JP2001284390A - Bond stage driver for bonder - Google Patents
Bond stage driver for bonderInfo
- Publication number
- JP2001284390A JP2001284390A JP2000093924A JP2000093924A JP2001284390A JP 2001284390 A JP2001284390 A JP 2001284390A JP 2000093924 A JP2000093924 A JP 2000093924A JP 2000093924 A JP2000093924 A JP 2000093924A JP 2001284390 A JP2001284390 A JP 2001284390A
- Authority
- JP
- Japan
- Prior art keywords
- bond stage
- drive
- cam
- motor
- drive table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/758—Means for moving parts
- H01L2224/75801—Lower part of the bonding apparatus, e.g. XY table
- H01L2224/75804—Translational mechanism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
- H01L2224/78804—Translational mechanism
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はボンディング装置用
ボンドステージ駆動装置に関する。The present invention relates to a bond stage driving device for a bonding device.
【０００２】[0002]
【従来の技術】ボンディング装置のボンドステージは、
ＸＹテーブルにより平面上のＸＹ軸方向に駆動され、Ｘ
Ｙテーブル上に搭載されたＺ軸（上下）駆動手段により
Ｚ軸方向に駆動される。Ｚ軸駆動手段は、Ｚ軸用モータ
と、このＺ軸用モータの回転をＺ軸方向に変換してボン
ドステージに伝達するＺ軸駆動部とからなっている。な
お、この種のボンディング装置用ボンドステージ駆動装
置として、例えば実開昭６３−２７０４２号公報、特開
平６−１６８９８３号公報等があげられる。2. Description of the Related Art The bonding stage of a bonding apparatus includes:
Driven in the XY axis directions on a plane by an XY table, X
It is driven in the Z-axis direction by Z-axis (up and down) driving means mounted on the Y table. The Z-axis driving means includes a Z-axis motor and a Z-axis driving unit that converts the rotation of the Z-axis motor in the Z-axis direction and transmits the rotation to the bond stage. Examples of this type of bond stage driving apparatus for a bonding apparatus include Japanese Utility Model Laid-Open No. 63-27042 and Japanese Patent Laid-Open No. 6-168983.
【０００３】従来技術は、いずれもＺ軸用モータがＺ軸
駆動部の側方に水平に配設されている。Ｚ軸用モータで
駆動されるＺ軸駆動部は、実開昭６３−２７０４２号公
報には開示されていないが、特開平６−１６８９８３号
公報には、次に述べる２つの実施の形態が開示されてい
る。In each of the prior arts, a Z-axis motor is horizontally disposed beside a Z-axis driving unit. The Z-axis drive unit driven by the Z-axis motor is not disclosed in Japanese Utility Model Laid-Open No. 63-27042, but the following two embodiments are disclosed in Japanese Patent Application Laid-Open No. 6-168983. Have been.
【０００４】第１の実施の形態は、水平に配設されたＺ
軸用モータが回転すると、カップリングを介して回転カ
ムが回転し、この回転カムの形状に従いカムフォロアが
上下動し、このカムフォロアと連結されたボンドステー
ジが上下動する。第２の実施の形態は、水平に配設され
たＺ軸用モータが回転すると、ボールねじが回転し、こ
のボールねじに螺合された連結体が水平移動し、この連
結体に連結された直進カムが水平移動する。この直進カ
ムの形状に従いカムフォロアが上下動し、このカムフォ
ロアと連結されたボンドステージが上下動する。[0004] In the first embodiment, a horizontally arranged Z is used.
When the shaft motor rotates, the rotating cam rotates via the coupling, the cam follower moves up and down according to the shape of the rotating cam, and the bond stage connected to the cam follower moves up and down. In the second embodiment, when a horizontally disposed Z-axis motor rotates, a ball screw rotates, and a connected body screwed to the ball screw moves horizontally and is connected to the connected body. The straight cam moves horizontally. The cam follower moves up and down according to the shape of the straight cam, and the bond stage connected to the cam follower moves up and down.
