying and firing process to fire,
The rubbing step described above ends.

[0010] The liquid crystal cell assembling step usually starts with a bead dispersing step in which beads serving as spacers are uniformly dispersed on the substrate received from the alignment film forming step.
Next, a sealing agent application step of screen-printing a sealing agent on an outer edge region on the substrate surface, and a superposition step of bonding two substrates of a TFT substrate and a color filter substrate facing the TFT substrate are performed. Thereafter, a liquid crystal is injected into the inside of the liquid crystal cell through a gap forming step of curing the sealant while appropriately pressing the two substrates to form a liquid crystal cell, and then injecting the liquid crystal into the liquid crystal cell. The process is completed by a sealing process. The description of the subsequent manufacturing steps will be omitted. As described above, in addition to the above dozens of steps, an inspection step and an additional optical unit supply step,
Many processes such as transportation and loading into a storage system are required. In addition, many devices other than those described above are required.

[0011] The substrate size has recently been increased to about 1 m square, and as a result, liquid crystal manufacturing factories have continued to increase in size, and there has been a tendency for capital investment to maintain cleanliness and reinforce buildings. . In addition, the volume of quality control data is enormous, which increases costs, makes processing difficult, and the management of consumable parts such as inspection equipment is complicated along with product material management, causing troubles in production due to inventory supply errors. Is easy to occur.

In order to overcome the above situation, an apparatus for measuring the thickness of a transparent or translucent film formed on a substrate surface has been disclosed (Matsushita Intertechno's film metrics). As shown in FIG. 10, the film metrics include a light source and a spectrometer, and a main body 1 for calculating a film thickness.
02 from the work substrate 101 via the optical fiber 103
The light is irradiated from the tip tool 104 to the surface and the reflected light is received, and the in-line operation can be performed with a relatively compact device.

However, since the measurement is limited to the film thickness evaluation only, other evaluations cannot be performed. Moreover,
The film thickness measurement was also evaluated at only one point.

As shown in FIG. 11, as a device for evaluating unevenness of the alignment film, a light source unit 106 and a camera unit 107 for irradiating a substrate 105 with uniform light obliquely from above, an image processing unit (not shown) There is SIM SERIES (Seika Sangyo: trade name) consisting of an analyzer and an analyzer. By using this apparatus, unevenness of the alignment film and the like can be evaluated. However, it is necessary to uniformly irradiate the substrate with light for a long period of time, which is an obstacle to in-line operation. In addition, this device is a large-scale device, and it is very difficult to inline the liquid crystal panel manufacturing line. Also,
No film thickness measurement can be performed. Further, it takes time for the analysis calculation and the derivation of the pass / fail result, which is a hindrance factor for in-line conversion.

FIG. 12 shows an inspection apparatus for inspecting the surface of the substrate 108 for scratches or foreign matter by image processing. The substrate 108 is illuminated by a light source 109, and the image captured by the camera 110 is inspected by image processing. Here, it is surrounded by a dark room box 111 in order to prevent surrounding illumination and reflection. The dark room box 111 requires a minimum work inlet / outlet (not shown). Further, in the dark room, even a single screw may cause imprint depending on the illumination direction or the structure of the dark room, and the measurement may not be possible at that portion.

When the apparatus shown in FIG. 12 is used, it is difficult to evaluate a substrate having a columnar shape. Since the darkroom box is configured to cover the whole, the footprint increases in-line. Furthermore, it is not possible to measure the film thickness and the like.

Accordingly, the present invention provides a method and apparatus for evaluating an electronic component capable of improving quality and achieving a high yield by evaluating the quality of various thin films such as an alignment film provided in the electronic component in a multi-faceted manner in-line. The purpose is to provide.

[0018]

In a method for evaluating an electronic component according to a first aspect of the present invention, a substrate is irradiated with light, and reflected light from the substrate is taken in as linear light and spectrally analyzed. The substrate surface is inspected and evaluated (claim 1).

