JP2001326252A - Electronic component mounting apparatus and mounting method - Google Patents

Abstract

(57) [Summary] An object of the present invention is to provide an electronic component mounting apparatus and a mounting method capable of reducing a tact time of a mounting operation. In an electronic component mounting apparatus for mounting an electronic component on an edge of a glass substrate, a first camera for imaging a first recognition mark formed on an edge of the glass substrate, and an electronic device. The second component formed on the lower surface of the electronic component 5 in a state where the component 5 is held at a position higher than the edge of the glass substrate 2 by the height difference h and at a position not overlapping the edge vertically.
And a second camera 22 that captures an image of the recognition mark of the glass substrate 2 and the electronic component 5. Thus, the time required for recognizing the glass substrate 2 and the electronic component 5 can be reduced, and the tact time of the mounting operation can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component for mounting an electronic component having a terminal to be joined to the terminal on a substrate having a transparent edge such as a display panel and having a terminal formed on the upper surface of the edge. And a mounting method.

[0002]

2. Description of the Related Art A display panel such as a plasma panel or a liquid crystal panel used as a display of an electronic device is assembled by mounting electronic components such as a tape carrier package on an edge of a transparent substrate such as a glass substrate serving as a display screen. Can be The mounting of the electronic component is performed by bonding the terminal formed on the lower surface of the electronic component to the terminal formed on the upper surface of the edge portion of the substrate by using an anisotropic conductor or the like.

Since the pitch of the terminals of the display panel has been narrowed along with the high integration of electronic components, high positional accuracy is required when aligning the terminals of the display panel with the terminals of the electronic components. Is done. For this reason, when mounting the electronic component on the substrate, the recognition mark formed on the display panel and the recognition mark formed on the electronic component are recognized to detect a position shift, and the position shift is corrected when the electronic component is mounted. The mounting of the electronic component on the edge of the substrate is performed above.

[0004] The alignment of a glass substrate used for a display panel and an electronic component in a conventional electronic component mounting apparatus will be described below with reference to the drawings. FIG. 6 is a process explanatory view of a conventional electronic component mounting method. In FIG. 6A, the glass substrate 2 is held by the substrate holding table 1. The electronic component 5 mounted on the glass substrate 2 is held by a mounting head 13. By moving the mounting head 13 to move the electronic component 5 to an image capturing position by the camera, an image of the recognition mark formed on the lower surface of the electronic component 5 is captured.

Next, the mounting head 13 is raised, and in this state, the glass substrate 2 is moved to an image pickup position by the camera as shown in FIG. 6B, and an image of the recognition mark formed on the edge is picked up. By recognizing these imaging results as images, the misalignment between the glass substrate 2 and the electronic component 5 is detected, and after correcting the misalignment as shown in FIG. Aligned to 2. Thereafter, as shown in FIG. 6D, the crimping tool 12 is lowered to mount the electronic component 5 on the edge of the glass substrate 2.

[0006]

However, in the above-mentioned conventional method, since the same camera is used to sequentially image both the glass substrate 2 and the electronic component 5, the imaging operation is performed twice by one camera. In addition to the operation, the operation of raising the mounting head 13 holding the electronic component 5 and the operation of moving the glass substrate 2 to the imaging position are required. For this reason, there has been a problem that it takes a long time for the recognition operation for detecting the positional deviation, and it is difficult to reduce the tact time of the mounting operation.

An object of the present invention is to provide an electronic component mounting apparatus and a mounting method capable of shortening the tact time of the mounting operation.

[0008]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus having a terminal having a transparent edge portion and a terminal formed on the upper surface of the edge portion, the terminal being joined to the terminal. An electronic component mounting apparatus for mounting an electronic component, comprising: a substrate holding table that holds and positions the substrate; a mounting head that holds the electronic component and presses the edge of the substrate; and a substrate holding table. Relative movement means for relatively moving the mounting head, a first camera for imaging a first recognition mark formed on the edge of the substrate, and a predetermined height difference between the electronic component and the edge of the substrate. A second camera that captures an image of a second recognition mark formed on the lower surface of the electronic component while being held only at a high position and in a proximity position that does not vertically overlap the edge, a first camera, and a second camera. Image data from camera The first to identify 1 of the recognition mark and the second
An image recognition unit for recognizing the position of the recognition mark, and a control unit for positioning the electronic component with respect to the substrate by controlling the relative movement means based on the image recognition result.

