JP2001267875A - Quartz crystal resonator and manufacturing method thereof - Google Patents

Abstract

(57) [Problem] To provide a crystal resonator realizing miniaturization and excellent impact resistance, and a method of manufacturing the same. SOLUTION: A vibrator substrate 20 provided with a pair of vibrating electrodes, a base substrate 30 supporting the vibrator substrate 20,
A lid substrate 40 that covers the vibrator substrate 20. The base substrate 30 and the lid substrate 40 have a frame-shaped metal layer 47 for gap formation and eutectic bonding, are eutectic bonded to the vibrator substrate 20, and are hermetically sealed. And the oscillator substrate 2
0 denotes a vibrator piece on which the first and second vibrating electrodes are formed, and a quartz vibrator piece, and the first wiring electrode connected to the first vibrating electrode is substantially on one surface. A second wiring electrode formed on the entire surface and connected to the second vibrating electrode is formed on almost the entire surface on the other surface, the vibrator piece has a frame portion, and a first side wall is provided on a corner side wall of the frame portion. The first and second external electrodes continuous with the wiring electrode and the second wiring electrode, respectively, are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a quartz oscillator and a method for manufacturing the same, and more particularly, to a technique capable of reducing the size of the oscillator and improving impact resistance.

[0002]

2. Description of the Related Art FIG. 9 shows a sectional structure of a conventional crystal unit. The crystal resonator 1 has a package 2 made of ceramics, and a crystal resonator element 3 fixed by an adhesive 4 therein. The package 2 is covered with a lid 5. The lid 5 is a lid made of Kovar, and the package 2 and the lid 5 are fixed by seam welding via a Kovar ring 6.

[0003]

In the above-described crystal resonator 1, the gap g1 between the crystal resonator element 3 and the upper lid 5 and the gap g2 between the base of the lower package 2 are large. , G2 is large, so that it is vulnerable to impact and cannot be made thin. Also, it was difficult to adjust the gaps g1 and g2 with high accuracy.

[0004] Considering the problem of impact, the behavior of the actual crystal resonator element 3 in a drop test shows that the higher the drop height, the more the crystal element 3 is dropped.
Make contact so as to form package 2. If the shock at that time cannot be tolerated, a phenomenon occurs in which the quartz oscillator piece 3 breaks or the adhesive 4 in the mount portion comes off.
Therefore, the problem is how to absorb the impact when the vehicle falls. In order to absorb the shock, if the crystal resonator element 3 can drop and fall into contact with the package 2 to absorb the shock by the entire crystal resonator element 3, the impact of the crystal resonator element 3 and the mounting part against the shock can be achieved. Damage can be reduced. Therefore, if the gaps g1 and g2 are reduced, the crystal vibrator piece 3 is bent at the time of a drop impact, and the package 2
, The impact can be absorbed by a wider area of the crystal resonator element 3. However, as described below, there is a problem that the gap cannot be reduced conventionally.

Next, the size of the gap and the adjustment accuracy thereof will be examined. When the crystal resonator element is mounted on the package 2 using the adhesive 4, there is a problem with the accuracy of the package 2, the accuracy of the device, and the like, so that the inclination (always upward, downward, or twist) always occurs. Therefore, if there is no gap to some extent, the crystal resonator element 3 will come into contact with the upper surface, the lower surface, or the side surface of the package 2 after sealing. Therefore, a gap g1 between the crystal resonator element 3 and the upper lid 5 and a gap g2 between the lower package 2 and the base are provided to some extent (at least 50 μm is required), and it is not necessary to increase the gap. I can't. Also, in order to improve the accuracy of the gap, it is necessary to improve both the precision of the package 2 and the accuracy of the mounting part.
There is a problem that.

Japanese Unexamined Patent Publication No. Hei 5-199056 proposes a thin quartz crystal resonator (see FIG. 5 of the same publication). However, since no electrode routing pattern is disclosed, a quartz crystal resonator cannot be realized. There was a problem.

SUMMARY OF THE INVENTION The present invention has been made to solve such problems, and an object of the present invention is to provide a crystal resonator which realizes miniaturization and excellent impact resistance, and a method of manufacturing the same.

