JP2001326789A - Attaching structure for solid-state imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively realize an attaching structure for a solid-state imaging device, which facilitates fine adjustment in 5 axial directions and reduces positional deviation when fixed, with a simple constitution and a high quality without increasing the number of parts. SOLUTION: The attaching structure for a solid-state imaging device packs and adheres a solid-state imaging device 1 and a solid-state imaging device holding member 3 to an intermediate holding member 6. This member 6 has an approximately L-shaped section and has light transmissivity and has a recessed part in the adhesion face to the solid-state imaging device 1, and therefore, the member cooperates with a tabular photoelectric element holding member 1e to hermetically seal picture element lines 1a to 1c between them.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a solid-state imaging device in an image reading apparatus such as a copying machine, an image scanner, and a facsimile.

[0002]

2. Description of the Related Art In an image reading apparatus such as a copying machine, an image scanner, and a facsimile, a solid-state imaging device such as a so-called CCD is used in an image reading section. As shown in FIG.
A large number of photoelectric elements 102 each having a size of about several μm are arranged in one line. In an image reading apparatus, an image of a document 103 is formed by an image forming lens 104 as shown in FIG. It is configured to perform reading. More recently, in order to read a color image, a color image solid-state imaging device having pixel rows each having a peak in spectral sensitivity at R, G, and B as shown in FIG. 5B may be used. This photoelectric element is generally called a photoelectric conversion element, and is an element for converting light energy into electric energy, and is often called a pixel when used for a light receiving portion of a solid-state imaging device such as a CCD. Hereinafter, the photoelectric element 102 is referred to as a pixel 102.

These solid-state imaging devices 101 generally have a hermetically sealed structure in which the pixels 102 are hermetically sealed by a package member 109 and a cover glass 110. As shown in FIGS. Separated. That is, as shown in FIG. 9A, one of the pixels 10 is placed in a concave portion of a ceramic package member 109 having a concave portion formed in the center.
2 are arranged, and a cover glass 110 seals the pixel 102, and the other is a package member 109.
The pixel 102 is sealed with the cover glass 110 and the package member 1 as shown in FIG. 9B.
Reference numeral 09 denotes a ceramic flat base 109a in which the pixels 102 are arranged in a substantially central portion, a substantially O-shaped resin annular member 109b in which a central portion corresponding to the arrangement portion of the pixels 102 is a through hole, and a ceramic. It is composed of an annular member 109c.

In an image reading apparatus using the solid-state image pickup device 101, in order to realize good image reading performance,
Since it is necessary to form a linear image from the imaging lens 104 on the pixels of the solid-state imaging device 101 while satisfying a predetermined required accuracy in the optical characteristics, the positioning accuracy of the pixel line is extremely important. For this reason, as shown in FIG. 6, it is necessary to finely move the attitude of the solid-state imaging device 101 with respect to the imaging lens 104 in the five axes of x, y, z, β, and γ to perform position adjustment. Solid-state imaging device 1
For the position adjustment accuracy of 01, high accuracy is required in all five axis directions.

[0005] However, even if the position adjustment is performed with high precision, if a displacement occurs when the solid-state image pickup device 101 is fixed, the position adjustment must be performed again or the unit must be discarded in some cases. , Which increases costs. Conventionally, fixing with screws has been often used, but the displacement amount is several tens μm to several hundreds.
μm, and sufficient positional accuracy could not be secured. For this reason, the solid-state imaging device 101
There has been a strong demand for a structure for fixing the.

For example, Japanese Patent Application Laid-Open No. Hei 5-328017 discloses a method for accurately adjusting and fixing the position of a CCD line sensor and an imaging lens by using an adjustment displacement mechanism using a wedge screw, a ball, and a compression spring. An arrangement is disclosed. However, according to this configuration, a large number of complicated mechanical components are required, so that the number of components is increased as a whole and the cost is increased.

Therefore, many attempts have been made at present to fix the position with an adhesive, which is considered to have a smaller amount of positional deviation than the fixing by screws, and to hardly increase the number of parts. This adhesion is roughly divided into two types: close adhesion in which the parts to be adhered are brought into contact with each other and adhesion, and a gap for adjusting the position between the parts to be adhered, which is provided. Filling and bonding with an adhesive.