According to a second aspect of the present invention, there is provided a method of mounting an electronic component having a terminal to be joined to the terminal on a substrate having a transparent edge and having a terminal formed on an upper surface of the edge. A component mounting method, comprising the steps of: holding a board on a board holding table; holding the electronic component on a mounting head to a position higher than the edge of the board by a predetermined height difference, and vertically above and below the edge. Temporarily positioning at a non-overlapping proximity position, and capturing a first recognition mark formed on an edge of the substrate with a first camera and forming a first recognition mark on a lower surface of the temporarily positioned electronic component. Capturing the second recognition mark with the second camera, and recognizing the image data of the first camera and the second camera to recognize the positions of the first recognition mark and the second recognition mark. , On image recognition results By relatively moving the substrate holding table and the mounting head Zui and a step of aligning the electronic component to the substrate.

According to the present invention, a first camera for picking up an image of a first recognition mark formed on an edge of a substrate is provided at a position higher than the edge of the substrate by a predetermined altitude difference, and the height of the first camera is higher than that of the edge. A second camera that images a second recognition mark formed on the lower surface of the electronic component in a state where the electronic component is held in a proximity position that does not overlap with the first recognition mark and the second recognition mark. By performing the imaging operations in parallel, the time required for recognizing the board and the electronic component can be reduced.

[0011]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a partial side view of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a plan view of a substrate and an electronic component according to an embodiment of the present invention, FIG. 4 is a process explanatory view of a method of mounting an electronic component according to an embodiment of the present invention, and FIG. FIG.

First, the structure of an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transparent glass substrate 2 is placed on a substrate holding table 1. The glass substrate 2 is formed by laminating two glass plates 2a and 2b, and a large number of terminals 3 are formed at the edge of the glass plate 2a.
See also). An anisotropic conductive material 4 is attached on the terminal 3. The glass substrate 2 is positioned by driving the substrate holding table 1 by the table driving mechanism 23 (FIG. 2). Therefore, the substrate holding table 1 and the table driving mechanism 23 serve as substrate positioning means.

Above the substrate holding table 1, a crimping section 6 is provided. On the moving table 7 of the crimping unit 6, a lifting unit 8 having a motor 8a is mounted. A pressure bonding head 10 is provided in the elevating unit 8 so as to be vertically movable by a guide member 9. The crimping head 10 includes a cylinder 11, and a crimping tool 12 is attached to a rod end of the cylinder 11.
Are combined.

On the front side of the substrate holding table 1, a mounting head 13 is provided. The mounting head 13 is configured by mounting a suction tool 15 on a mounting arm 14.
It is driven by the mounting head driving mechanism 26 (mounting head driving means) shown in FIG. 2 to perform horizontal movement and vertical movement.
The suction tool 15 holds the electronic component 5.

As shown in FIG. 3, the electronic component 5 has a semiconductor element 5b mounted on a film-like substrate and sealed with a resin. On the lower surface of the edge of the electronic component 5, a terminal 5a similar to the terminal 3 at the edge of the glass plate 2a is formed. Terminal 5
The electronic component 5 is mounted on the glass substrate 2 by superposing a on the terminal 3 via the anisotropic conductive material 4 and pressing the edge of the electronic component 5 with the crimping tool 12.

In FIG. 1, a camera moving table 20 is provided below an end of the substrate holding table 1. The camera movement table 20 has a first camera 21,
The second camera 22 is mounted. First camera 2
The first and second cameras 22 respectively image the edge of the glass plate 2 a of the glass substrate 2 and the lower surface of the electronic component 5 when the electronic component 5 is mounted.

Next, the configuration of the control system and the imaging by the first camera 21 and the second camera 22 will be described with reference to FIG. In FIG. 2, image data of the first camera 21 and the second camera 22 is sent to the image recognition unit 24.
The first camera 21 includes recognition marks MA and MB formed on the upper surface of the edge of the glass plate 2a of the glass substrate 2 shown in FIG.
Image data is obtained by imaging the visual fields 30A and 30B including the (first recognition mark) through the glass plate from the lower surface.

