JP2001338944A - Fixing jig, wiring board with fixing jig, electronic component mounted body, and manufacturing method thereof - Google Patents

Abstract

(57) [Problem] To provide an inexpensive and simple fixing jig in which electronic components can be removed even after mounting in flip chip mounting of electronic components. SOLUTION: A fixing jig 12 provided on a wiring board 101.
0 has a movable claw 123 and a positioning wall 128. The electronic component 105 is inserted from above the fixing jig 120. The movable claw 123 is retracted outward by the inclined surface 127, so that the electronic component 105 can be fitted between the positioning walls 128. After the fitting, the movable claw 123 is
And the positioning wall 128 is engaged with the electronic component 10.
5 is in contact with the surrounding wall. Thus, the electronic component can be flip-chip mounted. Further, the electronic component 105 can be easily removed even after mounting by moving the movable claw 123.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to various electronic components (for example, a semiconductor bare chip, a BGA (ball grid ar
ray), a CSP (chip size package, etc.) on a wiring board. In particular, the present invention relates to a fixing jig in which electronic components can be easily flip-chip mounted and can be easily replaced. Further, the present invention relates to a wiring board provided with such a fixing jig. The present invention also relates to a mounted body on which an electronic component is mounted using such a fixing jig, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become smaller and denser,
Not only for industrial use but also widely in the field of consumer equipment
There is a strong demand for flip chip mounting of semiconductor chips such as SI in a bare chip state.

[0003] In flip-chip mounting, a semiconductor chip is bonded to a substrate with a resin adhesive called underfill, so that once bonded, there is a problem that repair cannot be performed. This is an obstacle to adopting flip chip mounting.

[0004] In addition, semiconductor chip manufacturers have performed tests on bare chips and burn-in tests.
After performing t), it is necessary to remove the bare chip from the wiring board before shipping.

[0005] There is no fixing jig currently used as a fixing jig for mounting a flip chip so that a semiconductor chip can be easily detached from a wiring board. A part in which a frame for fixing the CSP is attached to a substrate on which contact pins are arranged has been experimentally used.

Japanese Patent Application Laid-Open No. Hei 2-268491 describes a method for interchangeably mounting a bipolar chip component having electrodes at both ends. The method is as follows. First, a pair of inclined metal plates is erected at both ends of the insulator plate to form a pedestal. Next, the pedestal is fixed on the wiring board. At this time, the pair of electrodes formed on the wiring board and the pair of inclined metal plates are respectively soldered and electrically connected. Next, the electrode at both ends of the bipolar chip component and the pair of inclined metal plates are brought into contact with each other, and the bipolar chip component is elastically held between the pair of inclined metal plates. As a result, the electrodes of the bipolar chip component and the electrodes of the wiring board are electrically connected via the inclined metal plate. According to this method, even after mounting the bipolar chip component, the bipolar chip component can be easily removed from the wiring board by releasing the elastic holding of the pair of inclined metal plates.

Japanese Patent Application Laid-Open No. 3-241847 describes a method of mounting a chip component having electrodes formed on one side. The method is as follows. First, the electrodes of the chip component are aligned with the electrodes on the wiring board, and the chip component is placed face down on the wiring board. Next, a substantially U-shaped cap is placed over the upper surface of the chip component (the surface on which the electrodes are not formed) via an elastic layer. Then, both feet of the cap are bonded to the wiring board. As described above, the chip component is pressed toward the wiring board by the cap via the elastic layer, and the electrical connection between the chip component and the wiring board is obtained.

[0008]

However, the above-mentioned conventional mounting methods have the following problems, respectively.

The CSP fixing jig has a very large construction. Therefore, it can be used for burn-in test of a semiconductor bare chip, but cannot be used for general electronic equipment at all in terms of cost and shape. Further, it is difficult to apply the method to a semiconductor chip having a narrow arrangement pitch of electrode pads.

In the mounting method of the bipolar chip component described in Japanese Patent Application Laid-Open No. 2-268491, a pedestal in which a pair of inclined metal plates is integrated at both ends of an insulator plate is used. Therefore, it is necessary to perform an operation of integrating members made of different materials in order to create the pedestal, which complicates the structure of the pedestal and increases the cost. Further, an insulator plate is interposed between the chip component and the wiring board, and the electrode of the chip component and the electrode of the wiring board are connected via a pair of inclined metal plates. Accordingly, characteristics such as high frequency characteristics are deteriorated. Further, the mounting method mainly focuses on a bipolar chip component, and it is difficult to apply this to flip chip mounting. Furthermore, it is difficult to apply to an electronic component in which many electrodes are formed at a narrow pitch,
Not suitable for high-density mounting.

In the method of mounting a chip component described in Japanese Patent Application Laid-Open No. 3-241847, it is difficult to replace the chip component after attaching a U-shaped cap to the wiring board. Also, when the cap is bonded and fixed, the chip components are easily displaced with respect to the wiring board,
Especially when the pitch of the electrodes is reduced, the yield is significantly reduced.

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and enables an electronic component such as a semiconductor bare chip to be mounted on a flip chip, and allows the electronic component to be easily removed even after the mounting. However, an object of the present invention is to provide a simple and practical fixing jig. Another object of the present invention is to provide a wiring board having such a fixing jig. Further, another object of the present invention is to provide a mounted body on which an electronic component is mounted using such a fixing jig, and a method for manufacturing the same.