【０００５】[0005]
【発明が解決しようとする課題】上記従来技術は、Ｚ軸
用モータが水平に配設されているので、ボンドステージ
を上下動させるＺ軸駆動手段の平面的サイズが大きくな
る。特に前記第２の実施の形態においては、水平に配設
されたボールねじ及び直進カムを有するので、更に平面
的サイズが大きくなる。また前記いずれの形態も１個の
カムフォロアでボンドステージ等を支持する構造である
ので、垂直荷重に対する剛性に難点があった。In the prior art, since the Z-axis motor is disposed horizontally, the planar size of the Z-axis driving means for moving the bond stage up and down becomes large. In particular, in the second embodiment, since the ball screw and the straight cam are disposed horizontally, the planar size is further increased. Further, since each of the above embodiments has a structure in which a single cam follower supports a bond stage or the like, there is a problem in rigidity against a vertical load.
【０００６】本発明の課題は、平面的サイズが小さく、
かつ垂直荷重に対する剛性が得られるボンディング装置
用ボンドステージ駆動装置を提供することにある。An object of the present invention is to reduce the planar size,
Another object of the present invention is to provide a bond stage driving device for a bonding device that can obtain rigidity against a vertical load.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
の本発明の第１の手段は、ＸＹテーブル上又は該ＸＹテ
ーブル上に設けられたθ軸駆動手段上にＺ軸駆動手段を
設け、Ｚ軸駆動手段にボンドステージを設けたボンディ
ング装置用ボンドステージ駆動装置において、前記Ｚ軸
駆動手段は、前記ＸＹテーブル又は前記θ軸駆動手段上
に固定されたθ駆動テーブル用モータと、このθ駆動テ
ーブル用モータにより回転させられるＺ駆動用テーブル
と、このＺ駆動用テーブル上に固定された複数個の傾斜
部を有するカムと、前記傾斜部にそれぞれ対応して該傾
斜部に圧接するように前記ボンドステージに設けられた
複数個のカムフォロアとを備え、前記Ｚ駆動用テーブル
の回転により傾斜部のプロフィールに沿って前記ボンド
ステージを上下動可能に設けたことを特徴とする。A first means of the present invention for solving the above problems is to provide a Z-axis driving means on an XY table or a θ-axis driving means provided on the XY table, In a bond stage driving device for a bonding apparatus in which a bond stage is provided on a Z-axis driving unit, the Z-axis driving unit includes: a motor for a θ driving table fixed on the XY table or the θ-axis driving unit; A Z-drive table rotated by a table motor, a cam having a plurality of inclined portions fixed on the Z-drive table, and a cam corresponding to each of the inclined portions so as to press against the inclined portions. A plurality of cam followers provided on the bond stage, and the bond stage can be moved up and down along the profile of the inclined portion by rotating the Z drive table. Characterized by providing the.
【０００８】上記課題を解決するための本発明の第２の
手段は、上記第１の手段において、前記傾斜部は、前記
Ｚ駆動用テーブルの外周部に等間隔に設けられた複数個
のカム又はリング状に形成されたカムよりなることを特
徴とする。According to a second aspect of the present invention, there is provided the above-mentioned first means, wherein the inclined portion comprises a plurality of cams provided at equal intervals on an outer peripheral portion of the Z drive table. Alternatively, it is characterized by comprising a cam formed in a ring shape.
【０００９】上記課題を解決するための本発明の第３の
手段は、上記第１の手段において、前記ボンドステージ
の上下動は、上下ガイド機構によりガイドされているこ
とを特徴とする。A third means of the present invention for solving the above-mentioned problem is characterized in that, in the first means, the vertical movement of the bond stage is guided by a vertical guide mechanism.
【００１０】[0010]
【発明の実施の形態】本発明の一実施の形態を図１乃至
図３により説明する。図１に示すように、平面上のＸＹ
軸方向に駆動されるＸＹテーブル１上には、θ軸駆動手
段２が搭載されている。θ軸駆動手段２は、ＸＹテーブ
ル１に固定されたθ軸駆動部３と、このθ軸駆動部３に
よりθ軸方向に駆動されるθ駆動用テーブル４とからな
っている。この機構は周知であるので、これ以上の説明
は省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. As shown in FIG.