The second camera 22 obtains image data of the visual fields 31A and 31B including the recognition marks ma and mb (second recognition marks) formed on the lower surface of the electronic component 5. During this imaging, the electronic component 5 is provisionally positioned at a position higher than the edge of the glass plate 2a by a predetermined height difference h and does not vertically overlap the edge. The focus of the first camera 21 and the second camera 22 is set in advance so that the focal position of the second camera 22 is higher by the height difference h. This allows the first camera 21 and the second camera 22 to immediately take an image after moving the glass substrate 2 and the electronic component 5 to the imaging position.

The image recognizing unit 24 processes the image data by image processing, thereby recognizing the mark M on the glass substrate 2.
A, MB, and recognition marks ma, mb of the electronic component 5 are recognized, and the position is detected. The detection result of the position of the recognition mark is sent to the control unit 25. The controller 25 controls the table driving mechanism 23 and the mounting head driving mechanism 2 based on the position detection result.
6 is controlled. Thereby, by moving the substrate holding table 1 and the mounting head 13 relatively, the positional deviation when the edge of the electronic component 5 is superimposed on the edge of the glass plate 2a of the glass substrate 2 and mounted is corrected. can do. Further, by controlling the camera moving table 20 by the control unit 25, the first camera 21 and the second camera 22 are moved along the edge of the glass substrate 2 to adjust the field of view to a desired imaging position. I can do it.

In the present embodiment, the table driving mechanism 23
And the mounting head drive mechanism 26 is mounted on the substrate holding table 1.
And the mounting head 13 are relatively moved, but one of the table driving mechanism 23 and the mounting head driving mechanism 26 may function as the relative moving means.

This electronic component mounting apparatus is configured as described above, and the mounting method will be described below with reference to FIG. In FIG. 4A, a glass substrate 2 is placed on a substrate holding table 1. The terminal 3 shown in FIG. 3 is formed on the edge of the glass plate 2 a of the glass substrate 2, and the anisotropic conductive material 4 is adhered on the terminal 3. The suction tool 15 of the mounting head 13 has terminals 5 on its lower surface.
a (FIG. 3) is held.

Next, as shown in FIG. 4B, the substrate holding table 1 and the suction tool 15 are moved to position the substrate holding table 1, and the electronic component 5 is moved to a predetermined distance from the edge of the glass plate 2a. Temporary positioning is performed at a proximity position that is higher by the height difference h and does not vertically overlap the edge. Then, as shown in FIG. 4C, the recognition mark MA on the edge of the glass plate 2a of the glass substrate 2 and the recognition mark ma on the lower surface of the electronic component 5 are respectively set to the first camera 21 and the second camera 22. Adjust to the imaging field of view. At this time, the first camera 2
1. Since the focal position of the second camera 22 is set in advance to a predetermined imaging height position with a height difference h shown in FIG. 2, the focal point is focused on the upper surface of the edge of the glass plate 2a and the lower surface of the electronic component 5. No time is required to match.

Thereafter, the first camera 21 and the second camera 22 simultaneously image the recognition marks MA and ma, respectively, and then drive the camera moving table 20 to drive the first camera 21 and the second camera 22. The camera 22 is moved, and the recognition marks MB and mb (FIG. 3) are similarly imaged. This image data is sent to the image recognition unit 24, where the recognition mark M
The positions of A, MB, ma, and mb are detected. The position detection result is sent to the control unit 25, and the control unit 25 calculates the relative displacement between the terminal 3 and the terminal 5a from the position detection result.

Then, as shown in FIG.
When the edge of is overlapped with the edge of the glass plate 2a of the glass substrate 2, the positioning is performed by correcting the above-mentioned positional deviation while relatively moving the two. Thereafter, in a state where the alignment has been performed, the crimping tool 12 is lowered with respect to the upper surface of the edge of the electronic component 5 as shown in FIG. Press against. By continuing the pressing and the heating by the heating means provided in the crimping tool 12 for a predetermined time, the electronic component 5 is fixed to the edge of the glass substrate 2 by the anisotropic conductive material 4 and the terminals 5a of the electronic component 5 are fixed. Are electrically connected to the terminals 3 of the glass substrate 2. Thus, the mounting of the electronic component 5 on the glass substrate 2 is completed.