[0013]

Means for Solving the Problems To achieve the above object, the present invention has the following constitution.

According to the present invention, there is provided a fixing jig comprising: a base having an open central portion; a movable claw provided on the base for fixing an electronic component; and at least a pair of movable claws for positioning the electronic component. It has a positioning wall.

According to the above-mentioned fixing jig, all or a part of four sides and four corners of electronic parts such as a semiconductor bare chip (synonymous with a semiconductor chip), a BGA, a CSP, etc. By making contact with the positioning wall,
Electronic components can be positioned and fixed. Therefore, if such a fixing jig is fixed to the wiring board, the electronic component can be flip-chip mounted on the wiring board. Moreover,
Since the electronic component is held by the movable claw, it can be easily removed even after mounting. Therefore, even if a mounting failure occurs, it can be easily repaired. Further, the fixing jig has a simple structure, can be manufactured at low cost, and can be put to practical use in electronic equipment. Further, since the center of the base is open, the electronic component and the wiring board can be directly connected without interposing other conductive members (except for bumps, conductive adhesives, etc.). Also, since the electronic component is formed in a frame shape so as to surround the outer periphery, the fixing member can be handled as one component, and mounting and manufacturing are easy.

In the above fixing jig, the movable claw is
It is preferable to be held on the base via a thin portion having a small thickness so as to be elastically displaceable. This facilitates mounting of the electronic component and removal after mounting.

In this case, it is preferable that the thickness of the base is larger than the thickness of the thin portion. Here, "base thickness" means the thickness of the base in a direction parallel to the surface of the wiring board when the fixing jig is attached to the wiring board. Thereby, the bottom area of the base to be bonded to the wiring board can be increased, and the mounting strength of the fixing jig to the wiring board is improved.

The cross section of the thin portion may be bent or curved into a substantially C shape, a substantially J shape, or a substantially V shape. Thereby, the dimensional tolerance of the fixing jig, the wiring board, and the electronic component can be reduced. Further, it is possible to prevent an electronic component or a wiring board from being damaged due to an excessive pressing force caused by a slight manufacturing error.

Further, in the above-mentioned fixing jig, it is preferable that the planar shape of the base is a substantially rectangular frame shape having an open central portion. The area occupied by the wiring board can be minimized by matching the shape of the fixing jig with a generally used rectangular shape as the planar shape of the electronic component.

In this case, the movable claw is 4
Preferably, it is formed on at least one of the four sides excluding the corner. This facilitates the elastic displacement of the movable claw, thereby facilitating the mounting and removal of the electronic component after mounting.

In the above-mentioned fixing jig, it is preferable that an inclined surface having a low opening side is formed above the movable claw. This facilitates mounting of electronic components.

In the fixing jig, it is preferable that the positioning wall is an inner wall surface of the base. This facilitates manufacture of the fixing jig.

Alternatively, the positioning wall may be a distal end surface of the movable claw. Thereby, the dimensional tolerance of the positioning wall and the electronic component can be reduced.

In the fixing jig, it is preferable that the movable claw and the positioning wall are made of an insulating material. By configuring at least a member that comes into contact with the electronic component from an insulating material, malfunction of the electronic component and the electric circuit can be prevented.

[0025] In the fixing jig, it is preferable that the base, the movable claw, and the positioning wall are integrally formed using the same material. Thus, the fixing jig can be manufactured at low cost.

Next, a wiring board with a fixing jig according to the present invention is a wiring board with a fixing jig provided with a fixing jig for mounting an electronic component. It has a movable claw for fixing, and at least a pair of positioning walls for positioning the electronic component, wherein an electrode of the wiring board is exposed between the pair of positioning walls.

According to the wiring board with the fixing jig, all or a part of the four sides and the four corners of the electronic parts such as the semiconductor bare chip, the BGA, and the CSP are engaged with the movable claw, and the positioning wall is formed. The electronic component can be positioned and fixed by contacting the electronic component. Therefore, the electronic component can be flip-chip mounted on the wiring board. In addition, since the electronic component is held by the movable claw, it can be easily removed even after mounting. Therefore, even if a mounting failure occurs, it can be easily repaired. Further, the fixing jig has a simple structure, can be manufactured at low cost, and can be put to practical use in electronic equipment. In addition, since the electrodes of the wiring board are exposed, the electrodes of the electronic component can be directly connected without using other conductive members (except for bumps, conductive adhesives, and the like).

In the above-mentioned wiring board with a fixing jig, it is preferable that the movable claw is held through a thin portion having a small thickness so as to be elastically displaceable. This facilitates mounting of the electronic component and removal after mounting.

In this case, it is preferable that the fixing jig is fixed by bonding a bottom surface to the wiring board, and a thickness of the fixing jig on the bottom surface is larger than a thickness of the thin portion. Thereby, the mounting strength of the fixing jig is improved.

The cross section of the thin portion may be bent or curved into a substantially C shape, a substantially J shape, or a substantially V shape. Thereby, the dimensional tolerance of the fixing jig, the wiring board, and the electronic component can be reduced. Further, it is possible to prevent an electronic component or a wiring board from being damaged due to an excessive pressing force caused by a slight manufacturing error.