On an XY table 1 driven in the axial direction, a θ-axis driving means 2 is mounted. The θ-axis driving means 2 includes a θ-axis driving unit 3 fixed to the XY table 1 and a θ-driving table 4 driven by the θ-axis driving unit 3 in the θ-axis direction. Since this mechanism is well known, further description is omitted.
【００１１】θ軸駆動手段２のθ駆動用テーブル４上に
は、Ｚ軸駆動手段１０が搭載されている。Ｚ軸駆動手段
１０は、ＡＣサーボモータを組み込んだＺ駆動テーブル
用モータ１１と、このＺ駆動テーブル用モータ１１によ
り回転させられるＺ駆動用テーブル１２とを有し、Ｚ駆
動テーブル用モータ１１はθ駆動用テーブル４に固定さ
れている。ここで、前記Ｚ駆動テーブル用モータ１１と
して、例えば日本精工株式会社製の商品名「メガトルク
モータ」を使用した。Ｚ駆動用テーブル１２の外周部に
は、図３に示すように、傾斜部１３を有する３個のカム
１４が等間隔に固定されている。なお、図１には１個の
カム１４のみ図示した。A Z-axis driving unit 10 is mounted on the θ-driving table 4 of the θ-axis driving unit 2. The Z-axis drive means 10 has a Z-drive table motor 11 incorporating an AC servomotor, and a Z-drive table 12 rotated by the Z-drive table motor 11, and the Z-drive table motor 11 has θ It is fixed to the drive table 4. Here, as the Z drive table motor 11, for example, a trade name "megatorque motor" manufactured by Nippon Seiko Co., Ltd. was used. As shown in FIG. 3, three cams 14 having inclined portions 13 are fixed at equal intervals on the outer peripheral portion of the Z drive table 12. FIG. 1 shows only one cam 14.
【００１２】図１及び図２に示すように、前記Ｚ駆動テ
ーブル用モータ１１の側面には、上方に垂直に伸びた２
個のガイド支持板１５が固定されており、ガイド支持板
１５の内側には垂直に配設されたガイドレール１６が固
定されている。ガイドレール１６には、スライダ１７が
上下動可能に嵌挿され、スライダ１７にボンドステージ
１８が固定されている。即ち、ガイド支持板１５、ガイ
ドレール１６、スライダ１７により、ボンドステージ１
８の上下ガイド機構を構成している。As shown in FIGS. 1 and 2, a side surface of the Z-drive table motor 11 is vertically
Each of the guide support plates 15 is fixed, and a vertically arranged guide rail 16 is fixed inside the guide support plate 15. A slider 17 is inserted into the guide rail 16 so as to be vertically movable, and a bond stage 18 is fixed to the slider 17. That is, the bond stage 1 is formed by the guide support plate 15, the guide rail 16, and the slider 17.
8 constitute a vertical guide mechanism.
【００１３】ボンドステージ１８の下面には、図３に示
すように、前記３個のカム１４に対応した位置にそれぞ
れブラケット２０が固定されており、ブラケット２０に
は傾斜部１３に当接するようにカムフォロア２１が回転
自在に支承されている。なお、図１には１個のブラケッ
ト２０及びカムフォロア２１のみ図示した。図１及び図
２に示すように、前記ガイド支持板１５及び前記スライ
ダ１７にはばね２２が設けられ、このばね２２の付勢力
でカムフォロア２１は傾斜部１３に圧接している。な
お、ばね２２は設けなくても、ボンドステージ１８の自
重でカムフォロア２１はカム１３に圧接するが、ばね２
２を設けた方がカムフォロア２１はカム１４の動きに確
実に追従するので好ましい。As shown in FIG. 3, brackets 20 are fixed to the lower surface of the bond stage 18 at positions corresponding to the three cams 14, respectively. A cam follower 21 is rotatably supported. FIG. 1 shows only one bracket 20 and cam follower 21. As shown in FIGS. 1 and 2, a spring 22 is provided on the guide support plate 15 and the slider 17, and the cam follower 21 is pressed against the inclined portion 13 by the urging force of the spring 22. Although the spring 22 is not provided, the cam follower 21 is pressed against the cam 13 by its own weight of the bond stage 18.
