JP2001328127A - Apparatus for manufacturing resin filler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance quality while reducing production cost in an apparatus for manufacturing a resin filler formed by filling the gaps between the wires of an electromagnet coil or the like with a resin. SOLUTION: A resin filling apparatus 30 has a mold 1 for receiving a molded article W, a vacuum container 31 for receiving the mold, the vacuum pump 13 allowed to selectively communicate with the vacuum container 31, the pressure pump 19 allowed to selectively communicate with the vacuum pump, a discharged resin receiving container 43 allowed to communicate with the mold 1 and also allowed to selectively communicate with the pressure pump 19 and the vacuum pump 13 and a resin container 15 allowed to communicate with the mold 1 and also allowed to selectively communicate with the pressure pump 19 and the vacuum pump 13. Resin injection piping 41 with an injection valve 37 is provided between the resin discharge piping 33, which connects the discharged resin receiving container 43 and the mold 1, and the discharged resin receiving container 43.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a resin filler, and more particularly to an apparatus for injecting a resin such as an epoxy resin when manufacturing an electromagnetic coil or a fiber reinforced resin (FRP) member.

[0002]

2. Description of the Related Art For example, in a heat-resistant coil for an electromagnet,
Inject and fill resin etc. between metal wires that become coils,
In a fiber-reinforced resin member, a resin is interposed between reinforcing fibers to form a matrix. As a method of injecting and filling a resin such as an epoxy resin into such a coil or a fiber-reinforced resin member, a vacuum impregnation method is known. In the vacuum impregnation method, a molding die containing a coil or a fiber-reinforced resin member is placed in a vacuum container in order to suppress the generation of voids (cavities) during resin injection and improve the quality, and the molding die is placed under a vacuum atmosphere. The resin is injected into the mold, and then the molding die is placed under atmospheric pressure or a pressurized state, and the voids generated in the molding die are crushed to complete the resin injection operation.

An example of a conventional apparatus and procedure for performing the above vacuum impregnation method will be described with reference to FIG. (1) First, a molding die 1 containing a molding W such as a coil.
Into the vacuum container 3. Then, the resin injection valve 5, the vacuum container pressure valve 7, and the resin container pressure valve 9 are closed, and the vacuum container vacuum valve 11 is opened to open the vacuum pump 1.
3 is started, the inside of the vacuum container 3 is evacuated, and the inside of the molding die 1 is deaerated. (2) Thereafter, the resin to be injected is put into the resin container 15, the pressure valve 9 for the resin container is closed, the vacuum valve 17 for the resin container is opened, and the vacuum pump 13 is activated to degas the resin. This operation may be performed in parallel with the above-mentioned procedure (1). Alternatively, the degassed resin may be put in the resin container 15 and this operation may be omitted. (3) Then, the resin container vacuum valve 17 is closed, the resin injection valve 5 is opened, and the resin is injected into the molding die 1. At this time, if necessary, the pressure valve 9 for the resin container is opened, and the resin is placed under the atmosphere or the pressure pump 19 is started to inject the resin under pressure. (4) When a part of the injected resin comes out of the discharged resin receiving container 21 and accumulates an appropriate amount therein, the resin injection valve 5 and the vacuum valve 11 are closed, and the vacuum container pressure valve 7 is closed.
Is opened and the inside of the vacuum vessel 3 is set to the atmospheric pressure or the pressurized state, and the resin injection is completed. Note that reference numerals 23, 25, 27 and 29 are
Resin discharge pipe, vacuum purge pipe, pressure pipe, and resin injection pipe.

