JP2001268808A - Secondary battery protection module - Google Patents
Secondary battery protection moduleInfo
- Publication number
- JP2001268808A JP2001268808A JP2000075712A JP2000075712A JP2001268808A JP 2001268808 A JP2001268808 A JP 2001268808A JP 2000075712 A JP2000075712 A JP 2000075712A JP 2000075712 A JP2000075712 A JP 2000075712A JP 2001268808 A JP2001268808 A JP 2001268808A
- Authority
- JP
- Japan
- Prior art keywords
- secondary battery
- battery protection
- circuit board
- printed circuit
- conductor pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 41
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000010931 gold Substances 0.000 claims abstract description 27
- 229910052737 gold Inorganic materials 0.000 claims abstract description 27
- 238000007747 plating Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical group [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Secondary Cells (AREA)
- Protection Of Static Devices (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、二次電池、即ち、
リチウムイオン電池等の充電可能な電池を保護するため
の回路を備えた二次電池保護モジュールに属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a secondary battery,
It belongs to a secondary battery protection module including a circuit for protecting a rechargeable battery such as a lithium ion battery.
【０００２】[0002]
【従来の技術】二次電池の内、特にリチウムイオン電池
は、過放電、過充電に弱いため、過放電状態、過充電状
態を検出して、過放電状態及び過充電状態から二次電池
を保護するための保護回路が不可欠である。従って、こ
の二次電池保護回路は、過放電防止機構と過充電防止機
構とを備えている。このような二次電池保護回路は、例
えば、特許第２８７２３６５号公報に開示されるものが
知られており、また、本願出願人によっても提案されて
おり（特願平１１−３４８５３５号参照）、通常、二次
電池保護回路として、ＩＣチップが用いられている。2. Description of the Related Art Among secondary batteries, lithium ion batteries, in particular, are vulnerable to overdischarge and overcharge. Therefore, an overdischarge state and an overcharge state are detected, and the secondary battery is detected from the overdischarge state and the overcharge state. A protection circuit for protection is indispensable. Therefore, this secondary battery protection circuit includes an overdischarge prevention mechanism and an overcharge prevention mechanism. Such a secondary battery protection circuit is known, for example, from Japanese Patent No. 2872365, and has also been proposed by the present applicant (see Japanese Patent Application No. 11-348535). Usually, an IC chip is used as a secondary battery protection circuit.
【０００３】この二次電池保護回路を備えた従来の二次
電池保護モジュールは、一面及び他面にそれぞれ導体パ
ターンが形成されたプリント基板と、該プリント基板の
一面上に設けられ、ワイヤーボンディングにより前記導
体パターンに接続された二次電池保護回路と、前記プリ
ント基板の他面に設けられ、前記導体パターンを通じて
前記二次電池保護回路に接続された端子とを含んで構成
されている。A conventional secondary battery protection module provided with this secondary battery protection circuit includes a printed circuit board having a conductor pattern formed on one surface and the other surface, a printed circuit board provided on one surface of the printed circuit board, and wire bonding. The secondary battery protection circuit is configured to include a secondary battery protection circuit connected to the conductor pattern, and a terminal provided on the other surface of the printed circuit board and connected to the secondary battery protection circuit through the conductor pattern.