[0008] For example, using this filling adhesion,
There is one disclosed in Japanese Patent Application Laid-Open No. 7-299799. According to this, a configuration is disclosed in which a solid-state imaging device fixing member to which an imaging lens is fixed and a solid-state imaging device holding member are attached by filling and attaching with high precision. That is, a projection is provided on the solid-state imaging device fixing member, a hole having a diameter larger than the projection is provided on the solid-state imaging device holding member, and the two members are positioned with the projection and the hole fitted. The adhesive is filled and fixed in the gap of the fitting portion while being positioned. In this configuration, even when the shapes of the adherends vary within the tolerance range, the amount of gap between the adherends is set so that the adherends do not come into contact with each other.

When an ultraviolet-curing adhesive is used as the adhesive, as shown in FIG. 7, an ultraviolet-curing adhesive 106 is applied to the bonding surface of the object 105 to be adhered to the object 107. After positioning, the light guide 10 is moved from the gap between the adherends 105 and 107 toward the ultraviolet curing adhesive 106.
The adhesive 106 is cured by irradiating ultraviolet rays by 8 to fix the object 105 to the object 107.

Japanese Patent Application Laid-Open No. 10-309801 discloses an ink jet head mounting structure in which an ink jet head is attached to a head holding member with high accuracy. A holding member is interposed, and the intermediate holding member is fixed to the ink jet head with an adhesive and is also fixed to the head holding member via the adhesive. According to this structure, when the adhesive cures and shrinks, the shrinkage is absorbed by moving the intermediate holding member closer to the ink jet head and the head holding member with the shrinkage, so that the ink jet head and the head holding member are fixed. The positional deviation at the time can be reduced.

[0011]

However, in the device disclosed in Japanese Patent Application Laid-Open No. 7-299799, the projection of the solid-state image sensor fixing member and the hole of the solid-state image sensor holding member are fitted so that they do not come into contact with each other. Since the total gap amount is set and the gap is filled with an adhesive and fixed, the following problems occur. Hereinafter, the problem of the filling adhesion will be specifically described with reference to FIG.

In FIG. 8, reference numerals 105 'and 107' denote adherends, and 106 'denotes an adhesive. After adjusting the positions of the adherends 105' and 107 'to predetermined positions, the adherend 105' is adjusted. An adhesive 106 'is filled in the gap between the adhesive surface of the adhesive 107' and the adhesive surface of the adhesive 107 'and cured to fix the object 105' to the object 107 '. The adherends 105 'and 107' correspond to the outer peripheral surface of the projection and the inner peripheral surface of the hole in JP-A-7-299799. Here, when the position is adjusted, the adherends 105 'and 10'
In order to obtain the necessary adhesive strength by filling the required amount of adhesive without contact with the 7 ', the objects 105' and 107 '
It is necessary to secure a predetermined gap B even when the distance fluctuates in the direction of the closest approach. Assuming that the position variation including the adjustment margin of the bonding surface 105a of the adherend 105 'is A and the position variation including the adjustment margin of the adhesion surface 107a of the adherend 107' is C, the thickness of the adhesive 106 'is minimum. The thickness B becomes the maximum thickness A + B + C, and the thickness A + C varies. In addition, the adherends 105 'and 10'
If 7 ′ has a surface accuracy variation of I and J on its bonding surface, the film thickness of the adhesive 106 ′ further varies accordingly.

In general, the adhesive shrinks when it is hardened. To reduce the displacement of the object to be bonded due to the hardening,
It is necessary to minimize the amount of adhesive applied. However, in the above-described filling bonding, the film thickness of the adhesive 106 'is changed to B
It is not possible to make the adhesive 10
If the shrinkage amount of 6 ′ is larger than the positional deviation allowable value, the positional deviation at the time of fixing the adherends 105 ′ and 107 ′ cannot be within the allowable value. In addition, since the variation in the thickness of the adhesive also generates the sum of A + C + I + J, the curing shrinkage amount of the adhesive also changes according to the variation. As a result, the positions of the adherends 105 'and 107' at the time of fixing may further vary, and the positional deviation may be further increased.