[0008]

Means for Solving the Problems (1) A crystal resonator according to one aspect of the present invention includes a resonator substrate having a pair of vibrating electrodes, a base substrate supporting the resonator substrate, and a vibrator. A lid substrate that covers the resonator substrate, the resonator substrate, the base substrate, and the lid substrate are formed of flat substrates, are eutectic bonded, are fixed to each other, are hermetically sealed, and the resonator substrate has a A vibrator piece on which the first and second vibrating electrodes are formed, and a first wiring electrode connected to the first vibrating electrode, which supports the quartz vibrator piece, are formed on substantially the entire surface on one surface. A second wiring electrode connected to the second vibrating electrode includes a frame formed on almost the entire surface on the other surface, and a first wiring electrode and a second wiring electrode on a corner side wall of the frame. The first and second external electrodes connected to each other are formed.

In the present invention, the following effects are obtained by adopting the above configuration.

A. The vibrator substrate, base substrate and lid substrate are flat substrates, and the processing of the crystal vibrator piece can be performed with extremely high precision by etching using photolithography. And a base substrate, or a metal thin film layer for eutectic bonding of a resonator substrate and a lid substrate can also be formed with high precision by a sputtering method, a vapor deposition method, a plating method, or the like. The gap between the crystal resonator element and the lid substrate can be reduced, so that the shock resistance is excellent, the size of the crystal resonator is reduced, and the gap can be easily adjusted.

B. In addition, since the lid substrate and the base substrate have flat shapes, complicated processing is not required, and the productivity is high.

C. Further, depending on the wiring method, it is necessary to perform processing such as hole processing and hole sealing. However, in the wiring of the present invention, the first and second external electrodes are formed on the corner side walls of the frame portion of the vibrator substrate. Since such a connection is made to be electrically connected to the outside, such processing is not required, and the reliability is increased accordingly.

(2) A quartz resonator according to another aspect of the present invention is the quartz resonator of (1), wherein the base substrate is
Third and fourth external electrodes are formed on the corner side walls, and the third and fourth external electrodes are led to the first and second connection electrodes formed on the back surface of the base substrate, respectively.
Then, the first external electrode, the third external electrode, and the first
Are connected, and the second external electrode is connected to the fourth external electrode and the second connection electrode.

In the present invention, the third and fourth external electrodes are formed on the corner side walls of the base substrate.
Are connected to the first external electrode and the fourth external electrode is connected to the fourth external electrode.
Since the external electrode and the second external electrode are connected, electrical connection between the vibrator substrate and the base substrate is easily made. Further, since the first and second connection electrodes are formed on the back surface side of the base substrate, the crystal resonator can be easily fixed to a printed circuit board or the like and can be electrically connected.

(3) A quartz oscillator according to another aspect of the present invention is the quartz oscillator of (2), wherein a notch is formed at a corner of the oscillator substrate and the base substrate, and a first notch is formed thereon. ~
Fourth external electrodes are formed respectively.
In the present invention, the first to fourth external electrodes are formed on the arc-shaped notches, and therefore, the external electrodes are easily connected to each other.

(4) In the crystal resonator according to another aspect of the present invention, in the crystal resonator according to the above (1), the resonator substrate or the frame of the base substrate is bonded to join the resonator substrate and the base substrate. The portion has a eutectic alloy layer of gold and tin or a laminated metal film of gold and tin. In the present invention, since a eutectic alloy layer of gold and tin or a laminated metal film of gold and tin is formed for bonding a resonator substrate and a base substrate and forming a gap, the resonator substrate or base is formed for forming a gap. No need to process the substrate.

(5) In the crystal unit according to another aspect of the present invention, in the crystal unit according to the above (1), a frame of the resonator substrate or the lid substrate for joining the resonator substrate and the lid substrate. The portion has a eutectic alloy layer of gold and tin or a laminated metal film of gold and tin. In the present invention, a eutectic alloy layer of gold and tin or a laminated metal film of gold and tin is formed for bonding a resonator substrate and a lid substrate and forming a gap. No need to process the substrate.