The above-mentioned electronic components include (a) various display devices such as a liquid crystal display device, a plasma display device, and a digital mirror device having a substrate having a columnar or flat shape, and (b) a line type or area type image and temperature. (C) various electronic components such as integrated circuits, solar cells, and photosensitive drums. The inspection target portions of the substrate are the front surface, the inside, and the back surface of the substrate. When a thin film is formed on the substrate, the inspection target portions include the front surface, the inside, and the back surface of the thin film. Further, when a laminated film is formed on the substrate, the surface, the inside, and the back surface of the laminated film are included.

With the above configuration, the following many effects can be obtained. (1) Surface analysis can be performed by moving the substrate in a direction perpendicular to the length direction of the line.
(2) According to the above configuration, since it takes up less space than a surface analysis device, it can be mounted compactly in an empty space of an existing manufacturing line. (3) In order to perform the spectroscopic analysis, the thickness of the inorganic film, the organic alignment film of the liquid crystal, the organic transparent film for flattening, etc., the inspection of the film thickness unevenness, the inspection for the presence or absence of scratches or foreign matter, the glass and the organic Numerous inspection items such as inspection of scratches on a film or the like, air bubbles, and color of a color filter can be targeted. For this reason, it is possible to reduce the number of inspection devices, and it is possible to incorporate the inspection devices compactly into a production line. Further, the number of stocks and storage locations can be reduced by using common consumable members such as lamps. further,
This makes it easy to use common hardware and software for test signal processing equipment, common use of processing personal computers, and integrate test data. (4) Since the reflected light is captured as linear light, evaluation can be performed on a cylindrical substrate such as a photosensitive drum of a copying machine. In addition, (5) if it is transparent or translucent, the inside or the back surface of the substrate and the thickness of the laminate can be inspected. For example, air bubbles and foreign matter in a glass substrate can be inspected. (6) Since the measurement unit is easily reduced in size, the movement of the measurement unit is relatively easy. Furthermore, (7) according to the inspection item,
Since it is relatively easy to change the resolution of the irradiation light at the irradiation position on the substrate surface, it is easy to inspect a plurality of inspection items.

In the above-mentioned embodiment of “taking in reflected light as linear light”, the light irradiated on the substrate is linear,
A form in which the reflected light is linear is included (claim 2).

According to the above-described embodiment, the line analysis can be performed simply and reliably without using a driving device or the like, as compared with the case where the substrate and the light irradiation and reflected light capturing unit are relatively moved using the spot irradiation light. Can be. The method for evaluating an electronic component according to the first aspect of the present invention includes:
It goes without saying that the case where the substrate and the light irradiation / reflected light capturing unit are relatively moved using the spot-shaped irradiation light to capture the reflected light as linear light is also included.

In the above-described embodiment of “taking in reflected light as linear light”, the light irradiated on the substrate surface is spot-shaped, and a light irradiation unit and a light take-in unit are provided.
The substrate and the substrate may be relatively moved in a line, and may be taken in as a line of light and spectrally analyzed.

As described above, the method for evaluating an electronic component according to the first aspect includes the above-described various embodiments and can perform various measurements. In the device that scans the spot-shaped irradiation light, there is basically no variation in the irradiation luminance of the light source depending on the position as compared with the device that uses the line-shaped irradiation light, and conversion such as the aforementioned color coordinate difference is unnecessary. In addition, it is easy to calibrate factors such as deterioration of the light source.

In the electronic component evaluation method according to the first aspect of the present invention, the inspection can be performed by a system capable of switching between line analysis for inspecting the substrate in a line and surface analysis for inspecting the substrate in a plane. (Claim 4). In the method for evaluating an electronic component according to the first aspect, in the line analysis, the substrate is irradiated with linear light to perform a line analysis. In the surface analysis, the line light and the substrate are relatively moved. Then, surface analysis is performed (claim 5).

The above analysis can be realized by relatively moving one or both of the substrate and the measurement unit at right angles to the longitudinal direction of the linear light.
The above-described surface analysis and line analysis include a case where the analysis is limited to a small area such as a predetermined sampling area. With the above configuration, it is possible to incorporate the evaluation device into the production line using a relatively small space as the installation location. For this reason, abnormalities in the production line, product defects, or prediction thereof can be detected immediately after the end of the production process, thereby reducing defective disposal.