Usually, the volumetric shrinkage of the ultraviolet curable adhesive upon curing is about 5 to 10%. Considering the case where the volumetric shrinkage is about 6%, the shrinkage is about 2% in each of the three-dimensional directions. Assuming that the minimum gap B is 0.5 mm, the adhesive is displaced by about 10 μm in that direction due to the curing shrinkage of the adhesive. Further, assuming that the sum of the film thickness variations A + C + I + J is also 0.5 mm, the curing shrinkage also varies by about 10 μm, and the positional deviation amount is as large as 20 μm.

On the other hand, according to the apparatus disclosed in Japanese Patent Application Laid-Open No. 10-309801, an intermediate holding member is interposed between the ink jet head and the head holding member. Since the contraction can be absorbed by moving the holding member closer to the inkjet head and the head holding member, it is possible to reduce a positional shift when the inkjet head is bonded and fixed. However, there is a problem that the number of components as an intermediate holding member increases, and the cost increases.

The present invention has been made in view of the above circumstances, and is intended to form a linear image from an imaging lens on a pixel of a solid-state imaging device while satisfying a predetermined required accuracy in optical characteristics. , X, y, z, β, and γ in a five-axis direction, and a solid-state imaging device mounting structure that can reduce positional deviation during fixing without increasing the number of parts. It is an object to realize high quality and low cost by a structure.

[0017]

According to a first aspect of the present invention, there is provided a solid-state imaging device mounting structure according to the first aspect of the present invention. An intermediate portion having a first adhesive surface facing the solid-state imaging device and a second adhesive surface facing the solid-state imaging device holding member between the solid-state imaging device in which the photoelectric elements are arranged and the solid-state imaging device holding member. The first bonding surface of the intermediate holding member and the solid-state imaging device are bonded with an adhesive via the holding member, and the adhesive is bonded between the second bonding surface of the intermediate holding member and the solid-state imaging device holding member. In the mounting structure that is used and adhered,
The intermediate holding member has a light transmitting property and has a structure in which the photoelectric element is enclosed and sealed in cooperation with the photoelectric element holding member.

According to the first aspect of the present invention, since the intermediate holding member is interposed between the solid-state image pickup device holding member and the solid-state image pickup device, the position can be easily adjusted in the directions of five axes, and high accuracy can be achieved. Positioning is possible. The intermediate holding member has a function of absorbing the curing shrinkage of the adhesive and has a light-transmitting property, and cooperates with the photoelectric element holding member to enclose and seal the photoelectric element, so that the number of parts can be easily increased. With such a simple structure, the positional deviation at the time of fixing can be reduced, and the mounting of the solid-state imaging device can be performed with high quality and at low cost.

According to a second aspect of the present invention, there is provided a solid-state image pickup device mounting structure in which a photoelectric element is arranged on a photoelectric element holding member and the solid-state image sensor holding member is opposed to the solid-state image sensor. Via an intermediate holding member having a first bonding surface and a second bonding surface facing the solid-state imaging device holding member,
A mounting structure for bonding the first bonding surface of the intermediate holding member and the solid-state imaging device using an adhesive, and bonding the second bonding surface of the intermediate holding member and the solid-state imaging device holding member using an adhesive. A concave portion is formed in the first adhesive surface,
The photoelectric element holding member has a flat plate shape, and the intermediate holding member has a light-transmitting property and has a structure in which the photoelectric element is enclosed and sealed in cooperation with the photoelectric element holding member.

According to the second aspect of the present invention, since the intermediate holding member is interposed between the solid-state image sensor holding member and the solid-state image sensor, the position can be easily adjusted in the five-axis direction, and high accuracy can be achieved. Positioning is possible. The intermediate holding member has a function of absorbing the curing shrinkage of the adhesive, has a light transmitting property, and cooperates with the photoelectric element holding member to enclose and seal the photoelectric element, so that it is simple without increasing the number of parts. With the structure, positional deviation at the time of fixing can be reduced, and mounting of the solid-state imaging device can be performed with high quality and at low cost. Moreover, since the photoelectric element holding member is flat, the manufacturing cost of the photoelectric element holding member can be reduced, and the cost can be further reduced.