In the above-mentioned wiring board with a fixing jig, it is preferable that the fixing jig has a substantially rectangular frame shape with an open central portion. By integrating the fixing jig so as to surround the outer periphery of the electronic component, the fixing jig can be handled as one component, so that mounting and manufacturing are facilitated.

In the above-mentioned wiring board with a fixing jig, the movable claw is at least one of four sides excluding the four corners.
Preferably, it is formed on the side. This facilitates the elastic displacement of the movable claw, thereby facilitating mounting of the electronic component and removal after mounting.

In the above-mentioned wiring board with a fixing jig, it is preferable that an inclined surface having a lower side on which the electronic component is disposed is formed above the movable claw. This allows
Mounting of electronic components becomes easy.

[0034] In the wiring board with the fixing jig, an electrode formed on the first surface may be provided on a second surface opposite to the first surface of the wiring board on which the fixing jig is provided. Connected electrodes may be formed. Thereby, a jig for flip chip mounting of electronic components is obtained.

Next, an electronic component mounted body according to the present invention is an electronic component mounted body in which an electronic component is mounted on a wiring board using a fixing jig, wherein the fixing jig has at least one pair with a movable claw. The movable claw fixes the electronic component on the wiring board, and the pair of positioning walls are arranged in parallel with the surface of the wiring board by disposing the electronic component therebetween. The position of the electronic component in any direction is regulated, and the electrode of the electronic component is connected to the electrode of the wiring board formed between the pair of positioning walls.

According to the above electronic component mounting body, electronic components such as a semiconductor bare chip, BGA, and CSP can be flip-chip mounted on a wiring board. In addition, since the electronic component is held by the movable claw, it can be easily removed after mounting. Therefore, even if a mounting failure occurs, it can be easily repaired. Further, the fixing jig has a simple structure, can be manufactured at low cost, and can be put to practical use in electronic equipment. In addition, the electrodes of the electronic component and the electrodes of the wiring board can be directly connected without using other conductive members (except for bumps, conductive adhesives, and the like).

In the above electronic component package, it is preferable that the movable claw presses the electronic component toward the wiring board. Thereby, the connection reliability between the electrode of the electronic component and the electrode of the wiring board is improved.

In the above electronic component package, a semiconductor chip, a BGA, or a CSP can be used as the electronic component.

Further, in the above electronic component mounted body, it is preferable that the electrodes of the electronic component and the electrodes of the wiring board are connected via a conductive adhesive. This allows mounting without forming bumps on both electrodes.
In addition, when bumps are formed, good electrical connection can be achieved even if there are manufacturing errors in the bumps, wiring boards, and the like.

In the above electronic component package, it is preferable that a bump is formed on an electrode of the electronic component or an electrode of the wiring board. Thereby, electrical connection is realized only by mounting the electronic component on the fixing jig.

In this case, it is preferable that the electrode on the side where the bump is not formed and the bump are connected via a conductive adhesive. Thereby, the conductive adhesive absorbs a manufacturing error of the bump, the wiring board, and the like, and a good electrical connection is realized.

In the above electronic component package, a fixing plate having a larger outer dimension than the electronic component is attached to the electronic component, and the movable claw is indirectly connected to the electronic component via the fixing plate. It is preferable that the positioning wall indirectly regulates the position of the electronic component via the fixing plate. Here, “large in outer diameter” means that the fixed plate is larger than the electronic component in the projected shape from the upper surface. Thus, if the size of the fixing plate is standardized, the fixing jig can be standardized, and the cost can be further reduced.

In this case, the fixing plate and the positioning wall are provided with fitting shapes that fit each other, and the position of the fixing plate is regulated by the fitting shape and / or the fixing plate is fixed. May be fixed. This increases the degree of freedom in designing the fixing jig.

Preferably, an inclined surface is formed around the lower surface of the fixing plate. Accordingly, the movable claw can be easily moved by bringing the inclined surface into contact with the movable claw when the electronic component is mounted, thereby facilitating mounting.

Further, it is preferable that the fixing plate is attached to the electronic component via an elastic adhesive layer. Thereby, various manufacturing errors can be absorbed by elastically deforming the adhesive layer.

Next, a method of manufacturing an electronic component package according to the present invention comprises the steps of: fixing a fixing jig having a movable claw and at least a pair of positioning walls; and an electrode formed by being exposed between the pair of positioning walls. After obtaining the provided wiring board, the electronic component is fitted between the pair of positioning walls, and the electronic component is fixed with the movable claw, thereby connecting the electrode of the electronic component and the electrode of the wiring board. It is characterized by the following.

According to the method of manufacturing the electronic component mounted body, all or a part of the four sides and the four corners of the electronic component such as the semiconductor bare chip, the BGA, and the CSP are engaged with the movable claw, and the positioning is performed. By making contact with the wall, the electronic component can be positioned and fixed. Therefore, the electronic component can be flip-chip mounted on the wiring board. In addition, the exposed electrode of the wiring board and the electrode of the electronic component can be directly connected without using another conductive member (excluding a bump, a conductive adhesive, and the like). In addition, since the electronic component is held by the movable claw, it can be easily removed after mounting. Therefore, even if a mounting failure occurs, it can be easily repaired. Further, the fixing jig has a simple structure, can be manufactured at low cost, and can be put to practical use in electronic equipment.

In the above-described method for manufacturing an electronic component package, after the electrodes of the electronic component are connected to the electrodes of the wiring board, a continuity test of the connection may be performed. Thereby, the quality of the connection can be determined. In the case of poor connection, the electronic component can be removed and repaired.