【０００４】従来の二次電池保護モジュールの場合、プ
リント基板の一面上に設けられた二次電池保護回路は、
上述のように、ワイヤーボンディングによって、プリン
ト基板の一面上に形成された導体パターンに電気的に接
続される。この為に、従来では、ワイヤーボンディング
を可能とする為に、プリント基板に形成された全ての導
体パターンに対してソフト金メッキ、即ち、純金による
金メッキが施されていた。このように、プリント基板の
一面側（チップ側）のみならず、プリント基板の他面側
（端子側）にもソフト金メッキが施されているので、プ
リント基板の他面に形成された導体パターンの一部を二
次電池保護回路の端子として用いた場合、二次電池を充
電器に装着する際等に、ソフト金メッキが傷付き易く、
その下の導体パターンを保護することができない。この
為、従来では、プリント基板の他面に形成され、ソフト
金メッキが施された導体パターンの内、端子と成る部分
に、金属片を半田付けし、更にこの金属片にハード金メ
ッキ、即ち、金合金による金メッキを施すことによっ
て、端子を構成していた。In the case of a conventional secondary battery protection module, a secondary battery protection circuit provided on one surface of a printed circuit board includes:
As described above, the wires are electrically connected to the conductor patterns formed on one surface of the printed circuit board. For this reason, conventionally, in order to enable wire bonding, soft gold plating, that is, gold plating with pure gold, has been applied to all conductor patterns formed on a printed circuit board. As described above, the soft gold plating is applied not only on one surface side (chip side) of the printed circuit board but also on the other surface side (terminal side) of the printed circuit board. When a part is used as the terminal of the secondary battery protection circuit, when mounting the secondary battery to the charger, the soft gold plating is easily damaged,
The underlying conductor pattern cannot be protected. For this reason, conventionally, a metal piece is soldered to a portion of a conductive pattern formed on the other surface of a printed circuit board and subjected to soft gold plating and serving as a terminal, and further, hard gold plating, that is, gold is applied to the metal piece. The terminals were formed by applying gold plating with an alloy.
【０００５】[0005]
【発明が解決しようとする課題】このように、従来の二
次電池保護モジュールでは、端子を構成するために、端
子と成る部分の導体パターンに、金属片を半田付けし、
更に、この金属片にハード金メッキを施さなければ成ら
ないので、製造工程が多く、この為、製造コストが高
く、安価に二次電池保護モジュールを提供することがで
きなかった。As described above, in the conventional secondary battery protection module, in order to form a terminal, a metal piece is soldered to a conductor pattern of a portion to be a terminal.
Further, since the metal piece must be plated with hard gold, the number of manufacturing steps is large, so that the manufacturing cost is high and the secondary battery protection module cannot be provided at low cost.
【０００６】それ故に、本発明の課題は、端子を簡単に
作ることが可能な二次電池保護モジュールを提供するこ
とにある。Therefore, an object of the present invention is to provide a secondary battery protection module in which terminals can be easily formed.
【０００７】[0007]
【課題を解決するための手段】請求項１記載の発明によ
れば、一面及び他面にそれぞれ導体パターン（３３，３
４）が形成されたプリント基板（３）と、該プリント基
板（３）の一面上に設けられ、ワイヤーボンディングに
より前記導体パターン（３３，３４）に接続された二次
電池保護回路（５）と、前記プリント基板（３）の他面
に設けられ、前記導体パターン（３３，３４）を通じて
前記二次電池保護回路（５）に接続された端子（７）と
を含む二次電池保護モジュール（１）において、前記一
面上の導体パターン（３３）にソフト金メッキ（３６）
が施され、該ソフトメッキ部分（３６）で前記ワイヤー
ボンディングが行われ、前記他面上の導体パターン（３
４）の少なくとも一部にハード金メッキ（３７）が施さ
れ、該ハード金メッキ部分（３７）を前記端子（７）と
したことを特徴とする二次電池保護モジュール（１）が
得られる。According to the first aspect of the present invention, the conductor patterns (33, 3) are provided on one surface and the other surface, respectively.
A printed circuit board (3) on which the printed circuit board (4) is formed; and a secondary battery protection circuit (5) provided on one surface of the printed circuit board (3) and connected to the conductor patterns (33, 34) by wire bonding. And a terminal (7) provided on the other surface of the printed circuit board (3) and connected to the secondary battery protection circuit (5) through the conductor patterns (33, 34). 2), the conductor pattern (33) on the one surface is soft gold-plated (36).
The wire bonding is performed on the soft-plated portion (36), and the conductor pattern (3
Hard battery plating (37) is applied to at least a part of 4), and the secondary battery protection module (1) is obtained, wherein the hard gold plated portion (37) is used as the terminal (7).