In the method for evaluating an electronic component according to the first aspect of the present invention, at least the light irradiation unit and the light capturing unit may be further movable in a direction perpendicular to the linear movement direction. 6).

According to the above configuration, it is possible to deal with both vertical and horizontal unevenness by scanning the spot-shaped irradiation light.

In the method for evaluating an electronic component according to the first aspect of the present invention, a plurality of inspection items are inspected in inspecting a substrate.

According to the above configuration, it is possible to reduce the number of inspection devices arranged on the production line. Furthermore, the common use of consumable members such as lamps makes it possible to reduce the number of stocks and storage locations. In addition, promotion of common use of hardware and software of test signal processing equipment, reduction of the number of computers by common use of processing personal computers, and integration of test data are facilitated.

In the method for evaluating an electronic component according to the first aspect of the present invention, the inspection is performed by changing the resolution of light at the irradiation position on the substrate (claim 8).

In the line-shaped analyzer, the change of the resolution is performed by zooming the camera, moving the camera, and using a CCD (Charge Co.).
(upled Device). In the device that scans the spot-shaped irradiation light, the resolution can be changed by switching any one of the moving speed of the light receiving unit and the sampling period in taking in the reflected light. As a result, the resolution according to the inspection item is selected, the measurement accuracy is optimized, and the measurement time can be reduced.

In the method for evaluating an electronic component according to the first aspect of the present invention, the reflected light from the substrate is taken in a line through a slit, and each part of the linear reflected light is spectrally analyzed and inspected ( Claim 9).

The above configuration has fewer movable parts and makes it easier to reduce the size and use it in a clean room as compared with an apparatus that scans spot-shaped irradiation light. Further, since the measurement time is short, it is easy to fit in the takt of the production line, and it is easy to realize in-line measurement.

In the method for evaluating an electronic component according to the first aspect of the present invention, the spectroscopic analysis is performed by using the assembled reflected light with a prism and a diffraction grating.

When the above-mentioned optical components, that is, the imaging spectroscope, are used, the light which has been split is excellent in the straightness and the CCD is used.
For example, when light is received and analyzed, the measurement accuracy is high and the analysis is easy. Although an imaging spectroscope has been conventionally known, no suggestion has been made to use this imaging spectroscope for evaluating electronic components or for multipurpose inspection, for example, evaluation of an alignment film of a liquid crystal display device.

In the method for evaluating an electronic component according to the first aspect of the present invention, the light measuring system is moved in a direction along the longitudinal direction of the linear light for analysis.

According to the above configuration, the optical measurement system can be moved in the direction along the line according to the measurement resolution, the possible distance range between the work board and the measuring instrument, and the measurement width of the work board. High resolution can be maintained and interference with other devices and members in the line of the measuring instrument can be avoided. In the method for evaluating an electronic component according to the first aspect of the present invention, in which the measuring device can be compactly arranged in a manufacturing line, the measuring device can be further moved in a direction perpendicular to the longitudinal direction. ).

With the above configuration, for example, in the unevenness analysis, it is possible to arbitrarily select and analyze vertical unevenness and horizontal unevenness. The unevenness of the alignment film of the liquid crystal display device may occur in both the vertical and horizontal directions with respect to the alignment film supply direction, depending on the cause of the unevenness. be able to.

In the electronic component evaluation method according to the first aspect of the present invention, the result of the spectroscopic analysis is replaced with a calculated color value and used for evaluation (claim 13).