After the continuity test, an underfill may be injected between the electronic component and the wiring board. As a result, it is possible to prevent the connection portion from being deteriorated due to an environmental change and to reinforce the mechanical strength of the connection portion.

After the continuity test, the electronic component may be sealed with a resin. Thereby, a semiconductor package can be obtained.

[0051]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described specifically with reference to embodiments.

(Embodiment 1) FIG. 1 is a sectional view of an electronic component mounted body according to Embodiment 1 of the present invention.

In this embodiment, a semiconductor bare chip (hereinafter simply referred to as a “semiconductor chip”) 105 is fixed to a fixing jig 1.
20 is mounted on the wiring board 101 by flip chip.

On the surface of the wiring board 101, the electrodes 102 are arranged in a predetermined shape. Although not shown, the wiring board 101 is often a multilayer wiring board in practice.
In order to provide and wire the electrodes 102 on the wiring board 101 corresponding to the fine narrow-pitch electrode pads on the semiconductor chip 105, the wiring board 101 must be a multilayer wiring board. Although not shown in the figure, a passive chip component such as a capacitor or a resistor may be mounted around the actual wiring board. Of course, a semiconductor package may be mounted.

The bumps 106 are formed on the electrode pads of the semiconductor chip 105 by a known method.

In order to position and fix the semiconductor chip 105, the fixing jig 120 is placed on the wiring board 101 with the adhesive 10.
4. The fixing jig 120 is accurately positioned and installed in relation to the formation position of the electrode 102 on the wiring board 101.

FIG. 2 is a perspective view showing a schematic configuration of the fixing jig 120.

The fixing jig 120 is a movable claw 12 for pressing and fixing the semiconductor chip 105 in the direction of the wiring board 101.
3, a positioning wall 128 for regulating the position of the semiconductor chip 105 in a direction parallel to the surface of the wiring board 101, and a substantially rectangular frame-shaped base 121 having an opening 122 in the center.

The movable claw 123 has a thin portion 125 having a small thickness.
Are integrated with the four sides of the base 121 respectively. The tip of the movable claw 123 is inward of the positioning wall 128 (on the side of the opening 122 where the semiconductor chip 105 is arranged).
It protrudes. The distance between the tips of the opposing movable claws 123 is smaller than the width of the semiconductor chip 105. The movable claw 123 is engaged with the periphery of the upper surface of the semiconductor chip 105 to fix the semiconductor chip 105.

An inclined surface 127 having a lower opening 122 side is formed above the movable claw 123. Semiconductor chip 10
5, the semiconductor chip 105 is attached to the inclined surface 1
All that is required is to place it on 27 and push it down from above.
As the semiconductor chip 105 moves on the inclined surface 127, the thin portion 125 is elastically deformed, and the movable claw 12 facing the thin portion 125 is deformed.
3 escapes outward, and the semiconductor chip 105 can be inserted. After being pushed, the movable claw 123 returns to its original position. As a result, the semiconductor chip 105 is engaged with and fixed to the movable claw 123.

The lower surface of the movable claw 123 is
So that the upper surface of the movable claw 1 is pressed downward by a predetermined stress.
It is preferable to set the height of 23. Thereby, the connection reliability between the bump 106 and the electrode 102 is improved.

The position of the semiconductor chip 105 in the direction parallel to the surface of the wiring board 101 is accurately determined by the peripheral wall of the semiconductor chip 105 being in contact with the inner wall surface of the base 121, ie, two pairs of opposing positioning walls 128. Be regulated.

As described above, the bump 106 formed on the electrode pad of the semiconductor chip 105 and the electrode 1 of the wiring board 101 formed in the opening 122 of the base 121 are exposed.
02 comes into contact with positional accuracy.

In the present invention, if the fixing jig 120 has a movable claw 123 for fixing the semiconductor chip 105 and a positioning wall 128 for positioning, the fixing jig 120 shown in FIG.
Is not limited to the configuration shown in FIG. As shown in FIG. 2, four movable claws 123 may be provided along four sides of the semiconductor chip, or two movable claws 123 may be provided along only two opposing sides.
Alternatively, a larger number may be provided. Alternatively, it may be provided so that only four corners (or two opposite corners) are locked instead of the sides of the semiconductor chip. In addition, by devising the formation position of the positioning wall 128, it is possible to use only one movable claw 123. On the other hand, the positioning wall 128
At least a pair of semiconductor chips 105 may be provided so as to be opposed to each other so as to sandwich the semiconductor chip 105 from both sides. As shown in FIG. 2, it may be provided continuously along four sides of the semiconductor chip, or may be provided along only two opposite sides of the semiconductor chip. Alternatively, instead of the side of the semiconductor chip,
It may be provided so as to come into contact only with the corner (or two corners facing each other).

FIG. 2 shows an example of a square open type fixing jig in which the movable claw 123 is not formed in a square. Such 4
With the open corner type, the four movable claws 123 can move independently of each other, so that the workability of mounting and removing the semiconductor chip is improved.

The movable claw 123 corresponding to any one of the four sides and the four corners of the semiconductor chip 105 is preferably
5, it is integrated with a substantially rectangular frame-shaped base 121 having an opening 122 in the center. Movable claw 1 by thin portion 125
23 is easily elastically displaced.