According to a third aspect of the present invention, there is provided a solid-state imaging device mounting structure according to the first or second aspect, wherein the adhesive is a photo-curable adhesive.

According to the third aspect of the present invention, the first aspect is provided.
In or 2, since the adhesive curing time can be shortened, the manufacturing time can be shortened, and the cost can be further reduced.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a solid-state image pickup device mounting structure according to the present invention will be described with reference to the drawings.

FIG. 1 is a schematic perspective view of an image pickup unit having a solid-state image pickup device mounting structure according to the present invention. The imaging unit 100 is used in an image reading device such as a copying machine, an image scanner, and a facsimile.

The imaging unit 100 includes a solid-state imaging device 1,
The solid-state imaging device 1 is roughly composed of an imaging lens 2, a solid-state imaging device holding member 3, and an intermediate holding member 6. The solid-state imaging device 1 includes a photoelectric element holding member 1e and R arranged on the photoelectric element holding member 1e.
It is generally constituted by GB photoelectric element arrays 1a, 1b, 1c (hereinafter, referred to as pixel lines; see also FIG. 3). A V-groove 4 is formed on the surface of the solid-state imaging device holding member 3 as shown in the drawing. The original image is converted to RGB pixel lines 1a, 1b,
The image forming lens 2 for forming an image on 1c is positioned and fixed to the V-groove 4 by the lens pressing plate 5, with the direction of the optical axis 9 parallel to the direction in which the V-groove 4 extends.

Here, the direction parallel to the optical axis 9 of the imaging lens 2 is orthogonal to the z-axis direction, the main scanning direction in the image reading device, ie, the direction in which the pixel line extends is the x-axis direction, and the sub-scanning direction, ie, orthogonal to the xz plane. Let the direction be the y-axis direction. Also,
The rotation direction around the y-axis is the β direction, and the rotation direction around the z-axis is γ.
Direction.

The solid-state imaging device 1 is mounted on a substrate 8. The substrate 8 has a solid-state image sensor 1 in addition to the solid-state image sensor 1.
And a signal processing circuit for a read signal read by the solid-state imaging device 1, and the like, and has a function of transmitting the processed electric signal to another circuit electrically connected thereto.

FIGS. 2 and 3 are side views of the image pickup unit 100 viewed from the right in FIG. 1 and the optical axis 9 of the imaging lens 2.
Is a side cross-sectional view cut along the XZ plane including. As shown in FIGS. 1 to 3, the intermediate holding member 6 includes a substantially rectangular parallelepiped first bonding portion 6 ′ (a vertical portion in FIG. 2) and a substantially rectangular parallelepiped second bonding portion 6 ′.
The bonding portion 6 ″ (horizontal portion in FIG. 2) is orthogonal and integrated, and has a substantially L-shaped cross section. The solid-state imaging device 1 is attached to the solid-state imaging device holding member 3 via the L-shaped intermediate holding member 6. Of the first bonding portion 6 ′
The surface 6a (first adhesive surface) facing the solid-state image sensor 1 is adhered to the solid-state image sensor 1, and the surface 6b (second adhesive surface) of the second adhesive portion 6 ″ facing the solid-state image sensor holding member 3 Is adhered to the solid-state image sensor holding member 3. During this bonding,
As will be described later, since the positioning is performed with high accuracy and there is almost no displacement at the time of fixing, the image light flux from the imaging lens 2 accurately forms an image on the pixel of the solid-state imaging device 1.

Since the intermediate holding member 6 has a substantially L-shaped cross section and the first and second bonding surfaces are orthogonal to each other, as shown in FIG. Both are fixed so as to be perpendicular to the pixel surface (light receiving surface) of the element 1. As a result, the pixel surface of the solid-state imaging device 1 is perpendicular to the optical axis 9 of the imaging lens 2 and is arranged so as to be able to receive a linear image light beam from the imaging lens 2.