As described above, the calculated color values (L, a, b)
The evaluation of the above various inspection items and data accumulation can be performed from the color difference ΔE with the reference value. As a result, the spectral result is displayed as an intensity distribution with respect to the light wavelength for each measurement point. In order to perform analysis and evaluation at each measurement point, it is better to convert to a one-dimensional value, for example, to convert to a film thickness value. However, there are cases where the physical properties of the constituent materials of the thin film are unknown, cases where conversion is impossible depending on the pattern structure of the lower layer film, and the like, and cases where errors are large. In such a case, for example, the difference in film thickness can be determined based on the difference in color from the distributed light. This difference in color distribution makes it easier to determine the unevenness of the film thickness in the process of processing on the production line and also in the off-line inspection than by numerically judging the unevenness of the film thickness. It becomes possible to do.
If there is unevenness in the linear irradiation light, an abnormal portion of the linear irradiation light can be determined by displaying the difference between the color coordinate values from the standard work as some color value. As a result, even when the substrate is warped and the optical axis of the reflected light is shifted depending on the measurement location, the inspection can be performed without the influence of the warpage. Further, measurement becomes easy even with a large substrate. For example, the substrate of the liquid crystal display device has a thickness of 1.1 mm and a size of several hundred mm square or more. These substrates do not like dust entrapment or scratching, but the applied resist may wrap around to the back surface. For this reason, it is often the case to avoid receiving a flat stage over the entire surface.

In the method for evaluating an electronic component according to the first aspect of the present invention, the unevenness of the alignment film is evaluated.
4).

According to the above configuration, the size can be reduced compared with the conventional apparatus for evaluating the unevenness of the alignment film, and the apparatus can be compactly incorporated into a production line to realize in-line measurement.

In the method for evaluating an electronic component according to the first aspect of the present invention, the inspection target items include film unevenness of the alignment film, film thickness unevenness, presence / absence of a scratch, adhesion of foreign matter, air bubbles, and discoloration of the color filter. Are evaluated at the same opportunity for at least two items (claim 15).

With the above configuration, the number of inspection devices can be reduced, the hardware and software of inspection signal processing equipment can be shared, the number of inspection computers can be reduced by using a common processing personal computer, and the integration of inspection data can be facilitated. Can be measured. In addition, a common consumable member such as a lamp can reduce the number of stocks and the number of storage locations.

In the method for evaluating an electronic component according to the first aspect of the present invention, a rod-shaped light guide is used for the light source unit.

By using the rod-shaped light guide, calibration on the substrate can be performed more compactly than in a fiber-type light guide in which a plurality of fibers are routed in a T-shape. Further, it is easy to directly connect the light sources.

In the electronic component evaluation method according to the first aspect of the present invention, a light source directly connected to a light guide is used.
7).

According to the above configuration, the loss of light is smaller than in the case where the light passes through a fiber, and the measurement can be easily performed even on a substrate having a large area. Further, the light source unit can be made more compact.

In the method for evaluating an electronic component according to the first aspect of the present invention, a halogen lamp including an infrared cut filter is used as a light source.

As described above, since the infrared region is cut, it is possible to suppress an increase in the temperature of the work, for example, to suppress variation in the measurement even for the alignment film during drying, and to realize in-line measurement. it can.

In the method for evaluating an electronic component according to the first aspect of the present invention, a deuterium lamp is further provided as a light source.

With the above configuration, even a thin film having a thickness of about several tens of nm, for example, ITO used for a liquid crystal panel, can be measured with relatively high accuracy. The thickness range can be expanded.

The electronic component evaluation device according to the first aspect of the present invention is an evaluation device that is used by being incorporated into an electronic component production line. This evaluation device includes a light irradiation unit that irradiates light to the substrate, a reflected light capture unit that captures the reflected light from the substrate in a line, a spectroscopic analyzer that performs spectral analysis of the reflected light, and a result of the spectral analysis. Based on the inspection target items, unevenness of alignment film, unevenness of film thickness, presence or absence of scratches, adhesion of foreign matter,
A signal processing device is provided for performing signal processing on at least one of the bubble and the color filter color fading (claim 20).