(6) A method of manufacturing a crystal unit according to another aspect of the present invention is the method of manufacturing a crystal unit according to the above (1), wherein a shape corresponding to a resonator element is formed on a crystal wafer, respectively. Holes are formed at positions corresponding to the corners of the vibrator substrate, and electrode patterns corresponding to the first and second vibrating electrodes are formed at positions corresponding to the vibrator pieces, and at positions corresponding to the frame portions of the vibrator substrate. An electrode pattern corresponding to the first and second wiring electrodes, an electrode pattern corresponding to the first and second external electrodes are formed on the inner wall of the hole, respectively, and the lid wafer, the quartz wafer, and the base wafer are formed. Are bonded by eutectic bonding, and then diced. In the present invention, since the lid wafer, the quartz crystal wafer, and the base wafer are joined by eutectic bonding to produce a large number of quartz oscillators at once, extremely high productivity is achieved. It has become.

(7) A method for manufacturing a crystal unit according to another aspect of the present invention is the method for manufacturing a crystal unit according to the above (6), wherein the base wafer is connected to the corner portion of the base substrate before the connection. Holes are formed at positions corresponding to the above, and electrode patterns corresponding to the third and fourth external electrodes are formed on the inner walls of the holes, respectively. Therefore, processing after bonding of the base wafer is facilitated. Has become.

(8) A method for manufacturing a crystal unit according to another aspect of the present invention is the method for manufacturing a crystal unit according to (7), wherein the first external electrode and the third external electrode are connected to each other after bonding or dicing. Since the external electrodes are connected to each other and the second external electrodes and the fourth external electrodes are connected to each other, and the above-described electrode connection is performed in a state where the positional relationship between the external electrodes is fixed,
The connection process is easy.

(9) A method for manufacturing a crystal unit according to another aspect of the present invention is the method for manufacturing a crystal unit described in (6) to (8) above, wherein the crystal unit is a tuning fork type crystal unit. A glass member is used for the lid substrate or the base substrate, and a laser beam is trimmed through the glass member on the first vibrating electrode and / or the second vibrating electrode of the quartz vibrator piece to adjust the vibration frequency. Therefore, the vibration frequency can be easily adjusted after assembling the crystal resonator.

(10) A method of manufacturing a crystal unit according to another aspect of the present invention is the method of manufacturing a crystal unit described in (6) to (8) above, wherein the crystal unit is a tuning-fork type crystal unit.
A crystal member is used for the lid substrate or the base substrate, and the vibration frequency is adjusted by trimming the first vibrating electrode and / or the second vibrating electrode of the quartz vibrator piece with the laser beam via the crystal member. Therefore, the vibration frequency can be easily adjusted after assembling the crystal resonator.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. FIG. 1 is a cross-sectional view (a cross-sectional view taken along the line AA in FIG. 2 described later) illustrating a structure of a crystal resonator (tuning fork type) according to an embodiment of the present invention, and FIG. 2 is a perspective view thereof. This crystal resonator 10 includes a resonator substrate 20,
A base substrate 30 disposed with the vibrator substrate 20 interposed therebetween
And a lid substrate 40. The vibrating electrode of the vibrator substrate 20 is connected to the base substrate 30 as described later.
At its corners.

FIGS. 3A, 3B, and 3C are a front view, a rear view, and an arrow A view of the vibrator substrate 20 of FIG. The vibrator substrate 20 includes a frame portion 21 and a vibrator piece 22 formed integrally with the frame portion 21. A cutout (an arc-shaped cutout as a preferred example in the present embodiment) is formed in each of the corners C1 to C4 of the frame 21, and the vibrator piece 22 is provided with a pair of vibrating electrodes 23 and 24. Is formed. The pattern of the pair of vibrating electrodes 23 and 24 of the vibrator piece 22 is not fundamentally different from the conventional one, and the vibrating electrode 23 of the vibrator piece 22 has a surface and a side wall 23a and 23b. The pattern on the back side is continuous. Then, the vibrating electrode 23 of the vibrator piece 22
Is continuous with a wiring electrode 25 formed over the entire surface of the frame portion 21 and further connected to an external electrode 26 formed on the side walls of the corners C2 and C3. ing. The same applies to the electrode 24 of the vibrator piece 22,
In the side walls 24a and 24b in the figure, the pattern of the front surface and the back surface is continuous. Then, the electrode 24 of the vibrator piece 22
Is continuous with a wiring electrode 27 formed over the entire back surface of the frame portion 21. Further, the wiring electrode 27 is continuous with an external electrode 28 formed on the side walls of the corners C1 and C4. ing. Therefore, the electrodes 23, 25, 26 and the electrodes 24, 27, 28 each form a continuous pattern. When the layers are stacked as shown in FIG. 1, the external electrodes 28 appear on the side walls of the corners C1 and C4.