【０００８】尚、本発明の各構成部分に付された括弧内
の符号は、本発明の理解を容易にするために、図示実施
形態の各構成部分に対応させて付したものであり、従っ
て、上気括弧内の符号は、各構成部分の一例を示すもの
であり、各構成部分は、図示されたものに限定されな
い。Incidentally, the reference numerals in parentheses attached to the respective components of the present invention are given in correspondence with the respective components of the illustrated embodiment in order to facilitate understanding of the present invention. , Symbols in upper brackets indicate an example of each component, and each component is not limited to the illustrated one.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して詳細に説明する。図１は本発明の一実
施形態に係る二次電池保護モジュールを示し、（ａ）は
樹脂で電子部品をポッティングする前の状態の斜視図、
（ｂ）は底面側から見た斜視図、（ｃ）は完成状態の斜
視図である。Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows a secondary battery protection module according to an embodiment of the present invention, in which (a) is a perspective view of a state before electronic components are potted with resin,
(B) is a perspective view seen from the bottom side, and (c) is a perspective view of a completed state.
【００１０】図１を参照して、本実施形態の二次電池保
護モジュール１は、携帯電話機用のリチウム電池保護モ
ジュールであって、プリント基板３と、二次電池保護回
路（リチウム電池保護回路）５と、端子７とを含んで構
成されている。Referring to FIG. 1, a secondary battery protection module 1 of the present embodiment is a lithium battery protection module for a portable telephone, and includes a printed circuit board 3 and a secondary battery protection circuit (lithium battery protection circuit). 5 and a terminal 7.
【００１１】プリント基板３は、その一面及び他面にそ
れぞれ導体パターン３３，３４が形成されている。この
プリント基板３の一面側（チップ側）の導体パターン３
３と他面側（端子側）の導体パターン３４は、スルーホ
ール３８によって互いに導通している。また、導体パタ
ーン３３は、パッド部３３ａを除き、ソルダレジスト３
５によって覆われている。同様に、導体パターン３４
は、端子７と成る部分を除き、ソルダレジスト３５によ
って覆われている。The printed circuit board 3 has conductor patterns 33 and 34 formed on one surface and the other surface, respectively. Conductor pattern 3 on one side (chip side) of this printed circuit board 3
3 and the conductor pattern 34 on the other surface (terminal side) are electrically connected to each other by a through hole 38. The conductor pattern 33 is formed of the solder resist 3 except for the pad portion 33a.
5 is covered. Similarly, the conductor pattern 34
Is covered with a solder resist 35 except for a portion to be the terminal 7.
【００１２】二次電池保護回路５は、ＩＣから成る。こ
のＩＣ５は、ワイヤー１１によって、導体パターン３３
のパッド部３３ａにボンディングされている。導体パタ
ーン３３のパッド部３３ａには、後述するように、ソフ
ト金メッキ３６が施されているので、このようにワイヤ
ーボンディングを行えるように成っている。また、プリ
ント基板３の一面上に搭載された他の電子部品１２，１
３，１４も導体パターン３３のパッド部３３ａに電気的
に接続されている。また、ＩＣ５は、他の電子部品１
２，１３，１４と共に、（ｃ）に示すように、樹脂１５
によってポッティングされている。The secondary battery protection circuit 5 comprises an IC. This IC 5 is connected to the conductor pattern 33 by the wire 11.
Is bonded to the pad portion 33a. Since the soft gold plating 36 is applied to the pad portion 33a of the conductor pattern 33 as described later, wire bonding can be performed in this manner. The other electronic components 12, 1 mounted on one surface of the printed circuit board 3
3 and 14 are also electrically connected to the pad portions 33a of the conductor pattern 33. Further, the IC 5 is used for other electronic components 1.
As shown in FIG.
Has been potted by.
【００１３】端子７は、プリント基板３の他面に設けら
れ、導体パターン３３，３４を通じてＩＣ５等に電気的
に接続されている。図１（ｂ）において、４つある端子
７の内、左側の２つは充電用であり、右側の２つは電源
用である。これらの端子７は、導体パターン３４の端子
と成る部分にハード金メッキ３７を施すことにより、構
成されている。このように、端子７は、導体パターン３
４の端子と成る部分にハード金メッキ３７を施すことに
より構成されているので、製造が容易であり、また、ハ
ード金メッキであるので、端子として十分な耐久性を有
している。尚、ハード金メッキに用いられる金合金とし
ては、例えば、金９９．７〜９９．９％、コバルト０．
１〜０．３％若しくはニッケル０．１〜０．３％の組成
を有するものが適する。The terminal 7 is provided on the other surface of the printed circuit board 3 and is electrically connected to the IC 5 or the like through the conductor patterns 33 and 34. In FIG. 1B, of the four terminals 7, two on the left are for charging, and two on the right are for power. These terminals 7 are configured by applying hard gold plating 37 to portions of the conductor pattern 34 that will become terminals. Thus, the terminal 7 is connected to the conductor pattern 3
Since the hard gold plating 37 is applied to the portion to be the terminal of No. 4, the manufacturing is easy, and the hard gold plating has sufficient durability as the terminal. In addition, as a gold alloy used for hard gold plating, for example, 99.7 to 99.9% of gold and 0.1% of cobalt are used.