[0004]

Thus, in the vacuum impregnation method described above, the injected resin flows in the molding die 1 as shown in FIG. That is, since the internal flow resistance between the coil wires or the reinforcing fibers in the molded product W is larger than the flow resistance between the molded product W and the molding die 1, the liquid level during the injection is indicated by a two-dot chain line. Ascend. In other words, the resin flows preferentially between the molding die 1 and the molded product W as indicated by a white arrow, and a resin-uninjected region or a void is generated in a portion of the molded product W7 near the discharge port side. Easy to cause poor quality. Further, the resin accumulated in the discharged resin receiving container 21 is not used and is wasted. Therefore, an object of the present invention is to provide a high-quality and efficient resin-filled manufacturing apparatus in which the injected resin does not evenly spread over the entire member and does not generate voids, and furthermore, the injected resin is effectively used without leaving any portion. It is to provide.

[0005]

According to the present invention, there is provided, in accordance with the present invention, an apparatus for producing a resin filling, such as an electromagnet coil or a fiber reinforced resin, which receives a molded article to be filled with a resin. A molding die, a vacuum container for receiving the molding die, a vacuum pump selectively connected to the vacuum container via a pipe provided with an open / close valve, and a vacuum pump selectively connected to the vacuum container with a pipe provided with an open / close valve. A pressurizing pump or a pressurizing source, such as an atmospheric pressure atmosphere, which is connected to the molding die, and a pipe having an on-off valve connected to the pressurizing source and the vacuum pump. Through a pipe provided with an open / close valve to the discharge resin receiving container and the molding die selectively communicated via a pipe provided with an open / close valve to the pressurizing source and the vacuum pump. Selection A resin return injection pipe with an open / close valve for re-injecting the discharged resin once overflowing from the molding die and entering the discharged resin receiving container into the molding die. It is composed. Each of the open / close valves may be configured as an independently operated valve or a direction switching valve for an interlocked operation, or the vacuum vessel and the molding die may be configured as an integral structure.

[0006]

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the same portions are denoted by the same reference symbols throughout the drawings. Referring to FIG. 1, a vacuum container 31 for housing a molding die 1 containing a molded product W includes a resin injection pipe 29 therein, which extends outside the vacuum container 31 and includes a resin injection valve 5. Then, it is connected to the injection port 15a of the resin container 15. The resin discharge pipe 33 provided in the vacuum vessel 31 extends outside the vacuum vessel 31 and is provided with a recovery valve 35 for the discharged resin receiving vessel and an injection valve 37 for the discharged resin receiving vessel. Resin recovery pipe 39 extending from recovery valve 35 and injection valve 3
The resin injection pipe 41 extending from the resin recovery port 43a and the resin injection port 4a of the discharge resin receiving container 43 respectively.
3b.

Further, referring to FIG. 1, the resin container 15 and the discharged resin receiving container 43 are formed in an airtight structure, and are provided with a pressure valve 9 for the resin container and a pressure valve 45 for the discharged resin receiving container. The pressurizing pump 47 is connected to the pressurizing pump 19 through a pressurizing pipe 47. The pressure pipe 47 is a pressure pump 19
Instead of being connected to the air. Furthermore,
The resin container 15 and the discharged resin receiving container 43 are provided with a resin container vacuum valve 17 and a discharged resin receiving container vacuum valve 49.
Is connected to the vacuum pump 13 via a vacuum purge pipe 51 having Here, the height relationship between the resin container 15 and the discharged resin receiving container 43 will be described. The height position of the injection port 15 a of the resin container 15 connected to the resin injection valve 5 is determined by the height of the resin connected to the pressure valve 9. Container pressurization port 1
5b and the vacuum port 15c of the resin container 15 connected to the resin container vacuum valve 17 are located below the height position.

The height position of the resin injection port 43b connected to the injection valve 37 of the discharge resin receiving container 43 is determined by the pressure port 43c connected to the discharge resin receiving container pressurizing valve 45 and the discharge resin receiving container. Vacuum valve 49 for container
The height position of the resin recovery port 43a, which is located below the height position of the vacuum port 43d connected to the discharge resin receiving container 35 and is connected to the pressure port 43c and the vacuum port 43d. Below and
It is located above the resin injection port 43b. Further, the vacuum vessel 31 is connected to the vacuum pump 13 via the vacuum purge pipe 53 provided with the vacuum vessel vacuum valve 11 and the above-described vacuum purge pipe 51, and is provided with a pressure provided with the vacuum vessel pressure valve 7. The pressurizing pump 19 is connected to the pressurizing pump 19 via the pipe 55 and the pressurizing pipe 47 described above.