Photoelectric element holding member 1e of solid-state imaging device 1
Is a member for holding the photoelectric element, and in this embodiment, the pixel lines 1a, 1b, 1
c is held substantially at the center thereof. Further, since the photoelectric element holding member 1e also has a function of radiating heat generated when the solid-state imaging element 1 is driven, ceramic having good thermal conductivity and non-conductivity is often used as the material. In general, ceramics have very high hardness and poor workability, and thus, in order to produce a complicated shape, a plate-shaped product is often laminated, but the production is difficult and costly. However, according to this embodiment, since the photoelectric element holding member 1e has a simple flat plate shape, it is not necessary to form ceramics by lamination. It is only necessary to cut out a flat plate material into a predetermined shape, the processing time and cost are reduced, and the number of parts may be one.

The first holding portion 6 'of the intermediate holding member 6 has a recess 6c' as shown in FIG. The concave portion 6c 'is formed so as to include the pixel lines 1a to 1c, and has a concave shape over the entire periphery except the first adhesive surface 6a. The pixel lines 1a to
The intermediate holding member 6 cooperates with the photoelectric element holding member 1e by applying an adhesive to the surrounding first adhesive surface 6a and filling and bonding with the plate-shaped photoelectric element holding member 1e while enclosing the photoelectric element holding member 1e. To seal the pixel lines 1a to 1c. By performing this step in a clean room or the like, the pixel lines 1 a to 1
The light receiving surface of 1c can be protected from dust. Also, even if dust or dust is present in the atmosphere in which the imaging unit 100 is used, the pixel lines 1a to 1c are sealed and protected, so that dust and dust do not collect on the light receiving surface of the pixel line. Also, there is no occurrence of a failure such as a missing pixel or a short circuit.

The intermediate holding member 6 includes the pixel lines 1a to 1c
Is arranged between the light receiving surface and the imaging lens 2 so as to block the image light flux. However, since the intermediate holding member 6 has light transmittance, the pixel lines 1a to 1c of the concave portion 6c ' The surface 6c facing the light receiving surface functions as a light-transmitting transmission window. Thereby, the image light beam from the imaging lens 2 can pass through the surface 6c as the transmission window of the concave portion 6c 'of the intermediate holding member 6 and reach the pixel lines 1a to 1c.

Further, in consideration of the attenuation of the light intensity of the image light beam, it is advantageous that the thickness of the first bonding portion 6 'in the image light beam traveling direction on the surface 6c as the transmission window is thinner.

The bonding between the intermediate holding member 6 and the solid-state image sensor 1 and the solid-state image sensor holding member 3 is performed in the following procedure.

First, the solid-state image pickup device 1 and the solid-state image pickup device holding member 3 are fixed to substantially three-dimensional fine-adjustable jigs (fine-adjustment stages) while being positioned at substantially predetermined positions. The fine adjustment stage to which the solid-state imaging device 1 is fixed can be finely adjusted in the x, y, and γ directions shown in FIG.
The fine adjustment stage to which the solid-state imaging element holding member 3 is fixed can be finely adjusted in the x, z, and β directions shown in FIG.

The first adhesive surface 6a of the intermediate holding member 6 and the second
UV-curable adhesives 7a and 7b are respectively applied to the surface 6b to be bonded.
Is applied. The smaller the amount of the UV-curable adhesives 7a and 7b applied, the less shrinkage during curing is required. However, when the fine adjustment in each axial direction as described later is performed, the gap generated between the adhesive surfaces can be filled. Must be applied beforehand.

The UV-curable adhesive 7a applied to the first adhesive surface 6a of the intermediate holding member 6 is brought into contact with the adhesive surface of the photoelectric element holding member 1e of the solid-state imaging device 1, and further applied to the second adhesive surface 6b. The applied ultraviolet-curable adhesive 7 b is brought into contact with the adhesive surface of the solid-state image sensor holding member 3. At this time, the pixel lines 1a to 1c arranged on the photoelectric element holding member 1e of the solid-state imaging device 1 are included in the concave portion 6c 'of the intermediate holding member 6. Thereby, the pixel lines 1a to 1c are sealed and protected from dust.