The vibrator substrate 20 is made of a quartz substrate. On the quartz substrate, “oscillating electrodes 23 and 24 made of a laminated film of a chromium film (for example, 50 nm) and a gold film (for example, 90 nm)” and “a chromium film (for example, 50 n)
m) and a gold film (for example, 90 nm) to form wiring electrodes 25 and 27 ".

FIGS. 4A and 4B are a back view of the base substrate 30 and a sectional view taken along line BB of FIG. The base substrate 30 is formed of a flat glass plate or a quartz plate, and has arc-shaped notches formed at the corners C11 to C14 similar to the vibrator substrate 20.
An external electrode 38 is formed on the side wall of each of C11 and C14, and a connection electrode 39 is formed on the back surface thereof. The external electrode 38 and the connection electrode 39 are formed in a continuous pattern.

In order to form a gap between the oscillator substrate 20 and the base substrate 30 and to perform eutectic bonding, for example, a conductive thin film “chrome film 31 (for example, 50 nm), a gold film 32 (for example, 90 nm) ”, a“ nickel film 33 (for example, 10 μm) ”for gap formation, and a“ gold film 34 (for example, 2 μm) for forming a eutectic alloy layer. A stacked film of a “tin film 35 (for example, 0.5 μm)” is formed. This eutectic alloy layer may be formed of an alloy film of gold and tin.

The lid substrate 40 is made of a flat glass member or a quartz member, and has a corner C21.
To C24, the above-described oscillator substrate 20 and base substrate 3
As in the case of 0, an arc-shaped notch is formed. However, the notch may not be formed in the lid substrate 40.

As shown in FIG. 5, in order to form a gap between the vibrator substrate 20 and the lid substrate 40 and to perform eutectic bonding, for example, a “chromium film 41 (for example, 50 nm), a gold film 42 (E.g., 90 nm) ", and a" nickel film 4 "is formed thereon to form a gap.
3 (for example, 10 μm) ”and“ gold film 4 ”for forming the eutectic alloy layer.
4 (eg, 2 μm), tin film 45 (eg, 0.5 μm) ”
Is formed. This eutectic alloy layer may be formed of an alloy film of gold and tin. The formation of these metal films is similar to that of the base substrate, and can be formed by a common process.

The vibrator substrate 20, the base substrate 30, and the lid substrate 40 are configured as described above, and are eutectic-bonded in a vacuum atmosphere in a stacked state as shown in FIG. The external electrode 26 of the vibrator substrate 20 and the external electrode 36 of the base substrate 30 are formed by using the brazing material 46.
Are electrically connected, and the external electrodes 28 of the vibrator substrate 20 and the external electrodes 38 of the base substrate 30 are electrically connected. Then, the connection electrodes 37 and 39 of the base substrate 30 are connected to a printed board or the like.

In the above-described tuning fork type vibrator, since the base substrate 30 and the lid substrate 40 are formed using a glass member or a quartz member, the laser light is transmitted through the glass member or the quartz member to generate a quartz oscillator. The vibration frequency can be adjusted by trimming the first vibration electrode 23 and / or the second vibration electrode 24 of the child piece 22.

Embodiment 2 FIG. FIG. 6 is a perspective view of a crystal substrate (AT cut type) of a crystal substrate according to another embodiment of the present invention. The base substrate 30 and the lid substrate 40 shown in FIG. Since they are the same, the description is omitted. The vibrator substrate 60 has a frame 61
And a vibrator piece 62 formed integrally with the frame portion 61. An arc-shaped notch is formed in each of the corners C1 to C4 of the frame 61, and a pair of vibrating electrodes is formed in the vibrator piece 62. (Only the vibration electrode 63 on the front surface is shown in FIG. 6). The pattern of the pair of vibrating electrodes of the vibrator piece 62 is not fundamentally different from the conventional one, and only one vibrating electrode 63 is shown on the front surface in the figure, but also on the back surface. Electrodes having a similar pattern are formed.
The vibrating electrode 63 of the vibrator element 62 is continuous with a wiring electrode 64 formed over the entire surface of the frame portion 61, and the wiring electrode 64 further includes corner portions C2 and C2.
3 is continuous with the external electrode 66 formed on the side wall. The same applies to the other electrode of the vibrator piece 62, which is continuous with a wiring electrode (not shown) formed over the entire back surface of the frame portion 61, and further, the wiring electrode is connected to the corner portion C1. ,
It is continuous with an external electrode (not shown) formed on the side wall of C4. Therefore, when stacked as shown in FIG. 1, one external electrode 66 appears on the side walls of the corners C2 and C3, and the other external electrode appears on the side walls of the corners C1 and C4.