Next, the operation of the above embodiment will be described. (1) First, a molding die 1 containing a molded product W to be filled with a resin such as a winding structure forming an electromagnetic coil is placed in a filling device 3.
0 and set in a vacuum container 31. That is, it is connected to the resin injection pipe 29 and the resin discharge pipe 33. After a while
Resin injection valve 5, Vacuum container pressurizing valve 7, Resin container pressurizing valve 9, and discharge resin receiving container pressurizing valve 45
And simultaneously, vacuum valve 11, vacuum valve 49,
The collection valve 35 and the injection valve 37 are opened, the vacuum pump 13 is started, and the vacuum chamber 31 is evacuated to evacuate the inside of the molding die 1. (2) Next, the resin to be injected is put into the resin container 15, the pressure valve 9 is closed, the vacuum valve 17 is opened, and the vacuum pump 13 is started to degas the resin. (This resin may be separately put into the resin container 15 to omit this operation, or may be performed in parallel with the operation of the procedure (1).)

(3) Thereafter, the vacuum valve 17 and the injection valve 37 are closed, and the resin injection valve 5 and the vacuum valve 49 are opened to inject the resin into the molding die 1. At this time, if necessary, the pressure valve 9 is opened to place the resin under atmospheric pressure or a pressurized state. In this manner, the resin is injected into the molding die 1 in the state shown in FIG. On the other hand, the resin flowing from the resin discharge pipe 33 through the recovery valve 35, further through the resin recovery pipe 39, flows into the discharged resin receiving container 43, and the resin accumulated therein is
Vacuum purging is performed by the vacuum pump 13 through the opened vacuum valve 49 and the vacuum purge pipe 51, so that the degassing is performed again. (4) Before the resin injected into the molding die 1 and discharged as described above accumulates in an appropriate amount in the discharged resin receiving container 43 and flows out from the vacuum valve 49, the pressurizing valve 9, the vacuum valve 49, The collection valve 35 is closed, the vacuum valve 17 and the injection valve 37 are opened, and the discharged resin is injected into the resin injection pipe 41.
Through the injection valve 37, the resin discharge pipe 33 flows backward, and is injected again into the molding die 1. At this time, if necessary, the pressure valve 45 is opened to place the resin under atmospheric pressure or under a pressurized state. The injection state of the resin into the molding W at this time is shown in FIG.

(5) When the amount of the resin in the discharge resin receiving container 43 is reduced by an appropriate amount by re-injection, the resin injection valve 5, the vacuum valve 11, the pressure valve 45, and the injection valve 37 are closed before the resin completely runs out. Then, the pressure valve 7 is opened to set the inside of the vacuum vessel 31 to the atmospheric pressure or a pressurized state, and the resin injection is completed. (If necessary, the procedure (3) and the following operations may be repeated.) In this manner, the resin once discharged into the discharge resin receiving container 43 is again injected into the molding die 1 so that the conventional resin is not injected. Eliminate regions and void generation regions.

Next, a modified embodiment in which a part of the above embodiment is modified will be described with reference to FIG. The main point of the modified portion is that the mold is provided with the function without using the vacuum vessel 31, and the above description will be made focusing on the modified portion. In the filling device 60 shown in FIG.
The molding die 61 is formed in an airtight structure.
1. The molded product W is stored in advance in 1. The molding die 61 is connected to a resin injection pipe 65 having a resin injection valve 5 and a resin container recovery valve 63, and is connected to the resin container 15. Further, a molding die 61 is connected to the discharge resin receiving container 43 via a resin discharge pipe 67 having a recovery valve 35 and an injection valve 37. The resin container 15 and the discharged resin receiving container 43 are configured to have an airtight function,
These are connected to the pressure pump 19 via a pressure pipe 47 having a pressure valve 9 or a pressure valve 45.