With the above-described evaluation device, the following many effects can be obtained. (1) Surface analysis can be performed by moving the substrate in a direction perpendicular to the length direction of the line. (2) According to the above configuration, since it takes up less space than a surface analysis device, it can be mounted compactly in an empty space of an existing manufacturing line. (3) In order to perform the spectroscopic analysis, the thickness of the inorganic film, the organic alignment film of the liquid crystal, the organic transparent film for flattening, etc., the inspection of the film thickness unevenness, the inspection for the presence or absence of scratches or foreign matter, the glass and the organic Membrane wounds, bubbles,
A large number of inspection items such as inspection of the color of a color filter can be targeted. For this reason, it is possible to reduce the number of inspection devices, and it is possible to incorporate the inspection devices compactly into a production line. Further, the number of stocks and storage locations can be reduced by using common consumable members such as lamps. Further, the hardware and software of the inspection signal processing device can be shared, the processing personal computer can be shared, and the inspection data can be easily integrated. (4) Since the reflected light is captured as linear light, evaluation can be performed on a cylindrical substrate such as a photosensitive drum of a copying machine. In addition, (5) if it is transparent or translucent, the inside or the back surface of the substrate and the thickness of the laminate can be inspected. For example, air bubbles and foreign matter in a glass substrate can be inspected. Also, (6)
Since the measurement unit is easily reduced in size, the movement of the measurement unit is relatively easy. Further, (7) it is relatively easy to change the resolution of the irradiation light at the irradiation position on the substrate surface according to the inspection item, so that it is easy to inspect a plurality of inspection items. Note that the above-described “capturing reflected light as linear light” includes (A) light that irradiates the substrate surface is linear, reflected light is linear, and (B) spot light irradiation. Both the form in which the substrate and the light irradiation / reflected light capturing unit are relatively moved using light to capture the reflected light as linear light is included.

[0056]

Next, embodiments of the present invention will be described with reference to the drawings. Although the present embodiment is directed to an alignment film, the present embodiment can also be used for in-line or off-line inspection in various electronic component evaluation methods.

(Embodiment 1) FIG. 1 is a diagram showing an electronic component evaluation method according to Embodiment 1 of the present invention. In FIG. 1, a roller feeder 3 having a built-in heater (not shown) for drying an alignment film is arranged between an alignment film coating device 1 and a rubbing device 2. An inspection system is provided.

For example, a columnar light guide 5 extending long in the direction perpendicular to the paper and a condensing lens 6 (for example, Nippon P.I. ) Made by Linear Bright). A halogen lamp (not shown) as a light source, which is almost directly fixed to the side of the light guide 5 and has an infrared cut filter, is used. A linear light extending from the position in the direction perpendicular to the plane of the drawing is applied to the point P on the substrate. This reflected light is taken in a line form through a slit, and a spectroscope 7 (for example, an imaging spectroscope “ImSpector” manufactured by Kawatetsu Techno Research Inc.) incorporating a prism and a combination of a diffraction grating and a prism is used. Camera system). With this configuration, it is possible to receive and split reflected light that is reflected from the vicinity of the linear portion P of the substrate 4 and extends in the direction perpendicular to the paper surface, thereby obtaining a wavelength distribution intensity (spectrum). This spectral data can be obtained at a resolution pitch of the linear portion P on the substrate in the direction perpendicular to the paper surface. The resolution of the linear light extending in the direction perpendicular to the paper surface in the horizontal direction of the paper surface is, for example, about 0.29 mm. Therefore, the spectrum of the reflected light can be obtained at the pitch of this resolution. If the roller 3a is stationary during the measurement, predetermined line-shaped data is obtained. If the measurement is performed while the roller 3a is stationary and the movement is repeated, sampling data is obtained. Further, if the measurement is continuously performed while the roller is rotating and the substrate is moving, it is possible to perform a surface analysis with a resolution corresponding to the substrate speed and the data sampling time. In addition, since the light source is provided with the infrared region cut filter, fluctuations in drying conditions can be eliminated even when the present system is installed in the substrate drying step.