Embodiment 3 FIG. 7 is a flowchart illustrating a method of manufacturing the crystal resonator according to the first embodiment, and the manufacturing method will be described with reference to the flowchart. (S1) Processing / Thin Film Formation (S1) (a) Lid substrate (glass member or quartz member): As shown in FIG. 8, holes are formed in the lid substrate 100 at predetermined intervals. The hole 101 formed by this hole processing is for forming an arc-shaped notch at the corners C21 to C24 (see FIG. 2). This drilling is done by laser,
The wet etching and the processing by the sand plast are appropriately combined and performed. Further, a metal laminated film is formed by a sputtering method for forming a gap with the vibrator substrate 20 and for eutectic bonding,
It is formed by a vapor deposition method or a plating method. (B) Vibrator substrate (quartz substrate): As shown in FIG. 8, holes are formed in the crystal substrate 110 at predetermined intervals. The hole 111 formed by this hole processing has corner portions C1 to C1.
This is for forming an arc-shaped notch of C4. Further, a periphery (a gap portion formed between the frame and the vibrator piece) 112 around a portion where the vibrator piece 22 is to be formed is hollowed out. The hole processing and the hollow processing are simultaneously performed by, for example, wet etching. When these processes are completed, a metal thin film pattern corresponding to the electrodes 23 to 28 is formed. This metal thin film pattern is made of the conductive thin film described in the first embodiment, and is formed by vapor deposition and sputtering. (C) Base substrate (glass member or crystal member): As shown in FIG. 8, holes are formed in the base substrate 120 at predetermined intervals. The hole 121 formed by this hole processing is for forming an arc-shaped notch at the corners C11 to C14 (see FIG. 2). This hole processing is performed by appropriately combining the processing with laser, wet etching and sand plast. In addition, the external electrodes 36 and 38
Then, a metal thin film pattern corresponding to the connection electrodes 37 and 39 is formed. This metal thin film pattern is used in the first embodiment.
And formed by vapor deposition or sputtering. Further, a metal laminated film is formed by a sputtering method, a vapor deposition method, and a plating method for forming a gap with the vibrator substrate 20 and eutectic bonding. (S2) Lamination (S2) Lid substrate 100, quartz substrate 1 processed as described above
The eutectic bonding is performed by bonding the base 10 and the base substrate 120 together. (S3) Dicing (S3) Eutectically bonded lid substrate 100, quartz substrate 110
Then, the base substrate 120 is cut in accordance with the shape of each crystal resonator. (S4) Connection with External Electrode (S4) External electrodes 26 and 28 of the vibrator substrate 20 and the base substrate 30
Are electrically connected to the external electrodes 36 and 38 by a conductive paste, a brazing material, or sputtering. This connection process may be performed at the stage when the eutectic bonding is completed.
Through these processes, the quartz oscillator shown in FIGS. 1 and 2 is obtained.

Although the above description is directed to a tuning-fork type crystal unit, the same applies to an AT-cut type crystal unit.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a structure of a crystal resonator (tuning fork type) according to an embodiment of the present invention.

FIG. 2 is a perspective view of the crystal unit shown in FIG. 1;

FIG. 3 is a front view, a rear view, and a view on arrow A of the vibrator substrate of FIG. 1;

FIG. 4 is a back view of the base substrate of FIG. 1 and a sectional view taken along line BB of FIG.

FIG. 5 is a sectional view of the lid substrate of FIG. 1;

FIG. 6 shows a quartz oscillator (AT) according to another embodiment of the present invention.
FIG. 3 is a perspective view of a (cut type) vibrator substrate.