The resin container 15 and the discharged resin receiving container 4
3 is also connected to the vacuum pump 13 via a vacuum purge pipe 51 having a vacuum valve 17 and a vacuum valve 49. Here, the height direction position of the injection port 15 a connected to the resin injection valve 5 of the resin container 15 is determined by the height of the pressure port 15 b connected to the pressure valve 9 and the height of the vacuum port 15 c connected to the vacuum valve 17. It is below the directional position. Further, the height position of the recovery port 15d connected to the recovery valve 63 for the resin container 15 is lower than the pressurization port 15b and the vacuum port 15c, and the injection port 1d.
5a.

On the other hand, the positional relationship in the height direction among the resin recovery port 43a, the injection port 43b, the pressurization port 43c, and the vacuum port 43d of the discharge resin receiving container 43 is the same as in the above-described embodiment.

Next, the operation procedure of the above-described filling device 60 will be described. (1) First, a molding die 61 having an airtight structure containing a molded product W
The resin injection valve 5, the pressure valve 9 and the pressure valve 45 are closed, and the vacuum valve 17, the vacuum valve 49, the recovery valve 35, the injection valve 37 and the recovery valve 63 are opened in order to evacuate the inside of the vacuum pump. 13 is started. At this time, if the resin to be injected into the resin container 15 is put, the resin can be simultaneously degassed. (2) Next, the pressurizing valve 45, the vacuum valve 17, the injection valve 37, and the recovery valve 63 are closed, and the resin injection valve 5, the vacuum valve 49, and the recovery valve 35 are opened, and the molding die 61 is opened.
Inject resin into At this time, if necessary, the pressure valve 9 is opened to bring the resin into a pressurized state. At this time, the resin discharge pipe 6
7, a part of the injected resin flows into the discharged resin receiving container 43 through the resin collecting pipe 39 through the collecting valve 35,
The resin accumulated here is degassed by the vacuum pump 13 through the opened vacuum valve 49 and the vacuum purge pipe 51. (3) The resin injection valve 5, the pressure valve 9, the vacuum valve 49, and the recovery valve 35 are closed before a part of the injected resin accumulates in the discharge resin receiving container 43 in an appropriate amount and flows out of the vacuum valve 49. The valve 17, the injection valve 37, and the recovery valve 63 are opened, and the above-described discharged resin flows back through the injection valve 37 opened from the resin re-injection pipe 41 to the resin discharge pipe 67 to be re-injected into the molding die 61. I do. At this time, if necessary, the pressure valve 45 is opened to bring the resin into a pressurized state. (4) The pressure valve 45, the vacuum valve 17, the injection valve 37, and the recovery valve 63 are closed to complete the resin injection before the resin in the discharged resin receiving container 43 is reduced in an appropriate amount by the re-injection and completely disappears. (If necessary, the work following step (2) may be repeated.) According to such a filling device 60, resin is injected into a molded product such as a large coil or fiber reinforced material because a vacuum vessel is not used. Can be performed.

Further, another embodiment of the present invention will be described with reference to FIG. In each of the above-described embodiments, since the valves that are individually opened and closed are used, the operation is not complicated. This embodiment mainly aims to simplify the valve operation. FIG.
In the filling device 70 shown in (1), the molding die 1 containing the molding W is set in the vacuum container 71 when the resin is injected. That is, the injection / collection switching valve (direction switching valve) 73
Is connected to the molding die 1 in the vacuum vessel 71, and is connected to the resin container via the resin injection pipe 75. 15 is connected to the discharge resin receiving container 43 via the resin discharge pipe 79. The resin container 15 and the discharged resin receiving container 43 are configured in an airtight structure as described above, and are connected via a vacuum pressure switching valve (direction switching valve) 81 and a vacuum pressure switching valve (direction switching valve) 83. It is connected to a pressure pipe 85 connected to the pressure pump 19. The pressure pipe 85 may be opened to the atmosphere instead of being connected to the pressure pump 19.