The inner dimensions between the opposing positioning walls 128 are formed with high precision so as to match the outer dimensions of the semiconductor chip 105. Thereby, the semiconductor chip 105 is accurately positioned.

The base 121 has a greater thickness than the thin portion 125. Thereby, the area of the bottom portion facing the wiring substrate 101 is increased, and the bonding strength is improved.

The base 121 can be formed corresponding to four sides of the semiconductor chip 105 having a substantially rectangular planar shape. At this time, the base 121 may be formed with four sides continuously as shown in FIG. 2, or the four sides may be provided independently of each other (that is, separated from each other). Alternatively, two sets of bases connecting two adjacent sides may be used. However, integration is easier to manufacture and install and lower cost. Note that the base 121 may be independently provided so as to correspond to only four (or two opposing) corners instead of the four sides of the semiconductor chip 105.

In the above embodiment, the semiconductor chip 105
Although the case where the bump 106 is formed on the electrode pad described above has been described, mounting is possible even without the bump. However, since the electrode pads on the semiconductor chip 105 are usually slightly depressed from the surface, it is preferable that bumps are formed with plating or a conductive adhesive to assist the contact.

The use of a conductive adhesive gives good results. Even when the bump 106 is formed, the surface of the substrate 101 and the bump 1 may be formed by applying a conductive adhesive between the bump 106 and the electrode 102 on the wiring substrate 101.
Good electrical contact can be ensured irrespective of the height variation of 06. This is because the movable claw 12 for securing the contact
3 can be reduced, and there is no need to mechanically strengthen the base 121, so that the base 121 can be made compact.

The material of the fixing jig 120 is not particularly limited.
For example, a conductive material such as a metal or an insulating material such as a resin or rubber can be used. However, the movable claw 123 and the positioning wall 12 that come into contact with the semiconductor chip 105
If 8 is made of an insulating material, malfunction of the semiconductor chip 105 can be prevented. Further, when the base 121, the movable claw 123, and the positioning wall 128 are integrally formed of the same material, the fixing jig 120 can be manufactured at low cost. In particular, it is preferable to integrally mold the entire fixing jig 120 using a resin because the moldability is good, the manufacturing can be performed accurately, and the cost can be reduced.

(Embodiment 2) FIG. 3 is a sectional view of an electronic component mounted body according to Embodiment 2. FIG. 4 is a perspective view of a fixing jig used for the electronic component package of FIG. 3 and 4, the same members as those in FIGS. 1 and 2 are denoted by the same reference numerals, and detailed description thereof will be omitted.

The second embodiment is different from the first embodiment in the shape of the fixing jig. Hereinafter, the fixing jig of the present embodiment will be described.

3 and 4, reference numeral 220 denotes a fixing jig,
221 is a base, 222 is an opening, 223 is a movable claw, 225
Is a thin portion, 227 is an inclined surface, and 228 is a positioning wall.

The thin portion 2 of the fixing jig 220 of the present embodiment
25 has a cross section bent in a substantially C shape, one end of which is connected to the base 221, and the other end of which has a movable claw 223.
Are formed. An inclined surface 227 is formed on the upper surface of the thin portion 225 so that the opening 222 side where the electronic component 105 is arranged is lower.

Attachment of semiconductor chip 105 is performed as follows in the same manner as in the first embodiment. The semiconductor chip 105 is placed on the inclined surface 227 and pushed downward from above. As the semiconductor chip 105 moves on the inclined surface 227, the thin portion 225 is elastically deformed, and the opposing movable claw 223 escapes outward. Semiconductor chip 10
After pushing 5, the movable claw 223 returns to its original position,
The upper surface of the semiconductor chip 105 is pressed toward the wiring board 101. At the same time, the electrodes 102 formed in the openings 222 of the base 221 are connected to the bumps 106 of the semiconductor chip 105. The position of the semiconductor chip 105 in the direction parallel to the surface of the wiring board 101 is accurately regulated by the peripheral wall of the semiconductor chip 105 abutting on the inner wall surface of the base 221, that is, the two opposing positioning walls 228. .

In the second embodiment, the thin portion 225 is bent so as to have a substantially C-shaped cross section.
The displacement amount of the movable claw 223 increases. Therefore, the movable claw 2
Even if variations occur in the dimensional accuracy of the spacing between the lower surface of the wiring substrate 23 and the upper surface of the wiring substrate 101, the thickness accuracy of the semiconductor chip 105, the height accuracy of the bumps 106, the flatness of the wiring substrate 101, etc. Can be. Therefore,
Since these dimensional tolerance ranges at the time of manufacturing can be relaxed, the cost can be reduced. Further, it is possible to prevent the semiconductor chip 105 and the electrode 102 from being damaged by an excessive pressing force.

The sectional shape of the thin portion 225 is not limited to the substantially C-shape shown in FIG. For example, substantially J-shaped, substantially V
It may be in a character shape or the like. Moreover, it may be curved by drawing a gentle curve.

Except for the above, the description of the first embodiment can be applied to the second embodiment.

FIG. 5 is a sectional view of another electronic component package according to the second embodiment. 5, the same members as those in FIG. 3 are denoted by the same reference numerals, and a detailed description thereof will be omitted.