It is preferable to provide the cam follower 2 because the cam follower 21 reliably follows the movement of the cam 14.
【００１４】次に作用について説明する。ＸＹテーブル
１がＸＹ軸方向に移動すると、θ軸駆動手段２及びＺ軸
駆動手段１０が共にＸＹ軸方向に移動し、ボンドステー
ジ１８もＸＹ軸方向に移動させられる。またθ軸駆動手
段２のθ軸駆動部３が駆動すると、Ｚ駆動用テーブル１
２が回転し、Ｚ駆動用テーブル１２と共にＺ軸駆動手段
（ガイド支持板１５、ガイドレール１６、スライダ１
７）が回転し、ボンドステージ１８も共に回転する。こ
れにより、ボンドステージ１８上に載置された図示しな
い基板等のθ（回転）方向を補正することができる。Next, the operation will be described. When the XY table 1 moves in the XY-axis directions, both the θ-axis driving means 2 and the Z-axis driving means 10 move in the XY-axis directions, and the bond stage 18 is also moved in the XY-axis directions. When the θ-axis drive unit 3 of the θ-axis drive unit 2 is driven, the Z-drive table 1
2 rotates and Z-axis driving means (guide support plate 15, guide rail 16, slider 1
7) rotates, and the bond stage 18 also rotates. Thus, the θ (rotation) direction of a substrate (not shown) mounted on the bond stage 18 can be corrected.
【００１５】Ｚ駆動テーブル用モータ１１を正方向に駆
動させると、Ｚ駆動用テーブル１２が矢印Ａ方向に回転
し、カム１４も共に回転する。ボンドステージ１８はス
ライダ１７を介してガイドレール１６に沿って上下動可
能に設けられているので、前記したようにカム１４が回
転すると、カム１４の傾斜部１３の上昇プロフィールに
沿ってカムフォロア２１が上昇し、ボンドステージ１８
も共に上昇する。ボンドステージ１８が上昇した状態
で、Ｚ駆動テーブル用モータ１１を逆方向に駆動させる
と、前記と逆に傾斜部１３の下降プロフィールに沿って
ボンドステージ１８は下降する。When the Z-drive table motor 11 is driven in the forward direction, the Z-drive table 12 rotates in the direction of arrow A, and the cam 14 also rotates. Since the bond stage 18 is provided so as to be able to move up and down along the guide rail 16 via the slider 17, when the cam 14 rotates as described above, the cam follower 21 moves along the rising profile of the inclined portion 13 of the cam 14. Rise, bond stage 18
Rise together. When the Z drive table motor 11 is driven in the reverse direction with the bond stage 18 raised, the bond stage 18 moves down along the descent profile of the inclined portion 13 in the opposite direction.
【００１６】なお、上記実施の形態においては、３個の
カム１４にそれぞれ傾斜部１３を形成したが、リング状
の１個のカムに３個の傾斜部１３を形成してもよい。ま
た３個の傾斜部１３を設け、この傾斜部１３に対応して
それぞれカムフォロア２１を設けたが、傾斜部１３は２
個以上でその傾斜部１３に対応してそれぞれカムフォロ
ア２１を設けてもよい。しかし、本実施の形態のように
３個の傾斜部１３を設け、３個のカムフォロア２１でボ
ンドステージ１８を支持するようにした方が安定性及び
剛性の面で好ましい。またθ軸駆動手段２を有する場合
について説明したが、実開昭６３−２７０４２号公報、
特開平６−１６８９８３号公報等のようにθ軸駆動手段
２を有しないものにも適用できることは言うまでもな
い。この場合は、ＸＹテーブル１上にＺ駆動テーブル用
モータ１１を固定することになる。In the above embodiment, the inclined portions 13 are formed on the three cams 14, respectively. However, three inclined portions 13 may be formed on one ring-shaped cam. Further, three inclined portions 13 are provided, and the cam followers 21 are provided corresponding to the inclined portions 13, respectively.