The above-mentioned resin container 15 and the discharged resin receiving container 43 are also connected to a vacuum purge pipe 87 connected to the vacuum pump 13 via the above-mentioned vacuum pressure switching valve 81 or vacuum pressure switching valve 83. ing. Here, the height direction position of the injection port 15a of the resin container 15 connected to the injection recovery switching valve 73 of the resin container 15 is higher than the height direction position of the vacuum pressure port 15e connected to the vacuum pressure switching valve 81. The height position of the resin recovery port 15d connected to the injection / recovery switching valve 73 is below the vacuum pressurization port 15e and above the injection port 15a. Also, the discharged resin receiving container 4
The height position of the resin injection port 43a connected to the third injection recovery switching valve 77 is lower than the height position of the vacuum pressure port 43e connected to the vacuum pressure switching valve 83. The height position of the resin recovery port 43a connected to the switching valve 77 is
3e and above the resin injection port 43b. Further, the vacuum vessel 71 is connected to a vacuum purge pipe 87 connected to the vacuum pump 13 via a vacuum valve (direction switching valve) 89. In addition, the code | symbol 95 in a figure is:
This is a stopper plug that closes one port of the direction switching valves 77, 79, 81, and 83. These direction switching valves use a two-position type, but a three-position type is used. A fully closed one may be used.

Next, an operation procedure of the filling device 70 having the above-described configuration will be described. (1) First, in order to evacuate the inside of the molding die 1 in which the molding W is placed, the injection / recovery switching valve 77 and the vacuum pressurization switching valve 83 are set at the position A (circled in the figure; the same applies hereinafter).
Next, the recovery switching valve 73 and the vacuum pressurization switching valve 81 are opened to the position B (circled in the figure, the same applies hereinafter), the vacuum valve 89 is opened, and the vacuum pump 13 is started. At this time, if the resin to be injected is put in the resin container 15, the resin is simultaneously degassed. (2) Next, the injection and recovery switching valve 73, the vacuum pressure switching valve 81, the vacuum pressure switching valve 83, and the injection and recovery switching valve 77 are set to the A position, and the resin is injected into the molding die 1.
That is, the injected resin put in the resin container 15 is supplied to the resin injection pipe 97, the injection recovery switching valve 73, and the resin injection pipe 7.
5 sequentially flows into the molding die 1. At this time, the resin flows out from the resin discharge pipe 79 through the resin recovery pipe 91 via the injection recovery switching valve 77 to the discharge resin receiving container 43, and a part of the injected resin collected here is removed by the vacuum pressurization switching valve 83.
Is degassed from the vacuum purge pipe 87 by the vacuum pump 13.

(3) Before a part of the resin injected into the molding die 1 accumulates in the discharge resin receiving container 6 and flows into the vacuum pressure switching valve 83, the injection / collection switching valve 73 and the vacuum pressure switching are performed. The valve 81, the vacuum pressurization switching valve 83, and the injection recovery switching valve 77 are set to the B position. Then, the above-mentioned discharged resin is re-injected from the resin injection pipe 93 to the molding die 1 through the resin discharge pipe 79 via the injection recovery switching valve 77. At this time, a part of the resin in the molding die 1 may return to the resin container 15 through the resin injection pipe 75, the injection recovery switching valve 73, and the resin recovery pipe 99 in some cases. (4) Then, before the resin in the discharge resin receiving container 43 is reduced in an appropriate amount by the re-injection and completely disappears, the injection and recovery switching valve 73 and the vacuum pressure switching valve 81 are set to the A position, and the resin injection is completed. (If necessary, the procedure (2) and the following operations may be repeated.) (5) The operations of the vacuum pump 13 and the pressure pump 19 are stopped, and the vacuum valve 89 is opened to complete the operation. In this way, according to the filling device 70, the complicated operation of the plurality of valves is replaced with the switching operation of the direction switching valve, so that the resin injection can be performed with a smaller number of used valves and easier operation than in the embodiment of FIG. Can be performed. Also, piping work becomes easy.