The package of FIG. 5 differs from the package of FIG. 3 in the method of positioning the semiconductor chip 105 in a direction parallel to the surface of the wiring board 101. In the implementation of FIG.
The positioning of the semiconductor chip 105 is performed as follows. The inner wall surface of the base 221 'of the fixing jig 220' used for the mounting body of FIG. 5 does not contact the peripheral wall of the semiconductor chip 105 and does not contribute to the positioning of the semiconductor chip 105 at all. The positioning of the semiconductor chip 105 is performed by the movable claw 223.
Is performed using the tip surface 229 of the above. The tip surface (positioning wall in this example) 229 is formed obliquely with respect to the surface of the wiring board 101, and comes into contact with a corner of the upper surface of the semiconductor chip 105. The force applied to the semiconductor chip 105 from the front end surface 229 can be divided into a component having a component perpendicular to the surface of the wiring board 101 and a component having a component parallel to the surface.
The force of the perpendicular component is applied to the semiconductor chip 105 by the wiring board 10.
1 is applied to the bump 106 and the electrode 10.
2 and contributes to the connection. On the other hand, the force of the component in the parallel direction contributes to regulating the position of the semiconductor chip 105 in a direction parallel to the surface of the wiring board 101. That is, the semiconductor chip 1 is placed at a position where the pressing force in the direction parallel to the surface of the wiring board 101 by the pair of movable claws 223 arranged opposite to each other is balanced.
05 is positioned.

By regulating the position of the semiconductor chip 105 with the tip end surface 229 of the movable claw 223, even if a manufacturing error occurs in the external dimensions of the semiconductor chip 105 or the formation position of the positioning wall, the thin portion for holding the movable claw 223. 225 can be elastically deformed and absorbed. Therefore, these dimensional tolerances can be reduced.

(Embodiment 3) FIG. 6 is a sectional view of an electronic component mounted body according to Embodiment 3 of the present invention. Members having the same functions as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

A fixing jig 120 is fixed to the wiring board 101 of the third embodiment using an adhesive 104 as in the first embodiment. The semiconductor chip 105 is a fixing jig 1
20 is mounted on the wiring board 101 by flip chip.

The third embodiment differs from the first embodiment in the following points.

The fixing plate 201 is adhered to the surface of the semiconductor chip 105 opposite to the surface on which the bumps 106 are formed via a buffer adhesive layer 202 having a predetermined thickness and elasticity. Fixing plate 2
01 is larger than that of the semiconductor chip 105. The fixing plate 201 is integrated with the semiconductor chip 105 so as to protrude from the outer peripheral end of the semiconductor chip 105. The mounting of the semiconductor chip 105 on the fixing jig 120 is as follows.
This is performed by engaging the movable claw 123 with the side around the upper surface of the fixed plate 201. The positioning of the semiconductor chip 105 in a direction parallel to the surface of the wiring board 101 is performed by bringing the peripheral wall of the fixed plate 201 into contact with the positioning wall 128. Of course, the relative position between the semiconductor chip 105 and the fixing plate 201 must be accurately determined in advance.

As described above, in the third embodiment, the semiconductor chip 105 is indirectly connected to the movable claw 2 via the fixed plate 201.
23 is pressed and fixed. In addition, the semiconductor chip 1
05 is the positioning wall 12 indirectly via the fixing plate 201.
8, the position is regulated.

It is preferable to form an inclined surface 203 by chamfering an end of the lower surface of the fixing plate 201. This makes it easy to insert the semiconductor chip.

Other than the above, the configuration is the same as that of the first embodiment shown in FIG.

When the buffer adhesive layer 202 is provided between the fixing plate 201 and the semiconductor chip 105 as in this embodiment,
The pressing force of the movable claw 123 is absorbed by the elastic deformation of the buffer adhesive layer 202. Therefore, the lower surface of the movable claw 123 and the wiring board 1
The tolerances such as the dimensional accuracy of the distance from the upper surface of the semiconductor chip 01, the thickness accuracy of the semiconductor chip 105, the height accuracy of the bumps 106, and the flatness of the wiring board 101 can be reduced. That is, the dimensional variations at the time of manufacturing can be absorbed, and the cost can be reduced.

As the buffer adhesive layer 202, a material having elasticity (for example, silicon rubber, epoxy resin or the like)
Can be used.

By mounting the semiconductor chip 105 via the fixing plate 201 as in this embodiment, the fixing jig 120 can be standardized. The size of the semiconductor chip 105 does not have a standardized shape, size, and area in order to minimize costs. Therefore, in the case of the first embodiment, a special fixing jig 120 corresponding to each semiconductor chip is used.
Must be prepared. However, if the fixing plate 201 is used, the number of sizes of the fixing plate 201 can be limited to a constant. Thereby, the types of the fixing jigs 120 can be reduced and the cost can be reduced. This is the traditional QFP
This is the same idea as standardization in packages such as (quad flat package).

As in the first embodiment, a good connection can be reliably obtained with a small pressing pressure by using a conductive adhesive.

As the fixing jig 120, the first embodiment,
The same configuration as described in 2 can be used. Further, in the present embodiment, by providing the fixing jig 120 and the fixing plate 201 with a shape that can be fitted to each other, the shape of the fixing jig 120 can be designed as compared with the case of the first embodiment. The degree of freedom above increases. For example, the positioning wall 128 is formed only on two opposing sides, and the movable claw 123 is formed only on the two positioning walls 128. The positioning in the direction parallel to the positioning wall 128 is performed by using the positioning wall 1.
28 and the fixed plate 201 which comes into contact with the fixing plate 201 are provided with shapes (for example, convex portions and grooves) that mesh with each other.