In this state, the adhesives 7a and 7b are not yet irradiated with ultraviolet rays. The ultraviolet-curable adhesives 7a and 7b are cured in a short time of about 10 seconds when irradiated with ultraviolet light, but do not start curing until irradiated with ultraviolet light. The position can be finely adjusted.

The position of the solid-state image sensing device 1 and the solid-state image sensing device holding member 3 is finely adjusted while inspecting by a predetermined inspection method. The predetermined inspection method is, for example, when the reference light emitted from the reference light source is condensed by the imaging lens 2 to form an image on the pixels of the solid-state imaging device 1, and when the positioning of the solid-state imaging device 1 is accurate. A reference imaging pattern (reference light receiving intensity pattern) based on this reference light is previously grasped, and the reference imaging pattern and the solid-state imaging device 1 to be inspected are identified.
, And a method of comparing with an imaging pattern, but details thereof are omitted. At this time, the solid-state imaging device 1 has x
Although the movement is restricted by the first adhesive surface 6a substantially parallel to the y plane, fine adjustment is easy in the x, y, and γ directions. On the other hand, the movement of the solid-state image sensor holding member 3 is restricted by the second bonding surface 6b substantially parallel to the xz plane, but fine adjustment is easy in the x, z, and β directions. therefore,
The mutual positional relationship between the solid-state imaging device 1 and the solid-state imaging device holding member 3 is determined via the intermediate holding member 6 by x, y, z, β, and γ.
Fine adjustment is easily possible in the five axis directions.

After the above-described fine adjustment of the position is completed, the adhesive is cured. The effect of the adhesive is as follows.
Irradiation of ultraviolet rays (not shown) is performed on a and 7b, but curing is completed in a short time of about 10 seconds, so that production efficiency is high. At this time, since the intermediate holding member 6 has a light transmitting property, ultraviolet rays can be irradiated through the intermediate holding member 6, and the operation of irradiating the ultraviolet rays is simple.

When the adhesives 7a and 7b are cured,
About 5 to 10% shrinkage occurs in volume shrinkage. However, in this embodiment, with the contraction of the adhesives 7a and 7b, the intermediate holding member 6 moves so as to approach the solid-state imaging device 1 and the solid-state imaging device holding member 3 and absorbs the contraction. The displacement of the element 1 and the solid-state imaging device holding member 3 itself hardly occurs.

After the curing of the adhesive is completed, the solid-state imaging device 1 and the solid-state imaging device holding member 3 are removed from their fine adjustment stages. In the imaging unit 100 in which the solid-state imaging device 1 and the solid-state imaging device holding member 3 are filled and bonded via the intermediate holding member 6, the intermediate holding member 6 for absorbing contraction during curing of the adhesive has a light transmitting property. And has a function as a cover glass of the solid-state imaging device 1. Therefore, without increasing the number of parts, the structure is inexpensive and has a simple structure. And is positioned with accurate position accuracy.

[Modification] In the above embodiment, the flat photoelectric element holding member 1e and the concave portion 6 are formed in the first bonding portion 6 '.
The mounting structure for filling and bonding the intermediate holding member 6 having c ′ has been described. As shown in the cross-sectional view of FIG. 10, the intermediate holding member 6 having the flat first bonding portion 6 ′ without the concave portion is provided. The mounting structure may have a concave portion 1e 'and fill and bond the concave portion 1e' with the photoelectric element holding member 1e in which the pixel lines 1a to 1c are arranged.

With this configuration, the intermediate holding member 6 can be formed in a simple shape, and can be manufactured at low cost. In addition, the pixel lines 1a to
1c is already disposed in the concave portion 1e 'of the photoelectric element holding member 1e.
The light receiving surfaces of the pixel lines 1a to 1c are protected to some extent,
There is also an effect that scratches and the like are not easily formed.