Since the tendency of the alignment unevenness occurs almost continuously, the unevenness of the alignment film thickness can be inspected by measuring the spectrum of the linear light. In addition, unevenness in the alignment film thickness is likely to occur in one of the vertical direction and the horizontal direction of the substrate, depending on the configuration of the production line. However, since there is not necessarily only one, if there is room in space or the like, the measurement system or the substrate may be rotated by 90 degrees to perform measurement in both directions. From the results of the spectroscopic analysis, the refractive index is n,
The wavelengths at which the reflectance is maximum and minimum are λ _2m ,
Assuming λ _{2m + 1} , the film thickness d can be obtained by the following equation. d = (1 / n) × λ _2m × λ _{2m + 1} ÷ ｛4 × (λ _2m −
λ _{2m + 1} )｝ In addition to the alignment film, the system
It can also be used for various inspections such as film thickness, film thickness unevenness, surface flaws, color filter color fading, etc. of thin films such as m Tin Oxide) and SiN. In addition, in order to detect the unevenness of the alignment film, the resolution is set to 0.29 mm, which has an inspection record, but it is preferable to change the resolution to a resolution suitable for the inspection purpose by changing the camera angle as necessary. .

In this embodiment, the number of lines is 480.
Camera (CJ-M300D made by JAI Corporation)
C "), the measurement was performed in an area corresponding to a length of about 140 mm of the linear light. Further, using the above camera, as shown in FIG. 2 when the film thickness unevenness is abnormal, and as shown in FIG. 3 when the film thickness unevenness is normal, a color display corresponding to the color difference is confirmed on the display, and visually observed. Confirmed that it can be determined. That is, FIG. 2 shows color display according to the color difference when the film thickness unevenness is abnormal, and FIG. 3 shows color display according to the color difference when the film thickness unevenness is normal. Since the film thickness unevenness occurs suddenly on almost the entire surface of the substrate,
The camera may be fixed, but the whole system may be moved in the direction perpendicular to the paper in the arrangement of FIG. 1 so as to be convenient for inspecting a large substrate having a side length of several hundred mm. Further, the resolution may be reduced by zooming up the camera, and the surface of the alignment film may be inspected for scratches or foreign matter.

In the above, the present invention has been described by taking an alignment film of a liquid crystal display device as an example of an electronic component.
For example, it goes without saying that the present invention can be applied to an inorganic film, an organic transparent film for planarization, and the like. That is, the present invention can be used for inspection of the above-mentioned other thin film scratches and foreign matter adhesion, film thickness, film thickness unevenness, scratches on glass and the above-mentioned organic film, bubbles, color of a color filter, and the like. In addition, the thin I
It is desirable to use a deuterium lamp as a light source for measuring the film thickness such as TO. In this case, the halogen light is incident on one end of the light guide 5 and the deuterium lamp light is incident on the other end, and switching is performed by a shutter or the like. As a result,
The light source system is simplified and miniaturized, so that inspection from a thin film to a thick film can be easily performed.

(Embodiment 2) FIG. 4 is a diagram showing a method for evaluating another electronic component of the present invention. The difference from FIG. 1 is that the substrate 4a is transported at a constant pitch by an intermittent feeder (not shown), and the substrate is arranged on a fixed heater 8 base. During intermittent feeding, the substrate 4a may be warped depending on the thickness, dimensions, and support structure of the substrate 4a. In preparation for the occurrence of such a warp, the sheet is conveyed while being raised, for example, by 20 mm to several tens of mm so as not to interfere with the apparatus and cause damage. For this reason, the camera 7a and the light source units 5a and 6a are arranged at a sufficient distance from the substrate.

(Embodiment 3) FIG. 5 is a diagram showing an electronic component evaluation method according to the present invention in Embodiment 3. In the present embodiment, the evaluation method is suitable for a case where there is a space between the devices 2b and 3b and the substrate is a light transmitting material. The light source units 5b and 6 are located below the space.
b, and the light receiving measurement system 7b is arranged on the upper part.
With this configuration, the measurement system can be installed compactly without making a major modification to the existing production line.