FIG. 7 is a flowchart illustrating a method of manufacturing the crystal resonator of FIG. 1;

FIG. 8 is an explanatory view of a lid substrate, a quartz substrate, and a base substrate in the manufacturing process of FIG. 7;

FIG. 9 is a cross-sectional view showing the structure of a conventional crystal unit.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 crystal oscillator 20 oscillator substrate 21 frame 22 crystal oscillator piece 23, 24 oscillation electrode 25, 27 wiring electrode 26, 28 external electrode 30 base substrate 31, 41 chrome film 32, 42 gold film 33, 43 nickel film 34, 44 Gold film 35,45 Tin film 36,38 External electrode 37,39 Connection electrode 40 Lid substrate 46 Brazing material 47 Eutectic alloy layer

Claims (10)

[Claims] 1. A vibrator substrate having a pair of vibrating electrodes formed thereon, a base substrate supporting the vibrator substrate, and a lid substrate covering the vibrator substrate, wherein the vibrator substrate and the base substrate are provided. The lid substrate is hermetically sealed by eutectic bonding; the vibrator substrate supports a vibrator piece on which first and second vibrating electrodes are formed, and supports the vibrator piece; A first wiring electrode connected to the vibrating electrode is formed on substantially the entire surface, and a second wiring electrode connected to the second vibrating electrode is provided on the other surface substantially on the entire surface, and a frame portion is provided.
The first wiring electrode and the second wiring electrode are provided on corner side walls of the frame portion.
A first external electrode and a second external electrode respectively connected to the wiring electrode. 2. The method according to claim 1, wherein the base substrate has a third side wall formed on a corner thereof.
And a fourth external electrode are formed, and the third and fourth external electrodes are formed on a back surface of the base substrate.
And a second connection electrode, respectively, and the first external electrode is connected to the third external electrode and the first connection electrode, and the second external electrode and the fourth external electrode are connected to each other. 2. The crystal unit according to claim 1, wherein the first and second connection electrodes are connected to each other. 3. A vibrator substrate and a corner side wall of the base substrate are formed with cutouts, and first to fourth external electrodes are formed on the cutouts. Crystal oscillator. 4. A eutectic alloy layer of gold and tin or a laminated metal film of gold and tin on a frame portion of the vibrator substrate or the base substrate to join the vibrator substrate and the base substrate. The quartz resonator according to claim 1, comprising: 5. A eutectic alloy layer of gold and tin or a laminated metal film of gold and tin on a frame portion of the vibrator substrate or the lid substrate for joining the vibrator substrate and the lid substrate. The quartz resonator according to claim 1, comprising: 6. A method for manufacturing a crystal resonator according to claim 1, wherein a shape corresponding to the resonator element is formed on the crystal wafer, and a hole is formed at a position corresponding to a corner of the resonator substrate. The first and second positions are located at positions corresponding to the vibrator pieces.
An electrode pattern corresponding to the vibrating electrode, an electrode pattern corresponding to the first and second wiring electrodes at a position corresponding to the frame of the vibrator substrate, and an electrode corresponding to the first and second external electrodes on the inner wall of the hole. A method for manufacturing a crystal resonator, comprising forming a pattern, bonding a lid wafer, the crystal wafer, and a base wafer by eutectic bonding, and thereafter dicing. 7. A hole is formed at a position corresponding to a corner of the base substrate before connection of the base wafer, and electrode patterns corresponding to third and fourth external electrodes are respectively formed on the inner wall of the hole. The method of manufacturing a quartz resonator according to claim 6, wherein the crystal resonator is formed. 8. The method according to claim 1, further comprising the step of:
8. The method according to claim 7, wherein the first external electrode is connected to a third external electrode, and the second external electrode is connected to a fourth external electrode. 9. A crystal resonator is a tuning-fork type crystal resonator, a glass member is used for a lid substrate or a base substrate, and a laser beam is applied to the first vibration electrode and / or the second vibration electrode of the crystal resonator piece via the glass member. 9. The method according to claim 6, wherein the vibration frequency is adjusted by trimming the vibration electrode of No. 2. 10. A crystal resonator is a tuning-fork type crystal resonator, a crystal member is used for a lid substrate or a base substrate, and a laser beam is applied to the first vibration electrode and / or the second vibration electrode of the crystal resonator piece via the crystal member. 9. The method according to claim 6, wherein the vibration frequency is adjusted by trimming the vibration electrode of No. 2.