[0045]

As described above, according to the mounting structure of the solid-state imaging device of the present invention, the intermediate holding member is interposed between the solid-state imaging device holding member and the solid-state imaging device.
It is possible to obtain an effect that the position can be easily adjusted in the axial direction and highly accurate positioning can be performed. In addition, the intermediate holding member has a function of absorbing the curing shrinkage of the adhesive and has a light transmitting property, and cooperates with the photoelectric element holding member to enclose and seal the photoelectric element, thereby increasing the number of parts. It is also possible to obtain an effect that the positional deviation at the time of fixing can be reduced with a simple and simple structure, and the mounting of the solid-state imaging device can be made high quality and inexpensive.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of an imaging unit having a solid-state imaging device mounting structure according to an embodiment of the present invention.

FIG. 2 is a side view of the imaging unit shown in FIG. 1 as viewed from the right in FIG.

3 is a side sectional view of the imaging unit shown in FIG. 1 cut along an XZ plane including an optical axis 9 of the imaging lens 2. FIG.

FIG. 4 is a perspective view showing a concave portion of the intermediate holding member.

FIG. 5A is a perspective view illustrating a solid-state imaging device. FIG. 2B is a perspective view illustrating a solid-state imaging device for color imaging.

FIG. 6 is a perspective view illustrating a schematic configuration of an imaging unit in the image reading device.

FIG. 7 is a view showing an adhesive portion of an adhesive using an ultraviolet curable adhesive.

FIG. 8 is an explanatory diagram for explaining a bonding structure by filling bonding.

FIG. 9A is a diagram illustrating a first structure of a solid-state imaging device. FIG. 3B is a diagram illustrating a second structure of the solid-state imaging device.

FIG. 10 is a side cross-sectional view of the imaging unit according to a modification of the present invention cut along the same cross section as FIG. 3;

[Explanation of symbols]

 1, 101: solid-state imaging device 1a, 1b, 1c: pixel line 1e: photoelectric element holding member 1e ': concave portion 2, 104: imaging lens 3: solid-state imaging device holding member 4: V groove 5: holding plate 6: middle Holding member 6 ': first bonding portion 6' ': second bonding portion 6a: first bonding surface 6b: second bonding surface 6c: surface facing the light receiving surface 6c': concave portion 7a, 7b, 106, 106 '... UV curable adhesive 8 ... Substrate 9 ... Optical axis 100 ... Imaging unit 102 ... Photoelectric element (pixel) 103 ... Document 105,105 '... Adhered object 107,107' ... Adhered object 108 ... Light guide 109 ... Package 109a ... flat base 109b ... resin annular member 109c ... ceramic annular member 110 ... cover glass

Claims (3)

[Claims] 1. A box-shaped photoelectric element holding member having a recess formed between a solid-state image sensor in which photoelectric elements are arranged in the recess and a solid-state image sensor holding member. The first adhesive surface of the intermediate holding member and the solid-state imaging device are bonded with an adhesive via an intermediate holding member having a first adhesive surface and a second adhesive surface facing the solid-state imaging device holding member. In the mounting structure in which the second bonding surface of the intermediate holding member and the solid-state imaging device holding member are bonded using the adhesive, the intermediate holding member has a light transmitting property, A solid-state image pickup device mounting structure, wherein the photoelectric device is enclosed and hermetically sealed in cooperation with the photoelectric device holding member. 2. A solid-state imaging device in which photoelectric elements are arranged on a photoelectric element holding member, and a first adhesive surface facing the solid-state imaging element and the solid-state imaging element holding member, between the solid-state imaging element holding member. The first bonding surface of the intermediate holding member and the solid-state imaging device are bonded to each other with an adhesive via an intermediate holding member having a second bonding surface facing the intermediate holding member. A mounting structure for bonding the second bonding surface and the solid-state imaging element holding member using the adhesive, wherein a concave portion is formed in the first bonding surface, and the photoelectric element holding member has a flat plate shape; A mounting structure for a solid-state imaging device, wherein the intermediate holding member has a light transmitting property and has a structure in which the photoelectric element is enclosed and sealed in cooperation with the photoelectric element holding member. 3. The mounting structure according to claim 1, wherein the adhesive is a photo-curable adhesive.