Those having a composition of 1 to 0.3% or nickel of 0.1 to 0.3% are suitable.
【００１４】次に、図１に示す二次電池保護モジュール
の要部の製造工程について説明する。図２（ａ）〜
（ｊ）は図１に示す二次電池保護モジュールの要部の各
製造工程を概略的に示す断面図である。Next, a description will be given of a manufacturing process of a main part of the secondary battery protection module shown in FIG. FIG.
(J) is sectional drawing which shows each manufacturing process of the principal part of the secondary battery protection module shown in FIG. 1 schematically.
【００１５】図２を参照して、先ず、（ａ）に示すよう
に、プリント基板３を用意する。このプリント基板３
は、絶縁基板３１の表裏面の全面に、それぞれ接着剤３
２によって銅箔３３′，３４′を貼着して成るものであ
る。Referring to FIG. 2, first, a printed circuit board 3 is prepared as shown in FIG. This printed circuit board 3
The adhesive 3 is applied to the entire front and back surfaces of the insulating substrate 31 respectively.
2, copper foils 33 'and 34' are adhered.
【００１６】次に、（ｂ）に示すように、プリント基板
３の上面にフォトレジスト（未硬化）２１を印刷する。Next, as shown in FIG. 1B, a photoresist (uncured) 21 is printed on the upper surface of the printed circuit board 3.
【００１７】次に、（ｃ）に示すように、未硬化のフォ
トレジスト２１上に、ネガフィルム２２を載せ、その
後、フォトレジスト２１に対して露光する。Next, as shown in FIG. 1C, a negative film 22 is placed on the uncured photoresist 21, and then the photoresist 21 is exposed.
【００１８】次に、（ｄ）に示すように、感光しなかっ
たフォトレジスト２１を洗い流し、感光して硬化したフ
ォトレジスト２１を残す。Next, as shown in FIG. 1D, the photoresist 21 that has not been exposed is washed away, and the photoresist 21 that has been exposed and cured remains.
【００１９】次に、（ｅ）に示すように、プリント基板
３の下面側においても、上述の（ｂ）〜（ｄ）の工程を
行い、銅箔３４′上にもフォトレジスト２１を形成す
る。Next, as shown in (e), the above-described steps (b) to (d) are performed also on the lower surface side of the printed circuit board 3 to form the photoresist 21 on the copper foil 34 '. .
【００２０】次に、（ｆ）に示すように、硬化したフォ
トレジスト２１をマスクとして、銅箔３３′，３４′を
エッチングし、導体パターン３３，３４を形成する。Next, as shown in (f), the copper foils 33 'and 34' are etched using the cured photoresist 21 as a mask to form conductor patterns 33 and 34.
【００２１】次に、（ｇ）に示すように、導体パターン
３３,３４上のフォトレジスト２１を剥離させる。Next, as shown in FIG. 1G, the photoresist 21 on the conductor patterns 33 and 34 is peeled off.
【００２２】次に、（ｈ）に示すように、プリント基板
３の上面にソルダレジスト３５を印刷により貼着する。
この際、導体パターン３３の内、パッド部３３ａは露出
するようにする。同様に、プリント基板３の下面にもソ
ルダレジスト３５を印刷により貼着する。この際、導体
パターン３４の内、端子と成る部分３４ａは露出するよ
うにする。Next, as shown in (h), a solder resist 35 is attached to the upper surface of the printed circuit board 3 by printing.