(Embodiment 4) FIG. 6 is a diagram for explaining an electronic component evaluation method according to the present invention in Embodiment 4. In the same figure, the tip tool 11 of the optical fiber is applied from the main body 9 to the surface of the work substrate 4c via the optical fiber 10.
And irradiates the light and receives the reflected light. Work board 4
By relatively moving c and the tip tool 11, receiving the light as linear light and performing spectral analysis, it is possible to relatively compactly measure the film thickness, foreign matter, scratches, and the like at each location. As for relative movement during measurement, it is desirable to move the work substrate 4a if there is no interference between the devices, but the tip tool 11 may be moved. When the tip tool 11 is moved, it is desirable to use a plastic fiber for the tip tool 11. However, even with a glass fiber, the life of the fiber can be extended by powder application or net division.

(Embodiment 5) FIG. 7 is a diagram illustrating an electronic component evaluation method according to the present invention in Embodiment 5. The tip tool 11 is placed on the substrate 4d that is moving with rollers or the like.
b was arranged, and the movable portion of the optical fiber was eliminated. The relative movement between the substrate and the tip tool for receiving as the linear light is realized by moving the entire measurement system. With this configuration, the measurement system can be installed relatively compactly without major modification of existing lines and the like.

Although the embodiments of the present invention have been described above, the embodiments of the present invention disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. Not limited. The scope of the present invention is shown by the description of the claims, and further includes all modifications within the meaning and scope equivalent to the description of the claims.

[0067]

By using the method and apparatus for evaluating an electronic component according to the present invention, the quality of various thin films such as an alignment film provided on the electronic component can be evaluated in-line from various aspects. As a result, the failure of the electronic component and the abnormality of the production line can be quickly detected, and a countermeasure can be taken immediately, so that it is possible to improve the quality and obtain a high yield.

[Brief description of the drawings]

FIG. 1 is a drawing for explaining an electronic component evaluation method according to a first embodiment of the present invention.

FIG. 2 shows a method for evaluating an electronic component shown in FIG.
5 is a diagram showing an abnormal alignment film when the color is replaced with a calculated value.

FIG. 3 shows a method for evaluating an electronic component shown in FIG.
5 is a drawing showing a normal alignment film when the color is calculated and replaced.

FIG. 4 is a drawing for explaining an electronic component evaluation method according to a second embodiment of the present invention.

FIG. 5 is a drawing for explaining an electronic component evaluation method according to a third embodiment of the present invention.

FIG. 6 is a diagram for explaining an electronic component evaluation method according to a fourth embodiment of the present invention.

FIG. 7 is a drawing for explaining an electronic component evaluation method according to a fifth embodiment of the present invention.

FIG. 8 is a flowchart showing a manufacturing process of the liquid crystal display device.

FIG. 9 is a flowchart illustrating a manufacturing process of a thin film transistor incorporated in a liquid crystal display device.

FIG. 10 is a view for explaining a conventional evaluation method for an alignment film of a liquid crystal display device.

FIG. 11 is a view for explaining another conventional evaluation method for an alignment film of a liquid crystal display device.

FIG. 12 is a drawing for explaining still another conventional evaluation method for an alignment film of a liquid crystal display device.

[Description of Signs] 1 Alignment film coating device, 2, 2a, 2b rubbing device,
3, 3a, 3b roller feeder, 4, 4a, 4b, 4
c, 4d substrate, 5, 5a, 5b light guide, 6,
6a, 6b condenser lens, 7, 7a, 7b optical camera system for spectral analysis, 9 spectral analyzer and signal processor, 10 optical fiber, 11 advanced tool, 14a
Irregular alignment film substrate with unevenness, 14b Non-uniformity normal alignment film substrate, light irradiation point on P substrate.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G02F 1/13 101 G02F 1/13 101 5G435 G09F 9/00 352 G09F 9/00 352 F-term (Reference) 2F065 AA30 AA49 BB01 BB03 BB15 CC17 CC25 CC31 DD02 GG02 GG03 GG16 HH04 HH05 HH12 JJ02 JJ08 JJ25 LL01 LL04 LL26 LL28 LL42 LL46 LL67 MM01 MM02 2G051 AA42 AA61 AA90 BB01 BB03 BA01 BB02 BA01 BB02 EE10 EE13 GG03 HH02 HH03 JJ05 JJ06 JJ11 JJ17 KK04 2G086 EE01 EE04 EE05 EE10 2H088 FA10 FA12 FA17 FA25 FA26 FA30 HA03 MA16 MA18 5G435 AA00 AA17 BB05 BB06 EE33 KK05 KK09 KK10