In the embodiment shown in FIG. 4, a vacuum container in which a molding die 1 is placed is used as in the embodiment shown in FIG. 1. However, as in the embodiment shown in FIG. 3, a molding die having a function as a vacuum container is used. 61 may be used instead of the molding die 1. The configuration of the filling device 100 in that case is as shown in FIG. In this case, the molding die 61 is connected to an injection / recovery switching valve 73 by a resin injection pipe 101, and further connected to an injection / recovery switching valve 77 by a resin recovery pipe 103.
Otherwise, the configuration is almost the same as that of the filling device 70 (FIG. 4). Therefore, the manner of operation such as this operation procedure will be well understood by those skilled in the art even if there is no special explanation, by appropriately considering the above-mentioned explanation regarding FIGS. 3 and 4.

[0021]

As described above, according to the present invention,
Injected resin overflowing from the molding die that forms the resin filling is collected in the discharge resin receiving container, and this is re-injected into the molding die, eliminating wasteful resin and efficiently filling the resin. Things can be manufactured.

[Brief description of the drawings]

FIG. 1 is a system diagram according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram illustrating an operation of the embodiment.

FIG. 3 is a system diagram according to a modified embodiment in which a part of the embodiment is modified.

FIG. 4 is a system diagram according to another embodiment of the present invention.

FIG. 5 is a system diagram according to a modified embodiment in which a part of the another embodiment is modified.

FIG. 6 is a system diagram of a conventional device.

FIG. 7 is an explanatory diagram for explaining one problem of a conventional device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Molding die 5 Resin injection valve 7, 9 Pressure valve 11 Vacuum valve 13 Vacuum pump 15 Resin container 17 Vacuum valve 19 Pressure pump 29 Resin injection pipe 30 Filling device 31 Vacuum container 33 Resin discharge pipe 35 Recovery valve 37 Injection valve 39 Resin recovery pipe 41 Resin injection pipe 43 Discharge resin receiving container 45 Pressure valve 47 Pressure pipe 49 Vacuum valve 51, 53 Vacuum purge pipe 55 Pressure pipe 60 Filling device 61 Molding die 63 Recovery valve 65 Resin injection pipe 67 Resin Discharge piping 70 Filling device 71 Vacuum container 73 Injection and recovery switching valve 75 Resin injection piping 77 Injection and recovery switching valve 79 Resin discharge piping 81, 83 Vacuum pressurization switching valve 85 Pressurizing piping 87 Vacuum purge piping 89 Vacuum valve

Claims (4)

[Claims] 1. A molding die for receiving a molded product to be filled with resin, a vacuum container for receiving the molding die, a vacuum pump selectively connected to the vacuum container, and a vacuum pump selectively connected to the vacuum container. A pressurized source, a discharge resin receiving container connected to the molding die and selectively connected to the pressurized source and the vacuum pump, and the pressurized source and the vacuum connected to the molding die. A resin container selectively connected to a pump is provided, and a resin return pipe with an open / close valve is provided between the resin discharge pipe connecting the discharge resin receiving container and the molding die and the discharge resin receiving container. An apparatus for manufacturing a resin filler, comprising: 2. The apparatus for producing a resin filling according to claim 1, wherein the molding die and the vacuum container are integrated to form a vacuum isolation structure molding die. 3. A molding die for receiving a molded product to be filled with resin, a vacuum container for receiving the molding die, a vacuum pump selectively connected to the vacuum container via a first direction switching valve, A discharge resin receiving container connected to the molding die via a second direction switching valve and selectively connected to the pressurizing source and the vacuum pump via a third direction switching valve; A resin container connected to the mold via a fourth direction switching valve and selectively connected to the pressurizing source and the vacuum pump via a fifth direction switching valve. Manufacturing equipment for resin filling. 4. The apparatus for producing a resin filling according to claim 3, wherein the molding die and the vacuum container are integrated to form a vacuum-isolation structure molding die.