A plurality of cam followers 21 may be provided corresponding to the inclined portions 13. However, it is more preferable to provide the three inclined portions 13 and support the bond stage 18 with the three cam followers 21 as in the present embodiment in terms of stability and rigidity. In addition, although the case where the θ-axis driving means 2 is provided has been described, Japanese Utility Model Laid-Open No. 63-27042 discloses
Needless to say, the present invention can be applied to a device having no θ-axis driving means 2 as disclosed in JP-A-6-168983. In this case, the Z drive table motor 11 is fixed on the XY table 1.
【００１７】このように、ＸＹテーブル１又はθ軸駆動
手段２上にＺ駆動テーブル用モータ１１を固定し、この
Ｚ駆動テーブル用モータ１１で回転されるＺ駆動用テー
ブル１２にカム１４を固定した構造であるので、Ｚ軸駆
動手段の平面サイズが小さくなる。またＺ駆動テーブル
用モータ１１はモータ部を内蔵しており、Ｚ軸駆動手段
のコンパクト化ができる。更にボンドステージ１８は、
複数個のカムフォロア２１で支持するので、垂直荷重に
対して剛性が得られる。As described above, the Z drive table motor 11 is fixed on the XY table 1 or the θ axis drive means 2, and the cam 14 is fixed on the Z drive table 12 rotated by the Z drive table motor 11. Due to the structure, the plane size of the Z-axis driving means is reduced. Further, the motor 11 for the Z drive table has a built-in motor unit, so that the Z axis drive means can be made compact. Furthermore, the bond stage 18
Since it is supported by the plurality of cam followers 21, rigidity can be obtained against a vertical load.
【００１８】[0018]
【発明の効果】本発明は、ＸＹテーブル又はθ軸駆動手
段上に固定されたθ駆動テーブル用モータと、このθ駆
動テーブル用モータにより回転させられるＺ駆動用テー
ブルと、このＺ駆動用テーブル上に固定された複数個の
傾斜部を有するカムと、前記傾斜部にそれぞれ対応して
該傾斜部に圧接するように前記ボンドステージに設けら
れた複数個のカムフォロアとを備え、前記Ｚ駆動用テー
ブルの回転により傾斜部のプロフィールに沿って前記ボ
ンドステージを上下動可能に設けたので、平面的サイズ
が小さく、かつ垂直荷重に対する剛性が得られる。The present invention provides a motor for a θ drive table fixed on an XY table or θ axis drive means, a Z drive table rotated by the motor for the θ drive table, and a motor for the Z drive table. A cam having a plurality of inclined portions fixed to the table, and a plurality of cam followers provided on the bond stage so as to press against the inclined portions respectively corresponding to the inclined portions, wherein the Z drive table is provided. Since the bond stage is provided so as to be vertically movable along the profile of the inclined portion by the rotation of, the planar size is small and rigidity against a vertical load can be obtained.
【図１】本発明のボンディング装置用ボンドステージ駆
動装置の一実施の形態を示す正面図である。FIG. 1 is a front view showing an embodiment of a bond stage driving device for a bonding device according to the present invention.
【図２】図１の平面図である。FIG. 2 is a plan view of FIG.
【図３】カムとカムフォロアとの関係を示す平面図であ
る。FIG. 3 is a plan view showing a relationship between a cam and a cam follower.