At this time, the pad portion 33a of the conductor pattern 33 is exposed. Similarly, a solder resist 35 is attached to the lower surface of the printed circuit board 3 by printing. At this time, a portion 34a serving as a terminal in the conductor pattern 34 is exposed.
【００２３】次に、（ｉ）に示すように、プリント基板
３の下面をマスキングして、導体パターン３３のパッド
部３３ａにソフト金メッキ３６を施す。Next, as shown in (i), the lower surface of the printed circuit board 3 is masked, and a soft gold plating 36 is applied to the pad portion 33a of the conductor pattern 33.
【００２４】次に、（ｊ）に示すように、プリント基板
３の上面をマスキングして、導体パターン３４の端子と
成る部分３４ａにハード金メッキ３７を施す。Next, as shown in (j), the upper surface of the printed circuit board 3 is masked, and a hard gold plating 37 is applied to a portion 34a of the conductive pattern 34 which will be a terminal.
【００２５】後は、図１（ａ）に示すように、プリント
基板３の一面上にＩＣ５や電子部品１２，１３，１４を
実装し、その後、図１（ｂ）に示すように、ＩＣ５や電
子部品１２，１３，１４をポッティング樹脂１５により
封入すれば、二次電池保護モジュール１が完成する。Thereafter, as shown in FIG. 1A, the IC 5 and the electronic components 12, 13, and 14 are mounted on one surface of the printed circuit board 3, and thereafter, as shown in FIG. When the electronic components 12, 13, and 14 are sealed with the potting resin 15, the secondary battery protection module 1 is completed.
【００２６】尚、本実施形態では、ソフト金メッキ３６
を先に行い、ハード金メッキ３７を後に行ったが、この
順番は、逆でも構わない。In this embodiment, the soft gold plating 36 is used.
Was performed first and the hard gold plating 37 was performed later, but this order may be reversed.
【００２７】[0027]
【発明の効果】本発明の二次電池保護モジュールは、導
体パターンにハード金メッキを施すことによって、端子
を構成するように成っているので、端子を簡単に作るこ
とができ、従って、その分、従来よりも製造コストを低
減させることができる。According to the secondary battery protection module of the present invention, the terminals can be easily formed by applying hard gold plating to the conductor pattern. Therefore, the terminals can be easily formed. The manufacturing cost can be reduced as compared with the related art.
【図１】本発明の一実施形態に係る二次電池保護モジュ
ールを示し、（ａ）は樹脂で電子部品をポッティングす
る前の状態の斜視図、（ｂ）は底面側から見た斜視図、
（ｃ）は完成状態の斜視図である。FIGS. 1A and 1B show a secondary battery protection module according to an embodiment of the present invention, wherein FIG. 1A is a perspective view of a state before electronic components are potted with a resin, FIG.
(C) is a perspective view of a completed state.
【図２】（ａ）〜（ｊ）は図１に示す二次電池保護モジ
ュールの要部の各製造工程を概略的に示す断面図であ
る。2 (a) to 2 (j) are cross-sectional views schematically showing respective manufacturing steps of a main part of the secondary battery protection module shown in FIG.