Claims (20)

[Claims] 1. A method for evaluating an electronic component, comprising: irradiating a substrate with light, taking in reflected light from the substrate as linear light, performing spectral analysis, and inspecting and evaluating the substrate. 2. The method for evaluating an electronic component according to claim 1, wherein the light applied to the substrate has a linear shape, and the reflected light has a linear shape. 3. The method according to claim 1, wherein the light applied to the substrate has a spot shape, and the light irradiation unit and the light capturing unit are relatively moved in a line shape, and the light is captured as linear light. The method for evaluating an electronic component according to claim 1, wherein the electronic component is subjected to spectroscopic analysis. 4. The inspection is performed by a system that can switch between line analysis for inspecting the substrate in a line and surface analysis for inspecting the substrate in a plane.
The electronic component evaluation method according to any one of the above. 5. In the line analysis, line analysis is performed by irradiating the substrate with linear light. In the surface analysis, the line analysis is performed by relatively moving the substrate and the light. Do,
The method for evaluating an electronic component according to claim 4. 6. The electron according to claim 1, wherein the light irradiation unit and the light capturing unit are further movable in a direction perpendicular to the linear relative movement direction. How to evaluate parts. 7. The method for evaluating an electronic component according to claim 1, wherein in the inspection of the board, an inspection is performed on a plurality of inspection items. 8. The method for evaluating an electronic component according to claim 1, wherein the inspection is performed by changing a resolution of the light at an irradiation position on the substrate. 9. The electronic component according to claim 1, wherein the reflected light from the substrate is taken in a line form through a slit, and each part of the linear reflected light is spectrally analyzed and inspected. Evaluation method. 10. The method for evaluating an electronic component according to claim 1, wherein the spectroscopic analysis is performed by using a set of a prism and a diffraction grating for the reflected light. 11. The method for evaluating an electronic component according to claim 1, wherein the analysis is performed by moving the optical measurement system in a direction along the longitudinal direction of the linear light. 12. The method for evaluating an electronic component according to claim 11, wherein the electronic component is further movable in a direction perpendicular to the longitudinal direction. 13. The method for evaluating an electronic component according to claim 1, wherein a result of the spectral analysis is replaced with a calculated color value and used for evaluation. 14. The method for evaluating an electronic component according to claim 1, wherein the evaluation of the film unevenness of the alignment film is performed. 15. The same opportunity is used to evaluate at least two of inspection target items, ie, film unevenness of the alignment film, film thickness unevenness, presence / absence of a flaw, adhesion of foreign matter, bubbles, and discoloration of the color filter. Item 14. The method for evaluating an electronic component according to any one of Items 1 to 13. 16. The method for evaluating an electronic component according to claim 1, wherein a rod-shaped light guide is used for the light source unit. 17. The method according to claim 16, wherein the light source directly connected to the light guide is used. 18. The method for evaluating an electronic component according to claim 1, wherein a halogen lamp including an infrared cut filter is used as a light source. 19. The method for evaluating an electronic component according to claim 18, further comprising a deuterium lamp as a light source. 20. An evaluation device incorporated in a production line of an electronic component and used, wherein: a light irradiation unit for irradiating light to a substrate; and a reflected light capturing unit for capturing reflected light from the substrate in a line form. And a spectroscopic analyzer that performs the spectroscopic analysis of the reflected light. Based on the result of the spectroscopic analysis, the inspection target items include film unevenness of the alignment film, film thickness unevenness, presence / absence of a scratch, adhesion of foreign matter, bubbles, and color. A signal processing device that performs signal processing on a result of the spectroscopic analysis for at least one of color fading of the filter.