１ ＸＹテーブル ２ θ軸駆動手段 ３ θ軸駆動部 ４ θ駆動用テーブル １０ Ｚ軸駆動手段 １１ Ｚ駆動テーブル用モータ １２ Ｚ駆動用テーブル １３ 傾斜部 １４ カム １５ ガイド支持板 １６ ガイドレール １７ スライダ １８ ボンドステージ ２１ カムフォロア DESCRIPTION OF SYMBOLS 1 XY table 2 θ axis drive means 3 θ axis drive part 4 θ drive table 10 Z axis drive means 11 Z drive table motor 12 Z drive table 13 Inclined part 14 Cam 15 Guide support plate 16 Guide rail 17 Slider 18 Bond Stage 21 Cam Follower
Claims (3)
設けられたθ軸駆動手段上にＺ軸駆動手段を設け、Ｚ軸
駆動手段にボンドステージを設けたボンディング装置用
ボンドステージ駆動装置において、前記Ｚ軸駆動手段
は、前記ＸＹテーブル又は前記θ軸駆動手段上に固定さ
れたθ駆動テーブル用モータと、このθ駆動テーブル用
モータにより回転させられるＺ駆動用テーブルと、この
Ｚ駆動用テーブル上に固定された複数個の傾斜部を有す
るカムと、前記傾斜部にそれぞれ対応して該傾斜部に圧
接するように前記ボンドステージに設けられた複数個の
カムフォロアとを備え、前記Ｚ駆動用テーブルの回転に
より傾斜部のプロフィールに沿って前記ボンドステージ
を上下動可能に設けたことを特徴とするボンディング装
置用ボンドステージ駆動装置。1. A bond stage driving device for a bonding apparatus, wherein a Z-axis driving unit is provided on an XY table or a θ-axis driving unit provided on the XY table, and the Z-axis driving unit is provided with a bond stage. The Z-axis driving means includes: a motor for a θ-drive table fixed on the XY table or the θ-axis driving means; a Z-drive table rotated by the motor for the θ-drive table; A cam having a plurality of fixed inclined portions, and a plurality of cam followers provided on the bond stage so as to press against the inclined portions respectively corresponding to the inclined portions; A bond stage drive for a bonding apparatus, wherein the bond stage is provided so as to be vertically movable along a profile of an inclined portion by rotation. Location.
外周部に等間隔に設けられた複数個のカム又はリング状
に形成されたカムよりなることを特徴とする請求項１記
載のボンディング装置用ボンドステージ駆動装置。2. The bonding device according to claim 1, wherein the inclined portion comprises a plurality of cams or ring-shaped cams provided at equal intervals on an outer peripheral portion of the Z drive table. Bond stage drive for equipment.
イド機構によりガイドされていることを特徴とする請求
項１記載のボンディング装置用ボンドステージ駆動装
置。3. The bond stage driving device for a bonding apparatus according to claim 1, wherein the vertical movement of the bond stage is guided by a vertical guide mechanism.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000093924A JP2001284390A (en) | 2000-03-30 | 2000-03-30 | Bond stage driver for bonder |
| TW089126702A TW471078B (en) | 2000-03-30 | 2000-12-14 | Bond stage driver for bonder |
| KR10-2001-0012414A KR100392522B1 (en) | 2000-03-30 | 2001-03-10 | Bond stage driving apparatus for bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000093924A JP2001284390A (en) | 2000-03-30 | 2000-03-30 | Bond stage driver for bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001284390A true JP2001284390A (en) | 2001-10-12 |
Family
ID=18609045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000093924A Withdrawn JP2001284390A (en) | 2000-03-30 | 2000-03-30 | Bond stage driver for bonder |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2001284390A (en) |
| KR (1) | KR100392522B1 (en) |
| TW (1) | TW471078B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4664818B2 (en) | 2004-01-29 | 2011-04-06 | 有限会社Ｎａｓ技研 | Substrate inspection device, substrate inspection method and recovery jig |
| KR100799367B1 (en) * | 2005-05-30 | 2008-01-30 | 주식회사 케이피에스 | 4-axis stage system |
| KR101450820B1 (en) * | 2008-10-31 | 2014-10-14 | 주식회사 탑 엔지니어링 | Chuck stage lifting device of bonding apparatus |
| KR20200109493A (en) * | 2019-03-13 | 2020-09-23 | (주)큐엠씨 | Apparatus and method for transferring semiconductor chip |
-
2000
- 2000-03-30 JP JP2000093924A patent/JP2001284390A/en not_active Withdrawn
- 2000-12-14 TW TW089126702A patent/TW471078B/en not_active IP Right Cessation
-
2001
- 2001-03-10 KR KR10-2001-0012414A patent/KR100392522B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20010094965A (en) | 2001-11-03 |
| KR100392522B1 (en) | 2003-07-23 |
| TW471078B (en) | 2002-01-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20070605 |