１ 二次電池保護モジュール ３ プリント基板 ３３ 導体パターン ３４ 導体パターン ３６ ソフト金メッキ ３７ ハード金メッキ ５ 二次電池保護回路（ＩＣ） 1 Secondary Battery Protection Module 3 Printed Circuit Board 33 Conductor Pattern 34 Conductor Pattern 36 Soft Gold Plating 37 Hard Gold Plating 5 Secondary Battery Protection Circuit (IC)
Claims (1)
形成されたプリント基板と、該プリント基板の一面上に
設けられ、ワイヤーボンディングにより前記導体パター
ンに接続された二次電池保護回路と、前記プリント基板
の他面に設けられ、前記導体パターンを通じて前記二次
電池保護回路に接続された端子とを含む二次電池保護モ
ジュールにおいて、前記一面上の導体パターンにソフト
金メッキが施され、該ソフトメッキ部分で前記ワイヤー
ボンディングが行われ、前記他面上の導体パターンの少
なくとも一部にハード金メッキが施され、該ハード金メ
ッキ部分を前記端子としたことを特徴とする二次電池保
護モジュール。A printed circuit board having a conductor pattern formed on one surface and another surface thereof; a secondary battery protection circuit provided on one surface of the printed circuit board and connected to the conductor pattern by wire bonding; And a terminal provided on the other surface of the substrate and including a terminal connected to the secondary battery protection circuit through the conductor pattern, wherein the conductor pattern on the one surface is subjected to soft gold plating, and the soft plating portion is provided. Wherein the wire bonding is performed, and at least a part of the conductor pattern on the other surface is hard gold-plated, and the hard gold-plated portion is used as the terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000075712A JP2001268808A (en) | 2000-03-17 | 2000-03-17 | Secondary battery protection module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000075712A JP2001268808A (en) | 2000-03-17 | 2000-03-17 | Secondary battery protection module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001268808A true JP2001268808A (en) | 2001-09-28 |
Family
ID=18593560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000075712A Pending JP2001268808A (en) | 2000-03-17 | 2000-03-17 | Secondary battery protection module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001268808A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1708553A3 (en) * | 2005-03-28 | 2008-07-23 | Mitsumi Electric Co., Ltd. | Secondary battery protecting module and lead mounting method |
| KR100870363B1 (en) | 2007-03-15 | 2008-11-25 | 삼성에스디아이 주식회사 | Protective Circuit Board for Secondary Battery and Secondary Battery Using the Same |
| US8043735B2 (en) * | 2005-03-09 | 2011-10-25 | Samsung Sdi Co., Ltd. | Rechargeable battery, printed circuit board therefor, and method of fabricating the same |
| KR101084855B1 (en) * | 2008-10-28 | 2011-11-22 | 삼성에스디아이 주식회사 | Manufacturing Method of Protective Circuit Module for Secondary Battery |
| WO2017006209A1 (en) | 2015-07-06 | 2017-01-12 | Attero Recycling Pvt. Ltd. | A method of recovering metals from spent li-ion batteries |
| CN109994660A (en) * | 2019-03-15 | 2019-07-09 | 福建南平南孚电池有限公司 | A kind of rechargeable battery with improved circuit unit |
-
2000
- 2000-03-17 JP JP2000075712A patent/JP2001268808A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8043735B2 (en) * | 2005-03-09 | 2011-10-25 | Samsung Sdi Co., Ltd. | Rechargeable battery, printed circuit board therefor, and method of fabricating the same |
| EP1708553A3 (en) * | 2005-03-28 | 2008-07-23 | Mitsumi Electric Co., Ltd. | Secondary battery protecting module and lead mounting method |
| US8305768B2 (en) | 2005-03-28 | 2012-11-06 | Mitsumi Electric Co., Ltd. | Secondary battery protecting module and lead mounting method |
| KR100870363B1 (en) | 2007-03-15 | 2008-11-25 | 삼성에스디아이 주식회사 | Protective Circuit Board for Secondary Battery and Secondary Battery Using the Same |
| US7898814B2 (en) | 2007-03-15 | 2011-03-01 | Samsung Sdi Co., Ltd. | Protection circuit board for secondary battery and secondary battery using the same |
| US8492013B2 (en) | 2007-03-15 | 2013-07-23 | Samsung Sdi Co., Ltd. | Protection circuit board for secondary battery and secondary battery using the same |
| KR101084855B1 (en) * | 2008-10-28 | 2011-11-22 | 삼성에스디아이 주식회사 | Manufacturing Method of Protective Circuit Module for Secondary Battery |
| US8966749B2 (en) | 2008-10-28 | 2015-03-03 | Samsung Sdi Co., Ltd. | Manufacturing method for protection circuit module of secondary battery |
| WO2017006209A1 (en) | 2015-07-06 | 2017-01-12 | Attero Recycling Pvt. Ltd. | A method of recovering metals from spent li-ion batteries |
| CN109994660A (en) * | 2019-03-15 | 2019-07-09 | 福建南平南孚电池有限公司 | A kind of rechargeable battery with improved circuit unit |
| CN109994660B (en) * | 2019-03-15 | 2023-12-05 | 福建南平南孚电池有限公司 | Rechargeable battery with improved circuit unit |
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