(Embodiment 4) FIG. 7 is an enlarged sectional view showing a connection portion between a bump and an electrode in an electronic component mounted body according to Embodiment 4 of the present invention. Members having the same functions as in FIG. 6 are denoted by the same reference numerals, and description thereof will be omitted.

The fourth embodiment is different from the third embodiment in that a conductive adhesive 302 is interposed between a bump 301 on an electrode pad of a semiconductor chip 105 and an electrode 102 on a wiring board 101. .

As in the third embodiment, the fixing jig 120 is adhered to the surface of the wiring board 101 using the adhesive 104. The semiconductor chip 105 is positioned and adhered to the fixing plate 201 via the buffer adhesive layer 202. Fixing plate 2
01 is accurately positioned by the positioning wall 128 of the base 121 and fixed by the movable claw 123.

In this embodiment, even when the tips of all the bumps 301 cannot contact the electrodes 102 due to the poor flatness of the surface of the wiring board 101 and the precision of the formation of the bumps 301, the conductive adhesive 302 can be used. It compensates for the gap.

The semiconductor chip 105 can be replaced even when the semiconductor chip 105 is connected by the conductive adhesive 302. Normally, the area of the electrical connection portion is very small, and even when the conductive adhesive 302 is cured, the adhesive force is small and the conductive adhesive 302 is easily peeled off. Of course, it is needless to say that the movable claw 123 must be opened. After the semiconductor chip 105 is removed, the amount of the conductive adhesive 302 remaining on the electrodes 102 of the wiring board 101 is small, and can be easily removed even after it is cured.

Note that also in the first embodiment, a conductive adhesive can be interposed between the bump and the electrode as described above.

After mounting the semiconductor chip 105 on the wiring board 101 as in the first to fourth embodiments, it is preferable to check the electrical connection (continuity test) between the semiconductor chip 105 and the wiring board 101. . If a poor connection is found as a result of the inspection, the semiconductor chip 105 can be easily removed by elastically displacing the movable claw. Therefore, repair is extremely easy.

If the connection is good and there is no plan to remove the semiconductor chip 105 thereafter, it is preferable to inject an underfill between the semiconductor chip 105 and the wiring board 101. As a result, it is possible to prevent the connection portion from being deteriorated due to an environmental change and to reinforce the mechanical strength of the connection portion. In addition to or instead of underfill injection, the semiconductor chip 105 may be resin-sealed by a known method. Thereby, a semiconductor package can be obtained.

In the first to fourth embodiments, the state in which the semiconductor chip 105 is mounted is shown, but a BGA or a CSP may be similarly mounted instead of the semiconductor chip.

In the first to fourth embodiments, the example in which the bump 106 is formed on the electrode pad of the semiconductor chip 105 has been described.
It can also be formed on top.

In the first to fourth embodiments, the bump 106 may be a solder bump. At this time, it is preferable to apply a paste to the electrode on which the bump is not formed. In this case, no conductive adhesive is required.

A flip-chip jig can be formed by using the wiring board with the fixing jig shown in the first to fourth embodiments. More specifically, electrodes (bumps or balls may be formed on the electrodes if necessary) are arranged on the lower surface (second surface) of the wiring substrate 101 in a grid pattern, and these are arranged on the upper surface (first surface). Is electrically connected to the electrode 102 via a via hole or the like. Such a wiring board is mounted on a motherboard, and electrodes on the lower surface are connected to the motherboard. The flip-chip jig thus obtained can be obtained by replacing the semiconductor components with CSP, BGA instead of semiconductor chips, and thereby providing CSP,
It can be a jig for BGA.

[0108]

According to the present invention, a semiconductor chip, a BG
Electronic components such as A and CSP can be flip-chip mounted on a wiring board using a fixing jig having movable claws and positioning walls. In addition, since the electronic component is held by the movable claw, it can be easily removed after mounting.
Therefore, even if a mounting failure occurs, it can be easily repaired. Furthermore,
The fixing jig has a simple structure, can be manufactured at low cost, and can be put to practical use in electronic devices.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an electronic component package according to a first embodiment of the present invention;

FIG. 2 is a perspective view showing a schematic configuration of a fixing jig according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing an electronic component package according to a second embodiment of the present invention;

FIG. 4 is a perspective view showing a schematic configuration of a fixing jig according to a second embodiment of the present invention.

FIG. 5 is a sectional view showing another electronic component package according to the second embodiment of the present invention;

FIG. 6 is a sectional view showing an electronic component package according to a third embodiment of the present invention;

FIG. 7 is an enlarged sectional view showing a connection portion between a bump and an electrode in the electronic component package according to the fourth embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Wiring board 102 Electrode 104 Adhesive 105 Semiconductor chip 106 Bump 120 Fixing jig 121 Base 122 Opening 123 Movable claw 125 Thin part 127 Inclined surface 128 Positioning wall 201 Fixed plate 202 Buffer adhesive layer 203 Inclined surface 220, 220 'Fixed jig Tool 221, 221 ′ base 222 opening 223 movable claw 225 thin portion 227 inclined surface 228 positioning wall 229 tip surface of movable claw (positioning wall) 301 bump 302 conductive adhesive