As described above, according to the present embodiment, in the electronic component mounting method in which the edge of the electronic component 5 is superposed on the edge of the glass substrate 2 and mounted, the electronic component 5 is formed on the glass substrate and the electronic component 5 respectively. Cameras for imaging the recognition marks are individually provided, and the imaging position and the focal height of each camera are determined by the glass substrate 2 and the electronic component 5 during the mounting operation.
Is set at a position where the movement of the object can be optimally performed.

Thus, the recognition of the glass substrate 2 and the recognition of the electronic component 5 can be performed simultaneously and in parallel, and no extra operation for imaging occurs during the mounting operation. Therefore, the mounting tact time can be shortened and the productivity can be improved.

In the above-described mounting mode, the first camera 21 and the first camera 21 for imaging the glass substrate 2 and the electronic component 5 are respectively provided.
An example is shown in which each of the second cameras 22 is provided, but as shown in FIG.
The first camera 21A, 21B and the second camera 22
A and 22B are mounted, and the recognition marks MA and MB of the glass substrate 2 and the recognition marks ma and mb of the electronic component 5 are simultaneously imaged. The productivity can be improved by shortening. Further, in the present embodiment, an example of the tape carrier package in which the lead-shaped terminals 5a are formed on the lower surface of the film-shaped substrate as the electronic component 5 has been described. It may be.

[0028]

According to the present invention, the first camera for picking up the first recognition mark formed on the edge of the substrate and the electronic component are located at a position higher than the edge of the substrate by a predetermined height difference. And a second camera that captures a second recognition mark formed on the lower surface of the electronic component while being held at a proximity position that does not overlap the edge, and captures the first recognition mark and the second recognition mark. Since the operations are performed in parallel, the time required for recognizing the board and the electronic component can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a partial side view of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a plan view of a substrate and an electronic component according to an embodiment of the present invention.

FIG. 4 is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention;

FIG. 5 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 6 is a process explanatory view of a conventional electronic component mounting method.

[Description of Reference Numerals] 1 substrate holding table 2 glass substrate 3 terminal 5 electronic component 10 pressure bonding head 13 mounting head 21 first camera 22 second camera 23 table driving mechanism 24 image recognition unit 25 control unit 26 mounting head driving mechanism MA , MB, ma, mb Recognition mark

Claims (2)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component having a terminal to be joined to a terminal on a substrate having a transparent edge and having a terminal formed on an upper surface of the edge, the substrate comprising: A substrate holding table for holding and positioning, a mounting head for holding the electronic component and pressing against the edge of the substrate, a relative moving unit for relatively moving the substrate holding table and the mounting head, A first camera for picking up an image of a first recognition mark formed on an edge, and holding the electronic component at a position higher than the edge of the substrate by a predetermined altitude difference and at a position not overlapping the edge vertically A second camera that captures an image of a second recognition mark formed on the lower surface of the electronic component in a state in which the first recognition mark and the second recognition mark are formed by performing image recognition on image data of the first camera and the second camera. Position of recognition mark 2 An electronic component mounting, comprising: an image recognition unit to be recognized; and a control unit that positions the electronic component with respect to a substrate by controlling the relative movement unit based on the image recognition result. apparatus. 2. A method for mounting an electronic component, comprising: mounting an electronic component having a terminal joined to the terminal on a substrate having a transparent edge and having a terminal formed on an upper surface of the edge; A step of holding the substrate on a table, and a step of temporarily positioning the electronic component at a position higher than the edge of the substrate by a predetermined height difference and at a position close to the edge so as not to vertically overlap with the edge of the substrate. The first recognition mark formed on the edge of the substrate is imaged by a first camera, and the second recognition mark formed on the lower surface of the temporarily positioned electronic component is captured by a second camera. An image capturing step, an image recognition of image data of the first camera and the second camera to recognize positions of the first recognition mark and the second recognition mark, and a step of holding the substrate based on an image recognition result. Table and front Mounting method of the electronic component, characterized in that the electronic component and the step of aligning with respect to the substrate by relatively moving the mounting head.