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Ken Shimamoto 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (33)

[Claims] 1. A base having an open central portion, a movable claw provided on the base for fixing an electronic component, and at least one pair of positioning walls for positioning the electronic component. A fixing jig characterized by the above. 2. The fixing jig according to claim 1, wherein the movable claw is held on the base via a thin portion having a small thickness so as to be elastically displaceable. 3. The fixing jig according to claim 2, wherein the thickness of the base is greater than the thickness of the thin portion. 4. A cross section of the thin portion is bent or curved into a substantially C shape, a substantially J shape, or a substantially V shape.
The fixing jig according to the item. 5. The fixing jig according to claim 1, wherein the base has a substantially rectangular frame shape with a central portion opened. 6. The fixing jig according to claim 5, wherein said movable claw is formed on at least one of four sides excluding four corners. 7. The fixing jig according to claim 1, wherein an inclined surface having a low opening side is formed on an upper portion of the movable claw. 8. The fixing jig according to claim 1, wherein said positioning wall is an inner wall surface of said base. 9. The fixing jig according to claim 1, wherein the positioning wall is a tip end surface of the movable claw. 10. The fixing jig according to claim 1, wherein said movable claw and said positioning wall are made of an insulating material. 11. The base, the movable claw, and the positioning wall are integrally formed using the same material.
The fixing jig according to the item. 12. A wiring board with a fixing jig provided with a fixing jig for mounting an electronic component, wherein the fixing jig comprises: a movable claw for fixing the electronic component; A wiring board with a fixing jig, comprising: at least a pair of positioning walls for positioning, wherein electrodes of the wiring board are exposed between the pair of positioning walls. 13. The wiring board with a fixing jig according to claim 12, wherein the movable claw is held via a thin portion having a small thickness so as to be elastically displaceable. 14. The fixing device according to claim 13, wherein the fixing jig is fixed by bonding a bottom surface to the wiring board, and a thickness of the fixing jig on the bottom surface is larger than a thickness of the thin portion. Wiring board with jig. 15. The thin section has a substantially C-shaped cross section.
14. The wiring board with a fixing jig according to claim 13, wherein the wiring board is bent or curved in a substantially J shape or a substantially V shape. 16. The wiring board with a fixing jig according to claim 12, wherein a planar shape of the fixing jig is a substantially rectangular frame shape having an open center. 17. The wiring board with a fixing jig according to claim 16, wherein the movable claw is formed on at least one of four sides excluding four corners. 18. The wiring board with a fixing jig according to claim 12, wherein an inclined surface having a lower side on which the electronic component is disposed is formed above the movable claw. 19. An electrode connected to an electrode formed on the first surface is formed on a second surface opposite to the first surface of the wiring board provided with the fixing jig. Item 12
A wiring board with a fixing jig according to the item. 20. An electronic component mounted body in which an electronic component is mounted on a wiring board using a fixing jig, wherein the fixing jig has a movable claw and at least one pair of positioning walls, Fixing the electronic component on the wiring board, the pair of positioning walls regulate the position of the electronic component in a direction parallel to the surface of the wiring board by disposing the electronic component therebetween. An electronic component mounted body, wherein an electrode of the electronic component is connected to an electrode of the wiring board formed between the pair of positioning walls. 21. The electronic component package according to claim 20, wherein the movable claw presses the electronic component toward the wiring board. 22. The electronic component is a semiconductor chip, BG
21. The electronic component package according to claim 20, which is A or CSP. 23. The electrode of the electronic component and the electrode of the wiring board are connected via a conductive adhesive.
The electronic component package according to 0. 24. The electronic component package according to claim 20, wherein a bump is formed on an electrode of the electronic component or an electrode of the wiring board. 25. The electronic component package according to claim 24, wherein the electrode on which the bump is not formed and the bump are connected via a conductive adhesive. 26. A fixing plate having an outer dimension larger than that of the electronic component is attached to the electronic component, and the movable claw indirectly fixes the electronic component via the fixing plate. 21. The electronic component package according to claim 20, wherein the wall indirectly regulates the position of the electronic component via the fixing plate. 27. The fixing plate and the positioning wall are provided with fitting shapes that fit each other, and the position of the fixing plate is regulated by the fitting shape and / or the fixing plate is fixed. The electronic component package according to claim 26, wherein 28. The electronic component package according to claim 26, wherein an inclined surface is formed around a lower surface of the fixing plate. 29. The electronic component package according to claim 26, wherein the fixing plate is attached to the electronic component via an elastic adhesive layer. 30. After obtaining a wiring board comprising a fixing jig having a movable claw and at least one pair of positioning walls, and electrodes formed to be exposed between said pair of positioning walls, said pair of positioning walls is provided. A method for manufacturing an electronic component mounted body, comprising: fitting an electronic component between the electrodes; and fixing the electronic component with the movable claw, thereby connecting an electrode of the electronic component and an electrode of the wiring board. 31. The method of manufacturing an electronic component mounted body according to claim 30, wherein after the electrodes of the electronic component are connected to the electrodes of the wiring board, a continuity test of the connection is performed. 32. An underfill is injected between the electronic component and the wiring board after the continuity test.
2. The method for manufacturing an electronic component package according to claim 1. 33. The method according to claim 31, wherein the electronic component is sealed with a resin after the continuity test.